CN115086525A - Camera module assembling method, device, equipment and computer readable storage medium - Google Patents
Camera module assembling method, device, equipment and computer readable storage medium Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 58
- 238000003384 imaging method Methods 0.000 claims abstract description 269
- 238000012360 testing method Methods 0.000 claims description 21
- 239000003292 glue Substances 0.000 claims description 12
- 230000000007 visual effect Effects 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 abstract description 25
- 238000001723 curing Methods 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000010191 image analysis Methods 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N17/00—Diagnosis, testing or measuring for television systems or their details
- H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
Abstract
The invention discloses a camera module assembling method, a device, equipment and a computer readable storage medium, wherein the method comprises the following steps: measuring the focal plane and the position of a main focus of the lens to be mounted through a back projection MTF measuring device; acquiring an imaging surface of an image sensor to be installed and the position of the central point of the imaging surface; based on the positions of the focal plane and the main focus and the positions of the imaging surface and the central point, adjusting the posture of the lens to be mounted and/or the image sensor to be mounted to enable the lens to be mounted and the image sensor to be mounted to be in a target relative pose, wherein the focal plane coincides with the imaging surface under the target relative pose, and the main focus coincides with the central point; and when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target, fixing the lens to be mounted and the image sensor to be mounted. The assembling method based on the inverse projection MTF measurement provided by the invention has the advantages that the assembling efficiency is ensured, and the assembling precision is improved.
Description
Technical Field
The present invention relates to the field of optical technologies, and in particular, to a method, an apparatus, a device, and a computer-readable storage medium for assembling a camera module.
Background
At present, in order to obtain higher imaging quality, the lens controls the unit pixel size of the image sensor to be continuously reduced, and the number of the assembling lenses in the lens is continuously increased to obtain better imaging quality, and the lens also puts higher requirements on the assembling precision of the image sensor and the lens. In the market at present, the assembly of the lens is completed by mainly measuring the image analysis force SFR of the lens to be assembled and the image sensor to be assembled in a certain relative pose in an orthographic projection mode, namely, a test image is obtained through the lens to be assembled after the image sensor to be assembled is lightened, and then the image analysis force SFR is calculated by analyzing the test image so as to judge whether the current relative pose meets the assembly requirement. The method needs to continuously adjust the relative pose between the lens to be mounted and the image sensor to be mounted so as to find the relative pose which enables the imaging quality to be optimal and then fix the lens to be mounted and the image sensor to be mounted; moreover, because the measurement accuracy of the image analysis force SFR is affected to a certain degree by the depth of field of the lens, on one hand, the trial and error method can cause uncertainty of the assembly efficiency, and on the other hand, the assembly accuracy is low.
Disclosure of Invention
The invention mainly aims to provide a camera module assembling method, a camera module assembling device, camera module assembling equipment and a computer readable storage medium, and aims to provide a camera module assembling scheme based on back projection MTF measurement so as to improve the certainty and the assembling precision of the camera module assembling efficiency.
In order to achieve the above object, the present invention provides a camera module assembling method, including the steps of:
measuring the focal plane and the position of a main focus of the lens to be mounted through a back projection MTF measuring device;
acquiring an imaging surface of an image sensor to be installed and the position of the central point of the imaging surface;
based on the positions of the focal plane and the main focal point and the positions of the imaging plane and the central point, adjusting the posture of the lens to be mounted and/or the image sensor to be mounted so that the lens to be mounted and the image sensor to be mounted are in a target relative pose, wherein the focal plane coincides with the imaging plane and the main focal point coincides with the central point under the target relative pose;
and when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target, fixing the lens to be mounted and the image sensor to be mounted.
Optionally, the back-projection MTF measuring device includes a reticle mask disposed at an image plane position, and further includes a plurality of photosensitive imaging devices or a photosensitive imaging device with an adjustable position disposed at an object plane position;
the step of measuring the focal plane of the lens to be mounted and the position of the main focus by the back projection MTF measuring device comprises the following steps:
when the lens to be mounted is placed between the reticle mask and the photosensitive imaging devices, the reticle mask is controlled to perform focus searching movement, and after the reticle mask moves once, an MTF value is respectively measured through the plurality of photosensitive imaging devices, or an MTF value is respectively measured through the photosensitive imaging devices with adjustable positions at a plurality of positions;
determining a peak value of a plurality of MTF values measured by each photosensitive imaging device in the focus searching movement, determining the position of a focus on the focal plane according to the position information corresponding to the photosensitive imaging device for measuring the peak value and the position information corresponding to the reticle mask when the peak value is measured, and fitting according to the positions of a plurality of focuses to obtain the position of the focal plane, wherein the focus corresponding to the on-axis photosensitive imaging devices of the plurality of photosensitive imaging devices is a main focus; or the like, or, alternatively,
determining peak values of a plurality of MTF values measured by the photosensitive imaging device with the adjustable position at the same position in the focus searching movement, determining the position of a focus on the focus plane according to the position information corresponding to the photosensitive imaging device with the adjustable position when the peak values are measured and the position information corresponding to the reticle mask when the peak values are measured, and fitting according to the positions of a plurality of focuses to obtain the position of the focus plane, wherein the focus corresponding to the photosensitive imaging device with the adjustable position at the axial position is a main focus.
Optionally, a plurality of photosensitive imaging devices are arranged at the position of the object plane at different azimuth angles and image heights, and the photosensitive imaging device at each azimuth angle corresponds to a reticle corresponding to the azimuth angle and the image height in the reticle mask;
the step of determining the position of a focal point on the focal plane according to the position information corresponding to the photosensitive imaging device for measuring the peak value and the position information corresponding to the reticle mask when the peak value is measured comprises the following steps:
calculating to obtain an X-axis coordinate value and a Y-axis coordinate value of a focus on the focal plane according to the azimuth angle of the photosensitive imaging device for measuring the peak value and the image height of the corresponding reticle;
and determining a Z-axis coordinate value of a focus on the focal plane according to the measured flange focal length corresponding to the position of the reticle mask at the peak time, wherein the position of the focus comprises an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value of the focus.
Optionally, the adjusting the posture of the lens to be mounted based on the positions of the focal plane and the main focal point and the positions of the imaging plane and the central point so that the lens to be mounted and the image sensor to be mounted are in a target relative pose includes:
determining a first position error between the position of the focal plane and the position of the imaging plane, and determining a second position error between the position of the primary focus point and the position of the center point;
determining target control parameters corresponding to the first position error and the second position error according to a corresponding relation between a preset position error and control parameters of a six-axis clamping device;
and controlling the six-axis clamping device to adjust the posture according to the target control parameter so as to adjust the posture of the lens to be mounted clamped by the six-axis clamping device, so that the lens to be mounted and the image sensor to be mounted are in a target relative posture.
Optionally, the step of obtaining the position of the imaging plane of the image sensor to be mounted and the central point of the imaging plane includes:
acquiring an image of an imaging surface of the image sensor to be installed through a visual positioning device;
performing image processing on the image of the imaging surface to calculate the position of the central point of the imaging surface;
measuring the height difference of a plurality of points on the imaging surface by a height measuring device;
and fitting according to the height difference of the plurality of points on the imaging surface to obtain the position of the imaging surface.
Optionally, after the step of adjusting the posture of the lens to be mounted and/or the image sensor to be mounted based on the positions of the focal plane and the main focal point and the positions of the imaging plane and the central point, so that the lens to be mounted and the image sensor to be mounted are in a target relative pose, the method further includes:
when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target and a standard test graphic card is arranged at the object plane position of the lens to be mounted, the image sensor to be mounted is lightened to obtain a test image by drawing through the lens to be mounted;
obtaining imaging quality by analyzing the test image;
and when the imaging quality meets a preset quality standard, executing the step of fixing the lens to be mounted and the image sensor to be mounted when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target.
Optionally, when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target, the step of fixing the lens to be mounted and the image sensor to be mounted includes:
and when the lens to be mounted and the image sensor to be mounted after dispensing are in the relative pose of the target, curing the glue through a curing device so as to fix the lens to be mounted and the image sensor to be mounted.
In order to achieve the above object, the present invention further provides a camera module assembling device, including:
the measuring module is used for measuring the focal plane and the position of the main focus of the lens to be mounted through the back projection MTF measuring device;
the acquisition module is used for acquiring an imaging surface of the image sensor to be mounted and the position of the central point of the imaging surface;
the adjusting module is used for adjusting the posture of the lens to be mounted and/or the image sensor to be mounted based on the positions of the focal plane and the main focus and the positions of the imaging plane and the central point, so that the lens to be mounted and the image sensor to be mounted are in a target relative pose, wherein the focal plane coincides with the imaging plane and the main focus coincides with the central point under the target relative pose;
and the fixing module is used for fixing the lens to be mounted and the image sensor to be mounted when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target.
In order to achieve the above object, the present invention also provides a camera module assembling apparatus, including: the camera module assembling method comprises the following steps of a memory, a processor and a camera module assembling program which is stored on the memory and can run on the processor, wherein the steps of the camera module assembling method are realized when the camera module assembling program is executed by the processor.
In addition, to achieve the above object, the present invention further provides a computer readable storage medium, having a camera module assembling program stored thereon, which when executed by a processor implements the steps of the camera module assembling method as described above.
In the invention, the focal plane and the position of a main focus of a lens to be mounted are measured by a back projection MTF measuring device; acquiring an imaging surface of an image sensor to be installed and the position of the central point of the imaging surface; based on the positions of the focal plane and the main focus and the positions of the imaging surface and the central point, adjusting the posture of the lens to be mounted and/or the image sensor to be mounted to enable the lens to be mounted and the image sensor to be mounted to be in a target relative pose, wherein the focal plane coincides with the imaging surface under the target relative pose, and the main focus coincides with the central point; and when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target, fixing the lens to be mounted and the image sensor to be mounted. Compared with the existing camera module assembling method which does not know the relative pose when the imaging quality is optimal and needs step trial and error, the assembling method based on the back projection MTF measurement provided by the invention measures the optical parameters of the lens to be mounted and the image sensor to be mounted, namely the relative pose of the lens to be mounted and the image sensor to be mounted when the imaging quality is optimal is known, and no trial and error process exists, so that the assembling efficiency is deterministic, the optical parameter measuring error is far smaller than the imaging error of the image sensor to be mounted and the lens to be mounted in the existing camera module assembling method, and the assembling accuracy is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic flow chart of a camera module assembly method according to a first embodiment of the present invention;
fig. 2 is a schematic diagram of an inverse projection MTF measurement apparatus according to an embodiment of the present invention.
The objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, a camera module assembling method according to an embodiment of the present invention includes the following steps:
step S10, measuring the focal plane and the position of the main focus of the lens to be mounted through the back projection MTF measuring device;
in an ideal state, the lens and the image sensor are assembled in a relative posture when the focal plane of the lens and the image plane of the image sensor are completely overlapped, and the assembly precision is the highest. However, in the current assembly method, an orthographic projection mode is adopted to measure the image resolution sfr (spatial Frequency response) of the lens to be assembled and the image sensor to be assembled in a certain relative pose so as to complete lens assembly, and the method tries to find the optimal relative pose for assembly through a trial and error process, but obviously, the trial and error mode cannot determine how many times the lens to be assembled and the image sensor to be assembled can find the relative pose meeting the requirement, so that the assembly efficiency is uncertain. In addition, since the lens depth of field affects the measurement accuracy of the image analysis force SFR to some extent, there is also a problem of low assembly accuracy.
In this embodiment, to solve the above technical problem, an assembly method based on a back projection MTF (Modulation Transfer Function) measurement is provided, where the focal plane and the main focus of a lens to be assembled are measured, and the positions of the imaging plane and the central point of the imaging plane of an image sensor to be assembled are obtained, and the relative pose of the lens to be assembled and the image sensor to be assembled is adjusted by taking the plane-plane coincidence as a target, so that the lens to be assembled and the image sensor to be assembled can be directly assembled in a relative pose close to an ideal state, and compared with a lens assembly method based on a forward projection measurement, which does not know the relative pose when the imaging quality is optimal, a step trial and error is required, the assembly method of this embodiment is equivalent to the known relative pose of the lens to be assembled and the image sensor to be assembled when the imaging quality is optimal, and there is no trial and error process, so that the assembly efficiency has certainty, and also improves the assembly accuracy.
Specifically, the lens to be mounted may be placed at a measurement position of the inverse projection MTF measurement device, and the focal plane and the position of the main focus of the lens to be mounted may be measured by the inverse projection MTF measurement device. In a specific embodiment, the lens to be mounted can be clamped by the clamping device, and the movement of the lens to be mounted is driven by controlling the movement of the clamping device. The placing of the lens to be mounted at the measurement position of the inverse projection MTF measurement device may specifically be controlling the movement of the clamping device to drive the lens to be mounted to move to the measurement position of the inverse projection MTF measurement device, or controlling the movement of the inverse projection MTF measurement device to make the lens to be mounted at the measurement position of the inverse projection MTF measurement device, or may be achieved by manual operation, which is not limited in this embodiment. In addition, it should be noted that, in the following embodiments, when the lens to be mounted needs to be placed at a certain device or a certain station, the lens to be mounted may be implemented by adjusting the position of the lens to be mounted, or may be implemented by adjusting the position of the device or the station, which is not limited in this embodiment.
MTF is a method for analyzing the resolution ratio of the optical lens, and the MTF value is a reference value for measuring the optical lens. The back projection MTF measuring device detects by reversing the positions of an imaging system object and an image, a reticle mask (reticle) is arranged at the image surface position of the measured lens, a plurality of photosensitive imaging devices or one photosensitive imaging device with an adjustable position is arranged at the object surface position, namely, the lens to be mounted needs to be placed between the reticle mask and the photosensitive imaging devices when measuring, the reticle mask is arranged on one side of the image surface of the lens to be mounted, and the photosensitive imaging devices are arranged on one side of the object surface of the lens to be mounted. The surface of the object space with clear focus is called the object surface, and the surface of the image space corresponding to the object surface is the image surface. The multiple photosensitive imaging devices specifically comprise an on-axis photosensitive imaging device and multiple off-axis photosensitive imaging devices, or the photosensitive imaging devices can be respectively used as the on-axis photosensitive imaging device and the off-axis photosensitive imaging device by adjusting the positions of the photosensitive imaging devices with adjustable positions. The method comprises the steps of looking down an inverse projection MTF measuring device by looking from an object plane position to an image plane position with a sight line, wherein all off-axis photosensitive imaging devices are distributed around an axis photosensitive imaging device, a coordinate system is established by taking the axis photosensitive imaging device as an origin, all off-axis photosensitive imaging devices have different azimuth angles, and the distances between all off-axis photosensitive imaging devices and the origin can be the same or different. The reticle mask has a plurality of reticles engraved on a surface thereof, and the shape of the reticle is not limited in this embodiment, and may be, for example, a cross reticle. The reticle on the reticle mask surface corresponds to the photosensitive imaging devices one by one, the photosensitive imaging device at each azimuth angle corresponds to the reticle (reticle) in the reticle mask corresponding to the azimuth angle and the image height, and the image height of the reticle at the center of the reticle mask corresponding to the axial photosensitive imaging device is 0. It can be understood that if the azimuth angles of the two photosensitive imaging devices are the same but the distances from the original center are different, the azimuth angles of the two ruled lines corresponding to the two photosensitive imaging devices are the same but the image heights are different. In some embodiments, the photosensitive imaging Device may employ a CCD (Charge Coupled Device). The light source is arranged on one side, opposite to the photosensitive imaging device, of the reticle photomask, the light source illuminates the reticle photomask, part of light rays penetrate through reticles on the reticle photomask and then are projected onto the photosensitive imaging device through the lens to be mounted, the photosensitive imaging device obtains images of corresponding reticles on the reticle photomask, an MTF value can be calculated through the images, the MTF value represents the imaging quality of the lens to be mounted at the position of the reticle, and the larger the MTF value is, the higher the imaging quality is.
For a certain photosensitive imaging device, the distance from the reticle mask to the lens to be mounted is adjusted by moving the reticle mask, the maximum MTF value tested by the photosensitive imaging device when the reticle mask is at a certain position can be measured, the position of the reticle corresponding to the photosensitive imaging device when the reticle mask is at the certain position is a point on the focal plane of the lens to be mounted, then, the positions of a plurality of points on the focal plane of the lens to be mounted can be measured by a plurality of photosensitive imaging devices, and the position of a plane can be obtained by fitting the positions of the plurality of points, wherein the position of the plane is the position of the focal plane, and the point measured by the axis photosensitive imaging device is the primary focus.
Based on the principle, the focal plane and the position of the main focus of the lens to be mounted can be measured through the back projection MTF measuring device. In a specific embodiment, the positions of the focal plane and the main focal point may be relative to a certain coordinate system, and may be represented by an angle value, a coordinate value, and the like, which is not limited in this embodiment.
Fig. 2 shows a schematic diagram of a back-projection MTF measurement apparatus. The back-projection MTF measurement apparatus shown in fig. 2 is only an example, and should not bring any limitation to the function and the range of use of the back-projection MTF measurement apparatus in the present embodiment. Reference numeral 1 denotes an inverse projection MTF measuring apparatus, which includes a dome 101 having a hemispherical shape, a plurality of holders 102 slidably mounted on the dome, a photosensitive imaging device 103 mounted on the holders, and a reticle mask 104. 2 is a six-axis holding device, and 3 is a lens to be measured.
Step S20, acquiring the position of an imaging surface of the image sensor to be installed and the central point of the imaging surface;
the position of the imaging plane of the image sensor to be mounted and the center point of the imaging plane may be obtained by various methods, which are not limited in this embodiment. For example, in one embodiment, a specific position for placing the image sensor to be installed is set on the assembly station, and the positions of the imaging surface and the central point of the imaging surface of the image sensor to be installed when the image sensor to be installed is placed at the specific position are measured by pre-calibration, and the position information is stored; on the production line, for each image sensor to be mounted, the image sensor to be mounted can be directly placed at the specific position of the assembly station, and the position of the imaging surface and the central point of the imaging surface which are stored in advance are directly obtained and used as the position of the imaging surface and the central point of the imaging surface of the image sensor to be mounted. In a specific embodiment, the positions of the imaging plane and the center point of the imaging plane may be relative to a certain coordinate system, and may be represented by an angle value, a coordinate value, and the like, which is not limited in this embodiment.
In a specific embodiment, the image sensor to be mounted can be clamped by the clamping device, and the movement of the image sensor to be mounted is driven by controlling the movement of the clamping device.
Step S30, based on the positions of the focal plane and the main focal point and the positions of the imaging plane and the central point, adjusting the posture of the lens to be mounted and/or the image sensor to be mounted so that the lens to be mounted and the image sensor to be mounted are in a target relative pose, wherein the focal plane coincides with the imaging plane and the main focal point coincides with the central point under the target relative pose;
after the positions of the focal plane and the main focus of the lens to be mounted and the positions of the imaging plane and the central point of the imaging plane of the image sensor to be mounted are obtained, the lens to be mounted and the image sensor to be mounted can be in a target relative pose by adjusting the posture of the lens to be mounted and/or the image sensor to be mounted, under the target relative pose, the focal plane of the lens to be mounted and the imaging plane of the image sensor to be mounted are coincident, and the main focus of the lens to be mounted and the central point of the imaging plane of the image sensor to be mounted are coincident. It can be understood that, when the posture of the lens to be installed is adjusted, the positions of the focal plane and the main focus can move accordingly, when the posture of the image sensor to be installed is adjusted, the central point of the imaging plane and the imaging plane of the image sensor to be installed can move, and the purpose of adjusting the posture is to enable the focal plane of the lens to be installed and the imaging plane of the image sensor to be installed to be coincident after adjustment, and the main focus of the lens to be installed and the central point of the imaging plane of the image sensor to be installed to be coincident, but not before adjustment.
In a specific embodiment, only the posture of the lens to be mounted may be adjusted, only the posture of the image sensor to be mounted may be adjusted, and both the posture of the lens to be mounted and the posture of the image sensor to be mounted may be adjusted, which is not limited in this embodiment. The posture of the lens to be mounted can be adjusted by clamping the lens to be mounted by adopting a six-axis clamping device and adjusting the posture of the lens to be mounted by adjusting control parameters of the six-axis clamping device. The same is true for the attitude adjustment method of the image sensor to be installed. The six-axis clamping device is a clamping device capable of adjusting the pose of the clamped object in the space by adjusting parameters of six degrees of freedom, and can be realized by adopting a conventional six-axis clamping device, which is not limited in this embodiment. The six-degree-of-freedom parameters are a moving degree-of-freedom parameter along the directions of three orthogonal coordinate axes of x, y and z and a rotating degree-of-freedom parameter around the three coordinate axes respectively, and the posture of a lens to be mounted or an image sensor to be mounted, which is clamped by the six-axis clamping device, in a space can be changed by adjusting any one parameter of the six-axis clamping device.
In a specific implementation manner, based on a position error between a focal plane of the lens to be mounted and an imaging plane of the image sensor to be mounted and a position error between a main focal point of the lens to be mounted and a central point of the imaging plane of the image sensor to be mounted, a control parameter of the clamping device of the lens to be mounted and/or the clamping device of the image sensor to be mounted is determined, the clamping device is controlled to adjust the posture according to the control parameter, and then the posture of the lens to be mounted and/or the image sensor to be mounted is adjusted, so that after the adjustment, the focal plane of the lens to be mounted coincides with the imaging plane of the image sensor to be mounted, and the main focal point of the lens to be mounted coincides with the central point of the imaging plane of the image sensor to be mounted. Further, when the reference system of the focal plane and the main focus of the lens to be mounted is different from the reference system of the imaging plane and the central point of the imaging plane of the image sensor to be mounted, the reference system can be converted into the same reference system and then the error is calculated. For example, when the positions of the focal plane, the main focus, the imaging plane, and the center point are relative to a coordinate system, the positions of the focal plane and the main focus and the positions of the imaging plane and the center point may be converted to be relative to the same coordinate system.
And step S40, when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target, fixing the lens to be mounted and the image sensor to be mounted.
When the lens to be mounted and the image sensor to be mounted are in the opposite pose of the target, the lens to be mounted and the image sensor to be mounted can be fixed so as to assemble the lens to be mounted and the image sensor to be mounted together. The method for fixing the lens to be mounted and the image sensor to be mounted is not limited in this embodiment, and for example, a method of UV light curing after dispensing may be adopted.
It can be understood that, when the target is in the relative pose, the focal plane of the lens to be assembled and the imaging plane of the image sensor to be assembled are coincident, and the main focal point of the lens to be assembled and the central point of the imaging plane of the image sensor to be assembled are coincident, so that the assembly precision of the final assembled finished product is considered to be the highest or close to the ideal highest precision, and compared with a lens assembly method based on orthographic projection measurement, the assembly precision is improved. Moreover, the assembly processes of each group of lenses to be assembled and the image sensor to be assembled are the same, and trial and error with uncertain times are not needed in the middle, so that the assembly efficiency certainty is improved or the assembly efficiency consistency is improved compared with a lens assembly method based on orthographic projection measurement.
Example two
On the basis of the first embodiment, the back-projection MTF measuring apparatus in the above embodiment includes a reticle mask disposed at an image plane position, and further includes a plurality of photosensitive imaging devices disposed at an object plane position or a photosensitive imaging device with an adjustable position, and step S10 specifically includes steps S101 to S103, which will be described below. In this embodiment, the same or similar contents as those in the first embodiment may refer to the above description, and are not repeated herein.
Step S101, when the lens to be mounted is placed between the reticle mask and the photosensitive imaging device, controlling the reticle mask to perform focus searching movement, and after the reticle mask moves once, respectively measuring an MTF value through the plurality of photosensitive imaging devices, or respectively measuring an MTF value through the position-adjustable photosensitive imaging devices at a plurality of positions;
in the present embodiment, a specific implementation is proposed for measuring the positions of the focal plane of the lens to be mounted and the main focus by the back-projection MTF measuring device.
Specifically, when the lens to be mounted is placed between the reticle mask and the photosensitive imaging device, the reticle mask can be controlled to perform focus searching movement. The focus searching movement aims to change the distance between the reticle photomask and the lens group to be assembled for many times. In the embodiment, the focus searching movement can be realized by controlling the reticle mask to move close to the lens to be mounted step by step from far to near by the same step.
When a plurality of photosensitive imaging devices are arranged in the back projection MTF measuring device, in the process of focus searching movement, after the reticle mask moves once, an MTF value is respectively measured through each photosensitive imaging device.
When a photosensitive imaging device with an adjustable position is arranged in the back projection MTF measuring device, in the process of focus searching movement, after the reticle mask moves once, an MTF value is respectively measured under a plurality of azimuth angles and image heights by adjusting the position of the photosensitive imaging device with the adjustable position.
Step S102, determining a peak value of a plurality of MTF values measured by each photosensitive imaging device in the focus searching movement, determining the position of a focus on the focal plane according to the position information corresponding to the photosensitive imaging device for which the peak value is measured and the position information corresponding to the reticle mask when the peak value is measured, and fitting according to the positions of a plurality of focuses to obtain the position of the focal plane, wherein the focus corresponding to the on-axis photosensitive imaging device in the plurality of photosensitive imaging devices is a main focus.
When a plurality of photosensitive imaging devices are provided in the back-projection MTF measuring device, a peak value can be determined for each of the photosensitive imaging devices from a plurality of MTF values measured by the photosensitive imaging device in the focus seeking movement. It can be understood that, taking the distance between the reticle mask and the lens to be mounted in the focus seeking movement or the focal length of the flange as the abscissa and the MTF value as the ordinate, a plurality of MTF values measured by the photosensitive imaging device in the focus seeking movement can be regarded as an MTF curve or can be fitted into an MTF curve, and the peak value is the peak value of the MTF curve. However, when determining the peak value from the plurality of MTF values obtained by the photosensitive imaging device in the focus seeking movement, the MTF curve is not necessarily obtained by fitting, that is, the maximum value may be directly selected from the plurality of MTF values as the peak value, or the peak value of the MTF curve may be obtained after obtaining one MTF curve based on fitting of each discrete MTF value.
After determining the peak value measured by the photosensitive imaging device, the position of a point (focus) on the focal plane can be determined according to the position information corresponding to the photosensitive imaging device and the position information corresponding to the reticle mask when the peak value is measured. The position of a point in space can be described by X, Y and the position of three axes of Z, the azimuth angle and image height information corresponding to the photosensitive imaging device can be used for describing the position of a focal point on the X and Y axes, and the position information corresponding to the reticle mask can be used for describing the position of the focal point on the Z axis.
Each photosensitive imaging device can measure the position of one focal point, and the photosensitive imaging device on the shaft can measure the position of the main focal point. The positions of a plurality of focuses measured by a plurality of photosensitive imaging devices can be fitted to obtain the position of a surface, namely the focal plane of the lens to be mounted.
Step S103, determining peak values of a plurality of MTF values measured by the position-adjustable photosensitive imaging device at the same position in the focus searching movement, determining the position of a focus on the focal plane according to the position information corresponding to the position-adjustable photosensitive imaging device when the peak values are measured and the position information corresponding to the reticle mask when the peak values are measured, and fitting according to the positions of a plurality of focuses to obtain the position of the focal plane, wherein the focus corresponding to the position-adjustable photosensitive imaging device at the axial position is the main focus.
When a position-adjustable photosensitive imaging device is arranged in the back-projection MTF measuring device, a peak value can be determined from a plurality of MTF values tested in the focus seeking movement of the photosensitive imaging device at the position for the position to which the photosensitive imaging device moves. It can be understood that, taking the distance between the reticle mask and the lens to be mounted in the focus seeking movement or the focal length of the flange as the abscissa and the MTF value as the ordinate, a plurality of MTF values measured in the focus seeking movement of the photosensitive imaging device at one same position can be regarded as an MTF curve or can be fitted into an MTF curve, and the peak value is the peak value of the MTF curve. However, when determining the peak value from the plurality of MTF values obtained by the photosensitive imaging device in the focus seeking movement, the MTF curve is not necessarily obtained by fitting, that is, the maximum value may be directly selected from the plurality of MTF values as the peak value, or the peak value of the MTF curve may be obtained after obtaining one MTF curve based on fitting of each discrete MTF value.
After determining the peak value measured when the photosensitive imaging device is at a position, the position of a point (focus) on the focal plane can be determined according to the position information corresponding to the photosensitive imaging device and the position information corresponding to the reticle mask when the peak value is measured. The position of a point in space can be described by X, Y and the position of three axes of Z, the position information corresponding to the photosensitive imaging device can be used for describing the position of a focal point on the X and Y axes, and the position information corresponding to the reticle mask can be used for describing the position of the focal point on the Z axis.
The photosensitive imaging device can measure the position of one focus when moving to one position, and can measure the position of the main focus when moving to the axial position. Through the positions of the plurality of focuses, the position of a surface, namely the focal plane of the lens to be mounted, can be obtained through fitting.
Further, in an embodiment, a plurality of photosensitive imaging devices are disposed at the object plane position at different azimuth angles, and each photosensitive imaging device at each azimuth angle corresponds to a reticle corresponding to the azimuth angle and the image height in the reticle mask, and the step S102 of determining the position of one focal point on the focal plane according to the position information corresponding to the photosensitive imaging device at which the peak value is measured and the position information corresponding to the reticle mask at the time of measuring the peak value includes:
step S1021, calculating to obtain an X-axis coordinate value and a Y-axis coordinate value of a focus on the focal plane according to the azimuth angle of the photosensitive imaging device for measuring the peak value and the image height of the corresponding reticle;
in this embodiment, the position information corresponding to the photosensitive imaging device may be an azimuth angle of the photosensitive imaging device and an image height of a reticle corresponding to the photosensitive imaging device. According to the azimuth angle of the photosensitive imaging device and the image height of the corresponding reticle, the X-axis coordinate value and the Y-axis coordinate value of one focus on the focal plane can be calculated. Specifically, the X-axis coordinate value and the Y-axis coordinate value may be calculated by multiplying the image height by the sine value and the cosine value of the azimuth angle, respectively.
In another embodiment, the position information corresponding to the photosensitive imaging device may be an X-axis coordinate value and a Y-axis coordinate value which are calculated in advance.
Step S1022, determining a Z-axis coordinate value of a focus on the focal plane according to the measured flange focal length corresponding to the position of the reticle mask when the peak value is detected, wherein the position of the focus comprises an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value of the focus.
And for a peak value measured by the photosensitive imaging device, determining a Z-axis coordinate value of a focus on a focal plane according to the flange focal length corresponding to the position of the reticle mask when the peak value is measured, so that an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value of the focus measured by the photosensitive imaging device can be obtained. The determining of the Z-axis coordinate value according to the flange focal length may specifically be converting the Z-axis coordinate value according to the flange focal length according to a position relationship between the coordinate system and the lens to be mounted, and how to select the coordinate system is not limited in this embodiment, so the conversion method is not described herein.
EXAMPLE III
On the basis of the first and/or second embodiments, the step S30 of the camera module assembling method in the above embodiments specifically includes the steps S301 to S303, which will be described below. In this embodiment, the same or similar contents as those in the first embodiment may refer to the above description, and are not repeated herein.
Step S301, determining a first position error between the position of the focal plane and the position of the imaging plane, and determining a second position error between the position of the main focus and the position of the central point;
in this embodiment, the relative pose of the lens to be mounted and the image sensor to be mounted can be adjusted to reach the target relative pose.
Specifically, a position error between the position of the focal plane and the position of the imaging plane (hereinafter referred to as a first position error for distinction) may be determined first, and a position error between the position of the main focus and the position of the center point (hereinafter referred to as a second position error) may be determined. The first position error may be represented by a rotation angle, and the second position error may be represented by a coordinate value difference between coordinate points in each coordinate axis, which is not limited in this embodiment.
Step S302, determining target control parameters corresponding to the first position error and the second position error according to a corresponding relation between a preset position error and control parameters of a six-axis clamping device;
the correspondence between the position error and the control parameter of the six-axis clamping device may be set in advance, for example, how much the corresponding control parameter should be adjusted when the rotation angle is so that the normal directions of the two surfaces after adjustment are consistent. Then, after the first position error and the second position error are obtained, the target control parameters corresponding to the first position error and the second position error may be determined according to the correspondence.
Step S303, controlling the six-axis clamping device to adjust the posture according to the target control parameter so as to adjust the posture of the lens to be mounted clamped by the six-axis clamping device, so that the lens to be mounted and the image sensor to be mounted are in a target relative posture.
After the target control parameters are determined, the six-axis clamping device is controlled to adjust the posture according to the target control parameters, the six-axis clamping device drives the lens to be mounted to rotate or move, and therefore the purpose of adjusting the posture of the lens to be mounted is achieved, and after adjustment is conducted, the lens to be mounted and the image sensor to be mounted are in the target relative pose.
In the embodiment, the control parameter for correcting the position error is determined according to the position error between the surface and between the point and the point, and the posture of the lens to be mounted is adjusted once so that the lens to be mounted and the image sensor to be mounted reach the target relative posture.
Example four
On the basis of the first, second and/or third embodiments, the step S20 of the camera module assembling method in the above embodiments specifically includes the steps S201 to S204, which will be described below. In this embodiment, the same or similar contents as those in the first embodiment may refer to the above description, and are not repeated herein.
Step S201, acquiring an image of an imaging surface of the image sensor to be installed through a visual positioning device;
in this embodiment, the positions of the imaging surface and the center point of the imaging surface of the image sensor to be mounted can be obtained through the visual positioning device and the height measuring device. In particular, the visual positioning device may comprise a camera for acquiring an image of an imaging surface of the image sensor to be mounted from a top view.
Step S202, image processing is carried out on the image of the imaging surface to calculate the position of the central point of the imaging surface;
and identifying the acquired image of the imaging surface, determining the position of the center of the imaging surface in the image, and converting the position into coordinate values of an X axis and a Y axis in a space coordinate system.
Step S203, measuring the height difference of a plurality of points on the imaging surface through a height measuring device;
and step S204, fitting according to the height difference of the points on the imaging surface to obtain the position of the imaging surface.
The height measuring device can be realized by a common height measuring device such as a laser height measuring instrument, and is not limited in this embodiment. The height difference of a plurality of points on the imaging surface can be measured by performing a multi-point test on the imaging surface through the height measuring device, and the coordinate values of the X axis and the Y axis of each point are known, so that the position of one surface (the imaging surface) can be obtained by fitting according to the coordinates of the X axis and the Y axis of each point and the height difference, and the position can be represented by using the normal direction or by using other manners, which is not limited in this embodiment. And after the X-axis coordinate value and the Y-axis coordinate value of the position of the imaging surface and the central point of the imaging surface are obtained, the Z-axis coordinate value of the central point of the imaging surface can be obtained through calculation.
Further, in an embodiment, after the step S30, the method further includes:
step S50, when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target and a standard test graphic card is arranged at the object plane position of the lens to be mounted, the image sensor to be mounted is lightened to obtain a test image through image taking of the lens to be mounted;
in this embodiment, to further ensure the imaging quality of the finished product, the imaging quality of the lens to be mounted and the image sensor to be mounted in the target relative pose may be measured by orthographic projection after the lens to be mounted and the image sensor to be mounted are adjusted to be in the target relative pose, so that when it is determined that the imaging quality meets the requirement, subsequent assembly may be performed
Specifically, when the lens to be mounted and the image sensor to be mounted are adjusted to be in the relative pose of the target, and a standard test graphic card is arranged at the object plane position of the lens to be mounted, the image sensor to be mounted is lightened to obtain a test image through image taking of the lens to be mounted. Under the condition that the relative pose of the target is kept unchanged after the lens to be mounted and the image sensor to be mounted are adjusted to the relative pose of the target, the lens to be mounted and the image sensor to be mounted are moved into a forward projection measuring device, so that the standard test graphic card is positioned at the object plane position of the lens to be mounted; or, after the lens to be mounted and the image sensor to be mounted are respectively moved to the orthographic projection measuring device, the lens to be mounted and the image sensor to be mounted are adjusted to the target relative posture.
Step S60, obtaining imaging quality by analyzing the test image;
after the test image is acquired, the imaging quality can be obtained by analyzing the test image. The analyzing of the test image to obtain the imaging quality may specifically be analyzing to obtain an image analysis force SFR, and the image analysis force SFR may reflect the imaging quality.
Step S70, when the imaging quality meets the preset quality standard, executing the step S40.
And comparing the imaging quality obtained by analysis with a preset quality standard, and fixing the lens to be mounted and the image sensor to be mounted when the lens to be mounted and the image sensor to be mounted are in a target relative pose.
When the imaging quality obtained by analysis does not meet the preset quality standard, the fixation can be omitted, so as to avoid obtaining defective products with imaging quality not too much. The unfixed lens to be installed and the unfixed image sensor to be installed can be discarded, or the lens to be installed is assembled with other image sensors to be installed, and the image sensor to be installed is assembled with other lenses to be installed.
Further, in an embodiment, the step S40 includes:
step S401, when the lens to be mounted and the image sensor to be mounted after dispensing are in the relative pose of the target, curing glue through a curing device so as to fix the lens to be mounted and the image sensor to be mounted.
The lens to be mounted and the image sensor to be mounted can be assembled in a light curing mode after dispensing. Specifically, the lens to be mounted and the image sensor to be mounted after dispensing can be adjusted to be in the target relative pose, glue on the mounting surface of the image sensor to be mounted is cured through the curing device, the glue is optical glue, firm bonding of the lens to be mounted and the image sensor to be mounted can be guaranteed through the bonding effect of the glue, and compared with other bonding modes, the optical glue prevents light from being absorbed or shielded due to the fact that light penetrates through the two lenses. The curing specifically can be ultraviolet lamp irradiation curing, the irradiation direction of the ultraviolet lamp faces the butt joint face of the lens to be mounted and the image sensor to be mounted, the curing speed of the glue can be improved through the ultraviolet lamp, the assembly can be completed as soon as possible, and the assembly efficiency is improved.
Further, in an embodiment, in order to avoid that the relative pose of the lens to be mounted and the image sensor to be mounted is changed after the glue is cured or the imaging quality is not in accordance with the standard due to the influence of the glue, the imaging quality of the finished product can be measured in an orthographic projection mode after the lens to be mounted and the image sensor to be mounted are fixed, and rework or abandonment is performed when the imaging quality is not in accordance with the preset imaging quality standard so as to ensure that the imaging quality of the finished product is in accordance with the standard.
EXAMPLE five
The embodiment of the invention provides a camera module assembling device based on back projection MTF detection, which comprises:
the measuring module is used for measuring the focal plane and the position of the main focus of the lens to be mounted through the back projection MTF measuring device;
the acquisition module is used for acquiring an imaging surface of the image sensor to be mounted and the position of the central point of the imaging surface;
the adjusting module is used for adjusting the posture of the lens to be mounted and/or the image sensor to be mounted based on the positions of the focal plane and the main focus and the positions of the imaging plane and the central point, so that the lens to be mounted and the image sensor to be mounted are in a target relative pose, wherein the focal plane coincides with the imaging plane and the main focus coincides with the central point under the target relative pose;
and the fixing module is used for fixing the lens to be mounted and the image sensor to be mounted when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target.
Furthermore, the back projection MTF measuring device comprises a reticle mask arranged at an image surface position, and also comprises a plurality of photosensitive imaging devices or a photosensitive imaging device with an adjustable position, which are arranged at an object surface position;
the measurement module is further configured to:
when the lens to be mounted is placed between the reticle mask and the photosensitive imaging devices, the reticle mask is controlled to perform focus searching movement, and after the reticle mask moves once, an MTF value is respectively measured through the plurality of photosensitive imaging devices, or an MTF value is respectively measured through the photosensitive imaging devices with adjustable positions at a plurality of positions;
determining a peak value of a plurality of MTF values measured by each photosensitive imaging device in the focus searching movement, determining the position of a focus on the focus plane according to the position information corresponding to the photosensitive imaging device for measuring the peak value and the position information corresponding to the reticle mask when the peak value is measured, and fitting according to the positions of a plurality of focuses to obtain the position of the focus plane, wherein the focus corresponding to the on-axis photosensitive imaging device in the plurality of photosensitive imaging devices is a main focus; or the like, or, alternatively,
determining peak values of a plurality of MTF values measured by the photosensitive imaging device with the adjustable position at the same position in the focus searching movement, determining the position of a focus on the focal plane according to the position information corresponding to the photosensitive imaging device with the adjustable position when the peak values are measured and the position information corresponding to the reticle mask when the peak values are measured, and fitting according to the positions of a plurality of focuses to obtain the position of the focal plane, wherein the focus corresponding to the photosensitive imaging device with the adjustable position at the axial position is the main focus.
Furthermore, a plurality of photosensitive imaging devices are arranged at the position of the object plane at different azimuth angles, and the photosensitive imaging device at each azimuth angle corresponds to a reticle corresponding to the azimuth angle and the image height in the reticle mask;
the measurement module is further configured to:
calculating to obtain an X-axis coordinate value and a Y-axis coordinate value of a focus on the focal plane according to the azimuth angle of the photosensitive imaging device for measuring the peak value and the image height of the corresponding reticle;
and determining a Z-axis coordinate value of a focus on the focal plane according to the measured flange focal length corresponding to the position of the reticle mask at the peak time, wherein the position of the focus comprises an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value of the focus.
Further, the adjusting module is further configured to:
determining a first position error between the position of the focal plane and the position of the imaging plane, and determining a second position error between the position of the primary focus point and the position of the center point;
determining target control parameters corresponding to the first position error and the second position error according to a corresponding relation between a preset position error and control parameters of a six-axis clamping device;
and controlling the six-axis clamping device to adjust the posture according to the target control parameter so as to adjust the posture of the lens to be mounted clamped by the six-axis clamping device, so that the lens to be mounted and the image sensor to be mounted are in a target relative posture.
Further, the obtaining module is further configured to:
acquiring an image of an imaging surface of the image sensor to be installed through a visual positioning device;
performing image processing on the image of the imaging surface to calculate the position of the central point of the imaging surface;
measuring the height difference of a plurality of points on the imaging surface by a height measuring device;
and fitting according to the height difference of the plurality of points on the imaging surface to obtain the position of the imaging surface.
Further, the camera module assembling apparatus further includes:
the lighting module is used for lighting the image sensor to be mounted to obtain a test image through the lens to be mounted to take an image when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target and a standard test graphic card is arranged at the position of the object plane of the lens to be mounted;
the analysis module is used for obtaining the imaging quality by analyzing the test image;
the fixing module is further used for executing the operation of fixing the lens to be mounted and the image sensor to be mounted when the imaging quality meets a preset quality standard and the lens to be mounted and the image sensor to be mounted are in the relative target pose.
Further, the fixing module is further configured to:
and when the lens to be mounted and the image sensor to be mounted after dispensing are in the relative pose of the target, curing the glue through a curing device so as to fix the lens to be mounted and the image sensor to be mounted.
The specific implementation of the camera module assembling device according to the embodiment of the present invention is basically the same as that of the camera module assembling method according to the embodiments of the present invention, and further description thereof is omitted here
EXAMPLE six
The present embodiment provides a camera module assembling apparatus, which includes: the camera module assembling program is stored on the memory and can run on the processor, and when being executed by the processor, the camera module assembling program realizes the steps of the camera module assembling method in the first embodiment, the second embodiment, the third embodiment and/or the fourth embodiment.
The expanding content of the specific implementation of the camera module assembling equipment in the embodiment of the invention is basically the same as that of each embodiment of the camera module assembling method, and is not described herein again.
EXAMPLE seven
The present embodiment provides a computer-readable storage medium, which stores a camera module assembly program, and when the camera module assembly program is executed by a processor, the camera module assembly program implements the steps of the camera module assembly method according to the first, second, third and/or fourth embodiments.
The specific implementation of the computer-readable storage medium according to the embodiments of the present invention is basically the same as the embodiments of the camera module assembling method described above, and further description thereof is omitted here
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A camera module assembling method is characterized by comprising the following steps:
measuring the focal plane and the position of a main focus of the lens to be mounted through a back projection MTF measuring device;
acquiring an imaging surface of an image sensor to be installed and the position of the central point of the imaging surface;
based on the positions of the focal plane and the main focal point and the positions of the imaging plane and the central point, adjusting the posture of the lens to be mounted and/or the image sensor to be mounted so that the lens to be mounted and the image sensor to be mounted are in a target relative pose, wherein the focal plane coincides with the imaging plane and the main focal point coincides with the central point under the target relative pose;
and when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target, fixing the lens to be mounted and the image sensor to be mounted.
2. The method for assembling a camera module of claim 1, wherein the back-projection MTF measuring device comprises a reticle mask disposed at an image plane position, and further comprises a plurality of photosensitive imaging devices or a photosensitive imaging device with an adjustable position disposed at an object plane position;
the step of measuring the focal plane of the lens to be mounted and the position of the main focus by the back projection MTF measuring device comprises the following steps:
when the lens to be mounted is placed between the reticle mask and the photosensitive imaging devices, the reticle mask is controlled to perform focus searching movement, and after the reticle mask moves once, an MTF value is respectively measured through the plurality of photosensitive imaging devices, or an MTF value is respectively measured through the photosensitive imaging devices with adjustable positions at a plurality of positions;
determining a peak value of a plurality of MTF values measured by each photosensitive imaging device in the focus searching movement, determining the position of a focus on the focal plane according to the position information corresponding to the photosensitive imaging device for measuring the peak value and the position information corresponding to the reticle mask when the peak value is measured, and fitting according to the positions of a plurality of focuses to obtain the position of the focal plane, wherein the focus corresponding to the on-axis photosensitive imaging device in the photosensitive imaging devices is a main focus; or the like, or, alternatively,
determining peak values of a plurality of MTF values measured by the photosensitive imaging device with the adjustable position at the same position in the focus searching movement, determining the position of a focus on the focus plane according to the position information corresponding to the photosensitive imaging device with the adjustable position when the peak values are measured and the position information corresponding to the reticle mask when the peak values are measured, and fitting according to the positions of a plurality of focuses to obtain the position of the focus plane, wherein the focus corresponding to the photosensitive imaging device with the adjustable position at the axial position is a main focus.
3. The camera module assembly method of claim 2, wherein a plurality of photosensitive imaging devices are disposed at the object plane location at different azimuth angles, the photosensitive imaging device at each azimuth angle corresponding to a reticle at a corresponding azimuth angle and image height in the reticle mask;
the step of determining the position of a focal point on the focal plane according to the position information corresponding to the photosensitive imaging device for measuring the peak value and the position information corresponding to the reticle mask when the peak value is measured comprises the following steps:
calculating to obtain an X-axis coordinate value and a Y-axis coordinate value of a focus on the focal plane according to the azimuth angle of the photosensitive imaging device for measuring the peak value and the image height of the corresponding reticle;
and determining a Z-axis coordinate value of a focus on the focal plane according to the measured flange focal length corresponding to the position of the reticle mask at the peak time, wherein the position of the focus comprises an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value of the focus.
4. The camera module assembly method of claim 1, wherein the step of adjusting the pose of the lens to be mounted based on the positions of the focal plane and the principal focus and the positions of the imaging plane and the center point so that the lens to be mounted and the image sensor to be mounted are in a target relative pose comprises:
determining a first position error between the position of the focal plane and the position of the imaging plane, and determining a second position error between the position of the primary focus point and the position of the center point;
determining target control parameters corresponding to the first position error and the second position error according to a corresponding relation between a preset position error and control parameters of a six-axis clamping device;
and controlling the six-axis clamping device to adjust the posture according to the target control parameter so as to adjust the posture of the lens to be mounted clamped by the six-axis clamping device, so that the lens to be mounted and the image sensor to be mounted are in a target relative posture.
5. The camera module assembly method of claim 1, wherein the step of obtaining the positions of the imaging plane of the image sensor to be mounted and the center point of the imaging plane comprises:
acquiring an image of an imaging surface of the image sensor to be installed through a visual positioning device;
performing image processing on the image of the imaging surface to calculate the position of the central point of the imaging surface;
measuring the height difference of a plurality of points on the imaging surface through a height measuring device;
and fitting according to the height difference of the plurality of points on the imaging surface to obtain the position of the imaging surface.
6. The camera module assembly method of claim 1, wherein after the step of adjusting the pose of the lens to be mounted and/or the image sensor to be mounted based on the positions of the focal plane and the main focal point and the positions of the imaging plane and the central point so that the lens to be mounted and the image sensor to be mounted are in the target relative pose, the method further comprises:
when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target and a standard test graphic card is arranged at the object plane position of the lens to be mounted, the image sensor to be mounted is lightened to obtain a test image by drawing through the lens to be mounted;
obtaining imaging quality by analyzing the test image;
and when the imaging quality meets a preset quality standard, executing the step of fixing the lens to be mounted and the image sensor to be mounted when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target.
7. The camera module assembling method according to any one of claims 1 to 6, wherein the step of fixing the lens to be mounted and the image sensor to be mounted while the lens to be mounted and the image sensor to be mounted are in the target relative pose includes:
and when the lens to be mounted and the image sensor to be mounted after dispensing are in the relative pose of the target, curing the glue through a curing device so as to fix the lens to be mounted and the image sensor to be mounted.
8. A camera module assembling apparatus, characterized in that the camera module assembling apparatus comprises:
the measuring module is used for measuring the focal plane and the position of the main focus of the lens to be mounted through the back projection MTF measuring device;
the acquisition module is used for acquiring an imaging surface of the image sensor to be mounted and the position of the central point of the imaging surface;
the adjusting module is used for adjusting the posture of the lens to be mounted and/or the image sensor to be mounted based on the positions of the focal plane and the main focus and the positions of the imaging plane and the central point, so that the lens to be mounted and the image sensor to be mounted are in a target relative pose, wherein the focal plane coincides with the imaging plane and the main focus coincides with the central point under the target relative pose;
and the fixing module is used for fixing the lens to be mounted and the image sensor to be mounted when the lens to be mounted and the image sensor to be mounted are in the relative pose of the target.
9. A camera module assembling apparatus, characterized by comprising: memory, a processor and a camera module assembly program stored on the memory and executable on the processor, which when executed by the processor implements the steps of the camera module assembly method according to any one of claims 1 to 7.
10. A computer-readable storage medium, having stored thereon a camera module assembly program which, when executed by a processor, implements the steps of the camera module assembly method according to any one of claims 1 to 7.
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| CN116197652A (en) * | 2023-04-27 | 2023-06-02 | 江西联益光学有限公司 | Automatic assembling method, assembling machine and assembling system for split lens |
| CN117492162A (en) * | 2023-12-29 | 2024-02-02 | 江西联益光学有限公司 | Automatic assembling method and device for lens and chip |
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| CN116197652B (en) * | 2023-04-27 | 2023-09-01 | 江西联益光学有限公司 | Automatic assembling method, assembling machine and assembling system for split lens |
| CN117492162A (en) * | 2023-12-29 | 2024-02-02 | 江西联益光学有限公司 | Automatic assembling method and device for lens and chip |
| CN117492162B (en) * | 2023-12-29 | 2024-04-02 | 江西联益光学有限公司 | Automatic assembling method and device for lens and chip |
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