CN115047677B - Backlight module, manufacturing method and device thereof, medium, equipment and display device - Google Patents

Backlight module, manufacturing method and device thereof, medium, equipment and display device Download PDF

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Publication number
CN115047677B
CN115047677B CN202210750765.1A CN202210750765A CN115047677B CN 115047677 B CN115047677 B CN 115047677B CN 202210750765 A CN202210750765 A CN 202210750765A CN 115047677 B CN115047677 B CN 115047677B
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backlight
wavelength
mini
brightness
led chips
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CN115047677A (en
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杨凡
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133609—Direct backlight including means for improving the color mixing, e.g. white

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present disclosure relates to a method, a device, a medium, a device and a display device for manufacturing a backlight module, wherein wavelength parameters of a plurality of backlight panels on the same backlight module are respectively obtained during manufacturing the backlight module, and the backlight panels with the wavelength parameters in the same wavelength interval are allocated to the same backlight module. After the backlight lamp panels are redistributed according to different wavelength parameters, the chromaticity difference of different backlight lamp panels of the same backlight module is small, and the human eyes cannot perceive the backlight lamp panels, so that the display color difference of the display device can be considered to be eliminated.

Description

Backlight module, manufacturing method and device thereof, medium, equipment and display device
Technical Field
The disclosure relates to the technical field of display, and in particular relates to a manufacturing method, a device, a medium, equipment and a display device of a backlight module.
Background
Compared with the traditional LCD display with LED backlight, the LCD display adopting Mini-LED chip backlight technology has better performance in dynamic contrast, brightness, color gamut and visual angle, and has the advantages of light weight, high image quality, low power consumption, energy conservation and the like.
With the development of Mini-LED chip technology, the use of the LED chip in large-size display devices is gradually increasing. And large-sized display devices typically include backlight panels of multiple Mini-LED chips that are tiled together. In the use process, the difference between backlight lamp panels of the Mini-LED chips can cause color difference of display pictures.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
BRIEF SUMMARY OF THE PRESENT DISCLOSURE
The present disclosure aims to overcome the shortcomings of the prior art, and provide a method, a device, a medium, a device and a display device for manufacturing a backlight module.
According to an aspect of the present disclosure, there is provided a method for manufacturing a backlight module, the method including:
obtaining dominant wavelength values of a plurality of Mini-LED chips on a backlight lamp panel;
determining the average value of the dominant wavelength values of a plurality of Mini-LED chips, and taking the average value of the dominant wavelength values as the wavelength parameter of the backlight lamp panel;
respectively acquiring wavelength parameters of a plurality of backlight lamp panels;
the range of the wavelength parameter is divided into a plurality of wavelength intervals, and the backlight lamp panels with the wavelength parameter in the same wavelength interval are distributed to the same backlight module.
In one embodiment of the present disclosure, the method of making further comprises:
acquiring brightness values of a plurality of Mini-LED chips on a backlight lamp panel;
determining the sum of brightness values of a plurality of Mini-LED chips, and taking the sum of the brightness values as a brightness parameter of a backlight lamp panel;
respectively acquiring brightness parameters of a plurality of backlight lamp panels;
the range of the brightness parameter is divided into a plurality of brightness intervals, and the backlight lamp panels in the same brightness interval are assembled in the same backlight module.
In one embodiment of the present disclosure, obtaining dominant wavelength values for a plurality of Mini-LED chips on a backlight panel comprises:
setting a test area corresponding to each Mini-LED chip by taking the center of each Mini-LED chip as the circle center;
obtaining a dominant wavelength value in each test area;
the obtaining of the brightness values of a plurality of Mini-LED chips on the backlight plate comprises the following steps:
and acquiring the brightness value in each test area.
In one embodiment of the present disclosure, the manufacturing method further includes determining brightness uniformity of the backlight panel, including:
obtaining the maximum value and the minimum value of brightness values of a plurality of Mini-LED chips;
the ratio of the minimum value to the maximum value is determined to be greater than 80%.
The embodiment of the disclosure also provides a device for reducing the display color difference. The apparatus may include:
the first acquisition module is configured to acquire dominant wavelength values of a plurality of Mini-LED chips on the backlight lamp panel.
The determining module is configured to determine an average value of dominant wavelength values of the Mini-LED chips, and take the average value of the dominant wavelength values as a wavelength parameter of the backlight board.
The second acquisition module is configured to acquire wavelength parameters of the backlight lamp panels respectively.
The distribution module is configured to divide the range of the wavelength parameter into a plurality of wavelength intervals and distribute the backlight lamp panels with the wavelength parameter in the same wavelength interval to the same backlight module.
According to yet another aspect of the present disclosure, there is provided a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a method as described in one aspect of the present disclosure.
According to yet another aspect of the present disclosure, there is provided an electronic device comprising a processor and a memory for storing executable instructions of the processor; wherein the processor is configured to perform the method of one aspect of the present disclosure via execution of the executable instructions.
According to still another aspect of the present disclosure, there is provided a backlight module manufactured by the method according to one aspect of the present disclosure, the backlight module includes a plurality of backlight panels, and the backlight panels having wavelength parameters in the same wavelength interval are assembled in the same backlight module.
In one embodiment of the disclosure, a backlight panel includes a circuit board and a plurality of Mini-LED chips, the plurality of Mini-LED chips are distributed on one surface of the circuit board, the Mini-LED chips are adhered to the circuit board through an adhesion part, the diameter of the adhesion part is 2.82-2.84mm, and the thickness of the adhesion part is 0.75-0.77mm.
According to still another aspect of the present disclosure, there is provided a display device including the backlight module according to still another aspect of the present disclosure.
According to the manufacturing method of the backlight module, the wavelength parameters of the backlight lamp panels on the same backlight module are respectively obtained, and the backlight lamp panels with the wavelength parameters in the same wavelength interval are distributed to the same backlight module. After the backlight lamp panels are redistributed according to different wavelength parameters, the chromaticity difference of different backlight lamp panels of the same backlight module is small, and the human eyes cannot perceive the backlight lamp panels, so that the display color difference of the display device can be considered to be eliminated.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort.
Fig. 1 is a schematic diagram of an implementation environment related to a method for manufacturing a backlight module according to an embodiment of the disclosure.
Fig. 2 is a flowchart of a method for manufacturing a backlight module according to an embodiment of the disclosure.
Fig. 3 is a flowchart of a method for manufacturing a backlight module according to another embodiment of the disclosure.
Fig. 4 is a schematic structural diagram of a backlight panel according to an embodiment of the disclosure.
Fig. 5 is a schematic diagram illustrating setting positions of test points on a backlight panel according to an embodiment of the disclosure.
Fig. 6 is a block diagram of a manufacturing apparatus of a backlight module according to an embodiment of the disclosure.
Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure.
Fig. 8 is a schematic structural diagram of a backlight module according to an embodiment of the disclosure.
Fig. 9 is a schematic diagram of an optical path of a Mini-LED chip according to an embodiment of the present disclosure.
Fig. 10 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
Reference numerals illustrate:
1. back plate, 11, bottom plate, 12, side plate; 2. a frame 21, a first support 22, and a second support; 3. a backlight board 31, a circuit board 32, mini-LED chips 33 and an adhesive part; 4. the light-emitting diode display comprises a diffusion plate, a quantum dot film layer, a brightness enhancement film layer, a bottom reflection layer, a side reflection layer and a display panel, wherein the diffusion plate is arranged between the quantum dot film layer and the bottom reflection layer; 110. a backlight module; 120. optical measuring device 130, and backlight module manufacturing device.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.
Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification for convenience only, such as in terms of the orientation of the examples described in the figures. It will be appreciated that if the device of the icon is flipped upside down, the recited "up" component will become the "down" component. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.
The terms "a," "an," "the," "said" and "at least one" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and do not limit the number of their objects.
In the using process of the display device adopting the Mini-LED chip backlight, the color difference of the display picture can occur, wherein the color difference comprises brightness difference and chromaticity difference, the brightness difference can be obtained through direct test of an instrument, and the chromaticity difference sometimes occurs under the condition that the data acquired by the test instrument are all in a range, but the visual difference is obvious. For example: the chromaticity difference obtained by the test instrument is less than 0.003, but the display picture is reddish, yellowish or bluish, and further analysis cannot be performed in the whole machine state, so that the abnormal backlight lamp panel needs to be screened.
There are two common detection means, one is to visually confirm the backlight module, but false detection is likely to occur. Namely, the backlight module has chromatic aberration, the chromatic aberration of the assembled display device is within the range of visual permission, and the false detection can cause material waste and increase the cost. The other is to visually confirm the display device, and the display device needs to be disassembled again when the color difference occurs, and the replacement backlight lamp panel cannot be ensured to meet the specification, so that the efficiency is low and mass production cannot be performed.
The color difference is usually generated as follows: the current of the Mini-LED chip during screening (division) is inconsistent with the current used by the display device. When the Mini-LED chip is screened, the main wavelength, the voltage, the radiation power and other parameters of the Mini-LED chip are respectively tested under the sorting current in normal times, and the Mini-LED chip is screened according to the difference of the main wavelength, the voltage and the radiation power, wherein the wavelength determines chromaticity, and the radiation power determines brightness.
The reason for the occurrence of chromatic aberration will be specifically described below. The sorting current used by different manufacturers is different, and the sorting current of the Mini-LED chip is usually 2mA or 5mA. For example, when the sorting current of Mini-LED chips is 2mA, the dominant wavelength of the Mini-LED chips is as follows: 459-460.5nm, radiation power: 3.4-3.5mW. The actual current used by the display device is 3.75mA, and the dominant wavelength of the Mini-LED chip with the dominant wavelength of 459-460.5nm on the backlight board is changed. Therefore, the backlight panel needs to be sorted twice in a state where an actual current is used.
Based on this, the embodiment of the disclosure provides a method for manufacturing a backlight module. Fig. 1 is a schematic diagram illustrating an implementation environment related to a method for manufacturing a backlight module according to some embodiments of the disclosure. The implementation environment may include: a plurality of backlight panels 110, an optical measuring device 120 and a manufacturing device 130 of the backlight module.
The backlight module 110 is configured to provide a backlight source for the display device. The backlight module 110 generally includes a plurality of backlight panels 3, and the backlight panels 3 generally include a circuit board 31 and a plurality of Mini-LED chips 32 arranged on one surface of the circuit board in an array manner.
The optical measuring device 120 is used for measuring the brightness value and the dominant wavelength value of each Mini-LED chip 32 on the backlight board 3.
The backlight module manufacturing device 130 is configured to allocate a plurality of backlight panels to different backlight modules according to the wavelength parameter and the brightness parameter.
As shown in fig. 2, a method for manufacturing a backlight module according to an embodiment of the disclosure includes:
step 10, obtaining dominant wavelength values of a plurality of Mini-LED chips on a backlight panel;
step 20, determining an average value of dominant wavelength values of a plurality of Mini-LED chips, and taking the average value of the dominant wavelength values as a wavelength parameter of a backlight lamp panel;
step 30, respectively obtaining wavelength parameters of a plurality of backlight lamp panels;
step 40, dividing the range of the wavelength parameter into a plurality of wavelength intervals, and distributing the backlight panels with the wavelength parameter in the same wavelength interval to the same backlight module.
The respective steps in fig. 2 are specifically described below.
In step S10, dominant wavelength values of a plurality of Mini-LED chips on a backlight panel are obtained.
When the dominant wavelength value of the Mini-LED chips is obtained, the center of each Mini-LED chip can be used as the circle center, and a test area corresponding to each Mini-LED chip can be set; and acquiring a dominant wavelength value in each test area.
The Mini-LED chips are arranged on one surface of the circuit board in an array manner. The Mini-LED chip and the circuit board are generally fixed together through the bonding part, and the size of the test area is required to be smaller than that of the bonding part in general, specifically, the orthographic projection of the test area on the circuit board is located in the orthographic projection of the bonding part on the circuit board.
The bonding parts are generally in one-to-one correspondence with the Mini-LED chips, namely, different Mini-LED chips are matched with different bonding parts, any two bonding parts are independent of each other and cannot overlap with each other. It will be appreciated that any two test areas do not overlap with each other.
In step 20, an average value of dominant wavelength values of the Mini-LED chips is determined, and the average value of dominant wavelength values is used as a wavelength parameter of the backlight panel.
The dominant wavelength values of all Mini-LED chips on the same backlight board are summed, and then the sum of the dominant wavelength values is divided by the total number of the Mini-LED chips, so that an average value of the dominant wavelength values can be obtained. And taking the average value of the dominant wavelength values as the wavelength parameter of the backlight lamp panel to represent the dominant wavelength value of any Mini-LED chip on the backlight lamp panel.
In step 30, wavelength parameters of a plurality of backlight panels are obtained, respectively.
Since the wavelength parameter of the backlight panel is known as the average value of the dominant wavelength values, this step is to find the average value of the dominant wavelength values of the multiple Mini-LED chips on different backlight panels.
In step 40, the range of the wavelength parameter is divided into a plurality of wavelength intervals, and the backlight panels with the wavelength parameter in the same wavelength interval are allocated to the same backlight module.
In a batch of backlight panels, the average value of the dominant wavelength values of different backlight panels may be different, but there is usually a maximum wavelength parameter and a minimum wavelength parameter, and the span between the minimum wavelength parameter and the maximum wavelength parameter is the range where the wavelength parameter is located.
In order to eliminate the chromaticity difference, a wavelength interval may be set, the length of the wavelength interval is set to be less than or equal to a range which is not perceived by the vision, and the backlight panels with the wavelength parameters in the same wavelength interval are allocated to the same backlight module, so that the difference of the wavelength parameters of different backlight panels on the same backlight module is controlled to be within the range which is not perceived by the vision.
As shown in fig. 3, in an embodiment of the present disclosure, the manufacturing method may further include:
and 50, acquiring brightness values of a plurality of Mini-LED chips on the backlight panel.
Specifically, the dominant wavelength value in each test area can be obtained according to the test area set by each Mini-LED chip.
Step 60, determining the sum of the brightness values of the Mini-LED chips, and taking the sum of the brightness values as the brightness parameter of the backlight panel.
Step 70, obtaining brightness parameters of the backlight panels respectively.
Since the luminance parameter of a backlight panel is known as the sum of luminance values, the luminance parameter is herein calculated by summing the luminance values of a plurality of Mini-LED chips on different backlight panels.
Step 80, dividing the range of the brightness parameter into a plurality of brightness intervals, and assembling the backlight panels in the same brightness interval into the same backlight module.
The sum of the brightness values of different backlight panels in a batch of backlight panels may also be different, but there is generally a sum of the maximum brightness value and a sum of the minimum brightness value, and the span from the sum of the minimum brightness value to the sum of the maximum brightness value is the range where the sum of the brightness values is located.
In order to eliminate the brightness difference, a brightness interval can be set, the length of the brightness interval is set to be less than or equal to a range which is not perceived by vision, and the backlight panels with brightness parameters in the same brightness interval are distributed to the same backlight module, so that the difference of the brightness parameters of different backlight panels on the same backlight module is controlled in the range which is not perceived by vision.
In embodiments of the present disclosure, the manufacturing method may further include determining brightness uniformity of the backlight panel.
Determining the brightness uniformity of the backlight panel may include: obtaining the maximum value and the minimum value of brightness values of a plurality of Mini-LED chips; the ratio of the minimum value to the maximum value is determined to be greater than 80%.
The brightness values of all Mini-LED chips are larger than one by one, and the workload is not necessary. Several test points can be selected as samples from specific positions of the backlight panel, and the brightness uniformity of the backlight panel can be determined according to the test results of the samples.
The backlight module manufactured based on the manufacturing method can eliminate the chromaticity difference and the brightness difference of the display picture.
The following describes a method for manufacturing a backlight module in detail with reference to a specific embodiment.
As shown in fig. 4, it is assumed that M rows by N columns of Mini-LED chips are provided on one backlight panel, and m×n test areas are formed with the center of each Mini-LED chip as the center and the diameter of 3mm as the test area.
Measuring dominant wavelength value lambda in each test zone by optical device i Brightness value IV i By 1) averaging dominant wavelength values over multiple test regionsObtaining the sum of the luminance values in the plurality of test areas by formula 2)>
Wherein lambda is i For the dominant wavelength value in each test zone, IV i For the luminance values within each test area,is the average value of M.N dominant wavelength values,/>And M is the sum of the brightness of N Mini-LED chips.
After the MiniLED chip with the wavelength of 459-460.5nm is produced into a backlight lamp panel, the backlight lamp panel is manufactured byAs wavelength parameters of each backlight panel, 0.5nm is set as an interval, and the range of the wavelength is divided into: 459-459.5nm, 459.5-460nm and 460-460.5nm, and can locate the wavelength parameters in the backlight panel of the same wavelength intervalIs installed on the same backlight module to eliminate the color value difference of the backlight module.
The MiniLED chip with the radiation power of 3.4-3.5mW is manufactured into a backlight lamp panel byAs the brightness parameter of each backlight panel, 0.03 +.>For interval, the range 3600-3850nit where the luminance value is located is divided into: the backlight lamp panels with brightness parameters in the same brightness interval can be installed on the same backlight module to eliminate the brightness difference of the backlight module in the two brightness intervals of 3600-3708nit and 3708-3816 nit.
The backlight lamp plates with the wavelength parameters in the same wavelength interval and the brightness parameters in the same brightness interval can be installed on the same backlight module, and meanwhile, the color value difference and the brightness difference of the backlight module are eliminated, namely the color difference of the backlight module is eliminated.
As shown in fig. 5, 9 test points are set on the backlight panel. Specifically, a position of one corner of the backlight lamp panel is taken as a round point, a direction of the length of the backlight lamp panel is taken as an x coordinate axis, a direction of the width of the backlight lamp panel is taken as a y coordinate axis, 9 test points are selected, brightness values in the 9 test points are measured, and a ratio of a minimum value of the brightness values to a maximum value of the brightness values is determined to be more than 80%.
The method comprises the following steps: the length of the backlight lamp panel is L, the width is W, and the coordinate values of the 9 test points are respectively as follows: a1 (1/4L, 1/4W), A2 (1/2L, 1/4W), A3 (3/4L, 1/4W), A4 (1/4L, 1/2W), A5 (1/2L, 1/2W), A6 (3/4L, 1/2W), A7 (1/4L, 3/4W), A8 (1/2L, 3/4W) and A9 (3/4L, 3/4W).
The points at which the luminance value is maximum and the points at which the luminance value is minimum among A1 to A9 are determined, and the luminance values of examples A1 to A9 may be respectively represented by L1 to L9. Such as: the luminance value L1 at the point A1 is the smallest, the luminance value L9 at the point A9 is the largest, and if the ratio of L1 to L9 is greater than 80%, the luminance uniformity of the backlight panel is acceptable.
The disclosed embodiments also provide an apparatus 100 for reducing display color differences. As shown in fig. 6, the apparatus may include:
the first obtaining module 101, the first obtaining module 101 may be configured to obtain dominant wavelength values of a plurality of Mini-LED chips on a backlight panel.
The determining module 102, the determining module 102 may be configured to determine an average value of dominant wavelength values of the plurality of Mini-LED chips, and use the average value of dominant wavelength values as a wavelength parameter of the backlight panel.
The second obtaining module 103, the second obtaining module 103 may be configured to obtain wavelength parameters of the plurality of backlight panels, respectively.
The allocation module 104 may be configured to divide the range of the wavelength parameter into a plurality of wavelength intervals, and allocate the backlight panels with the wavelength parameter in the same wavelength interval to the same backlight module.
In one embodiment of the present disclosure,
the first obtaining module 101 may be further configured to obtain brightness values of a plurality of Mini-LED chips on the backlight panel.
The determining module may be further configured to determine a sum of luminance values of the plurality of Mini-LED chips, and use the sum of luminance values as a luminance parameter of the backlight panel;
the second obtaining module may be further configured to obtain luminance parameters of the plurality of backlight panels, respectively;
the distribution module may be further configured to divide the range of the brightness parameter into a plurality of brightness intervals, and assemble the backlight panels in the same brightness interval into the same backlight module.
In one embodiment of the present disclosure, the first acquisition module 101 may include:
the setting unit can be configured to set a test area corresponding to each Mini-LED chip by taking the center of each Mini-LED chip as a circle center;
a first acquisition unit, which may be configured to acquire a dominant wavelength value in each test area;
and a second acquisition unit configured to acquire a luminance value within each of the test areas.
In one embodiment of the present disclosure, the apparatus may further include a determination module 105, and the determination module 105 may be configured to determine whether the brightness uniformity of the backlight panel is acceptable.
Specifically, the judging module 105 may include:
the selecting unit, the determining unit can be configured to select the maximum value and the minimum value of the brightness values of the Mini-LED chips;
and the judging unit can be configured to determine that the brightness uniformity of the backlight panel is qualified when the ratio of the minimum value to the maximum value is greater than 80%.
Exemplary embodiments of the present disclosure also provide a computer readable storage medium, which may be implemented in the form of a program product comprising program code for causing an electronic device to carry out the steps according to the various exemplary embodiments of the disclosure as described in the above section of the "exemplary method" when the program product is run on the electronic device. In one embodiment, the program product may be implemented as a portable compact disc read only memory (CD-ROM) and includes program code and may be run on an electronic device, such as a personal computer. However, the program product of the present disclosure is not limited thereto, and in this document, a readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
The program product may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium can be, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples (a non-exhaustive list) of the readable storage medium would include the following: an electrical connection having one or more wires, a portable disk, a hard disk, random Access Memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
The computer readable signal medium may include a data signal propagated in baseband or as part of a carrier wave with readable program code embodied therein. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A readable signal medium may also be any readable medium that is not a readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.
Program code embodied on a readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
Program code for carrying out operations of the present disclosure may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device, partly on a remote computing device, or entirely on the remote computing device or server. In the case of remote computing devices, the remote computing device may be connected to the user computing device through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or may be connected to an external computing device (e.g., connected via the Internet using an Internet service provider).
Exemplary embodiments of the present disclosure also provide an electronic device, which may be a processor. The electronic device is described below with reference to fig. 7. It should be understood that the electronic device 600 shown in fig. 7 is merely an example and should not be construed to limit the functionality and scope of use of embodiments of the present disclosure in any way.
As shown in fig. 7, the electronic device 600 is in the form of a general purpose computing device. Components of electronic device 600 may include, but are not limited to: at least one processing unit 610, at least one memory unit 620, a bus 630 that connects the different system components, including the memory unit 620 and the processing unit 610.
Wherein the storage unit stores program code that is executable by the processing unit 610 such that the processing unit 610 performs steps according to various exemplary embodiments of the present application described in the above-described "exemplary methods" section of the present specification. For example, the processing unit 610 may perform the method steps as shown in fig. 2 and 3, etc.
The storage unit 620 may include volatile storage units such as a Random Access Memory (RAM) 621 and/or a cache memory 622, and may further include a Read Only Memory (ROM) 623.
The storage unit 620 may also include a program/utility 624 having a set (at least one) of program modules 625, such program modules 625 including, but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of which may include an implementation of a network environment.
Bus 630 may include a data bus, an address bus, and a control bus.
The electronic device 600 may also communicate with one or more external devices 700 (e.g., keyboard, pointing device, bluetooth device, etc.) via an input/output (I/O) interface 640. The electronic device 600 may also communicate with one or more networks such as a Local Area Network (LAN), a Wide Area Network (WAN), and/or a public network such as the internet through a network adapter 650. As shown in fig. 7, the network adapter 650 communicates with other modules of the electronic device 600 over the bus 630. It should be appreciated that although not shown, other hardware and/or software modules may be used in connection with electronic device 600, including, but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, data backup storage systems, and the like.
It should be noted that although in the above detailed description several modules or units of a device for action execution are mentioned, such a division is not mandatory. Indeed, the features and functionality of two or more modules or units described above may be embodied in one module or unit in accordance with exemplary embodiments of the present disclosure. Conversely, the features and functions of one module or unit described above may be further divided into a plurality of modules or units to be embodied.
Those skilled in the art will appreciate that the various aspects of the present disclosure may be implemented as a system, method, or program product. Accordingly, various aspects of the disclosure may be embodied in the following forms, namely: an entirely hardware embodiment, an entirely software embodiment (including firmware, micro-code, etc.) or an embodiment combining hardware and software aspects may be referred to herein as a "circuit," module "or" system. Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein.
As shown in fig. 8, the embodiment of the present disclosure further provides a backlight module, which is manufactured by the method according to any one of the embodiments of the present disclosure, and the backlight module may include a plurality of backlight panels, where the backlight panels with wavelength parameters in the same wavelength interval are assembled in the same backlight module.
It can be understood that the light source manufactured by the method is a backlight module, the light source comprises a plurality of backlight lamp panels 3, the backlight lamp panels 3 comprise a circuit board 31 and a plurality of Mini-LED chips 32, and the Mini-LED chips 32 are distributed on one surface of the circuit board in an array manner.
The specific structure of the backlight module is described below. Comprises a back plate 1 and a frame 2, wherein the frame 2 is arranged in the back plate 1. The back plate 1 comprises a bottom plate 11 and a plurality of bottom plates 12 fixedly connected with the bottom plate 11, the frame 2 comprises a first supporting part 21 and a plurality of second supporting parts 22 connected with the first supporting part 21, the first supporting part 21 is parallel to the bottom plate 11, the second supporting part 22 is parallel to the bottom plate 12, and the orthographic projection of the first supporting part 21 on the bottom plate 11 is positioned at the edge of the bottom plate 11.
A backlight panel 3, a diffusion plate 4, a quantum dot film layer 5 and a brightness enhancement film layer 6 are arranged between the bottom plate 11 and the first supporting part 21. The backlight panel 3 is arranged on one side of the bottom plate 11, a diffusion plate 4 is arranged on one side of the backlight panel 3 far away from the bottom plate 11, and light rays emitted from the backlight panel 3 are diffused through the diffusion plate 4. The diffusion plate 4 is provided with a quantum dot film 5 on one side far away from the bottom plate 11, light emitted by the backlight plate 3 is blue light, after the blue light emitted by the backlight module reaches the quantum dot film 5, the blue light can excite red quantum dots in the quantum dot film 5 to emit red light in multiple directions (including directions of the quantum dot film 5 far away from and near the backlight module), and green quantum dots in the quantum dot film 5 are excited to emit green light in the multiple directions, so that the blue light can be converted into white light after passing through the quantum dot film 5. The side of the quantum dot film layer 5 far away from the bottom plate 11 is provided with a brightness enhancement film layer 6, and the side of the brightness enhancement film layer 6 far away from the bottom plate 11 is close to the first supporting part 21.
In order to enhance the brightness of the backlight module, light diffuse reflection is prevented when the backlight module is incident to the surface of the circuit board 31, so that light loss is large, and a bottom reflection layer 7 is arranged on one side of the backlight panel 3 far away from the bottom plate 11 to improve the reflection effect. The bottom reflecting layer 7 is provided with openings exposing the Mini-LED chips 32. In order to prevent blue light from being emitted from the side surface of the back plate 1, a side reflection layer 8 is provided inside the back plate 12, and blue light incident on the side reflection layer 8 is reflected as white light.
As shown in fig. 9, the Mini-LED chip 32 is adhered to the circuit board 31 by the adhesive portion 33, the adhesive portion is disposed on the side of the Mini-LED chip 32 and the circuit board 31 away from the base plate 11, the diameter D of the adhesive portion 33 is typically 2.82-2.84mm, the thickness h of the adhesive portion 33 is typically 0.75-0.77mm, the adhesive portion is a protective adhesive, and when the thickness of the adhesive portion exceeds the tolerance, the light emitting angle of the Mini-LED chip changes, the brightness increases or decreases, and the brightness is uneven.
When the thickness of the adhesive portion 33 is h, the light is emitted in the OA direction, refracted by the adhesive portion 33, and then emitted along the normal L2 of the adhesive portion toward the AB of the circuit board 31. When the thickness of the bonding portion 33 increases to H, the light is emitted from the OC in the same direction as the OA direction, refracted by the thickened bonding portion 33, and emitted between the normal L2 of the thickened bonding portion 33 and the normal L1 of the non-thickened bonding portion, and the refracted light is emitted specifically in the CE direction. It can be understood that when the thickness of the bonding portion 33 is changed from H to H, the light emitting direction of the Mini-LED chip is changed from AB to CE.
According to still another aspect of the present disclosure, there is provided a display device including the backlight module according to still another aspect of the present disclosure. The display device can refer to the specific structure and beneficial effects of the backlight module as well, and detailed description is omitted here.
As shown in fig. 10, the display device further includes a display panel 9, the display panel 9 includes a driving circuit layer and a pixel layer, the driving circuit layer is disposed on a side of the first supporting portion 21 away from the bottom plate 11, and the pixel layer is disposed on a side of the driving circuit layer away from the bottom plate 11. The pixel layer is usually a liquid crystal layer, and the driving circuit layer is provided with a driving circuit; the rotation direction of the liquid crystal molecules is controlled by changing the signals and the voltage of the driving circuit, so that whether polarized light of each pixel point is emergent or not is controlled, the display purpose is achieved, and the corresponding image is displayed.
It should be noted that, the display device may include other necessary components and components besides the backlight module, the driving circuit layer and the pixel layer, and the mobile phone is taken as an example, specifically, a housing, a driving circuit board, etc., which can be correspondingly supplemented by a person skilled in the art according to specific use requirements of the display device, and will not be described herein.
The display device may be a conventional electronic device, for example: cell phones, computers, televisions, and camcorders, but also emerging wearable devices, such as: virtual reality devices and augmented reality devices are not listed here.
This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. The manufacturing method of the backlight module is characterized by comprising the following steps:
obtaining dominant wavelength values of a plurality of Mini-LED chips on a backlight lamp panel;
determining the average value of the dominant wavelength values of a plurality of Mini-LED chips, and taking the average value of the dominant wavelength values as the wavelength parameter of the backlight lamp panel;
respectively acquiring wavelength parameters of a plurality of backlight lamp panels;
dividing the range of the wavelength parameter into a plurality of wavelength intervals, and distributing the backlight lamp panels with the wavelength parameter in the same wavelength interval to the same backlight module.
2. The method for manufacturing a backlight module according to claim 1, further comprising:
acquiring brightness values of a plurality of Mini-LED chips on a backlight lamp panel;
determining the sum of brightness values of a plurality of Mini-LED chips, and taking the sum of the brightness values as a brightness parameter of the backlight panel;
respectively obtaining brightness parameters of a plurality of backlight lamp panels;
the range of the brightness parameter is divided into a plurality of brightness intervals, and the backlight lamp panels in the same brightness interval are assembled in the same backlight module.
3. The method of claim 2, wherein obtaining dominant wavelength values of a plurality of Mini-LED chips on a backlight panel comprises:
setting a test area corresponding to each Mini-LED chip by taking the center of each Mini-LED chip as the circle center;
obtaining a dominant wavelength value in each test area;
the obtaining of the brightness values of a plurality of Mini-LED chips on the backlight plate comprises the following steps:
and acquiring the brightness value in each test area.
4. The method of claim 2, further comprising determining brightness uniformity of the backlight panel, comprising:
obtaining the maximum value and the minimum value of brightness values of a plurality of Mini-LED chips;
the ratio of the minimum value to the maximum value is determined to be greater than 80%.
5. The device for manufacturing the backlight module is characterized by comprising the following components:
the first acquisition module is configured to acquire dominant wavelength values of a plurality of Mini-LED chips on the backlight lamp panel;
the determining module is configured to determine an average value of dominant wavelength values of a plurality of Mini-LED chips, and take the average value of the dominant wavelength values as a wavelength parameter of the backlight lamp panel;
the second acquisition module is configured to acquire wavelength parameters of the backlight lamp panels respectively;
the distribution module is configured to divide the range of the wavelength parameter into a plurality of wavelength intervals and distribute the backlight lamp panels with the wavelength parameter in the same wavelength interval to the same backlight module.
6. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the method of any of claims 1 to 4.
7. An electronic device, comprising:
a processor; and
a memory for storing executable instructions of the processor;
wherein the processor is configured to perform the method of any one of claims 1 to 4 via execution of the executable instructions.
8. A backlight module manufactured by the method of any one of claims 1 to 4, the backlight module comprising:
the backlight lamp panels with the wavelength parameters in the same wavelength interval are assembled in the same backlight module.
9. The backlight module according to claim 8, wherein the backlight panel comprises:
a circuit board;
the LED chip array comprises a circuit board, a plurality of Mini-LED chips, a bonding part and a bonding part, wherein the Mini-LED chips are distributed on one surface of the circuit board, the Mini-LED chips are bonded on the circuit board through the bonding part, the diameter of the bonding part is 2.82-2.84mm, and the thickness of the bonding part is 0.75-0.77mm.
10. A display device comprising the backlight module of claim 8 or 9.
CN202210750765.1A 2022-06-28 2022-06-28 Backlight module, manufacturing method and device thereof, medium, equipment and display device Active CN115047677B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208636454U (en) * 2018-05-09 2019-03-22 四川长虹电器股份有限公司 Light guide plate, backlight module and display device
CN113791507A (en) * 2021-09-23 2021-12-14 京东方科技集团股份有限公司 Backlight module and display device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0822306A2 (en) * 2008-02-14 2015-06-16 Sharp Kk Display device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208636454U (en) * 2018-05-09 2019-03-22 四川长虹电器股份有限公司 Light guide plate, backlight module and display device
CN113791507A (en) * 2021-09-23 2021-12-14 京东方科技集团股份有限公司 Backlight module and display device

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