CN115055916B - Shape memory alloy soft driver with temperature self-sensing function - Google Patents
Shape memory alloy soft driver with temperature self-sensing function Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
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- Temperature-Responsive Valves (AREA)
Abstract
The application provides a shape memory alloy soft driver with a temperature self-sensing function, which comprises: -a shape memory alloy wire (1), said shape memory alloy wire (1) being heatable by an electric current; a flexible temperature sensor (2) abutting against the shape memory alloy wire (1); and a pre-stretching layer flexible substrate (3) and an encapsulation layer flexible substrate (4), wherein the shape memory alloy wire (1) and the flexible temperature sensor (2) are encapsulated between the pre-stretching layer flexible substrate (3) and the encapsulation layer flexible substrate (4), and the pre-stretching layer flexible substrate (3) after the pre-stretching is released to provide a curling force, so that the driver presents a curling state when the shape memory alloy wire (1) is not heated by current; after the shape memory alloy wire (1) is heated by current, the driver can be unfolded, and after the shape memory alloy wire (1) is cooled, the driver can recover the curled state.
Description
Technical Field
The application relates to the field of flexible electronic equipment, in particular to a shape memory alloy soft driver with a temperature self-sensing function and a preparation method of the shape memory alloy soft driver with the temperature self-sensing function.
Background
Soft robots are an emerging branch of the current robot field, which has the characteristics of small volume, light weight and softness, making them more advantageous than traditional rigid robots in certain situations. For example, the device can move in a narrow and unstructured environment, and has application prospects in the fields of medical treatment, military reconnaissance, disaster relief and the like. In the above application scenario, the software driver is an important component of the power and motion output of the software robot.
Disclosure of Invention
The application provides a shape memory alloy soft driver with a temperature self-sensing function and a preparation method thereof.
The shape memory alloy software driver with the temperature self-sensing function comprises:
a shape memory alloy wire that can be connected into an electrical circuit, the shape memory alloy wire being heatable by an electrical current;
a flexible temperature sensor which is abutted against the shape memory alloy wire and is used for detecting the temperature of the shape memory alloy wire; and
A pre-stretching layer flexible substrate and an encapsulation layer flexible substrate, the shape memory alloy wires and the flexible temperature sensor being encapsulated between the pre-stretching layer flexible substrate and the encapsulation layer flexible substrate,
Releasing the prestretched flexible substrate of the prestretched layer to provide a curling force, so that the shape memory alloy soft driver with the temperature self-sensing function presents a curling state when the shape memory alloy wire is not heated by current; after the shape memory alloy wire is heated by current, the shape memory alloy soft driver with the temperature self-sensing function can be unfolded; after the shape memory alloy wire is cooled, the shape memory alloy soft driver with the temperature self-sensing function can recover the curled state.
In at least one embodiment, the shape memory alloy wire is U-shaped, W-shaped, or serpentine.
In at least one embodiment, a recess is provided in the encapsulation layer flexible substrate, in which recess the shape memory alloy wire and the flexible temperature sensor are accommodated.
In at least one embodiment, the grooves include a first groove that accommodates the shape memory alloy wire and a second groove that accommodates the flexible temperature sensor, the second groove having a depth that is greater than a thickness of the flexible temperature sensor such that the second groove is capable of providing space for out-of-plane displacement of the flexible temperature sensor.
In at least one embodiment, the material of the pre-stretched layer flexible substrate and the encapsulation layer flexible substrate is a silicone gel doped with a thermally conductive material comprising at least one of a liquid alloy, a metal powder, and a graphene powder.
In at least one embodiment, the flexible temperature sensor comprises a functional layer, and a first substrate layer and a second substrate layer arranged on two sides of the functional layer, wherein the first substrate layer or the second substrate layer prevents the functional layer from directly contacting with the shape memory alloy wires.
In at least one embodiment, the functional layer includes a temperature detection region and a lead-out region connected to the temperature detection region, the temperature detection region having a serpentine shape.
In at least one embodiment, a transition layer is provided between the functional layer and the first substrate layer, and/or
A transition layer is arranged between the functional layer and the second substrate layer,
The material of the transition layer comprises chromium.
In at least one embodiment, two ends of the shape memory alloy wire extend out of the substrate formed by the pre-stretching layer flexible substrate and the packaging layer flexible substrate, and are used for connecting a circuit for heating.
In at least one embodiment, the pre-stretching direction of the pre-stretched layer flexible substrate is arranged parallel to the extension direction of the partial structure of the shape memory alloy wires.
The preparation method of the shape memory alloy soft driver with the temperature self-sensing function comprises the following steps:
providing a shape memory alloy wire;
providing a flexible temperature sensor, and abutting the flexible temperature sensor against the shape memory alloy wire, wherein the flexible temperature sensor is used for measuring the temperature of the shape memory alloy wire;
providing a prestretching layer flexible substrate and a packaging layer flexible substrate, packaging the shape memory alloy wires and the flexible temperature sensor between the prestretching layer flexible substrate and the packaging layer flexible substrate,
Wherein the prestretching layer flexible substrate is prestretched before packaging, after the shape memory alloy wire and the flexible temperature sensor are packaged between the prestretching layer flexible substrate and the packaging layer flexible substrate in a prestretching state, prestretching applied to the prestretching layer flexible substrate is released, so that the packaged shape memory alloy soft driver with the temperature self-sensing function presents a curled state,
After the shape memory alloy wire is heated by current, the shape memory alloy soft driver with the temperature self-sensing function can be unfolded, and after the shape memory alloy wire is cooled, the shape memory alloy soft driver with the temperature self-sensing function can be restored to a curled state.
In at least one embodiment, the shape memory alloy wire is U-shaped, W-shaped, or serpentine.
In at least one embodiment, a recess is provided in the encapsulation layer flexible substrate, in which recess the shape memory alloy wire and the flexible temperature sensor are accommodated.
In at least one embodiment, the grooves include a first groove that accommodates the shape memory alloy wire and a second groove that accommodates the flexible temperature sensor, the second groove having a depth that is greater than a thickness of the flexible temperature sensor such that the second groove is capable of providing space for out-of-plane displacement of the flexible temperature sensor.
In at least one embodiment, the material of the pre-stretched layer flexible substrate and the encapsulation layer flexible substrate is a silicone gel doped with a thermally conductive material comprising at least one of a liquid alloy, a metal powder, and a graphene powder.
In at least one embodiment, the flexible temperature sensor comprises a functional layer, and a first substrate layer and a second substrate layer arranged on two sides of the functional layer, wherein the first substrate layer or the second substrate layer prevents the functional layer from directly contacting with the shape memory alloy wires.
In at least one embodiment, the functional layer includes a temperature detection region and a lead-out region connected to the temperature detection region, the temperature detection region having a serpentine shape.
In at least one embodiment, a transition layer is provided between the functional layer and the first substrate layer, and/or
A transition layer is provided between the functional layer and the second substrate layer,
The material of the transition layer comprises chromium.
In at least one embodiment, two ends of the shape memory alloy wire extend out of the substrate formed by the pre-stretching layer flexible substrate and the packaging layer flexible substrate, and are used for connecting a circuit for heating.
In at least one embodiment, the pre-stretching direction of the pre-stretched layer flexible substrate is arranged parallel to the extension direction of the partial structure of the shape memory alloy wires.
According to the application, the shape memory alloy wire provides driving force for the driver, and the flexible temperature sensor is directly abutted against the shape memory alloy wire, so that the driver has a temperature self-sensing function, and the output control of the driver is facilitated.
Drawings
FIG. 1 shows a schematic diagram of a shape memory alloy software driver with temperature self-sensing function according to an embodiment of the present application.
FIG. 2 illustrates a top view of a shape memory alloy software driver with temperature self-sensing capability with the encapsulation layer flexible substrate removed, according to an embodiment of the present application.
FIG. 3 shows a schematic structural diagram of a flexible substrate of an encapsulation layer of a shape memory alloy soft driver with a temperature self-sensing function according to an embodiment of the present application.
FIG. 4 shows a schematic diagram of the shape change of a shape memory alloy soft driver with temperature self-sensing function according to an embodiment of the present application.
Fig. 5 shows a schematic structural diagram of a flexible temperature sensor of a shape memory alloy soft driver with a temperature self-sensing function according to an embodiment of the present application.
Fig. 6 shows a top view of the functional layers of the flexible temperature sensor of fig. 5.
Fig. 7 shows a schematic structural view of a shape memory alloy wire heat-setting die according to an embodiment of the present application.
Fig. 8 shows a schematic diagram of a manufacturing step of a flexible temperature sensor according to an embodiment of the present application.
Fig. 9 shows a schematic structural view of a mold for a pre-stretched layer flexible substrate according to an embodiment of the present application.
Fig. 10 shows a schematic structural view of a mold for an encapsulation layer flexible substrate according to an embodiment of the present application.
Fig. 11 shows a schematic structural view of a uniaxial stretching device according to an embodiment of the present application.
Description of the reference numerals
1. A shape memory alloy wire;
2. A flexible temperature sensor; 21. a first substrate layer; 22. a functional layer; 221. a temperature detection zone; 222. a lead-out area; 23. a second substrate layer;
3. prestretching the layer flexible substrate;
4. an encapsulation layer flexible substrate; 41. a groove;
5. A heat setting die for the shape memory alloy wire; 51. alloy wire grooves;
6. a die for pre-stretching the layer flexible substrate;
7. a mold for the flexible substrate of the encapsulation layer; 71. a first boss; 72. second protruding part
8. A uniaxial stretching device; 81. a cover plate; 82. matrix body
Detailed Description
Exemplary embodiments of the present application are described below with reference to the accompanying drawings. It should be understood that these specific illustrations are for the purpose of illustrating how one skilled in the art may practice the application, and are not intended to be exhaustive of all of the possible ways of practicing the application, nor to limit the scope of the application.
The embodiment of the application provides a shape memory alloy soft driver (hereinafter, sometimes simply referred to as a driver) with a temperature self-sensing function and a preparation method thereof. The driver can be used in the fields of soft robots and the like and has the characteristics of high reliability, light weight, softness, integrated driving and sensing and the like.
Referring to fig. 1, the actuator may include a shape memory alloy wire 1, a flexible temperature sensor 2, a pre-stretched layer flexible substrate 3, and an encapsulation layer flexible substrate 4.
Referring to fig. 2 and 4, a majority of the shape memory alloy wire 1 and all of the flexible temperature sensor 2 may be encapsulated between the pre-stretched layer flexible substrate 3 and the encapsulation layer flexible substrate 4. Both end portions of the shape memory alloy wire 1 may protrude from the flexible substrates (the pre-stretching layer flexible substrate 3 and the encapsulation layer flexible substrate 4) for connecting wires to apply a heating current.
In principle, the internal lattice of shape memory alloys (shape memory alloys, SMA) is capable of reversible martensitic transformation at different temperatures, the elastic modulus of the shape memory alloy also varying with temperature. The functional expression of the elastic modulus E (ζ M) of the shape memory alloy is:
E(ξM)＝EA+ξM(EM-EA) (1)
Wherein, xi M is the mass fraction of martensite and has a negative correlation with temperature. E A、EM is the modulus of elasticity of austenite and martensite, respectively, and E A＞EM. According to formula (1), when the temperature of the shape memory alloy is lower than the phase transition temperature, the main component of the shape memory alloy is martensite with lower elastic modulus, and the whole shape can be deformed at will; when the temperature of the shape memory alloy is increased and is higher than the phase transition temperature, the main component of the shape memory alloy is transformed into austenite with higher elastic modulus, and the whole shape spontaneously changes into a memory shape at high temperature; when the temperature drops below the transformation temperature again, the main components of the shape memory alloy are transformed into martensite again, and the whole shape can be deformed at will.
The application utilizes the shape memory property of the shape memory alloy as the main body part of the driver. Illustratively, the material of the shape memory alloy wire 1 may be a nickel titanium (NiTi) shape memory alloy having a one-way memory effect. The shape of the shape memory alloy wire 1 can be U-shaped, W-shaped or snake-shaped, and compared with the shape of a single line segment, the U-shaped, W-shaped or snake-shaped arrangement mode can enable more shape memory alloy to be arranged in the driver, and the driving force of the driver is improved. It is to be understood that the present application is not limited to the shape of the cross section of the shape memory alloy wire 1, and it may be, for example, circular, rectangular, etc.
The flexible temperature sensor 2 is in direct contact with the shape memory alloy wire 1 such that the flexible temperature sensor 2 can measure the real-time temperature of the shape memory alloy wire 1. Further, the information such as the elastic modulus of the flexible memory alloy wire 1 can be reversely deduced from the temperature to obtain the form of the actuator. Compared with the traditional non-contact temperature detection methods such as infrared detection, the method can measure the more accurate real-time temperature of the shape memory alloy wire 1 instead of measuring the temperature of the flexible substrate wrapped outside the shape memory alloy wire 1.
The pre-stretched layer flexible substrate 3 may be pre-stretched before the components of the actuator are packaged together, creating an overall curl with the strain mismatch of the structure, giving the actuator an overall, e.g. curled, state. This curled state can store elastic potential energy so that it can be quickly restored to a curled state (described later) by the elastic potential energy after the driving of the shape memory alloy wire 1 is completed. The direction of the pretensioning may be arranged parallel to part of the structure of the shape memory alloy wire 1, e.g. the direction of the pretensioning may be parallel to one side of the U-shaped shape memory alloy wire 1, so that the actuator can resume the original (curled) state after the shape memory alloy wire 1 has stopped heating.
Referring to fig. 3, a recess 41 may be provided in the encapsulation layer flexible substrate 4, and the recess 41 may be used to accommodate the shape memory alloy wire 1 and the flexible temperature sensor 2. The space of the groove 41 may be slightly larger than the volume of the shape memory alloy wire 1 and the flexible temperature sensor 2. The groove 41 may include a first groove for accommodating the shape memory alloy wire 1 and a second groove for accommodating the flexible temperature sensor 2, and the depth of the second groove may be greater than the thickness of the flexible temperature sensor 2. In the process of curling and flattening the driver, the second groove can provide space for out-of-plane displacement generated by the flexible temperature sensor 2, and the stretching and compression bearing capacity of the flexible temperature sensor 2 is improved.
Illustratively, the material of the pre-stretched layer flexible substrate 3 and the encapsulation layer flexible substrate 4 may be a silicone material doped with a highly thermally conductive material. The high heat conduction material can be liquid alloy, metal powder, graphene powder and other materials. The doped high-heat-conductivity material can improve the heat conductivity coefficient of the flexible substrate, improve the heat dissipation capacity and shorten the time for recovering the initial state after the driver is driven. The technical scheme of the doping material can also keep the flexible characteristics of the flexible matrix.
Referring to fig. 4, the driving principle of the driver may be:
(1) In an initial state (not electrified), the main component of the shape memory alloy wire 1 is martensite with lower elastic modulus, and the main function of the driver is the curling force brought by the prestretching layer flexible substrate 3, so that the whole driver is in a curled state;
(2) When the current is conducted, the shape memory alloy wire 1 generates joule heat, the temperature of the shape memory alloy wire 1 is increased, the elastic modulus of the shape memory alloy wire 1 is increased and is deformed to a plane state, so that the driver can be unfolded (the side curvature radius of the driver is increased), and the driver generates corresponding driving force and moment;
(3) The energizing of the shape memory alloy wire 1 is stopped, the actuator is naturally cooled after heat exchange with the surrounding environment, the elastic modulus of the shape memory alloy wire 1 is reduced, and the actuator is restored to the initial curled state.
The shape memory alloy wire 1 has a fast thermal response speed, thereby imparting a rapid motion capability to the driver. Thus, the temperature of the shape memory alloy wire 1 can be controlled by the current, and thus the changes of the shape memory alloy wire 1 and the driver can be controlled. For example, the shape memory alloy wire 1 may be heated and cooled according to a certain rule, so that the driver outputs a certain set operation. Real-time temperature feedback is beneficial to timely adjusting the states of all parts, so that the process is more accurate.
Referring to fig. 5 and 6, further, the flexible temperature sensor 2 provided by the present application may include a first substrate layer 21, a functional layer 22, and a second substrate layer 23. The material of the functional layer 22 may be gold, copper, platinum, or other metal, and its thickness may be set to 150nm to 250nm, and its thinner layer thickness provides the functional layer 22 with excellent flexibility. The first substrate layer 21 and the second substrate layer 23 may be disposed on both sides of the functional layer 22, insulating the functional layer 22 from the shape memory alloy wire 1 to prevent conduction interference. The material of the first substrate layer 21 and the second substrate layer 23 may be polyimide or the like, and the thickness thereof may be set to 5 μm to 10 μm.
Since the functional layer 22 is located substantially on the neutral layer of the flexible temperature sensor 2 in terms of mechanical angle, it is less likely to be damaged because the flexible temperature sensor 2 is minimally stressed by bending load, and durability can be improved.
In order to improve the adhesion between the functional layer 22 and the substrate layers (the first substrate layer 21 and the second substrate layer 23), a transition layer made of metal may be provided between the functional layer 22 and the substrate layers, and for example, a metal material having a strong adhesion to the substrate such as chromium may be used.
The functional layer 22 may include a temperature detection region 221 extending in a serpentine shape and a lead-out region 222 for connecting leads. The basic principle of the temperature sensor is to use the thermal resistance effect of the metal material. The resistance of a metal conductor increases linearly with increasing temperature over a range of temperatures. The temperature T of which satisfies
Where R is the resistance of the metal conductor at the current temperature T, R 0 is the reference resistance at the reference temperature T 0, and α is the temperature coefficient of resistance. Before use, T 0、R0 and alpha are determined by a temperature calibration test, so that according to formula (2), the real-time temperature of the metal conductor can be determined by the real-time resistance of the sensor, and the real-time temperature of the heat source-shape memory alloy wire 1 of the sensor can be obtained.
The structure of the temperature detection region 221 is configured in a serpentine form, which can improve the stretching and compressing ability of the flexible temperature sensor 2 and reduce the resistance change caused by the stretching and compressing deformation of the temperature detection region 221. For example, when the temperature detection region 221 is stretched or compressed in the length direction (e.g., the left-right direction in fig. 6), the serpentine structure generates in-plane and out-of-plane displacements, and meanwhile, the resistance change caused by stretching and compression can be reduced, so that the resistance change of the flexible temperature sensor 2 is mainly based on the temperature change, and the correspondence between the temperature and the resistance is more accurate. The snake-shaped structure greatly improves the stretching and compression bearing capacity of the flexible temperature sensor and improves the accuracy of temperature detection of the sensor.
The lead-out area 222 may be a metal disk connected to the end of the temperature detecting area 221, and the lead-out area 222 is used for leading out a wire (not shown in the figure), and by measuring the resistance of the functional layer 22, the real-time temperature of the shape memory alloy wire 1 measured by the flexible temperature sensor 2 can be obtained.
Referring to fig. 5, the first substrate layer 21 may have a structure and a size consistent with the functional layer 22, the second substrate layer 23 may have a structure and a size consistent with the temperature detection region 221, i.e., the second substrate layer 23 does not have the lead-out region 222, and wires may be connected from the second substrate layer 23 side of the functional layer 22.
The flexible temperature sensor 2 provided by the application can well realize the drive and sensor integrated function of the driver under the condition that the original movement of the shape memory alloy wire 1 is not interfered. The output state of the driver can be controlled more precisely by temperature feedback.
The application also provides a preparation method of the shape memory alloy soft driver with the temperature self-sensing function, which comprises the steps of preparing the shape memory alloy wire 1, preparing the flexible temperature sensor 2, and preparing the pre-stretching layer flexible substrate 3 and the packaging layer flexible substrate 4.
Referring to fig. 7, the preparation of the shape memory alloy wire 1 may include the following steps, for example.
(1) The shape memory alloy wire heat setting mold 5 is prepared by a machining method, and the material of the mold can be high temperature resistant plastic or metal. A wire groove 51 may be provided in the shape memory alloy wire heat setting die 5. To facilitate removal of the shape memory alloy wire while securing the shape memory alloy wire, the depth of the wire groove 51 may be set to be between the radius and diameter of the shape memory alloy wire 1.
(2) The shape memory alloy wire 1 is bent and embedded into the alloy wire groove 51, and is subjected to a heat setting process at 500 ℃ for half an hour, naturally cooled to room temperature and taken out, so as to obtain the shape memory alloy wire with a memory shape setting, such as a plane U shape.
Referring to fig. 8, the preparation of the flexible temperature sensor 2 may illustratively include the following steps.
(S1) preparing a multilayer film: for example, spin coating a sacrificial layer of polymethyl methacrylate (PMMA) on a silicon wafer, baking and curing to form a film; spin-coating flexible substrate Polyimide (PI) on PMMA, and step-heating to cure into a film as a first substrate 21; depositing a copper metal film of the functional layer 22 on the PI by utilizing an electron beam evaporation mode; and spin-coating a flexible substrate PI on the copper surface by the same process to serve as a second substrate 23, and depositing a metal mask layer of aluminum.
(S2) first photolithography: spin-coating positive photoresist on the surface of the multilayer film material, and baking and curing; covering a first mask plate (not shown in the figure) on the photoresist layer, wherein the mask plate pattern is consistent with the pattern of the functional layer 22 of the flexible temperature sensor 2 (comprising a serpentine pattern and a disc pattern for welding), exposing to ultraviolet light, and baking and fixing; placing the sample in a developing solution to develop the photoresist layer, removing the photoresist layer part exposed in the previous step, and leaving the photoresist layer of the mask pattern; and etching the aluminum layer without photoresist protection by using an aluminum etching solution to obtain the aluminum layer with the first mask pattern.
(S3) patterning the functional layer 22 (copper layer) and the first substrate layer 21 (lower substrate in fig. 8): carrying out Reactive Ion Etching (RIE) on the sample obtained in the last step, and removing PI parts and top photoresist which are not protected by the patterned aluminum mask; etching the copper layer by using a copper etching solution to obtain a functional layer with a design pattern; RIE is performed on the sample to obtain a first substrate 21 having a design pattern.
(S4) second lithography: and (3) spin-coating positive photoresist by adopting the same process as the first photoetching, covering a second mask plate (not shown in the figure) on the photoresist layer, enabling the mask plate pattern to be consistent with the pattern of the second substrate layer 23 of the sensor (only including a serpentine pattern and no disc pattern for welding), exposing to ultraviolet light, developing, and etching the aluminum layer without photoresist protection by using aluminum etching liquid to obtain the aluminum layer of the second mask plate pattern.
(S5) patterning the second substrate layer 23 (upper substrate in fig. 8): RIE is performed on the sample obtained in the previous step to remove the PI portion and the top photoresist that are not protected by the patterned aluminum mask, resulting in a second substrate layer 23 with a design pattern. It will be appreciated that the functional layer copper (functional layer 22) under the PI layer (second substrate layer 23) will protect the previously prepared first substrate layer 21 from etching.
(S6) removing the mask and soldering the wire: removing the top layer aluminum mask by using an aluminum etching solution; the flexible temperature sensor 2 is manufactured by soldering a lead wire to a soldering lands of the lead-out area of the functional layer 22. It can be understood that PMMA is used as a sacrificial layer to fix the flexible temperature sensor 2 on a hard substrate silicon wafer, and the PMMA is left on the silicon wafer after transfer, so that no influence is exerted on the flexible temperature sensor 2.
Referring to fig. 9, 10, the preparation of the pre-stretched layer flexible substrate 3 and the encapsulation layer flexible substrate 4 may include the following steps, for example.
(1) The mold 6 for the pre-stretching layer flexible substrate and the mold 7 for the packaging layer flexible substrate are respectively prepared by using a 3D printing or machining method, and the materials of the mold can be resin, metal or the like. The mold 6 for pre-stretching the layer flexible substrate may have a flat plate-like depression. The mold 7 for the encapsulation layer flexible substrate may have a flat plate-like recess having therein a protrusion complementary in shape to the recess 41 of the encapsulation layer flexible substrate 4. Illustratively, the protrusion includes a first protrusion 71 and a second protrusion 72 disposed on the first protrusion 71, the first protrusion 71 may correspond to the second groove of the encapsulation layer flexible substrate 4, and the second protrusion 72 may correspond to the first groove of the encapsulation layer flexible substrate 4.
(2) For example, a silica gel material is used as a flexible substrate material, an uncured silica gel material is prepared, the uncured silica gel material is poured into a mold 6 for a prestretched layer flexible substrate and a mold 7 for a packaging layer flexible substrate after vacuum defoamation treatment, and the mold is scraped with a flat plate along the upper surface of the mold to remove the redundant material.
(3) And demolding after the silica gel material is completely cured, and obtaining the prestretched layer flexible substrate 3 and the packaging layer flexible substrate 4.
The pre-stretching layer flexible substrate 3 needs to be pre-stretched before packaging. The uniaxial stretching device 8 by means of which the pretensioning of the pretensioned layer flexible substrate 3 can be achieved can be produced using 3D printing or machining methods. The material can be resin or metal. Illustratively, the uniaxial stretching device 8 may include two cover plates 81 and a base 82. The pre-stretched flexible substrate 3 may be placed in the base 82 of the uniaxial stretching device 8, one end of the pre-stretched flexible substrate 3 is first pressed with one cover plate 81 and clamped with a clip, the other end is elongated, the other end of the pre-stretched flexible substrate 3 is pressed with the other cover plate 81 and clamped with a clip, and the pre-strained pre-stretched flexible substrate 3 is obtained.
Of course, the pre-stretching of the pre-stretched layer flexible substrate 3 may be achieved using various existing single or double axis stretching means.
The method for preparing the whole driver can further comprise the following steps: transferring the flexible temperature sensor 2 from the hard silicon wafer to a set position of the pre-stretching layer flexible substrate 3 by using the flexible seal; coating a silica gel adhesive on the contact part of the packaging layer flexible substrate 4 and the pre-stretching layer flexible substrate 3, and bonding; and cutting out the driver with the required size after the silica gel adhesive is completely cured.
The shape memory alloy wire 1 and the flexible substrate have good fatigue characteristics, and the flexible temperature sensor 2 has high flexibility and ductility, so the driver has high reliability. Meanwhile, the flexible substrate is made of silica gel, so that the driver is light and flexible.
While the foregoing is directed to the preferred embodiments of the present application, it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the application, and such changes and modifications are intended to be included within the scope of the application.
Claims (8)
1. A shape memory alloy software driver with temperature self-sensing function, comprising:
A shape memory alloy wire (1) which can be connected into a circuit, can heat the shape memory alloy wire (1) through electric current, when the temperature of the shape memory alloy wire (1) is increased and is higher than the phase transition temperature, the whole shape of the shape memory alloy wire (1) spontaneously changes into a memory shape at high temperature, and when the temperature is reduced to below the phase transition temperature again, the shape memory alloy wire (1) can be deformed at will;
A flexible temperature sensor (2) against the shape memory alloy wire (1) for detecting the temperature of the shape memory alloy wire (1); and
A prestretching layer flexible substrate (3) and an encapsulation layer flexible substrate (4), the shape memory alloy wire (1) and the flexible temperature sensor (2) being encapsulated between the prestretching layer flexible substrate (3) and the encapsulation layer flexible substrate (4),
Releasing the prestretched flexible substrate (3) to provide a curling force, so that the shape memory alloy soft driver with the temperature self-sensing function is in a curled state when the shape memory alloy wire (1) is not heated by current; after the shape memory alloy wire (1) is heated by current, the shape memory alloy soft driver with the temperature self-sensing function can be unfolded; after the shape memory alloy wire (1) is cooled, the shape memory alloy soft driver with the temperature self-sensing function can recover the curled state,
A groove (41) is arranged in the packaging layer flexible substrate (4),
The groove (41) comprises a first groove for accommodating the shape memory alloy wire (1) and a second groove for accommodating the flexible temperature sensor (2), wherein the depth of the second groove is larger than the thickness of the flexible temperature sensor (2), so that the second groove can provide space for out-of-plane displacement of the flexible temperature sensor (2).
2. The shape memory alloy software driver with temperature self-sensing function according to claim 1, wherein,
The shape memory alloy wire (1) is U-shaped, W-shaped or serpentine.
3. The shape memory alloy software driver with temperature self-sensing function according to claim 1, wherein,
The material of the pre-stretching layer flexible substrate (3) and the packaging layer flexible substrate (4) is silica gel doped with a heat conducting material, wherein the heat conducting material comprises at least one of liquid alloy, metal powder and graphene powder.
4. The shape memory alloy software driver with temperature self-sensing function according to claim 1, wherein,
The flexible temperature sensor (2) comprises a functional layer (22), and a first substrate layer (21) and a second substrate layer (23) which are arranged on two sides of the functional layer (22), wherein the first substrate layer (21) or the second substrate layer (23) prevents the functional layer (22) from being directly contacted with the shape memory alloy wire (1).
5. The shape memory alloy software driver with temperature self-sensing function according to claim 4, wherein,
The functional layer (22) comprises a temperature detection region (221) and a lead-out region (222) connected to the temperature detection region (221), wherein the temperature detection region (221) is in a serpentine shape.
6. The shape memory alloy software driver with temperature self-sensing function according to claim 4, wherein,
A transition layer is arranged between the functional layer (22) and the first substrate layer (21), and/or
A transition layer is arranged between the functional layer (22) and the second substrate layer (23),
The material of the transition layer comprises chromium.
7. The shape memory alloy software driver with temperature self-sensing function according to claim 1, wherein,
The two ends of the shape memory alloy wire (1) extend out of the substrate formed by the pre-stretching layer flexible substrate (3) and the packaging layer flexible substrate (4) and are used for connecting a circuit for heating.
8. The shape memory alloy software driver with temperature self-sensing function according to claim 1, wherein,
The pre-stretching direction of the pre-stretching layer flexible substrate (3) is arranged parallel to the extension direction of the partial structure of the shape memory alloy wire (1).
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