CN115083991B - High-power transient suppression diode suction means - Google Patents

High-power transient suppression diode suction means Download PDF

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Publication number
CN115083991B
CN115083991B CN202210995994.XA CN202210995994A CN115083991B CN 115083991 B CN115083991 B CN 115083991B CN 202210995994 A CN202210995994 A CN 202210995994A CN 115083991 B CN115083991 B CN 115083991B
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fixedly connected
supporting
suction
diode
plate
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CN115083991A (en
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吴海英
章珂
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Shenzhen Hongyang Sizhou Technology Co ltd
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Shenzhen Hongyang Sizhou Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a high-power transient suppression diode suction device, which specifically comprises: the supporting seat is provided with a plane supporting structure and a supporting frame arranged on one side of the top of the supporting seat, one side of the top of the supporting frame is fixedly connected with a moving track, a moving slide block is connected onto the moving track in a sliding mode, and the bottom of the moving slide block is fixedly connected with a suction device; the invention relates to a diode supporting device, which comprises a supporting plate and a positioning plate, wherein the supporting plate is provided with a plate-shaped structure, the positioning plate is arranged at the top of the supporting plate, the supporting plate is provided with two groups of supporting plates, the two groups of supporting plates are respectively and fixedly connected with the bottoms of the two ends of the positioning plate, the bottom of the supporting plate is fixedly connected with the top of a supporting seat, and the part below the positioning plate at the top of the supporting seat is fixedly connected with an extrusion device. This high-power transient suppression diode suction means conveniently treats and carries out the fixed stay to the diode of processing, and the convenient not equidimension diode that adapts to uses, and the practicality is better.

Description

High-power transient suppression diode suction means
Technical Field
The invention relates to the technical field of diode production, in particular to a high-power transient suppression diode suction device.
Background
The transient voltage suppressor diode is called TVS for short, and is a high-efficiency protective device in the form of diode, when two poles of TVS diode are impacted by reverse transient high energy, it can change the high impedance between two poles into low impedance at the speed of minus 12 times of second magnitude of 10, and can absorb the surge power up to several thousands of watts, so that the voltage clamp between two poles can be positioned at a preset value, and can effectively protect the precision components in electronic circuit from being damaged by various surge pulses. At present, the diode is moved in-process is usually that artifical manual moves, and manual operation efficiency is lower, and the diode position is unfixed when absorbing, needs the manual work to put the position, and it is inconvenient to use to the risk is great, causes the incident easily.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a high-power transient suppression diode suction device, which solves the problems that the diode is usually manually moved in the moving process at present, the manual operation efficiency is low, the position of the diode is not fixed during suction, the position needs to be adjusted manually, the use is inconvenient, the risk is high, and safety accidents are easily caused.
In order to realize the purpose, the invention is realized by the following technical scheme: a high-power transient suppression diode suction device specifically comprises:
the supporting seat is provided with a plane supporting structure and a supporting frame arranged on one side of the top of the supporting seat, one side of the top of the supporting frame is fixedly connected with a moving track, a moving slide block is connected onto the moving track in a sliding mode, and the bottom of the moving slide block is fixedly connected with a suction device;
the supporting plate is provided with a plate-shaped structure and two groups of positioning plates arranged at the top of the supporting plate, the two groups of supporting plates are respectively and fixedly connected with the bottoms of the two ends of the positioning plates, the bottom of the supporting plate is fixedly connected with the top of the supporting seat, and the part below the positioning plate at the top of the supporting seat is fixedly connected with an extrusion device;
the pressing device includes:
the fixed slideway is provided with a vertical slideway structure and a top block arranged on the inner wall of the fixed slideway, the top block is connected with the inner wall of the fixed slideway in a sliding way, and the top of the top block is provided with an arc-shaped groove;
the limiting plate is provided with a plate-shaped structure, the extrusion spring is arranged at the bottom of the limiting plate, a threaded rod is arranged in the extrusion spring, the top of the threaded rod penetrates through the limiting plate and is in threaded connection with the limiting plate, and one side of the limiting plate is fixedly connected with the side face of the top block;
the locating plate comprises an inclined part and an arc-shaped part, sliding holes which are mutually communicated are formed in the inclined part and the arc-shaped part, and the inner wall of each sliding hole is connected with a diode to be processed in a sliding mode.
Will wait to process the diode during use and put into from the locating plate tip, it is inside to wait that the processing diode slides on the rake and gets into arc portion, slide to arc portion bottom central point under the action of gravity and put, it is inside when getting into arc portion to wait to process the diode, remove to the top of kicking block simultaneously, because the arc recess has been seted up at the kicking block top, the radian of arc recess is bigger than the radian of arc portion, consequently, it slides to the bottom when waiting to process the diode in arc portion inside, be close the arc recess at kicking block top gradually, when waiting to process the diode and slide to arc portion bottom central point and put, bottom and the contact of arc recess inner wall, can treat through the kicking block and process the diode and support, cooperate the spacing of arc portion simultaneously, make things convenient for suction means to treat to process the diode and absorb.
Preferably, the bottom of the fixed slideway is fixedly connected with the top of the supporting seat, and the top of the ejector block is over against the center of the arc-shaped part.
Preferably, extrusion spring bottom and supporting seat top fixed connection, the threaded rod bottom runs through the supporting seat and rotates through bearing and supporting seat to be connected, is provided with fixed slide and limiting plate, and when the diameter of waiting to process the diode changes, rotatable threaded rod because threaded rod and limiting plate threaded connection rotate simultaneously with the supporting seat to be connected, therefore the threaded rod can drive the limiting plate and remove when rotating, and the limiting plate drives the kicking block and removes, can change the distance between kicking block and the arc, conveniently adapts to not diode use of equidimension, and the practicality is better.
Preferably, suction means includes the control block, the triangular groove has been seted up to the control block bottom, triangular groove inner wall top runs through and fixedly connected with vacuum trachea, vacuum trachea bottom fixedly connected with suction nozzle device, control block top fixedly connected with electric telescopic handle is provided with suction means, when treating that the processing diode removes to the bottom of arc portion, electric telescopic handle drives the control block and descends, the triangular groove of control block below promptly pushes down, because the width of control block and the width looks adaptation of slide opening, the triangular groove is at the in-process of pushing down, bottom one side is earlier with treating processing diode contact, the slope inner wall through the triangular groove promotes the diode that waits to process and removes, along with the pushing down of triangular groove, the slope inner wall promotes the diode that waits to process to the suction nozzle device below gradually, can treat processing diode through the suction nozzle device and absorb, conveniently can treat processing diode's position through the triangular groove when the suction nozzle device pushes down and adjust, avoid artifical manual regulation, high durability and convenient use, and safety and reliability.
Preferably, the top of the electric telescopic rod is fixedly connected with the bottom of the movable sliding block, and one end, far away from the suction nozzle device, of the vacuum air pipe is communicated with an external vacuum air pump.
Preferably, the suction nozzle device comprises a fixed air disc, two sides of the fixed air disc are communicated with a cylindrical shell, through holes are formed in two sides of the cylindrical shell, the inner wall of the cylindrical shell is rotatably connected with a communicating sleeve through a rotating bolt, a gas port is formed in one side of the communicating sleeve, one side, away from the gas port, of the communicating sleeve is communicated with an arc-shaped pipe, one side, away from the communicating sleeve, of the arc-shaped pipe is communicated with a suction cylinder, one side of the suction cylinder is provided with a first suction port, the bottom of the fixed air disc is provided with a second suction port, the suction nozzle device is driven by a control block to descend, when the second suction port in the suction nozzle device is in contact with the upper surface of a diode to be processed, the arc-shaped pipes on two sides of the fixed air disc drive the first suction ports in the suction cylinder to be attached to the side surface of the diode to be processed, an external vacuum air pump vacuumizes the inside of the fixed air disc through a vacuum air pipe, namely, the diode to be processed can be adsorbed through the first suction ports and the second suction ports, when the diameter of the diode to be processed is changed, the communicating sleeve can be rotated, the communicating sleeve drives the arc-shaped pipe and the suction cylinder to be rotated, so that the diameter of the diode to be processed can be conveniently adjusted freely and the diode to be processed, and the diode to be processed can be adapted.
Preferably, the top of the fixed air disc is communicated with the bottom of the vacuum air pipe, and a sealing gasket is arranged between the inner wall of the cylindrical shell and the communicating sleeve.
Preferably, sealing gaskets are arranged on the first suction port and the second suction port.
The invention provides a high-power transient suppression diode suction device. The method has the following beneficial effects:
1. this a high-power transient suppression diode suction means, will wait to process the diode and put into from the locating plate tip during use, it is inside to wait to process the diode and slide on the rake and get into arc portion, slide to arc portion bottom central point under the action of gravity and put, wait to process the diode when getting into arc portion inside, move to the top of kicking block simultaneously, because the arc recess has been seted up at the kicking block top, the radian of arc recess is bigger than the radian of arc portion, consequently, it slides to the bottom when waiting to process the diode in arc portion inside, be close to the arc recess at kicking block top gradually, when waiting to process the diode and slide to arc portion bottom central point, bottom and the contact of arc recess inner wall, can treat through the kicking block and process the diode and support, cooperate the spacing of arc portion simultaneously, make things convenient for suction means to treat and process the diode and absorb.
2. This high-power transient suppression diode suction means is provided with fixed slide and limiting plate, and when waiting to process the diameter of diode and change, rotatable threaded rod because threaded rod and limiting plate threaded connection rotate simultaneously with the supporting seat and be connected, so the threaded rod can drive the limiting plate and remove when rotating, and the limiting plate drives the kicking block and removes, can change the distance between kicking block and the arc, conveniently adapts to not diode use of equidimension, and the practicality is better.
3. This a high-power transient state restraines diode suction means, be provided with suction means, when treating that processing diode removes the bottom to arc portion, electric telescopic handle drives the control block and descends, the triangular groove of control block below is promptly pressed down, because the width of control block and the width looks adaptation of slide opening, the triangular groove is at the in-process that pushes down, bottom one side contacts with treating processing diode earlier, the slope inner wall through the triangular groove promotes to treat that processing diode removes, along with the pushing down of triangular groove, the slope inner wall promotes treating processing diode to suction nozzle device below gradually, can treat processing diode through suction nozzle device and absorb, the position of treating processing diode through the triangular groove can be adjusted when convenient suction nozzle device pushes down, avoid artifical manual regulation, high durability and convenient use, and safe and reliable.
4. The utility model provides a high-power transient suppression diode suction means, be provided with the suction nozzle device, the suction nozzle device descends under the drive of control block, when the inside second of suction nozzle device absorbs the mouth and contacts the upper surface of waiting to process the diode, the arc pipe of fixed gas dish both sides drives the first mouth of absorbing on the section of thick bamboo and pastes and treat the processing diode side, outside vacuum air pump carries out the evacuation to fixed gas dish inside through the vacuum trachea, can absorb the mouth through first mouth and the second and adsorb the diode of waiting to process, when the diameter of waiting to process the diode changes, rotatable intercommunication sleeve, the intercommunication sleeve drives the arc pipe and absorbs a section of thick bamboo rotation, the convenience is adjusted freely according to the diameter of waiting to process the diode, adaptability is better.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the extruding apparatus and the positioning plate according to the present invention;
FIG. 3 is a schematic view of an exploded structure of the extrusion apparatus of the present invention;
FIG. 4 is a schematic view of the sucking device according to the present invention;
FIG. 5 is a schematic view of a nozzle assembly according to the present invention;
fig. 6 is a schematic cross-sectional view of a nozzle assembly according to the present invention.
In the figure: 1. a supporting seat; 2. a support frame; 3. a moving track; 4. moving the slide block; 5. a suction device; 51. a control block; 52. a triangular groove; 53. a vacuum gas pipe; 54. a suction nozzle device; 541. fixing the air disc; 542. a cylindrical housing; 543. a through hole; 544. a communicating sleeve; 545. a gas port; 546. an arc-shaped tube; 547. a suction cylinder; 548. a first suction port; 549. a second suction port; 55. an electric telescopic rod; 6. a support plate; 7. positioning a plate; 71. an inclined portion; 72. an arc-shaped portion; 73. a slide hole; 74. a diode to be processed; 8. an extrusion device; 81. fixing the slideway; 82. a top block; 83. an arc-shaped groove; 84. a limiting plate; 85. a compression spring; 86. a threaded rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-3, the present invention provides a technical solution: a high-power transient suppression diode suction device specifically comprises:
the supporting seat comprises a supporting seat 1, wherein the supporting seat 1 is provided with a plane supporting structure and a supporting frame 2 arranged on one side of the top of the supporting seat 1, one side of the top of the supporting frame 2 is fixedly connected with a moving track 3, the moving track 3 is connected with a moving slide block 4 in a sliding manner, and the bottom of the moving slide block 4 is fixedly connected with a suction device 5;
the supporting plate 6 is provided with a plate-shaped structure, the positioning plates 7 are arranged at the tops of the supporting plates 6, two groups of supporting plates 6 are arranged and are respectively fixedly connected with the bottoms of the two ends of each positioning plate 7, the bottom of each supporting plate 6 is fixedly connected with the top of the supporting seat 1, and the part of the top of the supporting seat 1 below the positioning plate 7 is fixedly connected with the extrusion device 8;
the pressing device 8 includes:
the fixed slideway 81 is provided with a vertical slideway structure, the top block 82 is arranged on the inner wall of the fixed slideway 81, the top block 82 is connected with the inner wall of the fixed slideway 81 in a sliding way, and the top of the top block 82 is provided with an arc-shaped groove 83;
the limiting plate 84 is of a plate-shaped structure, the extrusion spring 85 is arranged at the bottom of the limiting plate 84, a threaded rod 86 is arranged inside the extrusion spring 85, the top of the threaded rod 86 penetrates through the limiting plate 84 and is in threaded connection with the limiting plate 84, and one side of the limiting plate 84 is fixedly connected with the side face of the top block 82;
the positioning plate 7 includes an inclined portion 71 and an arc portion 72, the inclined portion 71 and the arc portion 72 are both provided with mutually communicated slide holes 73, and the inner wall of the slide hole 73 is slidably connected with a diode 74 to be processed.
The bottom of the fixed slide way 81 is fixedly connected with the top of the supporting seat 1, and the top of the top block 82 is opposite to the center of the arc-shaped part 72.
The bottom of the extrusion spring 85 is fixedly connected with the top of the supporting seat 1, and the bottom of the threaded rod 86 penetrates through the supporting seat 1 and is rotatably connected with the supporting seat 1 through a bearing.
When the diode 74 to be processed is put into the diode processing device from the end part of the positioning plate 7, the diode 74 to be processed slides on the inclined part 71 and enters the arc-shaped part 72, slides to the central position of the bottom of the arc-shaped part 72 under the action of gravity, when the diode 74 to be processed enters the arc-shaped part 72, and simultaneously moves to the top of the top block 82, because the arc-shaped groove 83 is formed in the top of the top block 82, the radian of the arc-shaped groove 83 is larger than that of the arc-shaped part 72, therefore, the diode 74 to be processed slides to the bottom in the arc-shaped part 72, and gradually approaches the arc-shaped groove 83 at the top of the top block 82, when the diode 74 to be processed slides to the central position of the bottom of the arc-shaped part 72, the bottom contacts with the inner wall of the arc-shaped groove 83, the diode 74 to be processed can be supported through the top block 82, and is matched with the limit of the arc-shaped part 72, the diode 74 to be processed is convenient to be sucked by the sucking device, a fixed slide way 81 and a limiting plate 84 are arranged, when the diameter of the diode 74 to be processed changes, the rotatable plate 86 is connected with the limiting plate 84 in a threaded rod 86, and is connected with the positioning plate 82 in a rotary mode, so that the supporting seat is convenient to be moved, and the diode 82, and the supporting seat 82 can be used.
Example two:
referring to fig. 1-4, the present invention provides a technical solution based on the first embodiment: the suction device 5 comprises a control block 51, a triangular groove 52 is formed in the bottom of the control block 51, a vacuum air pipe 53 penetrates through the top of the inner wall of the triangular groove 52 and is fixedly connected with the top of the inner wall of the triangular groove, a suction nozzle device 54 is fixedly connected with the bottom of the vacuum air pipe 53, an electric telescopic rod 55 is fixedly connected with the top of the control block 51, the top of the electric telescopic rod 55 is fixedly connected with the bottom of the movable sliding block 4, one end, far away from the suction nozzle device 54, of the vacuum air pipe 53 is communicated with an external vacuum air pump, the suction device 5 is arranged, when the diode 74 to be processed moves to the bottom of the arc-shaped portion 72, the electric telescopic rod 55 drives the control block 51 to descend, the triangular groove 52 below the control block 51 is tightly clamped and pressed down, as the width of the control block 51 is matched with the width of the sliding hole 73, the diode 74 to be processed can be sucked through the suction nozzle device 54 in the pressing down process, the diode 74 to be processed can be conveniently adjusted through the triangular groove 52 while the diode 74 to be processed is pressed down through the suction nozzle device 54, manual and reliable adjustment can be avoided, and the manual adjustment is convenient and reliable to use.
Example three:
referring to fig. 1-6, the present invention provides a technical solution based on the first embodiment and the second embodiment: the suction nozzle device 54 comprises a fixed air disc 541, two sides of the fixed air disc 541 are both communicated with a cylindrical casing 542, two sides of the cylindrical casing 542 are both provided with through holes 543, the inner wall of the cylindrical casing 542 is rotatably connected with a communicating sleeve 544 through a rotating bolt, one side of the communicating sleeve 544 is provided with an air port 545, one side of the communicating sleeve 544, which is far away from the air port 545, is communicated with an arc pipe 546, one side of the arc pipe 546, which is far away from the communicating sleeve 544, is communicated with a suction barrel 547, one side of the suction barrel 547 is provided with a first suction port 548, the bottom of the fixed air disc 541 is provided with a second suction port 549, the top of the fixed air disc 541 is communicated with the bottom of the vacuum air pipe 53, a sealing gasket is arranged between the inner wall of the cylindrical casing 542 and the communicating sleeve 544, and sealing gaskets are arranged on the first suction port 548 and the second suction port 549, the suction nozzle device 54 is arranged, the suction nozzle device 54 is driven to descend by the control block 51, when a second suction opening 549 in the suction nozzle device 54 is in contact with the upper surface of the diode 74 to be processed, the arc-shaped tubes 546 at two sides of the fixed air disc 541 drive the first suction opening 548 on the suction cylinder 547 to be attached to the side surface of the diode 74 to be processed, the external vacuum air pump vacuumizes the inside of the fixed air disc 541 through the vacuum air pipe 53, namely, the diode 74 to be processed can be sucked through the first suction opening 548 and the second suction opening 549, when the diameter of the diode 74 to be processed is changed, the communication sleeve 544 can be rotated, the communication sleeve 544 drives the arc-shaped tubes 546 and the suction cylinder 547 to rotate, the diameter of the diode 74 to be processed can be freely adjusted conveniently, and the adaptability is good.
It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by one of ordinary skill in the art and related arts based on the embodiments of the present invention without any creative effort, shall fall within the protection scope of the present invention. Structures, devices, and methods of operation not specifically described or illustrated herein are generally practiced in the art without specific recitation or limitation.

Claims (8)

1. A high-power transient suppression diode suction device specifically comprises:
the supporting device comprises a supporting seat (1), wherein the supporting seat (1) is provided with a plane supporting structure and a supporting frame (2) arranged on one side of the top of the supporting seat (1), one side of the top of the supporting frame (2) is fixedly connected with a moving track (3), a moving sliding block (4) is connected on the moving track (3) in a sliding manner, and the bottom of the moving sliding block (4) is fixedly connected with a suction device (5);
the supporting plate (6) is provided with a plate-shaped structure, and positioning plates (7) are arranged at the top of the supporting plate (6), two groups of supporting plates (6) are arranged and are respectively fixedly connected with the bottoms of two ends of each positioning plate (7), the bottom of each supporting plate (6) is fixedly connected with the top of the supporting seat (1), and a part below the positioning plate (7) at the top of the supporting seat (1) is fixedly connected with an extrusion device (8);
the high-power transient suppression diode suction device is characterized in that: the pressing device (8) comprises:
the fixed slideway (81), the fixed slideway (81) has a vertical slideway structure, and a top block (82) arranged on the inner wall of the fixed slideway (81), the top block (82) is connected with the inner wall of the fixed slideway (81) in a sliding way, and the top of the top block (82) is provided with an arc-shaped groove (83);
the limiting plate (84) is of a plate-shaped structure, the extrusion spring (85) is arranged at the bottom of the limiting plate (84), a threaded rod (86) is arranged inside the extrusion spring (85), the top of the threaded rod (86) penetrates through the limiting plate (84) and is in threaded connection with the limiting plate (84), and one side of the limiting plate (84) is fixedly connected with the side face of the top block (82);
the positioning plate (7) comprises an inclined part (71) and an arc-shaped part (72), sliding holes (73) which are communicated with each other are formed in the inclined part (71) and the arc-shaped part (72), and the inner wall of each sliding hole (73) is connected with a diode (74) to be processed in a sliding mode.
2. The high power transient suppression diode extraction device of claim 1, wherein: the bottom of the fixed slide way (81) is fixedly connected with the top of the supporting seat (1), and the top of the ejector block (82) is just opposite to the center of the arc-shaped part (72).
3. The high power transient suppression diode extraction device of claim 1, wherein: the bottom of the extrusion spring (85) is fixedly connected with the top of the supporting seat (1), and the bottom of the threaded rod (86) penetrates through the supporting seat (1) and is rotatably connected with the supporting seat (1) through a bearing.
4. The high power transient suppression diode extraction device of claim 1, wherein: the suction device (5) comprises a control block (51), a triangular groove (52) is formed in the bottom of the control block (51), a vacuum air pipe (53) penetrates through and is fixedly connected to the top of the inner wall of the triangular groove (52), a suction nozzle device (54) is fixedly connected to the bottom of the vacuum air pipe (53), and an electric telescopic rod (55) is fixedly connected to the top of the control block (51).
5. The high power transient suppression diode extraction device of claim 4, wherein: the top of the electric telescopic rod (55) is fixedly connected with the bottom of the movable sliding block (4), and one end, far away from the suction nozzle device (54), of the vacuum air pipe (53) is communicated with an external vacuum air pump.
6. The high power transient suppression diode extraction device of claim 4, wherein: the suction nozzle device (54) comprises a fixed air disc (541), two sides of the fixed air disc (541) are communicated with a cylindrical shell (542), two sides of the cylindrical shell (542) are provided with through holes (543), the inner wall of the cylindrical shell (542) is connected with a communicating sleeve (544) through a rotating bolt in a rotating mode, one side of the communicating sleeve (544) is provided with an air port (545), one side of the communicating sleeve (544), far away from the air port (545), is communicated with an arc-shaped pipe (546), far away from the communicating sleeve (544), of the arc-shaped pipe (546) is communicated with a suction barrel (547), one side of the suction barrel (547) is provided with a first suction port (548), and the bottom of the fixed air disc (541) is provided with a second suction port (549).
7. The high power transient suppression diode extraction device of claim 6, wherein: the top of the fixed air disc (541) is communicated with the bottom of the vacuum air pipe (53), and a sealing gasket is arranged between the inner wall of the cylindrical shell (542) and the communication sleeve (544).
8. The high power transient suppression diode extraction device of claim 6, wherein: and sealing gaskets are arranged on the first suction port (548) and the second suction port (549).
CN202210995994.XA 2022-08-19 2022-08-19 High-power transient suppression diode suction means Active CN115083991B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100011098A (en) * 2008-07-24 2010-02-03 세크론 주식회사 Apparatus for picking up a semiconductor device
KR20140101566A (en) * 2013-02-12 2014-08-20 김시정 A pick up apparatus used in a mounting system of a release mounter
CN110085540A (en) * 2019-04-29 2019-08-02 深圳市安思科电子科技有限公司 A kind of chip picking-up apparatus of the strong adsorption force of accurate positioning
CN212810262U (en) * 2020-10-10 2021-03-26 无锡国电资通科技有限公司 High-power transient suppression diode suction means

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4927979B2 (en) * 2010-09-28 2012-05-09 株式会社新川 Semiconductor die pick-up device and semiconductor die pick-up method using the device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100011098A (en) * 2008-07-24 2010-02-03 세크론 주식회사 Apparatus for picking up a semiconductor device
KR20140101566A (en) * 2013-02-12 2014-08-20 김시정 A pick up apparatus used in a mounting system of a release mounter
CN110085540A (en) * 2019-04-29 2019-08-02 深圳市安思科电子科技有限公司 A kind of chip picking-up apparatus of the strong adsorption force of accurate positioning
CN212810262U (en) * 2020-10-10 2021-03-26 无锡国电资通科技有限公司 High-power transient suppression diode suction means

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