CN115097297A - Method, device and system for monitoring contact state of auxiliary switch - Google Patents

Method, device and system for monitoring contact state of auxiliary switch Download PDF

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Publication number
CN115097297A
CN115097297A CN202210708389.XA CN202210708389A CN115097297A CN 115097297 A CN115097297 A CN 115097297A CN 202210708389 A CN202210708389 A CN 202210708389A CN 115097297 A CN115097297 A CN 115097297A
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contact
resistance
contact point
auxiliary switch
actual
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陈云浩
马宏明
钱国超
周仿荣
谭向宇
彭兆裕
何顺
杨明昆
邱鹏锋
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Electric Power Research Institute of Yunnan Power Grid Co Ltd
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Electric Power Research Institute of Yunnan Power Grid Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/327Testing of circuit interrupters, switches or circuit-breakers
    • G01R31/3271Testing of circuit interrupters, switches or circuit-breakers of high voltage or medium voltage devices
    • G01R31/3275Fault detection or status indication
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/08Measuring resistance by measuring both voltage and current

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  • General Physics & Mathematics (AREA)
  • Measurement Of Resistance Or Impedance (AREA)

Abstract

The embodiment of the invention discloses a method, a device and a system for monitoring the contact state of an auxiliary switch, which comprise the following steps: acquiring actual conductor resistance of each contact point of the auxiliary switch under the current voltage and contact point attribute parameters; calculating an additional resistance of each of the contact points based on the contact point attribute parameters of the contact point, and calculating an actual resistance of each of the contact points based on the additional resistance and the conductor resistance of each of the contact points; and judging whether the actual resistance of each contact point is greater than the reference resistance corresponding to the contact point, and if so, generating first alarm information of the contact point. According to the method, the additional resistance of the contact point is accurately obtained by obtaining the attribute parameters of the contact point in real time, the current actual resistance of the contact point is obtained according to the conductor resistance and the additional resistance, the actual resistance is compared with the reference resistance of each normal pair of contact points, and then the corresponding fault contact point can be found according to the abnormal contact point resistance.

Description

Method, device and system for monitoring contact state of auxiliary switch
Technical Field
The invention relates to the technical field of fault line selection of a power distribution network, in particular to a method, a device and a system for monitoring the contact state of an auxiliary switch.
Background
The operating state of the high voltage circuit breaker directly affects the safety of the power system. The contact state of the auxiliary switch can directly reflect the current working state of the circuit breaker, and is a necessary project for a maintainer to test the circuit breaker during maintenance. Therefore, the breaking capacity of the auxiliary switch and the conduction of all contacts must be strictly checked in the process of checking the circuit breaker, so that the on-off state judgment of the auxiliary switch is carried out by designing a contact state judgment circuit of the auxiliary switch of the high-voltage circuit breaker in the prior art.
However, in the actual use process, the performance state of the auxiliary switch cannot be accurately obtained only by testing the on-off state, and the electrical performance of the auxiliary switch contact is interfered by multiple factors such as environmental interference (e.g., oxidation) in the use process and contact form change caused by improper operation of an operator, so that the accuracy of judging the fault state of the contact can be affected.
Disclosure of Invention
In view of this, the present invention provides a method, an apparatus, and a system for monitoring a contact state of an auxiliary switch, which are used to solve the problems of incomplete and inaccurate monitoring of the state of the auxiliary switch in the prior art. To achieve one or a part of or all of the above or other objects, the present invention provides a method for monitoring the contact state of an auxiliary switch, comprising:
acquiring actual conductor resistance of each contact point of the auxiliary switch under the current voltage and contact point attribute parameters;
calculating an additional resistance of each of the contact points based on the contact point attribute parameters of the contact point, and calculating an actual resistance of each of the contact points based on the additional resistance and the conductor resistance of each of the contact points;
and judging whether the actual resistance of each contact point is greater than the reference resistance corresponding to the contact point, and if so, generating first alarm information of the contact point.
According to a specific embodiment, in the method for monitoring the contact state of the auxiliary switch, the reference resistance of each contact point is determined by the following method, including:
acquiring reference conductor resistance of each contact point of the auxiliary switch under reference voltage;
acquiring attribute data of a part where each contact point is connected with the power system, wherein the attribute data comprises: contact form, contact vertical radius, material data and contact film thickness, contact pressure;
calculating the contact surface resistance according to the contact vertical radius and the material data; calculating the contact film resistance according to the contact form, the contact film thickness and the contact pressure;
and summing the reference conductor resistance, the contact surface resistance and the contact membrane resistance to obtain the reference resistance.
According to a specific embodiment, in the method for monitoring the contact state of the auxiliary switch, the contact surface resistance is calculated according to the vertical radius of the contact portion and the contact material by the following formula:
Figure BDA0003707130790000021
wherein R is m D is the resistivity corresponding to the contact material, and a is the vertical radius.
According to a specific embodiment, in the above method for monitoring the contact state of the auxiliary switch, the contact film resistance is calculated according to the contact film thickness and the contact form by the following formula:
Figure BDA0003707130790000022
wherein R is CM Is the contact membrane resistance, F is the contact pressure, and V is the first constant corresponding to the contact form; k is a corresponding second constant based on the contact material.
According to a specific implementation mode, in the method for monitoring the contact state of the auxiliary switch, the contact attribute parameters include: contact point length data;
the calculating of the additional resistance of the contact point based on the contact point attribute parameters comprises:
converting the contact point length data into an actual contact film thickness, calculating an actual contact film resistance based on the actual contact film thickness, and determining the additional resistance based on the actual contact film resistance and the contact surface resistance.
According to a specific embodiment, in the method for monitoring the contact state of the auxiliary switch, the method further includes:
and calculating a first difference value between the actual resistance and the reference resistance based on the first alarm information, judging whether the first difference value exceeds a preset value, if so, calculating a second difference value between the actual conductor resistance and the reference conductor resistance, calculating a third difference value between the actual contact film resistance and the contact film resistance in the reference resistance, and performing correlation analysis on the first difference value, the second difference value and the third difference value to determine the fault category of the contact point.
In another aspect of the present invention, an auxiliary switch contact state monitoring device is provided, which includes:
the acquisition module is used for acquiring the actual conductor resistance of each contact point of the auxiliary switch under the current voltage and the attribute parameters of the contact point;
the storage module is used for pre-storing the reference resistance of each contact point of the auxiliary switch;
the calculation module is used for receiving the contact point attribute parameters of each contact point acquired by the measurement unit, calculating the additional resistance of the contact point based on the contact point attribute parameters, and calculating the actual resistance of each contact point based on the additional resistance and the conductor resistance of each contact point; and judging whether the actual resistance of each contact point is greater than the reference resistance corresponding to the contact point, and if so, generating first alarm information of the contact point.
According to a specific embodiment, in the device for monitoring contact state of an auxiliary switch, the reference resistance of each contact point is determined by the following method, including:
acquiring reference conductor resistance of each contact point of the auxiliary switch under reference voltage;
acquiring attribute data of a part where each contact point is connected with the power system, wherein the attribute data comprises: contact form, contact vertical radius, material data and contact film thickness, contact pressure;
calculating the contact surface resistance according to the contact vertical radius and the material data; calculating the contact film resistance according to the contact form, the contact film thickness and the contact pressure;
and summing the reference conductor resistance, the contact surface resistance and the contact membrane resistance to obtain the reference resistance.
According to a specific embodiment, in the device for monitoring the contact state of the auxiliary switch, the contact attribute parameters include: contact point length data;
the first computing unit is configured to: converting the contact point length data into the actual thickness of a contact film, calculating the actual contact film resistance based on the actual thickness of the contact film, and determining the additional resistance based on the actual contact film resistance and the contact surface resistance.
In another aspect of the present invention, there is provided an auxiliary switch contact state monitoring system, including: the auxiliary switch contact state monitoring device, the pressurizing unit and the measuring unit;
the pressurizing unit is used for applying voltage to each contact point of the auxiliary switch;
the measuring unit is used for acquiring the actual conductor resistance of each contact point of the auxiliary switch under the current voltage and the contact point state data, and transmitting the actual conductor resistance and the contact point state data to the auxiliary switch contact point state monitoring device.
The embodiment of the invention has the following beneficial effects:
according to the method for monitoring the contact state of the auxiliary switch, the actual conductor resistance of each contact of the auxiliary switch under real-time voltage and the attribute parameters of the contact are obtained; calculating an additional resistance of each of the contact points based on the contact point attribute parameters of the contact point, and calculating an actual resistance of each of the contact points based on the additional resistance and the conductor resistance of each of the contact points; when the actual resistance of the contact point is larger than the reference resistance corresponding to the contact point, generating first alarm information of the contact point; according to the method, the additional resistance of the contact point is accurately obtained by obtaining the attribute parameters of the contact point in real time, the current actual resistance of the contact point is obtained according to the conductor resistance and the additional resistance, the actual resistance is compared with the reference resistance of each normal pair of contact points, and the corresponding fault contact point can be found according to the abnormal contact point resistance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Wherein:
FIG. 1 is a schematic flow chart illustrating a method for monitoring the contact status of an auxiliary switch according to an embodiment;
FIG. 2 is a schematic diagram of an exemplary embodiment of an auxiliary switch contact status monitoring device;
FIG. 3 is a schematic diagram of an exemplary embodiment of an auxiliary switch contact condition monitoring system 1;
FIG. 4 is a schematic diagram of an exemplary embodiment of an auxiliary switch contact condition monitoring system 2.
Reference numerals: 1-auxiliary switch contact; 2-a measurement unit; 3-auxiliary switch contact state monitoring device.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Fig. 1 shows an auxiliary switch contact state monitoring method according to an exemplary embodiment of the present invention, which is applied to the auxiliary switch contact state monitoring apparatus shown in fig. 2, and includes:
s1, acquiring actual conductor resistance of each contact point of the auxiliary switch under the current voltage and contact point attribute parameters;
s2, calculating the additional resistance of each contact point based on the contact point attribute parameters of the contact point, and calculating the actual resistance of each contact point based on the additional resistance and the conductor resistance of each contact point;
and S3, judging whether the actual resistance of each contact point is larger than the reference resistance corresponding to the contact point, and if so, generating first alarm information of the contact point.
In this embodiment, the additional resistance of the contact point is accurately obtained by obtaining the attribute parameters of the contact point in real time, the current actual resistance of the contact point is obtained according to the conductor resistance and the additional resistance, and then the actual resistance is compared with the reference resistance of each normal pair of contacts, so that the corresponding fault alarm contact can be found according to the abnormal contact resistance.
Example 2
In a possible implementation manner, in the method for monitoring the contact state of the auxiliary switch, the reference resistance of each contact point is determined by the following method, including:
a1, acquiring the reference conductor resistance of each contact point of the normal auxiliary switch under the reference voltage;
a2, acquiring attribute data of each contact point connected with the power system, wherein the attribute data comprises: contact form, contact vertical radius, material data and contact film thickness, contact pressure;
a3, calculating the contact surface resistance according to the contact vertical radius and the material data; calculating the contact film resistance according to the contact form, the contact film thickness and the contact pressure;
and A4, summing the reference conductor resistance, the contact surface resistance and the contact membrane resistance to obtain the reference resistance.
In this embodiment, the reference resistance of the contact point in the state of being connected to the circuit is accurately determined by obtaining important parameters that affect the contact resistance of the auxiliary switch, such as the contact area of the contact point of the normal auxiliary switch (a normal auxiliary switch without a fault), the contact material, the contact pressure, the contact surface form, and the contact form.
In a possible implementation manner, the a1 specifically includes: the contact point is connected into the circuit, the contact point connected into the circuit is regarded as a section of complete conductor, reference current I and reference voltage drop U are passed through the contact point, reference conductor resistance RL is obtained through the reference current and the reference voltage, and the calculation formula is as follows:
Figure BDA0003707130790000061
in this embodiment, the reference conductor resistance of the contact point can be determined based on the ratio of the reference voltage to the current by connecting the contact point into the circuit and treating the contact point connected into the circuit as a section of a complete conductor.
In a possible implementation manner, in the above a2, the contact surface resistance is calculated according to the vertical radius of the contact part and the contact material by the following formula:
Figure BDA0003707130790000062
wherein R is m D is the resistivity corresponding to the contact material, and a is the vertical radius.
Specifically, when the contact is connected to the circuit, the equation of the equipotential surface of the actual contact position with the circuit is as follows:
Figure BDA0003707130790000063
the parameter a is the length of the vertical radius of the actual contact, the region where the current flows is related to the length of a, and when a is large, the extension resistance R of the equipotential surface is m Comprises the following steps:
Figure BDA0003707130790000064
the parameter D is the resistivity of the material, the total actual additional contact surface additional resistance R S Then it is twice R m Namely:
Figure BDA0003707130790000071
when the contact material of the contact point is different, the additional contact resistance R J Comprises the following steps:
Figure BDA0003707130790000072
it will be appreciated that when the contact is connected to a circuit, a first additional resistance, i.e. the actual contact surface resistance, is generated by the actual contact (which is actually connected to the circuit as a surface or a point) on the basis of the resistance of the conductor material. Therefore, in order to accurately obtain the reference resistance of the contact, in this embodiment, the actual contact area of the contact is calculated by obtaining the vertical radius of the contact when contacting with other elements of the circuit, and then the first additional resistance generated by the actual contact surface is calculated by obtaining the material of the contact and further combining the actual contact area and the resistivity of the material of the contact, so as to further obtain the accurate reference resistance of the contact.
In a possible implementation, in the above a3, the contact film resistance is calculated from the contact film thickness and the contact form by the following formula:
Figure BDA0003707130790000073
wherein R is CM Is the contact membrane resistance, F is the contact pressure, and V is the first constant corresponding to the contact form; k is a corresponding second constant based on the contact material. Wherein V-is a constant related to the contact form of the contact, and is between 0.4 and 0.8 for point contact V, and surface contact V is 1; k constants related to the contact material, the contact surface working method and the contact surface condition, such as: copper-copper: K-0.1X 10 -3 (ii) a Copper-aluminum K ═ 0.96X10 -3 (ii) a Aluminum-aluminum K ═ 5.4X10 -3
It can be understood that the auxiliary switch contact is influenced by the use environment and time, and an oxide film is generated between the contacts through the processes of environmental oxidation, pollution, dampness and the like, and the oxide film is changed into a contact film, so that the generated resistance is called as a second additional resistance, namely a contact film resistance; in the embodiment, a large number of theories and practical findings show that the magnitude of the contact film resistance is related to the thickness of the film in addition to the type of the formed film, and the thicker the film, the thicker the current contraction line, and the larger the resistance, so in the embodiment, in order to accurately obtain the reference resistance of the contact, the second additional resistance of the contact, i.e., the contact film resistance, is calculated by obtaining the attribute parameters (such as the thickness, the pressure, and the like) related to the contact film of the contact.
In a possible implementation manner, in the above-mentioned a4, the reference resistance of each contact of the normal auxiliary switch is calculated by the following formula:
the reference resistance is the conductor actual resistance + the actual contact resistance + the contact film resistance. Namely:
Figure BDA0003707130790000081
or:
Figure BDA0003707130790000082
in the embodiment, the additional resistance generated by the contact in the use state is fully considered, and then the resistance of the conductor material of the contact is combined, so that the reference resistance of the contact is accurately acquired.
In one possible implementation manner, in the method for monitoring a contact state of an auxiliary switch, the step S1 specifically includes: the method comprises the following steps of acquiring contact point state data collected by a measuring unit from the measuring unit, wherein the acquired contact point state data comprise: contact point length data;
in the above S2, the calculating the additional resistance of the contact point based on the contact point state data includes:
converting the contact point length data into an actual contact film thickness, calculating an actual contact film resistance based on the actual contact film thickness, and determining the additional resistance based on the actual contact film resistance and the contact surface resistance.
It can be understood that the vertical radius and the pressure of the contact part are values which are not easy to change and difficult to measure, in this embodiment, the difficulty degree of the property parameter measurement of the contact is fully considered, the actual contact film resistance is calculated by measuring the actual thickness of the contact film, and the actual additional resistance of the contact can be calculated based on the contact surface resistance in the actual contact film resistance and the reference resistance, so that the fault category of the contact can be obtained based on the difference value in the subsequent comparison.
In one possible implementation manner, the method for monitoring the contact state of the auxiliary switch further includes: s4, based on the first alarm information, calculating a first difference value between an actual resistance and a reference resistance, judging whether the first difference value exceeds a preset value, if so, calculating a second difference value between the actual conductor resistance and the reference conductor resistance, calculating a third difference value between the actual contact membrane resistance and a contact membrane resistance in the reference resistance, and performing correlation analysis on the first difference value, the second difference value and the third difference value to determine the fault type of the contact point.
Specifically, when a first-order fault occurs in the contact (e.g., failure to make and break, contact damage), the actual resistance of the contact changes abruptly, and thus the predetermined value is a large value. With the preset value N, N usually satisfies: n is more than or equal to 10% of reference resistance, for example, the reference resistance is 100 omega, and the preset value is 20 omega. At the moment, if the first difference obtained by calculation exceeds a preset value, the contact head is considered to have a large fault and needs to be replaced; if the fault type of the contact point is determined according to the first difference value, the second difference value and the third difference value, the fault type of the contact point is determined, and the repairing mode is determined.
In this embodiment, the prepared failure cause of the contact is obtained by performing correlation analysis on the difference, so that the failure is accurately removed.
In another aspect of the present invention, as shown in fig. 2, there is also provided an auxiliary switch contact state monitoring device, including:
the acquisition module is used for acquiring the actual conductor resistance of each contact point of the auxiliary switch under the current voltage and the attribute parameters of the contact point;
the storage module is used for pre-storing the reference resistance of each contact point of the auxiliary switch;
the calculation module is used for receiving the contact point attribute parameters of each contact point acquired by the measurement unit, calculating the additional resistance of the contact point based on the contact point attribute parameters, and calculating the actual resistance of each contact point based on the additional resistance and the conductor resistance of each contact point; and judging whether the actual resistance of each contact point is greater than the reference resistance corresponding to the contact point, and if so, generating first alarm information of the contact point.
Specifically, the acquisition module is used for performing data interaction with the measurement unit and the pressurization unit and acquiring corresponding data information from the measurement unit and the pressurization unit.
In this embodiment, the additional resistance of the contact point is accurately obtained by obtaining the attribute parameters of the contact point in real time, the current actual resistance of the contact point is obtained according to the conductor resistance and the additional resistance, and then the actual resistance is compared with the reference resistance of each normal pair of contacts, so that the corresponding fault contact can be found according to the abnormal contact resistance.
In one possible implementation manner, in the above auxiliary switch contact state monitoring device, the determining the reference resistance of each contact point by the following method includes:
acquiring reference conductor resistance of each contact point of the auxiliary switch under reference voltage;
acquiring attribute data of a part where each contact point is connected with the power system, wherein the attribute data comprises: contact form, contact vertical radius, material data and contact film thickness, contact pressure;
calculating the contact surface resistance according to the contact vertical radius and the material data; calculating the contact film resistance according to the contact form, the contact film thickness and the contact pressure;
and summing the reference conductor resistance, the contact surface resistance and the contact membrane resistance to obtain the reference resistance.
Alternatively, the reference conductor resistance may be calculated by applying a reference voltage and a reference current to each contact of the auxiliary switch.
In a possible implementation manner, in the device for monitoring contact state of an auxiliary switch, the contact attribute parameter includes: contact point length data;
the first computing unit is configured to: converting the contact point length data into an actual contact film thickness, calculating an actual contact film resistance based on the actual contact film thickness, and determining the additional resistance based on the actual contact film resistance and the contact surface resistance.
Optionally, a high precision laser rangefinder is used to measure the corresponding length data.
In another aspect of the present invention, an auxiliary switch contact state monitoring system is provided, including: the auxiliary switch contact state monitoring device, the pressurizing unit and the measuring unit;
the pressurizing unit is used for applying voltage to each contact point of the auxiliary switch;
the measuring unit is used for acquiring the actual conductor resistance of each contact point of the auxiliary switch under the current voltage and the contact point state data, and transmitting the actual conductor resistance and the contact point state data to the auxiliary switch contact point state monitoring device.
Optionally, the pressurizing unit is a software pressurizing unit or a hardware testing circuit.
In the embodiment, the additional resistance of the contact point is accurately obtained by obtaining the attribute parameters of the contact point in real time, the current actual resistance of the contact point is obtained according to the conductor resistance and the additional resistance, and then the actual resistance is compared with the reference resistance of each normal pair of contacts, so that the corresponding fault contact can be found according to the resistance of the abnormal contact.
Specifically, fig. 3 and 4 show application scenarios of the auxiliary switch contact state monitoring system for the power disconnecting switch provided in the embodiment of the present application.
While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims (10)

1. A method for monitoring the contact state of an auxiliary switch is characterized in that: the method comprises the following steps:
acquiring actual conductor resistance of each contact point of the auxiliary switch under the current voltage and contact point attribute parameters;
calculating an additional resistance of each of the contact points based on the contact point attribute parameters of the contact point, and calculating an actual resistance of each of the contact points based on the additional resistance and the conductor resistance of each of the contact points;
and judging whether the actual resistance of each contact point is greater than the reference resistance corresponding to the contact point, and if so, generating first alarm information of the contact point.
2. An auxiliary switch contact condition monitoring method as claimed in claim 1, wherein: determining a reference resistance for each of the contact points by a method comprising:
acquiring reference conductor resistance of each contact point of the auxiliary switch under reference voltage;
acquiring attribute data of each contact point and a part where the contact point is connected with the power system, wherein the attribute data comprises: contact form, contact vertical radius, material data and contact film thickness, contact pressure;
calculating the contact surface resistance according to the contact vertical radius and the material data; calculating the contact film resistance according to the contact form, the contact film thickness and the contact pressure;
and summing the reference conductor resistance, the contact surface resistance and the contact membrane resistance to obtain the reference resistance.
3. An auxiliary switch contact condition monitoring method as claimed in claim 2, wherein: calculating the contact surface resistance according to the vertical radius of the contact part and the contact material by the following formula:
Figure FDA0003707130780000011
wherein R is m D is the resistivity corresponding to the contact material, and a is the vertical radius.
4. A method of monitoring the contact state of an auxiliary switch as claimed in claim 2, wherein: calculating a contact film resistance from the contact film thickness and the contact form by the following formula:
Figure FDA0003707130780000012
wherein R is CM Is the contact membrane resistance, F is the contact pressure, and V is the first constant corresponding to the contact form; k is a corresponding second constant based on the contact material.
5. A method of monitoring the contact state of an auxiliary switch as claimed in claim 2, wherein: the contact point attribute parameters include: contact point length data;
the calculating of the additional resistance of the contact point based on the contact point attribute parameters includes:
converting the contact point length data into an actual contact film thickness, calculating an actual contact film resistance based on the actual contact film thickness, and determining the additional resistance based on the actual contact film resistance and the contact surface resistance.
6. An auxiliary switch contact condition monitoring method as claimed in claim 5, wherein: the method further comprises the following steps:
and calculating a first difference value between the actual resistance and the reference resistance based on the first alarm information, judging whether the first difference value exceeds a preset value, if so, calculating a second difference value between the actual conductor resistance and the reference conductor resistance, calculating a third difference value between the actual contact film resistance and the contact film resistance in the reference resistance, and performing correlation analysis on the first difference value, the second difference value and the third difference value to determine the fault category of the contact point.
7. The utility model provides an auxiliary switch contact state monitoring devices which characterized in that: the method comprises the following steps:
the acquisition module is used for acquiring the actual conductor resistance of each contact point of the auxiliary switch under the current voltage and the attribute parameters of the contact point;
the storage module is used for pre-storing the reference resistance of each contact point of the auxiliary switch;
the calculation module is used for receiving the contact point attribute parameters of each contact point acquired by the measurement unit, calculating the additional resistance of the contact point based on the contact point attribute parameters, and calculating the actual resistance of each contact point based on the additional resistance and the conductor resistance of each contact point; and judging whether the actual resistance of each contact point is greater than the reference resistance corresponding to the contact point, and if so, generating first alarm information of the contact point.
8. The auxiliary switch contact condition monitoring device of claim 7, wherein: determining a reference resistance for each of the contact points by a method comprising:
acquiring reference conductor resistance of each contact point of the auxiliary switch under reference voltage;
acquiring attribute data of a part where each contact point is connected with the power system, wherein the attribute data comprises: contact form, contact vertical radius, material data, contact film thickness and contact pressure;
calculating the contact surface resistance according to the contact vertical radius and the material data; calculating the contact film resistance according to the contact form, the contact film thickness and the contact pressure;
and summing the reference conductor resistance, the contact surface resistance and the contact membrane resistance to obtain the reference resistance.
9. The auxiliary switch contact condition monitoring device of claim 8, wherein: the contact point attribute parameters include: contact point length data;
the first computing unit is configured to: converting the contact point length data into an actual contact film thickness, calculating an actual contact film resistance based on the actual contact film thickness, and determining the additional resistance based on the actual contact film resistance and the contact surface resistance.
10. An auxiliary switch contact state monitoring system is characterized in that: the method comprises the following steps: the auxiliary switch contact state monitoring device according to any one of claims 7 to 9, and a pressurizing unit and a measuring unit;
the pressurizing unit is used for applying voltage to each contact point of the auxiliary switch; and the conductor resistance under the current voltage and current data is transmitted to the auxiliary switch contact state monitoring device;
the measuring unit is used for measuring contact point state data of each contact point of the auxiliary switch and transmitting the contact point state data to the auxiliary switch contact point state monitoring device.
CN202210708389.XA 2022-06-22 2022-06-22 Method, device and system for monitoring contact state of auxiliary switch Pending CN115097297A (en)

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