CN115079457A - Display panel - Google Patents
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- CN115079457A CN115079457A CN202110270284.6A CN202110270284A CN115079457A CN 115079457 A CN115079457 A CN 115079457A CN 202110270284 A CN202110270284 A CN 202110270284A CN 115079457 A CN115079457 A CN 115079457A
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- 239000010410 layer Substances 0.000 claims abstract description 192
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 238000007789 sealing Methods 0.000 claims abstract description 43
- 238000005253 cladding Methods 0.000 claims abstract description 15
- 239000011247 coating layer Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 22
- 238000009826 distribution Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- -1 acryl Chemical group 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000549 coloured material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel which comprises a first substrate, a second substrate, a display medium layer, a pixel element layer, a transparent conducting layer, a sealing layer and a covering layer. The first substrate has a display area and a non-display area. The display medium layer is arranged between the first substrate and the second substrate. The pixel element layer is arranged on the first substrate and is positioned between the display medium layer and the first substrate. The transparent conductive layer is arranged on the second substrate and is provided with a plurality of openings in a projection area corresponding to the non-display area. The sealing layer is arranged between the first substrate and the second substrate, is overlapped with the non-display area and the openings, and surrounds the display medium layer. The percentage of the vertical projection area of the openings on the first substrate to the vertical projection area of the sealing layer on the first substrate is between 30% and 70%. The coating layer is arranged between the second substrate and the transparent conductive layer. The openings of the transparent conductive layer expose a part of the surface of the cladding layer, and the sealing layer directly contacts the part of the surface of the cladding layer.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a display panel.
Background
With the development of display technology, the application range of display panels is becoming wider, and the application of curved display panels and flexible display panels is one of the key points of development of many brands and factories in recent years. For example, applications of a curved display panel with a thinned hard substrate, such as a curved television (curved TV), a curved computer display (curved monitor), and a curved mobile phone (curved phone), or applications of a flexible display panel with a flexible substrate, such as wearable devices like watches and clothes, or portable devices like mobile phones and electronic paper, can be seen. Generally, the upper and lower substrates of the lcd panel are connected by a sealing layer (e.g., sealant) to form a chamber isolated from the outside, and the chamber is filled with a liquid crystal layer. Therefore, the adhesion strength of the sealing layer to the upper and lower substrates determines the sealing degree of the chamber and the stability of the physical properties of the liquid crystal layer located in the chamber. That is, the adhesion between the sealant and the two substrates has a considerable influence on the reliability (reliability) of the display panel.
Disclosure of Invention
The invention discloses a display panel, which has better reliability and is not easy to peel off in a peripheral area.
According to an embodiment of the present invention, a display panel includes a first substrate, a second substrate, a display medium layer, a pixel element layer, a transparent conductive layer, a sealing layer, and a cover layer. The first substrate is provided with a display area and a non-display area outside the display area. The second substrate is arranged opposite to the first substrate. The display medium layer is arranged between the first substrate and the second substrate. The pixel element layer is arranged on the first substrate and is positioned between the display medium layer and the first substrate. The transparent conductive layer is disposed on the second substrate and has a plurality of openings corresponding to a projection area in the non-display area. And the sealing layer is arranged between the first substrate and the second substrate, overlaps the non-display area and the openings in a projection manner, and surrounds the display medium layer. The percentage of the vertical projection area of the openings on the first substrate to the vertical projection area of the sealing layer on the first substrate is between 30% and 70%. The coating layer is arranged between the second substrate and the transparent conductive layer. The openings of the transparent conductive layer expose part of the surface of the cladding layer, and the sealing layer directly contacts part of the surface of the cladding layer.
In the display panel according to the embodiment of the invention, the display panel further includes a colored material layer disposed between the cladding layer and the second substrate, and the projection overlaps the sealing layer.
In the display panel according to the embodiment of the invention, the material of the cladding layer includes an average thickness of at least
Or an inorganic material containing silicon groups.
In the display panel according to the embodiment of the invention, the display panel further comprises a plurality of conducting structures and a plurality of micro-conductors. The plurality of conducting structures are dispersedly arranged in the non-display area of the first substrate. At least part of the openings of the transparent conducting layer are not projected to overlap the conducting structures. The micro conductors are dispersedly arranged in the sealing layer and are electrically connected with the conducting structures and the transparent conducting layer.
In the display panel according to the embodiment of the present invention, the plurality of openings of the transparent conductive layer are connected to each other and surround the display area.
In the display panel according to the embodiment of the invention, the vertical projection of the plurality of openings on the first substrate extends in the non-display area in a bending manner.
In the display panel according to the embodiment of the present invention, the plurality of openings of the transparent conductive layer are separated from each other and disposed at least one side of the display region.
In the display panel according to the embodiment of the invention, the plurality of openings of the transparent conductive layer include a plurality of first openings and a plurality of second openings. The distribution density of the vertical projection of the first openings on the second substrate is different from the distribution density of the vertical projection of the second openings on the second substrate.
In the display panel according to the embodiment of the invention, a vertical projection profile of the plurality of openings of the transparent conductive layer on the first substrate includes straight line segments, arc line segments or a combination thereof.
In the display panel according to the embodiment of the present invention, the transparent conductive layer covers the display region entirely.
In view of the above, in the display panel of an embodiment of the invention, the first substrate is provided with the pixel element layer, the second substrate is provided with the cover layer and the transparent conductive layer, and the display medium layer and the sealing layer are disposed between the pixel element layer and the transparent conductive layer. The sealing layer is in direct contact with the cladding layer through the plurality of openings on the transparent conductive layer, so that the stability of the connection (or adhesion) relationship between the sealing layer and the two substrates can be improved, and the reliability of the display panel in the subsequent process or when the display panel is bent can be improved.
Drawings
Fig. 1 is a schematic top view of a display panel according to a first embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the display panel of FIG. 1;
FIG. 3 is a schematic cross-sectional view of a display panel of another embodiment of the present invention;
FIG. 4 is a schematic top view of a display panel according to a second embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of the display panel of FIG. 4;
FIG. 6 is a schematic top view of a display panel according to a third embodiment of the present invention;
FIG. 7 is a schematic top view of a display panel according to a fourth embodiment of the present invention;
fig. 8 is a schematic top view of a display panel according to a fifth embodiment of the present invention.
Description of the reference numerals
10. 10A, 11, 12, 13, 14: a display panel;
101: a first substrate;
101s, 120 s: a surface;
102: a second substrate;
110. 110A: a pixel element layer;
115: a conductive connection structure;
120: a coating layer;
125: a micro-conductor;
130. 130A, 130B, 130C, 130D: a transparent conductive layer;
131. 131B, 131C, 131D, 132D: an opening;
140: a layer of coloured material;
200: a sealing layer;
300: a display medium layer;
BM: a light-shielding pattern layer;
BMa: an opening;
DA: a display area;
d 1: a first distance;
d 2: a second distance;
PA: a non-display area;
A-A ', B-B': and (6) cutting lines.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1 is a schematic top view of a display panel according to a first embodiment of the invention. Fig. 2 is a schematic cross-sectional view of the display panel of fig. 1. Fig. 3 is a schematic cross-sectional view of a display panel according to another embodiment of the present invention. In particular, FIG. 2 corresponds to section line A-A' of FIG. 1. For the sake of clarity of presentation and explanation, fig. 1 shows only the first substrate 101, the second substrate 102, the light-shielding pattern layer BM, the transparent conductive layer 130, and the sealing layer 200 of fig. 2.
Referring to fig. 1 and fig. 2, the display panel 10 includes a first substrate 101, a second substrate 102, a pixel element layer 110, a cover layer 120, a transparent conductive layer 130, a light-shielding pattern layer BM, a sealing layer 200, and a display medium layer 300. The first substrate 101 has a display area DA and a non-display area PA (or referred to as a peripheral area) other than the display area DA. The second substrate 102 is disposed opposite to the first substrate 101. The material of the first substrate 101 and the second substrate 102 may include glass, quartz, polymer, or other suitable substrate materials.
The pixel element layer 110 is disposed on the first substrate 101. The transparent conductive layer 130 is disposed on the second substrate 102 and is opposite to the pixel element layer 110 on the first substrate 101. The display medium layer 300 is disposed between the pixel element layer 110 and the transparent conductive layer 130 (or between the first substrate 101 and the second substrate 102). In the present embodiment, the display medium layer 300 is, for example, a liquid crystal layer and may include a plurality of liquid crystal molecules, but not limited thereto. The pixel element layer 110 may include a plurality of scan lines (scan lines), a plurality of data lines (data lines), and a plurality of pixel structures, which are not shown. The scan lines and the data lines intersect each other and define a plurality of pixel regions of the display panel 10. The pixel structures are respectively located in the pixel regions and each have an active device (not shown) and a pixel electrode (not shown) electrically connected to each other, wherein the active device is electrically connected to the pixel electrode, a corresponding scan line and a corresponding data line. The active elements can be independently controlled through a corresponding scanning line and a corresponding data line respectively, so that the corresponding pixel electrodes have the same or different potentials. When the pixel electrode and the transparent conductive layer 130 are enabled to have a potential difference, the electric field formed between the pixel electrode and the transparent conductive layer 130 can drive the liquid crystal molecules of the display medium layer 300 to rotate, so as to modulate the polarization state of the polarized light incident into the display medium layer 300, and change the light intensity of the polarized light after passing through the display panel 10 to achieve the display effect.
In the present embodiment, a cladding layer 120 and a light-shielding pattern layer BM are further disposed on the second substrate 102. The cladding layer 120 is located between the second substrate 102 and the transparent conductive layer 130. The light-shielding pattern layer BM is located between the cladding layer 120 and the second substrate 102. Particularly, the light-shielding pattern layer BM surrounds an opening BMa, and the opening BMa defines a display area DA of the display panel 10. In other words, the vertical projection of the light-shielding pattern layer BM on the surface 101s of the first substrate 101 overlaps the non-display area PA (i.e., the peripheral area) of the display panel 10. The material of the coating layer 120 includes, for example, an average thickness of at least
Organic polymers (e.g. organic resins) or inorganic materials containing silicon groups (e.g. oxygen)Silicon nitride or silicon nitride). The main purpose of the cladding layer 120 is to provide better planarization and better optical performance, and therefore, it must have a certain thickness to achieve the above-mentioned goal. The material of the light-shielding pattern layer BM includes, for example, a black resin material, or other materials suitable for blocking light (e.g., low-reflection metal, blackened metal, black ink).
Note that a sealing layer 200 is further provided between the pixel element layer 110 and the transparent conductive layer 130. The sealing layer 200 is located in the non-display area PA (i.e., the peripheral area) of the first substrate 101 and surrounds the display medium layer 300. More specifically, the pixel element layer 110 on the first substrate 101 and the transparent conductive layer 130 on the second substrate 102 form a sealed cavity through the sealing layer 200, and the sealed cavity is filled with the display medium layer 300. It should be understood that the vertical projections of the sealing layer 200 and the light-shielding pattern layer BM on the surface 101s of the first substrate 101 may overlap each other to increase the concealment performance. In the present embodiment, the material of the sealing layer 200 includes acrylic resin (acryl resin), epoxy resin (epoxy resin), photo-sensitive polymer (photo-sensitive) material, or other suitable sealing material.
In the present embodiment, the transparent conductive layer 130 entirely covers the display area DA of the display panel 10. The transparent conductive layer 130 has a plurality of openings 131, and the projections of the openings 131 overlap in the non-display area PA of the display panel 10. It should be noted that the openings 131 of the transparent conductive layer 130 may expose a portion of the surface 120s of the coating layer 120, and the sealing layer 200 may directly contact the portion of the surface 120s of the coating layer 120 through the openings 131. If the sealing layer 200 is directly connected to the cover layer 120, the non-display area PA is not easily peeled off (peeling) due to external force, and the stability of the connection relationship between the sealing layer 200 and the two substrates is improved, thereby increasing the reliability of the display panel 10 in the subsequent process or when being bent. In the present embodiment, a percentage value of a vertical projection area of the openings 131 of the transparent conductive layer 130 on the first substrate 101 to a vertical projection area of the sealing layer 200 on the first substrate 101 is between 30% and 70%. Particularly, in order to effectively improve the control of the joint force and the manufacturing cost, if the openings are of an uninterrupted type, the percentage value of the vertical projection area is between 30% and 50%; if the openings are separated from each other, the percentage of the vertical projection area is between 50% and 70%.
In the present embodiment, the openings 131 of the transparent conductive layer 130 are dispersedly disposed in the non-display area PA (as shown in fig. 1) around the display area DA. However, the present invention is not limited thereto, and according to other embodiments, the plurality of openings 131 of the transparent conductive layer 130 may be disposed on only one side, two sides, or more than two sides of the display area DA, depending on the product design (e.g., the peripheral design) or the application requirement (e.g., the bending manner or the appearance shape) of the display panel. That is, the openings 131 of the transparent conductive layer 130 are separated from each other and disposed at least one side of the display area DA.
On the other hand, in the present embodiment, the vertical projection profile of the openings 131 on the first substrate 101 is, for example, rectangular. That is, the vertical projection profile of the opening 131 includes a plurality of straight line segments, but not limited thereto. In other embodiments, the vertical projection profile of the opening 131 of the transparent conductive layer 130 on the first substrate 101 can also be adjusted to be circular, elliptical, polygonal, or other suitable shapes (e.g., a combination of at least one straight line segment and at least one arc segment) corresponding to the design of the peripheral structure and the sealing layer 200.
It should be understood that in another embodiment, a colored material layer 140 can be further disposed on the second substrate 102 of the display panel 10A, as shown in fig. 3. The colored material layer 140 is located between the cladding layer 120 and the second substrate 102, and a perpendicular projection on the surface 101s of the first substrate 101 overlaps a perpendicular projection of the sealing layer 200 on the surface 101s of the first substrate 101. Since most of the colored material layer 140 has proper viscosity, if the colored material layer contacts the overcoat layer 120 and extends to the light-shielding pattern layer BM in the non-display area PA to overlap with the seal layer 200 in a projection manner, it is helpful to properly improve the peeling (peeling) phenomenon of the non-display area PA caused by external force.
The present disclosure will be described in detail below with reference to other embodiments, wherein like components are denoted by like reference numerals, and descriptions of the same technical content are omitted, and reference is made to the foregoing embodiments for omitting details.
Fig. 4 is a schematic top view of a display panel according to a second embodiment of the invention. Fig. 5 is a schematic cross-sectional view of the display panel of fig. 4. Fig. 5 corresponds to section line B-B' of fig. 4. Referring to fig. 4 and 5, the difference between the display panel 11 of the present embodiment and the display panel 10 of fig. 1 is: the transparent conductive layer has different opening configurations.
In the present embodiment, the display panel 11 further includes a plurality of conducting structures 115 and a plurality of micro-conductors 125. The conducting structures 115 are disposed on the pixel element layer 110A and located in the non-display area PA (i.e., the peripheral area) of the display panel 11. The micro-conductors 125 are disposed in the sealing layer 200 and electrically connected between the plurality of conductive structures 115 and the transparent conductive layer 130A. More specifically, the transparent conductive layer 130A on the second substrate 102 can be electrically connected to the pixel element layer 110A on the first substrate 101 through the micro-conductors 125 and the conductive structures 115 to receive an electrical signal (e.g., a common voltage signal) from one side of the first substrate 101. Therefore, the vertical projection of the plurality of openings 131 of the transparent conductive layer 130A on the surface 101s of the first substrate 101 does not overlap the vertical projection of the plurality of bonding structures 115 on the surface 101s of the first substrate 101. The material of the conductive structure 115 includes, for example, a metal, an alloy, a metal oxide (e.g., indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide), or other suitable material, or a stacked layer of at least two of the above materials. The micro-conductor 125 is, for example, a metal particle, and the material thereof includes gold or silver.
Fig. 6 is a schematic top view of a display panel according to a third embodiment of the invention. Referring to fig. 6, the difference between the display panel 12 of the present embodiment and the display panel 10 of fig. 1 is: the transparent conductive layer has a plurality of openings arranged in different manners. Specifically, the plurality of openings 131B of the transparent conductive layer 130B of the display panel 12 are connected to each other and surround the display area DA. In the present embodiment, the vertical projection of the openings 131B on the first substrate 101 extends in the non-display area PA (i.e. the peripheral area) in a bending manner. Accordingly, the stability of the connection relationship between the sealing layer 200 and the two substrates can be further improved, thereby increasing the reliability of the display panel 12 in the subsequent process or when being bent. Alternatively, the material selection margin of the cladding layer and the sealing layer 200 can be increased.
Fig. 7 is a schematic top view of a display panel according to a fourth embodiment of the invention. Fig. 8 is a schematic top view of a display panel according to a fifth embodiment of the present invention. Referring to fig. 7, the difference between the display panel 13 of the present embodiment and the display panel 10 of fig. 1 is: the transparent conductive layer has different opening profiles. In this embodiment, the vertical projection profile of the plurality of openings 131C of the transparent conductive layer 130C of the display panel 13 on the first substrate 101 is circular. Referring to fig. 8, the difference between the display panel 14 of the present embodiment and the display panel 13 of fig. 7 is: the transparent conductive layer has a plurality of openings arranged in different manners. Specifically, the openings of the transparent conductive layer 130D of the display panel 14 can be divided into a plurality of first openings 131D and a plurality of second openings 132D. The distribution density of the vertical projection of the first openings 131D on the second substrate 102 is different from the distribution density of the vertical projection of the second openings 132D on the second substrate 102.
For example, in the present embodiment, the first openings 131D are spaced apart by a first distance D1 in two directions (e.g., the horizontal direction and the vertical direction of fig. 8), the second openings 132D are spaced apart by a second distance D2 in the two directions, and the first distance D1 is optionally greater than the second distance D2. By the difference of the distribution density of the openings, the stability of the connection relationship between the two substrates and the sealing layer 200 in different regions can be improved to different degrees. For example: the distribution density of the plurality of openings at the position of the display panel close to the corner may be greater than the distribution density of the plurality of openings at the position of the display panel far away from the corner. However, the present invention is not limited thereto, and according to other embodiments, the difference of the distribution density of the plurality of openings of the transparent conductive layer may also be realized by the difference of the opening sizes of the openings, for example: the vertical projection area of the first openings of the transparent conductive layer on the second substrate 102 is optionally smaller than the vertical projection area of the second openings on the second substrate 102, and the openings are arranged at equal intervals.
In summary, in the display panel according to an embodiment of the invention, the first substrate is provided with the pixel element layer, the second substrate is provided with the cover layer and the transparent conductive layer, and the display medium layer and the sealing layer are disposed between the pixel element layer and the transparent conductive layer. The sealing layer is in direct contact with the cladding layer through the plurality of openings on the transparent conductive layer, so that the stability of the connection (or adhesion) relationship between the sealing layer and the two substrates can be improved, and the reliability of the display panel in the subsequent process or when the display panel is bent can be improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display panel, comprising:
a first substrate having a display region and a non-display region other than the display region;
a second substrate disposed opposite to the first substrate;
the display medium layer is arranged between the first substrate and the second substrate;
the pixel element layer is arranged on the first substrate and is positioned between the display medium layer and the first substrate;
a transparent conductive layer disposed on the second substrate, the transparent conductive layer having a plurality of openings in a projection area corresponding to the non-display area;
a sealing layer disposed between the first substrate and the second substrate, wherein the projection of the sealing layer overlaps the non-display region and the plurality of openings, and surrounds the display medium layer, and a percentage ratio of a vertical projection area of the plurality of openings on the first substrate to a vertical projection area of the sealing layer on the first substrate is between 30% and 70%; and
the covering layer is arranged between the second substrate and the transparent conducting layer, the plurality of openings of the transparent conducting layer expose partial surfaces of the covering layer, and the sealing layer directly contacts the partial surfaces of the covering layer.
2. The display panel according to claim 1, further comprising:
the colored material layer is arranged between the coating layer and the second substrate, and the projection of the colored material layer is overlapped with the sealing layer.
3. The display panel of claim 1 wherein the material of the cladding layer comprises an average thickness of at least
Or an inorganic material containing silicon groups.
4. The display panel according to claim 1, further comprising:
a plurality of conducting structures dispersedly arranged in the non-display area of the first substrate, wherein at least part of the plurality of openings of the transparent conductive layer are not projected to overlap with the plurality of conducting structures; and
and the micro conductors are dispersedly arranged in the sealing layer and are electrically connected with the plurality of conducting structures and the transparent conducting layer.
5. The display panel according to claim 1, wherein the plurality of openings of the transparent conductive layer are connected to each other and surround the display region.
6. The display panel according to claim 5, wherein a vertical projection of the plurality of openings on the first substrate extends in the non-display region in a bending manner.
7. The display panel according to claim 1, wherein the plurality of openings of the transparent conductive layer are separated from each other and are disposed on at least one side of the display region.
8. The display panel according to claim 1, wherein the plurality of openings of the transparent conductive layer include a plurality of first openings and a plurality of second openings, and a distribution density of vertical projections of the plurality of first openings on the second substrate is different from a distribution density of vertical projections of the plurality of second openings on the second substrate.
9. The display panel of claim 1, wherein a vertical projection profile of the openings of the transparent conductive layer on the first substrate comprises straight line segments, arc segments or a combination thereof.
10. The display panel according to claim 1, wherein the transparent conductive layer covers the display region over its entire surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110270284.6A CN115079457A (en) | 2021-03-12 | 2021-03-12 | Display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110270284.6A CN115079457A (en) | 2021-03-12 | 2021-03-12 | Display panel |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202372734U (en) * | 2011-12-15 | 2012-08-08 | 北京京东方光电科技有限公司 | Liquid crystal display |
| JP2013050590A (en) * | 2011-08-31 | 2013-03-14 | Seiko Epson Corp | Liquid crystal device, method for manufacturing liquid crystal device, and electronic equipment |
| US20130154949A1 (en) * | 2011-12-15 | 2013-06-20 | Abbas Jamshidi Roudbari | Displays with Light-Curable Sealant |
-
2021
- 2021-03-12 CN CN202110270284.6A patent/CN115079457A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013050590A (en) * | 2011-08-31 | 2013-03-14 | Seiko Epson Corp | Liquid crystal device, method for manufacturing liquid crystal device, and electronic equipment |
| CN202372734U (en) * | 2011-12-15 | 2012-08-08 | 北京京东方光电科技有限公司 | Liquid crystal display |
| US20130154949A1 (en) * | 2011-12-15 | 2013-06-20 | Abbas Jamshidi Roudbari | Displays with Light-Curable Sealant |
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