CN115092875A - Microneedle chip and method for producing same - Google Patents
Microneedle chip and method for producing same Download PDFInfo
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- CN115092875A CN115092875A CN202210691640.6A CN202210691640A CN115092875A CN 115092875 A CN115092875 A CN 115092875A CN 202210691640 A CN202210691640 A CN 202210691640A CN 115092875 A CN115092875 A CN 115092875A
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- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
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- A61B5/053—Measuring electrical impedance or conductance of a portion of the body
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- A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
- A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
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- A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
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- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
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- A61M37/00—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
- A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
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- A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
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Abstract
The invention provides a microneedle chip and a preparation method thereof, wherein an insulating layer and an electrode are manufactured on a microneedle structure, so that an electric signal can enter the skin through the microneedle structure to detect signals such as direct capacitance and resistance of the skin, and a skin detection result with higher accuracy is obtained; furthermore, according to the skin detection result, suitable chemicals such as skin care products, medicines and the like can be introduced into the skin layer through the micro-needle, so that the absorption of the skin to the chemicals is promoted, and the skin care is realized; further, an electrical signal may be applied to the microneedle chip according to the result of the skin test, so as to enhance the result of skin care. The invention improves the integration level and the convenience of the microneedle structure, improves the accuracy and the credibility of a skin detection result, and has a skin care function, thereby effectively expanding the functions and the application of the microneedle structure.
Description
Technical Field
The invention belongs to the technical field of instruments, and relates to a microneedle chip and a preparation method thereof.
Background
Skin moisture content detection, skin pH value detection and other skin detection are carried out on the surface of skin at present to calculate various parameter states of the skin, and the detection principle is that the skin state is obtained by calculation according to the skin surface measurement result, so that the result obtained by adopting the skin surface detection is greatly influenced by the environment, and the detection accuracy is low.
At present, skin care technologies such as radio frequency and ultrasound heat skin through a non-contact method to realize skin care, the heating efficiency is poor, and due to the adoption of a non-contact mode, feedback of skin care cannot be directly acquired, so that great hidden dangers exist, and destructive damage is easily caused to the skin.
The micro-needle structure is a special tool for promoting infiltration developed according to the structure of human skin, and can penetrate through the stratum corneum of the skin and open a channel leading to the dermis of the skin through the micro-needle structure, so that required medicines can more easily penetrate into cells of the dermis of the skin.
At present, the microneedle structure is applied to injection administration and the like by utilizing the characteristic of the mechanical structure that the microneedle structure can penetrate through the skin, but the integration level of the microneedle structure is still low at present, and the microneedle structure only utilizes the mechanical structure characteristic of the microneedle structure, so that the functions and the application of the microneedle structure are limited.
Therefore, it is necessary to provide a microneedle chip and a method for manufacturing the same.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a microneedle chip and a method for manufacturing the microneedle chip, which are used to solve the problems of large errors in skin detection and care and limited application of microneedle structures in the prior art.
To achieve the above and other related objects, the present invention provides a microneedle chip comprising:
a microneedle structure comprising a plurality of spaced microneedles;
an insulating layer covering a surface of the microneedle structure;
the electrodes are arranged on the insulating layer at intervals, cover the micro-needles, and are adjacent to each other, and the insulating layer is exposed from the electrodes.
Optionally, the microneedle structure comprises one of a silicon microneedle structure, a metal microneedle structure, and a polymer microneedle structure; the needle tip size of the microneedle comprises 1 nm-100 mu m.
Optionally, the insulating layer comprises one or a combination of a silicon oxide layer and a silicon nitride layer; the thickness of the insulating layer comprises 10nm to 10 μm.
Optionally, the electrode comprises one or a combination of a gold electrode, a silver electrode, a platinum electrode and a copper electrode; the thickness of the electrode comprises 1nm to 10 μm.
Optionally, the electrodes are arranged in one-to-one correspondence with the microneedles.
Optionally, the micro-needle structure further comprises a conductive pillar contacting the electrode, so as to electrically connect the electrode through the conductive pillar.
Optionally, any of the microneedle chips described above includes one or a combination of applications in skin detection and skin care.
The invention also provides a preparation method of the microneedle chip, which comprises the following steps:
providing a microneedle structure comprising a plurality of spaced microneedles;
forming an insulating layer covering the surface of the microneedle structure on the microneedle structure;
and forming a plurality of electrodes arranged at intervals on the insulating layer, wherein the electrodes cover the micro-needles, and the insulating layer is exposed adjacent to the electrodes.
Optionally, the microneedle structure comprises one of a silicon microneedle structure, a metal microneedle structure, and a polymer microneedle structure; wherein, when the microneedle structure is a silicon microneedle structure or a polymer microneedle structure, the preparation step comprises:
providing a substrate;
forming a resist layer on the substrate;
forming a photoresist layer on the etching resistant layer, and patterning the photoresist layer to form a photoresist window, wherein part of the etching resistant layer is exposed out of the photoresist window;
patterning the resist layer to form resist layer windows to expose portions of the substrate;
and removing the photoresist layer, etching the substrate, and removing the corrosion-resistant layer.
Optionally, the method further includes the step of preparing a conductive pillar in the substrate to electrically connect the electrode through the conductive pillar.
As described above, in the microneedle chip and the method for manufacturing the microneedle chip of the present invention, the insulating layer and the electrode are fabricated on the microneedle structure, so that the electrical signal can enter the skin through the microneedle structure to perform direct detection of signals such as capacitance and resistance on the skin, thereby obtaining a skin detection result with high accuracy; furthermore, according to the skin detection result, suitable chemicals such as skin care products, medicines and the like can be introduced into the skin layer through the micro-needle, so that the absorption of the skin to the chemicals is promoted, and the skin care is realized; further, an electrical signal can be applied to the microneedle chip according to the result of the skin detection, so as to enhance the result of skin care.
The microneedle chip and the preparation method thereof improve the integration level and convenience of the microneedle structure, improve the accuracy and reliability of a skin detection result, and have a skin care function, so that the functions and applications of the microneedle structure can be effectively expanded.
Drawings
Fig. 1 is a schematic structural view of a microneedle structure according to an embodiment of the present invention.
Fig. 2 shows a scanning electron micrograph of the microneedle structure of fig. 1.
Fig. 3 is a schematic structural diagram of a microneedle structure having an insulating layer formed thereon according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram after an electrode layer is formed in the embodiment of the invention.
Fig. 5 is a schematic structural diagram of a patterned electrode layer after forming an electrode according to an embodiment of the invention.
Fig. 6 is a diagram showing an equivalent circuit of capacitance between different rows of electrodes of the microneedle chip according to an embodiment of the present invention.
Fig. 7 is a diagram showing an equivalent circuit of the resistance between different rows of electrodes of the microneedle chip according to an embodiment of the present invention.
Description of the element reference numerals
100 microneedle structures
101 microneedle
200 insulating layer
300 electrode layer
301 electrode
Detailed Description
The following embodiments of the present invention are provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structures are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatial relationship terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
In the context of this application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed freely, and the layout of the components may be more complicated.
As shown in fig. 5, the present embodiment provides a microneedle chip, which includes:
a microneedle structure 100, wherein the microneedle structure 100 comprises a plurality of spaced microneedles 101;
an insulating layer 200, the insulating layer 200 covering a surface of the microneedle structure 100;
the electrodes 301 are arranged at intervals, the electrodes 301 are located on the insulating layer 200, cover the microneedles 101, and the insulating layer 200 is exposed adjacent to the electrodes 301.
In the microneedle chip of this embodiment, the insulating layer 200 and the electrode 301 are fabricated on the microneedle structure 100, so that an electrical signal can enter the skin through the microneedle 101 of the microneedle structure 100 to detect signals such as direct capacitance and resistance of the skin, thereby obtaining a skin detection result with high accuracy; furthermore, according to the result of skin detection, suitable chemicals such as skin care products, medicines and the like can be introduced into the skin layer through the micro-needles 101 to promote the skin to absorb the chemicals, so that the skin care is realized; further, an electrical signal may be applied to the microneedle chip according to the result of the skin detection, such as heating the skin, to enhance the skin care result.
The microneedle chip of the embodiment improves the integration level and convenience of the microneedle structure 100, improves the accuracy and reliability of a skin detection result, and has a skin care function, so that the functions and applications of the microneedle structure 100 can be effectively expanded.
As an example, the microneedle structure 100 may include one of a silicon microneedle structure, a metal microneedle structure, and a polymer microneedle structure.
Specifically, in the embodiment, the microneedle structure 100 is a silicon microneedle structure made of silicon, but is not limited thereto, and the microneedle structure 100 may also be a polymer microneedle structure made of a polymer material, or a metal microneedle structure made of a metal material, which is not limited herein. The tip size of the microneedle 101 may include 1nm to 100 μm, such as 1nm, 100nm, 1 μm, 10 μm, 100 μm, and the like, and the height, the bottom size, and the shape of the microneedle 101 may be selected according to the requirement, which is not limited herein.
As an example, the insulating layer 200 may include one or a combination of a silicon oxide layer and a silicon nitride layer.
Specifically, in the present embodiment, since the micro needle structure 100 is made of silicon, the insulating layer 200 is preferably a silicon oxide layer which is commonly used in semiconductor devices and is easy to form, but not limited thereto, and the insulating layer 200 may also be a silicon nitride layer, which is not limited herein.
The thickness of the insulating layer 200 may include 10nm to 10 μm, such as 10nm, 100nm, 1 μm, 10 μm, and the like, and may be set according to the requirement, which is not limited herein.
By way of example, the electrodes 301 may include one or a combination of gold, silver, platinum, and copper electrodes; the thickness of the electrode 301 may include 1nm to 10 μm.
Specifically, the thickness of the electrode 301 may include 1nm to 10 μm, such as 1nm, 100nm, 1 μm, 10 μm, etc., and the material, structure and thickness of the electrode 301 are not limited herein. The electrode 301 in this embodiment is a gold electrode with good conductivity, good corrosion resistance, and less damage to skin, but is not limited thereto.
As an example, the electrodes 301 are disposed in one-to-one correspondence with the microneedles 101.
Specifically, in this embodiment, as shown in fig. 5, the electrodes 301 and the microneedles 101 are disposed in a one-to-one correspondence, but not limited thereto, the electrodes 301 may also be disposed in a structure that a plurality of the microneedles 101 correspond to 1 of the electrodes 301, for example, 2, 3, etc. of the microneedles 101 correspond to 1 of the electrodes 301, and the specific configuration may be performed as needed, and is not limited herein.
As an example, the micro-needle structure 100 may further include a conductive pillar contacting the electrode 301, so as to electrically connect the electrode 301 through the conductive pillar.
Specifically, when the conductive pillars, such as TSV pillars, are prepared in the microneedle structure 100, the conductive pillars can be electrically connected to the electrodes 301 without increasing the size of the device, but the invention is not limited thereto, and the conductive pillars can also be connected by other electrical interconnection technologies, and the invention is not limited thereto.
Referring to fig. 1 to 5, this embodiment further provides a method for preparing a microneedle chip, including the following steps:
providing a microneedle structure 100, wherein the microneedle structure 100 comprises a plurality of spaced microneedles 101;
forming an insulating layer 200 covering the surface of the microneedle structure 100 on the microneedle structure 100;
a plurality of electrodes 301 arranged at intervals are formed on the insulating layer 200, the electrodes 301 cover the microneedles 101, and the insulating layer 200 is exposed adjacent to the electrodes 301.
Referring to fig. 1 to 5, the preparation of the microneedle chip will be described below with reference to the accompanying drawings.
First, referring to fig. 1, a microneedle structure 100 is provided, wherein the microneedle structure 100 comprises a plurality of microneedles 101 arranged at intervals.
As an example, the microneedle structure 100 may include one of a silicon microneedle structure, a metal microneedle structure, and a polymer microneedle structure; wherein, when the microneedle structure 100 is a silicon microneedle structure or a polymer microneedle structure, the preparing step may include:
providing a substrate;
forming a resist layer on the substrate;
forming a photoresist layer on the etching resistant layer, and patterning the photoresist layer to form a photoresist window, wherein part of the etching resistant layer is exposed out of the photoresist window;
patterning the resist layer to form resist layer windows to expose portions of the substrate;
and removing the photoresist layer, etching the substrate, and removing the corrosion-resistant layer.
Referring to fig. 1 and 2, in the present embodiment, the microneedle structure 100 is a silicon microneedle structure, but is not limited thereto, and the microneedle structure 100 may also be a polymer microneedle structure made of a polymer material, or a metal microneedle structure made of a metal material, which is not limited herein.
Wherein, when the silicon micro-needle structure is prepared, a monocrystalline silicon substrate or a polycrystalline silicon substrate can be used, the etch resistant layer can be a silicon oxide layer, and the silicon substrate can be subjected to anisotropic wet etching by an etching solution to form the micro-needle 101, which is not limited herein with respect to the preparation of the micro-needle structure 100.
The tip size of the microneedle 101 may include 1nm to 100 μm, such as 1nm, 100nm, 1 μm, 10 μm, 100 μm, and the like, and the height, the bottom size, and the shape of the microneedle 101 may be selected according to the requirement, which is not limited herein.
Next, referring to fig. 3, an insulating layer 200 covering the surface of the microneedle structure 100 is formed on the microneedle structure 100.
Specifically, a thermal oxidation method may be used to grow a silicon oxide layer with a certain thickness on the surface of the silicon substrate to serve as the insulating layer 200, or a vapor deposition (CVD) method may be used to deposit a silicon nitride layer, a silicon oxide layer, or the like with a certain thickness on the surface of the substrate to serve as the insulating layer 200. A specific method for forming the insulating layer 200, a type and a thickness of the insulating layer 200, etc. are not limited herein, and in the present embodiment, the insulating layer 200 is a silicon oxide layer. The thickness of the insulating layer 200 may include, but is not limited to, 10nm to 10 μm, such as 10nm, 100nm, 1 μm, 10 μm, and the like.
Next, referring to fig. 4 and 5, a plurality of electrodes 301 arranged at intervals are formed on the insulating layer 200, the electrodes 301 cover the microneedles 101, and the insulating layer 200 is exposed adjacent to the electrodes 301.
Specifically, as shown in fig. 4, an electrode layer 300 covering the insulating layer 200 may be formed on the insulating layer 200 by, for example, an electroplating method, and then a portion of the electrode layer 300 may be removed by an etching method to form the electrode 301 covering the microneedles 101 and exposing the insulating layer 200 between adjacent microneedles 101. The method for manufacturing the electrode 301 is not limited thereto, and is not limited thereto.
Wherein, the electrode 301 may comprise one or a combination of a gold electrode, a silver electrode, a platinum electrode and a copper electrode; the thickness of the electrode may include 1nm to 10 μm, such as 1nm, 100nm, 1 μm, 10 μm, etc., and the structure, material and thickness of the electrode 301 are not limited herein. The electrode 301 in this embodiment is a gold electrode with good conductivity, good corrosion resistance, and less damage to skin, but is not limited thereto.
As an example, the electrodes 301 are disposed in one-to-one correspondence with the microneedles 101.
Specifically, in this embodiment, the electrodes 301 and the microneedles 101 are arranged in a one-to-one correspondence manner, as shown in fig. 5, but not limited thereto, the electrodes 301 may also be arranged in a configuration that a plurality of microneedles 101 correspond to 1 electrode 301, for example, 2, 3, etc. microneedles 101 correspond to 1 electrode 301, and the configuration is not limited herein.
Further, a step of preparing a conductive pillar may be further included to electrically connect the electrode 301 through the conductive pillar.
Specifically, the TSV pillar may be prepared by forming a TSV hole in the substrate and depositing a metal material to be electrically connected to the electrode 301, but the invention is not limited thereto, and the TSV pillar may also be connected by other electrical interconnection techniques, and the invention is not limited thereto.
In this embodiment, the microneedle chip can be applied to one or a combination of skin detection and skin care.
Specifically, as shown in fig. 6, taking skin moisture and oil detection as an example, the method specifically includes the following steps:
1-1) preparing a microneedle structure, wherein the microneedle structure comprises a plurality of microneedles which are arranged at intervals;
1-2) carrying out oxidation insulation on the micro-needle structure;
1-3) depositing an electrode material on the microneedle structure;
1-4) patterning the electrode material according to design requirements to realize insulation between electrodes on the micro-needle structure;
1-5) after the microneedles penetrate through the skin epidermis, the electrodes on the microneedles are used as capacitance electrodes to detect capacitance values among the microneedles in different rows, and due to the fact that the dielectric constants of skin moisture and oil content are different, the detected capacitance values of the skin are different under different moisture and oil content proportions, and therefore detection of the skin moisture and the oil content can be achieved.
Similarly, as shown in fig. 7, after the microneedles penetrate the epidermis of the skin, the electrodes on the microneedles serve as resistance electrodes, so that the resistance values of the microneedles in different rows can be detected, and accurate information such as accurate fat content can be obtained.
Taking skin care of heating and hot compressing skin as an example, the method specifically comprises the following steps:
2-1) preparing a microneedle structure, wherein the microneedle structure comprises a plurality of microneedles which are arranged at intervals;
2-2) carrying out oxidation insulation on the micro-needle structure;
2-3) depositing an electrode material on the microneedle structure;
2-4) patterning the electrode material according to design requirements to realize insulation between electrodes on the micro-needle structure;
2-5) after the micro-needle penetrates the skin epidermis, the electrode on the micro-needle is used as a resistance electrode, and a voltage signal is applied to the electrode, so that accurate hot compress nursing of the skin can be realized.
In the embodiment, skin detection and nursing can be integrated on the micro-needle chip, and integration of skin detection and nursing is realized by improving integration level; the microneedle chip is used for skin detection, so that a more accurate skin detection result can be obtained; the microneedle chip is used for skin care, the microneedle can promote the absorption of chemicals to care the skin, the electric signal of the microneedle chip can also be used for skin care, and the two skin care technologies can be simultaneously applied to obtain a better skin care result.
Due to the improvement of the integration level of the microneedle chip, the portability of skin detection and nursing integration is greatly improved, the skin detection and nursing home use can be realized, the customization of skin nursing can be realized through the skin detection result of each person, the skin nursing pertinence is improved, and the defect that the existing skin nursing technology adopts a standard scheme to be used by all persons and lacks universality is avoided; because the skin detection and the care are carried out with the assistance of the microneedle chip, the local accurate detection and the care can be carried out so as to realize the accurate skin detection and the care.
In summary, according to the microneedle chip and the preparation method thereof, the insulating layer and the electrode are manufactured on the microneedle structure, so that the electric signal can enter the skin through the microneedle structure to directly detect signals such as capacitance and resistance of the skin, and a skin detection result with high accuracy is obtained; furthermore, according to the skin detection result, suitable chemicals such as skin care products, medicines and the like can be introduced into the skin layer through the micro-needle, so that the absorption of the skin to the chemicals is promoted, and the skin care is realized; further, an electrical signal can be applied to the microneedle chip according to the result of the skin detection, so as to enhance the result of skin care.
The microneedle chip and the preparation method thereof improve the integration level and convenience of the microneedle structure, improve the accuracy and reliability of a skin detection result, and have a skin care function, so that the functions and application of the microneedle structure can be effectively expanded.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A microneedle chip, comprising:
a microneedle structure comprising a plurality of spaced microneedles;
an insulating layer covering a surface of the microneedle structure;
the electrodes are arranged on the insulating layer at intervals, cover the micro-needles, and are adjacent to each other, and the insulating layer is exposed from the electrodes.
2. The microneedle chip according to claim 1, characterized in that: the micro-needle structure comprises one of a silicon micro-needle structure, a metal micro-needle structure and a polymer micro-needle structure; the needle tip size of the microneedle comprises 1 nm-100 mu m.
3. The microneedle chip according to claim 1, characterized in that: the insulating layer comprises one or a combination of a silicon oxide layer and a silicon nitride layer; the thickness of the insulating layer comprises 10 nm-10 μm.
4. The microneedle chip according to claim 1, characterized in that: the electrode comprises one or a combination of a gold electrode, a silver electrode, a platinum electrode and a copper electrode; the thickness of the electrode comprises 1nm to 10 μm.
5. The microneedle chip according to claim 1, characterized in that: the electrodes are arranged in one-to-one correspondence with the microneedles.
6. The microneedle chip according to claim 1, characterized in that: the micro-needle structure also comprises a conductive column which is in contact with the electrode, so that the electrode is electrically connected through the conductive column.
7. A microneedle chip according to any one of claims 1 to 6, wherein: the microneedle chip comprises one or a combination of applications in skin detection and skin care.
8. A method for preparing a microneedle chip is characterized by comprising the following steps:
providing a microneedle structure comprising a plurality of spaced microneedles;
forming an insulating layer covering the surface of the microneedle structure on the microneedle structure;
and forming a plurality of electrodes arranged at intervals on the insulating layer, wherein the electrodes cover the micro-needles, and the insulating layer is exposed adjacent to the electrodes.
9. The method for preparing a microneedle chip according to claim 8, wherein the microneedle structure comprises one of a silicon microneedle structure, a metal microneedle structure, and a polymer microneedle structure; wherein, when the microneedle structure is a silicon microneedle structure or a polymer microneedle structure, the preparation step comprises:
providing a substrate;
forming a resist layer on the substrate;
forming a photoresist layer on the etching resistant layer, and patterning the photoresist layer to form a photoresist window, wherein part of the etching resistant layer is exposed out of the photoresist window;
patterning the resist layer to form resist layer windows to expose portions of the substrate;
and removing the photoresist layer, etching the substrate, and removing the corrosion-resistant layer.
10. The method for producing a microneedle chip according to claim 8, characterized in that: the method also comprises the step of preparing a conductive column in the substrate so as to electrically connect the electrode through the conductive column.
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| CN113855031A (en) * | 2021-09-18 | 2021-12-31 | 浙江清华柔性电子技术研究院 | Flexible microneedle electrode and preparation method thereof |
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| US20190001108A1 (en) * | 2015-12-18 | 2019-01-03 | Labo Juversa Co., Ltd. | Microneedle and microneedle patch |
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