CN115044344A - UV hydrolysis adhesive for temporary fixing of microelectronic device and preparation method thereof - Google Patents
UV hydrolysis adhesive for temporary fixing of microelectronic device and preparation method thereof Download PDFInfo
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- CN115044344A CN115044344A CN202210906698.8A CN202210906698A CN115044344A CN 115044344 A CN115044344 A CN 115044344A CN 202210906698 A CN202210906698 A CN 202210906698A CN 115044344 A CN115044344 A CN 115044344A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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Abstract
The invention discloses a UV hydrolytic adhesive for temporarily fixing a microelectronic device and a preparation method thereof, the UV hydrolytic adhesive gives good adhesive force to the adhesive by using difunctional aggregated urethane acrylate resin and hydroxyethyl methacrylate (HEMA) as base material resin, and the flexibility of the adhesive is improved by using polyethylene glycol (600) diacrylate (PEG (600) DA); the reasonable matching of the photoinitiator improves the defect that the ultraviolet intensity is insufficient and the curing is difficult, and improves the crosslinking efficiency of the UV hydrolysis adhesive; the UV hydrolysis adhesive has the characteristics of short curing time, good flexibility, quick film forming, strong adhesive force and excellent scratch resistance and wear resistance.
Description
Technical Field
The invention belongs to the technical field of UV hydrolyzed adhesives, and particularly relates to a UV hydrolyzed adhesive for temporarily fixing a microelectronic device and a preparation method thereof.
Background
With the rapid development of industrial technologies, microelectronic devices have become an indispensable part of various electronic products, however, the conventional fixing method often uses a direct soldering method, which can control the fixing degree of the microelectronic devices, but cannot accurately control the accuracy of soldering positions to a great extent, and once soldering starts, the positions are difficult to adjust.
Therefore, the development of the adhesive which has high bonding speed and high bonding force and can simply fall off is very important for fixing the microelectronic device, so that the invention creates the adhesive which can be applied to temporary fixing of the microelectronic device, but can simply remove the adhesive state, improves the fault tolerance of the production process, improves the production efficiency and reduces the material waste; has great significance for social business and ecological environment.
Disclosure of Invention
In order to overcome the disadvantages and shortcomings of the prior art, the primary object of the present invention is to provide a UV hydrolyzed adhesive for temporary fixing of microelectronic devices, which has a fast bonding speed and a high adhesive force and can be applied to temporary fixing of microelectronic devices while being easily peeled off.
The second purpose of the invention is to provide a preparation method of the UV hydrolysis adhesive for temporary fixing of the microelectronic device, which has simple process conditions and is suitable for large-scale production.
The primary purpose of the invention is realized by the following technical scheme:
the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 60-70 parts of light-cured resin, 20-40 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 1-5 parts of photoinitiator and 1-4 parts of hydroxyethyl methacrylate (HEMA).
Preferably, the UV hydrolysis adhesive for temporary fixing of the microelectronic device comprises the following components in parts by weight: 65 parts of light-cured resin, 33 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 4 parts of photoinitiator and 3 parts of hydroxyethyl methacrylate (HEMA).
Preferably, the photocurable resin is a difunctional block urethane acrylate resin.
Preferably, the photoinitiator is a 1173 photoinitiator. The adhesive prepared above should be preserved in a cool and dry place.
The second purpose of the invention is realized by the following technical scheme:
a method for preparing a UV hydrolytic adhesive for temporarily fixing a microelectronic device comprises the following steps:
(1) stirring and dispersing the light-cured resin, polyethylene glycol (600) diacrylate (PEG (600) DA) and hydroxyethyl methacrylate (HEMA);
(2) and (2) continuously adding the photoinitiator into the raw materials stirred and dispersed in the step (1), stirring and dispersing to ensure that all components are completely uniform, and preparing the UV hydrolysis adhesive for temporary fixing of the microelectronic device.
Preferably, the dispersion rotation speed in the step (1) and the step (2) is 5-600 r/min, and the dispersion time is 10-30 min.
The adhesive prepared by the invention should be preserved in a cool and dry place.
Compared with the prior art, the invention has the following technical effects:
according to the UV hydrolysis adhesive, difunctional group urethane acrylate resin and hydroxyethyl methacrylate (HEMA) are used as base material resins, so that the adhesive is endowed with good adhesive force, and the flexibility of the adhesive is improved by using polyethylene glycol (600) diacrylate (PEG (600) DA); the reasonable matching of the photoinitiator improves the defect that the ultraviolet intensity is insufficient and the curing is difficult, and improves the crosslinking efficiency of the UV hydrolysis adhesive; the UV hydrolysis adhesive has the characteristics of short curing time, good flexibility, quick film forming, strong adhesive force and excellent scratch resistance and wear resistance. The UV hydrolyzed adhesive prepared by the invention has high bonding speed and high bonding force, and can be used for temporarily fixing microelectronic devices.
Detailed Description
The embodiments of the present invention are described in further detail to make the technical solutions of the present invention easier to understand and master.
Example 1
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 65 parts of difunctional aggregated urethane acrylate resin, 33 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 4 parts of 1173 photoinitiator and 3 parts of HEMA.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional block urethane acrylate resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and HEMA into a mixing barrel, adjusting the rotating speed of a dispersing machine to 5-600 revolutions per minute, and stirring and dispersing for 20-30 minutes;
(2) adding 1173 photoinitiator, and continuously stirring and dispersing for 10-20 minutes at 5-600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in dry place.
Example 2
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 60 parts of difunctional block urethane acrylate resin, 40 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 1 part of 1173 photoinitiator and 4 parts of HEMA.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional block urethane acrylate resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and the HEMA into a mixing barrel, adjusting the rotating speed of a dispersing machine to 5-600 revolutions per minute, and stirring and dispersing for 20-30 minutes;
(2) adding 1173 photoinitiator, and continuously stirring and dispersing for 10-20 minutes at 5-600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in dry place.
Example 3
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 62 parts of difunctional polyurethane acrylate resin, 38 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 1 part of 1173 photoinitiator and 4 parts of HEMA.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional block urethane acrylate resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and HEMA into a mixing barrel dispersing machine, adjusting the rotating speed to 5-600 revolutions per minute, and stirring and dispersing for 20-30 minutes;
(2) adding 1173 photoinitiator, and continuously stirring and dispersing for 10-20 minutes at 5-600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in dry place.
Example 4
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 63 parts of difunctional block urethane acrylate resin, 35 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 2 parts of 1173 photoinitiator and 3 parts of HEMA.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional block urethane acrylate resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and the HEMA into a mixing barrel, adjusting the rotating speed of a dispersing machine to 5-600 revolutions per minute, and stirring and dispersing for 20-30 minutes;
(2) adding 1173 photoinitiator, and continuously stirring and dispersing for 10-20 minutes at 5-600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in dry place.
Example 5
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 64 parts of difunctional block urethane acrylate resin, 30 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 2 parts of 1173 photoinitiator and 2 parts of HEMA.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional block urethane acrylate resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and the HEMA into a mixing barrel, adjusting the rotating speed of a dispersing machine to 5-600 revolutions per minute, and stirring and dispersing for 20-30 minutes;
(2) adding 1173 photoinitiator, and continuously stirring and dispersing for 10-20 minutes at 5-600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in dry place.
Example 6
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 66 parts of difunctional polyurethane acrylate resin, 600 parts of polyethylene glycol diacrylate PEG600DA28 parts, 1173 parts of photoinitiator and 2 parts of HEMA.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional block urethane acrylate resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and the HEMA into a mixing barrel, adjusting the rotating speed of a dispersing machine to 5-600 revolutions per minute, and stirring and dispersing for 20-30 minutes;
(2) 1173 photoinitiator is added, and the mixture is stirred and dispersed for 10 to 20 minutes at 5 to 600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in dry place.
Example 7
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 67 parts of difunctional block urethane acrylate resin, 25 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 4 parts of 1173 photoinitiator and 2 parts of HEM.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional block urethane acrylate resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and the HEMA into a mixing barrel, adjusting the rotating speed of a dispersing machine to 5-600 revolutions per minute, and stirring and dispersing for 20-30 minutes;
(2) adding 1173 photoinitiator, and continuously stirring and dispersing for 10-20 minutes at 5-600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in dry place.
Example 8
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 68 parts of difunctional block urethane acrylate resin, 23 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 4 parts of 1173 photoinitiator and 1 part of HEMA.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional polyurethane acrylate resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and the HEMA into a mixing barrel, adjusting the rotating speed of a dispersing machine to 5-600 r/min, and stirring and dispersing for 20-30 min;
(2) adding 1173 photoinitiator, and continuously stirring and dispersing for 10-20 minutes at 5-600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in a cool and dry place.
Example 9
The UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following components in parts by weight: 70 parts of difunctional polyurethane acrylate resin, 20 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 5 parts of 1173 photoinitiator and 1 part of HEMA.
The preparation method of the UV hydrolysis adhesive for temporarily fixing the microelectronic device comprises the following steps:
(1) adding the difunctional light-cured B-701 resin, the polyethylene glycol (600) diacrylate (PEG (600) DA) and HEMA into a mixing barrel, adjusting the rotation speed of a dispersing machine to 5-600 revolutions per minute, and stirring and dispersing for 20-30 minutes;
(2) adding 1173 photoinitiator, and continuously stirring and dispersing for 10-20 minutes at 5-600 revolutions per minute to ensure that all components are completely uniform;
(3) packaging as required, and storing in dry place.
Performance test experiment
In order to examine the performance of the UV hydrolysis adhesive for temporary fixing of microelectronic devices according to the present invention, the UV hydrolysis adhesive for temporary fixing of microelectronic devices prepared in examples 1 to 9 was applied to temporary fixing of microelectronic devices. The prepared samples were compared with those conventionally applied to adhesives (common adhesives) for comparison. The results were as follows:
table 1 shows the performance test data of examples 1 to 9 and the common adhesives thereof
Table 2 shows the data of the performance tests of examples 1 to 9 and the common adhesives thereof
Table 3 shows the performance test data of examples 1 to 9 and the common adhesives thereof
The technical effects of the invention are mainly reflected in the following aspects as can be seen from the data: various performance indexes of the prepared UV hydrolyzed adhesive for temporary fixation of the microelectronic device meet the technical index requirements of the UV hydrolyzed adhesive for temporary fixation of the microelectronic device; the material takes difunctional light-cured B-701 resin and HEMA as base material resin, so that the adhesive is endowed with good adhesive force, and the flexibility of the adhesive is improved by using polyethylene glycol (600) diacrylate (PEG (600) DA); the reasonable matching of the photoinitiator improves the defect that the curing is difficult due to insufficient ultraviolet intensity and improves the crosslinking efficiency of the UV hydrolysis adhesive; the UV hydrolysis adhesive prepared by the invention has the characteristics of short curing time, good flexibility, quick film forming, strong adhesive force and excellent scratch resistance and wear resistance.
The UV hydrolysis adhesive for temporarily fixing the microelectronic device is prepared by taking difunctional aggregated urethane acrylate resin and HEMA as base material resin, endows the adhesive with good adhesive force, and improves the flexibility of the adhesive by using polyethylene glycol (600) diacrylate (PEG (600) DA); the reasonable matching of the photoinitiator improves the defect that the ultraviolet intensity is insufficient and the curing is difficult, and improves the crosslinking efficiency of the UV hydrolysis adhesive; the UV hydrolysis adhesive prepared by the invention has the characteristics of short curing time, good flexibility, quick film forming, strong adhesive force and excellent scratch resistance and wear resistance. The UV hydrolysis adhesive prepared by the invention can simply remove the adhesive state, improves the fault tolerance of the production process, improves the production efficiency, reduces the material waste, and has great significance for social commerce and ecological environment. When the proportion is 65 parts of functionality light-cured B-701 resin, 33 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 4 parts of 1173 photoinitiator and 3 parts of HEMA, the developed UV hydrolysis adhesive for temporary fixing of the microelectronic device achieves the best bonding performance.
The above are only typical examples of the present invention, and besides, the present invention may have other embodiments, and all the technical solutions formed by equivalent substitutions or equivalent changes are within the scope of the present invention as claimed.
Claims (6)
1. The UV hydrolysis adhesive for temporarily fixing the microelectronic device is characterized by comprising the following components in parts by weight: 60-70 parts of light-cured resin, 20-40 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 1-5 parts of photoinitiator and 1-4 parts of hydroxyethyl methacrylate.
2. The microelectronic device temporary fixing UV hydrolysis adhesive according to claim 1, comprising the following components in parts by weight: 65 parts of light-cured resin, 33 parts of polyethylene glycol (600) diacrylate (PEG (600) DA), 4 parts of photoinitiator and 3 parts of hydroxyethyl methacrylate.
3. The microelectronic device temporary fixing UV hydrolysis adhesive according to claim 1, wherein said photocurable resin is a difunctional urethane acrylate resin.
4. The microelectronic device temporary holding UV hydrolyzed adhesive of claim 1, wherein said photoinitiator is 1173 photoinitiator.
5. A method of preparing a UV hydrolysis adhesive for temporary attachment of microelectronic devices according to any of claims 1 to 4, comprising the steps of:
(1) stirring and dispersing the light-cured resin, polyethylene glycol (600) diacrylate (PEG (600) DA) and hydroxyethyl methacrylate;
(2) and (2) continuously adding the photoinitiator into the raw materials stirred and dispersed in the step (1), stirring and dispersing to ensure that all components are completely uniform, and preparing the UV hydrolysis adhesive for temporary fixing of the microelectronic device.
6. The method for preparing a UV hydrolysis adhesive for temporary fixation of microelectronic device according to claim 5, wherein the dispersion rotation speed in step (1) and in step (2) is 5-600 rpm, and the dispersion time is 10-30 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210906698.8A CN115044344A (en) | 2022-07-29 | 2022-07-29 | UV hydrolysis adhesive for temporary fixing of microelectronic device and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210906698.8A CN115044344A (en) | 2022-07-29 | 2022-07-29 | UV hydrolysis adhesive for temporary fixing of microelectronic device and preparation method thereof |
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| CN115044344A true CN115044344A (en) | 2022-09-13 |
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| CN202210906698.8A Pending CN115044344A (en) | 2022-07-29 | 2022-07-29 | UV hydrolysis adhesive for temporary fixing of microelectronic device and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116376482A (en) * | 2023-04-25 | 2023-07-04 | 合肥微晶材料科技有限公司 | Hydrolysis UV adhesive for ultrathin glass lamination processing and application method thereof |
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| CN111320962A (en) * | 2020-03-25 | 2020-06-23 | 詹志豪 | Fast-curing UV adhesive and preparation method thereof |
| CN111560233A (en) * | 2020-05-18 | 2020-08-21 | 杭州华圩新材料科技有限公司 | High-performance low-toxicity medical UV adhesive and preparation method thereof |
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2022
- 2022-07-29 CN CN202210906698.8A patent/CN115044344A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102807835A (en) * | 2012-05-23 | 2012-12-05 | 烟台信友电子有限公司 | Hydrolysable ultraviolet curing adhesive and method for preparing same |
| CN103865470A (en) * | 2014-02-12 | 2014-06-18 | 惠晶显示科技（苏州）有限公司 | Light-curing edge sealing adhesive |
| CN104910853A (en) * | 2015-05-25 | 2015-09-16 | 广州市尤特新材料有限公司 | UV rapidly curable warm water fast hydrolyzed glue and preparation method thereof |
| CN105820794A (en) * | 2016-05-30 | 2016-08-03 | 三友（天津）高分子技术有限公司 | Inorganic filler modified ultraviolet curing adhesive |
| CN111320962A (en) * | 2020-03-25 | 2020-06-23 | 詹志豪 | Fast-curing UV adhesive and preparation method thereof |
| CN111560233A (en) * | 2020-05-18 | 2020-08-21 | 杭州华圩新材料科技有限公司 | High-performance low-toxicity medical UV adhesive and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116376482A (en) * | 2023-04-25 | 2023-07-04 | 合肥微晶材料科技有限公司 | Hydrolysis UV adhesive for ultrathin glass lamination processing and application method thereof |
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