CN115044090B - Method for machining surface of workpiece, shell and electronic equipment - Google Patents

Abstract

The application discloses a method for processing the surface of a workpiece, a shell and electronic equipment, and relates to the technical field of material processing and forming. The method comprises the steps of treating the surface of a high-molecular polymer workpiece by using an organic solvent mixed solution to open molecular chains on the surface layer of the high-molecular polymer workpiece, wherein the organic solvent mixed solution comprises a plurality of organic solvents with different volatility and swelling the high-molecular polymer workpiece to different degrees; and (3) spraying a hardening liquid on the treated surface, and curing the hardening liquid to form a hardening layer. According to the application, the organic solvent mixed solution is utilized to open the molecular chains of the high polymer on the surface layer of the high polymer workpiece, release the internal stress, and reduce the probability of adverse phenomena such as shower coating process and later cracking; in addition, the composition of the organic solvent mixed solution, the volatility and the swelling capacity of each organic solvent are controlled, so that the process of controlling the release of internal stress is realized, and the quality of the high polymer workpiece and the adhesive force of the high polymer workpiece to a hardening layer are improved.

Description

Method for machining surface of workpiece, shell and electronic equipment

Technical Field

The application relates to the technical field of material processing and forming, in particular to a method for processing the surface of a workpiece, a shell and electronic equipment.

Background

The local position of the battery cover is provided with a convex structure similar to a crater shape. The integral battery cover with the crater-shaped structure is formed by compression injection molding or direct injection molding of a high polymer, and the battery cover is coated and hardened on a compact surface to form a hardened layer, so that the hardened layer is easy to fall off due to poor adhesive force, and the internal stress is released due to surface swelling in the coating hardening process, so that adverse phenomena such as cracking and the like occur.

Disclosure of Invention

The application aims to provide a method for processing the surface of a workpiece, which comprises the following steps:

the method comprises the steps of processing the surface of a high-molecular polymer workpiece by utilizing an organic solvent mixed solution so as to open molecular chains on the surface layer of the high-molecular polymer workpiece, wherein the organic solvent mixed solution comprises a plurality of organic solvents with different volatility and swelling the high-molecular polymer workpiece to different degrees;

and spraying a hardening liquid on the treated surface, wherein the hardening liquid is solidified to form a hardening layer.

The application aims to provide a shell, which comprises:

the surface of the protruding part or the surface of the joint of the protruding part and the main body part is configured to be treated by an organic solvent mixed solution, and a high polymer molecular chain on the surface layer is opened, wherein the organic solvent mixed solution comprises a plurality of organic solvents with different volatility and swelling the high polymer workpiece to different degrees; and

and a hardening layer disposed at least on the surface treated with the organic solvent mixture.

The technical problem to be solved by the application is to provide an electronic device, comprising:

as described above, the convex portion is provided with a camera hole; and

the middle frame is connected with the shell to form an installation space communicated with the camera hole;

the display screen is arranged on one side of the middle frame far away from the shell; and

the camera is installed in the installation space and is arranged opposite to the camera shooting hole.

By adopting the technical scheme of the application, the application has the following beneficial effects: according to the application, the surface of the high polymer workpiece is treated by using the organic solvent mixed solution, and the high polymer molecular chain on the surface layer of the high polymer workpiece is opened, so that the internal stress is released, and the probability of adverse phenomena such as spray coating process and later cracking is reduced. The process of controlling the release of internal stress is achieved by controlling the composition of the organic solvent mixed solution, the volatility and the swelling capacity of each organic solvent. For example, in a specific control process, the composition of the mixed solution of the organic solvents, the volatility and the swelling capacity of each organic solvent can be controlled so as to enable the internal stress to be released slowly (the internal stress is not released too fast so that the high polymer workpiece is cracked poorly, and the improvement effect cannot be achieved by cracking). Furthermore, the internal stress is slowly released and the surface layer high molecular chains are opened, so that gaps among the molecular chains are increased, the hardening liquid for subsequent curtain coating can easily enter the surface of the high molecular polymer workpiece, the adhesion force of the high molecular polymer workpiece to the hardening layer is effectively improved, and the quality of the high molecular polymer workpiece is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic flow chart of a process for processing a surface of a workpiece according to an embodiment of the application;

FIG. 2 is a schematic view of the structure of a workpiece during injection molding or compression injection molding;

FIG. 3 is a schematic diagram of step S101 of the present application;

FIG. 4 is a schematic flow chart of processing a surface of a workpiece according to another embodiment of the application;

FIG. 5 is a schematic view of a housing according to an embodiment of the application;

FIG. 6 is a schematic view of the housing of the embodiment of FIG. 5 in another embodiment;

FIG. 7 is a schematic flow chart of processing a surface of a workpiece according to another embodiment of the application;

FIG. 8 is a schematic view of a housing according to an embodiment of the application;

FIG. 9 is a schematic view of the housing of the embodiment of FIG. 8 in another embodiment;

FIG. 10 is a schematic view of a housing according to an embodiment of the application;

FIG. 11 is a schematic view of the housing of the embodiment of FIG. 10 in another embodiment;

FIG. 12 is a schematic flow chart of processing a surface of a shell according to an embodiment of the application;

FIG. 13 is a schematic flow chart of processing a surface of a workpiece according to another embodiment of the application;

FIG. 14 is a schematic view of a surface of a workpiece according to an embodiment of the application;

FIG. 15 is a schematic view of a surface of a workpiece after processing in accordance with an embodiment of the present application;

FIG. 16 is a schematic surface view of a workpiece coated with a hardening liquid to form a hardened layer according to an embodiment of the present application;

fig. 17 is a schematic structural diagram of an electronic device according to an embodiment of the application.

Detailed Description

The present application will be described in further detail with reference to the drawings and embodiments. It is to be noted that the following embodiments are only for illustrating the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some, but not all, of the embodiments of the present application, and all other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

The application discloses a method for processing the surface of a workpiece, which can be used for facilitating the hardening treatment of the surface of the workpiece and also can be used for facilitating the manufacture of an appearance membrane on the surface of the workpiece. The workpiece may be a plate or a shell, but may be of other types of structures. In some embodiments, the workpiece such as a plate and a shell can be used for the electronic device to serve as a shell and a battery cover of the electronic device, so that the appearance expressive force of the electronic device is improved. In some embodiments, the housing may be a portion of the casing, or the entire casing.

As used herein, "electronic equipment" (which may also be referred to as a "terminal" or "mobile terminal" or "electronic device") includes, but is not limited to, devices configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface, such as for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal. A communication terminal configured to communicate through a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellites or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; a PDA that can include a radiotelephone, pager, internet/intranet access, web browser, organizer, calendar, and/or a Global Positioning System (GPS) receiver; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. The mobile phone is the electronic equipment provided with the cellular communication module.

Referring to fig. 1, fig. 1 is a schematic flow chart of processing a surface of a workpiece according to an embodiment of the application. The method can comprise the following steps:

step S101: and (3) treating the surface of the high-molecular polymer workpiece by using the organic solvent mixed solution.

For workpieces, in particular injection-molded or compression-injection-molded workpieces, the curing takes place from injection-molded raw materials. In one embodiment, the injection molding material is a polymer, and thus a polymer work piece can be formed.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a workpiece during injection molding or compression injection molding. In the injection molding or compression injection molding process of the workpiece 100, the applicant finds the following phenomena and corresponding problems:

the surface and the surface layer 102 are cooled quickly, and then the polymer chains in the surface layer 102 are firstly cooled when not reaching a natural stretching state, and chain segments are frozen to form a condensation layer, so that the temperature of the interior 101 is higher than that of the surface layer 102; then, when the inside 101 is cooled, the surface layer 102 of the workpiece 100 is pulled by the internal stress generated by the cooling of the inside 101, and the molecular chains in the surface layer 102 are oriented in a stretched state and cannot be naturally curled.

The unstable stretching condensation state of the polymer chains in the surface layer 102 makes the surface and the surface layer 102 compact, so that the solvent is difficult to erode and the adhesive force is poor; in the case of curtain coating hardening, the work 100 is swelled by the hardening liquid to release internal stress by cracking of the work 100, and the adhesion to the hardened layer is poor, resulting in poor appearance.

That is, the applicant has found that the problems of internal stress release and poor adhesion to the surface during the shower hardening due to the asynchronous cooling of the inner part 101 and the surface layer 102 during the cooling process are the primary problems to be solved by the applicant.

The applicant processes the surface of the high polymer workpiece through the organic solvent mixed solution, opens the molecular chain of the surface layer of the high polymer workpiece, releases the internal stress, reduces the probability of releasing the internal stress during the curtain coating hardening, and reduces the occurrence of the cracking phenomenon of the high polymer workpiece caused by the curtain coating hardening.

In some embodiments, the treated surface may change its structure due to the release of internal stress, and thus, the adhesion of the surface may be improved when the shower coating is hardened.

In some embodiments, the organic solvent mixture includes a plurality of organic solvents that are different in volatility and that swell the high molecular polymer workpiece to different extents. And the composition of the organic solvent mixed solution, the volatility and the swelling capacity of each organic solvent can be controlled to play a role in controlling the process of releasing internal stress, so that the quality of the high polymer workpiece is improved, and the adhesion of the high polymer workpiece to a hardening layer is improved.

In some embodiments, the control of the volatilization rate can be achieved by controlling the volatility, and thus the time of action of the organic solvent with the high molecular polymer workpiece can be controlled.

In some embodiments, by controlling the swelling capacity (i.e., the swelling degree), the coordination effect between the organic solvents can be controlled, for example, the organic solvent with stronger swelling capacity can swell the polymer workpiece faster, open the molecular chains faster, and the organic solvent with weaker swelling capacity is more advantageous for the surface layer of the polymer workpiece which is difficult to open, and the organic solvent with stronger swelling capacity cooperates with the organic solvent with weaker swelling capacity, so that the cracking probability of the surface of the polymer workpiece caused by too fast opening of the molecular chains by the organic solvent with stronger swelling capacity can be reduced.

In some embodiments, the organic solvents with different volatilities and swelling degrees for the high polymer workpiece can be matched to enable the molecular chain to be opened slowly, so that internal stress is released slowly, and the quality of the surface of the high polymer workpiece is guaranteed. Specifically, the cooperation of the volatility and the swelling capacity (namely the swelling degree) can realize the cooperation of the action degree and the action time of the organic solvent and the high polymer workpiece so as to realize the slow release of the internal stress. For example, the strong swelling capacity and the strong volatility of the solvent firstly open the acting force among the surface molecular chains, which is similar to an invasive acting mode, and the invasive acting is only carried out for a short time when the strong volatility of the solvent is matched, the strong swelling capacity and the strong volatility of the solvent volatilize quickly after the strong swelling capacity and the strong volatility of the solvent invade the surface molecular chains of the product, and the molecular chain segments are not naturally contracted or are naturally contracted to be limited; then the medium swelling capacity and medium volatility solvent is responsible for keeping the molecular chain on the surface of the product in an opened state, so as to provide time for the immersion of the weak swelling capacity and weak volatility solvent; after the solvent with weak swelling capacity and weak volatility is immersed, the molecular chain on the surface layer of the high polymer product can be naturally curled in the solvent for a long time due to weak volatility. By controlling, the opening process is slow, the molecular chain is converted from a stretched orientation state into a natural curling state, the surface layer is not affected by internal stress any more, and the curtain coating solvent easily enters the product, so that the adhesive force is effectively improved.

In some embodiments, the workpiece may also be a composite of one or more of PMMA (Polymethyl Methacrylate ), PC (Polycarbonate), PVC (Polyvinylchloride), and ABS (Acrylonitrile Butadiene Styrene, acrylonitrile butadiene styrene copolymer). In some embodiments, the work piece is a composite of one or more of a transparent glass-like PC material and an acrylic material. It will be appreciated that the workpiece may be formed from other materials and polymers.

For the workpiece, the interaction of the action degree and the action time of the organic solvent and the high polymer workpiece can be realized by the combination of volatility and swelling capacity (namely the swelling degree) so as to realize the slow release of the internal stress. For example, the strong swelling capacity and the strong volatility of the solvent firstly open the acting force among the surface molecular chains, which is similar to an invasive acting mode, and the invasive acting is only carried out for a short time when the strong volatility of the solvent is matched, the strong swelling capacity and the strong volatility of the solvent volatilize quickly after the strong swelling capacity and the strong volatility of the solvent invade the surface molecular chains of the product, and the molecular chain segments are not naturally contracted or are naturally contracted to be limited; then the medium swelling capacity and medium volatility solvent is responsible for keeping the molecular chain on the surface of the product in an opened state, so as to provide time for the immersion of the weak swelling capacity and weak volatility solvent; after the solvent with weak swelling capacity and weak volatility is immersed, the molecular chain on the surface layer of the high polymer product can be naturally curled in the solvent for a long time due to weak volatility. By controlling the opening process slowly, the molecular chains are converted from the stretched orientation state to a natural curling state, the surface layer is no longer subjected to the action of internal stress, and microstructures such as cracks, holes and the like are generated. After the organic solvent mixed solution volatilizes, the hardening solution can be well immersed between high polymer chains in the surface through the microstructure, so that the adhesive force of the workpiece is improved. In some embodiments, the volatile organic solvent may be volatilized during the swelling process.

When the organic solvent mixed solution is used for treatment, spraying, smearing and other modes can be adopted, so that the workpiece is adhered with the organic solvent. In some embodiments, the swelling degree of the high polymer workpiece can be controlled according to the control of the dosage of the volatile organic solvent, the spraying time, the painting times and the like, so as to realize reasonable release of the internal stress.

In some embodiments, microstructures, such as microscopic holes, may be formed in the surface of the polymeric workpiece during processing, so that the hardening liquid impregnates between the polymeric chains in the surface through the microstructures during shower coating, enhancing the adhesion of the workpiece.

Step S102: and spraying hardening liquid on the treated surface.

The hardening liquid comprises UV (Ultraviolet) hardening liquid. Similarly, the UV hardening liquid promotes the initiator to decompose under the irradiation of ultraviolet rays to generate free radicals to trigger the resin reaction, and the resin is instantaneously solidified to form a hardening layer, so that the environment-friendly effect is better.

In some embodiments, an appearance film may be fabricated on the hardened layer to enhance the appearance expressive force of the workpiece.

In some embodiments, in step S101, the plurality of organic solvents are arranged in order of decreasing swelling capacity to the high molecular polymer work, and the volatility in the arrangement order is decreased in order.

Through reasonable collocation and control of swelling capacity and volatility of various organic solvents, the curling process and the internal stress release process of the polymer chain can be reasonably controlled. In some embodiments, the swelling capacity and volatility of various organic solvents can be reasonably matched and controlled, so that a more uniform microstructure such as microscopic holes can be generated on the surface to improve the adhesion of the workpiece.

In some embodiments, the plurality of organic solvents may include at least two.

In some embodiments, the plurality of organic solvents may include three.

In some embodiments, at least two organic solvents are arranged in the order in which the swelling capacity for the high molecular polymer work piece is sequentially reduced, and the volatility in the arrangement order is sequentially reduced in the organic solvent mixture.

In some embodiments, the plurality of organic solvents includes a first organic solvent, a second organic solvent, and a third organic solvent, and in the organic solvent mixture, the swelling capacity of the first organic solvent, the second organic solvent, and the third organic solvent to the high polymer workpiece decreases sequentially, and the volatility decreases sequentially.

In some embodiments, the plurality of organic solvents may be a combination of a ketone organic solvent, a toluene organic solvent, and an alcohol organic solvent. For example, the organic solvent mixture may be a combination of at least one of ketone organic solvents, at least one of toluene organic solvents, and at least one of alcohol organic solvents.

In some embodiments, the plurality of organic solvents may include three, one being a ketone organic solvent, another being a toluene organic solvent, and a final alcohol organic solvent. In some embodiments, in the organic solvent mixture, the swelling capacity of the ketone organic solvent, the toluene organic solvent and the alcohol organic solvent to the high polymer workpiece is reduced and the volatility is reduced, respectively, in sequence. That is, in the organic solvent mixture, the plurality of organic solvents may include one strong solvent, one medium solvent, and one weak solvent. Among the organic solvent mixed solution, the organic solvent with the strongest swelling capacity and the strongest volatility is the strong solvent, the organic solvent with the weakest swelling capacity and the weakest volatility is the weak solvent, and the rest is the medium solvent. When the surface of a high polymer workpiece is treated, strong solvent ketones firstly open acting force among surface molecular chains, which is similar to an invasive acting mode, but because the strong solvent has strong volatility, the acting can only last for a short time, the strong solvent volatilizes quickly after invading the surface molecular chains of a product, and the molecular chain segments are not naturally contracted or are limited. Then, toluene as a medium solvent is responsible for keeping the molecular chains on the surface of the product open, and provides time for the immersion of weak solvent alcohols. After the weak solvent alcohol is immersed, the molecular chain on the surface layer of the injection molding product can be naturally curled in the solvent for a long time due to weaker volatility. Through the cooperation of a plurality of solvents, the cooperation of the action degree and the action time of the organic solvent is realized, so that the slow release of the molecular chain stress on the surface of the high polymer workpiece is realized. The molecular chain is changed from a stretched orientation state to a natural curling state, the surface layer is not affected by internal stress any more, and the curtain coating solvent easily enters the product, so that the adhesive force is effectively improved.

Referring to fig. 3, fig. 3 is a schematic diagram of step S101 of the present application. Initially, the surface layer 102 of the workpiece 100 is subjected to internal stress, so that the polymer chain in the surface layer 102 is limited in curl, and a state of natural curl cannot be achieved.

In a, a workpiece is treated with a mixture of organic solvents. In some embodiments, the work piece may be treated with a variety of organic solvents that are mixed with strong, medium, and weak solvents. The solvent has stronger polarity, can break the hydrogen bond between molecular chains, open the molecular chains, enlarge the gaps between the molecular chains, facilitate the hardening liquid of the subsequent curtain coating to easily enter, and further improve the adhesive force.

In B, the strong solvent can well open the polymer chains in the surface layer 102, which provides convenience for the medium solvent and the weak solvent to enter between the polymer chains, and further can better complete the treatment of the workpiece, such as swelling treatment.

In the step C, the strong solvent has strong volatility, and can volatilize quickly in the whole process of opening the polymer chains in the surface layer 102, and the medium solvent can keep the open state of the polymer chains in the surface layer 102, so as to cooperate with the volatilization of the strong solvent, so that the polymer chains are filled with sufficient weak solvent. When the medium solvent and the weak solvent volatilize, the solvent with higher volatility can leave a great deal of time for the polymer chain to curl, so that the polymer chain starts to naturally curl at least in the weak solvent.

In D, after all the organic solvents such as the strong solvent, the medium solvent, and the weak solvent are volatilized, van der waals force and hydrogen bond between the polymer chains in the surface layer 102 are broken to be loose, and internal stress in the workpiece 100 is released. The molecular chains in the surface layer 102 re-interact in a crimped state.

In some embodiments, the strong solvent may be methyl isobutyl ketone in a ketone organic solvent. In some embodiments, the medium solvent may be trimethylbenzene in a toluene-based organic solvent. In some embodiments, the weak solvent may be n-butanol in an alcoholic organic solvent. In the organic solvent mixed solution, the swelling capacity of methyl isobutyl ketone, trimethylbenzene and n-butanol to a high molecular polymer workpiece is reduced and the volatility is reduced in sequence.

In some embodiments, the weight parts ratio of the ketone organic solvent, the toluene organic solvent and the alcohol organic solvent is 55-80:2-8:20-45.

In some embodiments, the weight parts ratio of the ketone organic solvent, the toluene organic solvent, and the alcohol organic solvent is 67:3:30.

in some embodiments, the weight parts ratio of the ketone organic solvent, the toluene organic solvent and the alcohol organic solvent is 60-75:4-6:28-40.

In some embodiments, the weight parts ratio of the ketone organic solvent, the toluene organic solvent, and the alcohol organic solvent is 63:4:35.

in some embodiments, referring to fig. 4, fig. 4 is a schematic flow chart of processing a surface of a workpiece according to another embodiment of the application. The workpiece may be a housing. Prior to step S0101, the method further comprises:

step S401: and (5) performing injection molding by using a high molecular polymer to form the shell.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a housing according to an embodiment of the application. The housing 200 may include a body portion 10 and a boss portion 20 connected to each other. The body portion 10 has oppositely disposed first and second surfaces 11, 12. The boss 20 may be provided on the first surface 11 of the body portion 10. Specifically, the boss 20 is provided to protrude at one side of the first surface 11 of the main body 10.

Referring to fig. 6, fig. 6 is a schematic structural diagram of the housing 200 in another embodiment in the embodiment shown in fig. 5. I.e. the edge of the body part 10 is curved to a side remote from the first surface 11.

Step S101 may be to treat at least the surface of the protruding portion with a volatile organic solvent.

The boss 20 is provided as part of the housing of the electronic device. Further, the electronic device case is processed on the main body 10 and the boss 20, for example.

In some embodiments, the shell 200 is thicker at the location of the boss 20 and thus has greater internal stress, and thus the swelling process is performed on the boss 20 to be more effective. In an embodiment, after step S101, the electronic device housing, for example, the main body 10, the surface of the protruding portion 20, and the surface of the connecting portion between the protruding portion 20 and the main body 10, have microscopic holes formed by the treatment of the organic solvent mixture. Further, after step S102, a hardened layer is disposed on the surface having the microscopic holes to cover the microscopic holes.

In some embodiments, referring to fig. 7, fig. 7 is a schematic flow chart of processing a surface of a workpiece according to another embodiment of the application. The workpiece may be a housing. Prior to step S0101, the method further comprises:

step S601: and (5) performing compression injection molding by using a high polymer to form the shell.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a housing according to an embodiment of the application. The housing 200 may include a body portion 10 and a boss portion 20 connected to each other. The body portion 10 has oppositely disposed first and second surfaces 11, 12. The boss 20 is provided on the first surface 11 of the body portion 10. Specifically, the boss 20 is provided to protrude at one side of the first surface 11 of the main body 10.

Referring to fig. 9, fig. 9 is a schematic structural diagram of the housing 200 in another embodiment in the embodiment shown in fig. 8. The edge of the body portion 10 is curved to a side away from the first surface 11.

In some embodiments, referring to fig. 8 and 9, the main body 10 has a blind hole 13 formed on the second surface 12. Specifically, the main body 10 is provided with a blind hole 13 on a portion of the second surface 12 opposite to the protruding portion 20. In some embodiments, the blind bore 13 may extend into the boss 20, although it may be provided only in the body portion 10. In some embodiments, blind bore 13 may be formed when housing 200 is compression molded. Referring to fig. 10 and 11, fig. 10 is a schematic structural view of a housing according to an embodiment of the present application, and fig. 11 is a schematic structural view of a housing according to another embodiment of the present application according to the embodiment shown in fig. 10. The convex part 20 can be provided with a camera shooting hole 21 on the surface of one side far away from the main body part 10, and the camera shooting hole 21 can be communicated with the blind hole 13 so as to give way for the camera. In some embodiments, the image capturing hole 21 may be formed by punching after the injection molding of the housing, or may be formed during the injection molding process, although other manners may be used. In some embodiments, the blind hole 13 may be omitted, and the image capturing hole 21 may extend toward the second surface 12 to penetrate the main body 10.

Referring to fig. 8, 9, 10, 11 and 12, fig. 12 is a schematic flow chart of processing a surface of a housing 200 according to an embodiment of the application. In step S101, at least the surface of the protruding portion and the first surface may be treated with a volatile organic solvent on the side of the main body portion located on the first surface.

In some embodiments, the housing 200, such as the surface of the body 10, the surface of the boss 20, and the surface where the boss 20 connects to the body 10, has microscopic holes formed by treatment with a mixture of organic solvents.

In some embodiments, referring to fig. 12 and 13, fig. 13 is a schematic flow chart of processing a surface of a workpiece according to another embodiment of the application. After step S101 and before step S102, the method further comprises:

step S901: and (5) air-drying the treated surface.

By air drying, the volatilization of the organic solvent is quickened, the influence of the organic solvent on the hardening liquid is reduced, the adhesive force of the workpiece is further improved, and in some embodiments, the plasma air can be adopted for air drying.

In some embodiments, after step S901 and before step S102, the method further comprises:

step S902: and cleaning the treated surface.

In some embodiments, the cleaning may be performed by curtain coating, spraying, or the like.

In some embodiments, after step S102, the product may be inspected to eliminate defective products to ensure quality of subsequent processes.

In some embodiments, after step S102, a hardened layer is disposed on the surface to cover the microscopic holes.

Referring to fig. 14, 15 and 16, fig. 14 is a schematic surface view of a workpiece according to an embodiment of the application, fig. 15 is a schematic surface view of the workpiece after being treated according to an embodiment of the application, and fig. 16 is a schematic surface view of the workpiece after being coated with a hardening liquid to form a hardening layer according to an embodiment of the application. Wherein, after the surface is treated by the organic solvent mixture, the surface generates microstructures such as microscopic holes, and the microscopic holes can comprise dense island holes.

The microstructure such as dense island-shaped holes is used as a release source of the internal stress, so that the internal stress is uniformly released on the whole surface, and the occurrence probability of cracking caused by rapid release of the internal stress concentrated at a certain point is reduced; meanwhile, the microstructure such as dense island-shaped holes improves the surface roughness, increases the surface energy, is beneficial to increasing the embedding with the shower-coating hardening liquid and increases the adhesive force.

Referring to FIG. 15, the microstructure, e.g., densely-isolated island holes, has a diameter of 30-70um, a depth of 1-4 um, and a roughness of 0.268. Referring to fig. 16, after shower coating with the hardening liquid, the whole surface exhibits a highlight appearance effect, the microscopic depth of the shower coated surface is 0.3-0.4um, and the roughness is 0.299.

In some embodiments, the method may be applied to the boss 20 and the portion of the body portion 10 facing the boss 20. I.e. the method acts on thicker parts of the housing 200.

In an embodiment, referring to fig. 9 and 10, the surface of the housing 200, such as the boss 20, is treated in step S101, so that the polymer chains in the housing 200, such as the boss 20, are opened and converted into a natural crimped state, and at the same time, dense microscopic holes are generated on the surface of the housing 200, such as the boss 20, and release of internal stress is completed. In step S102, the surface of the housing 200, for example, the protruding portion 20, is subjected to shower coating with the hardening liquid, so that the hardening liquid can enter microscopic holes, the adhesion force of the housing 200, for example, the protruding portion 20 and the hardening layer is effectively improved, the cracking probability of the housing 200, for example, the protruding portion 20, in step S102 and later stages is reduced, the adhesion force between the housing 200, for example, the protruding portion 20 and the hardening layer is improved, the yield of the shower coating hardening process is improved, and meanwhile, the design space of the boss structure is expanded.

In some embodiments, prior to step S102, the method further comprises treating the surface of the high molecular polymer workpiece to form microstructures such as microscopic holes, micro-textures on the surface of the high molecular polymer workpiece. In some embodiments, chemical agents may be used to create microstructures such as microscopic holes or rivet structures on the surface of the polymeric workpiece. Of course, instead of using a surface treatment process that is not mediated by chemical agents to create microstructures, such as microscopic holes or rivet structures, on the surface, for example, a design that utilizes a mold process to create microstructures, such as micro-textures, for example, by other means, such as laser engraving, rubbing, printing, etc., on the polymeric workpiece, it will be appreciated that micro-textures may include microscopic holes or rivet structures.

Next, an electronic device that can use the case 200 in the above-described embodiment, or that can use the case prepared by the method in the above-described embodiment will be described. The electronic device may be any of a number of electronic devices including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, calculators, programmable remote controls, pagers, netbooks, personal Digital Assistants (PDAs), portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2), audio layer 3 (MP 3) players, portable medical devices, and digital cameras, combinations thereof, and the like.

In some embodiments, the electronic device may include, but is not limited to, an electronic device with communication capabilities such as a cell phone, tablet, notebook, wearable device, internet device (mobile internet device, MID), electronic book, portable playstation (Play Station Portable, PSP), or personal digital assistant (Personal Digital Assistant, PDA).

Referring to fig. 17, fig. 17 is a schematic structural diagram of an electronic device 300 according to an embodiment of the application. The electronic apparatus 300 may include the case 200, the middle frame 30 connected to the case 200, the camera 40 installed in the installation space formed by the connection of the case 200 and the middle frame 30, and the display 50 disposed at a side of the middle frame 30 away from the case 200 in the above embodiments. The image capturing hole 21 may be in communication with the installation space, so that light is incident into the camera 40 through the image capturing hole 21. The display screen 50 may be fastened to the middle frame 30 by fastening or bonding, and the camera 40 may be installed in the installation space and matched with the housing 200, and disposed opposite to the camera hole 21, so as to be used as a rear camera. In some embodiments, camera 40 is mounted between housing 200 and display 50 and is at least partially positioned within blind bore 13 for light capture through camera aperture 21. Of course, the blind hole 13 may be omitted, and the image pickup hole 21 is directly communicated with the installation space. In some embodiments, the housing 200 may be snap-fit to the center 30. It will be appreciated that the electronic device 300 may also include other structures disposed within the mounting space such as a circuit board on which a control unit such as a processor or the like is disposed, a battery, a sensor, and other electronic components. And will not be described in detail herein.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described device embodiments are merely illustrative, e.g., the division of modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the object of the embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.

The foregoing description is only illustrative of the present application and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present application.

Claims (15)

1. A method of machining a surface of a workpiece, comprising:

the method comprises the steps of processing the surface of a high-molecular polymer workpiece by utilizing an organic solvent mixed solution so as to open molecular chains on the surface layer of the high-molecular polymer workpiece, wherein the organic solvent mixed solution comprises a plurality of organic solvents which have different volatilities and swell the high-molecular polymer workpiece to different degrees, in the organic solvent mixed solution, the plurality of organic solvents are arranged according to the order of sequentially reducing the swelling capacity of the high-molecular polymer workpiece, and the volatilities of the plurality of organic solvents in the arrangement order are sequentially reduced;

and spraying a hardening liquid on the treated surface, wherein the hardening liquid is solidified to form a hardening layer.

2. The method according to claim 1, wherein the plurality of organic solvents includes a first organic solvent, a second organic solvent, and a third organic solvent, and in the organic solvent mixture, swelling capacities of the first organic solvent, the second organic solvent, and the third organic solvent with respect to the high molecular polymer workpiece are sequentially reduced, and volatility is sequentially reduced.

3. The method of claim 1, wherein the treating the surface of the high molecular polymer workpiece with the organic solvent mixture comprises:

and processing the surface of the high-molecular polymer workpiece by utilizing the plurality of organic solvents so as to open molecular chains on the surface layer of the high-molecular polymer workpiece and form microscopic holes on the surface of the high-molecular polymer workpiece.

4. The method of claim 1, wherein prior to the curtain coating of the hardening liquid on the treated surface, the method further comprises:

and processing the surface of the high-molecular polymer workpiece to form microscopic holes on the surface of the high-molecular polymer workpiece.

5. The method of claim 4, wherein the treating the surface of the high molecular polymer workpiece comprises:

and (3) adopting a non-chemical agent-interposed surface treatment process to treat the surface of the high-molecular polymer workpiece so as to form microscopic holes on the surface of the high-molecular polymer workpiece.

6. The method according to claim 1, wherein the plurality of organic solvents include a ketone organic solvent, a toluene organic solvent, and an alcohol organic solvent, and in the organic solvent mixture, swelling capacities of the ketone organic solvent, the toluene organic solvent, and the alcohol organic solvent with respect to the high-molecular polymer workpiece are sequentially reduced, and volatility is sequentially reduced.

7. The method of claim 6, wherein the ketone organic solvent comprises methyl isobutyl ketone, the toluene organic solvent comprises trimethylbenzene, and the alcohol organic solvent comprises n-butanol.

8. The method according to claim 6, wherein the weight ratio of the ketone organic solvent, the toluene organic solvent and the alcohol organic solvent is 55-80:2-8:20-45.

9. The method according to claim 8, wherein the weight ratio of the ketone organic solvent, the toluene organic solvent and the alcohol organic solvent is 67:3:30.

10. the method according to claim 1, characterized in that before the surface of the high molecular polymer workpiece is treated with the organic solvent mixture, the method comprises:

the method comprises the steps of performing injection molding by using a high polymer to form a shell, wherein the shell comprises a main body part and a protruding part which are connected with each other, and the protruding part is arranged on one side of the main body part in a protruding way;

the treatment of the surface of the high polymer workpiece by using the organic solvent mixed solution comprises the following steps:

and treating at least the surface of the convex part by using the organic solvent mixed solution.

11. The method of claim 1, further comprising, prior to said curtain coating the hardening liquid on the treated surface:

and (5) air-drying the treated surface.

12. The method as recited in claim 1, further comprising:

and manufacturing an appearance membrane on the hardening layer.

13. A housing, comprising:

the device comprises a main body part and a bulge part, wherein the bulge part is arranged on one side of the main body part in a protruding way, the surface of the bulge part or the surface of the joint of the bulge part and the main body part is configured to be treated by an organic solvent mixed solution, a high polymer molecular chain on the surface layer is opened, the organic solvent mixed solution comprises a plurality of organic solvents which have different volatilities and swell the high polymer workpieces to different degrees, in the organic solvent mixed solution, the plurality of organic solvents are arranged according to the order of sequentially decreasing the swelling capacity of the high polymer workpieces, and the volatilities of the plurality of organic solvents in the arrangement order are sequentially decreased; and

and a hardening layer disposed at least on the surface treated with the organic solvent mixture.

14. The housing of claim 13, further comprising:

and the appearance membrane is arranged on the hardening layer.

15. An electronic device, comprising:

the housing according to any one of claims 13 to 14, the boss being provided with a camera aperture; and

the middle frame is connected with the shell to form an installation space communicated with the camera hole;

the display screen is arranged on one side of the middle frame far away from the shell; and

the camera is installed in the installation space and is arranged opposite to the camera shooting hole.