CN115056524A

CN115056524A - Micro-optical device preparation method and device based on die pressing

Info

Publication number: CN115056524A
Application number: CN202210467616.4A
Authority: CN
Inventors: 田宜彬; 李志伟; 王凌
Original assignee: Guanglun Technology Shenzhen Co ltd
Current assignee: Guanglun Technology Shenzhen Co ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-09-16

Abstract

The invention discloses a method and a device for preparing a micro-optical device based on die pressing, which comprises the following steps: defining a microstructured mold for use in the fabrication of a micro-optical device, the microstructured mold surface having at least one raised mold structure; based on preset pressure, the device preparation equipment is controlled to press the microstructure mould on the surface to be pressed of the compressible optical material placed on the material platform in the direction perpendicular to the material platform to obtain the target micro-optical device with the surface provided with at least one concave optical structure, the optical refractive index corresponding to the concave optical structure changes along with the pressing degree change of the microstructure mould on the compressible optical material, and the convex mould structures are embedded with the concave optical structures formed by pressing the convex mould structures one by one. Therefore, the micro-optical device can be prepared by utilizing the micro-structure mold, so that the preparation cost of the micro-optical device is reduced, the optical refractive index is determined as the design variable of the micro-optical device, and the design freedom degree of the micro-optical device is improved.

Description

Micro-optical device preparation method and device based on die pressing

Technical Field

The invention relates to the technical field of optical devices, in particular to a method and a device for preparing a micro-optical device based on die pressing.

Background

In industrial production, the Micro-Optical Device realizes the control of polarization, phase, amplitude and other attributes of light by processing a specific Micro-scale structure on the surface of an Optical material, such as a Sub-wavelength-characterized Micro-Optical Device (swMOD) surface Sub-wavelength-scale structure.

Existing micro-optics can generally be prepared in two ways: firstly, removing partial materials on a uniform substrate with a certain thickness by using laser and ion beams through direct writing or photoetching and the like so that the residual materials form a required micro-size structure; the second is that the micro-scale structure required for adding occurs by 3D printing or embossing or the like on a thin uniform substrate. However, it has been found in practice that the existing methods for manufacturing micro-optical devices are complicated in processing equipment and processing technology, which results in high manufacturing cost of micro-optical devices, and the existing micro-optical devices control the transmission phase by the size of the surface microstructure, which results in low design freedom of micro-optical devices.

Therefore, it is important to reduce the manufacturing cost of the micro-optical device and improve the design freedom of the micro-optical device.

Disclosure of Invention

The invention aims to solve the technical problem of providing a method and a device for preparing a micro-optical device based on die pressing, which can reduce the preparation cost of the micro-optical device and improve the design freedom of the micro-optical device.

In order to solve the above technical problems, a first aspect of the present invention discloses a method for manufacturing a micro-optical device based on mold pressing, the method comprising:

determining a micro-structured mold for manufacturing a micro-optical device, wherein the micro-structured mold surface has at least one protruding mold structure, and each protruding mold structure is a micro-scale structure;

based on preset pressure, controlling device preparation equipment for preparing the micro-optical device to press the micro-structure mold on a to-be-pressed surface of the compressible optical material placed on the material table along a direction perpendicular to the material table to obtain a target micro-optical device with at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device changes along with the pressing degree of the micro-structure mold on the compressible optical material, and the convex mold structures are embedded with the concave optical structures formed by pressing the convex mold structures one by one.

As an alternative embodiment, in the first aspect of the invention, the compressible optical material comprises a porous silicon-based compound.

As an alternative embodiment, in the first aspect of the present invention, the protruding mold structure is a first type of protruding mold structure or a second type of protruding mold structure;

wherein the first type of raised die structure comprises a first main pressing surface and a side surface perpendicular to the first main pressing surface; the second type of protruding die structure comprises a second main pressing surface and a side surface which is not perpendicular to the second main pressing surface, and an included angle between the side surface which is not perpendicular to the second main pressing surface and the second main pressing surface is larger than 90 degrees and smaller than 180 degrees;

for the second type of raised mold structure, the side not perpendicular to the second major pressing surface has a pressing effect on the compressible optical material, and the side not perpendicular to the second major pressing surface presses the compressible optical material with an optical index of refraction that is different from the optical index of refraction of the compressible optical material pressed by the second major pressing surface.

As an alternative implementation, in the first aspect of the present invention, the method further includes:

controlling the device manufacturing equipment to fill a predetermined optical filling material into each concave optical structure to obtain a first type of pure-plane micro-optical device, wherein the material volume of the optical filling material filled in each concave optical structure is equal to the concave volume of the concave optical structure; alternatively, the first and second electrodes may be,

and controlling the device preparation equipment to polish the convex part of the target micro-optical device, which is compared with the concave optical structure, until the pressed surface of the target micro-optical device is flat, so as to obtain a second type of pure-plane micro-optical device.

As an alternative embodiment, in the first aspect of the present invention, before the determining the microstructured mold for making a micro-optical device, the method further comprises:

determining a target preparation parameter combination corresponding to the preparation of the micro-optical device;

wherein, the determining the target preparation parameter combination corresponding to the micro-optical device comprises:

determining a current preparation parameter combination corresponding to the preparation of the micro-optical device;

calculating current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm;

verifying the current wavefront phase modulation information based on predetermined target wavefront phase modulation information under a predetermined wavelength to obtain a verification result;

when the verification result shows that the verification of the current wavefront phase modulation information passes, determining the current preparation parameter combination as a target preparation parameter combination corresponding to the preparation of the micro-optical device;

and when the verification result indicates that the verification of the current wavefront phase modulation information does not pass, adjusting a current preparation parameter combination corresponding to the preparation of the micro-optical device, re-executing the calculation algorithm based on the current preparation parameter combination and the predetermined wavefront phase, calculating the operation of the current wavefront phase modulation information corresponding to the current preparation parameter combination and the operation of verifying the current wavefront phase modulation information based on the target wavefront phase modulation information under the predetermined wavelength, and obtaining the operation of the verification result.

As an optional implementation manner, in the first aspect of the present invention, the verifying the current wavefront phase modulation information based on the predetermined target wavefront phase modulation information at the predetermined wavelength to obtain a verification result includes:

calculating the difference degree between the predetermined target wavefront phase modulation information under the predetermined wavelength and the current wavefront phase modulation information;

and judging whether the difference degree is smaller than or equal to a preset threshold value, if so, determining to verify the current wavefront phase modulation information, and if not, determining to verify the current wavefront phase modulation information, wherein the obtained verification result indicates that the current wavefront phase modulation information is verified to be passed, and if not, determining to verify the current wavefront phase modulation information, and the obtained verification result indicates that the current wavefront phase modulation information is not verified to be passed.

As an optional implementation manner, in the first aspect of the present invention, before the calculating, based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, current wavefront phase modulation information corresponding to the current preparation parameter combination, the method further includes:

acquiring an optical refractive index-pressing degree corresponding relation determined based on a plurality of pre-sampled microstructure parameter combinations, wherein the optical refractive index-pressing degree corresponding relation is used for representing a corresponding relation between an optical refractive index and a compression distance, and the optical refractive index-pressing degree corresponding relation comprises an optical refractive index-pressing degree relation curve and/or an optical refractive index-pressing degree lookup table;

the calculating current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm includes:

determining the current optical refractive index corresponding to the current preparation parameter combination according to the optical refractive index-pressing degree corresponding relation;

and calculating current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination, the current optical refractive index and a predetermined wavefront phase calculation algorithm.

detecting whether the target micro-optical device meets the device quality condition, and adjusting the pressing control parameters of the device preparation equipment and/or the micro-structure mold when the detection result is negative;

wherein the detecting whether the target micro-optical device satisfies a device quality condition includes:

acquiring stress parameters corresponding to one or more pressed parts of the compressible optical material in the process that the microstructure mould is pressed on the compressible optical material by the device preparation equipment based on a pressure sensor corresponding to the device preparation equipment, wherein the stress parameters comprise the stress magnitude corresponding to each pressed part and/or the stress direction corresponding to each pressed part;

judging whether the stress parameters meet preset stress conditions or not;

when the stress parameter is judged not to meet the preset stress condition, determining that the target micro-optical device does not meet the device quality condition;

when the stress parameter is judged to meet the preset stress condition, acquiring optical quality parameters corresponding to all the concave optical structures based on the optical sensor corresponding to the device preparation equipment;

judging whether the optical quality parameters meet preset optical quality conditions or not;

and when the optical quality parameter is judged not to meet the preset optical quality condition, determining that the target micro-optical device does not meet the device quality condition.

The invention discloses a micro-optical device preparation device based on die pressing in a second aspect, which comprises:

the micro-structure mold comprises a determining module, a forming module and a forming module, wherein the determining module is used for determining a micro-structure mold for preparing a micro-optical device, the surface of the micro-structure mold is provided with at least one protruding mold structure, and each protruding mold structure is a micro-size structure;

and the equipment control module is used for controlling the device preparation equipment for preparing the micro-optical device to press the micro-structure mould on the surface to be pressed of the compressible optical material placed on the material platform along the direction vertical to the material placing platform based on preset pressure so as to obtain the target micro-optical device with at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device is changed along with the pressing degree of the micro-structure mould on the compressible optical material, and the convex mould structures are embedded with the concave optical structures formed by pressing the convex mould structures one by one.

As an alternative embodiment, in the second aspect of the invention, the compressible optical material comprises a porous silicon-based compound.

As an alternative embodiment, in the second aspect of the present invention, the protruding mold structure is a first type of protruding mold structure or a second type of protruding mold structure;

As an optional implementation manner, in the second aspect of the present invention, the apparatus control module is further configured to control the device manufacturing apparatus to fill a predetermined optical filling material into each of the recessed optical structures, so as to obtain a first type of planar micro-optical device, where a material volume of the optical filling material filled in each of the recessed optical structures is equal to a recessed volume of the recessed optical structure; or controlling the device preparation equipment to polish the convex part of the target micro-optical device, which is compared with the concave optical structure, until the pressed surface of the target micro-optical device is flat, so as to obtain a second type of pure-plane micro-optical device.

As an alternative embodiment, in the second aspect of the present invention, the determining module is further configured to determine a target manufacturing parameter combination corresponding to the micro-optical device before determining the micro-structured mold for manufacturing the micro-optical device;

the determining module determines a specific way for preparing a target preparation parameter combination corresponding to the micro-optical device, and the specific way comprises the following steps:

determining a current preparation parameter combination corresponding to the micro-optical device;

As an optional implementation manner, in the second aspect of the present invention, the specific manner of verifying the current wavefront phase modulation information based on the predetermined target wavefront phase modulation information at the predetermined wavelength by the determining module to obtain the verification result includes:

As an optional implementation manner, in the second aspect of the present invention, the determining module is further configured to, before calculating current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, obtain an optical refractive index-compression degree correspondence determined based on a plurality of microstructure parameter combinations sampled in advance, where the optical refractive index-compression degree correspondence is used to represent a correspondence between an optical refractive index and a compression distance, and the optical refractive index-compression degree correspondence includes an optical refractive index-compression degree relation curve and/or an optical refractive index-compression degree lookup table;

the specific way for the determining module to calculate the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm includes:

As an alternative embodiment, in the second aspect of the present invention, the apparatus further comprises:

the detection module is used for detecting whether the target micro-optical device meets the device quality condition;

the adjusting module is used for adjusting the pressing control parameters of the device preparation equipment and/or the microstructure mould when the target micro-optical device detected by the detecting module does not meet the device quality condition;

the specific way for detecting whether the target micro-optical device meets the device quality condition by the detection module comprises the following steps:

judging whether the stress parameters meet preset stress conditions or not;

The invention discloses a micro-optical device preparation device based on die pressing in a third aspect, which comprises:

a memory storing executable program code;

a processor coupled with the memory;

the processor calls the executable program codes stored in the memory to execute the micro-optical device preparation method based on the die pressing disclosed by the first aspect of the invention.

In a fourth aspect, the present invention discloses a computer storage medium storing computer instructions, which, when invoked, are used to perform the method for manufacturing a micro-optical device based on mold pressing disclosed in the first aspect of the present invention.

Compared with the prior art, the embodiment of the invention has the following beneficial effects:

in an embodiment of the present invention, a microstructure mold for manufacturing a micro-optical device is determined, wherein a surface of the microstructure mold has at least one protruding mold structure, and each protruding mold structure is a micro-scale structure; based on preset pressure, controlling device preparation equipment for preparing a micro-optical device to press a micro-structure die on a to-be-pressed surface of a compressible optical material placed on a material platform along a direction perpendicular to the material platform to obtain a target micro-optical device with at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device is changed along with the pressing degree of the micro-structure die on the compressible optical material, and the convex die structures are embedded with the concave optical structures formed by pressing the convex die structures one by one. Therefore, the micro-structure mold can be pressed on the compressible optical material with the optical refractive index changing along with the change of the pressing degree to obtain the micro-optical device with the optical structure with a plurality of concave surfaces, the preparation complexity and the preparation difficulty of the micro-optical device are reduced, and the micro-structure mold is favorable for realizing the batch copying of the micro-optical device, so that the preparation cost of the micro-optical device is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic flow chart of a method for manufacturing a micro-optical device based on mold pressing according to an embodiment of the present disclosure;

FIG. 2 is a schematic flow chart of another method for manufacturing a micro-optical device based on mold pressing according to the embodiment of the present disclosure;

FIG. 3 is a schematic flow chart of a method for manufacturing a micro-optical device based on mold pressing according to an embodiment of the present disclosure;

FIG. 4 is a device fabrication apparatus according to an embodiment of the present disclosure;

FIG. 5 is a diagram of a target recipe parameter set disclosed in accordance with an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a micro-optical device manufacturing apparatus based on mold pressing according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of another micro-optical device manufacturing apparatus based on mold pressing according to the disclosure;

FIG. 8 is a schematic structural diagram of another apparatus for micro-optical device fabrication based on mold pressing according to the disclosure of the present application.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terms "first," "second," and the like in the description and claims of the present invention and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, article, or article that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or article.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The invention discloses a method and a device for preparing a micro-optical device based on mold pressing, which can press a micro-structural mold on a compressible optical material with the optical refractive index changing along with the change of the pressing degree to obtain the micro-optical device with a plurality of concave optical structures on the surface, reduce the preparation complexity and the preparation difficulty of the micro-optical device, and are beneficial to realizing the batch copying of the micro-optical device through the micro-structural mold, thereby reducing the preparation cost of the micro-optical device. The following are detailed below.

Example one

Referring to fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing a micro-optical device based on mold pressing according to an embodiment of the present invention. The method for manufacturing a micro-optical device based on mold pressing described in fig. 1 may be applied to any micro-optical device manufacturing process, such as a micro-optical device based on sub-wavelength characteristics, and the embodiment of the present invention is not limited thereto. As shown in fig. 1, the method for manufacturing a micro-optical device based on mold pressing may include the operations of:

101. a microstructured mold for making a micro-optical device is determined.

In the embodiment of the present invention, the surface of the microstructure mold has at least one protruding mold structure, each protruding mold structure is a micro-scale structure, such as a micro-nano structure with a structure size smaller than 100nm, optionally, the micro-scale structure may be a sub-wavelength structure, that is, a structure with a structure size smaller than the operating wavelength of the micro-optical device, further optionally, when the surface of the microstructure mold has at least two protruding mold structures, the structures of each two protruding mold structures may be the same or different, and the embodiment of the present invention is not limited.

102. And controlling the device preparation equipment for preparing the micro-optical device to press the micro-structure mold on the surface to be pressed of the compressible optical material placed on the material table along the direction vertical to the material table on the basis of preset pressure to obtain the target micro-optical device with the surface provided with at least one concave optical structure.

In the embodiment of the invention, the optical refractive index corresponding to the concave optical structure on the target micro-optical device can be changed along with the pressing degree of the micro-structural mold on the compressible optical material, and the convex mold structures are embedded with the concave optical structures formed by pressing the convex mold structures one by one. Wherein when the raised mold structure is a subwavelength-sized structure, the target micro-optic device is a micro-optic device based on subwavelength features.

In the embodiment of the present invention, preferably, the direction perpendicular to the discharging table may be a vertical direction, that is, the compressible optical material is horizontally placed on the discharging table, so that the situation that the pressing direction is deviated in the pressing process and the stress on the pressed portion of the surface of the compressible optical material is unbalanced due to the self-gravity of the protruding mold structure and/or the device manufacturing apparatus can be reduced.

In the embodiment of the invention, optionally, the compressible optical material may include a porous silicon-based compound, such as porous silicon nitride, porous silicon dioxide, and the like, which can improve the strength, toughness, heat resistance, corrosion resistance, oxidation resistance, light transmittance, and thermal shock resistance of the micro-optical device, improve the compressible degree of the compressible optical material, and reduce the dielectric loss of the micro-optical device.

In an embodiment of the present invention, optionally, as shown in fig. 3(a), a base layer may be embedded in a bottom portion of the compressible optical material for pressing, the bottom portion being opposite to the surface to be pressed, wherein the material corresponding to the base layer may include a substrate material or a coating material, and further optionally, an optical refractive index n of the compressible material ¹ Optical refractive index n of material corresponding to base layer ² May or may not be equal.

In the embodiment of the present invention, optionally, as shown in fig. 3(b), the protruding mold structure may be a first type protruding mold structure or a second type protruding mold structure; the first type of protruding die structure comprises a first main pressing surface and a side surface perpendicular to the first main pressing surface; the second type of protruding die structure comprises a second main pressing surface and a side surface which is not vertical to the second main pressing surface, and the included angle between the side surface which is not vertical to the second main pressing surface and the second main pressing surface is larger than 90 degrees and smaller than 180 degrees; for the second type of raised mold structure, the side not perpendicular to the second major pressing surface has a pressing effect on the compressible optical material, and the side not perpendicular to the second major pressing surface presses the compressible optical material with an optical index of refraction that is different from the optical index of refraction of the compressible optical material pressed by the second major pressing surface. It should be noted that the "first protruding mold structure" and the "second protruding mold structure" are only used to distinguish two different protruding mold structures. Therefore, the compressible optical material can be pressed by adopting the convex die structures of different types according to actual requirements, so that the diversity and flexibility of the optical refractive index of the internal structure of the micro-optical device are improved, and the design freedom of the micro-optical device is further improved.

In an embodiment of the present invention, it is further optional that when the microstructure mold is pressed on the compressible optical material by the device manufacturing apparatus, the main pressing surface of the protruding mold structure is parallel to the surface to be pressed of the compressible optical material, wherein the main pressing surface includes a first main pressing surface or a second main pressing surfaceAnd (5) pressing the noodles. Specifically, as shown in fig. 3(c), for the first type of protruding mold structure, the side perpendicular to the first main pressing surface does not press the compressible optical material, and the optical refractive index obtained by pressing the compressible optical material with the first main pressing surface is a fixed refractive index n ³ And different from the refractive index n of the uncompressed part of the compressible optical material ¹ Thereby forming a target micro-optic with a stepwise change in optical refractive index; for the second type of convex mold structure, the optical refractive index obtained by pressing the compressible optical material with the second main pressing surface is a fixed refractive index n ³ And different from the refractive index n of the uncompressed part of the compressible optical material ¹ The optical refractive index of the compressible optical material obtained by pressing the side surface which is not perpendicular to the second main pressing surface is the graded refractive index n ⁴ And, in the concave optical structure obtained by pressing the side face which is not perpendicular to the second main pressing face, the refractive index n of one end of the concave optical structure which is connected with the concave part obtained by pressing the compressible optical material by the second main pressing face ⁴ And n ³ Equal to the refractive index n of the end of the compressible optical material adjacent to the uncompressed, non-recessed portion ⁴ And n ¹ And thereby forming a target micro-optical structure having a graded change in optical refractive index.

In an embodiment of the present invention, further optionally, each protruding mold structure may comprise a plurality of first main pressing faces and/or a plurality of second main pressing faces that press the compressible optical material to different degrees, whereby the versatility and design freedom of the micro-optical device may be improved.

In an embodiment of the present invention, optionally, as shown in fig. 4, the device manufacturing apparatus may include an optical sensor, a pressure sensor, a high-precision XYZ mechanism, a motor and driver, an arithmetic control platform, and a light source, where the feeding and discharging platform is configured to control a feeding operation of a compressible optical material to be pressed and a discharging operation of a target micro optical device obtained after pressing, the motor and the driver may be configured to press a microstructure mold on the compressible optical material, the pressure sensor may be configured to detect stress parameters of each portion of the microstructure mold during the pressing process, the light source and the optical sensor may be configured to detect optical quality parameters of the target micro optical device obtained after pressing, and the high-precision XYZ mechanism may be configured to control three-dimensional spatial precision in the feeding operation, the pressing operation, the stress detection operation, and the optical quality detection operation. Therefore, the accuracy and the reliability of the micro-optical device pressing can be improved.

Therefore, the micro-structure mold can be pressed on the compressible optical material with the optical refractive index changing along with the pressing degree to obtain the micro-optical device with the optical structure with a plurality of concave surfaces, the preparation complexity and the preparation difficulty of the micro-optical device are reduced, and the micro-structure mold is favorable for realizing batch copying of the micro-optical device, so that the preparation cost of the micro-optical device is reduced.

In an alternative embodiment, as shown in fig. 3(d) (e), the method may further include:

filling a predetermined optical filling material into each concave optical structure by using a control device preparation device to obtain a first type of pure-plane micro-optical device, wherein the material volume of the optical filling material filled in each concave optical structure is equal to the concave volume of the concave optical structure; alternatively, the first and second electrodes may be,

and (3) polishing the convex part of the target micro-optical device, which is compared with the concave optical structure, by the control device preparation equipment until the pressed surface of the target micro-optical device is flat, so as to obtain the second type of pure-plane micro-optical device.

In the embodiment of the invention, the optical refractive index n of the optical filling material is optional ⁵ And the refractive index n of the compressed and uncompressed part of the compressible optical material ¹ And an optical refractive index n obtained by pressing a compressible optical material with a main pressing surface ³ All of which are different, and further alternatively, the optical filling material may comprise a PDMS (Polydimethylsiloxane) polymer.

Therefore, the optional embodiment can be implemented to fill and level the concave optical structure or polish the convex part of the surface of the micro-optical device through the optical filling material to obtain the pure-plane micro-optical device, reduce the damage of the device caused by the micro-structure on the surface of the micro-optical device, and reduce the influence of environmental conditions such as dust on the working performance of the micro-optical device.

In another optional embodiment, the method may further comprise:

detecting whether the target micro-optical device meets the device quality condition, and adjusting the pressing control parameters and/or the microstructure mould of the device preparation equipment when the detection result is negative;

detecting whether the target micro-optical device meets the device quality condition may include:

acquiring stress parameters corresponding to one or more pressed parts of the compressible optical material in the process of pressing the microstructure mould on the compressible optical material by the device preparation equipment based on the pressure sensor corresponding to the device preparation equipment, wherein the stress parameters comprise the stress magnitude corresponding to each pressed part and/or the stress direction corresponding to each pressed part;

judging whether the stress parameters meet preset stress conditions or not;

when the stress parameters are judged to meet the preset stress conditions, acquiring optical quality parameters corresponding to all the concave optical structures based on the optical sensors corresponding to the device preparation equipment;

Therefore, the optional embodiment can be implemented to detect the quality of the micro-optical device by combining the pressure sensor and the optical sensor in the preparation process of the micro-optical device, and if the quality problem exists, the pressing control parameter and the micro-structure mold of the device preparation equipment are timely adjusted, so that the unnecessary preparation cost caused by untimely quality problem discovery is reduced, the intelligence of micro-optical device preparation and processing is improved, and the yield of the micro-optical device is improved.

In this optional embodiment, optionally, the pressure sensor may be a distributed pressure sensor, the pressure sensor may be placed on a back surface of the microstructure mold corresponding to the surface on which the protruding mold is located and/or a back surface of the compressible optical material corresponding to the surface to be pressed, further optionally, when the pressure sensor is placed on the back surface of the microstructure mold, the stress parameter corresponding to each pressed portion of the compressible optical material includes a back pressure parameter corresponding to the protruding mold structure for pressing the pressed portion, which is acquired by the pressure sensor, and the back pressure parameter corresponding to each protruding mold structure may include a pressure parameter distributed to a portion corresponding to the back surface of the microstructure mold by the protruding mold structure in the process of pressing the compressible optical material by the device manufacturing apparatus, so that it is possible to reduce the solid microstructure parameters of each pressed portion of the compressible optical material due to non-uniform structure type of the protruding mold structure The inter-stress parameters are not uniform, so that the detection accuracy is low.

In this optional embodiment, as an optional implementation manner, the determining whether the stress parameter meets the preset stress condition may include:

judging whether the stress parameter meets a preset stress size condition, and determining that the stress parameter does not meet the preset stress size condition when the stress parameter does not meet the preset stress size condition;

when judging that the stress parameter meets the preset stress size condition, judging whether the stress parameter meets the preset stress direction condition, and when judging that the stress parameter does not meet the preset stress direction condition, determining that the stress parameter does not meet the preset stress condition;

wherein, judge whether the atress parameter satisfies the big or small condition of predetermineeing the atress, can include:

judging whether the stress magnitude corresponding to each pressed part is a preset stress magnitude, determining that the stress parameter meets the preset stress magnitude condition when the stress magnitude corresponding to each pressed part is judged to be the preset stress magnitude, and otherwise, determining that the stress parameter does not meet the preset stress magnitude condition; alternatively, the first and second electrodes may be,

judging whether the difference value between the stress size corresponding to each pressed part and the preset stress size is smaller than a first preset threshold value, when the difference value between the stress size corresponding to each pressed part and the preset stress size is smaller than the first preset threshold value, determining that the stress parameter meets the preset stress size condition, otherwise, determining that the stress parameter does not meet the preset stress size condition;

and, judge whether the atress parameter satisfies the condition of predetermined atress direction, can include:

judging whether the stress direction corresponding to each pressed part is the direction vertical to the discharging table, and determining that the stress parameter meets the condition of the preset stress direction when the stress direction corresponding to each pressed part is the direction vertical to the discharging table, otherwise, determining that the stress parameter does not meet the condition of the preset stress direction; alternatively, the first and second electrodes may be,

and judging whether the angle difference value between the stress direction corresponding to each pressed part and the direction perpendicular to the discharging table is smaller than a second preset threshold value, determining that the stress parameter meets the preset stress direction condition when judging that the angle difference value between the stress direction corresponding to each pressed part and the direction perpendicular to the discharging table is smaller than the second preset threshold value, and otherwise, determining that the stress parameter does not meet the preset stress direction condition.

Therefore, whether the stress magnitude and the stress direction of the pressed part meet the preset stress magnitude condition and the preset stress direction condition can be detected in sequence by implementing the optional implementation mode, and the flexibility, the accuracy and the reliability of stress parameter detection are improved.

In this optional embodiment, optionally, when it is determined that the optical quality parameter does not satisfy the preset optical quality condition, the method may further include: and recording the device information of the target micro-optical device according to the stress parameter and the optical quality parameter so as to classify the device quality of the target micro-optical device. This can improve the efficiency and convenience of quality classification of the micro-optical device.

Example two

Referring to fig. 2, fig. 2 is a schematic flow chart of another method for manufacturing a micro-optical device based on mold pressing according to an embodiment of the present disclosure. The method for manufacturing a micro-optical device based on mold pressing described in fig. 2 may be applied to any micro-optical device manufacturing process, such as a micro-optical device based on sub-wavelength characteristics, and the embodiment of the present invention is not limited thereto. As shown in fig. 2, the method for manufacturing a micro-optical device based on mold pressing may include the operations of:

201. and determining a target preparation parameter combination corresponding to the micro-optical device.

In an embodiment of the present invention, optionally, as shown in fig. 5, the target preparation parameter set may include a dimension parameter of the microstructure mold, a pressing control parameter of the device preparation apparatus, and a dimension parameter of the compressible optical material, further optionally, when the microstructure mold includes a first protruding mold structure or a second protruding mold structure, the dimension parameter of the microstructure mold may include a width b of a main pressing surface of each protruding mold structure of the microstructure mold and a distance w between the main pressing surfaces of each two protruding mold structures, the main pressing surfaces include a first main pressing surface or a second main pressing surface, and when the protruding mold structure of the microstructure mold includes a second protruding mold structure, the dimension parameter of the microstructure mold may further include an included angle θ between the second main pressing surface of the second protruding mold structure and a side surface not perpendicular to the second main pressing surface or an included angle θ not perpendicular to the side surface of the second main pressing surface relative to the plane of the second main pressing surface The compression control parameters of the device manufacturing apparatus may include a compression distance d of each raised mold structure to the compressible optical material, and the dimensional parameters of the compressible optical material may include a thickness h of the compressible optical material, and further optionally, the dimensional parameters of the compressible optical material may also include a porosity of the compressible optical material.

As an alternative embodiment, determining a target set of manufacturing parameters for manufacturing a micro-optical device may include:

verifying the current wavefront phase modulation information based on the predetermined target wavefront phase modulation information under the predetermined wavelength to obtain a verification result;

when the verification result shows that the verification of the current wavefront phase modulation information is passed, determining the current preparation parameter combination as a target preparation parameter combination corresponding to the preparation of the micro-optical device;

and when the verification result indicates that the verification of the current wavefront phase modulation information does not pass, adjusting a current preparation parameter combination corresponding to the preparation of the micro-optical device, and re-executing the calculation algorithm based on the current preparation parameter combination and the predetermined wavefront phase, calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination and the target wavefront phase modulation information based on the predetermined wavelength, and verifying the current wavefront phase modulation information to obtain the verification result.

Therefore, the optional implementation mode can verify the current wavefront phase modulation information corresponding to the current preparation parameter combination corresponding to the micro-optical device according to the actually required target wavefront phase modulation information, and readjust the current preparation parameter combination when the verification fails, so that the matching degree of the preparation parameter combination for preparing the micro-optical device and the actual requirement is improved, and the accuracy and the reliability of the preparation of the micro-optical device are further improved.

In this optional embodiment, optionally, verifying the current wavefront phase modulation information based on the predetermined target wavefront phase modulation information at the predetermined wavelength to obtain a verification result, which may include:

calculating the difference degree between the predetermined target wavefront phase modulation information and the predetermined current wavefront phase modulation information under the predetermined wavelength;

and judging whether the difference degree is less than or equal to a preset threshold value, if so, determining to verify the current wavefront phase modulation information, and if not, determining to verify the current wavefront phase modulation information, and if so, determining to verify the current wavefront phase modulation information, and if not, determining to verify the current wavefront phase modulation information.

In this optional embodiment, further optionally, the degree of difference may include a distance value between the target wavefront phase modulation information and the current wavefront phase modulation information.

Therefore, the optional implementation mode can also verify the current wavefront phase modulation information according to the difference between the target wavefront phase modulation information and the current wavefront phase modulation information, so that the verification accuracy is improved, and the accuracy of the determined target preparation parameter combination is further improved.

In this optional embodiment, optionally, before calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the predetermined wavefront phase calculation algorithm, the method may further include:

acquiring an optical refractive index-pressing degree corresponding relation determined based on a plurality of pre-sampled microstructure parameter combinations, wherein the optical refractive index-pressing degree corresponding relation is used for representing the corresponding relation between the optical refractive index and the compression distance, and the optical refractive index-pressing degree corresponding relation comprises an optical refractive index-pressing degree relation curve and/or an optical refractive index-pressing degree lookup table;

calculating current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, which may include:

determining the current optical refractive index corresponding to the current preparation parameter combination according to the corresponding relation between the optical refractive index and the pressing degree;

Therefore, the optional implementation method can also determine the current optical refractive index corresponding to the current preparation parameter combination according to the optical refractive index-pressing degree corresponding relation determined by the pre-sampled microstructure parameter combinations, and further calculate the current wavefront phase modulation information corresponding to the current preparation parameter combination, so that the accuracy and efficiency of calculating the current wavefront phase modulation information are improved.

In this optional embodiment, optionally, the current optical refractive index corresponding to the current preparation parameter combination includes a fixed refractive index n obtained by pressing the main pressing surface of the simulated microstructure mold corresponding to the current preparation parameter combination against the simulated compressible optical material corresponding to the current preparation parameter combination ³ Optionally, if the current preparation parameter combination indicates that the protruding mold structure of the simulated microstructure mold includes a second protruding mold structure, the current optical refractive index further includes a graded refractive index n obtained by pressing the simulated compressible optical material on a side surface of the second protruding mold structure of the simulated microstructure mold, which is not perpendicular to the second main pressing surface ⁴ (ii) a Further alternatively, the optical refractive index-pressing degree correspondence may include n ³ Corresponding first class correspondence and n ⁴ Corresponding second type corresponding relationship, wherein the first type corresponding relationship is n ³ ＝g(n ¹ H, d) the second-type correspondence relationship n ⁴ ＝g(n ¹ H, d, u) and/or n ⁴ ＝g(n ¹ H, d, θ); still further optionally, the optical refractive index-pressing degree relation curve may be determined by fitting a correspondence between the optical refractive index of a plurality of pre-sampled microstructure parameter combinations and a plurality of pre-sampled pressing degrees, and the optical refractive index-pressing degree look-up table may be determined by the optical refractive index-pressing degree relation curve, or may be determined by a correspondence between the optical refractive index of a plurality of pre-sampled microstructure parameter combinations and a plurality of pre-sampled pressing degrees.

In this alternative embodiment, the wavefront phase calculation algorithm may optionally include a wavefront phaseThe modulation information calculation formula and the electromagnetic field calculation algorithm are further optional, and the electromagnetic field calculation algorithm can be one of a time domain finite difference method, a finite element method and a moment method. Wherein, if the current preparation parameters indicate that the protruding mold structure of the simulation microstructure mold only comprises the first protruding mold structure and the target micro-optical device to be prepared does not need to be filled with the optical filling material, the calculation formula of the wavefront phase modulation information can be

If the current preparation parameters indicate that the protruding mold structure of the simulation microstructure mold only comprises the first protruding mold structure and the target micro-optical device to be prepared needs to be filled with the optical filling material, the calculation formula of the wavefront phase modulation information can be

If the current preparation parameters indicate that the protruding mold structure of the simulation microstructure mold comprises a second type protruding mold structure and the target micro-optical device to be prepared does not need to be filled with the optical filling material, the calculation formula of the wavefront phase modulation information can be

Or

If the current preparation parameters indicate that the protruding mold structure of the simulated microstructure mold comprises a second protruding mold structure and the target micro-optical device to be prepared needs to be filled with the optical filling material, the calculation formula of the wavefront phase modulation information can be

Or

Wherein k is constant, λ is preset wavelength, n ⁵ Is the optical refractive index of the optical filling material.

It should be noted that, in other optional embodiments, not only the current preparation parameter combination corresponding to the preparation of the micro optical device may be verified based on the target wavefront phase modulation information at the predetermined wavelength described in the optional embodiments, but also the current preparation parameter combination may be verified based on any one of the target wavefront polarization modulation information at the predetermined wavelength and the target wavefront amplitude modulation information, which is not limited in the embodiment of the present invention.

202. A microstructured mold for making a micro-optical device is determined.

As an alternative embodiment, determining a microstructured mold for making a micro-optical device may comprise: and determining the micro-structural mold for preparing the micro-optical device according to the target preparation parameter combination. This can improve the accuracy of the determined microstructure mold.

203. And controlling the device preparation equipment for preparing the micro-optical device to press the micro-structure mold on the surface to be pressed of the compressible optical material placed on the material table along the direction vertical to the material table on the basis of preset pressure to obtain the target micro-optical device with the surface provided with at least one concave optical structure.

In the embodiment of the present invention, for other descriptions of steps 202 to 203, please refer to the detailed description of steps 101 to 102 in the first embodiment, which is not repeated herein.

Therefore, the embodiment of the invention can press the microstructure mould on the compressible optical material with the optical refractive index changing along with the pressing degree to obtain the micro-optical device with the optical structure with a plurality of concave surfaces, thereby reducing the preparation complexity and the preparation difficulty of the micro-optical device, being beneficial to realizing the batch copying of the micro-optical device through the microstructure mould, further reducing the preparation cost of the micro-optical device, determining the refractive index of the optical material and the size of the micro-optical device as the design variables of the micro-optical device, improving the design freedom of the micro-optical device, and in addition, determining the target preparation parameter combination for preparing the micro-optical device before preparing the micro-optical device, and improving the accuracy and the reliability of the preparation of the micro-optical device.

EXAMPLE III

Referring to fig. 6, fig. 6 is a schematic structural diagram of a micro-optical device manufacturing apparatus based on mold pressing according to an embodiment of the present disclosure. The micro-optical device manufacturing apparatus based on mold pressing described in fig. 6 may be applied to any micro-optical device manufacturing process, such as a micro-optical device based on sub-wavelength characteristics, and the embodiment of the present invention is not limited thereto. As shown in fig. 6, the mold press-based micro optical device manufacturing apparatus may include:

a determining module 301, configured to determine a micro-structured mold for manufacturing a micro-optical device, where a surface of the micro-structured mold has at least one protruding mold structure, and each protruding mold structure is a micro-scale structure;

and the device control module 302 is used for controlling the device manufacturing equipment for manufacturing the micro-optical device to press the micro-structural mold on the surface to be pressed of the compressible optical material placed on the material table in the direction perpendicular to the material table based on the preset pressure to obtain the target micro-optical device with the surface provided with at least one concave optical structure, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device is changed along with the pressing degree change of the micro-structural mold on the compressible optical material, and the convex mold structures are embedded with the concave optical structures formed by pressing the convex mold structures one by one.

It can be seen that implementing the apparatus described in fig. 6 can press the microstructure mold on the compressible optical material whose optical refractive index changes with the pressing degree, to obtain the micro-optical device with a plurality of concave optical structures on the surface, to reduce the preparation complexity and preparation difficulty of the micro-optical device, and to be beneficial to realizing the batch copy of the micro-optical device through the microstructure mold, thereby reducing the preparation cost of the micro-optical device, in addition, the refractive index of the optical material and the size of the micro-optical device can be determined as the design variables of the micro-optical device, and the design freedom of the micro-optical device is improved.

In an alternative embodiment, as shown in FIG. 6, the compressible optical material comprises a porous silicon-based compound.

It can be seen that the implementation of the apparatus depicted in fig. 6 can also use a porous silicon-based compound as the compressible optical material, which is beneficial to improve the strength, toughness, heat resistance, corrosion resistance, oxidation resistance, light transmittance and thermal shock resistance of the micro-optical device, improve the compressible degree of the compressible optical material, and reduce the dielectric loss of the micro-optical device.

In another alternative embodiment, as shown in FIG. 6, the male mold structures are either a first type of male mold structure or a second type of male mold structure;

the first type of protruding die structure comprises a first main pressing surface and a side surface perpendicular to the first main pressing surface; the second type of protruding die structure comprises a second main pressing surface and a side surface which is not vertical to the second main pressing surface, and the included angle between the side surface which is not vertical to the second main pressing surface and the second main pressing surface is larger than 90 degrees and smaller than 180 degrees;

It can be seen that the implementation of the apparatus described in fig. 6 can also adopt different types of protruding mold structures to press the compressible optical material according to actual requirements, thereby improving the diversity and flexibility of the optical refractive index of the internal structure of the micro-optical device, and further improving the design freedom of the micro-optical device.

In yet another alternative embodiment, as shown in fig. 6, the apparatus control module 302 is further configured to control the device manufacturing apparatus to fill a predetermined optical filling material into each recessed optical structure to obtain a first type of pure planar micro-optical device, where a material volume of the optical filling material filled in each recessed optical structure is equal to a recessed volume of the recessed optical structure; or, the device preparation equipment is controlled to polish the convex part of the target micro-optical device, which is compared with the concave optical structure, until the pressed surface of the target micro-optical device is flat, so that the second type of pure-plane micro-optical device is obtained.

It can be seen that, the implementation of the apparatus described in fig. 6 can also fill and level the concave optical structure or polish the convex portion of the surface of the micro-optical device through the optical filling material, so as to obtain a pure-plane micro-optical device, reduce the damage of the device due to the micro-structure on the surface of the micro-optical device, and reduce the influence of environmental conditions such as dust on the working performance of the micro-optical device.

In yet another alternative embodiment, as shown in fig. 6, the determining module 301 is further configured to determine a target manufacturing parameter combination corresponding to the micro-optical device to be manufactured before determining the micro-structured mold for manufacturing the micro-optical device;

the specific manner of determining the target manufacturing parameter combination corresponding to the micro optical device by the determining module 301 may include:

It can be seen that, the implementation of the apparatus described in fig. 6 can also improve the accuracy and reliability of the micro-optical device preparation by determining the target preparation parameter combination for preparing the micro-optical device before preparing the micro-optical device, and verify the current wavefront phase modulation information corresponding to the current preparation parameter combination for preparing the micro-optical device according to the actually required target wavefront phase modulation information, and readjust the current preparation parameter combination when the verification fails, and determine the current preparation parameter combination as the target preparation parameter combination when the verification passes, thereby improving the matching degree between the target preparation parameter combination for preparing the micro-optical device and the actual requirement, and further improving the accuracy and reliability of the micro-optical device preparation.

In yet another alternative embodiment, as shown in fig. 6, the determining module 301 verifies the current wavefront phase modulation information based on the predetermined target wavefront phase modulation information at the predetermined wavelength, and the specific manner of obtaining the verification result may include:

calculating the difference degree between the predetermined target wave front phase modulation information under the predetermined wavelength and the current wave front phase modulation information;

Therefore, the device described in fig. 6 can also verify the current wavefront phase modulation information according to the difference between the target wavefront phase modulation information and the current wavefront phase modulation information, so that the verification accuracy is improved, and the accuracy of the determined target preparation parameter combination is further improved.

In yet another alternative embodiment, as shown in fig. 6, the determining module 301 is further configured to, before calculating current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, obtain an optical refractive index-compression degree corresponding relationship determined based on a plurality of pre-sampled microstructure parameter combinations, where the optical refractive index-compression degree corresponding relationship is used to represent a corresponding relationship between an optical refractive index and a compression distance, and the optical refractive index-compression degree corresponding relationship may include an optical refractive index-compression degree relation curve and/or an optical refractive index-compression degree lookup table;

the specific way for the determining module 301 to calculate the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the predetermined wavefront phase calculation algorithm may include:

It can be seen that, by implementing the apparatus described in fig. 6, the current optical refractive index corresponding to the current preparation parameter combination can be determined according to the corresponding relationship between the optical refractive index and the pressing degree determined by the pre-sampled microstructure parameter combinations, so that the current wavefront phase modulation information corresponding to the current preparation parameter combination is calculated, and the accuracy and efficiency of calculating the current wavefront phase modulation information are improved.

In yet another alternative embodiment, as shown in fig. 7, the apparatus may further include:

the detection module 303 is configured to detect whether the target micro-optical device meets a device quality condition;

the adjusting module 304 is used for adjusting the pressing control parameters and/or the microstructure mold of the device preparation equipment when the target micro-optical device detected by the detecting module 303 does not meet the device quality condition;

the specific way for detecting whether the target micro-optical device satisfies the device quality condition by the detection module 303 may include:

judging whether the stress parameters meet preset stress conditions or not;

when the stress parameters are judged to meet the preset stress conditions, acquiring optical quality parameters corresponding to all the concave optical structures based on the optical sensors corresponding to the device manufacturing equipment;

Therefore, the device described in the embodiment of fig. 7 can be used for detecting the quality of the micro-optical device by combining the pressure sensor and the optical sensor in the preparation process of the micro-optical device, and if the quality problem exists, the pressing control parameter of the device preparation equipment and the micro-structure mold are timely adjusted, so that the unnecessary preparation cost caused by untimely quality problem discovery is reduced, the intelligence of the preparation and processing of the micro-optical device is improved, and the yield of the micro-optical device is improved.

Example four

Referring to fig. 8, fig. 8 is a schematic structural diagram of another micro-optical device manufacturing apparatus based on mold pressing according to an embodiment of the disclosure. As shown in fig. 8, the mold press-based micro-optical device manufacturing apparatus may include:

a memory 401 storing executable program code;

a processor 402 coupled with the memory 401;

the processor 402 calls the executable program code stored in the memory 401 to execute the steps of the method for manufacturing a micro-optical device based on mold clamping according to the first embodiment or the second embodiment of the present invention.

EXAMPLE five

The embodiment of the invention discloses a computer storage medium, which stores computer instructions, and when the computer instructions are called, the computer instructions are used for executing the steps in the micro-optical device preparation method based on die pressing described in the first embodiment or the second embodiment of the invention.

EXAMPLE six

An embodiment of the present invention discloses a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to cause a computer to execute the steps of the method for manufacturing a micro-optical device based on mold pressing described in the first embodiment or the second embodiment.

The above-described embodiments of the apparatus are merely illustrative, and the modules described as separate components may or may not be physically separate, and the components shown as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Through the above detailed description of the embodiments, those skilled in the art will clearly understand that the embodiments may be implemented by software plus a necessary general hardware platform, and may also be implemented by hardware. Based on such understanding, the above technical solutions may be embodied in the form of a software product, which may be stored in a computer-readable storage medium, where the storage medium includes a Read-Only Memory (ROM), a Random Access Memory (RAM), a Programmable Read-Only Memory (PROM), an Erasable Programmable Read-Only Memory (EPROM), a One-time Programmable Read-Only Memory (OTPROM), an Electrically Erasable Programmable Read-Only Memory (EEPROM), a Compact Disc-Read-Only Memory (CD-ROM), or other disk memories, CD-ROMs, or other magnetic disks, A tape memory, or any other medium readable by a computer that can be used to carry or store data.

Finally, it should be noted that: the method and apparatus for manufacturing micro-optical device based on mold pressing disclosed in the embodiments of the present invention are only the preferred embodiments of the present invention, and are only used for illustrating the technical solution of the present invention, not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art; the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for fabricating a micro-optical device based on mold pressing, the method comprising:

determining a micro-structured mold for producing a micro-optical device, wherein the micro-structured mold surface has at least one raised mold structure, each raised mold structure being a micro-scale structure;

2. A method for fabricating micro-optical devices based on mold pressing as claimed in claim 1, wherein the compressible optical material comprises a porous silicon-based compound.

3. The mold-pressing-based micro optical device manufacturing method according to claim 1 or 2, wherein the protruding mold structure is a first-type protruding mold structure or a second-type protruding mold structure;

for the second type of raised mold structure, the side that is not perpendicular to the second major pressing surface has a pressing effect on the compressible optical material, and the side that is not perpendicular to the second major pressing surface has a different optical index of refraction for pressing the compressible optical material than the second major pressing surface.

4. A mold press-based micro-optical device fabrication method as claimed in claim 3, further comprising:

5. The mold-pressing-based micro-optical device fabrication method of any one of claims 1, 2, and 4, wherein before the determining the micro-structured mold for fabricating the micro-optical device, the method further comprises:

6. A micro-optical device manufacturing method based on mold pressing as claimed in claim 5, wherein the verifying the current wavefront phase modulation information based on the predetermined target wavefront phase modulation information at the predetermined wavelength to obtain the verification result comprises:

and judging whether the difference degree is less than or equal to a preset threshold value, if so, determining to verify the current wave front phase modulation information, and if not, determining to verify the current wave front phase modulation information, and if so, determining to verify the current wave front phase modulation information, and if not, determining to verify the current wave front phase modulation information, and determining to not verify the current wave front phase modulation information.

7. The mold-pressing-based micro-optical device manufacturing method of claim 5, wherein before the calculating of the current wavefront phase modulation information corresponding to the current manufacturing parameter combination based on the current manufacturing parameter combination and a predetermined wavefront phase calculation algorithm, the method further comprises:

8. A mold-pressing based micro-optical device fabrication method as claimed in any one of claims 1, 2, 4, 6, and 7, further comprising:

judging whether the stress parameters meet preset stress conditions or not;

9. A micro-optical device manufacturing apparatus based on mold pressing, the apparatus comprising:

10. A micro-optical device manufacturing apparatus based on mold pressing, the apparatus comprising:

a memory storing executable program code;

a processor coupled with the memory;

the processor calls the executable program code stored in the memory to execute the micro-optical device manufacturing method based on mold pressing according to any one of claims 1 to 8.