CN115066476A - Silicone adhesive composition - Google Patents
Silicone adhesive composition Download PDFInfo
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- CN115066476A CN115066476A CN202080095822.6A CN202080095822A CN115066476A CN 115066476 A CN115066476 A CN 115066476A CN 202080095822 A CN202080095822 A CN 202080095822A CN 115066476 A CN115066476 A CN 115066476A
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- 239000000203 mixture Substances 0.000 title claims abstract description 106
- 239000013464 silicone adhesive Substances 0.000 title claims abstract description 49
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000003054 catalyst Substances 0.000 claims abstract description 14
- 125000000962 organic group Chemical group 0.000 claims abstract description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910004283 SiO 4 Inorganic materials 0.000 claims abstract description 13
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 11
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 11
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims description 56
- 239000000853 adhesive Substances 0.000 claims description 52
- 125000004432 carbon atom Chemical group C* 0.000 claims description 36
- 239000000126 substance Substances 0.000 claims description 21
- 125000001931 aliphatic group Chemical group 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 6
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 claims description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 229920002050 silicone resin Polymers 0.000 abstract description 11
- 150000002430 hydrocarbons Chemical group 0.000 description 28
- 238000005096 rolling process Methods 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 19
- -1 3,3, 3-trifluoropropyl group Chemical group 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 238000001723 curing Methods 0.000 description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 125000004122 cyclic group Chemical group 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000003472 neutralizing effect Effects 0.000 description 3
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- KJDMMCYMVUTZSN-UHFFFAOYSA-N (1-ethynylcyclohexyl)oxy-trimethylsilane Chemical compound C[Si](C)(C)OC1(C#C)CCCCC1 KJDMMCYMVUTZSN-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- ZCTILCZSUSTVHT-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-yloxy(trimethyl)silane Chemical compound CC(C)CC(C)(C#C)O[Si](C)(C)C ZCTILCZSUSTVHT-UHFFFAOYSA-N 0.000 description 1
- KBSDLBVPAHQCRY-UHFFFAOYSA-N 307496-19-1 Chemical group C1CC=CCC1CC[Si](O1)(O2)O[Si](O3)(C4CCCC4)O[Si](O4)(C5CCCC5)O[Si]1(C1CCCC1)O[Si](O1)(C5CCCC5)O[Si]2(C2CCCC2)O[Si]3(C2CCCC2)O[Si]41C1CCCC1 KBSDLBVPAHQCRY-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical class OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- RGMZNZABJYWAEC-UHFFFAOYSA-N Methyltris(trimethylsiloxy)silane Chemical compound C[Si](C)(C)O[Si](C)(O[Si](C)(C)C)O[Si](C)(C)C RGMZNZABJYWAEC-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005452 alkenyloxyalkyl group Chemical group 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- NFCHUEIPYPEHNE-UHFFFAOYSA-N bis(2,2-dimethylbut-3-ynoxy)-dimethylsilane Chemical compound C#CC(C)(C)CO[Si](C)(C)OCC(C)(C)C#C NFCHUEIPYPEHNE-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- SVBSJWKYFYUHTF-UHFFFAOYSA-N ethyl 2-butoxyacetate Chemical compound CCCCOCC(=O)OCC SVBSJWKYFYUHTF-UHFFFAOYSA-N 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000007759 kiss coating Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- IALUUOKJPBOFJL-UHFFFAOYSA-N potassium oxidosilane Chemical compound [K+].[SiH3][O-] IALUUOKJPBOFJL-UHFFFAOYSA-N 0.000 description 1
- CUQOHAYJWVTKDE-UHFFFAOYSA-N potassium;butan-1-olate Chemical compound [K+].CCCC[O-] CUQOHAYJWVTKDE-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- VNRWTCZXQWOWIG-UHFFFAOYSA-N tetrakis(trimethylsilyl) silicate Chemical compound C[Si](C)(C)O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C VNRWTCZXQWOWIG-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- NWMVPLQDJXJDEW-UHFFFAOYSA-N trimethyl(3-methylpent-1-yn-3-yloxy)silane Chemical compound CCC(C)(C#C)O[Si](C)(C)C NWMVPLQDJXJDEW-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The present invention is a silicone adhesive composition comprising: (A) an organopolysiloxane having two or more alkenyl-containing organic groups in one molecule and containing 0.0002 to 0.05 mol of alkenyl groups in 100 g; (B) containing R 2 3 SiO 1/2 Unit andSiO 4/2 units and in terms of mole ratio (R) 2 3 SiO 1/2 Unit)/(SiO 4/2 Unit) 0.6 to 1.0 of polyorganosiloxane; (C) r 3 e H f SiO (4‑e‑f)/2 A polyorganohydrogensiloxane having three or more Si-H groups in one molecule; (D) a platinum group metal-based catalyst for hydrosilylation addition of an alkenyl group in the composition and the Si — H group of the component (C) to cure the composition; (E) a silicone-free thermoplastic resin. Thus, a silicone adhesive composition is provided which has both high adhesion and high tackiness while controlling the adhesion properties by adding components other than silicone resin.
Description
Technical Field
The invention relates to an organic silicon adhesive with a novel composition.
Background
The adhesive is one of adhesives, and is often used in the form of an adhesive tape or an adhesive label obtained by coating an adhesive on a substrate and curing the adhesive, and the adhesive tape is a typical article among articles using an adhesive in general. These items are used in a variety of applications, such as labels for identifying items, for packaging goods, or for connecting multiple items, etc.
There are several types of base materials for constituting the adhesive, and they are roughly classified into rubbers, acrylics, silicones, and the like. Rubber adhesives are common base materials, have low prices, and are used in products such as general-purpose tapes. Acrylic adhesives use polyacrylate as a substrate, and are superior to rubbers in chemical properties and the like, and therefore are more suitable for high-functional adhesive products than rubbers. The silicone adhesive is composed of a silicone raw rubber (gum) and a silicone resin having high viscosity, and has various excellent characteristics because the main chain has a plurality of siloxane bonds, and specifically, heat resistance, cold resistance, weather resistance, chemical resistance, electrical insulation, and the like can be mentioned.
The silicone adhesive is used for industrial high-performance tapes such as heat-resistant tapes, masking tapes for engineering, and mica tapes having flame retardancy, because of the excellent properties described above, and is used in cases where the properties can be exhibited even under severe use conditions.
As described above, the main components of the silicone adhesive are gum and silicone resin, but the adhesion characteristics can be controlled by changing the blend of these two components (patent documents 1 to 3). Gums are base polymers which are soft and exhibit easy wetting properties on the surface, and silicone resins are used as tackifiers, which function to impart tackiness by being blended in the base polymers. Although the adhesion of the silicone adhesive composition can be certainly improved by adding the silicone resin, the increase in adhesion by adding the silicone resin is limited at present, and the characteristics of the adhesive obtained by merely changing the blend are limited. However, it is difficult to control the tack characteristics simply by ingredients other than the silicone resin, and it is difficult to perform compatibility with the base gum.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 5117713
Patent document 2: japanese patent No. 6091518
Patent document 3: japanese patent No. 6348434
Disclosure of Invention
Technical problem to be solved by the invention
Accordingly, an object of the present invention is to provide a silicone adhesive composition that can control the adhesive properties by adding components other than a silicone resin and that can achieve both high adhesion and high tack (tack).
Means for solving the problems
In order to solve the above-mentioned technical problems, the present invention provides a silicone adhesive composition comprising the following components:
(A) an organopolysiloxane having two or more alkenyl-containing organic groups in one molecule and containing 0.0002 to 0.05 mol of alkenyl groups per 100g, represented by the average compositional formula (1), in an amount of 60 to 30 parts by mass,
[ chemical formula 1]
In the formula (1), R 1 Is a monovalent hydrocarbon group having 1 to 10 carbon atoms, R is the same or different 1 Two or more of the organic groups contain an alkenyl group having 2 to 10 carbon atoms. a is an integer of 2 or more, b is an integer of 1 or more, c and d are integers of 0 or more, and a + b + c + d is not less than 50 and not more than 15000;
(B) containing R 2 3 SiO 1/2 Units and SiO 4/2 Units and in terms of mole ratio (R) 2 3 SiO 1/2 Unit)/(SiO 4/2 Unit) 0.6 to 1.0, 40 to 70 parts by mass of a polyorganosiloxane, wherein R is 2 Each independently represents a C1-10 monovalent hydrocarbon group or a C2-6 alkenyl group having no aliphatic unsaturated bond;
(C) a polyorganohydrogensiloxane having three or more Si-H groups in one molecule represented by the average compositional formula (2) in an amount such that the Si-H groups are in a molar ratio of 0.2 to 20 with respect to the alkenyl groups in the composition,
R 3 e H f SiO (4-e-f)/2 average composition formula (2)
In the formula (2), R 3 Represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms except for an aliphatic unsaturated group, e > 0, f > 0, and e + f is more than 0 and less than or equal to 3;
(D) a platinum group metal-based catalyst for curing the alkenyl group in the composition and the Si-H group of the component (C) by hydrosilylation addition, the amount of the metal being 1 to 500ppm relative to the total amount of the components (A) to (C);
(E) and (C) a silicon-free thermoplastic resin in an amount of 0.1 to 3 parts by mass based on the total amount of the components (A) to (C).
In such a composition, the adhesion properties can be controlled by adding components other than the silicone resin, and a high adhesion force and a high viscosity can be achieved at the same time.
In the present invention, the composition may further contain (F) a control agent, and the amount of the control agent (F) is 0.01 to 5 parts by mass relative to the total amount of the components (a) to (C).
Such a composition can further improve the effect of the present invention.
In the present invention, the component (E) may be a compound represented by the following formula (3).
[ chemical formula 2]
In the formula (3), R 4 、R 5 、R 6 Is a monovalent hydrocarbon group having 1 to 5 carbon atoms, m and n are integers of 1 or more, m is 1 or more and 20 or less, and n is 1 or less and 20 or less.
Such a component can control the tack property by adjusting the amount of addition and utilizing components other than the silicone resin, and can exhibit performance while being compatible with the base gum.
In the present invention, the hydroxyl value of the component (E) can be set to 10 to 300 mgOH/g.
Such a component can further improve the effect of the present invention.
Further, the present invention provides an adhesive article having a cured product of the silicone adhesive composition on one or both surfaces of a substrate.
With such a component, an adhesive article having both higher adhesive force and higher adhesive force than before can be obtained.
Effects of the invention
The silicone adhesive composition of the present invention can achieve both higher adhesive force and higher viscosity than conventional ones, and by using the composition, an adhesive article can be obtained that achieves both higher adhesive force and higher viscosity than conventional ones.
Detailed Description
As described above, development of a silicone adhesive composition having both high adhesion and high tackiness has been attempted.
The present inventors have conducted extensive studies to solve the above-mentioned problems, and as a result, have found that a silicone adhesive composition having both high adhesion and high tackiness can be obtained while controlling the tackiness characteristics by adding a silicon-free thermoplastic resin, and have completed the present invention.
That is, the present invention is a silicone adhesive composition characterized by containing the following components:
(A) an organopolysiloxane represented by the average compositional formula (1), having at least two alkenyl-containing organic groups in one molecule and containing 0.0002 to 0.05 mol of alkenyl groups per 100g, in an amount of 60 to 30 parts by mass,
[ chemical formula 3]
In the formula (1), R 1 Is a monovalent hydrocarbon group having 1 to 10 carbon atoms, which may be the same or different, and at least 2R 1 An alkenyl-containing organic group having 2 to 10 carbon atoms. a is an integer of 2 or more, b is an integer of 1 or more, c and d are integers of 0 or more, and a + b + c + d is not less than 50 and not more than 15000;
(B) containing R 2 3 SiO 1/2 Units and SiO 4/2 Units and in terms of mole ratio (R) 2 3 SiO 1/2 Unit)/(SiO 4/2 Unit) 0.6 to 1.0, 40 to 70 parts by mass of a polyorganosiloxane, wherein R is 2 Each independently represents a C1-10 monovalent hydrocarbon group or a C2-6 alkenyl group having no aliphatic unsaturated bond;
(C) a polyorganohydrogensiloxane having at least three Si-H groups in one molecule represented by the average compositional formula (2) in an amount such that the Si-H groups are in a molar ratio of 0.2 to 20 with respect to the alkenyl groups in the composition,
R 3 e H f SiO (4-e-f)/2 average composition formula (2)
In the formula (2), R 3 Represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms except for an aliphatic unsaturated group, e > 0, f > 0, and e + f is more than 0 and less than or equal to 3;
(D) a platinum group metal-based catalyst for curing the alkenyl group in the composition by hydrosilylation addition to the Si-H group of the component (C), in which the amount of the metal is 1 to 500ppm based on the total amount of the components (A) to (C),
(E) and (C) a silicon-free thermoplastic resin in an amount of 0.1 to 3 parts by mass based on the total amount of the components (A) to (C).
The present invention will be described in detail below, but the present invention is not limited to these contents.
[ (A) component ]
(A) The component (A) is an organopolysiloxane represented by the following average composition formula (1), having at least two alkenyl-containing organic groups in one molecule, and containing 0.0002-0.05 mol of alkenyl groups in 100 g.
[ chemical formula 4]
In the formula (1), R 1 Optionally, the monovalent hydrocarbon groups are the same or different and each has 1 to 10 carbon atoms, R 1 At least two of the organic groups contain an alkenyl group having 2 to 10 carbon atoms. a is an integer of 2 or more, b is an integer of 1 or more, c and d are integers of 0 or more, and a + b + c + d is 50 or more and 15000 or less.
R 1 Is a monovalent hydrocarbon group having 1 to 10 carbon atoms, wherein 2 or more of the monovalent hydrocarbon groups are alkenyl-containing organic groups having 2 to 10 carbon atoms. R 1 The number of the alkenyl group-containing organic group having 2 to 10 carbon atoms of (A) is not particularly limited as long as it is 2 or more, and all R's may be 1 Is an alkenyl-containing organic group having 2 to 10 carbon atoms.
Specific examples of the monovalent hydrocarbon group include alkyl groups such as methyl, ethyl, propyl, and butyl; cycloalkyl groups such as cyclohexyl; examples of the "aryl" group include phenyl and the like, and some or all of the hydrogen atoms bonded to carbon atoms of these groups may be substituted with a halogen atom or another group, and examples thereof include a trifluoromethyl group, a 3,3, 3-trifluoropropyl group and the like. Among the above groups, saturated aliphatic groups or aromatic groups are preferable, and methyl groups and phenyl groups are particularly preferable.
The alkenyl-containing organic group is a group having 2 to 10 carbon atoms, and examples thereof include alkenyl groups such as vinyl, allyl, hexenyl, and octenyl; acryloylalkyl groups and methacryloylalkyl groups such as acryloylpropyl, acryloylmethyl and methacryloylpropyl groups; cycloalkenylalkyl groups such as cyclohexenylethyl; alkenyloxyalkyl such as vinyloxypropyl, and the like. Among these groups, vinyl groups are particularly preferable.
The amount of alkenyl groups contained in the component (A) is 0.0002 to 0.05 mol, preferably 0.0004 to 0.04 mol, and more preferably 0.0005 to 0.03 mol per 100g of organopolysiloxane. When the amount is less than 0.0002 mol, the crosslinking density is decreased, and cohesive failure of the adhesive layer may occur, and when the amount is more than 0.05 mol, the adhesive layer becomes hard, and appropriate adhesive force or tackiness may not be obtained.
In the average composition formula (1), a is an integer of 2 or more, b is an integer of 1 or more, c and d are integers of 0 or more, 50. ltoreq. a + b + c + d. ltoreq.15000, preferably 200. ltoreq. a + b + c + d. ltoreq.12000. When a + b + c + d is less than 50, the crosslinking point becomes too much to slow the reaction, and when a + b + c + d is more than 15000, the viscosity of the composition becomes very high, and thus the workability becomes poor.
(A) The component (a) is usually produced by ring-opening polymerization of a cyclic low-molecular siloxane such as octamethylcyclotetrasiloxane using a catalyst, but since the cyclic low-molecular siloxane as a raw material is contained after the polymerization, it is preferable to use a product obtained by distilling off an inert gas while passing the inert gas through a reaction product under heating and reduced pressure.
Examples of the component (a) include, but are not limited to, compounds represented by the following general formula.
R 1-1 R 1-2 2 SiO(R 1-2 2 SiO) p SiR 1-2 2 R 1-1
R 1-1 R 1-2 2 SiO(R 1-2 2 SiO) p (R 1-1 R 1-2 SiO) q SiR 1-2 2 R 1-1
R 1-1 3 SiO(R 1-2 2 SiO) p (R 1-1 R 1-2 SiO) q SiR 1-1 3
R 1-2 3 SiO(R 1-2 2 SiO) p (R 1-1 R 1-2 SiO) q SiR 1-2 3
In the above formula, R 1-1 Each being a same or different species of organic group containing an alkenyl group, R 1-2 Respectively are the same or different monovalent hydrocarbon groups with 1-10 carbon atoms and no aliphatic unsaturated bonds, p is not less than 47, q is not less than 1, wherein when the molecule does not have a substituent (R) 1-1 R 1-2 SiO) q R other than R 1-1 When q is more than or equal to 2.
As R 1-1 、R 1-2 Examples thereof include the above-mentioned groups R 1 The groups exemplified in (1). In addition, 47. ltoreq. p.ltoreq. 11,998 is preferable, 1. ltoreq. q.ltoreq.1,000 is preferable, and 2. ltoreq. q.ltoreq.800 is more preferable.
The component (a) is more specifically a compound represented by the following general formula, but is not limited thereto. In the following formulae, Me, Vi and Ph represent a methyl group, a vinyl group and a phenyl group, respectively.
[ chemical formula 5]
[ chemical formula 6]
[ chemical formula 7]
[ chemical formula 8]
[ chemical formula 9]
[ (B) component ]
(B) Component (A) contains R 2 3 SiO 1/2 Unit (R) 2 Independently represents a C1-10 monovalent hydrocarbon group or a C2-6 alkenyl group having no aliphatic unsaturated bond) and SiO 4/2 Units and in terms of mole ratio (R) 2 3 SiO 1/2 Unit)/(SiO 4/2 Unit) of 0.6 to 1.0, preferably 0.65 to 0.9. If the molar ratio is less than 0.6, the adhesive force or tackiness may decrease, and if the molar ratio is more than 1.0, the adhesive force or holding power may decrease.
R 2 Each independently represents a C1-10 monovalent hydrocarbon group or C2-6 alkenyl group having no aliphatic unsaturated bond, and R is 2 Examples of the monovalent hydrocarbon group having 1 to 10 carbon atoms include alkyl groups such as methyl, ethyl, propyl and butyl groups, and alkyl groups having 2 to 6 carbon atoms are preferable; aryl groups such as phenyl and tolyl, preferably aryl groups having 6 to 10 carbon atoms. Examples of the alkenyl group having 2 to 6 carbon atoms include a vinyl group, an allyl group, and a butenyl group.
Two or more components (B) may be used simultaneously. Further, R may be contained in the component (B) as required 2 SiO 3/2 Unit, R 2 2 SiO 2/2 And (4) units.
The component (B) may be one obtained by condensing a hydrolyzable group present on the surface thereof in the presence of a catalyst. Thus, the effect of improving the adhesive force of the adhesive composition can be expected as long as the reaction is carried out at room temperature to reflux using a basic catalyst and the reaction is neutralized as necessary.
Examples of the basic catalyst include metal hydroxides such as lithium hydroxide, sodium hydroxide, potassium hydroxide, and calcium hydroxide; carbonates such as sodium carbonate and potassium carbonate; bicarbonates such as sodium bicarbonate and potassium bicarbonate; metal alkoxides such as sodium methoxide and potassium butoxide; organic metals such as butyl lithium; potassium silanolate; and nitrogen compounds such as ammonia, ammonia water, methylamine, trimethylamine, and triethylamine, and the like, preferably ammonia or ammonia water. The condensation reaction may be carried out at a temperature ranging from room temperature to the reflux temperature of the organic solvent. The reaction time is not particularly limited, and may be 0.5 to 20 hours, preferably 1 to 16 hours.
Further, after the completion of the reaction, a neutralizing agent for neutralizing the basic catalyst may be added as needed. Examples of the neutralizing agent include acidic gases such as hydrogen chloride and carbon dioxide; organic acids such as acetic acid, octanoic acid, and citric acid; and inorganic acids such as hydrochloric acid, sulfuric acid, and phosphoric acid. When ammonia gas, ammonia water or a low-boiling amine compound is used as the basic catalyst, an inert gas such as nitrogen gas may be introduced for distillation.
(A) The amount of the component (A) is 60 to 30 parts by mass, the amount of the component (B) is 40 to 70 parts by mass, and the ratio of the components (A) and (B) is 60/40 to 30/70 by mass, more preferably 55/45 to 35/65 by mass. When the total of the components (a) and (B) is 100, the compatibility with the component (E) described later may be poor if the proportion of the component (B) is less than 40, and the heat resistance of the composition may be poor if the proportion of the component (B) is more than 70.
[ (C) ingredient ]
(C) The component (A) is a polyorganohydrogensiloxane having at least three Si-H groups in one molecule represented by the average compositional formula (2).
R 3 e H f SiO (4-e-f)/2 Average composition formula (2)
In the formula (2), R 3 Represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms except for an aliphatic unsaturated group, e > 0, f > 0, and 0 < e + f < 3.
R 3 Is a monovalent hydrocarbon group having 1 to 10 carbon atoms excluding an aliphatic unsaturated group. Specifically, examples thereof include alkyl groups such as methyl, ethyl, propyl and butyl; cycloalkyl groups such as cyclohexyl; aryl groups such as phenyl, and the like, and further, some or all of the hydrogen atoms bonded to carbon atoms of these groups may be substituted with halogen atoms or other groups, and trifluoromethyl, 33-trifluoropropyl, and the like. The monovalent hydrocarbon group is preferably a saturated aliphatic group or aromatic group, and particularly preferably a methyl group or a phenyl group.
In the average composition formula (2), e and f are numbers satisfying e > 0, f > 0 and 0 < e + f.ltoreq.3, and preferably numbers satisfying e > 0, f > 0 and 0 < e + f < 3.
(C) The component (b) may be a compound represented by the following general formula (4), but is not limited thereto.
R 7 3 Si-O-(SiR 8 2 -O) r -(SiR 9 H-O) s -O-SiR 10 3 General formula (4)
In the general formula (4), R 7 、R 10 Each represents a monovalent hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom other than an aliphatic unsaturated group, R 8 、R 9 Each represents a monovalent hydrocarbon group having 1 to 10 carbon atoms excluding an aliphatic unsaturated group, r is 0. ltoreq. r.ltoreq.100, and s is 3. ltoreq. s.ltoreq.80.
R 8 、R 9 Each represents a monovalent hydrocarbon group having 1 to 10 carbon atoms other than the aliphatic unsaturated group, and examples thereof include alkyl groups such as methyl, ethyl, propyl, and butyl; cycloalkyl groups such as cyclohexyl; aryl groups such as phenyl and the like. Further, in these groups, some or all of hydrogen atoms bonded to carbon atoms may be substituted with a halogen atom or other groups, and examples thereof include a trifluoromethyl group, a 3,3, 3-trifluoropropyl group and the like. As R 8 、R 9 Saturated aliphatic groups or aromatic groups are preferable, and methyl groups or phenyl groups are particularly preferable.
R 7 、R 10 Each is a monovalent hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom other than the aliphatic unsaturated group. As R 7 、R 10 The monovalent hydrocarbon group having 1 to 10 carbon atoms is exemplified by the same groups as those described above, r is 0. ltoreq. r.ltoreq.100, preferably 0. ltoreq. r.ltoreq.80 or 0 < r.ltoreq.80, s is 3. ltoreq. s.ltoreq.80, preferably 4. ltoreq. s.ltoreq.70.
The amount of the component (C) is preferably 0.2 to 20, particularly preferably 0.5 to 15, in terms of the molar ratio of the Si-H groups in the component (C) to the alkenyl groups in the composition. When the crosslinking density is less than 0.2, the cohesive force and holding force may be low. If the amount is more than 20, the crosslinking density increases, and appropriate adhesive force and tackiness may not be obtained.
(C) The component (b) is usually produced by ring-opening polymerization of a cyclic low-molecular siloxane such as octamethylcyclotetrasiloxane and a siloxane having Si — H such as tetramethylcyclotetrasiloxane using an acid catalyst, but since the cyclic low-molecular siloxane is contained as a raw material after the polymerization, it is preferable to use a compound obtained by distilling off the cyclic low-molecular siloxane while passing an inert gas into a reaction product under heating and reduced pressure.
Examples of the general formula representing the specific structure of component (C) include, but are not limited to, chemical formulas represented by the following general formulae. In addition, Me in the following general formula represents a methyl group.
[ chemical formula 10]
[ (D) component ]
(D) The component (C) is a platinum group metal-based catalyst for curing by hydrosilylation addition of the alkenyl group in the composition and the Si — H group in the component (C), and examples of the central metal include platinum, palladium, iridium, rhodium, osmium, ruthenium, and the like, and platinum is preferable. Examples of the platinum catalyst include chloroplatinic acid, an alcohol solution of chloroplatinic acid, a reactant of chloroplatinic acid and an alcohol, a reactant of chloroplatinic acid and an olefin compound, and a reactant of chloroplatinic acid and a vinyl group-containing siloxane.
The content of the component (D) is preferably 1 to 500ppm, more preferably 2 to 450ppm, in terms of mass, of the metal relative to the total amount of the components (A), (B) and (C). If the amount is less than 1ppm, the reaction is retarded and curing is insufficient, and thus various properties such as adhesive force and holding force may not be exhibited. If the amount exceeds 500ppm, the cured product may have poor flexibility.
[ (E) ingredient ]
(E) The component is a silicon-free thermoplastic resin. The thermoplastic resin is not particularly limited as long as it is a silicon-free thermoplastic resin, and specific examples thereof include those represented by the following formula (3).
[ chemical formula 11]
In the formula (3), R 4 、R 5 、R 6 The monovalent hydrocarbon groups have 1 to 5 carbon atoms, m and n are integers of 1 or more, m is 1 or more and 20 or less, and n is 1 or less and 20 or less.
With such a structure, by adjusting the amount of addition, the adhesive properties can be controlled by the components other than the silicone resin, and the resin can exhibit performance while being compatible with the base gum.
R 4 、R 5 、R 6 And optionally, the monovalent hydrocarbon groups are the same or different and each has 1 to 5 carbon atoms. Specific examples of the monovalent hydrocarbon group include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, and pentyl, and some or all of hydrogen atoms bonded to carbon atoms of these groups may be substituted with halogen atoms or other groups, and examples thereof include trifluoromethyl and 3,3, 3-trifluoropropyl. The monovalent hydrocarbon group is preferably a saturated aliphatic group, and particularly preferably a methyl group.
Wherein m and n are integers of 1 or more, 1. ltoreq. m.ltoreq.20, 1. ltoreq. n.ltoreq.20, preferably 2. ltoreq. m.ltoreq.15, 2. ltoreq. n.ltoreq.15, more preferably 2. ltoreq. m.ltoreq.10, 2. ltoreq. n.ltoreq.10.
(E) The hydroxyl value of the component (A) may be 10 to 300mgOH/g, preferably 15 to 280mgOH/g, and more preferably 20 to 250 mgOH/g. When the hydroxyl value is not less than 10mgOH/g, suitable adhesive properties can be obtained, and when the hydroxyl value is not more than 300mgOH/g, the adhesive is sufficiently compatible with the silicone adhesive composition as a base.
The content of the component (E) is 0.1 to 3 parts by mass, preferably 0.2 to 2.8 parts by mass, and more preferably 0.3 to 2.5 parts by mass, relative to the total amount of the components (A) to (C). If the amount is less than 0.1 parts by mass, the adhesive properties may not be sufficiently changed, and if the amount is more than 3 parts by mass, the function as a silicone adhesive may be adversely impaired, specifically, the heat resistance may be impaired.
[ (F) ingredient ]
(F) The component (A) is a control agent which is added for preventing the thickening or gelling of the treatment liquid by inducing an addition reaction before heat curing when the silicone adhesive composition is prepared or applied to a substrate. The control agent inhibits addition reaction by coordinating with a platinum group metal as an addition reaction catalyst, and exhibits catalytic activity by breaking the coordination when heat curing is performed thereon. The control agents conventionally used in addition reaction-curable silicone compositions can be used. Specific examples thereof include 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3, 5-dimethyl-1-hexyn-3-ol, 1-ethynylcyclohexanol, 3-methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3, 5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1-trimethylsiloxycyclohexane, bis (2, 2-dimethyl-3-butynyloxy) dimethylsilane, 1,3,5, 7-tetramethyl-1, 3,5, 7-tetravinylcyclotetrasiloxane, 1,3, 3-tetramethyl-1, 3-divinyldisiloxane, maleate, adipate, and the like.
The content of component (F) may be 0.01 to 5 parts by mass, preferably 0.02 to 4 parts by mass, and more preferably 0.03 to 3 parts by mass, relative to the total amount of components (A) to (C). When the amount is 0.01 parts by mass or more, a sufficient pot life (pot life) can be obtained, and when the amount is 5 parts by mass or less, reactivity is not deteriorated due to too strong controllability.
[ organic solvent ]
When all the components are mixed, the viscosity may be increased to make handling difficult, and therefore, a solvent may be optionally added for dilution. Examples of the solvent include aromatic hydrocarbon solvents such as toluene and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane, isooctane, decane, cyclohexane, methylcyclohexane, and isoparaffin (isoparaffine); hydrocarbon solvents such as industrial gasoline, petroleum ether, solvent naphtha (solvent naphtha); ketone solvents such as acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, 2-heptanone, 4-heptanone, methyl isobutyl ketone, diisobutyl ketone, diacetone, and cyclohexanone; ester solvents such as ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, and the like; ether solvents such as diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, 1, 2-dimethoxyethane, and 1, 4-dioxane; solvents having an ester moiety and an ether moiety, such as ethyl 2-methoxyacetate, ethyl 2-ethoxyacetate, propylene glycol monomethyl ether acetate, and ethyl 2-butoxyacetate; siloxane-based solvents such as hexamethyldisiloxane, octamethyltrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, tris (trimethylsiloxy) methylsilane, and tetrakis (trimethylsiloxy) silane; or a mixed solvent of these solvents.
[ method of Using Silicone adhesive composition ]
In general, a catalyst is not mixed with the silicone adhesive composition in many cases, but in the present invention, the catalyst is uniformly mixed and used before actual use.
As the substrate to which the silicone adhesive composition is applied, paper, a plastic film, glass, or metal can be selected. Examples of the paper include coated paper, glassine paper, polyethylene laminated paper, and kraft paper. Examples of the plastic film include a polyethylene film, a polypropylene film, a polyester film, a polyimide film, a polyvinyl chloride film, a polyvinylidene chloride film, a polyvinyl alcohol film, a polycarbonate film, a polytetrafluoroethylene film, a polystyrene film, an ethylene-vinyl acetate copolymer film, an ethylene-vinyl alcohol copolymer film, a triacetyl cellulose film, a polyether ether ketone film, and a polyphenylene sulfide film. The thickness, type, and the like of the glass are not particularly limited, and the glass may be chemically strengthened or the like. Glass fibers can be used as appropriate, and glass fibers can be used alone or in combination with other resins. Examples of the metal include aluminum foil, copper foil, gold foil, silver foil, and nickel foil. Among these substrates, the silicone adhesive composition is particularly used mostly as a substrate for a plastic film.
The coating method may be any known coating method, and examples thereof include comma coating, lip coating, roll coating, die coating, blade coating, bar coating, kiss coating, gravure coating, screen coating, dip coating, and cast coating.
The coating amount is not particularly limited, but the coating amount can be set to 0.1 to 300 μm, preferably 0.5 to 200 μm.
The curing conditions are not limited thereto, as long as the curing is carried out at 80 to 150 ℃ for 20 seconds to 10 minutes.
[ adhesive article ]
In this way, an adhesive article having a cured product of the silicone adhesive composition on at least one surface of a substrate can be produced.
Examples
The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to these examples and comparative examples. In addition, Me and Vi below represent methyl and vinyl, respectively.
[ example 1]
A silicone adhesive composition was prepared by adding the following components (in terms of molar ratio, the Si-H group in component (C) was 10.5 times as large as the vinyl group in the composition):
35 parts by mass of a component (A) which is a polysiloxane (a-1) represented by the following average composition formula (A-1),
[ chemical formula 12]
A component (B) containing Me in an amount of 65 parts by mass based on the nonvolatile matter 3 SiO 1/2 Unit and SiO 4/2 Units and in terms of mole ratio (Me) 3 SiO 1/2 Unit)/(SiO 4/2 Unit) was 0.85 of a 60 mass% toluene solution of methylpolysiloxane (b-1),
0.35 parts by mass of a component (C) which is methylhydrogenpolysiloxane (C-1) represented by the following average compositional formula (C-1),
[ chemical formula 13]
0.5 parts by mass of a component (E) which is a thermoplastic resin (E-1) (hydroxyl value: 54mgOH/g) represented by the following formula (E-1),
[ chemical formula 14]
0.25 part by mass of a component (F) which is ethynylcyclohexanol,
0.5 part by mass of component (D), which is a platinum component toluene solution (D-1) containing 0.5% by mass of 1, 3-divinyl-1, 1,3, 3-tetramethyldisiloxane platinum (0) complex.
The adhesive force and rolling ball tack were evaluated using the composition in the manner described below.
Comparative example 1
A silicone adhesive composition containing no component (E) relative to the composition of example 1 was prepared, and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
Comparative example 2
A silicone adhesive composition in which the component (B) was added in an amount equivalent to and in place of the component (E) in the composition of example 1 was prepared, and the adhesive force and the rolling ball tack were evaluated using this composition.
[ example 2]
A silicone adhesive composition was prepared in the same manner as in example 1, except that the amount of the component (E) added was 1.0 part by mass, and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
Comparative example 3
A silicone adhesive composition in which the component (B) was added in an amount equivalent to and in place of the component (E) in the composition of example 2 was prepared, and the adhesive force and the rolling ball tack were evaluated using this composition.
[ example 3]
A silicone adhesive composition was prepared in the same manner as in example 1, except that the amount of the component (E) added was 1.5 parts by mass, and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
Comparative example 4
A silicone adhesive composition in which the component (B) was added in an amount equivalent to and in place of the component (E) in the composition of example 3 was prepared, and the adhesive force and the rolling ball tack were evaluated using this composition.
[ example 4]
A silicone adhesive composition was prepared in the same manner as in example 1, except that the amount of the component (E) added was 2.0 parts by mass, and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
Comparative example 5
A silicone adhesive composition in which the component (B) was added in an amount equivalent to and in place of the component (E) in the composition of example 4 was prepared, and the adhesive force and the rolling ball tack were evaluated using this composition.
Comparative example 6
A silicone adhesive composition in which component (B) was added in an amount of 4.0 parts by mass based on the composition of comparative example 1 was prepared, and the adhesive force and the rolling ball tackiness were evaluated using the composition.
[ example 5]
A silicone adhesive composition was prepared in the same manner as in example 1, except that the component (E) was changed to 1.0 part by mass of the thermoplastic resin (E-2) (hydroxyl value: 163mgOH/g) represented by the following formula (E-2), and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
[ chemical formula 15]
[ example 6]
A silicone adhesive composition was prepared in the same manner as in example 2, except that the amount of component (a-1) was 50 parts by mass, the amount of component (B-1) was 50 parts by mass, and the amount of component (C-1) was 0.50 parts by mass, and using this composition, the adhesive force and the rolling ball tack were evaluated (in terms of molar ratio, the Si-H group in component (C) was 10.5 times the vinyl group in the composition).
Comparative example 7
A silicone adhesive composition containing no component (E) relative to the composition of example 6 was prepared, and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
[ example 7]
A silicone adhesive composition was prepared in the same manner as in example 2 except that 50 parts by mass of polysiloxane (a-2) represented by the following formula (A-2) was used in place of (a-1) of component (A), the amount of (B-1) of component (B) was 50 parts by mass, and the amount of (C-1) of component (C) was 0.37 parts by mass, and using this composition, the adhesive force and the rolling ball tack were evaluated (in terms of molar ratio, the Si-H group in component (C) was 5.6 times the vinyl group in the composition).
[ chemical formula 16]
Comparative example 8
A silicone adhesive composition containing no component (E) relative to the composition of example 7 was prepared, and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
[ example 8]
Except that Me was used in an amount of 50 parts by mass in terms of nonvolatile matter 3 SiO 1/2 Unit and SiO 4/2 Units and in terms of mole ratio (Me) 3 SiO 1/2 Unit)/(SiO 4/2 Unit) a 60 mass% toluene solution of methylpolysiloxane (B-2) of 0.75 instead of component (B-1) of component (B), the amount of component (C-1) of component (C) was made 0.50 parts by mass, and 1.0 part by mass of thermoplastic resin (E-1) (hydroxyl value: 54mgOH/g) was prepared in the same manner as in comparative example 7, and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
Comparative example 9
A silicone adhesive composition containing no component (E) relative to the composition of the example 8 was prepared, and using this composition, the adhesive force and the rolling ball tackiness were evaluated.
[ adhesion force ]
The silicone adhesive composition solution was coated on a PET film having a thickness of 23 μm and a width of 25mm using a coater so that the thickness after curing was 30 μm, and then heated and cured under a condition of 130 ℃/1 minute, thereby preparing an adhesive tape. The adhesive tape was adhered to a glass plate, and pressure-bonded by reciprocating twice using a roller having a weight of 2kg and covered with a rubber layer. The glass plate to which the adhesive tape was applied was put in a constant temperature bath in which a certain humidity and temperature were set and taken out after a prescribed number of days, and the force (N/25mm) required to peel the adhesive tape from the glass plate at a speed of 300 mm/min at an angle of 180 ° was measured using a tensile tester.
[ Rolling ball tack ]
The silicone adhesive composition solution was coated on a PET film having a thickness of 23 μm and a width of 25mm using a coater so that the thickness after curing was 30 μm, and then heated and cured under a condition of 130 ℃/1 minute, thereby preparing an adhesive tape. The steel ball was placed on a slope with an inclination angle of 30 ° with the adhesive surface of the tape facing upward, and was rolled from a position with a run-up distance of 10cm, and the maximum value of the steel ball stopped in the range of the adhesive layer was evaluated. The size of the rolling ball is 32 for a steel ball with a diameter of 1 inch and 1 for a steel ball with a diameter of 1/32 inches, and a steel ball with a larger stop value indicates a larger viscosity value.
The results of examples 1 to 8 and comparative examples 1 to 9 are shown together in Table 1.
It is understood from example 1 and comparative example 1 that the adhesion was improved by adding component (E), while in comparative example 2, component (B) was added in an amount equal to that of component (E), but the increase in adhesion was not as great as in example 1. Similarly, in examples 2 to 4 and comparative examples 3 to 5, it was found that the adhesion of the composition containing the component (E) was improved when the adhesion was increased by the amount of the component (E) compared with the adhesion when the component (E) was replaced by the same amount of the component (B). In comparative example 6, component (B) was further added for the purpose of providing an adhesive force comparable to those of examples 2 and 3, but the value of the adhesive force was lowered. From this, it is found that the addition of the component (E) can control the tack properties, which have been difficult to achieve in silicone adhesive compositions so far, i.e., can achieve both high tack and high rolling ball tack.
In example 5, although the component (E) having a different structure was added, the increase in the adhesive force was confirmed as in the other examples. In examples 6 to 8 and comparative examples 7 to 9, although the composition of the silicone adhesive composition was changed as the base, in any case, it was confirmed that the adhesive force was increased by the addition of the component (E).
Thus, according to the present invention, a silicone adhesive composition having both high adhesion and high viscosity, which has been difficult to obtain, can be obtained.
The present invention is not limited to the above embodiments. The above embodiments are illustrative, and any embodiments having substantially the same composition as the technical idea described in the claims of the present invention and exhibiting the same operational effects are included in the technical scope of the present invention.
Claims (5)
1. A silicone adhesive composition characterized by comprising the following components:
(A) an organopolysiloxane having two or more alkenyl-containing organic groups in one molecule and containing 0.0002 to 0.05 mol of alkenyl groups per 100g, represented by the average compositional formula (1), in an amount of 60 to 30 parts by mass,
[ chemical formula 1]
In the formula (1), R 1 Is a monovalent hydrocarbon group having 1 to 10 carbon atoms, R is the same or different 1 Wherein 2 or more of the alkenyl-containing organic groups have 2 to 10 carbon atoms, a is an integer of 2 or more, b is an integer of 1 or more, c and d are integers of 0 or more, and 50. ltoreq. a + b + c + d. ltoreq.15000;
(B) containing R 2 3 SiO 1/2 Units and SiO 4/2 Units and in terms of mole ratio (R) 2 3 SiO 1/2 Unit)/(SiO 4/2 Unit) 0.6 to 1.0, 40 to 70 parts by mass of a polyorganosiloxane, R 2 Each independently represents a C1-10 monovalent hydrocarbon group or a C2-6 alkenyl group having no aliphatic unsaturated bond;
(C) a polyorganohydrogensiloxane having three or more Si-H groups in one molecule represented by the average compositional formula (2) in an amount such that the Si-H groups are in a molar ratio of 0.2 to 20 with respect to the alkenyl groups in the composition,
R 3 e H f SiO (4-e-f)/2 average composition formula (2)
In the formula (2), R 3 Represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms except for an aliphatic unsaturated group, e > 0, f > 0, and e + f is more than 0 and less than or equal to 3;
(D) a platinum group metal catalyst for curing by hydrosilylation addition of alkenyl groups in the composition and Si-H groups of the component (C), in which the amount of the metal is 1 to 500ppm relative to the total amount of the components (A) to (C);
(E) and (C) a silicon-free thermoplastic resin in an amount of 0.1 to 3 parts by mass based on the total amount of the components (A) to (C).
2. The silicone adhesive composition according to claim 1, further comprising (F) a control agent, wherein the control agent (F) is 0.01 to 5 parts by mass relative to the total amount of the components (A) to (C).
3. The silicone adhesive composition according to claim 1 or 2, wherein the component (E) is a compound represented by the following formula (3),
[ chemical formula 2]
In the formula (3), R 4 、R 5 、R 6 Is a monovalent hydrocarbon group having 1 to 5 carbon atoms, m and n are integers of 1 or more, m is 1. ltoreq. m.ltoreq.20, and n is 1. ltoreq. n.ltoreq.20.
4. The silicone adhesive composition according to any one of claims 1 to 3, wherein the hydroxyl value of the component (E) is 10 to 300 mgOH/g.
5. An adhesive article characterized by having a cured product of the silicone adhesive composition according to any one of claims 1 to 4 on one or both surfaces of a substrate.
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- 2020-02-25 JP JP2020029506A patent/JP7321954B2/en active Active
- 2020-12-10 KR KR1020227027126A patent/KR20220146433A/en active Search and Examination
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JP2021134244A (en) | 2021-09-13 |
JP7321954B2 (en) | 2023-08-07 |
WO2021171734A1 (en) | 2021-09-02 |
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