CN115053511A - Periscopic camera module and manufacturing method thereof - Google Patents
Periscopic camera module and manufacturing method thereof Download PDFInfo
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- CN115053511A CN115053511A CN202080085310.1A CN202080085310A CN115053511A CN 115053511 A CN115053511 A CN 115053511A CN 202080085310 A CN202080085310 A CN 202080085310A CN 115053511 A CN115053511 A CN 115053511A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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Abstract
The application discloses periscopic camera module and a manufacturing method thereof. The periscopic camera module comprises a module component, a light turning component, a light quantity adjusting component and a circuit board component. The module assembly has a photosensitive path. The light turning component is correspondingly arranged on the photosensitive path of the module component and is provided with a light inlet end and a light outlet end facing the module component, wherein the light turning component is used for turning the light rays emitted from the light inlet end to be emitted from the light outlet end and transmitting the light rays along the photosensitive path to be received by the module component for imaging. The light quantity adjusting component is assembled at the light outlet end of the light turning component so as to be positioned between the light turning component and the module component and used for adjusting the quantity of light rays entering the module component. The circuit board assembly is electrically connected with the light quantity adjusting assembly and used for providing electric energy required by the operation for the light quantity adjusting assembly.
Description
The invention relates to the technical field of camera modules, in particular to a periscopic camera module and a manufacturing method thereof.
In recent years, the demand for the camera function of portable electronic devices (such as tablet computers, smart phones, etc.) is still increasing rapidly, and the camera module configured for the electronic device gradually realizes a plurality of functions such as background blurring, night shooting, double-shot zooming, etc. In particular, due to the application of periscopic camera modules, the capability of the bi-zoom is gradually increasing, for example, the optical zoom capability thereof has been upgraded to 3 times zoom through 2 times zoom, even 5 times zoom. In other words, the periscopic camera module greatly changes the cognition of people on the shooting capability of the portable electronic equipment (such as a smart phone), and has a wide market prospect.
As is well known, the quality of the image captured by the camera module is closely related to the light input of the camera module, and the light input of the camera module is usually controlled by a diaphragm disposed on the camera module, and the larger the diaphragm (aperture diameter), the larger the light input of the camera module. For example, as shown in fig. 1, a conventional periscopic camera module 1P includes a photosensitive assembly 11P and a lens barrel unit 12P, wherein the lens barrel unit 12P includes a lens group 121P, a prism 122P and a liquid crystal dimming device 123P, wherein the lens group 121P and the prism 122P are sequentially disposed in a photosensitive path of the photosensitive assembly 11P, and the lens group 121P is located between the prism 122P and the photosensitive assembly 11P, wherein the liquid crystal dimming device 123P is mounted to an inclined surface of the prism 122P for changing an orientation of liquid crystal molecules under an applied voltage, thereby changing a light transmittance of the liquid crystal dimming device 123P. In other words, the light entering the prism 122P enters the liquid crystal dimming device 123P through the prism 122P, and then is reflected at the liquid crystal dimming device 123P, so that the reflected light passes through the prism 122P and the lens assembly 121P to be received and imaged by the photosensitive assembly 11P. At this time, the orientation of the liquid crystal molecules is adjusted by the driving of the liquid crystal layer voltage to change the amount of light reflected by the liquid crystal dimming device 123P, so that the amount of light passing through the prism 122P and the lens group 121P to be received by the photosensitive element 11P is changed, thereby changing the amount of light entering the periscopic camera module 1P.
However, in the process of adjusting the light entering amount by the conventional periscopic camera module 1P, the light is reflected and/or refracted for multiple times and enters and exits from multiple interfaces (such as the interface between the liquid crystal dimming device and the prism), which causes light energy loss, resulting in insufficient light amount during imaging. In addition, the liquid crystal dimming device 123P is difficult to be assembled on the inclined surface of the prism 122P, which results in high assembly cost of the conventional periscopic camera module 1P.
Disclosure of Invention
An advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, which can make the structure compact and contribute to reducing the overall size of the module.
Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, a light quantity adjusting component of the periscopic camera module is disposed at a light exit end of a light turning component, which is helpful for reducing difficulty in assembling the periscopic camera module.
Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein, in an embodiment of the present invention, a light quantity adjusting component of the periscopic camera module is disposed on a module component, which helps to reduce the difficulty of assembling the periscopic camera module, so that the light quantity adjusting component can be debugged during assembling.
Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the periscopic camera module directly bonds or engages the light quantity adjusting assembly to the housing bracket of the light turning assembly, so as to reduce the assembly difficulty of the module, improve the utilization rate of the internal space of the module, and facilitate to reduce the size of the periscopic camera module.
Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the periscopic camera module is electrically controlled by using a split circuit board, so as to avoid unstable performance of an integrated circuit board due to an oversize circuit board.
Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the periscopic camera module can integrate background blurring and multiple long-shot functions into a whole and can be switched to use.
Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein in an embodiment of the present invention, the periscopic camera module can prevent a flexible board from being damaged due to an excessively large bending angle, which is helpful for improving the stability of the periscopic camera module.
Another advantage of the present invention is to provide a periscopic camera module and a method for manufacturing the same, wherein the use of expensive materials or complicated structures is not required in order to achieve the above advantages. Therefore, the present invention successfully and effectively provides a solution, not only provides a periscopic camera module and a manufacturing method thereof, but also increases the practicability and reliability of the periscopic camera module and the manufacturing method thereof.
To achieve at least one of the above advantages or other advantages and in accordance with the purpose of the invention, a periscopic camera module is provided, including:
a module assembly, wherein the module assembly has a photosensitive path;
the light steering component is correspondingly arranged on the photosensitive path of the module component and is provided with a light inlet end and a light outlet end facing the module component, wherein the light steering component is used for steering light rays entering from the light inlet end to be emitted from the light outlet end and propagating along the photosensitive path to be received by the module component for imaging;
a light quantity adjusting assembly, wherein the light quantity adjusting assembly is assembled at the light outlet end of the light turning assembly so as to be positioned between the light turning assembly and the module assembly, and is used for adjusting the quantity of light rays entering the module assembly; and
a circuit board assembly, wherein the circuit board assembly is configured to be electrically connected to the light quantity adjusting assembly for providing the light quantity adjusting assembly with electric power required for operation.
In an embodiment of the invention, the circuit board assembly includes a first circuit board electrically connected to the light turning assembly, a second circuit board electrically connected to the module assembly, and a first extension circuit board, wherein the first extension circuit board extends from the module assembly to the light turning assembly, and the first extension circuit board is electrically connected to the first circuit board and the second circuit board respectively.
In an embodiment of the invention, the circuit board assembly further includes at least one electrical connection element, wherein the electrical connection element electrically connects the first extension circuit board and the light quantity adjusting assembly, and is used for providing the electrical energy required by the operation of the light quantity adjusting assembly through the first extension circuit board.
In an embodiment of the invention, the electrical connection element is a conductive pin, wherein the conductive pin is electrically connected to the light quantity adjusting assembly, so as to electrically connect the light quantity adjusting assembly to the first extension circuit board through the conductive pin.
In an embodiment of the invention, the conductive pins extend from the side wall of the light quantity adjusting assembly to the first extension circuit board side by side and are soldered to the first extension circuit board.
In an embodiment of the invention, the conductive pins are disposed at intervals and electrically connected to a sidewall of the light amount adjustment assembly, wherein the first extension circuit board is provided with two notches, and the notches on the first extension circuit board correspond to the conductive pins disposed on the light amount adjustment assembly one to one, respectively, so as to solder the conductive pins to the first extension circuit board.
In an embodiment of the invention, the circuit board assembly further includes at least one electrical connection element, wherein the electrical connection element electrically connects the first circuit board and the light quantity adjusting assembly, and is used for providing the electrical energy required by the operation of the light quantity adjusting assembly through the first circuit board.
In an embodiment of the invention, the electrical connection element is a conductive pin, wherein the conductive pin is electrically connected to the light quantity adjusting assembly, and the conductive pin extends from the bottom wall of the light quantity adjusting assembly side by side to the first circuit board, and the conductive pin is soldered to the first circuit board.
In an embodiment of the present invention, the electrical connecting element includes a lead, wherein one end of the lead is electrically connected to the first circuit board, and the other end of the lead is electrically connected to the light quantity adjusting assembly
In an embodiment of the invention, the circuit board assembly further includes a driving circuit board, wherein the driving circuit board is electrically connected to the bottom side of the module assembly, and the driving circuit board is electrically connected to the first extension circuit board, wherein the circuit board assembly further includes at least one electrical connection element, wherein the electrical connection element electrically connects the driving circuit board and the light quantity adjusting assembly, and is used for providing the electrical energy required by the operation of the light quantity adjusting assembly through the driving circuit board.
In an embodiment of the invention, the electrical connection element is a conductive pin, wherein the conductive pin is electrically connected to the light quantity adjusting assembly, and the conductive pin extends from the bottom wall of the light quantity adjusting assembly to the driving circuit board side by side and is soldered to the driving circuit board.
In an embodiment of the invention, the circuit board assembly further includes a first flexible board, wherein the first flexible board is electrically connected to the second circuit board and the first extension circuit board in a bent manner.
In an embodiment of the invention, the circuit board assembly further includes a first flexible board, a second extension circuit board, and a second flexible board, wherein the second circuit board is disposed at the rear side of the module assembly, and the second extension circuit board is stacked on the second circuit board, wherein the first flexible board is electrically connected to the first extension circuit board and the second extension circuit board in a bent manner, and wherein the second flexible board is electrically connected to the second circuit board and the second extension circuit board in a bent manner.
In an embodiment of the invention, the periscopic camera module further includes a spacer, wherein the spacer is stacked between the second circuit board and the second extension circuit board, and a height of the second extension circuit board is smaller than a height of the second circuit board.
In an embodiment of the present invention, the circuit board assembly further includes a connector and a connection flexible board, wherein the connection flexible board electrically connects the connector to the second extension circuit board in a height direction of the second extension circuit board, and the connector is used for electrically connecting a main board of an electronic device.
In an embodiment of the invention, the periscopic camera module further includes an adhesive layer, so that the light turning module and the module are respectively adhered to the light quantity adjusting module through the adhesive layer.
In an embodiment of the invention, the light quantity adjusting module is fastened to the light exit end of the light turning module.
According to another aspect of the present invention, there is further provided a method for manufacturing a periscopic camera module, comprising the steps of:
assembling a light quantity adjusting assembly at a light outlet end of a light turning assembly, so that light rays incident from a light inlet end of the light turning assembly are firstly turned by the turning assembly to be emitted from the light outlet end, and then are adjusted by the light quantity adjusting assembly to change the quantity of the light rays passing through the light quantity adjusting assembly;
arranging the light quantity adjusting assembly and the light turning assembly in a photosensitive path of a module assembly, wherein the light quantity adjusting assembly is positioned between the light turning assembly and the module assembly and is used for enabling light rays passing through the light quantity adjusting assembly to be received by the module assembly for imaging; and
and electrically connecting a circuit board assembly to the light quantity adjusting assembly to provide electric energy required by the work for the light quantity adjusting assembly.
In an embodiment of the present invention, the step of electrically connecting a circuit board assembly to the light quantity adjusting assembly for providing the light turning assembly, the module assembly and the light quantity adjusting assembly with electric power required for operation includes the steps of:
electrically connecting a first circuit board to the light turning component to electrically connect the first circuit board to an anti-shake driver of the light turning component;
electrically connecting a second circuit board to the module assembly to electrically connect the second circuit board to a photosensitive chip of a photosensitive assembly of the module assembly;
a first extension circuit board is arranged on the module assembly and the light steering assembly in an extending mode, and the first extension circuit board is electrically connected to the first circuit board and the second circuit board respectively; and
the light quantity adjusting component is electrically connected to the first circuit board or the first extension circuit board through at least one electrical connection element.
In an embodiment of the present invention, the step of electrically connecting a circuit board assembly to the light quantity adjusting assembly for providing the light quantity adjusting assembly with electric energy required for operation further includes the steps of:
superposing a second extension circuit board on the second circuit board, and electrically connecting the second extension circuit board to the second circuit board through a second flexible board;
electrically connecting the first extension circuit board to the second extension circuit board or the second circuit board through a first flexible board; and
a spacer is stacked between the second wiring board and the second extension wiring board.
In an embodiment of the present invention, the method for manufacturing a periscopic camera module further includes:
the light quantity adjusting assembly is adhered or buckled at the light outlet end of the light steering assembly; and
and correspondingly bonding the light quantity adjusting assembly to the module assembly.
In an embodiment of the present invention, the method for manufacturing a periscopic camera module further includes:
pre-positioning the light quantity adjusting assembly and the module assembly so that center lines of the light quantity adjusting assembly and the module assembly are substantially aligned in an optical axis direction of an optical lens of the module assembly;
adjusting the position of the light quantity adjusting component according to the shooting effect of shooting a target through the photosensitive component of the module component; and
and debugging the light quantity adjusting component to enable the light quantity controlled by the light quantity adjusting component to meet the preset requirement.
In an embodiment of the present invention, the method for manufacturing a periscopic camera module further includes:
pre-positioning the light redirecting assembly, the light quantity adjusting assembly, and the module assembly such that centerlines of the light redirecting assembly, the light quantity adjusting assembly, and the module assembly are substantially aligned; and
and adjusting the position of the light steering component according to the shooting effect of shooting the target through the photosensitive component.
An advantage of the present invention is to provide a periscopic camera module that enables a compact configuration, which helps to reduce the overall size of the module.
Another advantage of the present invention is to provide a periscopic camera module, wherein in an embodiment of the present invention, the light quantity adjusting component of the periscopic camera module is disposed on the light turning component, which helps to reduce the difficulty of assembling the periscopic camera module.
Another advantage of the present invention is to provide a periscopic camera module, wherein, in an embodiment of the present invention, the light quantity adjusting component of the periscopic camera module is disposed on the module component, which helps to reduce the assembly difficulty of the periscopic camera module, so that the light quantity adjusting component can be debugged during assembly.
Another advantage of the present invention is to provide a periscopic camera module, wherein in an embodiment of the present invention, the periscopic camera module directly bonds or engages the light quantity adjusting assembly to the housing bracket of the light turning assembly, so as to improve the utilization ratio of the internal space of the module and facilitate to reduce the size of the periscopic camera module.
Another advantage of the present invention is to provide a periscopic camera module, wherein in an embodiment of the present invention, the periscopic camera module can assemble the light quantity adjusting component to the module component before assembling the light turning component, so as to adjust and debug the light quantity adjusting component in advance, which is helpful to improve the assembling quality of the periscopic camera module.
Another advantage of the present invention is to provide a periscopic camera module, wherein in an embodiment of the present invention, the periscopic camera module can integrate the background blurring function and the multiple long-shot function into a whole, and can be switched to use.
Another advantage of the present invention is to provide a periscopic camera module that does not require expensive materials or complex structures to achieve the above advantages. Therefore, the invention successfully and effectively provides a solution, not only provides a simple periscopic camera module, but also increases the practicability and reliability of the periscopic camera module.
To achieve at least one of the above advantages or other advantages and in accordance with the purpose of the invention, a periscopic camera module is provided, including:
a modular assembly, wherein the modular assembly comprises:
the photosensitive assembly is provided with a photosensitive path; and
the lens assembly is correspondingly arranged on the photosensitive path of the photosensitive assembly;
a light turning component, wherein the light turning component is correspondingly arranged on the photosensitive path of the photosensitive component, and the lens component is positioned between the photosensitive component and the light turning component; and
a light quantity adjusting assembly, wherein the light quantity adjusting assembly is assembled at the end of the light turning assembly, and the light quantity adjusting assembly is positioned in the photosensitive path of the photosensitive assembly and used for adjusting the quantity of light received by the photosensitive assembly.
In an embodiment of the invention, the light redirecting assembly includes a reflective element, a carrier, and a housing support having a redirecting channel, wherein the reflective element and the carrier are both disposed in the redirecting channel of the housing support, and the reflective element is carried on the carrier to keep the reflective element correspondingly positioned in the photosensitive path of the photosensitive assembly, wherein the adhesive layer is disposed between the light quantity adjusting assembly and the housing support of the light redirecting assembly to adhere the light quantity adjusting assembly to the housing support of the light redirecting assembly.
In an embodiment of the invention, the end portion of the light turning component includes a light inlet end and a light outlet end, wherein the turning channel of the housing bracket extends from the light inlet end of the light turning component to the light outlet end of the light turning component in a bending manner, wherein the light quantity adjusting component is adhered to the housing bracket, and the light quantity adjusting component is located at the light inlet end of the light turning component.
In an embodiment of the invention, the end portion of the light turning component includes a light inlet end and a light outlet end, wherein the turning channel of the housing bracket extends from the light inlet end of the light turning component to the light outlet end of the light turning component in a bending manner, wherein the light quantity adjusting component is adhered to the housing bracket, and the light quantity adjusting component is located between the light outlet end of the light turning component and the module component.
In an embodiment of the present invention, the light quantity adjusting assembly is soldered to the lens assembly of the module assembly.
In an embodiment of the invention, the periscopic camera module further includes an adhesive layer, wherein the adhesive layer is disposed between the light quantity adjusting assembly and the lens assembly of the module assembly, so as to adhere the light quantity adjusting assembly to the module assembly through the adhesive layer.
In an embodiment of the invention, the lens assembly of the module assembly includes an optical lens, a focusing driver and an assembly housing, wherein the optical lens is drivably assembled to the focusing driver, and the focusing driver and the photosensitive assembly are correspondingly assembled in the assembly housing, wherein the focusing driver is configured to drive the optical lens to move along the photosensitive path; wherein the light amount adjustment member is directly adhered between the assembly housings of the lens assembly by the adhesive layer, and the adhesive layer has a thickness of 0.901mm to 0.92 mm.
In an embodiment of the present invention, the thickness of the adhesive layer is between 0.903mm and 0.915 mm.
In an embodiment of the present invention, the light amount adjustment member has a rectangular end face, and long and short sides of the light amount adjustment member are parallel to long and short sides of the lens assembly, respectively.
In an embodiment of the present invention, a ratio of a width to a length of the rectangular end surface of the light amount adjusting member is greater than 0.975 and less than 1.
In an embodiment of the present invention, the light amount adjusting assembly includes a pair of blades, a plurality of electric actuators, and a frame, wherein the blades are partially overlapped and mounted to the frame to form a diaphragm hole with an adjustable aperture by the blades, and wherein the electric actuators are respectively disposed at left and right sides of the frame to actuate the blades to adjust the aperture size of the diaphragm hole.
In an embodiment of the invention, the adhesive layer corresponds to left and right sides and/or a bottom side of the assembly housing of the lens assembly.
In an embodiment of the invention, the light quantity adjusting assembly is snappingly adhered to the light turning assembly.
In an embodiment of the invention, the periscopic camera module further includes a circuit board assembly, wherein the circuit board assembly is electrically connected to the light quantity adjusting assembly and is configured to provide the light quantity adjusting assembly with electric energy required for operation.
According to another aspect of the present invention, there is further provided a periscopic camera module, comprising:
a modular assembly, wherein the modular assembly comprises:
the photosensitive assembly is provided with a photosensitive path; and
the lens assembly is correspondingly arranged on the photosensitive path of the photosensitive assembly;
a light redirecting assembly, wherein the light redirecting assembly is assembled to the lens assembly and the light redirecting assembly corresponds to the light sensing path of the light sensing assembly such that the lens assembly is positioned between the light sensing assembly and the light redirecting assembly; and
a light quantity adjusting assembly, wherein the light quantity adjusting assembly is assembled to the lens assembly, and the light quantity adjusting assembly is located in the photosensitive path of the photosensitive assembly and is used for adjusting the quantity of light received by the photosensitive assembly.
In an embodiment of the invention, the lens assembly of the module assembly includes an optical lens, a focusing driver and an assembly housing, wherein the optical lens is drivably assembled to the focusing driver, and the focusing driver and the photosensitive assembly are correspondingly assembled in the assembly housing, wherein the focusing driver is configured to drive the optical lens to move along the photosensitive path, and wherein the light quantity adjusting assembly is assembled to the optical lens of the lens assembly to maintain the light quantity adjusting assembly corresponding to the photosensitive path of the photosensitive assembly.
In an embodiment of the present invention, the optical lens includes a first lens group and a second lens group, wherein the light amount adjusting member is disposed between the first lens group and the second lens group.
In an embodiment of the present invention, the optical lens further includes a lens barrel, wherein the first lens group, the light quantity adjusting assembly, and the second lens group are assembled to the lens barrel in sequence, and the second lens group is located between the light quantity adjusting assembly and the photosensitive assembly.
In an embodiment of the invention, the optical lens further includes a first barrel and a second barrel, wherein the first lens group is assembled to the first barrel and the second lens group is assembled to the second barrel, wherein the light amount adjusting assembly is mounted to the first barrel and/or the second barrel, and the second lens group is located between the light amount adjusting assembly and the photosensitive assembly.
In an embodiment of the present invention, the light amount adjustment unit is integrally formed with the focus actuator of the lens unit, and the optical lens is located between the light amount adjustment unit and the photosensitive unit.
Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.
These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.
The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.
Fig. 1 shows a schematic structural diagram of a periscopic camera module in the prior art.
Fig. 2 is a system diagram of a periscopic camera module according to a first embodiment of the present invention.
Fig. 3 is a perspective view of the periscopic camera module according to the first embodiment of the present invention.
Fig. 4 shows an exploded view of the periscopic camera module according to the first embodiment of the present invention.
Fig. 5 is a schematic structural diagram of the periscopic camera module according to the first embodiment of the present invention.
Fig. 6 shows a schematic structural diagram of the light steering assembly of the periscopic camera module according to the first embodiment of the present invention.
Fig. 7A shows an example of the wiring board assembly of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 7B shows a first example of the wiring board assembly of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 7C shows a second example of the wiring board assembly of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 8A and 8B are schematic structural views showing a light amount adjustment assembly of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 9 is a schematic structural diagram of the photosensitive assembly of the module assembly of the periscopic camera module according to the first embodiment of the present invention.
Fig. 10 is a schematic expanded view of the wiring board assembly of the periscopic camera module according to the first embodiment of the present invention.
Fig. 11A shows a first modified embodiment of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 11B shows a second modification of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 12 is a perspective view of a periscopic camera module according to a second embodiment of the present invention.
Fig. 13 is a perspective view showing a light amount adjustment assembly of the periscopic camera module according to the second embodiment of the present invention.
Fig. 14 and 15 show a first variant of the periscopic camera module according to the second embodiment of the invention described above.
Fig. 16 to 18 show a second modified embodiment of the periscopic camera module according to the above-described second embodiment of the present invention.
Fig. 19 is a schematic structural diagram of a periscopic camera module according to a third embodiment of the present invention.
Fig. 20A to 20C are schematic flow charts illustrating a method for manufacturing a periscopic camera module according to an embodiment of the present invention.
Fig. 21 is a system diagram of a periscopic camera module according to a first embodiment of the present invention.
Fig. 22 is a perspective view of the periscopic camera module according to the first embodiment of the present invention.
Fig. 23 is a schematic structural diagram of the periscopic camera module according to the first embodiment of the present invention.
Fig. 24 is a schematic structural diagram of the light steering assembly of the periscopic camera module according to the first embodiment of the present invention.
Fig. 25A is a perspective view showing the light amount adjusting unit of the periscopic camera module according to the first embodiment of the present invention.
Fig. 25B and 25C respectively show schematic views of states of the light amount adjustment assembly according to the above-described first embodiment of the present invention.
Fig. 25D and 25E show a modified embodiment of the light amount adjustment assembly according to the above-described first embodiment of the present invention.
Fig. 26 shows a first variant of the periscopic camera module according to the first embodiment of the present invention described above.
Fig. 27 shows a second modified embodiment of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 28A and 28B show a third modified embodiment of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 29 shows a fourth modified embodiment of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 30 shows a fifth modified embodiment of the periscopic camera module according to the above-described first embodiment of the present invention.
Fig. 31A is a schematic structural diagram of a periscopic camera module according to a second embodiment of the present invention.
Fig. 31B shows an example of the positional distribution of the adhesive layer in the periscopic camera module according to the above-described second embodiment of the present invention.
Fig. 31C shows another example of the positional distribution of the adhesive layer in the periscopic camera module according to the above-described second embodiment of the present invention.
Fig. 32 shows a first modified embodiment of the periscopic camera module according to the above-described second embodiment of the present invention.
Fig. 33 shows a second modified embodiment of the periscopic camera module according to the above-described second embodiment of the present invention.
Fig. 34 shows a third modified embodiment of the periscopic camera module according to the above-described second embodiment of the present invention.
Fig. 35 shows a fourth modified embodiment of the periscopic camera module according to the above-described second embodiment of the present invention.
Fig. 36 shows a fifth modified embodiment of the periscopic camera module according to the above-described second embodiment of the present invention.
Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments of the present application, and it should be understood that the present application is not limited to the example embodiments described herein.
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments described below are by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships that are based on those shown in the drawings, which are merely for convenience in describing the present disclosure and to simplify the description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus the terms above should not be construed as limiting the present disclosure.
In the present invention, the terms "a" and "an" in the claims and the description should be understood as meaning "one or more", that is, one element may be one in number in one embodiment, and the element may be more than one in number in another embodiment. The terms "a" and "an" should not be construed as limiting the number unless the number of such elements is explicitly recited as one in the present disclosure, but rather the terms "a" and "an" should not be construed as being limited to only one of the number.
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic representation of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The periscopic camera module can realize long-focus shooting, has smaller module volume and particularly conforms to the trend of current more miniaturization development. The invention designs the light quantity adjusting component (such as an iris diaphragm) and the periscopic camera module in a matching way, thereby not only realizing the shooting mode of a large diaphragm with a long focus to achieve the effect of blurring the background when shooting the portrait and making the portrait more prominent; but also can realize the shooting mode that the small aperture lengthens the focus so as to realize the shooting of multiple times of long shot. Therefore, the periscopic camera module can combine the background blurring shooting function and the multiple long-distance scene shooting function into one camera module and can be switched to use.
Referring to fig. 2 to 6 of the drawings, a periscopic camera module according to a first embodiment of the present invention is illustrated. Specifically, as shown in fig. 2 and 3, the periscopic camera module 81 includes a module assembly 810, a light turning assembly 820, a light quantity adjusting assembly 830, and a circuit board assembly 840. The module assembly 810 has a photosensitive path 8100 for receiving light along the photosensitive path 8100 for imaging. The light turning element 820 is correspondingly disposed on the photosensitive path 8100 of the module 810, and the light turning element 820 has a light inlet 8201 and a light outlet 8202 facing the module 810, wherein the light turning element 820 is used for turning the light entering from the light inlet 8201 to exit from the light outlet 8202, so that the light exiting from the light outlet 8202 propagates along the photosensitive path 8100 to be received and imaged by the module 810. The light quantity adjusting assembly 830 is assembled at the light exit end 8202 of the light turning assembly 820 to be located between the light turning assembly 820 and the module assembly 810 for adjusting the quantity of light entering the module assembly 810. It is understood that the light amount adjusting member 830 is assembled between the light outlet end 8202 of the light turning member 820 and the module assembly 810 such that the light amount adjusting member 830 is positioned between the light turning member 820 and the module assembly 810 for adjusting the amount of light entering the module assembly 810 through the light turning member 820.
In other words, the light quantity adjusting assembly 830 and the light turning assembly 820 are sequentially located on the photosensitive path 8100 of the module assembly 810, and the light quantity adjusting assembly 830 is located between the module assembly 810 and the light outlet end 8202 of the light turning assembly 820, so that the light entering from the light inlet end 8201 of the light turning assembly 820 is firstly turned by the light turning assembly 820 to exit from the light outlet end 8202, and then is received by the module assembly 810 to form an image after the light quantity is adjusted by the light quantity adjusting assembly 830.
It should be noted that, since the light quantity adjusting assembly 830 is directly assembled to the light exit end 8202 of the light turning assembly 820, the periscopic camera module 81 of the present invention can fully utilize the internal space of the module, so that the internal structure of the module is more compact, which is helpful to reduce the overall size of the module. Meanwhile, the module assembly 810, the light turning assembly 820, and the light amount adjusting assembly 830 in the periscopic camera module 81 are independent of each other so that one component may be replaced independently when a problem occurs, without affecting other components, which contributes to reducing the maintenance cost of the periscopic camera module 81.
More specifically, as shown in fig. 4 and fig. 6, the light diverting assembly 820 of the periscopic camera module 81 may include a reflective element 821, a carrier 822 and a housing holder 823, wherein the housing holder 823 has a diverting passage 8230, wherein the reflective element 821 and the carrier 822 are both disposed in the diverting passage 8230 of the housing holder 823, and the reflective element 821 is carried on the carrier 822 to keep the reflective element 821 correspondingly located on the light sensing path 8100 of the module assembly 810, such that the light diverting assembly 820 is used for diverting the light entering from the light inlet end 8201 to exit from the light outlet end 8202 through reflection of the reflective element 821, and such that the light exiting from the light outlet end 8202 propagates along the light sensing path 8100 to be received by the module assembly 810 for imaging.
For example, in the first embodiment of the invention, as shown in fig. 4 and 6, the reflective element 821 of the light diverting assembly 820 can be implemented as a prism 8210, that is, the prism 8210 has a light incident surface 8211, a light emitting surface 8212 and a reflecting surface 8213, wherein the light incident surface 8211 of the prism 8210 is located at the light incident end 8201 of the light diverting assembly 820, and the reflecting surface 8213 of the prism 8210 is disposed on the carrier 822, wherein the light emitting surface 8212 of the prism 8210 is located at the light emitting end 8202 of the light diverting assembly 820, and the light emitting surface 8212 faces the module assembly 810, so that a light ray incident into the prism 8210 through the light incident surface 8211 is firstly deflected by the reflecting surface 8213 and then exits the prism 8210 through the light emitting surface 8212 to propagate along the photosensitive path 8100, and is received by the module assembly 810 for imaging. Of course, in other examples of the present invention, the reflective element 821 of the light turning component 820 may also be implemented as other optical elements such as a reflective plane mirror and a waveguide, or the reflective element 821 may also be replaced by a refractive element as long as the propagation direction of the light can be changed, which is not described in detail herein.
Preferably, the light incident surface 8211 of the prism 8210 is perpendicular to the light emitting surface 8212 of the prism 8210, so that the prism 8210 is implemented as a right-angle prism, and light rays perpendicularly incident into the prism 8210 through the light incident surface 8211 are firstly reflected by the reflecting surface 8213 to turn 890 degrees, then perpendicularly emergent from the prism 8210 through the light emitting surface 8212 to propagate along the photosensitive path 8100, and then received by the module assembly 810 to form an image. In other words, the light incident surface 8211 of the prism 8210 is parallel to the light sensing path 8100 of the module assembly 810, and the light emitting surface 8212 of the prism 8210 is perpendicular to the light sensing path 8100 of the module assembly 810, so that the light rays propagating perpendicular to the light sensing path 8100 can propagate along the light sensing path 8100 after being reflected by the prism 8210, so as to be received and imaged by the module assembly 810.
More preferably, as shown in fig. 6, the prism 8210 is completely accommodated in the housing bracket 823, that is, the light incident surface 8211 and the light emitting surface 8212 of the prism 8210 are both located in the turning channel 8230 of the housing bracket 823, so as to protect the prism 8210 and reduce wear.
It should be noted that, as shown in fig. 6, the light turning component 820 of the periscopic camera module 81 may further include an anti-shake driver 824, where the anti-shake driver 824 is disposed between the carrier 822 and the housing bracket 823, and is configured to drive the carrier 822 to drive the prism 8210 to rotate, so as to change a rotation angle of the prism 8210, so that the light turned by the prism 8210 can better propagate along the photosensitive path 8100, thereby achieving an anti-shake effect of the periscopic camera module 81, and facilitating improvement of image quality of the periscopic camera module 81.
Specifically, as shown in fig. 6, the carrier 822 of the light turning assembly 820 has a bearing surface 8221 and at least one non-bearing surface 8222, wherein the reflecting surface 8213 of the prism 8210 is disposed on the bearing surface 8221 of the carrier 822 in a face-to-face manner, and the anti-shake driver 824 is disposed between the non-bearing surface 8222 of the carrier 822 and an inner wall surface of the housing holder 823, and is configured to drive the carrier 822 to drive the prism 8210 to rotate, thereby achieving an anti-shake function of the periscopic camera module 81.
For example, as shown in fig. 6, the anti-shake driver 824 may include, but is not limited to, a magnet 8241 and a coil 8242, wherein the magnet 8241 is disposed on the non-bearing surface 8222 of the carrier 822, and the coil 8242 is correspondingly disposed on an inner wall surface of the housing bracket 823, such that the position of the magnet 8241 and the position of the coil 8242 correspond to each other, so as to form an electric motor for driving the carrier 822 to drive the prism 8210 to rotate under the action of electric power to achieve an anti-shake effect. Of course, in other examples of the present invention, the magnet 8241 may be disposed on an inner wall surface of the housing holder 823, and the coil 8242 may be correspondingly disposed on the non-bearing surface 8222 of the carrier 822 as long as an electric motor can be formed, and the positions of the magnet 8241 and the coil 8242 are not limited in the present invention.
In the first embodiment of the present invention, as shown in fig. 4 and 5, the circuit board assembly 840 of the periscopic camera module 81 includes a first circuit board 841, wherein the first circuit board 841 is disposed on the housing bracket 823 of the light turning assembly 820, and the first circuit board 841 is electrically connected to the anti-shake driver 824 for providing the electric energy required by the operation of the anti-shake driver 824, so that the prism 8210 rotates to achieve optical anti-shake.
Illustratively, as shown in fig. 3, the first circuit board 841 of the circuit board assembly 840 is attached to the outer side of the housing frame 823 of the light turning assembly 820 and located at the bottom side of the light turning assembly 820, wherein the first circuit board 841 is electrically connected to the anti-shake driver 824 directly through a lead (not shown) so as to realize the anti-shake function of the periscopic camera module 81. It is understood that the first circuit board 841 may also be electrically connected to the anti-shake driver 824 through conductive pins. In addition, the first circuit board 841 of the circuit board assembly 840 may be implemented as a hard board PCB, a soft board FPC or a hard-soft combined board, and the type of the first circuit board 841 is not limited in the present invention. It is understood that the bottom side mentioned in the present invention is defined as the side facing away from the light entrance end 8201 of the light turning assembly 820, and the front and rear sides mentioned in the present invention correspond to the light turning assembly 820 and the module assembly 810, respectively, that is, the light rays propagate from the front to the rear along the photosensitive path of the module assembly 810 to be received and imaged by the module assembly 810.
It is to be noted that the light quantity adjusting assembly 830 of the periscopic camera module 81 according to the above-described first embodiment of the present invention may be implemented as, but not limited to, various types of variable diaphragms such as voltage-type variable diaphragms, liquid crystal-type variable diaphragms, or blade-type variable diaphragms, so as to change the size of the diaphragm aperture of the variable diaphragm under the action of electric energy, thereby adjusting the quantity of light entering the module assembly 810. Therefore, the light quantity adjusting module 830 of the periscopic camera module 81 of the present invention is electrically connected to the circuit board assembly 840 to provide power to the light quantity adjusting module 830 through the circuit board assembly 840, so that the light quantity adjusting module 830 can adjust the amount of light entering the module assembly 810 under the action of the power.
More specifically, as shown in fig. 4 and 5, the circuit board assembly 840 may further include at least one electrical connection element 842, wherein the electrical connection element 842 electrically connects the light quantity adjusting assembly 830 and the first circuit board 841 together to transmit power to the light quantity adjusting assembly 830 through the first circuit board 841 and the electrical connection element 842.
In an example of the present invention, as shown in fig. 4 and 7A, the electrical connection element 842 may be implemented as a conductive pin 8421 electrically connected and disposed on the light quantity adjusting assembly 830, wherein the conductive pin 8421 extends from the bottom wall 8301 of the light quantity adjusting assembly 830 side by side and forwards to the first circuit board 841, so as to directly weld the conductive pin 8421 to the first circuit board 841, thereby achieving electrical connection between the light quantity adjusting assembly 830 and the first circuit board 841. It is understood that in other examples of the present invention, the conductive leads 8421 may also be electrically connected and adhered to the first circuit board 841 through a conductive adhesive, which is not described in detail herein.
It is noted that, since the conductive pins 8421 extend directly to the bottom of the light redirecting assembly 820 and the first circuit board 841 is assembled at the bottom of the light redirecting assembly 820, the conductive pins 8421 can directly contact the first circuit board 841 to electrically connect the first circuit board 841 by soldering, thereby achieving electrical connection between the first circuit board 841 and the light quantity adjusting assembly 830.
Of course, in the first modified example of the present invention, as shown in fig. 7B, the electrical connection element 842 may also be implemented as a lead wire 8422, wherein one end of the lead wire 8422 is electrically connected to the first circuit board 841, and the other end of the lead wire 8422 is electrically connected to the light quantity adjusting assembly 830, so that the light quantity adjusting assembly 830 at the light exit end 8202 of the light redirecting assembly 820 is electrically connected to the first circuit board 841 through the lead wire 8422.
As another example, in the second modified example of the present invention, as shown in fig. 7C, the electrical connection element 842 may include the conductive pin 8421 and the lead wire 8422, wherein the conductive pin 8421 is electrically connected to the light quantity adjustment assembly 830, wherein one end of the lead wire 8422 is electrically connected to the first circuit board 841, and the other end of the lead wire 8422 is electrically connected to the conductive pin 8421, so that the light quantity adjustment assembly 830 is electrically connected to the first circuit board 841 through the bonding between the conductive pin 8421 and the lead wire 8422, thereby facilitating the detachment of the light quantity adjustment assembly 830.
It should be noted that, according to the first embodiment of the present invention, as shown in fig. 2 and 5, the periscopic camera module 81 may further include an adhesive layer 850, wherein the adhesive layer 850 is located between the light quantity adjusting assembly 830 and the light exit end 8202 of the light turning assembly 820, so as to adhere the light quantity adjusting assembly 830 to the light exit end 8202 of the light turning assembly 820 through the adhesive layer 850, so that the light turned by the light turning assembly 820 firstly passes through the light quantity adjusting assembly 830 and then enters the module assembly 810 to be received and imaged after exiting from the light exit end 8202. Like this the periscopic camera module 81 can pass through the light quantity control subassembly 830 is adjusted more accurately and is got into the light quantity of module subassembly 810 for periscopic camera module 81 can also help improving self formation of image quality when satisfying the light input quantity demand of different shooting modes.
For example, as shown in fig. 8A and 8B, the light quantity adjusting assembly 830 of the periscopic camera module 81 may include, but is not limited to, a plurality of blades 831, a plurality of electric actuators 832 and a frame 833, wherein the blades 831 are partially overlapped and mounted on the frame 833 to form a diaphragm hole 8300 with an adjustable aperture through the blades 831, the electric actuators 832 are correspondingly disposed on the frame 833, and the electric actuators 832 are connected to the blades 831 in a one-to-one correspondence manner for actuating the corresponding blades 831 to adjust the aperture of the diaphragm hole 8300. It is to be appreciated that the electrical actuator 832 may include a magnet, a coil, and a lever, the coil, when energized, generating a magnetic field to drive the magnet in a particular direction to move the lever; the lever is connected to the blade 831, so that the blade 831 can change its position (e.g., rotate within a specific angle range) with the movement of the lever, thereby changing the aperture size of the diaphragm aperture 8300. In addition, the number and shape of the blades 831 in the light amount adjusting unit 830 may be any as long as the diaphragm holes 8300 having a variable aperture can be formed, and the present invention is not limited thereto.
It should be noted that, in the first embodiment of the present invention, the adhesive layer 850 is located between the housing holder 823 of the light turning module 820 and the frame 833 of the light quantity adjusting module 830 to firmly attach the light quantity adjusting module 830 to the light exit end 8202 of the light turning module 820. Meanwhile, the adhesive layer 850 may be simultaneously located between the light amount adjustment unit 830 and the module unit 810, so that the light redirecting unit 820, the light amount adjustment unit 830, and the module unit 810 are sequentially adhered together by the adhesive layer 850 to be independently assembled into the periscopic camera module 81.
In particular, the adhesive layer 850 may be cured, but is not limited to, by an adhesive such as glue, so as to adjust the relative positions among the light turning member 820, the light quantity adjusting member 830 and the module assembly 810 before curing, to ensure that the center of the diaphragm hole 8300 of the light quantity adjusting member 830 is aligned or substantially aligned with the photosensitive path 8100 of the module assembly 810, so that the light turned by the light turning member 820 can pass through the diaphragm hole 8300 of the light quantity adjusting member 830 to enter the module assembly 810 to be subjected to image formation.
Illustratively, in the above example of the present invention, a circle of adhesive is applied on the frame 833 of the light quantity adjusting assembly 830, and then the light quantity adjusting assembly 830 is correspondingly placed at the light emitting end 8202 of the light turning assembly 820, and the adhesive is located between the housing bracket 823 of the light turning assembly 820 and the frame 833 of the light quantity adjusting assembly 830, so as to form the adhesive layer 850 after the adhesive is cured, so as to adhesively fix the light quantity adjusting assembly 830 to the light emitting end 8202 of the light turning assembly 820 through the adhesive layer 850; finally, an adhesive is applied between the light amount adjustment member 830 and the module assembly 810 to form the adhesive layer 850 that adhesively fixes the light amount adjustment member 830 and the module assembly 810 after the adhesive is cured.
Of course, in another example of the present invention, the light amount adjustment unit 830 and the module unit 810 are bonded together by the adhesive layer 850, and after the light amount adjustment unit 830 is debugged, the light exit end 8202 of the light redirecting unit 820 is correspondingly bonded to the light amount adjustment unit 830 by the adhesive layer 850, thereby completing the assembly of the periscopic camera module 81. Thus, before the light turning assembly 820 is assembled, the light quantity adjusting assembly 830 can be debugged by the photographing effect of the lens and the photosensitive chip to determine whether the center of the diaphragm hole 8300 of the light quantity adjusting assembly 830 is aligned with the optical center of the optical lens of the module assembly 810; alternatively, it is tested whether the effect of the opening and closing of the blades in the light quantity adjusting assembly 830 on the amount of incoming light can achieve the desired effect, and so on.
According to the first embodiment of the present invention, as shown in fig. 4 and 5, the module assembly 810 of the periscopic camera module 81 may include an optical lens 811, a light-sensing assembly 812, a focus driver 813, and an assembly housing 814, wherein the optical lens 811, the light sensing component 812 and the focus driver 813 are assembled within the assembly housing 814, wherein the optical lens 811 is drivably provided to the focus driver 813, and the focus driver 813 is correspondingly provided to the light sensing assembly 812, so that the optical lens 811 is held in the photosensitive path of the photosensitive component 812 (i.e. the photosensitive path 8100 of the module component 810), the focusing driver 813 is configured to drive the optical lens 811 to move on the light sensing path 8100, so as to implement a focusing function of the periscopic imaging module 81.
More specifically, as shown in fig. 5, the optical lens 811 may include a lens barrel 8111 and a plurality of lenses 8112, wherein the lenses 8112 are coaxially disposed on the lens barrel 8111, so as to drive the lens barrel 8111 to move through the focusing driver 813, and further drive the lenses 8112 to move to achieve a focusing effect. Preferably, an included angle between an optical axis of the optical lens 811 and the reflecting surface 8213 of the prism 8210 of the light turning assembly 820 is 45 °, so as to ensure that the center of the diaphragm hole 8300 of the light quantity adjusting assembly 830 is substantially coincident with the optical axis of the optical lens 811, which is helpful for improving the imaging quality of the periscopic camera module 81.
It is noted that in one example of the present invention, as shown in fig. 5, the focus driver 813 may include a driving motor 8131 and a driving housing 8132. The driving motor 8131 may include a magnet mounted on the lens barrel 8111 of the optical lens 811 and a coil mounted on the driving housing 8132, and a position of the magnet and a position of the coil correspond to each other. The driving housing 8131 has a recess hole for mounting the optical lens 811. It is understood that the drive motor 8131 may be implemented as, but not limited to, a voice coil motor or a piezoelectric motor. In another example of the present invention, the coil may be attached to the lens barrel 8111, and the magnet may be attached to the driving housing 8132.
Specifically, as shown in fig. 3 and 5, the circuit board assembly 840 of the present invention may include a driving circuit board 843, wherein the driving circuit board 843 is mounted outside the driving housing 8132 of the focus driver 813, and the driving circuit board 843 is provided with pins horizontally extending from the outside of the driving housing 8132, through which circuit boards of other components may be soldered together. Of course, the driving motor 8131 of the focusing driver 813 can also be electrically connected to the driving circuit board 843 through pins or wires, so as to obtain electrical energy from the driving circuit board 843, so that the optical lens 811 moves relative to the photosensitive assembly 812 under the driving of the driving motor 8131, thereby implementing a focusing function. It is to be understood that the type of the driving circuit board 843 is not a limitation of the present invention, and may be a hard board PCB, a soft board FPC, or a rigid-flex board.
According to the first embodiment of the present invention, as shown in fig. 3 and 9, the photosensitive assembly 812 of the module assembly 810 may include a photosensitive chip 8121 and a filter element 8122, wherein the filter element 8122 is disposed between the photosensitive chip 8121 and the optical lens 811, so that light entering the module assembly 810 is converged by the optical lens 811, and then is received by the photosensitive chip 8121 for imaging after being filtered by the filter element 8122.
Correspondingly, as shown in fig. 3 and 5, the circuit board assembly 840 of the periscopic camera module 81 further includes a second circuit board 844, wherein the photosensitive chip 8121 of the photosensitive assembly 812 is attached to the second circuit board 844, and the photosensitive chip 8121 is electrically connected to the second circuit board 844, so as to provide electric energy for the photosensitive chip 8121 through the second circuit board 844, and enable the photosensitive chip 8121 to receive light rays for imaging.
Illustratively, as shown in fig. 9, the photosensitive assembly 812 may further include a support 8123, wherein the filter element 8122 is disposed on the support 8123, and the support 8123 is correspondingly disposed on the second circuit board 844, so as to hold the filter element 8122 between the photosensitive chip 8121 and the optical lens 811, so that light rays sequentially pass through the optical lens 811 and the filter element 8122 and then are received and imaged by the photosensitive chip 8121.
It should be noted that, in the first embodiment of the present invention, as shown in fig. 3 and 10, the circuit board assembly 840 of the periscopic camera module 81 further includes a first extension circuit board 845, wherein the first extension circuit board 845 extends from the module assembly 810 to the light redirecting assembly 820, and the first extension circuit board 845 is electrically connected to the first circuit board 841, the driving circuit board 843, and the second circuit board 844 at the same time, so as to form the circuit board assembly 840 in a split-type conduction manner, so that each part of the circuit board assembly 840 can be provided with electric energy through one connector. In other words, the first extension circuit board 845 is electrically extendable from the second circuit board 844 to the first circuit board 841, and the drive circuit board 843 positioned between the first circuit board 841 and the second circuit board 844 is electrically connectable to the first extension circuit board 845 to form the circuit board assembly 840 in a split conduction.
Preferably, as shown in fig. 10, the first extended circuit board 845 is provided with a processing chip 8451, so as to control the driving/actuating components in the module assembly 810, the light turning assembly 820 and the light quantity adjusting assembly 830 through the processing chip 8451, thereby achieving the functions of focusing, anti-shake and adjusting the amount of light entering the lens.
It is noted that the first extension circuit board 845 may be electrically connected to the first circuit board 841 and the driving circuit board 843, respectively, by means of pin soldering; meanwhile, the light amount adjusting member 830 may be electrically connected to the first extension wiring board 845 indirectly through the first wiring board 841. In particular, as shown in fig. 3, the first wiring board 841 and the driving wiring board 843 are correspondingly located at the bottom of the periscopic camera module 81, respectively, and the first extension wiring board 845 is preferably located at the side of the periscopic camera module 81, so that the first diffraction wiring board 845 can intersect at the first wiring board 841 and the driving wiring board 843 at the same time, so as to directly electrically connect the first wiring board 841 and the driving wiring board 843 to the first diffraction wiring board 845 by means of pin soldering, respectively. Of course, in other examples of the present invention, the first extension circuit board 845 may also be disposed at the bottom of the periscopic imaging module 81, so that the first circuit board 841 and the driving circuit board 843 are electrically stacked on the first extension circuit board 845, respectively.
In addition, as shown in fig. 3 and 5, the second circuit board 844 of the circuit board assembly 840 of the present invention is usually located at the rear side of the module main body 810 of the periscopic camera module 81, so that the included angle between the second circuit board 844 and the first extension circuit board 845 is a right angle, and therefore, in order to electrically connect the second circuit board 844 and the first extension circuit board 845, the circuit board assembly 840 of the present invention may further include a first soft board 846, wherein the first soft board 846 is disposed between the first extension circuit board 845 and the second circuit board 844 in a bent manner, so as to electrically connect the first extension circuit board 845 and the second circuit board 844 through the first soft board 846. It is understood that the first soft board 846 may be implemented as a flexible board FPC capable of being bent, so that the first soft board 846 can reduce the size of the periscopic camera module 81 while stably and electrically connecting the first extension circuit board 845 and the second circuit board 844 together.
Further, as shown in fig. 3 and 10, the circuit board assembly 840 of the periscopic camera module 81 may further include a connector 847, wherein the connector 847 is electrically connected to the second circuit board 844 for electrically connecting to a motherboard of an electronic device, such as a mobile phone, so as to provide power and/or control signals for the circuit board assembly 840 through the motherboard of the electronic device. It is noted that the connector 847 is preferably electrically connected to the second circuit board 844 through a flexible connecting board 8470, so that the position of the connector 847 relative to the second circuit board 844 can be adjusted as needed to electrically connect to the main board of the electronic device.
It should be noted that, in an example of the present invention, the periscopic camera module 81 may further include a housing or an external bracket (not shown), wherein the module component 810, the light turning component 820, the light quantity adjusting component 830 and the circuit board component 840 are assembled in the housing or the external bracket, so that the module component 810, the light turning component 820, the light quantity adjusting component 830 and the circuit board component 840 are protected by the housing or the external bracket, and the module component 810, the light turning component 820, the light quantity adjusting component 830 and the circuit board component 840 are prevented from being contaminated.
It should be noted that fig. 11A shows a first variant of the periscopic camera module 81 according to the first embodiment of the present invention, wherein the light quantity adjusting assembly 830 is fastened to the light exit end 8202 of the light turning assembly 820, so as to omit the adhesive layer 850, and the light quantity adjusting assembly 830 is directly detachably assembled to the light turning assembly 820, so as to replace the light turning assembly 820 or the light quantity adjusting assembly 830.
Specifically, the light exit end 8202 of the light turning module 820 is provided with a first engaging structure 8231 located in the housing bracket 823, and the frame 833 of the light quantity adjusting module 830 is provided with a second engaging structure 8232 adapted to the first engaging structure, wherein when the first engaging structure 8231 and the second engaging structure 8232 are adapted to be engaged together, the frame 833 of the light quantity adjusting module 830 is mounted on the housing bracket 823 of the light turning module 820, so that the light quantity adjusting module 830 is assembled to the light exit end 8202 of the light turning module 820.
Preferably, as shown in fig. 11A, in the periscopic camera module 81 according to the first modified embodiment of the present invention, the first engaging structure 8231 is implemented as a groove provided in the housing holder 823, and the second engaging structure 8232 is implemented as a protrusion provided in the frame 833, so that the light quantity adjusting assembly 830 and the light steering assembly 820 are fixedly assembled by inserting the protrusion on the frame 833 into the groove on the housing holder 823, which not only reduces the size of the periscopic camera module 81, but also simplifies the assembly and disassembly of the periscopic camera module 81.
In particular, in order to further enhance the connection strength between the first fastening structure 8231 and the second fastening structure 8232, so that the light quantity adjusting assembly 830 is more firmly mounted to the housing bracket 823 of the light turning assembly 820, the adhesive layer 850 of the present invention may also be disposed between the first fastening structure 8231 and the second fastening structure 8232. For example, an adhesive is applied in the first fastening structure 8231 (i.e., the groove of the housing bracket 823), and then the first fastening structure 8231 and the second fastening structure 8232 are fastened to form the adhesive layer 850 between the first fastening structure 8231 and the second fastening structure 8232 after the adhesive is cured, so as to firmly fix the light quantity adjusting assembly 830 to the housing bracket 823 of the light turning assembly 820.
It should be noted that, although the first latching structure 8231 and the second latching structure 8232 of the periscopic camera module 81 are sequentially implemented as a groove and a protrusion to realize the latching connection between the light quantity adjusting assembly 830 and the light turning assembly 820 as shown in fig. 11A, the manner of latching is only an example, and the invention is not limited thereto. For example, as shown in fig. 11B, a second modified embodiment of the periscopic camera module 81 according to the above-described first embodiment of the present invention is illustrated, in which the first engagement structure 8231 of the periscopic camera module 81 is implemented as a protrusion provided to the housing holder 823, and the second engagement structure 8232 is implemented as a groove provided to the frame 833, so that the fixed assembly between the light quantity adjusting assembly 830 and the light turning assembly 820 is also achieved by inserting the protrusion on the housing holder 823 into the groove on the frame 833.
Specifically, referring to fig. 12 and 13 of the drawings, a periscopic camera module according to a second embodiment of the present invention is illustrated. Compared to the above-described first embodiment of the present invention, the periscopic imaging module 81 according to the second embodiment of the present invention differs in that: the light quantity adjusting member 830 is electrically connected directly to the first extension wiring board 845 of the wiring board assembly 840 without electrically connecting the light quantity adjusting member 830 indirectly to the first extension wiring board 845 through the first wiring board 841, so that the first wiring board 841 alone supplies power to the light redirecting member 820, contributing to simplification of the circuit design of the first wiring board 841.
Specifically, as shown in fig. 13, the electrical connection element 842 of the circuit board assembly 840 is implemented as the conductive pin 8421 electrically connected to the side wall 8302 of the light quantity adjusting assembly 830, wherein the conductive pin 8421 is soldered to the first extension circuit board 845, so as to electrically connect the light quantity adjusting assembly 830 to the first extension circuit board 845 through the conductive pin 8421.
Illustratively, as shown in fig. 12 and 13, the electrical connection component 842 includes two conductive pins 8421, wherein the conductive pins 8421 are disposed at intervals on an outer side wall of the frame 833 of the light quantity adjusting assembly 830, and the conductive pins 8421 are electrically connected to the electrical actuator 832 of the light quantity adjusting assembly 830, wherein the conductive pins 8421 can be electrically connected to the first extension circuit board 845 of the circuit board assembly 840 by means of solder balls, so as to provide electrical energy for the electrical actuator 832 of the light quantity adjusting assembly 830 through the first extension circuit board 845, thereby achieving the light intake quantity adjusting effect of the light quantity adjusting assembly 830. Of course, in other examples of the invention, the number of the conductive pins 8421 may exceed two, and the conductive pins 8421 may also be electrically and electrically bonded to the first extension circuit board 845 by means of a conductive adhesive.
Preferably, as shown in fig. 12, the first extension circuit board 845 of the circuit board assembly 840 is provided with two notches 8452, 8453, and the notches 8452, 8453 correspond to the conductive pins 8421 on the light quantity adjusting assembly 830, respectively, so that the conductive pins 8421 can be soldered to the first extension circuit board 845 at the notches 8452, 8453 of the first extension circuit board 845, respectively. It can be understood that, just because the first extension circuit board 845 is provided with the notches 8452 and 8453, the conductive pins 8421 can be electrically connected to the first extension circuit board 845 at the notches 8452 and 8453 of the first extension circuit board 845 by means of a solder ball, so that the size of the periscopic camera module 81 is prevented from being increased, and the soldering is also facilitated.
More preferably, as shown in fig. 12, one of the conductive pins 8421 is disposed on an upper portion of an outer sidewall of the frame 833 to form an upper pin; another conductive pin 8422 is disposed on a lower portion of the outer sidewall of the frame 833 to form a lower pin. The first extension circuit board 845 of the circuit board assembly 840 is provided with an upper notch 8452 and a lower notch 8453, and the upper notch 8452 and the lower notch 8453 of the first extension circuit board 845 correspond to the upper pin and the lower pin of the frame 833, respectively, so that the conductive pins 8421 are soldered to the first extension circuit board 845, respectively, thereby integrally and electrically connecting the light quantity adjusting assembly 830 to the first extension circuit board 845, for obtaining electric energy from the first extension circuit board 845 to adjust the quantity of light entering. It can be understood that the upper notch 8452 and the lower notch 8453 are arranged on the first extension circuit board 845, which is not only beneficial to welding the conductive pin 8421, but also beneficial to reducing the installation space of the periscopic camera module 81.
Fig. 14 and 15 show a modified embodiment of the periscopic camera module 81 according to the second embodiment of the present invention, in which the conductive pins 8421 extend from the side wall 8302 of the light quantity adjusting assembly 830 to the first extension circuit board 845 side by side and outward, so that the conductive pins 8421 are soldered to the first extension circuit board 845.
Illustratively, as shown in fig. 15, the conductive pins 8421 are electrically connected to the light quantity adjusting assembly 830, wherein the conductive pins 8421 extend side by side outward to protrude from the side wall 8302 of the light quantity adjusting assembly 830, so that the conductive pins 8421 are located on the bottom side of the first extended circuit board 845, that is, the conductive pins 8421 and the first extended circuit board 845 are located on the same side of the light quantity adjusting assembly 830, which facilitates soldering the conductive pins 8421 and the first extended circuit board 845 together.
It should be noted that, since the height of the second circuit board 844 of the circuit board assembly 840 of the periscopic camera module 81 of the present invention is substantially equal to the height of the periscopic camera module 81, and the connection flexible board 8470 for connecting the connector 847 and the second circuit board 844 does not protrude out of the side surface of the periscopic camera module 81, the bending angle of the connection flexible board 8470 for connecting the connector 847 and the second circuit board 844 is too large, and the circuit components of the connection flexible board 8470 are easily damaged.
Therefore, in order to solve the above problem, fig. 16 to 18 show a second modified embodiment of the periscopic camera module according to the above second embodiment of the present invention. The periscopic camera module 81 according to the second variant of the present invention differs from the above-described second embodiment of the present invention in that: the circuit board assembly 840 further includes a second extension circuit board 848 and a second flexible board 849, wherein the second flexible board 849 electrically connects the second extension circuit board 848 to the second circuit board 844 in a bendable manner, and the first flexible board 846 electrically connects the first extension circuit board 848 to the second extension circuit board 848 in a bendable manner. Specifically, the second extension wiring board 848 is stacked on the second wiring board 844, and the height of the second extension wiring board 848 is smaller than the height of the second wiring board 844, wherein the connector 847 is electrically connected to the second extension wiring board 848 in the height direction of the second extension wiring board 848 so as to electrically connect the wiring board assembly 840 to the main board of the electronic device through the connector 847.
It should be noted that, since the height of the second extension circuit board 848 is smaller than the height of the second circuit board 844 (as shown in fig. 18), so as to form a height difference between the second extension circuit board 848 and the second circuit board 844, the connecting soft board 8470 connected with the connector 847 still has enough space to bend without protruding out of the side surface of the periscopic camera module 81, so as to reduce the bending angle of the connecting soft board 8470, and further avoid the damage to the connecting soft board 8470 due to an excessively large bending angle.
Further, as shown in fig. 16 and 17, the periscopic camera module 81 further includes a gasket 860, wherein the gasket 860 is stacked between the second circuit board 844 and the second extension circuit board 848 to reduce the bending angle of the first soft board 846 and the second soft board 849, which helps to prevent the first soft board 846 and the second soft board 849 from being damaged due to too large bending.
Preferably, the gasket 860 is made of a metal material, so that the heat of the second circuit board 844 is transferred to the second extension circuit board 848 through the gasket 860, which helps to improve the heat dissipation performance of the periscopic camera module 81.
It should be noted that, in the second modified embodiment of the present invention, as shown in fig. 17, the first extension circuit board 845 and the drive circuit board 843 in the circuit board assembly 840 are integrally soldered and conducted by conductive pins, and the first extension circuit board 845 and the first circuit board 841 are integrally soldered and conducted by conductive pins, wherein the first extension circuit board 845 and the light quantity adjusting assembly 830 are integrally soldered and conducted by the conductive pins 8421, which is helpful for reducing the installation area of the periscopic camera module 81. It can be understood that the first circuit board 841, the driving circuit board 843, the light quantity adjusting assembly 830 and the first extension circuit board 846 of the circuit board assembly 840 are all connected into a whole by an electrical connection manner of conductive pin soldering, so that unstable performance caused by an overlarge integrated circuit board is avoided. Meanwhile, the first extension circuit board 846 can be electrically connected to the second extension circuit board 848 by the first soft board 847 in a bendable manner, and the second extension circuit board 848 can be electrically connected to the second circuit board 844 by the second soft board 849 in a bendable manner, so that the internal space of the periscopic camera module 81 is further utilized, the structure of the periscopic camera module 81 is more compact, and the volume of the periscopic camera module 81 is reduced.
Specifically, referring to fig. 19 of the drawings, a periscopic camera module according to a third embodiment of the present invention is illustrated. Compared to the second modified embodiment according to the second embodiment of the present invention, the periscopic imaging module 81 according to the third embodiment of the present invention is different in that: the electrical connection component 842 can be implemented as a conductive pin 8421 electrically connected to the light quantity adjusting assembly 830, wherein the conductive pin 8421 extends from the bottom wall 8301 of the light quantity adjusting assembly 830 to the driving circuit board 843 side by side and backwards, so as to directly solder the conductive pin 8421 to the driving circuit board 843, thereby achieving the electrical connection between the light quantity adjusting assembly 830 and the driving circuit board 843. It is understood that in other examples of the present invention, the conductive leads 8421 may also be electrically connected to the driving circuit board 843 by a conductive adhesive, which is not described in detail herein.
It is noted that, as shown in fig. 19, since the conductive pins 8421 directly extend to the bottom of the module assembly 810 and the driving circuit board 843 is just assembled to the bottom of the module assembly 810, the conductive pins 8421 can directly contact the driving circuit board 843 to electrically connect the driving circuit board 843 by soldering, so as to electrically connect the driving circuit board 843 and the light quantity adjusting assembly 830.
According to another aspect of the present invention, a method for manufacturing a periscopic camera module is further provided. Specifically, as shown in fig. 20A, the method for manufacturing the periscopic camera module includes the steps of:
s8100: assembling a light quantity adjusting assembly at a light outlet end of a light turning assembly, so that light rays incident from a light inlet end of the light turning assembly are firstly turned by the turning assembly and then emitted from the light outlet end, and then the light quantity passing through the light quantity adjusting assembly is changed by the adjustment of the light quantity adjusting assembly; and
s8200: arranging the light quantity adjusting assembly and the light turning assembly in a photosensitive path of a module assembly, wherein the light quantity adjusting assembly is positioned between the light turning assembly and the module assembly and is used for enabling the light rays passing through the light quantity adjusting assembly to be received by the module assembly for imaging; and
s8300: and electrically connecting a circuit board assembly to the light quantity adjusting assembly to provide electric energy required by the work for the light quantity adjusting assembly.
In an embodiment of the present invention, as shown in fig. 20B, the step S8300 of the method for manufacturing a periscopic camera module further includes the steps of:
s8310: electrically connecting a first circuit board to the light steering assembly to electrically connect the first circuit board to an anti-shake driver of the light steering assembly;
s8320: electrically connecting a second circuit board to the module assembly to electrically connect the second circuit board to a photosensitive chip of a photosensitive assembly of the module assembly;
s8330: a first extension circuit board is arranged on the module assembly and the light steering assembly in an extending mode, and the first extension circuit board is electrically connected to the first circuit board and the second circuit board respectively; and
s8340: the light quantity adjusting component is electrically connected to the first circuit board or the first extension circuit board through at least one electrical connection element.
In an example of the present invention, as shown in fig. 20B, the step S8300 of the method for manufacturing a periscopic imaging module further includes the steps of:
s8350: superposing a second extension circuit board on the second circuit board, and electrically connecting the second extension circuit board to the second circuit board through a second flexible board; and
s8360: the first extension circuit board is electrically connected to the second extension circuit board or the second circuit board through a first flexible board.
In an example of the present invention, as shown in fig. 20B, the step S8300 of the method for manufacturing a periscopic imaging module further includes the steps of:
s8370: a spacer is stacked between the second wiring board and the second extension wiring board.
According to the above embodiment of the present invention, as shown in fig. 20A, the method for manufacturing a periscopic imaging module further includes:
s8400: the light quantity adjusting assembly is adhered or buckled at the light outlet end of the light steering assembly; and
s8500: and correspondingly bonding the light quantity adjusting assembly to the module assembly.
It should be noted that, in an example of the present invention, as shown in fig. 20C, in order to accurately assemble the periscopic camera module 81, the method for manufacturing the periscopic camera module may further include the steps of:
s8610: pre-positioning the light amount adjustment member 830 and the module member 810 so that center lines of the light amount adjustment member 830 and the module member 810 are substantially aligned in an optical axis direction of the optical lens 811 of the module member 810;
s8620: adjusting the position of the light quantity adjusting assembly 830 according to the photographing effect of photographing a target through the photosensitive assembly 812 of the module assembly 810; and
s8630: the light quantity adjusting assembly 830 is adapted so that the size of the incident light quantity controlled by the light quantity adjusting assembly 830 meets a predetermined requirement.
As shown in fig. 20C, the method for manufacturing a periscopic camera module may further include:
s8640: pre-positioning the light redirecting assembly 820, the light amount adjusting assembly 830, and the module assembly 810 such that the centerlines of the light redirecting assembly 820, the light amount adjusting assembly 830, and the module assembly 810 are substantially aligned; and
s8650: the position of the light turning component 820 is adjusted according to the shooting effect of shooting the target through the light sensing component 812.
For example, when assembling the periscopic camera module 81, the light quantity adjusting assembly 830 and the module assembly 810 may be pre-positioned by a capturing tool such as a jig or a suction cup, so that the center lines of the light quantity adjusting assembly 830 and the module assembly 810 are substantially aligned (or approximately aligned) along the optical axis direction of the optical lens 811 of the module assembly 810, so that the photosensitive assembly 812 can capture an image of the target through the light quantity adjusting assembly 830; the position of the light quantity adjusting assembly 830 is adjusted according to the image quality (such as the SFR value of the image) so as to improve the degree of alignment between the light quantity adjusting assembly 830 and the optical axis of the optical lens 811; thereafter, the control effect of the light quantity adjusting assembly 830 is debugged to test whether the SFR value of the image reaches the expected SFR value during the adjustment of the light quantity adjusting assembly 830 within the light inlet quantity adjusting range, so as to facilitate the replacement of the light quantity adjusting assembly 830 which fails the test before the light turning assembly 820 is assembled.
Then, in the case where the light amount adjustment member 830 satisfies the requirement, the light redirecting member 820, the light amount adjustment member 830, and the module member 810 may be further pre-positioned such that the center lines of the light redirecting member 820, the light amount adjustment member 830, and the module member 810 are substantially aligned; and adjusts the position of the light turning component 820 according to the quality of the image (i.e. the shooting effect) shot by the light sensing component 812, so as to further improve the degree of alignment between the light turning component 820 and the optical axis of the optical lens 811; finally, after the adjustment and adjustment are completed, the light turning assembly 820, the light quantity adjusting assembly 830, and the module assembly 810 are positionally fixed to complete the manufacture of the periscopic camera module 81.
Of course, in other examples of the present invention, the relative position of the light steering assembly 820 may also be adjusted according to the SFR value of the captured image to test and adjust the anti-shake effect of the periscopic camera module 81; the relative position of the optical lens 811 of the module assembly 810 can be adjusted according to the SFR value of the captured image, so as to test and adjust the auto-focus effect or anti-shake effect of the periscopic camera module 81.
It should be noted that, although the steps of the method for manufacturing the periscopic camera module according to the present invention are sequentially depicted in the drawings, the order of the steps of the method for manufacturing the periscopic camera module according to the present invention is not limited thereto, and may be implemented in other orders. In addition, in other examples of the present invention, the method for manufacturing the periscopic camera module may include only a part of the steps shown in fig. 20A and 20B, or may include other steps besides the steps shown in fig. 20A and 20B, as long as one of the periscopic camera modules 81 can be manufactured, and the present invention is not described herein again.
Referring to fig. 21 to 23 of the drawings, a periscopic camera module according to a first embodiment of the present invention is illustrated. Specifically, as shown in fig. 21 and 22, the periscopic camera module 91 includes a module 910, a light turning module 920 and a light quantity adjusting module 930. The module assembly 910 includes a lens assembly 911 and a photosensitive assembly 912, wherein the photosensitive assembly 912 has a photosensitive path 9120 for receiving light along the photosensitive path 9120 for imaging, and the lens assembly 911 is correspondingly disposed on the photosensitive path 9120 of the photosensitive assembly 912 for converging light propagating along the photosensitive path 9120 for being received by the photosensitive assembly 912. The light turning component 920 is correspondingly disposed on the photosensitive path 9120 of the photosensitive component 912, and the lens component 911 of the module component 910 is disposed between the photosensitive component 912 and the light turning component 920, and is configured to bend the photosensitive path 9120 of the photosensitive component 912, so that light rays propagating along the photosensitive path 9120 are firstly turned by the light turning component 920 and then converged by the lens component 911 to be received and imaged by the photosensitive component 912.
The light quantity adjusting assembly 930 is assembled to the end portion 9200 of the light turning assembly 920, and the light quantity adjusting assembly 930 is located on the photosensitive path 9120 of the photosensitive assembly 912 for adjusting the quantity of light received by the photosensitive assembly 912. It can be understood that the end portion 9200 of the light turning component 920 includes a light inlet 9201 and a light outlet 9202 facing the module component 910, where the light turning component 920 is configured to extend the photosensitive path 9120 from the light inlet 9201 to the light outlet 9202 in a bending manner, so that light rays propagating along the photosensitive path 9120 are incident from the light inlet 9201, and are emitted from the light outlet 9202 after being turned, and then are received by the photosensitive component 912 for imaging.
It should be noted that, since the light quantity adjusting unit 930 is directly assembled to the end 9200 of the light turning unit 920, the module 910, the light turning unit 920 and the light quantity adjusting unit 930 in the periscopic camera module 91 are independent from each other, so that when one component goes wrong, the component can be replaced independently without affecting other components, which helps to reduce the maintenance cost of the periscopic camera module 91.
More specifically, in the above embodiment of the present invention, as shown in fig. 21 and 23, the light quantity adjusting component 930 is preferably assembled to the light outlet end 9201 of the light turning component 920, so that the light quantity adjusting component 930 is located between the light turning component 920 and the module component 910, which helps the periscopic camera module 91 of the present invention to fully utilize the internal space of the module, makes the internal structure of the module more compact, and helps to reduce the overall size of the module.
For example, as shown in fig. 23 and 24, the light diverting assembly 920 of the periscopic camera module 91 may include a reflecting element 921, a carrier 922 and a housing support 923, wherein the housing support 923 has a diverting channel 9230, wherein the reflecting element 921 and the carrier 922 are disposed in the diverting channel 9230 of the housing support 923, and the reflecting element 921 is carried on the carrier 922 to keep the reflecting element 921 correspondingly located on the photosensitive path 9120 of the module assembly 910. Meanwhile, the light quantity adjusting assembly 930 is mounted on the housing bracket 923 of the light turning assembly 920, and the light quantity adjusting assembly 930 is located at the light emitting end 9201 of the light turning assembly 920, so that light rays entering from the light entering end 9201 are first reflected by the reflecting element 921 to be turned, and then exit from the light emitting end 9202 after being turned, and then are adjusted by the light quantity adjusting assembly 930 to be received and imaged by the photosensitive assembly 912 of the module assembly 910.
Further, in the first embodiment of the present invention, as shown in fig. 23 and 24, the reflection element 921 of the light turning assembly 920 can be, but is not limited to be, implemented as a prism 9210, that is, the prism 9210 has a light incident surface 9211, a light emitting surface 9212 and a reflection surface 9213, wherein the light incident surface 9211 of the prism 9210 is located at the light incident end 9201 of the light turning assembly 920, and the reflection surface 9213 of the prism 9210 is disposed on the carrier 922, wherein the light emitting surface 9212 of the prism 9210 is located at the light emitting end 9202 of the light turning assembly 920, and the light emitting surface 9212 of the prism 9210 faces the module assembly 910, so that a light ray entering the prism 9210 through the light incident surface 9211 is firstly reflected by the reflection surface 9213 to be turned, then exits the prism 9210 through the light emitting surface 9212 to propagate along the photosensitive path 9120, and is received by the module component 910 for imaging. Of course, in other examples of the present invention, the reflecting element 921 of the light diverting assembly 920 may also be implemented as other optical elements such as a reflecting plane mirror and a waveguide, or the reflecting element 921 may also be replaced by a refractive element as long as the propagation direction of the light can be changed, which is not described in detail herein.
Preferably, the light-incident surface 9211 of the prism 9210 is perpendicular to the light-emitting surface 9212 of the prism 9210, so that the prism 9210 is implemented as a right-angle prism, and light rays perpendicularly entering the prism 9210 through the light-incident surface 9211 are firstly reflected by the reflecting surface 9213 to turn 990 °, and then perpendicularly exit the prism 9210 through the light-emitting surface 9212 to propagate along the light-sensing path 9120, and are further received by the module assembly 910 to form an image. In other words, the photosensitive paths 9120 of the photosensitive assemblies 912 of the module assembly 910 are respectively perpendicular to the light-incident surface 9211 and the light-emitting surface 9212 of the prism 9210 before and after being turned around, so that the light rays propagating along the photosensitive paths 9120 are reflected by the prism 9210 to be turned around and then received by the photosensitive assemblies 912 of the module assembly 910 for imaging.
More preferably, as shown in fig. 24, the prism 9210 is completely accommodated in the housing bracket 923, that is, the light incident surface 9211 and the light emitting surface 9212 of the prism 9210 are both located in the turning channel 9230 of the housing bracket 923, so as to protect the prism 9210 and reduce wear.
It is worth mentioning, as shown in fig. 24, the periscopic camera module 91 the light turns to subassembly 920 can also further include an anti-shake driver 924, wherein the anti-shake driver 924 is set up in the carrier 922 with between the shell support 923, be used for the drive the carrier 922 is in order to drive the prism 9210 rotates, in order to change the turned angle of prism 9210 makes via the light that the prism 9210 turned to can better follow sensitization route 9120 propagates, in order to realize the anti-shake effect of periscopic camera module 91 helps promoting periscopic camera module 91's image quality.
Exemplarily, as shown in fig. 24, the carrier 922 of the light turning assembly 920 has a bearing surface 9221 and at least one non-bearing surface 9222, wherein the reflection surface 9213 of the prism 9210 is disposed on the bearing surface 9221 of the carrier 922 in a face-to-face manner, and the anti-shake driver 924 is disposed between the non-bearing surface 9222 of the carrier 922 and an inner wall surface of the housing support 923, and is configured to drive the carrier 922 to drive the prism 9210 to rotate, so as to implement an anti-shake function of the periscopic camera module 91.
In more detail, as shown in fig. 24, the anti-shake driver 924 may include, but is not limited to, a magnet 9241 and a coil 9242, wherein the magnet 9241 is disposed on the non-carrying surface 9222 of the carrier 922, and the coil 9242 is correspondingly disposed on an inner wall surface of the housing bracket 923, so that a position of the magnet 9241 and a position of the coil 9242 correspond to each other to form an electric motor for driving the carrier 922 to drive the prism 9210 to rotate under the action of electric power to achieve the anti-shake effect. Of course, in other examples of the present invention, the magnet 9241 may be disposed on the inner wall surface of the housing holder 923, and the coil 9242 may be correspondingly disposed on the non-bearing surface 9222 of the carrier 922, as long as an electric motor can be formed, and the positions of the magnet 9241 and the coil 9242 are not limited in the present invention.
It should be noted that, according to the first embodiment of the present invention, as shown in fig. 21 and 23, the periscopic camera module 91 may further include an adhesive layer 950, where the adhesive layer 950 is located between the light quantity adjusting component 930 and the light exit end 9202 of the light turning component 920, so as to adhere the light quantity adjusting component 930 to the light exit end 9202 of the light turning component 920 through the adhesive layer 950, so that the light turned by the light turning component 920 passes through the light quantity adjusting component 930 first after exiting from the light exit end 9202, and then enters the photosensitive component 912 to be received and imaged. In this way, the periscopic camera module 91 can more accurately adjust the amount of light entering the photosensitive assembly 912 through the light amount adjusting assembly 930, and further accurately control the amount of light received by the photosensitive assembly 912, so that the periscopic camera module 91 can meet the light inlet amount requirements of different shooting modes and also contribute to improving the imaging quality of the periscopic camera module 91.
Illustratively, as shown in fig. 25A, the light quantity adjusting assembly 930 of the periscopic camera module 91 may include, but is not limited to, a plurality of blades 931, a plurality of electric actuators 932, and a frame 933, wherein the blades 931 are partially overlapped and mounted on the frame 933 to form an aperture-adjustable diaphragm hole 9300 by the blades 931, wherein the electric actuators 932 are correspondingly disposed on the frame 933, and the electric actuators 932 are connected with the blades 931 in a one-to-one correspondence for actuating the corresponding blades 931 to adjust the aperture size of the diaphragm hole 9300 (as shown in fig. 25B and 25C). It is understood that the electrical actuator 932 may include a magnet, a coil, and a toggle, wherein the coil, when energized, generates a magnetic field to move the magnet in a particular direction, thereby moving the toggle; the lever is connected to the blade 931 so that the blade 931 can change its position (e.g., rotate within a specific angular range, etc.) with the movement of the lever, thereby changing the aperture size of the diaphragm hole 9300. Further, the number and shape of the blades 931 in the light quantity adjusting unit 930 may be arbitrary as long as the diaphragm hole 9300 having a variable aperture can be formed, and the present invention is not limited thereto.
In other words, as shown in fig. 25B and 25C, the light amount adjustment assembly 930 has a square end surface, and the electric actuators 932 are uniformly distributed around the frame 933 such that the electric actuators 932 are connected to the blades 931 in a one-to-one correspondence for actuating the respective blades 931 to adjust the aperture size of the diaphragm holes 9300. It is to be understood that the end surfaces mentioned in the present invention are end surfaces of the light amount adjustment assembly 930 corresponding to the light redirecting assembly 920 and the lens assembly 911, respectively.
Of course, in a modified embodiment of the present invention, as shown in fig. 25D and 25E, the light amount adjusting unit 930 may have a rectangular end surface so that the shape of the light amount adjusting unit 930 matches the shape of the lens assembly 911, i.e., the long and short sides of the light amount adjusting unit 930 are parallel to the long and short sides of the lens assembly 911, respectively. It should be noted that the parallel defined in the present invention is understood to be parallel to each other, and may also exist at an angle, for example, an angle of 90-910 °.
The electric actuators 932 are symmetrically distributed on the left and right sides of the frame 933, and the electric actuators 932 are used to actuate the blades 931 to adjust the aperture size of the diaphragm holes 9300. It is to be understood that, in order to ensure that the shape of the light amount adjustment assembly 930 matches the shape of the lens assembly 911, the distribution position of the electric actuators 932 in the light amount adjustment assembly 930 may be designed/adjusted according to the shape of the lens assembly 911, for example, the electric actuators 932 may also be symmetrically distributed on the upper and lower sides of the frame 933. Of course, in other examples of the present invention, the light amount adjusting member 930 may also have a rectangular-like end surface, for example, a rounded rectangular end surface, or the like.
Preferably, the ratio of the width to the length of the rectangular end surface of the light amount adjusting member 930 is greater than 0.975 and less than 1, that is, as shown in fig. 25D, the ratio (W/L) of the width W to the length L of the rectangular end surface is between 0.975 and 1.
It should be noted that, in the first embodiment of the present invention, as shown in fig. 23, the adhesive layer 950 is located between the housing bracket 923 of the light turning assembly 920 and the frame 933 of the light quantity adjusting assembly 930, so as to firmly attach the light quantity adjusting assembly 930 to the light exit end 9202 of the light turning assembly 920. Meanwhile, the adhesive layer 950 may be simultaneously located between the light amount adjustment unit 930 and the lens assembly 911 of the module assembly 910, so that the light redirecting unit 920, the light amount adjustment unit 930, and the module assembly 910 are sequentially adhered together by the adhesive layer 950 to be independently assembled into the periscopic camera module 91.
In particular, the adhesive layer 950 may be cured by, but not limited to, an adhesive such as glue, so as to adjust the relative positions of the light turning member 920, the light quantity adjusting member 930 and the module assembly 910 before curing, and ensure that the center of the aperture hole 9300 of the light quantity adjusting member 930 is aligned or substantially aligned with the photosensitive path 9120 of the photosensitive assembly 912, so that the light turned by the light turning member 920 can pass through the aperture hole 9300 of the light quantity adjusting member 930 to enter the module assembly 910 to be received and imaged by the photosensitive assembly 912.
Exemplarily, in the above example of the present invention, an adhesive is applied on the frame 933 of the light quantity adjusting assembly 930, and then the light quantity adjusting assembly 930 is correspondingly placed on the light exit end 9202 of the light turning assembly 920, and the adhesive is located between the housing bracket 923 of the light turning assembly 920 and the frame 933 of the light quantity adjusting assembly 930, so as to form the adhesive layer 950 after the adhesive is cured, so as to adhesively fix the light quantity adjusting assembly 930 to the housing bracket 923 of the light turning assembly 920 through the adhesive layer 950, so as to stably hold the light quantity adjusting assembly 930 at the light exit end 9202 of the light turning assembly 920; finally, an adhesive is further applied between the light amount adjusting member 930 and the module member 910 to form the adhesive layer 950 that adhesively fixes the light amount adjusting member 930 and the module member 910 after the adhesive is cured.
It should be noted that fig. 26 shows a first variant of the periscopic camera module 91 according to the above embodiment of the present invention, wherein the light quantity adjusting element 930 is directly fastened to the housing bracket 923 of the light turning element 920 and is located at the light exit end 9202 of the light turning element 920. In other words, the present invention directly and detachably assembles the light quantity adjusting component 930 to the light turning component 920, which facilitates easy replacement of the light turning component 920 or the light quantity adjusting component 930.
Specifically, as shown in fig. 26, the light emitting end 9202 of the light turning assembly 920 is provided with a first engaging structure 9231 located on the housing holder 923, and the frame 933 of the light quantity adjusting assembly 930 is provided with a second engaging structure 9232 adapted to the first engaging structure, wherein when the first engaging structure 9231 and the second engaging structure 9232 are adapted to be engaged together, the frame 933 of the light quantity adjusting assembly 930 is mounted on the housing holder 920, so that the light quantity adjusting assembly 930 is assembled to the light emitting end 9202 of the light turning assembly 920.
Preferably, as shown in fig. 26, in the periscopic camera module 91 according to the first modified embodiment of the present invention, the first engaging structure 9231 is implemented as a groove provided on the housing bracket 923, and the second engaging structure 9232 is implemented as a protrusion provided on the frame 933, so that the fixed assembly between the light quantity adjusting assembly 930 and the light turning assembly 920 is realized by inserting the protrusion on the frame 933 into the groove on the housing bracket 923, which not only can reduce the size of the periscopic camera module 91, but also can simplify the assembly and disassembly of the periscopic camera module 91.
More preferably, in order to further enhance the connection strength between the first latching structure 9231 and the second latching structure 9232, so that the light quantity adjusting assembly 930 is more firmly mounted to the housing bracket 923 of the light turning assembly 920, the adhesive layer 950 of the present invention may also be disposed between the first latching structure 9231 and the second latching structure 9232. For example, an adhesive is applied in the first fastening structure 9231 (i.e., the groove of the housing support 923), and then the first fastening structure 9231 and the second fastening structure 9232 are fastened to form the adhesive layer 950 between the first fastening structure 9231 and the second fastening structure 9232 after the adhesive is cured, so that the light amount adjusting assembly 930 is adhesively fastened to the housing support 923 of the light turning assembly 920, so that the light amount adjusting assembly 930 is firmly fixed to the light turning assembly 920.
It should be noted that, although the first latching structure 9231 and the second latching structure 9232 are sequentially implemented as a groove and a protrusion to realize the latching connection between the light quantity adjusting component 930 and the light turning component 920 in the periscopic camera module 91 as shown in fig. 26, the manner of latching is not limited thereto. For example, as shown in fig. 27, a second modified embodiment of the periscopic camera module 91 according to the above-described first embodiment of the present invention is illustrated, wherein the first snap-fit structure 9231 of the periscopic camera module 91 is implemented as a protrusion provided on the housing bracket 923, and the second snap-fit structure 9232 is implemented as a groove provided on the frame 933, so that the fixed assembly between the light quantity adjusting assembly 930 and the light turning assembly 920 is also achieved by the protrusion on the housing bracket 923 being inserted into the groove on the frame 933.
It should be noted that the light quantity adjusting component 930 of the periscopic camera module 91 is not limited to be assembled at the light outlet end 9202 of the light turning component 920, for example, in another example of the present invention, the light quantity adjusting component 930 may also be assembled at the light inlet end 9201 of the light turning component 920, so that the light rays propagating along the light sensing path 9120 first pass through the light quantity adjusting component 930 for adjusting the light quantity, then enter the light turning component 920 from the light inlet end 9201 for being turned, and then exit from the light outlet end 9202 for entering the module component 910 to be received and imaged by the light sensing component 912.
Fig. 28A and 28B show a third modified embodiment of the periscopic camera module 91 according to the first embodiment of the present invention, in which the adhesive layer 950 is located between the housing bracket 923 of the light turning assembly 920 and the frame 933 of the light quantity adjustment assembly 930, and the light quantity adjustment assembly 930 is located at the light inlet end 9201 of the light turning assembly 920, so as to firmly attach the light quantity adjustment assembly 930 to the light inlet end 9201 of the light turning assembly 920. Meanwhile, the adhesive layer 950 may be simultaneously located between the light exit end 9202 of the light redirecting unit 920 and the lens unit 911 of the module unit 910, so that the light amount adjusting unit 930, the light redirecting unit 920, and the module unit 910 are bonded together by the adhesive layer 950 to assemble the periscopic camera module 91 independently.
In this way, since the light quantity adjusting assembly 930 is independently assembled to the light entrance end 9201 of the light turning assembly 920 and the light turning assembly 920 is independently assembled to the module assembly 910, the light turning assembly 920 and the module assembly 910 can be assembled before the light quantity adjusting assembly 930 is assembled, so as to ensure high imaging quality of the periscopic camera module 91 by adjusting/adjusting the posture (i.e., position and posture) of the light turning assembly 920. Thereafter, in the process of assembling and adjusting the light quantity adjusting assembly 930, the light turning assembly 920 and the module assembly 910 do not need to be adjusted, which is beneficial to reducing the adjustment variables and improving the adjustment efficiency and accuracy of the light quantity adjusting assembly 930. Of course, the light quantity adjusting unit 930 is independently assembled to the light inlet end 9201 of the light turning unit 920, which further facilitates the detection and replacement of the light quantity adjusting unit 930, thereby reducing the maintenance cost.
It is noted that, as shown in fig. 28B, the adhesive layer 950 is disposed between the frame 933 of the light quantity adjusting assembly 930 and the housing bracket 923 of the light turning assembly 920, so that the light quantity adjusting assembly 930 is adhesively mounted to the light entrance end 9201 of the light turning assembly 920 through the adhesive layer 950. Meanwhile, the thickness D of the adhesive layer 950 is implemented as a distance between the frame 933 of the light amount adjusting member 930 and the housing support 923 of the light turning member 920, so that the distance between the light amount adjusting member 930 and the light turning member 920 is controllably adjusted by the magnitude of the thickness D of the adhesive layer 950, so as to adjust the relative position between the light turning member 920 and the light amount adjusting member 930, thereby achieving the center alignment of the center of the diaphragm hole 9300 of the light amount adjusting member 930 and the light incident surface of the light turning member 920. It can be understood that, when the light quantity adjusting assembly 930 is adhesively mounted to the light exit end 9202 of the light turning assembly 920 through the adhesive layer 950, the thickness of the adhesive layer 950 also helps to adjust the relative position between the light turning assembly 920 and the light quantity adjusting assembly 930, so as to achieve the alignment between the center of the diaphragm hole 9300 of the light quantity adjusting assembly 930 and the center of the light exit surface of the light turning assembly 920.
Preferably, the thickness D of the adhesive layer 950 between the light amount adjusting member 930 and the light diverting member 920 is between 0.901mm and 0.92mm, that is, the range of the thickness D of the adhesive layer 950 is preferably implemented as 0.901mm < D < 0.92 mm.
More preferably, the thickness D of the adhesive layer 950 between the light amount adjusting member 930 and the light redirecting member 920 is between 0.903mm and 0.915mm, that is, the thickness D of the adhesive layer 950 is preferably implemented in a range of 0.903mm < D < 0.915 mm.
In addition, fig. 29 shows a fourth variant of the periscopic camera module 91 according to the first embodiment of the present invention, wherein the light quantity adjusting element 930 is directly fastened to the housing bracket 923 of the light turning element 920 and is located at the light entrance end 9201 of the light turning element 920. In other words, the light quantity adjusting unit 930 is directly and detachably assembled to the light inlet end 9201 of the light turning unit 920, which further facilitates the light quantity adjusting unit 930 to be replaced conveniently.
Illustratively, as shown in fig. 29, the light inlet 9201 of the light turning module 920 is provided with a first engaging structure 9231 located at the housing holder 923, and the frame 933 of the light quantity adjusting module 930 is provided with a second engaging structure 9232 adapted to the first engaging structure, wherein when the first engaging structure 9231 and the second engaging structure 9232 are adapted to be engaged together, the frame 933 of the light quantity adjusting module 930 is mounted on the housing holder 923 of the light turning module 920, so that the light quantity adjusting module 930 is assembled to the light inlet 9201 of the light turning module 920.
Preferably, as shown in fig. 29, in the periscopic camera module 91 according to the fourth modified embodiment of the present invention, the first engaging structure 9231 is implemented as a groove provided on the housing bracket 923, and the second engaging structure 9232 is implemented as a protrusion provided on the frame 933, so that the light quantity adjusting assembly 930 and the light steering assembly 920 are fixedly assembled by inserting the protrusion on the frame 933 into the groove on the housing bracket 923, which not only can reduce the size of the periscopic camera module 91, but also can simplify the assembly and disassembly of the periscopic camera module 91.
It should be noted that, although the first latching structure 9231 and the second latching structure 9232 are sequentially implemented as a groove and a protrusion to realize the latching connection between the light quantity adjusting component 930 and the light turning component 920 in the periscopic camera module 91 as shown in fig. 29, the manner of latching is not limited thereto. For example, as shown in fig. 30, a fifth modified embodiment of the periscopic camera module 91 according to the above-mentioned first embodiment of the present invention is illustrated, wherein the first snap-fit structure 9231 of the periscopic camera module 91 is implemented as a protrusion provided on the housing bracket 923, and the second snap-fit structure 9232 is implemented as a groove provided on the frame 933, so that the fixed assembly between the light quantity adjusting assembly 930 and the light turning assembly 920 can be realized by inserting the protrusion on the housing bracket 923 into the groove on the frame 933.
Meanwhile, in some examples of the present invention, the adhesive layer 950 may be disposed between the light emitting end 9202 of the light turning element 920 and the lens element 911 of the module element 910, so that the light turning element 920 is directly adhered to the module element 910 through the adhesive layer 950, and after the light turning element 920 is debugged, the light quantity adjusting element 930 is adhered to or fastened to the light entering end 9201 of the light turning element 920, so as to complete the assembly of the periscopic camera module 91. In other words, before assembling the light quantity adjusting assembly 930, the light turning assembly 920 may be debugged by the photographing effect of the photosensitive assembly 912 to determine whether the center of the light emitting end 9202 of the light turning assembly 920 is aligned with the optical center of the optical lens of the module assembly 910; alternatively, the light redirecting assembly 920 may be tested for light redirecting effects that are expected, and so forth.
It should be noted that, according to the first embodiment of the present invention, as shown in fig. 23, the lens assembly 911 of the module assembly 910 of the periscopic module 91 may include an optical lens 9111, a focusing driver 9112 and an assembly housing 9113, wherein the optical lens 9111 and the focusing driver 9112 are assembled in the assembly housing 9113, and the photosensitive component 912 is correspondingly assembled in the assembly housing 9113, wherein the optical lens 9111 is drivably disposed on the focusing driver 9112, so that the optical lens 911 is held on the photosensitive path 9120 of the photosensitive component 912 and moves back and forth along the photosensitive path 9100 under the driving of the focusing driver 913, so as to realize the focusing function of the periscopic module 91.
In addition, as shown in fig. 23, the photosensitive assembly 912 of the module assembly 910 may include a photosensitive chip 9121 and a filter element 9122, wherein the filter element 9122 is disposed between the photosensitive chip 9121 and the optical lens 9111, such that light entering the module assembly 910 is collected by the optical lens 9111, and then is received by the photosensitive chip 9121 for imaging after being filtered by the filter element 9122.
It is to be noted that the light quantity adjusting assembly 930 of the periscopic camera module 91 according to the first embodiment of the present invention may be implemented as, but not limited to, various types of variable diaphragms such as voltage-type variable diaphragms, liquid crystal-type variable diaphragms, or blade-type variable diaphragms, so as to change the size of the diaphragm aperture of the variable diaphragm under the action of electric energy, thereby adjusting the quantity of light entering the module assembly 910. Meanwhile, the anti-shake driver 924 of the light turning assembly 920 and the photo sensor chip 9121 and the focus driver 9112 of the module assembly 910 also require electric power when in operation. Therefore, as shown in fig. 22 and 23, the periscopic camera module 91 of the present invention further includes a circuit board assembly 940, wherein the light quantity adjusting assembly 930, the anti-shake driver 924 of the light turning assembly 920, and the photosensitive chip 9121 and the focus driver 9112 in the module assembly 910 are electrically connected to the circuit board assembly 940, so as to provide the light quantity adjusting assembly 930, the anti-shake driver 924 of the light turning assembly 920, and the photosensitive chip 9121 and the focus driver 9112 in the module assembly 910 with electric power required for operation through the circuit board assembly 940.
Illustratively, as shown in fig. 22 and 23, the circuit board assembly 940 of the periscopic camera module 91 includes a first circuit board 941, a second circuit board 942, a driving circuit board 943 and an extension circuit board 944, wherein the extension circuit board 944 extends from the rear end to the front end of the periscopic camera module 91, and the extension circuit board 944 is electrically connected to the first circuit board 941, the second circuit board 942 and the driving circuit board 943. The first circuit board 941 is disposed on the housing bracket 923 of the light turning assembly 920, and the first circuit board 941 is electrically connected to the anti-shake driver 924 for providing electric energy required by the operation of the anti-shake driver 924, so that the prism 9210 rotates to achieve optical anti-shake. The second circuit board 942 is disposed on the photosensitive assembly 912 of the module assembly 910, and is configured to electrically mount the photosensitive chip 9121, so as to provide electric energy for the photosensitive chip 9121 through the second circuit board 942, so that the photosensitive chip 9121 can receive light to form an image. The driving circuit board 943 is disposed on the lens assembly 911 of the module assembly 910, and the driving circuit board 943 is electrically connected to the focusing driver 9112 for providing electric energy required by the operation of the focusing driver 9112, so that the optical lens 9111 moves relative to the photosensitive chip 9121 of the photosensitive assembly 912 under the driving of the focusing driver 9112 to realize a focusing function.
In particular, the light quantity adjusting unit 930 of the present invention may be, but is not limited to, electrically connected to the extension circuit board 944 of the circuit board assembly 940 directly, so as to provide the light quantity adjusting unit 930 with electric power required for operation through the extension circuit board 944. Of course, in other examples of the present invention, the light quantity adjusting assembly 930 may also be directly electrically connected to the first circuit board 941 or the driving circuit board 943 to provide the light quantity adjusting assembly 930 with electric energy required for operation through the first circuit board 941 or the driving circuit board 943. It is understood that the light quantity adjusting assembly 930 may be, but not limited to, soldered or conductively adhered to a corresponding circuit board through electrical connecting elements such as wires or conductive pins, so as to achieve the effect of electrically connecting, and the description of the present invention is omitted here.
It should be noted that the light quantity adjusting assembly 930 of the present invention needs to be debugged during assembly so that the aperture hole 9300 of the light quantity adjusting assembly 930 corresponds to the photosensitive path 9120 of the photosensitive assembly 912, and the light quantity adjusting range of the light quantity adjusting assembly 930 meets the working requirement of the periscopic camera module 91, so as to avoid the light quantity adjusting assembly 930 from adversely affecting the imaging quality of the periscopic camera module 91.
Therefore, in order to debug the light quantity adjusting unit 930 before assembling the light redirecting unit 920, a periscopic camera module according to a second embodiment of the present invention is illustrated with reference to fig. 31A of fig. 29 of the specification. The periscopic camera module 91 according to the second embodiment of the present invention differs from the first embodiment of the present invention described above in that: the light quantity adjusting assembly 930 is directly assembled to the lens assembly 911 of the module assembly 910, and the light quantity adjusting assembly 930 is located on the photosensitive path 9120 of the photosensitive assembly 912 to adjust the quantity of light received by the photosensitive assembly 912 through the light quantity adjusting assembly 930 as well.
Illustratively, as shown in fig. 31A, the light quantity adjusting component 930 is directly adhered to the assembly housing 9113 of the lens component 911 through the adhesive layer 950, and the light quantity adjusting component 930 is located between the optical lens 9111 and the light turning component 920, so that the light rays propagating along the photosensitive path 9120 are firstly turned by the light turning component 920, then adjusted by the light quantity adjusting component 930, and finally received and imaged by the photosensitive chip 9121 of the photosensitive component 912 after being converged by the optical lens 9111.
It should be noted that, since the light quantity adjusting component 930 is directly adhered to the assembly housing 9113 of the lens assembly 911, before the light turning component 920 is assembled, the light quantity adjusting component 930 can be assembled on the assembly housing 9113 of the lens assembly 911 of the module assembly 910, so as to adjust the pose and the light quantity adjusting quality of the light quantity adjusting component 930 according to the image effect captured by the photosensitive chip 9121 of the photosensitive component 912, which is beneficial to reducing the difficulty of adjusting the light quantity adjusting component 930 and improving the accuracy of adjusting the light quantity adjusting component 930. Meanwhile, if the light amount adjusting unit 930 cannot meet the requirements after being debugged due to its own defects, the light amount adjusting unit 930 may be directly replaced with a new one, so as to avoid disassembling the light turning unit 920 and simplify the assembly process.
Further, as shown in fig. 31A, the adhesive layer 950 is disposed between the frame 933 of the light amount adjustment member 930 and the assembly housing 9113 of the lens assembly 911 to adhesively mount the light amount adjustment member 930 to the lens assembly 911 through the adhesive layer 950. Meanwhile, the thickness d of the adhesive layer 950 is implemented as the distance d between the frame 933 of the light amount adjustment member 930 and the assembly housing 9113 of the lens assembly 911, so that the distance between the light amount adjustment member 930 and the lens assembly 911 is controllably adjusted by the magnitude of the thickness d of the adhesive layer 950.
It is understood that the distance between the light amount adjustment member 930 and the lens member 911 (or the thickness d of the adhesive layer 950) can optically achieve a "vignetting" phenomenon relief, an increase in image brightness, and a sharper image, and also can achieve an adjustment of the relative position between the light amount adjustment member 930 and the lens member 911 such that the center of the diaphragm hole 9300 of the light amount adjustment member 930 is aligned with the optical axis of the optical lens 9111 of the lens member 911.
Preferably, the thickness d of the adhesive layer 950 between the light amount adjustment member 930 and the lens member 911 is between 0.901mm and 0.92mm, that is, the thickness d of the adhesive layer 950 is preferably implemented to have a value of 0.901mm ≦ d ≦ 0.92 mm.
More preferably, the thickness d of the adhesive layer 950 between the light amount adjustment member 930 and the lens member 911 is between 0.903mm and 0.915mm, that is, the range of the thickness d of the adhesive layer 950 is preferably implemented as 0.903mm ≦ d ≦ 0.915 mm.
Further, in one example of the present invention, as shown in fig. 31B, the adhesive layers 950 are correspondingly positioned at both left and right sides of the assembly housing 9113 of the lens assembly 911, so that the light amount adjustment assembly 930 is directly adhered to the assembly housing 9113 of the lens assembly 911 by the adhesive layers 950. In other words, the adhesive is disposed on the left and right sides of the assembly housing 9113 in a glue-drawing manner, and then the light amount adjusting component 930 is correspondingly attached to the assembly housing 9113 of the lens component 911, so that the pose and the light amount adjusting quality of the light amount adjusting component 930 are adjusted according to the photographed image effect before the adhesive is cured, which is helpful for improving the debugging accuracy of the light amount adjusting component 930.
Of course, in another example of the present invention, as shown in fig. 31C, the adhesive layers 950 are located at left and right sides and a bottom side of the assembly housing 9113 of the lens assembly 911, respectively, so that the light amount adjusting assembly 930 is securely adhered to the assembly housing 9113 of the lens assembly 911 by the adhesive layers 950. In other words, the adhesives are firstly disposed on the left and right sides and the bottom side of the assembly housing 9113 in a glue-drawing manner, and then the light amount adjusting components 930 are correspondingly attached to the assembly housing 9113 of the lens assembly 911, so that after the adhesives are cured, the adhesive layers 950 disposed on the left and right sides and the bottom side of the assembly housing 9113 are formed, which is helpful for increasing the adhesive area of the adhesive layers 950, and further enhancing the adhesive strength between the light amount adjusting components 930 and the lens assembly 911. In addition, the adhesive layers 950 located on the left, right, and bottom sides of the assembly housing 9113 of the lens assembly 911 also contribute to reducing the thickness of the periscopic camera module 91.
It should be noted that fig. 32 shows a first modified embodiment of the periscopic camera module 91 according to the second embodiment of the present invention, wherein the light quantity adjusting component 930 is directly fastened to the assembly housing 9113 of the lens assembly 911, and the light quantity adjusting component 930 is located between the optical lens 9111 and the light turning component 920. In other words, the present invention directly detachably assembles the light quantity adjusting component 930 to the assembly housing 9113 of the lens assembly 911, which further helps to reduce the difficulty in adjusting and replacing the light quantity adjusting component 930.
Illustratively, as shown in fig. 32, the assembly housing 9113 of the lens assembly 911 is provided with a first snap structure 9231, and the frame 933 of the light amount adjusting assembly 930 is provided with a second snap structure 9232 adapted to the first snap structure 9231, wherein when the first snap structure 9231 and the second snap structure 9232 are adapted to be snapped together, the frame 933 of the light amount adjusting assembly 930 is mounted on the assembly housing 9113 of the lens assembly 911, so that the light amount adjusting assembly 930 is detachably assembled to the assembly housing 9113 of the lens assembly 911.
In particular, as shown in fig. 32, in the periscopic camera module 91 according to this modified embodiment of the present invention, the first engagement structure 9231 is implemented as a groove provided in the assembly housing 9113, and the second engagement structure 9232 is implemented as a protrusion provided in the frame 933, so as to achieve fixed assembly between the light amount adjustment assembly 930 and the lens assembly 911 of the module assembly 910 by inserting the protrusion on the frame 933 into the groove on the assembly housing 9113, which not only enables reduction in size of the periscopic camera module 91, but also enables simplification of attachment and detachment of the periscopic camera module 91.
It should be noted that, although the first latching structure 9231 and the second latching structure 9232 are sequentially implemented as a groove and a protrusion to realize the latching connection between the light quantity adjusting component 930 and the lens component 911 in the periscopic camera module 91 as shown in fig. 32, this is only an example, and the latching manner mentioned in the present invention is not limited thereto. For example, as shown in fig. 33, a second modified embodiment of the periscopic camera module 91 according to the above-described second embodiment of the present invention is illustrated, in which the first snap-fit structure 9231 of the periscopic camera module 91 is implemented as a protrusion provided on the assembly housing 9113, and the second snap-fit structure 9232 is implemented as a groove provided on the frame 933, so that fixed assembly between the light amount adjustment member 930 and the lens member 911 can be also achieved by inserting the protrusion on the assembly housing 9113 into the groove on the frame 933.
Of course, in other examples of the present invention, the light amount adjusting component 930 may also be directly welded to the lens component 911 of the module component 910, so as to mount the light amount adjusting component 930 to the lens component 911 more firmly, which is not described in detail herein.
Fig. 34 shows a third modified embodiment of the periscopic camera module 91 according to the second embodiment of the present invention, in which the light quantity adjusting assembly 930 is directly assembled to the optical lens 9111 of the lens assembly 911 so as to keep the light quantity adjusting assembly 930 better aligned with the photosensitive path 9120 of the photosensitive assembly 912.
Specifically, as shown in fig. 34, the optical lens 9111 may include a first lens group 91111 and a second lens group 91112, wherein the light quantity adjusting assembly 930 is disposed between the first lens group 91111 and the second lens group 91112, and the second lens group 91112 is disposed between the light quantity adjusting assembly 930 and the photosensitive assembly 912, such that the light deflected by the light deflecting assembly 920 passes through the first lens group 91111, the light quantity adjusting assembly 930 and the second lens group 91112 in sequence, and then is received by the photosensitive chip 9121 of the photosensitive assembly 912 for imaging. It is to be understood that the first and second lens groups 91111 of the optical lens 9111 can include one or more lenses for converging light rays passing through the optical lens 9111.
Preferably, as shown in fig. 34, the optical lens 9111 further includes a lens barrel 91113, wherein the first lens group 91111, the light quantity adjusting assembly 930 and the second lens group 91112 are assembled in the lens barrel 91113 in sequence so as to keep the first lens group 91111 and the second lens group 91112 coaxial, and the center of the stop hole 9300 of the light quantity adjusting assembly 930 is located on the optical axis of the first lens group 91111 and the second lens group 91112, which helps to improve the imaging quality of the periscopic camera module 91. Meanwhile, the lens barrel 91113 of the optical lens 9111 is assembled to the focus actuator 9112, so that the lens barrel 91113 is driven by the adjustment actuator 9112 to drive the first lens group 91111, the second lens group 91112 and the light quantity adjusting assembly 930 to move along the photosensitive path 9120, so as to prevent the light quantity adjusting assembly 930 from affecting the focusing effect of the periscopic imaging module 91.
It should be noted that although the optical lens 9111 in the periscopic camera module 91 shown in fig. 34 only includes one lens barrel 91113, it is only an example, and the number of the lens barrels 91113 mentioned in the present invention is not limited thereto. For example, as shown in fig. 35, a fourth modified embodiment of the periscopic camera module 91 according to the above-mentioned second embodiment of the present invention is illustrated, wherein the optical lens 9111 of the periscopic camera module 91 may include a first barrel 91114 and a second barrel 91115, wherein the first lens group 91111 is assembled to the first barrel 91114, and the second lens group 91112 is assembled to the second barrel 91115. Meanwhile, the light quantity adjusting assembly 930 is assembled between the first barrel 91114 and the second barrel 91115 to ensure that the light quantity adjusting assembly 930 is positioned between the first lens group 91111 and the second lens group 91112.
It is to be noted that, just because the first and second lens groups 91111, 91112 are assembled to the first and second barrels 91114, 91115, respectively, and the first and second barrels 91114, 91115 are independent from each other, the focus actuator 913 of the lens assembly 911 of the present invention can achieve the focusing effect of the periscopic camera module 91 by driving the first barrel 91114 and/or the second barrel 91115.
For example, the light amount adjusting assembly 930 may be, but is not limited to, mounted on the first barrel 91114 and/or the second barrel 91115 of the optical lens 9111 by means such as bonding or snap-fitting, and the description of the invention is omitted here.
Of course, in other examples of the present invention, the light quantity adjusting assembly 930 may be separately mounted to the first barrel 91114, and the first and second lens groups 91111, 91112 are located between the light quantity adjusting assembly 930 and the photosensitive assembly 912, so that light rays pass through the first and second lens groups 91111, 91112 in sequence after being adjusted in light quantity by the light quantity adjusting assembly 930 to be received and imaged by the photosensitive assembly 912.
Fig. 36 shows a fifth modified embodiment of the periscopic camera module 91 according to the second embodiment of the present invention, in which the light quantity adjusting assembly 930 is integrally formed with the focus actuator 9112 of the lens assembly 911, that is, the light quantity adjusting assembly 930 is integrally connected with the lens assembly 911 to form an actuator having a function of adjusting the quantity of incoming light, thereby achieving the focusing effect and the quantity of incoming light adjustment.
It is noted that the focus actuator 9112 of the present invention can comprise a drive motor and a drive housing. The drive motor may include a magnet mounted on a lens barrel of the optical lens 9111 and a coil mounted on the drive housing, and the position of the magnet and the position of the coil correspond to each other. The drive housing has a recessed aperture for receiving the optical lens 9111. It is understood that the drive motor may be implemented as, but not limited to, a voice coil motor or a piezoelectric motor. In another example of the present invention, the coil may be attached to a lens barrel of the optical lens 9111, and the magnet may be attached to the drive housing.
Illustratively, in this modified embodiment of the present invention, the frame 933 of the light amount adjusting assembly 930 is integrally connected to the driving housing of the focus actuator 9112, so that the light amount adjusting assembly 930 and the focus actuator 9112 have an integrated structure. In other words, the light amount adjusting assembly 930 is integrally mounted to the focus actuator 9112 to maximize the coupling strength of the light amount adjusting assembly 930 to the focus actuator 9112. Of course, in other examples of the present invention, the light amount adjusting assembly 930 may be mounted to the driving housing of the focus driver 9112 by means of adhesion and/or snap-fitting.
It should be noted that, in the second embodiment of the present invention, when the periscopic camera module 91 is assembled, the light quantity adjusting assembly 930 and the module assembly 910 may be pre-positioned by a capturing tool such as a clamp or a suction cup, so that the center line of the diaphragm hole 9300 of the light quantity adjusting assembly 930 is substantially aligned (or approximately aligned) with the optical axis of the optical lens 9111 of the lens assembly 911 of the module assembly 910, so that the photosensitive assembly 912 can capture an image of the target through the light quantity adjusting assembly 930; adjusting the position of the light quantity adjusting component 930 according to the image quality (such as the SFR value of the image) so as to improve the degree of alignment between the light quantity adjusting component 930 and the optical axis of the optical lens 9111; thereafter, the control effect of the light amount adjusting unit 930 is adjusted to test whether the SFR value of the image reaches the expected SFR value during the adjustment of the light amount adjusting unit 930 in the light amount adjusting range, so as to facilitate the replacement of the light amount adjusting unit 930 which fails the test before the light redirecting unit 920 is assembled.
Then, in case the light amount adjustment member 930 meets the requirement, the light redirecting member 920 may be further pre-positioned such that the center lines of the light redirecting member 920, the light amount adjustment member 930, and the module member 910 are substantially aligned; and the position of the light-turning component 920 is adjusted according to the quality of the image (i.e. the shooting effect) shot by the photosensitive component 912, so as to further improve the alignment degree between the center of the light-emitting end 9201 of the light-turning component 920 and the optical axis of the optical lens 9111; finally, after the adjustment and adjustment, the light turning assembly 920, the light quantity adjusting assembly 930 and the module assembly 910 are fixed in position to complete the manufacture of the periscopic camera module 91.
Of course, in other examples of the present invention, the relative position of the light steering assembly 920 may also be adjusted according to the SFR value of the captured image, so as to test and adjust the anti-shake effect of the periscopic camera module 91; the relative position of the optical lens 911 of the module 910 can be adjusted according to the SFR value of the captured image, so as to test and adjust the auto-focus effect or anti-shake effect of the periscopic camera module 91.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (43)
- A periscopic module of making a video recording, its characterized in that includes:a module assembly, wherein the module assembly has a photosensitive path;a light turning component, wherein the light turning component is correspondingly disposed on the photosensitive path of the module component, and the light turning component has a light inlet end and a light outlet end facing the module component, wherein the light turning component is used for turning the light entering from the light inlet end to exit from the light outlet end, and propagating along the photosensitive path to be received by the module component for imaging;a light quantity adjusting assembly, wherein the light quantity adjusting assembly is assembled at the light outlet end of the light turning assembly so as to be positioned between the light turning assembly and the module assembly, and is used for adjusting the quantity of light rays entering the module assembly; anda circuit board assembly, wherein the circuit board assembly is configured to be electrically connected to the light quantity adjusting assembly for providing the light quantity adjusting assembly with electric power required for operation.
- The periscopic camera module of claim 1, wherein the circuit board assembly includes a first circuit board electrically coupled to the light redirecting assembly, a second circuit board electrically coupled to the module assembly, and a first extension circuit board, wherein the first extension circuit board extends from the module assembly to the light redirecting assembly, and wherein the first extension circuit board is electrically coupled to the first circuit board and the second circuit board, respectively.
- The periscopic camera module of claim 2, wherein said circuit board assembly further comprises at least one electrical connecting element, wherein said electrical connecting element electrically connects said first extension circuit board with said light quantity adjusting assembly for providing electrical energy required for said light quantity adjusting assembly to operate through said first extension circuit board.
- The periscopic camera module of claim 3, wherein said electrical connection element is a conductive pin, wherein said conductive pin is electrically connected to said light quantity adjusting assembly, so as to electrically connect said light quantity adjusting assembly to said first extension board through said conductive pin.
- The periscopic camera module of claim 4, wherein said conductive pins extend outwardly from side-by-side walls of said light intensity adjustment assembly to said first extension wiring board, and said conductive pins are soldered to said first extension wiring board.
- The periscopic camera module of claim 4, wherein said conductive pins are disposed at intervals and electrically connected to the side walls of said light quantity adjusting assembly, wherein said first extension circuit board is provided with two notches, and said notches on said first extension circuit board correspond to said conductive pins disposed on said light quantity adjusting assembly one-to-one, respectively, so as to solder said conductive pins to said first extension circuit board.
- The periscopic camera module of claim 2, wherein said circuit board assembly further comprises at least one electrical connecting element, wherein said electrical connecting element electrically connects said first circuit board with said light quantity adjusting assembly for providing electrical energy required for operation of said light quantity adjusting assembly through said first circuit board.
- The periscopic camera module of claim 7, wherein said electrical connection element is a conductive pin, wherein said conductive pin is electrically connected to said light quantity adjusting assembly, and said conductive pin extends from a bottom wall of said light quantity adjusting assembly side by side forward to said first circuit board, and said conductive pin is soldered to said first circuit board.
- The periscopic camera module of claim 8, wherein said electrical connection element comprises a lead, wherein one end of said lead is electrically connected to said first circuit board, and the other end of said lead is electrically connected to said light quantity adjusting assembly
- The periscopic camera module of claim 2, wherein said circuit board assembly further comprises a driving circuit board, wherein said driving circuit board is electrically connected to a bottom side of said module assembly and said driving circuit board is electrically connected to said first extension circuit board, wherein said circuit board assembly further comprises at least one electrical connection element, wherein said electrical connection element electrically connects said driving circuit board with said light quantity adjusting assembly for providing electrical power required for operation of said light quantity adjusting assembly through said driving circuit board.
- The periscopic camera module of claim 10, wherein said electrical connection element is a conductive pin, wherein said conductive pin is electrically connected to said light quantity adjusting assembly, and said conductive pin extends from a bottom wall of said light quantity adjusting assembly side by side and backward to said driving circuit board, and said conductive pin is soldered to said driving circuit board.
- The periscopic camera module of any one of claims 2-11, wherein said circuit board assembly further comprises a first flexible board, wherein said first flexible board is electrically connected to said second circuit board and said first extension circuit board by bending.
- The periscopic camera module of any one of claims 2-11, wherein said circuit board assembly further comprises a first flexible board, a second extension circuit board, and a second flexible board, wherein said second circuit board is disposed on a rear side of said module assembly, and said second extension circuit board is stacked on said second circuit board, wherein said first flexible board is electrically connected to said first extension circuit board and said second extension circuit board by bending, and wherein said second flexible board is electrically connected to said second circuit board and said second extension circuit board by bending.
- The periscopic camera module of claim 13, further comprising a spacer, wherein said spacer is stacked between said second circuit board and said second extension circuit board, wherein a height of said second extension circuit board is less than a height of said second circuit board.
- The periscopic camera module of claim 14, wherein said circuit board assembly further comprises a connector and a connection flexible board, wherein said connection flexible board electrically connects said connector to said second extension circuit board in a height direction of said second extension circuit board, and said connector is used for electrically connecting a main board of an electronic device.
- The periscopic camera module of any one of claims 1-11, further comprising an adhesive layer to bond the light redirecting assembly and the module assembly to the light quantity adjusting assembly, respectively, via the adhesive layer.
- The periscopic camera module of any one of claims 1-11, wherein said light quantity adjusting module is fastened to said light exit end of said light turning module.
- A manufacturing method of a periscopic camera module is characterized by comprising the following steps:assembling a light quantity adjusting assembly at a light outlet end of a light turning assembly, so that light rays incident from a light inlet end of the light turning assembly are firstly turned by the turning assembly and then emitted from the light outlet end, and then the light quantity passing through the light quantity adjusting assembly is changed by the adjustment of the light quantity adjusting assembly;arranging the light quantity adjusting assembly and the light turning assembly in a photosensitive path of a module assembly, wherein the light quantity adjusting assembly is positioned between the light turning assembly and the module assembly and is used for enabling the light rays passing through the light quantity adjusting assembly to be received by the module assembly for imaging; andand electrically connecting a circuit board component to the light quantity adjusting component to provide electric energy required by the work for the light quantity adjusting component.
- The method of manufacturing a periscopic camera module according to claim 18, wherein said step of electrically connecting a circuit board assembly to said light quantity adjusting assembly for providing electrical power required for the operation of said light redirecting assembly, said module assembly and said light quantity adjusting assembly comprises the steps of:electrically connecting a first circuit board to the light turning component to electrically connect the first circuit board to an anti-shake driver of the light turning component;electrically connecting a second circuit board to the module assembly to electrically connect the second circuit board to a photosensitive chip of a photosensitive assembly of the module assembly;a first extension circuit board is arranged on the module assembly and the light steering assembly in an extending mode, and the first extension circuit board is electrically connected to the first circuit board and the second circuit board respectively; andthe light quantity adjusting component is electrically connected to the first circuit board or the first extension circuit board through at least one electrical connection element.
- The method of manufacturing a periscopic camera module set forth in claim 19, wherein said step of electrically connecting a circuit board assembly to said light quantity adjusting assembly for providing said light quantity adjusting assembly with electrical power required for operation further comprises the steps of:superposing a second extension circuit board on the second circuit board, and electrically connecting the second extension circuit board to the second circuit board through a second flexible board;electrically connecting the first extension circuit board to the second extension circuit board or the second circuit board through a first flexible board; anda spacer is stacked between the second wiring board and the second extension wiring board.
- The method for manufacturing a periscopic camera module according to any one of claims 18-20, further comprising the steps of:the light quantity adjusting assembly is adhered or buckled at the light outlet end of the light steering assembly; andand correspondingly bonding the light quantity adjusting assembly to the module assembly.
- The method for manufacturing a periscopic camera module set according to claim 18, further comprising the steps of:pre-positioning the light quantity adjusting assembly and the module assembly so that center lines of the light quantity adjusting assembly and the module assembly are substantially aligned in an optical axis direction of an optical lens of the module assembly;adjusting the position of the light quantity adjusting component according to the shooting effect of shooting a target through the photosensitive component of the module component; andand debugging the light quantity adjusting component to enable the light quantity controlled by the light quantity adjusting component to meet the preset requirement.
- The method for manufacturing a periscopic camera module set according to claim 22, further comprising the steps of:pre-positioning the light redirecting assembly, the light quantity adjusting assembly, and the module assembly such that centerlines of the light redirecting assembly, the light quantity adjusting assembly, and the module assembly are substantially aligned; andand adjusting the position of the light steering component according to the shooting effect of shooting the target through the photosensitive component.
- A periscopic module of making a video recording, its characterized in that includes:a modular assembly, wherein the modular assembly comprises:the photosensitive assembly is provided with a photosensitive path; andthe lens assembly is correspondingly arranged on the photosensitive path of the photosensitive assembly;a light steering assembly, wherein the light steering assembly is correspondingly disposed in the photosensitive path of the photosensitive assembly, and the lens assembly is located between the photosensitive assembly and the light steering assembly; anda light quantity adjusting assembly, wherein the light quantity adjusting assembly is assembled at an end of the light turning assembly, and the light quantity adjusting assembly is located in the photosensitive path of the photosensitive assembly for adjusting the quantity of light received by the photosensitive assembly.
- The periscopic camera module of claim 24, wherein the light redirecting assembly includes a reflective element, a carrier, and a housing bracket having a redirecting channel, wherein the reflective element and the carrier are disposed within the redirecting channel of the housing bracket, and the reflective element is carried on the carrier to maintain the reflective element correspondingly positioned in the photosensitive path of the photosensitive assembly, and wherein the adhesive layer is disposed between the light quantity adjusting assembly and the housing bracket of the light redirecting assembly to adhere the light quantity adjusting assembly to the housing bracket of the light redirecting assembly.
- The periscopic camera module of claim 25, wherein said end of said light redirecting assembly includes an input end and an output end, wherein said redirecting channel of said housing bracket extends from said input end of said light redirecting assembly to said output end of said light redirecting assembly with said light quantity adjusting assembly being adhesively attached to said housing bracket and said light quantity adjusting assembly being located at said input end of said light redirecting assembly.
- The periscopic camera module of claim 25, wherein the end of the light redirecting assembly includes an input end and an output end, wherein the redirecting channel of the housing bracket extends from the input end of the light redirecting assembly to the output end of the light redirecting assembly with a bend, wherein the light quantity adjusting assembly is adhered to the housing bracket and the light quantity adjusting assembly is positioned between the output end of the light redirecting assembly and the module assembly.
- The periscopic camera module of claim 27 wherein said light adjustment assembly is welded to said lens assembly of said module assembly.
- The periscopic camera module of claim 27, further comprising an adhesive layer, wherein the adhesive layer is disposed between the light quantity adjusting assembly and the lens assembly of the module assembly to adhere the light quantity adjusting assembly to the module assembly through the adhesive layer.
- The periscopic camera module of claim 29, wherein the lens assembly of the module assembly comprises an optical lens, a focus actuator, and an assembly housing, wherein the optical lens is drivably assembled to the focus actuator, and the focus actuator and the photosensitive assembly are correspondingly assembled in the assembly housing, wherein the focus actuator is configured to drive the optical lens to move along the photosensitive path; wherein the light amount adjustment member is directly adhered between the assembly housings of the lens assembly by the adhesive layer, and the adhesive layer has a thickness of 0.01mm to 0.2 mm.
- A periscopic camera module according to claim 30 and wherein said adhesive layer is between 0.03mm and 0.15mm thick.
- The periscopic camera module of claim 30, wherein the adhesive layer corresponds to left and right sides and/or a bottom side of the assembly housing of the lens assembly.
- The periscopic camera module of claim 30, wherein the light adjustment assembly has a rectangular end face, and the long and short sides of the light adjustment assembly are parallel to the long and short sides of the lens assembly, respectively.
- The periscopic camera module of claim 33, wherein the ratio of the width to the length of the rectangular end surface of the light volume adjusting assembly is greater than 0.75 and less than 1.
- The periscopic camera module of claim 34, wherein the light quantity adjusting assembly comprises a pair of blades, a plurality of electric actuators and a frame, wherein the blades are partially overlapped and mounted on the frame to form a diaphragm hole with an adjustable aperture by the blades, and wherein the electric actuators are respectively disposed on left and right sides of the frame for actuating the blades to adjust the aperture size of the diaphragm hole.
- A periscopic camera module according to any one of claims 24-35 and wherein said light quantity adjusting assembly is snapably adhered to said light diverting assembly.
- A periscopic camera module according to any one of claims 24 to 36 and further comprising a circuit board assembly, wherein said circuit board assembly is electrically connected to said light quantity adjusting assembly for providing said light quantity adjusting assembly with electrical power required for operation.
- A periscopic module of making a video recording, its characterized in that includes:a modular assembly, wherein the modular assembly comprises:the photosensitive assembly is provided with a photosensitive path; andthe lens assembly is correspondingly arranged on the photosensitive path of the photosensitive assembly;a light diverting assembly, wherein the light diverting assembly is assembled to the lens assembly and corresponds to the photosensitive path of the photosensitive assembly such that the lens assembly is positioned between the photosensitive assembly and the light diverting assembly; anda light quantity adjusting assembly, wherein the light quantity adjusting assembly is assembled to the lens assembly, and the light quantity adjusting assembly is located in the photosensitive path of the photosensitive assembly and is used for adjusting the quantity of light received by the photosensitive assembly.
- The periscopic camera module of claim 38, wherein the lens assembly of the module assembly comprises an optical lens, a focus actuator and an assembly housing, wherein the optical lens is drivably assembled to the focus actuator, and the focus actuator and the photosensitive assembly are correspondingly assembled in the assembly housing, wherein the focus actuator is configured to drive the optical lens to move along the photosensitive path, and wherein the light quantity adjusting assembly is assembled to the optical lens of the lens assembly to maintain the light quantity adjusting assembly corresponding to the photosensitive path of the photosensitive assembly.
- The periscopic camera module of claim 39, wherein said optical lens comprises a first lens group and a second lens group, wherein said light quantity adjusting assembly is disposed between said first lens group and said second lens group.
- The periscopic camera module of claim 40, wherein said optical lens further comprises a lens barrel, wherein said first lens group, said light quantity adjusting assembly and said second lens group are assembled to said lens barrel in sequence, and said second lens group is located between said light quantity adjusting assembly and said photosensitive assembly.
- The periscopic camera module of claim 40, wherein said optical lens further comprises a first barrel and a second barrel, wherein said first lens group is assembled to said first barrel and said second lens group is assembled to said second barrel, wherein said light quantity adjusting assembly is mounted to said first barrel and/or said second barrel, and said second lens group is located between said light quantity adjusting assembly and said photosensitive assembly.
- The periscopic camera module of claim 39, wherein the light quantity adjustment assembly is integrally formed with the focus actuator of the lens assembly, and the optical lens is positioned between the light quantity adjustment assembly and the photosensitive assembly.
Applications Claiming Priority (5)
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CN201911278714.8A CN112995443B (en) | 2019-12-13 | 2019-12-13 | Periscopic camera module and manufacturing method thereof |
CN201911288944.2A CN112995445A (en) | 2019-12-13 | 2019-12-13 | Periscopic camera module |
CN2019112787148 | 2019-12-13 | ||
CN2019112889442 | 2019-12-13 | ||
PCT/CN2020/135809 WO2021115440A1 (en) | 2019-12-13 | 2020-12-11 | Periscope camera module, and manufacturing method for same |
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CN113747021B (en) * | 2021-09-08 | 2023-06-20 | 维沃移动通信有限公司 | Periscope type camera shooting module and electronic equipment |
CN115942073A (en) * | 2021-09-10 | 2023-04-07 | 宁波舜宇光电信息有限公司 | Camera shooting module |
CN113747024B (en) * | 2021-09-13 | 2023-05-23 | 维沃移动通信有限公司 | Camera module and electronic equipment |
CN114006999B (en) * | 2021-10-29 | 2023-10-10 | 盛泰光电科技股份有限公司 | Periscope type camera device processing method |
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