CN115083659A - Conductive paste for laser transfer printing, and preparation method and application thereof - Google Patents
Conductive paste for laser transfer printing, and preparation method and application thereof Download PDFInfo
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- CN115083659A CN115083659A CN202210859538.2A CN202210859538A CN115083659A CN 115083659 A CN115083659 A CN 115083659A CN 202210859538 A CN202210859538 A CN 202210859538A CN 115083659 A CN115083659 A CN 115083659A
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- conductive paste
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- point solvent
- conductive
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- 238000010023 transfer printing Methods 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title abstract description 11
- 239000002002 slurry Substances 0.000 claims abstract description 54
- 238000009835 boiling Methods 0.000 claims abstract description 48
- 239000002904 solvent Substances 0.000 claims abstract description 46
- 239000000843 powder Substances 0.000 claims abstract description 41
- 229920002545 silicone oil Polymers 0.000 claims abstract description 31
- 239000011521 glass Substances 0.000 claims abstract description 21
- 239000011230 binding agent Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 21
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 18
- -1 polydimethylsiloxane Polymers 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 239000002270 dispersing agent Substances 0.000 claims description 12
- 239000013008 thixotropic agent Substances 0.000 claims description 12
- 150000002148 esters Chemical class 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000003981 vehicle Substances 0.000 claims description 10
- 239000001856 Ethyl cellulose Substances 0.000 claims description 8
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 8
- 229920001249 ethyl cellulose Polymers 0.000 claims description 8
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 8
- 239000002952 polymeric resin Substances 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 6
- 239000002243 precursor Substances 0.000 claims description 6
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 4
- SESFRYSPDFLNCH-UHFFFAOYSA-N benzyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1=CC=CC=C1 SESFRYSPDFLNCH-UHFFFAOYSA-N 0.000 claims description 4
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 239000001087 glyceryl triacetate Substances 0.000 claims description 4
- 235000013773 glyceryl triacetate Nutrition 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 229960002622 triacetin Drugs 0.000 claims description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 3
- WHFKYDMBUMLWDA-UHFFFAOYSA-N 2-phenoxyethyl acetate Chemical compound CC(=O)OCCOC1=CC=CC=C1 WHFKYDMBUMLWDA-UHFFFAOYSA-N 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 229920006217 cellulose acetate butyrate Polymers 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920003225 polyurethane elastomer Polymers 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 2
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 claims description 2
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- LEACJMVNYZDSKR-UHFFFAOYSA-N 2-octyldodecan-1-ol Chemical compound CCCCCCCCCCC(CO)CCCCCCCC LEACJMVNYZDSKR-UHFFFAOYSA-N 0.000 claims description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 2
- 239000005642 Oleic acid Substances 0.000 claims description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 2
- 229960002903 benzyl benzoate Drugs 0.000 claims description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 2
- 239000004359 castor oil Substances 0.000 claims description 2
- 235000019438 castor oil Nutrition 0.000 claims description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 239000000806 elastomer Substances 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 2
- 239000000787 lecithin Substances 0.000 claims description 2
- 235000010445 lecithin Nutrition 0.000 claims description 2
- 229940067606 lecithin Drugs 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229940049964 oleate Drugs 0.000 claims description 2
- 235000021313 oleic acid Nutrition 0.000 claims description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 2
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 2
- 239000003760 tallow Substances 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- IFPMZBBHBZQTOV-UHFFFAOYSA-N 1,3,5-trinitro-2-(2,4,6-trinitrophenyl)-4-[2,4,6-trinitro-3-(2,4,6-trinitrophenyl)phenyl]benzene Chemical compound [O-][N+](=O)C1=CC([N+](=O)[O-])=CC([N+]([O-])=O)=C1C1=C([N+]([O-])=O)C=C([N+]([O-])=O)C(C=2C(=C(C=3C(=CC(=CC=3[N+]([O-])=O)[N+]([O-])=O)[N+]([O-])=O)C(=CC=2[N+]([O-])=O)[N+]([O-])=O)[N+]([O-])=O)=C1[N+]([O-])=O IFPMZBBHBZQTOV-UHFFFAOYSA-N 0.000 claims 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims 1
- 229960002969 oleic acid Drugs 0.000 claims 1
- 229940114926 stearate Drugs 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 35
- 230000008569 process Effects 0.000 abstract description 21
- 238000012546 transfer Methods 0.000 abstract description 17
- 238000007639 printing Methods 0.000 abstract description 14
- 238000007650 screen-printing Methods 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 230000000052 comparative effect Effects 0.000 description 23
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 230000008901 benefit Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920005596 polymer binder Polymers 0.000 description 3
- 239000002491 polymer binding agent Substances 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- ACGOCZRLBYATQI-UHFFFAOYSA-N 3-hydroxy-3-(4-methoxyphenyl)-2-methyl-1-phenylpropan-1-one Chemical compound C1=CC(OC)=CC=C1C(O)C(C)C(=O)C1=CC=CC=C1 ACGOCZRLBYATQI-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- AMTWCFIAVKBGOD-UHFFFAOYSA-N dioxosilane;methoxy-dimethyl-trimethylsilyloxysilane Chemical compound O=[Si]=O.CO[Si](C)(C)O[Si](C)(C)C AMTWCFIAVKBGOD-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229940083037 simethicone Drugs 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical class [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229940008099 dimethicone Drugs 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Sustainable Development (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses conductive paste for laser transfer printing, and a preparation method and application thereof. The conductive paste comprises conductive powder, glass powder and an organic carrier, wherein the organic carrier comprises silicone oil, a high-molecular binder and a low-boiling-point solvent; in the conductive slurry, the mass fraction of the silicone oil is 0.2-1.5%, the mass fraction of the high molecular binder is 0.2-2.0%, the mass fraction of the low boiling point solvent is 2.0-5.0%, and the boiling point is lower than 250 ℃. The conductive paste provided by the invention better balances the vapor pressure, the adhesive force and the capability of falling off from the carrier plate, can be well matched with laser transfer printing, has better transfer capability and ensures the printing performance on one hand, and has excellent wire take-up capability on the other hand, so that the height-width ratio of a grid line is improved; compared with the conventional screen printing process, the PA of the prepared grid line electrode can be reduced by more than 10%, and meanwhile, the photoelectric conversion efficiency of the solar cell can be improved by more than 0.1%.
Description
Technical Field
The invention relates to the technical field of conductive paste, in particular to conductive paste for laser transfer printing, and a preparation method and application thereof.
Background
The laser transfer printing is to fill slurry on a transparent carrier plate with specially designed grooves, and transfer the slurry from the grooves of the carrier plate to the surface of the battery through high-power laser beam scanning.
The application range of laser transfer printing is very wide, for example, in the field of solar cell preparation, compared with the mainstream traditional screen printing technology of solar cells, the grid line prepared by the laser transfer printing technology has the following advantages: (1) the shading area of the grid line can be obviously reduced, so that the photoelectric conversion efficiency is improved; (2) the use amount of the slurry can be obviously reduced; (3) the method is a non-contact technology, and can effectively reduce the fragment rate.
According to Pattern Transfer Printing (PTP) TM ) As disclosed in the article for c-Si solar cell sizing, the process of laser transfer printing is mainly based on two stages from the process principle and steps: 1) filling printing material, namely filling the prepared slurry on the groove of the transparent carrier plate. Like screen printing, the grooves are filled with paste by a squeegee, which will completely cover the grooves. 2) Transfer of printing material: and inverting the carrier plate filled with the slurry, wherein the filled slurry faces downwards and is arranged above the photovoltaic cell. Laser irradiates the back surface of the transparent carrier plate, the laser irradiates the transparent carrier plate, heat is conducted to the contact surface of the slurry and the groove of the carrier plate, the slurry absorbs heat, so that part of the solvent is evaporated and steam is formed in the closed space. When the steam pressure is larger than the adhesive force between the slurry and the carrier plate, the slurry and the carrier plate are separated and fall off, and the opposite position of the surface of the photovoltaic cell is transferred to form the grid line electrode.
However, in practical applications, the laser transfer printing technology has a high technical barrier, which is embodied in how the slurry parameters are adapted to the laser conditions. For example, when the laser power is too low, the laser energy is transmitted to the contact surface of the carrier and the slurry, the vapor pressure generated by the heat absorption and evaporation of the slurry is less than the adhesive force of the slurry, and finally the slurry cannot be separated from the carrier, so that the grid breakage problem is easily generated. When the laser power is too high, the generated steam pressure is too large, the shape of the contact surface is changed, and more fragments are generated by the slurry; in addition, the slurry obtains excessive acceleration and impacts the surface of the battery piece, the line width of the grid line is increased, and even the grid is broken.
Therefore, under the ideal condition, the laser energy is reasonable power when the vapor pressure generated by the slurry is slightly larger than the adhesive force between the slurry and the carrier plate. However, because different slurry ratios have differences in solvent evaporation capacity (vapor pressure difference), adhesion between the slurry and the carrier, and slip ability of the slurry in the grooves of the template, the prior art still cannot realize wide application of laser transfer printing.
The skilled person has made some efforts to address the above problems, but all are based on improvements to the process of laser transfer itself: for example, chinese patent nos. CN110690300B and CN113130672A are focused on optimizing the process conditions of laser transfer printing itself, including laser irradiation intensity and time, patterning template structure, and the like.
However, no specific technical scheme is disclosed for how to adjust and optimize the formula of the slurry according to the material composition and performance characteristics of the slurry, so that the slurry can exert the greatest advantage by matching with the laser transfer printing process conditions.
It should be noted that, in order to facilitate understanding of technical solutions of the present invention by those skilled in the art, the background of the present invention includes some prior arts and analysis and discovery of problems of the prior arts by the inventors, and all the contents of the background of the present invention should not be regarded as technical contents which have been disclosed, and problems of the prior arts and causes and/or solution directions of the problems may be firstly proposed by the inventors rather than directly taught or suggested by the disclosed prior arts.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide conductive paste for laser transfer printing, and a preparation method and application thereof.
In order to achieve the purpose, the technical scheme adopted by the invention comprises the following steps:
in a first aspect, the present invention provides a conductive paste for laser transfer printing, including conductive powder, glass powder and an organic carrier, where the organic carrier includes silicone oil, a polymer binder and a low-boiling point solvent;
in the conductive paste, the mass fraction of the silicone oil is 0.2-1.5%, the mass fraction of the high molecular binder is 0.2-2.0%, and the mass fraction of the low boiling point solvent is 2.0-5.0%;
the low boiling point solvent has a boiling point of less than 250 ℃.
In a second aspect, the present invention further provides a method for preparing the conductive paste, including:
fully stirring and mixing the conductive powder, the glass powder and the organic carrier to obtain a paste composition;
rolling and grinding the paste composition to a fineness of 10 μm or less to obtain a slurry precursor;
and filtering and dispersing the slurry precursor to obtain the conductive slurry for laser transfer printing.
In a third aspect, the invention also provides application of the conductive paste in laser transfer printing. In particular to the application of laser transfer printing in the preparation of solar cell grid lines.
In a fourth aspect, the invention further provides a solar cell, which includes a substrate and a gate line formed on the surface of the substrate, wherein the gate line is formed by laser transfer printing of the conductive paste.
Based on the technical scheme, compared with the prior art, the invention has the beneficial effects that at least:
the conductive paste provided by the invention forms an organic carrier through silicone oil, a high-molecular binder and a low-boiling point solvent, the vapor pressure of the conductive paste under laser irradiation is well balanced, the adhesive force between the conductive paste and a substrate and the falling capability of the conductive paste from a carrier plate can be well matched with a laser transfer printing process, and on one hand, the conductive paste has good capability of transferring from a patterned template to a silicon wafer substrate, so that the printing performance is ensured, on the other hand, the conductive paste has excellent wire taking-up capability, and the height-width ratio of a printed grid line is improved;
compared with the conventional screen printing process, the grid line electrode of the solar cell prepared by the conductive paste provided by the invention through the laser transfer printing process has the advantages that the Paste Amount (PA) required by printing each cell can be reduced by more than 10%, and meanwhile, the photoelectric conversion efficiency of the solar cell can be improved by more than 0.1%.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to enable those skilled in the art to more clearly understand the technical solutions of the present invention and to implement them according to the content of the description, the following description is made with reference to the preferred embodiments of the present invention and the detailed drawings.
Drawings
Fig. 1 is a schematic diagram of a conductive paste for laser transfer printing according to an exemplary embodiment of the present invention.
Detailed Description
In view of the deficiencies in the prior art, the inventors of the present invention have made extensive studies and extensive practices to provide technical solutions of the present invention. The technical solution, its implementation and principles, etc. will be further explained as follows.
In order to solve the technical problems, the embodiment of the invention adopts a technical scheme that the conductive paste applied to solar cell laser transfer metallization is provided, on one hand, the conductive paste has better capability of transferring from a patterned template to a silicon wafer substrate so as to ensure printability, and on the other hand, the conductive paste has excellent wire take-up capability, the height-width ratio of a printed grid line is improved, the cell efficiency is improved, and the paste consumption is reduced.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described herein, and thus the scope of the present invention is not limited by the specific embodiments disclosed below.
Referring to fig. 1, an embodiment of the present invention provides a conductive paste for laser transfer printing, including conductive powder, glass frit, and an organic vehicle, where the organic vehicle includes silicone oil, a polymer binder, and a low-boiling point solvent; in the conductive paste, the mass fraction of the silicone oil is 0.2-1.5%, the mass fraction of the high molecular binder is 0.2-2.0%, and the mass fraction of the low boiling point solvent is 2.0-5.0%; the low boiling point solvent has a boiling point of less than 250 ℃.
As some typical application examples of the technical scheme, the invention specifically exemplifies a laser transfer conductive paste for a solar cell, which comprises silver powder, glass powder and an organic carrier. The organic vehicle comprises at least one of silicone oil, high molecular weight cellulose (EC) and (PVB) resin, and a low boiling point solvent. Also, the organic vehicle may further include a thixotropic agent, a dispersant, a high boiling point solvent, and a polymer resin.
In some embodiments, the silicone oil comprises one or a combination of two or more of polydimethylsiloxane, polymethylphenylsiloxane, polyether polysiloxane copolymer, aminosiloxane.
In some embodiments, the silicone oil has a viscosity of from 10mpa.s to 5000 mpa.s.
As some typical application examples, the preferred silicone oil is polydimethylsiloxane, also called dimethicone, which has a viscosity of preferably 100-2000 mPas and a mass fraction of 0.3-1.0%; the dimethyl silicone oil has a good demolding effect, can help the slurry to be better transferred from the patterning template to the battery piece substrate, and meanwhile, the dimethyl silicone oil can also achieve the effect of adjusting the viscosity and rheological property of the conductive slurry, the addition amount is too small, so that the slurry is difficult to slide from the support plate to break the grid in the laser transfer process, the addition amount is too large, the excessive transfer of the slurry and the widening of the grid line are caused, and the aspect ratio is influenced.
In some embodiments, the polymeric binder comprises any one or a combination of two of ethyl cellulose, polyvinyl butyral.
In some embodiments, the ethylcellulose has a weight average molecular weight of 50000 or greater.
In some embodiments, the weight average molecular weight of the ethylcellulose is 50000-200000.
In some embodiments, the polyvinyl butyral has a hydroxyl value of 10 to 25%.
In the technical scheme, the EC and the PVB have good solvent compatibility, are convenient to disperse in the slurry, have excellent adhesion to the surface of a silicon wafer, can help the slurry transfer, are beneficial to elastic fracture of a template subjected to laser transfer printing during the slurry transfer, and help the slurry transfer to the silicon wafer, and particularly for a laser transfer printing process, compared with the traditional screen printing process, the EC and/or the PVB which are preferably used are a non-contact process, and need higher molecular weight or more polar functional groups to provide high adhesion to the silicon wafer substrate so as to enhance the adhesion between the EC and the PVB and the silicon wafer substrate.
The EC or PVB has more polar functional groups, provides cohesive force, enhances the adhesion effect of the EC or PVB and the silicon wafer substrate, and assists in the transfer of slurry. Meanwhile, the conductive paste has a coagulation effect, and the powder can be prevented from collapsing or flowing obviously during sintering.
EC is easier to be wound, so that the system is better and compact in agglomeration, and the linear broadening caused by the over-high content of pure silicone oil can be optimized. The PVB system contains sufficient hydroxyl functionality to provide strong adhesion to the substrate, while also reducing thixotropy and providing better flow properties. The preferred embodiment of the present invention is a combination of both EC and PVB, as the combination of both can better balance the ability to bond and take-up.
In some embodiments, the low boiling point solvent has a boiling point greater than 170 ℃.
In some embodiments, the low boiling point solvent comprises any one or a combination of two or more of dimethyl glutarate, dimethyl adipate, mixed dibasic acid esters, butyl diglycol acetate, and butyl diglycol monobutyl ether.
The low-boiling-point solvent has the function of generating vapor pressure in a closed space in the laser irradiation process to promote the separation of the slurry and the carrier plate, but the viscosity of the slurry in the continuous printing process is unstable due to too low boiling point or too much low-boiling-point solvent content, so that the final printing performance is influenced.
In some embodiments, the organic vehicle further comprises any one or a combination of two or more of a high boiling point solvent, a dispersant, a thixotropic agent, and a polymeric resin; wherein the boiling point of the high boiling point solvent is greater than 250 ℃.
The high-boiling-point solvent is used for further balancing the steam pressure of the slurry in the laser irradiation process, reducing the viscosity of the slurry and meeting the printing requirement. The dispersant is used for further providing the dispersing performance of the conductive paste and forming the stable and non-agglomerated high-solid-content conductive paste. The thixotropic agent is used for further improving the rheological property of the paste and enhancing the thixotropic property of the paste. The polymer resin is used for further improving the dispersion and coating of the conductive powder on the solid particles, preventing the particles from agglomerating, increasing the viscosity and plasticity of the slurry and adjusting the rheological property so as to meet the printing requirement of mass production.
In some embodiments, in the conductive paste, the mass fraction of the high boiling point solvent is 1 to 4%, the mass fraction of the dispersant is 0.1 to 1%, the mass fraction of the thixotropic agent is 0.2 to 2%, and the mass fraction of the polymer resin is 0.1 to 1%.
In some embodiments, the high boiling point solvent comprises a combination of one or more of ethyl 2-isobutoxybenzoate, triacetin, benzyl benzoate, ethylene glycol phenyl ether acetate, 2-octyldodecanol, propylene glycol phenyl ether, alcohol ester dodecanol, and alcohol ester hexadecanol.
In some embodiments, the dispersing agent comprises any one or a combination of two or more of tallow based propylene diamine oleate, stearates, lecithin, oleic acid, polyvinylpyrrolidone, and polyethylene glycol.
In some embodiments, the thixotropic agent comprises any one or a combination of two or more of hydrogenated castor oil, sodium polyamide, and fumed silica.
In some embodiments, the polymeric resin comprises any one or a combination of two or more of cellulose acetate butyrate, carboxymethyl cellulose, polyacrylate, rosin resin, polyurethane elastomer, polystyrene-ethylene-butadiene-styrene elastomer, alpha toluene vinyl resin, polyester, phenolic resin, and pentaerythritol triacrylate.
In some embodiments, the conductive powder comprises a metal powder.
In some embodiments, the conductive powder has a mass fraction of 80-92% in the conductive paste, and in this range, the conductive powder may provide a better function of collecting photo-generated carriers. The mass fraction of the glass powder is 1-4%, and within the range, the glass powder has excellent sintering window and corrosion performance. The organic vehicle has a mass fraction of 3 to 15%, and within this range, the organic vehicle can provide electrode shaping ability and excellent continuous printability to the conductive paste.
The conductive powder is preferably silver powder, however, based on the principle of the present invention, the selection of the conductive powder and the glass powder does not have a critical influence on the laser transfer process, it can be understood that the important improvement of the present invention lies in the composition and the proportion of the organic vehicle, and the selectable range of the conductive powder is not limited to silver powder, and other materials such as aluminum powder, aluminum alloy powder and the like can be used as the selectable range of the conductive powder; the glass powder is used for etching silicon and forming a conductive interface, the selection range is wide, and commercial glass powder which is commercially available and self-made glass powder which is specially prepared for some improvement purposes are also within the protection range of the invention.
The embodiment of the present invention further provides a method for preparing conductive paste provided in any one of the above embodiments, including the following steps:
the conductive powder, the glass frit, and the organic vehicle were sufficiently stirred and mixed to obtain a paste composition.
Rolling and grinding the paste composition to a fineness of 10 μm or less to obtain a slurry precursor.
And filtering and dispersing the slurry precursor to obtain the conductive slurry for laser transfer printing.
As a more specific embodiment, the preparation method comprises the following steps of sequentially adding and mixing organic substances such as a solvent (comprising the high boiling point solvent and the low boiling point solvent), a thermoplastic resin (comprising the high molecular binder and the high molecular resin), silicone oil, a thixotropic agent, a dispersing agent and the like, glass powder and silver powder, stirring for 1-2 hours under high shearing force, repeatedly rolling the paste composition by using a three-roll mill, grinding the paste composition to conductive paste with the fineness of less than 10 μm, and filtering and dispersing the conductive paste by using a screen to obtain a finished product.
The embodiment of the invention also provides application of the conductive paste provided by any one of the above embodiments in preparing a grid line by laser transfer printing.
The embodiment of the invention also provides a solar cell, which comprises a substrate and a grid line formed on the surface of the substrate, wherein the grid line is formed by coating the conductive paste provided by any one of the above embodiments on the substrate through laser transfer printing, and the substrate is preferably a silicon wafer substrate.
In some embodiments, the aspect ratio of the grid lines is above 60%.
The technical solution of the present invention is further described in detail by the following examples. However, the examples are chosen only for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
It should be noted that in the following examples 1 to 5 and comparative examples 1 to 4 of the present invention, the conductive paste was made using the following materials, and all of the examples and comparative examples maintained the same ratio of silver powder and glass frit.
Conductive powder: the spherical silver powder has a particle diameter (D50) of 0.5 to 2 μm.
Glass powder: lead oxide-tellurium oxide-bismuth oxide based glass powder, the source of which is commercially available.
Organic carrier: comprises silicone oil, at least one of high molecular weight cellulose (EC) and PVB resin, lower low boiling point solvent, thixotropic agent, dispersant, high boiling point solvent and high molecular resin. Wherein in the embodiments 1-5 of the invention, the silicone oil is dimethyl silicone oil, the viscosity is 100-; the weight average molecular weight of the cellulose resin is more than 50000; the hydroxyl value of the polyvinyl butyral resin is 10-25%; the low-boiling point solvent has a boiling point lower than 250 ℃ and comprises diethylene glycol butyl ether acetate, mixed dibasic acid ester, dimethyl adipate and diethylene glycol monobutyl ether; the high boiling point solvent has a boiling point of more than 250 ℃ and comprises 2-isobutoxy ethyl benzoate, glyceryl triacetate, ethylene glycol phenyl ether acetate and alcohol ester hexadecane; the high molecular resin comprises polyacrylate, rosin resin, polyurethane elastomer, cellulose acetate butyrate and the like; the thixotropic agent is polyamide sodium; the dispersant is TDO. The amounts of the above components added are shown in table 1 below.
The following examples 1 to 5 and comparative examples 1 to 4 were each prepared by the following method:
the conductive paste is prepared by the following method: adding organic matters such as a solvent, thermoplastic resin, silicone oil, a thixotropic agent, a dispersing agent and the like, glass powder and silver powder into the mixture in sequence, stirring the mixture for l to 2 hours under high shearing force, repeatedly rolling the mixture by using a three-roll grinder at different roll intervals until the mixture is conductive paste with the fineness of less than 10 mu m, and filtering the conductive paste by using a screen and defoaming the conductive paste for dispersion to obtain a finished product.
And the conductive pastes prepared in each example and comparative example were printed into a grid line on a solar substrate using the printing method as shown in the following table.
TABLE 1 conductive paste formulations of examples 1-5 and comparative examples 1-4
As a specific example, the specific steps of example 1 are as follows.
Example 1
2 percent of diethylene glycol monobutyl ether acetate, 0.5 percent of mixed dibasic acid ester, 1.2 percent of glyceryl triacetate, 2 percent of 2-isobutoxyethyl benzoate, 0.1 percent of alcohol ester sixteen, 0.4 percent of ethyl cellulose, 0.2 percent of polyvinyl butyral, 0.3 percent of acrylic resin, 0.5 percent of dimethyl silicone oil, 1.2 percent of sodium polyamide, 0.3 percent of TDO, 2.2 percent of glass powder and 89.1 percent of silver powder are sequentially added into a mixer to be mixed, stirred under high shearing force for 2 hours, repeatedly rolled to the fineness of below 10 mu m by using a three-roll grinder at different roll intervals to obtain conductive paste, and the conductive paste is prepared by filtering, defoaming and dispersing through a screen to obtain the finished conductive paste.
And then preparing the grid line electrode of the solar cell by using the conductive paste by using a laser transfer printing method. The method comprises the following specific steps: the conductive paste of the above examples and comparative examples was printed on a silicon substrate (166X 166mm) by a laser transfer technique, the number of grid lines was 136, and the laser irradiation intensity was 400W. The cell pieces were dried in an infrared drying oven and then passed through a belt firing oven. And cooling the sintered conductive paste to form the grid line electrode.
Other examples 2-5 and comparative examples 1-4 were made by reference to the procedure of example 1, adjusted in combination with the compounding ratio values given in table 1.
Furthermore, the performance tests of the solar cells and the grid lines thereof prepared in the above embodiments and comparative examples are as follows.
The test method comprises the following steps:
(1) printing and electrode height and width testing
The width, height and aspect ratio of the electrodes were measured using an optical microscope and a microimaging tester. Each slurry was tested 6 times and the average was taken.
(2) Cell conversion efficiency test
The resulting solar cells were subjected to an I-V test for measuring electrical properties including Voc, Isc, Rs, Rsh, FF, Eff under 1 sunlight intensity condition. Each slurry was tested for 12 sets of electrical property data and averaged.
The results obtained in the above examples and tests are shown in table 2 below.
Table 2 solar cells and grid line performance tests prepared in examples 1-5 and comparative examples 1-4
The main difference between comparative example 1 and examples 1 to 5 is that: the usage amount of the simethicone is lower than a reasonable range; the main differences of comparative example 2 compared to examples 1 to 5 are: polyvinyl butyral was not used; the main difference between comparative example 3 and examples 1 to 5 is that: the dosage of the simethicone is higher than a reasonable range, and the dosage of the low-boiling point solvent is lower than a reasonable range; the main difference of comparative example 4 compared to examples 1-5 is that the formation of the grid lines was performed using a screen printing process.
With respect to the amount of silicone oil used, examples 1 to 5 and comparative examples 1 and 3 were compared, wherein comparative examples 1 and 3 made the slurry in the same manner as example 1, and electrodes were formed using the same laser transfer technique, but the amount of silicone oil in comparative example 1 was less, and severe gate breakage occurred. The width of the printed electrodes in examples 1-5 is narrower than that of the electrodes in comparative example 3, and the aspect ratio is significantly improved.
With respect to resin compositions and amounts used, examples 1, 3, 5 and comparative example 2 were compared, comparative example 2 was made into a paste in the same manner as in example 1, electrodes were formed using the same laser transfer technique, and example 1 had the narrowest width of the printed electrode, whereas example 2 had a small amount of broken bars, on the premise of print quality ok.
With respect to the amount of the low-boiling point solvent used, examples 1 to 5 and comparative example 3 were compared, wherein example 3 made a slurry in the same manner as example 1, and electrodes were formed using the same laser transfer technique. In which comparative example 2 printing had a small amount of broken bars, examples 1-5. print quality ok.
Compared with the comparative example 4, the laser transfer printing technology is adopted in the examples 1 to 5, the width of the printing electrode is obviously narrowed, the consumption of the slurry is obviously reduced, the advantage of the aspect ratio is obvious, and the efficiency is obviously improved.
The present invention also obtains other embodiments based on the technical solutions provided above, as shown below.
Example 6
This example illustrates the preparation of a conductive paste and its application to a solar cell grid line, which is substantially the same as example 1 except that:
the silicone oil is selected from polymethylphenylsiloxane and aminosiloxane in a volume ratio of l: 1, and the amount of the silicone oil is 1.5 wt%;
the polymer binder is selected from 1.0 wt% of ethyl cellulose and 1.0 wt% of polyvinyl butyral;
the low boiling point solvent is selected from dimethyl glutarate, dimethyl adipate and mixed dibasic acid ester in a volume ratio of 1: 1, and the total dosage of the low boiling point solvent is 2.0 wt%.
Except silver powder, the amount of the other components is unchanged, and the silver powder is adjusted adaptively.
Example 7
This example illustrates the preparation of a conductive paste and its application to a solar cell grid line, which is substantially the same as example 1 except that:
the silicone oil is selected from polymethylphenylsiloxane and aminosiloxane mixed according to the volume ratio of 1: 1, and the amount of the silicone oil is 0.3 wt%;
the high molecular binder is selected from 0.1 weight percent of ethyl cellulose and 0.1 weight percent of polyvinyl butyral;
the low boiling point solvent is selected from dimethyl glutarate, dimethyl adipate and mixed dibasic acid ester in a volume ratio of 1: 1, and the total amount of the low boiling point solvent is 5.0 wt%.
Except silver powder, the amount of the other components is unchanged, and the silver powder is adjusted adaptively.
Example 8
This example illustrates the preparation of a conductive paste and its application to a solar cell grid line, which is substantially the same as example 1 except that:
the conductive metal powder is replaced by the mixture of silver powder and aluminum powder in the mass ratio of 2: 1.
The grid line electrode of the solar cell is prepared by the conductive paste provided in the above examples 6 to 8 by the same method as in example 1, and the aspect ratio and the performance of the solar cell are maintained at the same level as in examples 1 to 5, which is not described herein again.
Based on the embodiment, the comparative example and the detection results thereof, it is clear that the conductive paste provided by the embodiment of the invention forms an organic carrier through silicone oil, a high-molecular binder and a low-boiling point solvent, so that the vapor pressure of the conductive paste under laser irradiation, the adhesive force between the conductive paste and the substrate and the falling capability of the conductive paste from the carrier plate are well balanced, a laser transfer printing process can be well matched, and the conductive paste has a good capability of transferring from a patterned template to a silicon wafer substrate on one hand, so that the printing performance is ensured, and has an excellent wire take-up capability on the other hand, and the height-width ratio of a printed grid line is improved; compared with the conventional screen printing process, the grid line electrode of the solar cell prepared by the conductive paste provided by the embodiment of the invention through the laser transfer printing process has the advantages that the PA (unit consumption) can be reduced by more than 10%, and meanwhile, the photoelectric conversion efficiency of the solar cell can be improved by more than 0.1%.
It should be understood that the above-mentioned embodiments are merely illustrative of the technical concepts and features of the present invention, which are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and therefore, the protection scope of the present invention is not limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (10)
1. The conductive paste for laser transfer printing comprises conductive powder, glass powder and an organic carrier, and is characterized in that the organic carrier comprises silicone oil, a high-molecular binder and a low-boiling-point solvent;
in the conductive paste, the mass fraction of the silicone oil is 0.2-1.5%, the mass fraction of the high molecular binder is 0.2-2.0%, and the mass fraction of the low boiling point solvent is 2.0-5.0%;
the low boiling point solvent has a boiling point of less than 250 ℃.
2. The conductive paste according to claim 1, wherein the silicone oil comprises one or a combination of two or more of polydimethylsiloxane, polymethylphenylsiloxane, polyether polysiloxane copolymer, and aminosiloxane;
and/or the viscosity of the silicone oil is 10mPa.s-5000 mPa.s.
3. The conductive paste as claimed in claim 1, wherein the polymeric binder comprises one or a combination of two of ethyl cellulose and polyvinyl butyral;
preferably, the weight average molecular weight of the ethylcellulose is 50000 or more, more preferably 50000-200000;
preferably, the polyvinyl butyral has a hydroxyl value of 10 to 25%.
4. The electroconductive paste according to claim 1, wherein the low boiling point solvent has a boiling point higher than 170 ℃;
preferably, the low-boiling point solvent comprises any one or a combination of more than two of dimethyl glutarate, dimethyl adipate, mixed dibasic acid ester, diethylene glycol monobutyl ether and diethylene glycol butyl ether acetate.
5. The conductive paste according to claim 1, wherein the organic vehicle further comprises any one or a combination of two or more of a high boiling point solvent, a dispersant, a thixotropic agent, and a polymer resin;
wherein the boiling point of the high boiling point solvent is greater than 250 ℃;
preferably, in the conductive paste, the mass fraction of the high boiling point solvent is 1 to 4%, the mass fraction of the dispersant is 0.1 to 1%, the mass fraction of the thixotropic agent is 0.2 to 2%, and the mass fraction of the polymer resin is 0.1 to 1%.
6. The conductive paste as claimed in claim 5, wherein the high boiling point solvent includes one or a combination of two or more of ethyl 2-isobutoxybenzoate, triacetin, benzyl benzoate, ethylene glycol phenyl ether acetate, 2-octyldodecanol, propylene glycol phenyl ether, tripropylene glycol methyl ether, alcohol ester dodeca and alcohol ester hexadecane;
and/or the dispersing agent comprises any one or the combination of more than two of tallow propylene diamine oleate, stearate, lecithin, oleic acid, polyvinylpyrrolidone and polyethylene glycol;
and/or the thixotropic agent comprises any one or the combination of more than two of hydrogenated castor oil, polyamide sodium and fumed silica;
and/or the high polymer resin comprises any one or the combination of more than two of cellulose acetate butyrate, carboxymethyl cellulose, polyacrylate, rosin resin, polyurethane elastomer, polystyrene-ethylene-butadiene-styrene elastomer, alpha toluene vinyl resin, polyester, phenolic resin and pentaerythritol triacrylate.
7. The electroconductive paste according to claim 1, wherein the electroconductive powder comprises a metal powder;
and/or in the conductive paste, the mass fraction of the conductive powder is 80-92%, the mass fraction of the glass powder is 1-4%, and the mass fraction of the organic carrier is 3-15%.
8. The method for producing conductive paste according to any one of claims 1 to 7, comprising:
fully stirring and mixing the conductive powder, the glass powder and the organic carrier to obtain a paste composition;
rolling and grinding the paste composition to a fineness of 10 μm or less to obtain a slurry precursor;
and filtering and dispersing the slurry precursor to obtain the conductive slurry for laser transfer printing.
9. Use of the electroconductive paste according to any one of claims 1 to 7 in laser transfer printing.
10. A solar cell, comprising a substrate and a grid line formed on the surface of the substrate, wherein the grid line is formed by laser transfer printing of the conductive paste according to any one of claims 1 to 7;
preferably, the aspect ratio of the grid line is more than 60%.
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| CN115831440A (en) * | 2022-12-16 | 2023-03-21 | 江苏太阳科技股份有限公司 | Low-temperature curing conductive silver paste for laser transfer printing and preparation method thereof |
| WO2024087905A1 (en) * | 2022-10-25 | 2024-05-02 | 隆基绿能科技股份有限公司 | Laser transfer printing method and device, and solar cell |
| WO2024131495A1 (en) * | 2022-12-23 | 2024-06-27 | 晶澳（扬州）太阳能科技有限公司 | Preparation method for solar cell grid line |
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