CN115064384B - Production process of capacitor - Google Patents
Production process of capacitor Download PDFInfo
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- CN115064384B CN115064384B CN202210846653.6A CN202210846653A CN115064384B CN 115064384 B CN115064384 B CN 115064384B CN 202210846653 A CN202210846653 A CN 202210846653A CN 115064384 B CN115064384 B CN 115064384B
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- lead
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- powder
- namely
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- 239000003990 capacitor Substances 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 37
- 239000000843 powder Substances 0.000 claims abstract description 32
- 238000012360 testing method Methods 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 18
- 239000004593 Epoxy Substances 0.000 claims abstract description 8
- 238000007648 laser printing Methods 0.000 claims abstract description 7
- 229920002545 silicone oil Polymers 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000005538 encapsulation Methods 0.000 claims abstract description 4
- 230000002950 deficient Effects 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 238000007598 dipping method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 239000013256 coordination polymer Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000009966 trimming Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/04—Drying; Impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Abstract
The invention relates to a production process of a capacitor, which comprises the following steps: step one, arranging leads; step two, enabling; step three, welding; step four, burr burning; step five, coating silicone oil; step six, preheating; step seven, encapsulating epoxy; step eight, inner soaking and curing; step nine, powder encapsulation; step ten, cutting the powder into pins; step eleven, solidifying the powder; step twelve, laser printing; thirteenth step, testing; fourteen, checking the appearance of the CCD; fifteen, sorting capacity grades; sixthly, pulling out feet and molding. By adopting the scheme, the capacitor can be produced and processed, and the processing efficiency is improved.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a production process of a capacitor.
Background
A capacitor is a device that holds electrical charge. The circuit is one of electronic elements widely used in electronic equipment, and is widely applied to the aspects of blocking, coupling, bypass, filtering, tuning loop, energy conversion, control and the like in a circuit.
The manufacture of the existing film capacitor mainly comprises the following steps: the core can be manufactured by overlapping a metal foil (the metal foil is used as an electrode) and a plastic film and then winding the metal foil and the plastic film together, or by evaporating a layer of very thin metal (the metal layer on the evaporation is used as the electrode) on the plastic film to obtain a metallized film and then winding the metallized film to manufacture the core; the wound core is generally cylindrical (a hot pressing mode is also generally adopted to clamp the cylindrical core to prepare a flat cylindrical core); and then, respectively spraying metal on two ends of the core.
In order to perform subsequent operations such as energizing, welding, packaging and the like on the metal sprayed core, an efficient production process is required to finish the production of the finished capacitor product.
Disclosure of Invention
The invention overcomes the defects of the prior art, and provides a production process of the capacitor, which can realize the production and processing of the capacitor and improve the processing efficiency.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: a process for producing a capacitor, comprising the steps of:
step one, arranging leads, namely cutting the leads, bending the leads to form U-shaped leads, conveying the adhesive tape and the paper tape vertically correspondingly, pushing the U-shaped leads between the adhesive tape and the paper tape, and sticking the U-shaped leads on the paper tape by pressing the adhesive tape to form a lead tape, wherein the U-shaped leads are distributed on the lead tape at intervals, two end pins of the U-shaped leads and a U-shaped tail ring are exposed out of the paper tape, and the lead tape is automatically conveyed;
step two, enabling, namely conveying cores subjected to metal spraying treatment to a clamp of an enabling device one by one, completing one-time charging and discharging treatment on the enabling device by each core, and conveying qualified products to a welding device after testing the standard value of capacity, the upper and lower deviation and the upper limit value of loss value by a digital bridge;
step three, welding, wherein the welding device carries out welding operation on the energized cores and the U-shaped leads on the lead belt one by one, so that the two conductive ends of the cores are respectively welded on the two end pins of the U-shaped leads, and the cores are conveyed along with the lead belt;
fourthly, deburring, namely blowing hot air into the welded lead belt to bake the burrs;
step five, silicone oil coating is carried out on the two end feet of the U-shaped lead;
step six, preheating, namely conveying the lead belt coated with the silicone oil to a heating box, and drying at the temperature of 70-100 ℃;
step seven, encapsulating epoxy, namely dipping cores on the lead tapes into epoxy resin paint;
step eight, inner dipping and curing, namely curing the paint-dipped core at 60-100 ℃ to form an epoxy resin layer on the outer surface of the core;
step nine, powder encapsulation, namely heating a powder groove, immersing cores on a lead belt into powder in the powder groove, and performing powder dipping operation;
step ten, cutting pins of the powder, and cutting off the powder stuck on the lead;
step eleven, curing the powder, namely curing the powder-dipped core at 60-100 ℃ to form an epoxy powder outer layer on the surface of the epoxy resin layer, so as to form a capacitor product;
step twelve, laser printing, wherein the laser flying marking mechanism performs laser printing operation on the outer surface of the capacitor;
thirteenth, testing, namely sequentially performing CP testing on the capacitor, cutting off the CP defective products, performing DC withstand voltage charge and discharge testing on the capacitor, performing DC2 withstand voltage testing on the capacitor, cutting off the DC defective products, performing IR charge and discharge testing on the capacitor, and cutting off the IR defective products;
fourteen, checking the appearance of the CCD, detecting the appearance of the capacitor through a CCD detector, and cutting off the bad capacitor of the CCD;
fifteen, sorting capacity grades, namely sorting high-frequency capacity grades and sorting non-high-frequency capacity grades, cutting off defective products of high-frequency test capacities and cutting off defective products of non-high-frequency test capacities;
sixteenth, pin pulling/forming, and after capacity grade sorting, pin pulling and receiving or pin cutting and receiving are respectively carried out on the capacitor through a blanking device, and blanking operation of the capacitor is carried out.
The invention is further provided with the following steps: the lead strip formed in the first step sequentially passes through a lead trimming mechanism, a lead expanding mechanism and a lead tail ring cutting mechanism, wherein the lead trimming mechanism can trim two end feet of a U-shaped lead, the lead expanding mechanism can expand two end feet of the U-shaped lead, and the lead tail ring cutting mechanism can cut off a U-shaped tail ring of the U-shaped lead.
The invention is further provided with the following steps: the energizing device and the welding device in the second step and the third step can be provided with at least two groups, and the wire welding operation can be simultaneously carried out on cores at different positions on the wire guiding belt.
The invention is further provided with the following steps: wherein, in the step ten and the step eleven, a dust collecting device, a dust-proof device and an explosion-proof device are also arranged.
The invention is further provided with the following steps: and the capacitor product formed in the step eleven passes through a cooling device and is subjected to air cooling operation for 3-6 minutes.
By adopting the scheme, the capacitor can be produced and processed, and the processing efficiency is improved.
The invention is further described below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic illustration of a process flow;
fig. 2 is a schematic diagram of a capacitor forming process.
Detailed Description
As shown in fig. 1-2, a process for producing a capacitor includes the steps of:
step one, arranging leads, namely cutting the leads, bending the leads to form U-shaped leads, conveying the adhesive tape and the paper tape vertically correspondingly, pushing the U-shaped leads between the adhesive tape and the paper tape, and sticking the U-shaped leads on the paper tape by pressing the adhesive tape to form a lead tape, wherein the U-shaped leads are distributed on the lead tape at intervals, two end pins of the U-shaped leads and a U-shaped tail ring are exposed out of the paper tape, and the lead tape is automatically conveyed;
step two, enabling, namely conveying cores subjected to metal spraying treatment to a clamp of an enabling device one by one, completing one-time charging and discharging treatment on the enabling device by each core, and conveying qualified products to a welding device after testing the standard value of capacity, the upper and lower deviation and the upper limit value of loss value by a digital bridge;
step three, welding, wherein the welding device carries out welding operation on the energized cores and the U-shaped leads on the lead belt one by one, so that the two conductive ends of the cores are respectively welded on the two end pins of the U-shaped leads, and the cores are conveyed along with the lead belt;
fourthly, burr burning is carried out, hot air is blown to the welded lead belt, and burr burning treatment is carried out, wherein the temperature of the burr burning is 230-240 ℃;
step five, silicone oil coating is carried out on the two end feet of the U-shaped lead;
step six, preheating, namely conveying the lead belt coated with the silicone oil to a heating box, and drying at the temperature of 70-100 ℃;
step seven, encapsulating epoxy, namely immersing the core on the lead belt in epoxy resin paint, wherein the epoxy resin paint is epoxy resin 850s;
step eight, inner dipping and curing, namely curing the paint-dipped core at the temperature of 60-100 ℃ to form an epoxy resin layer on the outer surface of the core, wherein the thickness of the epoxy resin layer is 0.2-0.3mm;
step nine, powder encapsulation, namely heating a powder groove, immersing a core on a lead belt into powder in the powder groove, and performing powder dipping operation, wherein the temperature of the powder groove is 150-190 ℃;
step ten, cutting pins of the powder, and cutting off the powder stuck on the lead;
step eleven, curing the powder, namely curing the powder-dipped core at the temperature of 60-100 ℃ to form an epoxy powder outer layer on the surface of the epoxy resin layer, thereby forming a capacitor product, wherein the thickness of the epoxy powder outer layer is 0.2-0.3mm;
step twelve, laser printing, wherein the laser flying marking mechanism performs laser printing operation on the outer surface of the capacitor;
thirteenth, testing, namely sequentially performing CP testing on the capacitor, cutting off the CP defective products, performing DC withstand voltage charge and discharge testing on the capacitor, performing DC2 withstand voltage testing on the capacitor, cutting off the DC defective products, performing IR charge and discharge testing on the capacitor, and cutting off the IR defective products;
fourteen, checking the appearance of the CCD, detecting the appearance of the capacitor through a CCD detector, and cutting off the bad capacitor of the CCD;
fifteen, sorting capacity grades, namely sorting high-frequency capacity grades and sorting non-high-frequency capacity grades, cutting off defective products of high-frequency test capacities and cutting off defective products of non-high-frequency test capacities;
sixteenth, pin pulling/forming, and after capacity grade sorting, pin pulling and receiving or pin cutting and receiving are respectively carried out on the capacitor through a blanking device, and blanking operation of the capacitor is carried out.
In this embodiment, the wire tape formed in the first step sequentially passes through the wire trimming mechanism, the wire expanding mechanism and the wire tail ring cutting mechanism, the wire trimming mechanism can trim two ends of the U-shaped wire, the wire expanding mechanism can expand two ends of the U-shaped wire, and the wire tail ring cutting mechanism can cut off the U-shaped tail ring of the U-shaped wire.
In this embodiment, at least two groups of the energizing device and the soldering device in the second step and the third step may be provided, so that the soldering operation may be performed on cores at different positions on the lead ribbon at the same time.
In the present embodiment, dust collection means, dust prevention means, and explosion prevention means are further provided in step ten and step eleven.
In this embodiment, the capacitor product formed in step eleven is passed through a cooling device for 3-6 minutes of air cooling.
The above embodiments are only preferred embodiments of the present invention, and common variations and substitutions by those skilled in the art within the scope of the technical solution of the present invention are included in the scope of the present invention.
Claims (5)
1. The production process of the capacitor is characterized by comprising the following steps of:
step one, arranging leads, namely cutting the leads, bending the leads to form U-shaped leads, conveying the adhesive tape and the paper tape vertically correspondingly, pushing the U-shaped leads between the adhesive tape and the paper tape, and sticking the U-shaped leads on the paper tape by pressing the adhesive tape to form a lead tape, wherein the U-shaped leads are distributed on the lead tape at intervals, two end pins of the U-shaped leads and a U-shaped tail ring are exposed out of the paper tape, and the lead tape is automatically conveyed;
step two, enabling, namely conveying cores subjected to metal spraying treatment to a clamp of an enabling device one by one, completing one-time charging and discharging treatment on the enabling device by each core, and conveying qualified products to a welding device after testing the standard value of capacity, the upper and lower deviation and the upper limit value of loss value by a digital bridge;
step three, welding, wherein the welding device carries out welding operation on the energized cores and the U-shaped leads on the lead belt one by one, so that the two conductive ends of the cores are respectively welded on the two end pins of the U-shaped leads, and the cores are conveyed along with the lead belt;
fourthly, deburring, namely blowing hot air into the welded lead belt to bake the burrs;
step five, silicone oil coating is carried out on the two end feet of the U-shaped lead;
step six, preheating, namely conveying the lead belt coated with the silicone oil to a heating box, and drying at the temperature of 70-100 ℃;
step seven, encapsulating epoxy, namely dipping cores on the lead tapes into epoxy resin paint;
step eight, inner dipping and curing, namely curing the paint-dipped core at 60-100 ℃ to form an epoxy resin layer on the outer surface of the core;
step nine, powder encapsulation, namely heating a powder groove, immersing cores on a lead belt into powder in the powder groove, and performing powder dipping operation;
step ten, cutting pins of the powder, and cutting off the powder stuck on the lead;
step eleven, curing the powder, namely curing the powder-dipped core at 60-100 ℃ to form an epoxy powder outer layer on the surface of the epoxy resin layer, so as to form a capacitor product;
step twelve, laser printing, wherein the laser flying marking mechanism performs laser printing operation on the outer surface of the capacitor;
thirteenth, testing, namely sequentially performing CP testing on the capacitor, cutting off the CP defective products, performing DC withstand voltage charge and discharge testing on the capacitor, performing DC2 withstand voltage testing on the capacitor, cutting off the DC defective products, performing IR charge and discharge testing on the capacitor, and cutting off the IR defective products;
fourteen, checking the appearance of the CCD, detecting the appearance of the capacitor through a CCD detector, and cutting off the bad capacitor of the CCD;
fifteen, sorting capacity grades, namely sorting high-frequency capacity grades and sorting non-high-frequency capacity grades, cutting off defective products of high-frequency test capacities and cutting off defective products of non-high-frequency test capacities;
sixteenth, pin pulling/forming, and after capacity grade sorting, pin pulling and receiving or pin cutting and receiving are respectively carried out on the capacitor through a blanking device, and blanking operation of the capacitor is carried out.
2. A process for producing a capacitor as claimed in claim 1, wherein: the lead strip formed in the first step sequentially passes through a lead trimming mechanism, a lead expanding mechanism and a lead tail ring cutting mechanism, wherein the lead trimming mechanism can trim two end feet of a U-shaped lead, the lead expanding mechanism can expand two end feet of the U-shaped lead, and the lead tail ring cutting mechanism can cut off a U-shaped tail ring of the U-shaped lead.
3. A process for producing a capacitor according to claim 1 or 2, characterized in that: the energizing device and the welding device in the second step and the third step can be provided with at least two groups, and the wire welding operation can be simultaneously carried out on cores at different positions on the wire guiding belt.
4. A process for producing a capacitor according to claim 1 or 2, characterized in that: wherein, in the step ten and the step eleven, a dust collecting device, a dust-proof device and an explosion-proof device are also arranged.
5. A process for producing a capacitor according to claim 1 or 2, characterized in that: and the capacitor product formed in the step eleven passes through a cooling device and is subjected to air cooling operation for 3-6 minutes.
Priority Applications (1)
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CN202210846653.6A CN115064384B (en) | 2022-07-05 | 2022-07-05 | Production process of capacitor |
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CN202210846653.6A CN115064384B (en) | 2022-07-05 | 2022-07-05 | Production process of capacitor |
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CN115064384A CN115064384A (en) | 2022-09-16 |
CN115064384B true CN115064384B (en) | 2023-09-19 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994002954A1 (en) * | 1992-07-27 | 1994-02-03 | Cole, Jonathan | Solid/gas double layer capacitor and electrical storage device |
CN101567265A (en) * | 2009-06-04 | 2009-10-28 | 上海春黎电子实业有限公司 | Manufacturing method capable of effectively improving product life of capacitor |
KR101251990B1 (en) * | 2011-11-17 | 2013-04-08 | 주식회사 에너솔 | Apparatus and method for manufacturing aluminum polymer capacitor |
CN110164691A (en) * | 2019-05-06 | 2019-08-23 | 艾华新动力电容(苏州)有限公司 | A kind of high moisture-proof metalizing polypropylene thin film capacitor and its processing method |
CN113593907A (en) * | 2021-07-20 | 2021-11-02 | 广东国灿电子科技有限公司 | Production process of metallized film capacitor |
-
2022
- 2022-07-05 CN CN202210846653.6A patent/CN115064384B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994002954A1 (en) * | 1992-07-27 | 1994-02-03 | Cole, Jonathan | Solid/gas double layer capacitor and electrical storage device |
CN101567265A (en) * | 2009-06-04 | 2009-10-28 | 上海春黎电子实业有限公司 | Manufacturing method capable of effectively improving product life of capacitor |
KR101251990B1 (en) * | 2011-11-17 | 2013-04-08 | 주식회사 에너솔 | Apparatus and method for manufacturing aluminum polymer capacitor |
CN110164691A (en) * | 2019-05-06 | 2019-08-23 | 艾华新动力电容(苏州)有限公司 | A kind of high moisture-proof metalizing polypropylene thin film capacitor and its processing method |
CN113593907A (en) * | 2021-07-20 | 2021-11-02 | 广东国灿电子科技有限公司 | Production process of metallized film capacitor |
Non-Patent Citations (1)
Title |
---|
关于CBB61型薄膜电容器容量稳定性的探讨;徐莉;;铜陵职业技术学院学报(第03期);全文 * |
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