CN115061556A - Heat dissipation structure of vehicle-mounted flat plate and heat dissipation simulation analysis method - Google Patents
Heat dissipation structure of vehicle-mounted flat plate and heat dissipation simulation analysis method Download PDFInfo
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- CN115061556A CN115061556A CN202210848743.9A CN202210848743A CN115061556A CN 115061556 A CN115061556 A CN 115061556A CN 202210848743 A CN202210848743 A CN 202210848743A CN 115061556 A CN115061556 A CN 115061556A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 49
- 238000004088 simulation Methods 0.000 title claims abstract description 43
- 238000004458 analytical method Methods 0.000 title claims abstract description 31
- 239000004033 plastic Substances 0.000 claims abstract description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000000741 silica gel Substances 0.000 claims abstract description 29
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims abstract description 4
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 210000000988 bone and bone Anatomy 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 239000000499 gel Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses a heat dissipation structure of a vehicle-mounted flat plate, which mainly comprises a heat dissipation piece, heat conduction silica gel, a shielding cover, a heating power consumption chip, a plastic rear shell, a plastic front shell, a PCBA, a display screen module and a support. The heat-conducting silica gel is pasted on the heating power consumption chip, and gaps between the heating power consumption chip and the radiating fins are filled through the heat-conducting silica gel. The radiating fins are sleeved on the plastic rear shell in an injection molding mode in the mold, so that the radiating fins and the plastic rear shell are connected and fixed. The radiating fin is provided with a fin, a boss, a large plane at the bottom of the radiating fin and a radiating fin base. The boss contacts with heat conduction silica gel, fills the gap through heat conduction silica gel for the better heat is transmitted to the fin by the consumption chip that generates heat. The invention also provides a heat dissipation simulation analysis method of the vehicle-mounted panel, which can accurately determine the structural form of the heat dissipation fins, the heat dissipation fins are arranged on the CPU chip and the 5G module chip, and the heat generated by the chips is conducted to the heat dissipation fins in time, so that the heat dissipation efficiency is effectively improved, and the temperature of the chips is reduced.
Description
Technical Field
The invention relates to a heat dissipation structure of a vehicle-mounted panel, in particular to a heat dissipation structure of a vehicle-mounted panel and a heat dissipation simulation analysis method used for industrial and agricultural medium-sized electronic products.
Background
At the present stage, the industrial and agricultural electronization is changing day by day, and the environment of electronic products used in the industrial and agricultural is relatively severe, for example, when the operation is performed in a high-temperature environment, the temperature rise generated by the power consumption chip is large, the temperature of the power consumption chip rises to a certain degree, the normal operation of the vehicle-mounted panel can be influenced, and even the power consumption chip is damaged due to overheating.
In the prior art, a part of vehicle-mounted flat plates are not provided with radiating fins, and the performance of a power consumption chip is usually reduced through software control in the operation of the vehicle-mounted flat plates in a high-temperature environment, so that the vehicle-mounted flat plates cannot be damaged due to heating, but the problem is caused that the vehicle-mounted flat plates cannot normally work in the high-temperature environment to influence the operation of equipment.
Generally, although another type of vehicle-mounted flat plate is provided with the radiating fins, the back surfaces of the radiating fins are single large flat surfaces and carry out heat conduction with the related power consumption chips, in such a way, heat is quickly conducted to the corresponding positions outside the radiating fins of the power consumption chips, so that the temperature of the positions of the radiating fins is locally too high, the radiating temperature is not well uniformly distributed, the power consumption chips cannot effectively obtain great reduction of the temperature, and the service life of the power consumption chips is greatly reduced.
How to reasonably carry out the structural layout of the vehicle-mounted panel is very important to effectively and timely dissipate the heat generated by the power consumption chip, so that the structural layout of the vehicle-mounted panel power consumption device needs to be carried out by means of heat dissipation simulation design, and the heat dissipation efficiency of the system is improved.
Disclosure of Invention
In order to solve the technical problems, the invention relates to a vehicle-mounted panel heat dissipation structure, a vehicle-mounted panel based on the heat dissipation simulation structure and a heat dissipation simulation analysis method.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides a shell, PCBA, display screen module and support constitute before on-vehicle dull and stereotyped heat radiation structure mainly by fin, heat conduction silica gel, shield cover, the consumption chip that generates heat, plastic backshell, plastic.
The heat-conducting silica gel is pasted on the heating power consumption chip, and gaps between the heating power consumption chip and the radiating fins are filled through the heat-conducting silica gel. The radiating fin is sleeved on the plastic rear shell in an injection molding mode in the mold, so that the radiating fin and the plastic rear shell are connected and fixed.
The radiating fin is provided with a fin, a boss, a large plane at the bottom of the radiating fin and a radiating fin base. The boss contacts with heat conduction silica gel, fills the gap through heat conduction silica gel for the better heat is transmitted to the fin by the consumption chip that generates heat.
Furthermore, the heating power consumption chip is attached to the PCBA in a soldering mode. The PCBA is fixed on the plastic rear shell in a screw and stud locking mode.
The display screen module is pasted inside the plastic front shell, the display screen module is fixedly connected with the plastic front shell through the accumulated water back glue, and the display screen module is connected with the plastic front shell in an enhanced mode through the support.
Further, the support passes through the screw and is connected fixedly with the plastic preceding shell with the double-screw bolt closure, and the display screen module is installed before the plastic between shell and the support, and the bone that encloses of support extrudees the TP glass of display screen module simultaneously for further strengthen the fixed of display screen module.
A heat dissipation simulation analysis method of a vehicle-mounted flat panel comprises the following steps:
step 1: analyzing a temperature distribution area of the radiating fin:
the power consumption chip mainly comprises a CPU chip and a 5G module chip, and the two chips are assembled and contacted with the same radiating fin; the heat radiating fin is made of aluminum alloy, the back surface of the heat radiating fin is a uniform large flat surface, simulation analysis is carried out through thermal simulation analysis software, and if the result is ideal, the scheme is considered to be adopted. If the results are not ideal, the next step is performed.
Step 2: according to the simulation result of the step 1, analyzing whether the main reason of non-ideal is that the heat absorption capacity of the heat dissipation plate is insufficient, if so, increasing the heat absorption capacity of the heat dissipation plate, such as increasing the thickness; and then carrying out heat dissipation simulation to obtain a result, and if the result is ideal, considering the scheme. If not, the next step is carried out.
And step 3: according to the simulation results of the steps 1 and 2, the main reason that the thickness of the base of the radiating fin is influenced by the whole structure space and cannot be increased to the ideal thickness is analyzed in the process of the step, and the radiating fin is considered to be a locally thickened boss surface and is in contact with the CPU chip and the 5G module chip respectively to promote heat to be conducted and diffused to the bottom plane of the radiating fin rapidly. And performing simulation analysis by thermal simulation analysis software to obtain the temperature of the CPU chip and the 5G module chip and the temperature distribution of the radiating fin, and considering the scheme if the result is ideal. If the result is not ideal, the next step is performed.
And 4, step 4: analyzing whether the non-ideal reason is that heat accumulated on the radiating fins cannot be rapidly dissipated to the outside so as to cause non-ideal radiating effect according to the simulation result of the step 1-3; the heat dissipation rate is improved, then the temperature of the CPU chip and the 5G module chip and the temperature distribution of the heat dissipation fins are obtained through simulation, and if the result is ideal, the scheme is considered to be adopted. If the result is not ideal, backtracking the steps until the result obtains the optimal heat dissipation scheme, and finally selecting the heat dissipation scheme preferentially.
The beneficial effects of the invention are:
according to the invention, the heat-conducting silica gel is adhered to the heating power consumption chip, the gap between the heating power consumption chip and the radiating fin is filled by the heat-conducting silica gel, the boss is contacted with the heat-conducting silica gel, and the gap is filled by the heat-conducting silica gel, so that the heat is better transmitted to the radiating fin from the chip, and the heat of the heating power consumption chip is radiated to the outside of the vehicle-mounted panel through the radiating fin, thereby reducing the temperature of the heating power consumption chip and enabling the chip to work smoothly.
The invention can accurately determine the structural form of the radiating fin by using a radiating simulation analysis method, and the radiating fins are arranged on the CPU chip and the 5G module chip to conduct the heat generated by the chips to the radiating fin in time, thereby effectively improving the radiating efficiency, reducing the temperature of the chips and ensuring that the vehicle-mounted flat plate stably and normally works.
According to the invention, under the thermal simulation analysis software and the same heat source environment, the key heating power consumption chip analysis is carried out by changing the size and the material of the radiating fin, so that the size and the material of the optimal radiating fin are obtained, and therefore, the temperature of the heating power consumption chip is reduced.
Drawings
The technical solution and the advantages of the present invention will be apparent from the following detailed description of the embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a whole structure diagram of a vehicle-mounted flat plate heat dissipation structure provided by the invention.
Fig. 2 is an exploded view of the whole structure of fig. 1.
Fig. 3 is a stacked view of the main heat dissipation structure of the present invention.
Fig. 4 is a partial schematic view of the combination of the large planar surface of the heat sink and the critical power consuming chip of the present invention.
Fig. 5 is a simulated analysis temperature diagram of the heat dissipation structure of fig. 4.
Fig. 6 is a partial schematic diagram of the combination of the thickened thickness of the heat spreader root and the critical power dissipation chip of the present invention.
Fig. 7 is a simulation analysis temperature diagram of the heat dissipation structure of fig. 6.
FIG. 8 is a partial schematic view of the combination of the increased thickness of the heat spreader base and the increased bump and critical power dissipation chip of the present invention.
Fig. 9 is a simulation analysis temperature diagram of the heat dissipation structure of fig. 8.
Fig. 10 is a partial schematic view of the combination of the thicker base of the heat sink, the added boss, the increased fin height, and the key power dissipation chip of the present invention.
Fig. 11 is a simulated analysis temperature diagram of the heat dissipation structure of fig. 10.
Fig. 12 is an enlarged view of the area of fig. 10 at location G of the present invention.
Fig. 13 is an enlarged view of the area H of fig. 10 of the present invention.
Fig. 14 is a flow chart of a simulation analysis of heat dissipation of a vehicle-mounted tablet according to the present invention.
Description of the main elements: 10 vehicle-mounted flat plates, 100 radiating fins, 200 plastic rear shells, 300 heat-conducting silica gel I, 4005G module chips, 500PCBA, 600 supports, 700 display screen modules, 800 plastic front shells, 900CPU chips, 1000 heat-conducting silica gel II, 1100 shielding cases, 1200 heat-conducting silica gel III, 110 fins, 120 boss I, 130 radiating fin bottom large planes, 140 boss II and 150 radiating fin foundations.
Detailed Description
The following describes the heat dissipation simulation analysis of the vehicle-mounted flat panel of the present invention with reference to the accompanying drawings and examples, and clearly and completely describes the technical solutions in the embodiments of the present invention, it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1, 2, 3, 4, 6, 8, 10, 12, and 13, a vehicle-mounted flat panel 10 based on heat dissipation simulation includes a heat sink 100, a plastic rear case 200, a first heat-conducting silicone gel 300, a 5G module chip 400, a PCBA500, a bracket 600, a display screen module 700, a plastic front case 800, a CPU chip 900, a second heat-conducting silicone gel 1000, a shield 1100, and a third heat-conducting silicone gel 1200.
The heat sink 100 is fixed on the plastic rear case 200 by in-mold injection molding, the CPU chip 900 is mounted on the PCBA500, the second heat conductive silicone 1000 is attached to the CPU chip 900 and contacts with the shield cover 1100, the shield cover 1100 is contact-welded to the PCBA500, and the third heat conductive silicone 1200 is attached to the shield cover 1100.
The 5G module chip 400 is mounted on the PCBA500, and the first heat-conducting silica gel 300 is adhered to the 5G module chip.
The PCBA500 is fixed on the plastic rear shell 200 by the way of locking the PCBA500 with the screw and the stud.
The display screen module 700 is adhered to the inside of the plastic front shell 800, and the support is fixed on the plastic front shell in a screw and stud locking mode for reinforcing the fixation of the display screen module.
Further, the heat sink 100 is mainly characterized by comprising a fin 110, a first boss 120, a large bottom plane 130, a second boss 140, and a heat sink base 150.
The second boss 140 is in interference fit contact with the third heat-conducting silica gel 1200, and through the assembling and action relation among the CPU chip 900, the second heat-conducting silica gel 100, the shielding cover 1100, the third heat-conducting silica gel 1200 and the second boss 140, the heat radiating fins of the CPU chip 900 are conducted to the shielding cover through the heat-conducting silica gel, then are conducted to the radiating fins through the shielding cover, and are radiated to the outside of the vehicle-mounted panel through the radiating fins, so that the temperature of the CPU chip 900 is reduced.
The first boss 120 is in contact with the first heat-conducting silica gel 300, and through the assembling and acting relation among the 5G module chip 400, the first heat-conducting silica gel 300 and the first boss 120, the heat of the 5G module chip 400 is dissipated to the outside of the vehicle-mounted flat plate through the radiating fin, so that the temperature of the 5G module chip 400 is reduced.
The above-described CPU chip 900 and 5G module chip 400 are generic to the above-described power consumption chip.
Referring to fig. 5, 7, 9 and 11, simulation analysis results performed in an environment of 70 ℃ by using CFD thermal simulation analysis software are shown.
Example (b):
as shown in fig. 14, according to the analysis in step 1 of the thinking diagram, as shown in fig. 4, the CPU chip 900 is in contact with the large bottom plane 130 of the heat sink through the third heat conductive silicone rubber 1200, and the 5G module chip 400 is in contact with the large bottom plane 130 of the heat sink through the first heat conductive silicone rubber 300. The heat sink 100 is made of aluminum alloy, the heat sink base 150 has a thickness of 2mm, and the fins 110 have a height of 4 mm. As shown in fig. 5, the simulation analysis shows that the temperature of the CPU chip 900 is 110.37 ℃, the temperature of the 5G module chip 400 is 91.68 ℃, and the effect is not ideal, so the further analysis is performed.
As shown in fig. 14, according to the analysis of the thinking map step 2, the heat sink root substrate is thin and has insufficient heat absorption to sufficiently absorb the heat of the chip according to the thermal simulation, so the second embodiment is performed according to the thinking map step 2: as shown in fig. 6, the CPU chip 900 is in contact with the bottom large plane 130 of the heat sink through the third thermal conductive silicone rubber 1200, and the 5G module chip 400 is in contact with the bottom large plane 130 of the heat sink through the first thermal conductive silicone rubber 300. The heat sink 100 is made of aluminum alloy, the thickness of the heat sink base 150 is increased to 3.5mm at most by the structural influence, and the height of the fin 110 is 4 mm. As shown in fig. 7, the simulation analysis showed that the temperature of the CPU chip 900 was 104.03 ℃, the temperature of the 5G module chip 400 was 90.96 ℃, and the effect was not satisfactory, so the analysis was further performed.
As shown in fig. 14, according to the analysis of the thinking map step 3, the base material of the root of the heat sink is thin and the heat absorption is insufficient according to the thermal simulation, so according to the third embodiment of the thinking map step 3: as shown in fig. 8, a second boss 140 and a first boss 120 are added to the large plane 130 at the bottom of the heat sink 100, the CPU chip 900 contacts the second boss 140 through the third heat conductive silicone 1200, and the 5G module chip 400 contacts the first boss 120 through the first heat conductive silicone 300. The heat sink 100 is made of aluminum alloy, the heat sink base 150 has a thickness of 3.5mm, and the fins 110 have a height of 4 mm. As shown in fig. 9, the simulation analysis shows that the temperature of the CPU chip 900 is 97.9 ℃, the temperature of the 5G module chip 400 is 87.9 ℃, and the effect is not satisfactory, so that the further analysis is performed.
As shown in fig. 14, the analysis according to step 4 of the thinking map shows that the heat absorption rate of the heat sink is sufficient according to the thermal simulation, so that the heat sink is analyzed to have insufficient heat dissipation rate, and the surface area needs to be increased to increase the heat dissipation rate; therefore, according to the thinking diagram, step 4, the embodiment is four: as shown in fig. 10, the CPU chip 900 is in contact with the second bump 140 through the third thermal conductive silicone 1200, and the 5G module chip 400 is in contact with the first bump 120 through the first thermal conductive silicone 300. The heat sink 100 is made of aluminum alloy, the thickness of the heat sink base 150 is 3.5mm, and the height of the fins 110 is increased to 7 mm. As shown in fig. 11, the simulation analysis shows that the temperature of the CPU chip 900 is 96.25 ℃, the temperature of the 5G module chip 400 is 85 ℃.
Comparing the four simulation results of steps 1 to 4, it can be seen that the temperature of the two key power consumption chips, namely the CPU chip 900 and the 5G module chip 400, is the lowest by adopting the scheme of step 4, that is, the second boss 140 and the first boss 120 are added to the heat sink 100, the height of the fin 110 is 7mm, and the thickness of the heat sink base 150 is 3.5mm, which is most reasonable.
In summary, the present invention is only a preferred embodiment, and the designer can make optimization or improvement without departing from the technical solution according to the teaching of the above embodiments.
Claims (5)
1. The utility model provides a shell, PCBA, display screen module and support constitute characterized by before shell, PCBA, display screen module and support before mainly by fin, heat conduction silica gel, shield cover, the consumption chip that generates heat, plastic backshell, plastic: the heat-conducting silica gel is adhered to the heating power consumption chip, and a gap between the heating power consumption chip and the radiating fin is filled through the heat-conducting silica gel; the radiating fins are sleeved on the plastic rear shell in an injection molding mode in the mold, so that the radiating fins are fixedly connected with the plastic rear shell; the radiating fin is provided with a fin, a boss, a large plane at the bottom of the radiating fin and a radiating fin base; the boss contacts with heat conduction silica gel, fills the gap through heat conduction silica gel for the better heat is transmitted to the fin by the consumption chip that generates heat.
2. The heat dissipation structure of the vehicle-mounted flat panel as claimed in claim 1, wherein: the heating power consumption chip is pasted on the PCBA in a soldering tin mode; the PCBA is fixed on the plastic rear shell in a screw and stud locking mode.
3. The heat dissipation structure of a vehicle-mounted flat panel according to claim 1, wherein: the display screen module is pasted inside the plastic front shell, the display screen module is fixedly connected with the plastic front shell through the accumulated water back glue, and the display screen module is connected with the plastic front shell in an enhanced mode through the support.
4. The heat dissipation structure of a vehicle-mounted flat panel according to claim 3, wherein: the support passes through the screw and is connected fixedly with the plastic front shell with double-screw bolt closure, and the display screen module is installed before the plastic between shell and the support, and the TP glass of the display screen module of bone extrusion that encloses of support simultaneously for further strengthen the fixed of display screen module.
5. A heat dissipation simulation analysis method of a vehicle-mounted flat panel comprises the following steps:
step 1: analyzing a temperature distribution area of the radiating fin:
the power consumption chip mainly comprises a CPU chip and a 5G module chip, and the two chips are assembled and contacted with the same radiating fin; the heat radiating fin is made of aluminum alloy, the back surface of the heat radiating fin is a uniform large flat surface, simulation analysis is carried out through thermal simulation analysis software, if the result is ideal, the scheme is considered to be adopted, and if the result is not ideal, the next step is carried out;
step 2: according to the simulation result of the step 1, analyzing whether the main reason of non-ideal is that the heat absorption capacity of the heat dissipation plate is insufficient, if so, increasing the heat absorption capacity of the heat dissipation plate, such as increasing the thickness; then carrying out heat dissipation simulation to obtain a result, if the result is ideal, considering to adopt the scheme, and if the result is not ideal, carrying out the next step;
and step 3: according to the simulation results of the steps 1 and 2, analyzing the main reason of non-ideal in the process of the step, and considering whether the thickness of the root of the radiating fin is influenced by the whole structure space and cannot be increased to the ideal thickness, the radiating fin is considered to be a locally thickened convex table surface and is respectively contacted with the CPU chip and the 5G module chip to promote the heat to be rapidly conducted and diffused to the bottom plane of the radiating fin; carrying out simulation analysis through thermal simulation analysis software to obtain the temperature of the CPU chip and the 5G module chip and the temperature distribution of the radiating fin, if the result is ideal, considering to adopt the scheme, and if the result is not ideal, carrying out the next step;
and 4, step 4: analyzing whether the non-ideal reason is that heat accumulated on the radiating fins cannot be rapidly dissipated to the outside so as to cause non-ideal radiating effect according to the simulation result of the step 1-3; and improving the heat dissipation rate, simulating to obtain the temperature of the CPU chip and the 5G module chip and the temperature distribution of the heat dissipation fins, if the result is ideal, considering to adopt the scheme, if the result is not ideal, backtracking to carry out the steps until the result obtains an optimal heat dissipation scheme, and finally selecting the heat dissipation scheme preferentially.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060215372A1 (en) * | 2005-03-24 | 2006-09-28 | Kwang-Jin Jeong | Dissipating apparatus for integrated circuit chip and display module including the same |
| CN203105039U (en) * | 2013-02-07 | 2013-07-31 | 协创立科数码电子(深圳)有限公司 | WiFi (Wireless Fidelity) wireless audio-video sharing device |
| CN206161999U (en) * | 2016-09-18 | 2017-05-10 | 马瑞利汽车电子(广州)有限公司 | On -vehicle high -definition liquid crystal display instrument |
| CN206441106U (en) * | 2017-01-24 | 2017-08-25 | 东莞市鸿艺电子有限公司 | A kind of radiating subassembly applied to Intelligent mobile equipment |
| CN110276137A (en) * | 2019-06-25 | 2019-09-24 | 上海交通大学 | A kind of optimization method of power device radiator |
| CN214206191U (en) * | 2020-10-10 | 2021-09-14 | 深圳市哲思特科技有限公司 | High heat-transfer heat dissipation backshell and vehicle-mounted display |
-
2022
- 2022-07-19 CN CN202210848743.9A patent/CN115061556A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060215372A1 (en) * | 2005-03-24 | 2006-09-28 | Kwang-Jin Jeong | Dissipating apparatus for integrated circuit chip and display module including the same |
| CN203105039U (en) * | 2013-02-07 | 2013-07-31 | 协创立科数码电子(深圳)有限公司 | WiFi (Wireless Fidelity) wireless audio-video sharing device |
| CN206161999U (en) * | 2016-09-18 | 2017-05-10 | 马瑞利汽车电子(广州)有限公司 | On -vehicle high -definition liquid crystal display instrument |
| CN206441106U (en) * | 2017-01-24 | 2017-08-25 | 东莞市鸿艺电子有限公司 | A kind of radiating subassembly applied to Intelligent mobile equipment |
| CN110276137A (en) * | 2019-06-25 | 2019-09-24 | 上海交通大学 | A kind of optimization method of power device radiator |
| CN214206191U (en) * | 2020-10-10 | 2021-09-14 | 深圳市哲思特科技有限公司 | High heat-transfer heat dissipation backshell and vehicle-mounted display |
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