CN115083954A - Substrate processing apparatus and supply valve - Google Patents

Substrate processing apparatus and supply valve Download PDF

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Publication number
CN115083954A
CN115083954A CN202210223005.5A CN202210223005A CN115083954A CN 115083954 A CN115083954 A CN 115083954A CN 202210223005 A CN202210223005 A CN 202210223005A CN 115083954 A CN115083954 A CN 115083954A
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liquid
flow path
valve
pump
open
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CN202210223005.5A
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Chinese (zh)
Inventor
柏山真人
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1026—Valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/02—Construction of housing; Use of materials therefor of lift valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/04—Actuating devices; Operating means; Releasing devices electric; magnetic using a motor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/08—Pipe-line systems for liquids or viscous products
    • F17D1/14—Conveying liquids or viscous products by pumping
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D3/00—Arrangements for supervising or controlling working operations
    • F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Water Supply & Treatment (AREA)
  • Coating Apparatus (AREA)
  • Details Of Valves (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Fluid-Driven Valves (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Threshing Machine Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention relates to a substrate processing apparatus and a supply valve. The supply valve (21) has a structure (a switch valve chamber (65), a valve seat (71), a diaphragm (73), and a switch drive unit (75)) that functions as a switch valve (55). An exhaust passage (103) for discharging bubbles in the switch valve chamber (65) is connected to the switch valve chamber (65). Thus, even if air bubbles are generated when the open-close valve (55) is opened and closed, the air bubbles in the open-close valve chamber (65) can be discharged through the exhaust passage (103). Therefore, it is possible to prevent product defects caused by bubbles being supplied to the substrate or the like.

Description

Substrate processing apparatus and supply valve
Technical Field
The present invention relates to a substrate processing apparatus for processing a substrate and a supply valve provided in the substrate processing apparatus. Examples of the substrate include a semiconductor substrate, a substrate for FPD (Flat Panel Display), a glass substrate for photomask, a substrate for optical disc, a substrate for magnetic disk, a ceramic substrate, and a substrate for solar cell. Examples of the FPD include a liquid crystal display device and an organic EL (electroluminescence) display device.
Background
Conventionally, a substrate processing apparatus includes a nozzle, a pipe, and a processing liquid supply source. The nozzle ejects, for example, a resist solution as a processing liquid onto the substrate. The pipe connects the nozzle and the processing liquid supply source. A pump and an on-off valve are provided in this order from the upstream to the downstream of the nozzle in the pipe. By keeping the on-off valve in an open state, the resist liquid is delivered through the pipe by a pump, and the resist liquid is discharged from the nozzle (see, for example, patent documents 1 and 2).
Patent document 1 discloses that a collection tank is provided in a pipe between a buffer tank and a nozzle. The treatment liquid in the buffer tank is supplied to the collection tank by pressurizing the buffer tank. Further, the treatment liquid in the collection tank is supplied to the nozzle by pressurizing the collection tank.
Patent document 2 discloses a distribution mechanism for distributing and supplying a processing liquid to a plurality of coating modules stacked in multiple stages. The distribution mechanism includes a processing liquid supply source, a pressurizing device, and a plurality of distribution units corresponding to the plurality of coating modules. Each of the plurality of dispensing units includes a pump and a nozzle. The nozzles eject the processing liquid from the corresponding coating modules. The pump is disposed on the side (obliquely downward) of the corresponding coating module. The pump stores the processing liquid supplied from the processing liquid supply source by the pressurizing device.
[ background Art document ]
[ patent document ]
[ patent document 1]
Japanese patent laid-open No. 2000-173902
[ patent document 2]
Japanese patent laid-open No. 2007-005576
Disclosure of Invention
[ problems to be solved by the invention ]
However, the conventional substrate processing apparatus has the following problems. The on-off valve sometimes generates bubbles in the processing liquid (e.g., resist liquid) when opened and closed. The generated bubbles remain in the on-off valve chamber and grow to a certain size. There are also concerns that: bubbles growing to a certain size are delivered to the nozzle when the on-off valve is in an open state, and the bubbles are supplied from the nozzle to the substrate together with the processing liquid. In addition, bubbles may be a source of particles. These conditions may cause product defects.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate processing apparatus and a supply valve capable of removing bubbles generated by opening and closing the valve.
[ means for solving problems ]
The present invention is configured as follows in order to achieve the above object. That is, the substrate processing apparatus of the present invention is characterized by comprising: a nozzle for ejecting a treatment liquid to the substrate; a supply valve for supplying the treatment liquid to the nozzle; and a nozzle-side pipe connecting the nozzle to an outlet of the supply valve; and the supply valve includes: a flow path block; a switching valve chamber formed in the flow path block; an inlet-side flow path formed in the flow path block and configured to allow a liquid to flow between an inlet and the open/close valve chamber; an outlet side flow path formed in the flow path block and configured to allow a liquid to flow between the open/close valve chamber and the outlet; an on-off valve body disposed in the on-off valve chamber; a valve seat provided at a boundary between the open/close valve chamber and the outlet side flow passage, and configured to support the open/close valve body in the open/close valve chamber; a switch driving unit that stops the flow of the treatment liquid from the switch valve chamber to the outlet side flow path by pressing the switch valve body against the valve seat, and causes the treatment liquid to flow from the switch valve chamber to the outlet side flow path by separating the pressed switch valve body from the valve seat; and an exhaust passage formed in the passage block and connected to the open/close valve chamber to discharge bubbles in the open/close valve chamber.
According to the substrate processing apparatus of the present invention, the supply valve includes the on-off valve (the on-off valve chamber, the valve seat, the on-off valve body, and the on-off driving unit). An exhaust passage for discharging bubbles in the open/close valve chamber is connected to the open/close valve chamber. Thus, even if bubbles are generated when the open-close valve is opened and closed, the bubbles in the open-close valve chamber can be discharged through the exhaust passage. That is, bubbles generated by opening and closing the valve can be removed. Therefore, it is possible to prevent product defects caused by bubbles being supplied to the substrate or the like.
In the substrate processing apparatus, it is preferable that the exhaust gas flow path extends downward and is connected to the open/close valve chamber. Since the exhaust flow path extends in the direction in which the bubbles move due to buoyancy, the bubbles in the on-off valve chamber can be easily removed.
In the substrate processing apparatus, it is preferable that the inlet side flow path has a common flow path extending in a downward direction and connected to the open/close valve chamber, and the exhaust flow path is connected to the open/close valve chamber through the common flow path and discharges bubbles in the open/close valve chamber. The exhaust gas flow path is connected to the open/close valve chamber via a common flow path connected to the inlet side flow path. Therefore, the flow path block can be formed small. In addition, since the common flow path extends downward, the exhaust flow path and the common flow path each extend downward. Therefore, bubbles in the on-off valve chamber can be removed more easily.
In the substrate processing apparatus, it is preferable that a ceiling surface of the open/close valve chamber has an inclined surface to guide bubbles to the exhaust gas flow path. The inclined surface can easily cause the air bubbles to accumulate in the exhaust gas flow path without remaining in the open-close valve chamber.
In the substrate processing apparatus, it is preferable that the supply valve further includes: a1 st pump chamber formed in the inlet-side flow path of the flow path block and accommodating a processing liquid; a volume changing member for changing a volume in the 1 st pump chamber; and a pump driving unit that drives the volume changing member to perform a pump operation.
Thus, the supply valve includes the pump (the 1 st pump chamber, the volume changing member, and the pump driving unit). The pump is arranged in a flow path block provided with an on-off valve. Therefore, the distance between the pump and the on-off valve becomes short. Therefore, the pressure loss due to the flow path length between the pump and the on-off valve can be suppressed to be small, and the pressure loss due to the difference in level between the pump and the on-off valve can be suppressed to be small. In addition, when the substrate processing apparatus includes a plurality of supply valves, the distance and the level difference between the pump and the on-off valve are invariably fixed. Therefore, the pressure loss due to the flow path length can be easily equalized between the plurality of supply valves.
In the substrate processing apparatus, it is preferable that the supply valve is disposed in a liquid processing unit together with the nozzle and the nozzle-side pipe. The pump (the 1 st pump chamber, the volume changing member, and the pump driving unit) of the supply valve can be brought closer to the nozzle. The pressure loss due to the flow path from the pump of the supply valve to the nozzle and the length of the piping can be suppressed to be smaller.
In addition, the substrate processing apparatus preferably further includes: a plurality of liquid processing units arranged in an up-down direction, each processing a substrate; and an upstream pump for delivering the treatment liquid to each of the plurality of liquid treatment units; and the plurality of liquid processing units each include the nozzle, the supply valve, and the nozzle-side pipe, the supply valve includes a1 st pressure sensor, the 1 st pressure sensor is provided so as to be in contact with the 1 st pump chamber, and measures a pressure of the processing liquid in the 1 st pump chamber, and the upstream pump includes: a2 nd pump chamber for containing a processing liquid; and a2 nd pressure sensor provided in contact with the 2 nd pump chamber, for measuring a pressure of the processing liquid in the 2 nd pump chamber; and the upstream pump adjusts a2 nd pressure value measured by the 2 nd pressure sensor in cooperation with the pump driving unit of the supply valve of the liquid processing unit to which the processing liquid is supplied, so that the 1 st pressure value measured by the 1 st pressure sensor of the liquid processing unit to which the processing liquid is supplied becomes a preset pressure value, when the processing liquid is selectively supplied to any one of the plurality of liquid processing units.
The difference in height between the upstream pump and each liquid processing unit causes unevenness in the state (ejection pressure, ejection rate, ejection flow rate, etc.) of the processing liquid ejected from the nozzles. Therefore, the supply valve of each liquid processing unit includes a pump (the 1 st pump chamber, the volume changing member, the pump driving unit, and the like). This makes it possible to match the discharge states of the liquid processing units. In addition, if the pressures of the processing liquids delivered to the pumps of the respective supply valves are not uniform, the load of pressure adjustment in the pumps of the respective supply valves increases. In this respect, the present invention can equalize the pressures of the processing liquids sent to the pumps of the respective supply valves. Therefore, the load of pressure adjustment in the pump of each supply valve can be reduced.
Further, the supply valve of the present invention is characterized by comprising: a flow path block; a switching valve chamber formed in the flow path block; an inlet-side flow path formed in the flow path block and configured to allow a liquid to flow between an inlet and the open/close valve chamber; an outlet side flow path formed in the flow path block and configured to allow a liquid to flow between the open/close valve chamber and an outlet; an on-off valve body disposed in the on-off valve chamber; a valve seat provided at a boundary between the open/close valve chamber and the outlet side flow passage, and configured to support the open/close valve body in the open/close valve chamber; a switch driving unit that stops a flow of the liquid from the switch valve chamber to the outlet side flow path by pressing the switch valve body against the valve seat, and causes the liquid to flow from the switch valve chamber to the outlet side flow path by separating the pressed switch valve body from the valve seat; and an exhaust passage formed in the passage block and connected to the open/close valve chamber to discharge bubbles in the open/close valve chamber.
The supply valve of the present invention includes an on-off valve (an on-off valve chamber, a valve seat, an on-off valve body, and an on-off drive unit). An exhaust passage for discharging bubbles in the open/close valve chamber is connected to the open/close valve chamber. Thus, even if bubbles are generated when the open-close valve is opened and closed, the bubbles in the open-close valve chamber can be discharged through the exhaust passage. That is, bubbles generated by opening and closing the valve can be removed. Therefore, it is possible to prevent product defects caused by bubbles being supplied to the substrate or the like.
Further, the present specification also discloses an invention of the following substrate processing apparatus.
(1) The substrate processing apparatus of the present invention is characterized by comprising: a plurality of liquid processing units arranged in an up-down direction, each processing a substrate; and an upstream pump for delivering the treatment liquid to each of the plurality of liquid treatment units; and the plurality of liquid treatment units each include: a nozzle for ejecting a treatment liquid to the substrate; a supply valve for supplying the treatment liquid to the nozzle; and a nozzle-side pipe connecting the nozzle to an outlet of the supply valve; and the supply valve further includes: a1 st pump chamber for containing a processing liquid; a1 st pressure sensor provided in contact with the 1 st pump chamber, for measuring a pressure of the processing liquid in the 1 st pump chamber; a volume changing member that changes a volume in the 1 st pump chamber; and a pump driving unit for driving the volume changing member to perform a pump operation; and the upstream pump includes: a2 nd pump chamber for containing a processing liquid; and a2 nd pressure sensor provided in contact with the 2 nd pump chamber, for measuring a pressure of the processing liquid in the 2 nd pump chamber; and the upstream pump adjusts a2 nd pressure value measured by the 2 nd pressure sensor so that a1 st pressure value measured by the 1 st pressure sensor of the liquid processing unit to which the processing liquid is supplied becomes a preset pressure value in cooperation with the pump driving unit of the supply valve of the liquid processing unit to which the processing liquid is supplied, when the processing liquid is selectively supplied to any one of the plurality of liquid processing units.
The invention described in (1) above has the following effects. The difference in height between the upstream pump and each liquid processing unit causes unevenness in the state (ejection pressure, ejection rate, ejection flow rate, etc.) of the processing liquid ejected from the nozzles. Therefore, the supply valve of each liquid processing unit includes a pump (the 1 st pump chamber, the volume changing member, the pump driving unit, and the like). This makes it possible to match the discharge states of the liquid processing units. In addition, if the pressures of the processing liquids delivered to the pumps of the respective supply valves (the respective liquid processing units) are not uniform, the load of pressure adjustment in the pumps of the respective supply valves increases. In this respect, the present invention can equalize the pressures of the processing liquids sent to the pumps of the respective supply valves. Therefore, the load of pressure adjustment in the pump of each supply valve can be reduced.
[ Effect of the invention ]
According to the substrate processing apparatus and the supply valve of the present invention, bubbles generated by opening and closing the valve can be removed.
Drawings
Fig. 1(a) is a longitudinal sectional view showing a schematic configuration of a substrate processing apparatus, and (b) is a cross-sectional view showing a schematic configuration of a substrate processing apparatus.
FIG. 2 is a piping diagram of the substrate processing apparatus.
Fig. 3 is a longitudinal sectional view showing the structure of the upstream pump.
Fig. 4 is a longitudinal sectional view showing the structure of the supply valve.
Fig. 5 is a view partially showing the flow path block viewed from an arrow a-a in fig. 4.
Fig. 6 is a diagram for explaining the operation of the on-off valve.
Fig. 7 is a vertical sectional view showing an installation posture of the supply valve of example 2.
Fig. 8 is an enlarged longitudinal sectional view of a part of the supply valve of embodiment 2.
Fig. 9 is a piping diagram showing a configuration for supplying a coating liquid to 2 coating units for forming an antireflection film among 4 coating units in the substrate processing apparatus according to the modified example.
Fig. 10 is a piping diagram showing a configuration for supplying a coating liquid to 2 coating units for forming a resist film out of 4 coating units in the substrate processing apparatus according to the modified example.
Fig. 11 is a vertical sectional view showing an open/close valve, an exhaust passage, and the like of a supply valve according to a modification.
Detailed Description
[ example 1]
Hereinafter, embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1(a) is a vertical sectional view showing a schematic configuration of a substrate processing apparatus. FIG. 1(b) is a cross-sectional view schematically showing the structure of a substrate processing apparatus.
< 1. construction of substrate processing apparatus 1 >
Refer to fig. 1(a) and 1 (b). The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 includes a loading block 2 and a processing block 3.
The loading block 2 includes a plurality of (e.g., 2 or 4) carrier tables 5 and, for example, 2 first substrate transfer mechanisms 6 (robots). A carrier C for accommodating the substrate W is placed on the carrier stage 5. The 21 st substrate transfer mechanisms 6 can transfer the substrate W between the carrier C mounted on each carrier stage 5 and the 2 substrate mounting portions PS1 and PS 2. In addition, 2 substrate placement parts PS1 and PS2 are disposed at the boundary between the loading block 2 and the processing block 3 and in the vicinity of the boundary. The 2 substrate placement units PS1 and PS2 are arranged in the vertical direction.
The processing block 3 includes a plurality of processing units 7 and a2 nd substrate transfer mechanism 8 (robot). The 2 nd substrate transfer mechanism 8 is disposed in a transfer space 9 long in the X direction (see fig. 1 (b)). The 2 nd substrate transfer mechanism 8 can transfer the substrate W between the 2 substrate placement units PS1 and PS2 and the plurality of processing units 7. The 1 st substrate conveyance mechanism 6 and the 2 nd substrate conveyance mechanism 8 each include an electric motor and are driven by the electric motor.
As shown in fig. 1(b), the plurality of processing units 7 are disposed so as to sandwich the conveyance space 9. The plurality of processing units 7 are divided into 4 liquid processing units 11A, 11B, 11C, 11D and other processing units 12 (e.g., heat treatment units). In fig. 1(b), 4 liquid processing units 11A to 11D are disposed on the 1 st side surface of the conveying space 9 as indicated by an arrow RT. As indicated by an arrow LT, the other processing unit 12 is disposed on the 2 nd side surface of the conveying space 9.
As shown in fig. 1A, 4 liquid processing units 11A to 11D (also referred to as modules) are arranged in a stacked manner in the vertical direction. The liquid processing units 11A to 11D each process the substrate W by supplying a processing liquid onto the substrate W. Each of the liquid processing units 11A to 11D includes 2 holding/rotating units 14, a nozzle 16, and a nozzle moving mechanism 18. As shown in fig. 2, each of the liquid treatment units 11A to 11D includes a supply valve 21 and a nozzle-side pipe 22. The nozzle-side pipe 22 connects the nozzle 16 to the outlet member 64 of the supply valve 21.
In addition, when the supply valves 21 are distinguished, the supply valves 21A, 21B, 21C, and 21D are referred to as corresponding to the liquid processing units 11A to 11D. Similarly, when the nozzles 16 are distinguished, they are referred to as nozzles 16A, 16B, 16C, and 16D. The nozzle-side pipes 22 are referred to as nozzle- side pipes 22A, 22B, 22C, and 22D.
The 2 holding and rotating units 14 each hold the substrate W in a horizontal posture and rotate the held substrate W. The holding and rotating portion 14 includes a spin chuck 23 and a spin driving portion 24. The spin chuck 23 holds the back surface of the substrate W by, for example, sucking air from a suction port provided on the mounting surface of the substrate W. The rotation driving unit 24 includes an electric motor and rotates the spin chuck 23 around a vertical axis. The nozzle 16 discharges the processing liquid to the substrate W held by the holding and rotating unit 14. The nozzle moving mechanism 18 includes an electric motor and moves the nozzle 16 to an arbitrary position.
Refer to fig. 2. Fig. 2 is a piping diagram of the substrate processing apparatus 1. For convenience of illustration, 1 holding and rotating unit 14 is shown in each of the liquid processing units 11A to 11D. The substrate processing apparatus 1 includes a transfer pipe 25, a processing solution bottle 27 (processing solution supply source), a gas supply unit 28, a collection tank 29, an upstream pump 31, a filter 33, branching units 34, 35, 36, and 4 transfer branch pipes 37A, 37B, 37C, 37D. When the 4 transport branch pipes 37A, 37B, 37C, and 37D are not distinguished, they are referred to as transport branch pipes 37.
The 1 st end of the transfer pipe 25 is inserted into the treatment solution bottle 27. The 2 nd end of the delivery pipe 25 is connected to the 1 st branch portion 34. The treatment liquid bottle 27 contains a treatment liquid. The treatment liquid is, for example, a resist liquid such as a resist liquid, a coating liquid for forming an antireflection film, a coating liquid for forming a resist cover film, a solvent (e.g., a diluent), a rinse liquid (e.g., DIW (Deionized Water)), a developing liquid, or an etching liquid.
The gas supply unit 28 is provided with a pipe and a valve and supplies gas into the treatment liquid bottle 27. This enables the treatment liquid contained in the treatment liquid bottle 27 to be sent to the delivery pipe 25. The gas is an inert gas such as nitrogen. The collection tank 29 is provided in the delivery pipe 25. The collection tank 29 is configured to store the processing liquid, and the remaining amount of the collection tank 29 is detected by a liquid level sensor, not shown.
Further, an exhaust pipe 30 is connected to the collection tank 29. The exhaust pipe 30 is provided with an on-off valve V21. The on-off valve V21 is normally closed. When the on-off valve V21 is in an open state and the on-off valves V1, V7 to V10, which will be described later, are in a closed state, the gas supply unit 28 is actuated to supply the treatment liquid from the treatment liquid bottle 27 to the collection tank 29. Thereby, the processing liquid containing the bubbles is pushed out through the exhaust pipe 30 and discharged or reused.
The upstream pump 31 selectively feeds the treatment liquid to each of the 4 liquid treatment units 11A to 11D. The upstream pump 31 is provided in the delivery pipe 25 between the collection tank 29 and the 1 st branch portion 34. As shown in fig. 3, the upstream pump 31 includes a pump chamber 41, a diaphragm 43, a pump driving unit 44, and a pressure sensor 50. The pump driving unit 44 includes the 1 st link 45, a conversion mechanism 47, and an electric motor 48, and performs a pump operation.
The pump chamber 41 accommodates a processing liquid. The peripheral edge of the diaphragm 43 is fixed to the inner wall of the pump chamber 41. The 1 st end of the 1 st link 45 is coupled to the center portion of the diaphragm 43. The 2 nd end of the 1 st link 45 is coupled to an output shaft 48A (rotor) of the electric motor 48 via a conversion mechanism 47. The conversion mechanism 47 includes 2 or more gears, and converts the rotation of the output shaft 48A of the electric motor 48 into the linear movement of the 1 st link 45 in the axial direction AD 1. That is, the electric motor 48 moves the center portion of the diaphragm 43 forward and backward along the axial direction AD 1. This deforms the diaphragm 43, and changes the volume of the pump chamber 41. The pressure sensor 50 is provided so as to be in contact with the pump chamber 41. The pressure sensor 50 is disposed so as to face the diaphragm 43. The pressure sensor 50 measures the pressure of the processing liquid in the pump chamber 41.
The diaphragm 43 is a rolling diaphragm, for example. The pump chamber 41 corresponds to the 2 nd pump chamber of the present invention. The pressure sensor 50 corresponds to the 2 nd pressure sensor of the present invention.
Refer to fig. 2. The filter 33 is provided in the delivery pipe 25 between the upstream pump 31 and the 1 st branch portion 34. The filter 33 includes a filter main body, not shown. When the treatment liquid is passed through the filter main body, foreign matters (dirt) and bubbles contained in the treatment liquid are removed by the filter main body. An exhaust pipe 51 is connected to the filter 33. The exhaust pipe 51 is provided with an on-off valve V22. The on-off valve V22 is normally closed. When the on-off valve V22 and the on-off valve V2 described below are in an open state and the on-off valves V1, V3 to V6 described below are in a closed state, the upstream pump 31 is operated to feed the treatment liquid from the upstream pump 31 to the filter 33, whereby the treatment liquid including bubbles that have passed through the filter main body is discharged or reused through the exhaust pipe 51.
The 1 st branch portion 34 is connected to the 2 nd end of the delivery pipe 25. Further, the 1 st end of 2 delivery branch pipes 37A and 37D is connected to the 1 st branch portion 34. The delivery branch pipe 37B is connected to the delivery branch pipe 37D via the 2 nd branch portion 35. The delivery branch pipe 37C is connected to the delivery branch pipe 37D via the 3 rd branch portion 36. Thereby, the treatment liquid delivered to the 1 st branch portion 34 through the delivery pipe 25 can be delivered to each of the 4 delivery branch pipes 37A to 37D. The 2 nd ends of the 4 delivery branch pipes 37A to 37D are connected to the 4 supply valves 21A to 21D of the 4 liquid treatment units 11A to 11D, respectively. For example, the 2 nd end of the delivery branch pipe 37A is connected to the supply valve 21A of the lowermost liquid processing unit 11A. The 2 nd end of the delivery branch pipe 37D is connected to the supply valve 21D of the uppermost liquid processing unit 11D.
In fig. 2, the delivery branch pipe 37B is connected to the delivery branch pipe 37D via the 2 nd branch portion 35, and the delivery branch pipe 37C is connected to the delivery branch pipe 37D via the 3 rd branch portion 36. In this regard, the 4 delivery branch pipes 37A to 37D may be directly connected to the 1 st branch portion 34 to which the delivery pipe 25 is connected.
The nozzle-side pipe 22A is provided with a flow meter 53A. Similarly, a flow meter 53B is provided in the nozzle-side pipe 22B. The nozzle-side pipe 22C is provided with a flow meter 53C. The flow meter 53D is provided in the nozzle-side pipe 22D. For example, the flow meter 53A measures the flow rate of the treatment liquid in the nozzle-side pipe 22A. Similarly, the 3 flow meters 53B to 53D measure the flow rates of the treatment liquids in the nozzle-side pipes 22B to 22D, respectively.
< 1-1 > constitution of supply valve 21(21A, 21B, 21C, 21D)
As shown in fig. 2, the supply valve 21A is disposed in the processing space in the liquid processing unit 11A together with the nozzle 16A and the nozzle-side pipe 22A. The supply valve 21B is disposed in the processing space in the liquid processing unit 11B together with the nozzle 16B and the nozzle-side pipe 22B. The same applies to the supply valves 21C and 21D. As shown in fig. 1(b), the supply valve 21 is disposed in the middle of the 2 holding and rotating portions 14.
Refer to fig. 4 and 5. Fig. 4 is a longitudinal sectional view showing the structure of the supply valve 21. Fig. 5 is a view partially showing the flow path block 61 as viewed from the arrow a-a in fig. 4. The supply valve 21 is used to supply the processing liquid to the nozzle 16. The supply valve 21 includes an on-off valve 55 (distribution valve), a pump 57, and a suck-back valve 59. The supply valve 21 includes a flow path block 61, an inlet member 63, and an outlet member 64. The processing liquid flows into the supply valve 21 from the tubular inlet member 63. The processing liquid in the supply valve 21 flows out from the tubular outlet member 64.
The flow path block 61 is shared by the on-off valve 55, the pump 57, and the suck-back valve 59. The flow path block 61 is formed of a fluororesin or other resin having thermoplastic and melt flowability, such as PFA (perfluoroalkoxyalkane). The flow path block 61 may be formed of a fluororesin such as PTFE (polytetrafluoroethylene).
The flow path block 61 includes an upper surface 61T, a lower surface 61B, a left side surface 61L, and a right side surface 61R. The flow path block 61 is provided with a switching valve chamber 65, an inlet side flow path 67, and an outlet side flow path 69.
An inlet 67A is formed at the 1 st end of the inlet-side flow path 67 so as to open on the left side surface 61L. The 2 nd end of the inlet-side flow passage 67 is connected to the switching valve chamber 65. That is, the inlet side flow path 67 is configured to allow the process liquid (liquid) to flow between the inlet 67A and the open/close valve chamber 65. The inlet member 63 is attached to the inlet 67A of the flow block 61 so as to communicate with the inlet-side flow passage 67.
The 1 st end of the outlet-side flow path 69 is connected to the switching valve chamber 65. An outlet 69A is formed at the 2 nd end of the outlet-side flow path 69 so as to open on the right side surface 61R. That is, the outlet side flow path 69 is configured to allow the treatment liquid to flow between the open/close valve chamber 65 and the outlet 69A. The outlet member 64 is attached to the outlet 69A of the flow path block 61 so as to communicate with the outlet-side flow path 69.
The supply valve 21 further includes a valve seat 71, a diaphragm 73 (an opening/closing valve body), and an opening/closing drive unit 75. The valve seat 71 is formed in the flow path block 61. The valve seat 71 is provided at a boundary (including a vicinity of the boundary) between the switching valve chamber 65 and the outlet-side flow passage 69. The valve seat 71 is configured to support a diaphragm 73 as an on-off valve body in the on-off valve chamber 65.
The diaphragm 73 is disposed in the switching valve chamber 65. Diaphragm 73 includes thick portion 73A and thin portion 73B. The thick-walled portion 73A is a portion pressed against the valve seat 71. Thin portion 73B is formed at the outer edge of thick portion 73A. The outer edge of the thin portion 73B is fixed to the inner wall of the switch valve chamber 65. The diaphragm 73 partitions the switching valve chamber 65 and a space 76 shown in fig. 4. The diaphragm 73 is configured to prevent the process liquid in the on-off valve chamber 65 from leaking into the space 76.
The switch driving unit 75 is configured to stop the flow of the treatment liquid from the switch valve chamber 65 to the outlet-side flow path 69 by pressing the diaphragm 73 against the valve seat 71, and to flow the treatment liquid from the switch valve chamber 65 to the outlet-side flow path 69 by separating the pressed diaphragm 73 from the valve seat 71. The switch drive unit 75 includes a2 nd link 78, a conversion mechanism 79, and an electric motor 80. The 1 st end of the 2 nd link 78 is connected to the thick portion 73A of the diaphragm 73. The 2 nd end of the 2 nd link 78 is coupled to an output shaft 80A (rotor) of the electric motor 80 via a conversion mechanism 79. The conversion mechanism 79 includes 2 or more gears, and converts the rotation of the output shaft 80A of the electric motor 80 into the linear movement of the 2 nd link 78 in the axial direction AD 2. That is, the electric motor 80 moves the thick portion 73A of the diaphragm 73 forward and backward along the axial direction AD 2. Thereby, thick portion 73A is pressed against valve seat 71, and thick portion 73A is separated from valve seat 71.
The switch valve chamber 65 is formed so as to open to the lower surface 61B of the flow path block 61. The diaphragm 73 and the opening/closing drive portion 75 are attached to the flow path block 61 so as to close the opening of the opening/closing valve chamber 65.
The supply valve 21 includes a pump 57 upstream of the open/close valve 55. The pump 57 includes a pump chamber 82, a diaphragm 83 (volume changing member), a pump driving unit 85, and a pressure sensor 86. The pump chamber 82 accommodates a processing liquid. The pump chamber 82 is formed in the inlet-side flow passage 67 of the flow passage block 61. That is, the pump chamber 82 is formed so as to be interposed in the inlet-side flow passage 67. Diaphragm 83 changes the volume of pump chamber 82. The peripheral edge portion of diaphragm 83 is fixed to the inner wall of pump chamber 82. The diaphragm 83 is a rolling diaphragm, for example.
Pump chamber 82 corresponds to the 1 st pump chamber of the present invention. The pressure sensor 86 corresponds to the 1 st pressure sensor of the present invention.
The pump driving unit 85 drives the diaphragm 83 to perform a pump operation. The pump driving unit 85 includes a 3 rd link 88, a conversion mechanism 89, and an electric motor 90. The 1 st end of the 3 rd link 88 is coupled to the center portion of the diaphragm 83. The 2 nd end of the 3 rd link 88 is coupled to an output shaft 90A (rotor) of the electric motor 90 via a conversion mechanism 89. The conversion mechanism 89 includes 2 or more gears, and converts the rotation of the output shaft 90A of the electric motor 90 into the linear movement of the 3 rd link 88 in the axial direction AD 3. Therefore, the central portion of the diaphragm 83 advances and retreats in the axial direction AD 3. This deforms diaphragm 83, and changes the volume in pump chamber 82. Pressure sensor 86 is disposed in contact with pump chamber 82. The pressure sensor 86 is disposed so as to face the diaphragm 83. Pressure sensor 86 measures the pressure of the process fluid within pump chamber 82.
The supply valve 21 is provided with a suck-back valve 59 downstream of the open/close valve 55. The suck back valve 59 includes a suck back valve chamber 92, a diaphragm 93, and a suck back driving unit 95. The suck-back valve chamber 92 is formed in the outlet side passage 69 of the passage block 61. That is, the suck-back valve chamber 92 is formed so as to be interposed in the outlet-side passage 69. The peripheral edge of the diaphragm 93 is fixed to the inner side wall of the suck-back valve chamber 92.
The suck-back driving unit 95 includes a 4 th link 98, a conversion mechanism 100, and an electric motor 101. The 1 st end of the 4 th link 98 is coupled to the center portion of the diaphragm 93. The 2 nd end of the 4 th link 98 is coupled to an output shaft 101A (rotor) of an electric motor 101 via a conversion mechanism 100. The conversion mechanism 100 includes 2 or more gears, and converts the rotation of the output shaft 101A of the electric motor 101 into the linear movement of the 4 th link 98 in the axial direction AD 4. Therefore, the central portion of the diaphragm 93 moves forward and backward along the axial direction AD 4. This changes the volume of the suck-back valve chamber 92.
As shown in fig. 4, the supply valve 21 includes an exhaust passage 103 and a bubble discharge member 105. The exhaust passage 103 is connected to the open/close valve chamber 65 and discharges air bubbles in the open/close valve chamber 65. The exhaust flow path 103 is formed in the flow path block 61. A discharge port 103A opened to the upper surface 61T of the passage block 61 is formed at the 1 st end of the exhaust passage 103. A tubular bubble discharge member 105 is attached to the discharge port 103A of the flow block 61 so as to communicate with the exhaust flow path 103. The 2 nd end of the exhaust gas flow path 103 is connected to the inlet side flow path 67 (the below-described shared flow path 67B). That is, the exhaust gas flow passage 103 extends downward and is connected to the open/close valve chamber 65 via the inlet-side flow passage 67 (the shared flow passage 67B described below). More specifically, the description will be given.
The inlet-side flow passage 67 extends horizontally from the inlet member 63, and then changes direction upward and downward of the open/close valve chamber 65 to be connected to the open/close valve chamber 65. The portion of the inlet-side flow passage 67 between the exhaust gas flow passage 103 and the open/close valve chamber 65 is referred to as a shared flow passage 67B. The common flow path 67B extends downward and is connected to the open/close valve chamber 65. Further, the exhaust flow path 103 extends downward and is connected to the common flow path 67B. In fig. 4, the inlet-side flow passage 67 is formed in an L shape. Therefore, the inlet-side flow passage 67 and the exhaust flow passage 103 form a T-shaped flow passage. Thus, the exhaust passage 103 is connected to the open/close valve chamber 65 via the common passage 67B, and discharges bubbles in the open/close valve chamber 65. With this configuration, the common flow passage 67B and the exhaust flow passage 103 linearly extend upward from the open/close valve chamber 65, and therefore, bubbles in the open/close valve chamber 65 can be smoothly discharged. In fig. 4, the outlet side channel 69 is also formed in an L shape.
Refer to fig. 2. The remaining configuration of the substrate processing apparatus 1 will be explained. The substrate processing apparatus 1 includes 4 return branch pipes 107A, 107B, 107C, and 107D, a1 st confluence section 109, a2 nd confluence section 110, a 3 rd confluence section 111, a return pipe 112, and a 4 th confluence section 114.
The 1 st ends of the 4 return branch pipes 107A to 107D are connected to the 4 supply valves 21A to 21D, respectively. For example, the return branch pipe 107A is connected to the bubble discharge member 105 of the supply valve 21A of the lowermost liquid processing unit 11A. Similarly, return branch pipes 107B to 107D are connected to 3 bubble discharge members 105 of the 3 supply valves 21B to 21D, respectively.
The 2 nd end of the return branch pipe 107B is connected to the return branch pipe 107A via the 1 st confluence section 109. Similarly, the 2 nd end of the return branch pipe 107C is connected to the return branch pipe 107A via the 2 nd confluence section 110. The 2 nd ends of the 2 return branch pipes 107A and 107D are connected to the 3 rd confluence section 111. The 1 st end of the return pipe 112 is further connected to the 3 rd confluence section 111. Further, the 2 nd end of the return pipe 112 is connected to the delivery pipe 25 via a 4 th confluence section 114. The 4 th confluence section 114 is disposed between the treatment liquid bottle 27 and the collection tank 29. When the supply valve 21A is set to upstream and the 4 th merging portion 114 is set to downstream, the 1 st merging portion 109, the 2 nd merging portion 110, the 3 rd merging portion 111, and the 4 th merging portion 114 are arranged in this order from upstream side. With this configuration, the treatment liquid or the bubbles can be returned from the supply valve 21 to the upstream of the catch tank 29.
The branching portions 34, 35, and 36 and the merging portions 109, 110, and 111 are each formed of, for example, a T-shaped pipe. The 4 th confluence portion 114 is constituted by a three-way valve. The 4 return branch pipes 107A to 107D may be directly connected to the 3 rd confluence section 111 to which the return pipe 112 is connected.
Further, as shown in FIG. 2, the substrate processing apparatus 1 includes 10 switching valves V1 to V10. The on-off valves V1 to V10 and the on-off valves V21 and V22 are driven by, for example, gas, a solenoid, an electric motor, or the like.
The on-off valve V1 is provided in the delivery pipe 25 between the collection tank 29 and the upstream pump 31. The on-off valve V2 is provided in the delivery pipe 25 between the upstream pump 31 and the filter 33. The on-off valve V3 is provided in the delivery branch pipe 37A between the 1 st branch portion 34 and the supply valve 21A. The on-off valve V4 is provided in the delivery branch pipe 37B between the 2 nd branch portion 35 and the supply valve 21B. The on-off valve V5 is provided in the delivery branch pipe 37C between the 3 rd branch portion 36 and the supply valve 21C. The on-off valve V6 is provided in the delivery branch pipe 37D between the 3 rd branch portion 36 and the supply valve 21D.
The open/close valve V7 is provided in the return branch pipe 107A between the supply valve 21A and the 1 st confluence section 109. The on-off valve V8 is provided in the return branch pipe 107B between the supply valve 21B and the 1 st confluence section 109. The on-off valve V9 is provided in the return branch pipe 107C between the supply valve 21C and the 2 nd confluence section 110. The on-off valve V10 is provided in the return branch pipe 107D between the supply valve 21D and the 3 rd confluence section 111.
The upstream pump 31 selectively sends the treatment liquid to any one of the 4 supply valves 21A to 21D in accordance with the open/close states of the 4 open/close valves V3 to V6. This will be specifically explained. The supply valve 21A performs a liquid transfer operation in cooperation with the upstream pump 31 and the on-off valves V1, V2, V3, V7, and V22. The supply valve 21B performs a liquid transfer operation in cooperation with the upstream pump 31 and the on-off valves V1, V2, V4, V8, and V22. The supply valve 21C performs a liquid transfer operation in cooperation with the upstream pump 31 and the on-off valves V1, V2, V5, V9, and V22. The supply valve 21D performs a liquid transfer operation in cooperation with the upstream pump 31 and the on-off valves V1, V2, V6, V10, and V22.
When the treatment liquid is discharged from the nozzle 16, the treatment liquid is sent only by the pump 57 of the supply valve 21 without cooperating with the upstream pump 31.
Further, when the upstream pump 31 selectively feeds the processing liquid to any one of the 4 liquid processing units 11A to 11D, for example, the liquid processing unit 11D, the 2 nd pressure value P2 measured by the pressure sensor 50 of the upstream pump 31 is adjusted in cooperation with the pump driving unit 85 (that is, the pump 57) of the supply valve 21D of the liquid processing unit 11D to which the processing liquid is fed so that the 1 st pressure value P1 measured by the pressure sensor 86 of the liquid processing unit 11D to which the processing liquid is fed becomes the preset positive pressure value PP. The preset positive pressure value PP is the same value for the 4 supply valves 21A to 21D. The pressure adjustment is performed simultaneously with the supply of the treatment liquid to the liquid treatment unit 11D with the on-off valves V2 and V6 being opened. The pressure adjustment is performed simultaneously with the management of the differential pressure value DP between the 1 st pressure value P1 and the 2 nd pressure value P2.
Here, the preset positive pressure value PP is, for example, 5 kPa. The 1 st pressure value P1 measured by the pressure sensor 86 (see fig. 4) is assumed to be 5kPa, for example, and the theoretical differential pressure value DP (the 2 nd pressure value P2 — the 1 st pressure value P1) determined by the level difference is assumed to be 9kPa, for example. In this case, the upstream pump 31 pressurizes the pressure at the 2 nd pressure value P2 at 14 kPa. The differential pressure value DP is a value determined by the difference in level between the upstream pump 31 and each of the supply valves 21A to 21D. Therefore, the higher the position of the supply valve 21, the larger the differential pressure value DP. For example, when the 2 nd pressure value P2 is 14kPa, but the 1 st pressure value P1 is as low as 4kPa, for example, the 2 nd pressure value P2 measured by the pressure sensor 50 of the upstream pump 31 is adjusted by the upstream pump 31 so that the 1 st pressure value P1 measured by the pressure sensor 86 of the pump 57 becomes 5 kPa. That is, the processing liquid is further pressurized by increasing the advancing speed of the diaphragm 43 and the 1 st link 45. The upstream pump 31 sends out the further pressurized treatment liquid to the pump 57. Further, the processing liquid is decompressed by reducing the advancing speed of the diaphragm 43 and the 1 st link 45.
The 2 nd pressure value P2 may be adjusted by the pump 57 of the liquid processing unit 11D to which the processing liquid is supplied, or may be adjusted by both the upstream pump 31 and the pump 57 of the liquid processing unit 11D to which the processing liquid is supplied. In this case, when the upstream pump 31 sends the processing liquid, the pump 57 decreases the retreating speeds of the diaphragm 83 and the 3 rd link 88 to pressurize the processing liquid. The pump 57 increases the retraction speed of the diaphragm 83 and the 3 rd link 88 to reduce the pressure of the processing liquid.
In fig. 1(a), a storage area PA1 is provided below the 4 liquid processing units 11A to 11D. The storage area PA1 is disposed upstream of the supply valves 21A to 21D. For example, in the housing area PA1, the delivery pipe 25, the treatment liquid bottle 27, the collection tank 29, the upstream pump 31, the filter 33, the 3 branching units 34 to 36, and the 6 on-off valves V1 to V6 are disposed as shown in FIG. 2. In fig. 1(a), a piping area PA2 is provided on the side of the 4 liquid treatment units 11A to 11D. For example, 4 delivery branch pipes 37A to 37D (part of) and 4 return branch pipes 107A to 107D (part of) are disposed in the pipe area PA 2.
The substrate processing apparatus 1 includes a controller 115 shown in fig. 1(b) and a storage unit (e.g., a memory) not shown. The controller 115 includes 1 or more Central Processing Units (CPUs). The controller 115 controls the respective components (e.g., the holding and rotating unit 14, the supply valve 21, the gas supply unit 28, the upstream pump 31, and the switching valves V1 to V10, V21 to V22) of the substrate processing apparatus 1. A computer program necessary for the operation of the substrate processing apparatus 1 is stored in the storage unit.
< 2 > action of the substrate processing apparatus 1
The operation of the substrate processing apparatus 1 will be described. The substrate W is subjected to liquid processing by the uppermost liquid processing unit 11D among the 4 liquid processing units 11A to 11D. First, the substrate W is carried onto the holding and rotating unit 14 of the liquid processing unit 11D.
In fig. 1(a) and 1(b), the carrier C is conveyed to the carrier stage 5. The 1 st substrate transfer mechanism 6 takes out the substrate W from the carrier C mounted on the carrier stage 5, and transfers the taken-out substrate W to one of the 2 substrate mounting portions PS1 and PS 2. In this description, the substrate W taken out is transported to the substrate mounting unit PS2 disposed at the upper stage.
The 2 nd substrate transfer mechanism 8 receives the substrate W from the substrate placement part PS2, and transfers the received substrate W to any of the processing units 7(11A to 11B, 12). The substrate W is, for example, subjected to heat treatment or cooling treatment by the other treatment unit 12, and then transported to the uppermost liquid treatment unit 11D. The substrate W is placed on the spin chuck 23 of one of the 2 holding and rotating units 14 of the liquid processing unit 11D. The holding and rotating unit 14 holds the substrate W placed thereon.
Next, the liquid transfer operation by the upstream pump 31, the supply valve 21D, and the like will be described with reference to fig. 2, 4, and 6. Fig. 6 is a diagram for explaining the operations of the on-off valves V1 to V10, V22, and the on-off valve 55 of the supply valve 21. In fig. 6, "open" in the item "V3/V4/V5/V6" related to the 4 on-off valves V3 to V6 means that any one of the 4 on-off valves V3 to V6 is selectively in an open state. "closed" indicates that all of the 4 on-off valves V3 to V6 are in a closed state. This is the same for the item "V7/V8/V9/V10" relating to the 4 on-off valves V7 to V10 and the item "55" relating to the 4 on-off valves 55 of the 4 supply valves 21A to 21D.
Step S01 suction process of upstream pump 31
In fig. 2, the ON-OFF valve V1 is in an open state (ON state), and the ON-OFF valves V2 to V10, V22, and the ON-OFF valve 55 of the 4 supply valves 21A to 21D are in a closed state (OFF state). In this state, the upstream pump 31 retracts the diaphragm 43 and the 1 st link 45 of the upstream pump 31 in a direction away from the pressure sensor 50. This increases the capacity of the pump chamber 41, and the treatment liquid is sucked into the pump chamber 41 of the upstream pump 31.
Step S02 Filtering Process Using the Filter 33
The processing liquid pumped into the pump chamber 41 of the upstream pump 31 is sent to the pump chamber 82 of the pump 57 of the supply valve 21D through the delivery pipe 25 and the filter 33. When the treatment liquid is sent from the upstream pump 31 to the pump 57 of the supply valve 21D, foreign substances and bubbles in the treatment liquid are removed by the filter 33.
This will be specifically explained. First, the on-off valves V1 to V10, V22, and the on-off valve 55 of the 4 supply valves 21A to 21D are closed. In this state, the upstream pump 31 changes the volume of the pump chamber 41 so that the 2 nd pressure value P2 measured by the pressure sensor 50 becomes the preset discharge pressure.
Then, the on-off valves V2, V6 are opened, and the on-off valves V1, V3 to V5, V7 to V10, V22, and the on-off valves 55 of the supply valves 21A to 21D are closed. In this state, the upstream pump 31 moves the diaphragm 43 and the 1 st link 45 forward in a direction to approach the pressure sensor 50. This reduces the volume of the pump chamber 41 of the upstream pump 31, and the treatment liquid is sent from the pump chamber 41 to the filter 33. Simultaneously with the operation of the upstream pump 31, the pump 57 of the supply valve 21D of the liquid processing unit 11D retracts the diaphragm 83 and the 3 rd link 88 in a direction away from the pressure sensor 86. Thereby, the capacity of pump chamber 82 of pump 57 increases, and the treatment liquid is sucked into pump chamber 82 of pump 57 of supply valve 21D.
Here, when the upstream pump 31 selectively feeds the processing liquid to any one of the 4 liquid processing units 11A to 11D, for example, the liquid processing unit 11D, the 2 nd pressure value P2 measured by the pressure sensor 50 of the upstream pump 31 is adjusted in cooperation with the pump driving unit 85 (the pump 57) of the supply valve 21D of the liquid processing unit 11D to which the processing liquid is fed so that the 1 st pressure value P1 measured by the pressure sensor 86 (see fig. 4) of the liquid processing unit 11D to which the processing liquid is fed becomes the preset positive pressure value PP.
Step S03 air discharge step of the pump 57
The on-off valve V10 is opened, and the on-off valves V1 to V9, V22 and the on-off valve 55 of the supply valves 21A to 21D are closed. In this state, the pump 57 of the supply valve 21D slightly advances the diaphragm 83 and the 3 rd link 88 in a direction to approach the pressure sensor 86. The amount of movement is predetermined. Thus, in fig. 4, the capacity of pump chamber 82 is slightly reduced, and the processing liquid in pump chamber 82 is sent to exhaust passage 103 and bubble discharge member 105 without going to the open/close valve chamber 65 side. The processing liquid delivered from the pump chamber 82 flows in order to the inlet-side flow path 67, the exhaust flow path 103, the bubble discharge member 105, and the return branch pipe 107D.
Here, the exhaust gas flow passage 103 is connected to the open/close valve chamber 65 of the open/close valve 55 via the shared flow passage 67B (inlet side flow passage 67). The air bubbles in the open/close valve chamber 65 can move to the exhaust passage 103. The bubbles moved to the exhaust passage 103 are further transported to the bubble discharging unit 105 or the return branch pipe 107D by the flow of the processing liquid by the pump 57. In this step, bubbles generated in the pump 57 or upstream of the pump 57 can be sent to the return branch pipe 107D and the like.
The bubbles and the processing liquid sent to the return branch pipe 107D are sequentially returned to the 3 rd merging portion 111, the return pipe 112, and the 4 th merging portion 114. The treatment liquid returned to the 4 th confluence section 114 is sent to the treatment liquid bottle 27. This makes it possible to effectively use the processing liquid at a high cost without discarding it.
[ step S04] discharge step by Pump 57
First, the on-off valves V1 to V10, V22, and the on-off valve 55 of the 4 supply valves 21A to 21D are closed. In this state, the pump 57 of the supply valve 21D changes the volume of the pump chamber 82 so that the 1 st pressure value P1 measured by the pressure sensor 86 of the supply valve 21D becomes the preset discharge pressure.
Then, the on-off valve 55 of the supply valve 21D is opened, and the on-off valves V1 to V10, V22, and the on-off valves 55 of the 3 supply valves 21A to 21C are closed. In this state, the pump 57 of the supply valve 21D advances the diaphragm 83 and the 3 rd link 88. Thus, the volume of pump chamber 82 decreases in accordance with the amount of movement of diaphragm 83 and 3 rd link 88. Therefore, the treatment liquid in the pump chamber 82 of the supply valve 21D is sent to the open/close valve chamber 65 and the outlet side passage 69, and the treatment liquid is discharged from the nozzle 16. The treatment liquid in the pump chamber 82 is sent to the switching valve chamber 65, the suck-back valve chamber 92, and the outlet member 64 through the inlet-side passage 67 and the outlet-side passage 69 in this order. The processing liquid fed to the outlet member 64 is fed to the nozzle-side pipe 22D and the nozzle 16D (see fig. 2) in this order.
While the treatment liquid is being sent out from the pump chamber 82, the pump 57 of the supply valve 21D increases or decreases the forward speed of the diaphragm 83 and the 3 rd link 88 so that the 1 st pressure value P1 measured by the pressure sensor 86 of the supply valve 21D is maintained at the preset discharge pressure.
While the processing liquid is being discharged, the holding and rotating unit 14 may rotate the held substrate W or may be stationary and not rotate. When a predetermined amount of the processing liquid is discharged from the nozzle 16D, the on-off valve 55 of the supply valve 21D is closed, and the movement of the diaphragm 83 and the 3 rd link 88 of the pump 57 of the supply valve 21D is stopped.
When the opening/closing valve 55 of the supply valve 21D is opened by separating the diaphragm 73 from the valve seat 71 (that is, when the processing liquid is discharged from the nozzle 16D), the suck back valve 59 of the supply valve 21D moves the diaphragm 93 and the 4 th link 98 forward, thereby reducing the volume of the suck back valve chamber 92. When the opening/closing valve 55 of the supply valve 21D is in the closed state (that is, when the discharge of the processing liquid from the nozzle 16D is stopped) by pressing the diaphragm 73 against the valve seat 71, the suck-back valve 59 of the supply valve 21D retracts the diaphragm 93 and the 4 th link 98, thereby increasing the volume of the suck-back valve chamber 92. When the volume increases, the processing liquid in the nozzle 16D is sucked toward the supply valve 21D, and the droplets of the processing liquid can be prevented from dropping from the nozzle 16A.
Further, the suction step and the discharge step may be performed simultaneously. In this case, for example, the suction and discharge process (step S01+ S04), the filtration process (step S02), and the flushing process (step S03) are sequentially repeated.
Further, in step S02, for example, 5ml (milliliter) of the treatment liquid is transferred to pump chamber 82 of pump 57, and after the discharge step of step S04, for example, 1ml of the treatment liquid remains in pump chamber 82. In this case, as shown in step S21 in fig. 6, the remaining processing liquid may be returned to the 4 th confluence section 114.
Specifically, the on-off valve V10 is opened, and the on-off valves V1 to V9, V22 and the on-off valve 55 of the supply valves 21A to 21D are closed. In this state, the pump 57 of the supply valve 21D moves the diaphragm 83 and the 3 rd link 88 forward in a direction to approach the pressure sensor 86. Thereby, the excess processing liquid returns to the 4 th confluence portion 114 side through the return pipe 112. By flowing the treatment liquid, the treatment liquid (e.g., resist liquid) can be prevented from solidifying and generating foreign matter. In this case, the operations are performed in the order of step S01, step S02, step S03, step S04, and step S21. Further, step S01 may also be performed in parallel with step S04 or step S21.
Further, the upstream pump 31 may feed the treatment liquid to the supply valve 21D again after feeding the treatment liquid to the supply valve 21D, or may selectively feed the treatment liquid to any one of the other 3 supply valves 21A to 21C (for example, the supply valve 21A).
After the substrate W is treated by the treatment liquid discharged therefrom, the holding/rotating unit 14 releases the holding of the substrate W in a state where the rotation of the substrate W is stopped. The 2 nd substrate conveyance mechanism 8 receives the substrate W on the holding and rotating section 14 of the liquid processing unit 11D. The 2 nd substrate transfer mechanism 8 transfers the received substrate W to another processing unit 12 as needed, and thereafter transfers the substrate W to the substrate placement part PS 2. The 1 st substrate conveyance mechanism 6 receives the substrate W conveyed to the substrate placement section PS2, and returns the received substrate W to the carrier C placed on the carrier stage 5.
According to the present embodiment, the supply valve 21 includes the on-off valve 55 (the on-off valve chamber 65, the valve seat 71, the diaphragm 73, and the on-off driving unit 75). An exhaust passage 103 for discharging bubbles in the open/close valve chamber 65 is connected to the open/close valve chamber 65. Thus, even if air bubbles are generated when the open-close valve 55 is opened and closed, the air bubbles in the open-close valve chamber 65 can be discharged through the exhaust passage 103. That is, bubbles generated by the on-off valve 55 can be removed. Therefore, it is possible to prevent product defects caused by bubbles being supplied to the substrate W or the like.
Further, the exhaust passage 103 extends downward and is connected to the on-off valve chamber 65. Since the exhaust passage 103 extends in the direction in which the bubbles move due to buoyancy, the bubbles in the open/close valve chamber 65 can be easily removed.
The inlet-side flow passage 67 has a common flow passage 67B extending downward and connected to the open/close valve chamber 65. The exhaust passage 103 is connected to the open/close valve chamber 65 via the common passage 67B, and discharges bubbles in the open/close valve chamber 65. The exhaust passage 103 is connected to the open/close valve chamber 65 via the common passage 67B by the common passage 67B connected to the inlet passage 67. Therefore, the flow path block 61 can be formed small. Since the shared passage 67B extends downward, both the exhaust passage 103 and the shared passage 67B extend downward. Therefore, air bubbles in the on-off valve chamber 65 can be removed more easily.
The supply valve 21 includes a pump 57 (pump chamber 82, diaphragm 83, and pump driving unit 85). The pump 57 is provided in the flow path block 61 where the on-off valve 55 is provided. Therefore, the distance between the pump 57 and the on-off valve 55 becomes short. Therefore, the pressure loss due to the flow path length between the pump 57 and the open/close valve 55 can be suppressed to be small, and the pressure loss due to the difference in level between the pump 57 and the open/close valve 55 can be suppressed to be small. In the case where the substrate processing apparatus 1 includes a plurality of supply valves 21, the distance and the height difference between the pump 57 and the on-off valve 55 are invariably constant. Therefore, the pressure loss due to the flow path length can be made uniform among the plurality of supply valves 21.
The supply valve 21A is disposed in the processing space in the liquid processing unit 11A together with the nozzle 16A and the nozzle-side pipe 22D, for example. The pump 57 (pump chamber 82, diaphragm 83, and pump driving unit 85) of the supply valve 21A can be brought closer to the nozzle 16A. The pressure loss due to the length of the flow path and piping from the pump 57 of the supply valve 21A to the nozzle 16A can be suppressed to be smaller. For example, the electric motor 90 of the supply valve 21A may have a torque smaller than that of the electric motor 48 of the upstream pump 31. The same applies to the other 3 supply valves 21B to 21D.
[ example 2]
Next, embodiment 2 of the present invention will be explained with reference to the drawings. Note that the description overlapping with embodiment 1 is omitted.
In fig. 4 and 5 of embodiment 1, the top surface 65A of the on-off valve chamber 65 is horizontal. The top surface 65A is a portion indicated by dotted hatching in fig. 5. In this regard, in embodiment 2, the top surface 65A of the on-off valve chamber 65 has an inclined surface 65A to guide bubbles to the exhaust gas flow path 103. The inclined surface 65A can easily cause air bubbles to accumulate in the exhaust passage 103 without remaining in the open/close valve chamber 65.
Fig. 7 is a view showing an installation posture of the supply valve 21 of embodiment 2. In fig. 7 and fig. 8 described below, an arrow denoted by reference sign Z indicates a vertical direction. The supply valve 21 of embodiment 2 shown in fig. 7 is a case where the supply valve 21 shown in fig. 4 is inclined. That is, the supply valve 21 shown in fig. 7 is installed in the liquid processing units 11A to 11D in an inclined posture.
A description is given of where to tilt. The connection portion between the shared passage 67B and the open/close valve chamber 65 is disposed on the inlet member 63 side in the open/close valve chamber 65. Therefore, the supply valve 21 is disposed so that the outlet member 64 is lower than the inlet member 63. Accordingly, substantially the entire surface of the top surface 65A is inclined, and therefore, bubbles in the open/close valve chamber 65 are easily guided to the shared flow path 67B and the exhaust flow path 103.
Further, it is necessary that the top surface 65A be inclined, and the exhaust gas flow passage 103 and the common flow passage 67B extend upward (including obliquely upward) from the open/close valve chamber 65. This is to facilitate the discharge of the air bubbles from the air bubble discharge member 105 to the open/close valve chamber 65.
Fig. 8 is an enlarged longitudinal sectional view of a part of a supply valve 21 according to a modification of embodiment 2. The top surface 65A shown in fig. 8 is inclined with respect to the horizontal upper surface 61T and lower surface 61B. That is, substantially the entire surface of the top surface 65A is the inclined surface 65A. The top surface 65A indicated by dotted hatching in fig. 5 is formed in an annular shape so as to surround the valve seat 71. Therefore, the air bubbles BB shown in fig. 8 are guided along the top surface (inclined surface) 65A while passing around the valve seat 71. This facilitates the introduction of the air bubbles BB in the switch valve chamber 65 into the common flow path 67B and the exhaust flow path 103. In fig. 7 and 8, the top surface (inclined surface) 65A may be a curved surface.
The present invention is not limited to the above embodiment, and can be variously implemented as follows.
(1) In the above embodiments, as shown in fig. 1(a) and 2, the substrate processing apparatus 1 includes 4-stage (4-layer) liquid processing units 11A to 11D. In this regard, the substrate processing apparatus 1 may also be provided with a level 1 or 2 or more liquid processing unit. Further, the liquid treatment unit of 2 stages or more is disposed in the vertical direction.
(2) In the above-described embodiments and modifications, the substrate processing apparatus 1 is configured to transfer the processing liquid from 1 processing liquid bottle 27 to 4 liquid processing units 11A to 11D. In this respect, the substrate processing apparatus 1 may be configured to transfer the processing liquid from a plurality of (for example, 2) processing liquid bottles 27 to 1 or a plurality of liquid processing units. As shown in fig. 9 and 10, for example, the substrate processing apparatus 1 includes 2 coating units rest and 2 coating units BARC. The 4 coating units rest and BARC (liquid processing units 11A to 11D) are stacked and arranged in the vertical direction.
Fig. 9 is a piping diagram showing a configuration for supplying the coating liquid to the 2 coating units BARC. The 2 coating units BARC each form an anti-reflection film on the substrate W. The treatment liquid bottle 120 contains a coating liquid for forming an antireflection film. The 1 st end of the transfer pipe 25P is inserted into the treatment liquid bottle 120. The 2 nd end of the delivery pipe 25P is connected to the branch portion 121. Further, 2 delivery branch pipes 37A and 37C are connected to the branch portion 121.
Further, 21 st ends of the return branch pipes 107A and 107C are connected to 2 bubble discharge members 105 of the supply valves 21A and 21C, respectively. The 2 nd ends of the return branch pipes 107A and 107C are connected to the joint 122. The return pipe 112P is connected to the merging portion 122. Furthermore, in FIG. 9, the components associated with the coating unit BARC, such as the symbol 25P, are numbered with a "P". The function of the delivery pipe 25P with "P" is the same as that of the delivery pipe 25 shown in fig. 2, for example.
Fig. 10 is a piping diagram showing a configuration for supplying a coating liquid to 2 coating units ress. Each of the 2 coating units rest forms a RESIST film on the antireflection film of the substrate W. The treatment liquid bottle 124 contains a resist liquid (coating liquid). The 1 st end of the transfer pipe 25Q is inserted into the treatment liquid bottle 124. The 2 nd end of the delivery pipe 25Q is connected to the branch portion 125. Further, 2 delivery branch pipes 37B and 37D are connected to the branch portion 125.
Further, the 21 st ends of the return branch pipes 107B, 107D are connected to the 2 bubble discharge members 105 of the supply valves 21B, 21D, respectively. The 2 nd ends of the return branch pipes 107B and 107D are connected to the merging portion 126. The return pipe 112Q is connected to the junction 126. In fig. 10, the composition related to the coating unit rest is indicated by a numeral "Q" as indicated by 25Q. The function of the transport pipe 25Q with "Q" is the same as that of the transport pipe 25 shown in fig. 2, for example. The delivery pipe 25Q is provided separately from the delivery pipe 25P shown in fig. 9, for example.
(3) In the above-described embodiments and modifications, the exhaust flow passage 103 shown in fig. 4 extends vertically downward and is connected to the common flow passage 67B, and the common flow passage 67B extends vertically downward and is connected to the open/close valve chamber 65. In this regard, the exhaust passage 103 may extend obliquely downward and be connected to the common passage 67B, and the common passage 67B may extend obliquely downward and be connected to the open/close valve chamber 65. In this specification, the lower direction includes an obliquely lower direction, and the upper direction includes an obliquely upper direction.
Further, the exhaust passage 103 and the common passage 67B linearly extend from the open/close valve chamber 65. In this regard, the exhaust passage 103 and the common passage 67B may extend from the open/close valve chamber 65 in a curved shape including an arc shape.
(4) In each of the above-described embodiments and modifications, the on-off valve 55 and the pump 57 of the supply valve 21 shown in fig. 4 are provided in 1 flow path block 61. In this regard, the on-off valve 55 and the pump 57 may be provided in 2 flow path blocks, respectively, as necessary. In this case, the 2 flow path blocks are connected by hollow cylindrical (tubular) intermediate pipes. The treatment liquid is transferred from the 1 st flow path block provided with the pump 57 to the 2 nd flow path block provided with the on-off valve 55 through the intermediate pipe. The flow path block 61 shown in fig. 4 is not configured such that 2 flow path blocks 61 are connected by intermediate pipes.
The on-off valve 55 and the suck-back valve 59 may be provided in 2 flow path blocks. In this case as well, 2 flow path blocks are connected by hollow cylindrical (tubular) intermediate pipes. The on-off valve 55, the pump 57, and the suck-back valve 59 may be provided in 3 flow path blocks.
(5) In each of the above-described embodiments and modifications, as shown in fig. 4, the exhaust passage 103 is connected to the open/close valve chamber 65 via the common passage 67B of the inlet-side passage 67. In this regard, as shown in fig. 11, the exhaust passage 103 may be directly connected to the on-off valve chamber 65 without passing through the inlet side passage 67 (the shared passage 67B). In this case, the switching valve chamber 65 of fig. 11 is larger than the switching valve chamber 65 of fig. 4. Therefore, the flow path block 61, that is, the supply valve 21 becomes large. When the processing liquid is returned to the 4 th junction 114 side through the exhaust flow path 103, the processing liquid is sequentially sent to the inlet flow path 67, the switching valve chamber 65, and the exhaust flow path 103.
In addition, when the exhaust gas flow passage 103 is provided at a position indicated by an arrow VNT of fig. 5 separately from the inlet-side flow passage 67, the flow passage block 61 may have to be formed thick in the direction indicated by the arrow WD. In this case as well, the flow path block 61, that is, the supply valve 21 becomes large.
[ description of symbols ]
1 substrate processing apparatus
11A to 11D liquid treatment unit
16(16A to 16D) nozzles
21(21A to 21D) supply valve
22 nozzle side piping
31 upstream pump
41 pump chamber
50: pressure sensor
55 switching valve
57 pump
61 flow path block
65 switching valve chamber
65A Top surface (inclined surface)
67 inlet side channel
67A inlet
67B shared channel
69 outlet side flow passage
69A is an outlet
71 valve seat
73 diaphragm
75 switch driving part
82 pump chamber
83 diaphragm
85 pump driving part
86 pressure sensor
103 exhaust gas flow path
105 bubble discharge part
115, a controller.

Claims (8)

1. A substrate processing apparatus, comprising:
a nozzle for ejecting a treatment liquid to the substrate;
a supply valve for supplying the treatment liquid to the nozzle; and
a nozzle-side pipe connecting the nozzle to an outlet of the supply valve; and is
The supply valve includes:
a flow path block;
a switching valve chamber formed in the flow path block;
an inlet-side flow path formed in the flow path block and configured to allow a liquid to flow between an inlet and the open/close valve chamber;
an outlet side flow path formed in the flow path block and configured to allow a liquid to flow between the open/close valve chamber and the outlet;
an on-off valve body disposed in the on-off valve chamber;
a valve seat provided at a boundary between the open/close valve chamber and the outlet side flow passage, and configured to support the open/close valve body in the open/close valve chamber;
a switch driving unit that stops the flow of the treatment liquid from the switch valve chamber to the outlet side flow path by pressing the switch valve body against the valve seat, and causes the treatment liquid to flow from the switch valve chamber to the outlet side flow path by separating the pressed switch valve body from the valve seat; and
and an exhaust passage formed in the passage block and connected to the open/close valve chamber to discharge bubbles in the open/close valve chamber.
2. The substrate processing apparatus according to claim 1, wherein:
the exhaust gas flow path extends downward and is connected to the on-off valve chamber.
3. The substrate processing apparatus according to claim 2, wherein:
the inlet side flow passage has a common flow passage extending downward and connected to the open/close valve chamber,
the exhaust passage is connected to the open/close valve chamber via the common passage, and discharges bubbles in the open/close valve chamber.
4. A substrate processing apparatus according to any one of claims 1 to 3, wherein:
the top surface of the open/close valve chamber has an inclined surface to guide air bubbles to the exhaust gas flow path.
5. A substrate processing apparatus according to any one of claims 1 to 3, wherein:
the supply valve further includes:
a1 st pump chamber formed in the inlet-side flow path of the flow path block and accommodating a processing liquid;
a volume changing member that changes a volume in the 1 st pump chamber; and
and a pump driving unit that drives the volume changing member to perform a pump operation.
6. The substrate processing apparatus according to claim 5, wherein:
the supply valve is disposed in the liquid treatment unit together with the nozzle and the nozzle-side pipe.
7. The substrate processing apparatus according to claim 5, further comprising:
a plurality of liquid processing units arranged in an up-down direction, each processing a substrate; and
an upstream pump for delivering a treatment liquid to each of the plurality of liquid treatment units; and is
The plurality of liquid treatment units each include the nozzle, the supply valve, and the nozzle-side pipe,
the supply valve includes a1 st pressure sensor, the 1 st pressure sensor is provided so as to be in contact with the 1 st pump chamber, and measures a pressure of the processing liquid in the 1 st pump chamber,
the upstream pump includes:
a2 nd pump chamber for containing a processing liquid; and
a2 nd pressure sensor provided in contact with the 2 nd pump chamber, for measuring a pressure of the processing liquid in the 2 nd pump chamber; and is
The upstream pump adjusts a2 nd pressure value measured by the 2 nd pressure sensor so that a1 st pressure value measured by the 1 st pressure sensor of the liquid processing unit to which the processing liquid is supplied becomes a preset pressure value in cooperation with the pump driving unit of the supply valve of the liquid processing unit to which the processing liquid is supplied, when the processing liquid is selectively supplied to any one of the plurality of liquid processing units.
8. A supply valve is characterized by comprising:
a flow path block;
a switching valve chamber formed in the flow path block;
an inlet-side flow path formed in the flow path block and configured to allow a liquid to flow between an inlet and the open/close valve chamber;
an outlet side flow path formed in the flow path block and configured to allow a liquid to flow between the open/close valve chamber and an outlet;
an on-off valve body disposed in the on-off valve chamber;
a valve seat provided at a boundary between the open/close valve chamber and the outlet side flow passage, and configured to support the open/close valve body in the open/close valve chamber;
a switch driving unit that stops a flow of the liquid from the switch valve chamber to the outlet side flow path by pressing the switch valve body against the valve seat, and causes the liquid to flow from the switch valve chamber to the outlet side flow path by separating the pressed switch valve body from the valve seat; and
and an exhaust passage formed in the passage block and connected to the open/close valve chamber to discharge bubbles in the open/close valve chamber.
CN202210223005.5A 2021-03-10 2022-03-09 Substrate processing apparatus and supply valve Pending CN115083954A (en)

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JP2021038356A JP2022138462A (en) 2021-03-10 2021-03-10 Substrate processing apparatus and supply valve
JP2021-038356 2021-03-10

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Publication Number Publication Date
CN115083954A true CN115083954A (en) 2022-09-20

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KR (1) KR20220127162A (en)
CN (1) CN115083954A (en)
TW (1) TWI816298B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0175048B1 (en) * 1996-03-19 1999-04-01 김광호 Photoresist Sprayer
JPH1133471A (en) * 1997-07-23 1999-02-09 Tokyo Electron Ltd Coating apparatus
JP2000173902A (en) 1998-12-08 2000-06-23 Dainippon Screen Mfg Co Ltd Substrate treatment system
JP4553256B2 (en) 2005-06-24 2010-09-29 東京エレクトロン株式会社 Substrate processing system and control method thereof

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