CN115043593A - Low-dielectric glass fiber composition and application thereof - Google Patents
Low-dielectric glass fiber composition and application thereof Download PDFInfo
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- CN115043593A CN115043593A CN202210726068.2A CN202210726068A CN115043593A CN 115043593 A CN115043593 A CN 115043593A CN 202210726068 A CN202210726068 A CN 202210726068A CN 115043593 A CN115043593 A CN 115043593A
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- 239000003365 glass fiber Substances 0.000 title claims abstract description 73
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 13
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims abstract description 12
- 229910052796 boron Inorganic materials 0.000 claims abstract description 12
- 229910010413 TiO 2 Inorganic materials 0.000 claims abstract description 10
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims description 36
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 230000008054 signal transmission Effects 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 239000002759 woven fabric Substances 0.000 claims description 2
- 238000009472 formulation Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 5
- 230000037431 insertion Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000292 calcium oxide Substances 0.000 description 10
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 238000001816 cooling Methods 0.000 description 5
- 239000000395 magnesium oxide Substances 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012681 fiber drawing Methods 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C13/00—Fibre or filament compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
- C03B37/01—Manufacture of glass fibres or filaments
- C03B37/02—Manufacture of glass fibres or filaments by drawing or extruding, e.g. direct drawing of molten glass from nozzles; Cooling fins therefor
- C03B37/022—Manufacture of glass fibres or filaments by drawing or extruding, e.g. direct drawing of molten glass from nozzles; Cooling fins therefor from molten glass in which the resultant product consists of different sorts of glass or is characterised by shape, e.g. hollow fibres, undulated fibres, fibres presenting a rough surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Glass Compositions (AREA)
Abstract
The invention provides a low-dielectric glass fiber composition and application thereof. The low-dielectric glass fiber composition comprises the following components in percentage by mass: SiO 2 2 50‑58.5%,Al 2 O 3 8‑16%,B 2 O 3 17‑26%,CaO 0‑1.0%,ZnO 0‑5.0%,BaO 0.5‑6.0%,SrO 0.5‑3.0%,TiO 2 0.1‑5.0%,F 2 0.1-1.8% and Na 2 O+K 2 O+Li 2 0.05 to 0.5 percent of O. The low dielectric glass fiber composition of the present invention has a low drawing temperature, and has a low dielectric constant and dielectric loss, excellent processability and dielectric properties, and furthermore, has a significant improvement effect on insertion loss.
Description
Technical Field
The invention relates to the technical field of glass fiber, in particular to a low-dielectric glass fiber composition and application thereof.
Background
The main components of the glass fiber comprise silicon dioxide, aluminum oxide, calcium oxide, boron oxide, magnesium oxide, sodium oxide and the like, and the glass fiber can be divided into alkali-free glass fiber, medium-alkali glass fiber and high-alkali glass fiber according to the content of alkali in the glass. E-glass, also known as alkali-free glass, is a borosilicate glass, which is also the most widely used glass fiber at present, however, E-glass has a relatively high dielectric constant and a relatively high loss tangent angle. The D glass is also called low dielectric glass, has lower dielectric constant and loss tangent angle, is mainly used for producing low dielectric glass fiber with better dielectric strength, but has higher melting temperature and poorer processability.
B 2 O 3 -P 2 O 5 -SiO 2 The alkali-free glass has a small dielectric constant and a low loss tangent angle at a frequency of 10GHz or higher, whereas SiO in the alkali-free glass 2 The content is high, so that the viscosity of the glass is too high in a high-temperature molten state, the clarification effect is poor, and bubbles in the glass liquid are difficult to escape; meanwhile, the glass fiber drawing temperature of the glass is over 1400 ℃, the production efficiency of the glass fiber is seriously influenced, and air bubbles or stripes are easily generated in the drawing process, so that the wire breakage is caused. In addition, as the signal transmission frequency increases, the signal loss of the existing glass fiber increases significantly, which is not favorable for high-speed and low-loss transmission of high-frequency signals.
In view of this, the invention is particularly proposed.
Disclosure of Invention
The invention aims to provide a low-dielectric glass fiber composition and application thereof, wherein the low-dielectric glass fiber composition has low drawing temperature, lower dielectric constant and dielectric loss and obvious improvement effect on insertion loss.
The invention provides a low-dielectric glass fiber composition which comprises the following components in percentage by mass: SiO 2 2 50-58.5%,Al 2 O 3 8-16%,B 2 O 3 17-26%,CaO 0-1.0%,ZnO 0-5.0%,BaO 0.5-6.0%,SrO 0.5-3.0%,TiO 2 0.1-5.0%,F 2 0.1-1.8% and Na 2 O+K 2 O+Li 2 O 0.05-0.5%。
Further, the low dielectric glass fiber composition comprises the following components in percentage by mass: SiO 2 2 52-58%,Al 2 O 3 8-13.5%,B 2 O 3 21-25%,CaO 0-1.0%,ZnO 0-4.5%,BaO 0.5-6.0%,SrO 0.5-3.0%,TiO 2 0.5-4.0%,F 2 05-1.8% and Na 2 O+K 2 O+Li 2 O 0.05-0.3%。
Further, the low dielectric glass fiber composition comprises the following components in percentage by mass: SiO 2 2 53.6-57.2%,Al 2 O 3 8.5-11.9%,B 2 O 3 21.5-23.8%,CaO 0-0.5%,ZnO 0-4.2%,BaO 1.6-5.9%,SrO 1.6-2.9%,TiO 2 1.1-3.1%,F 2 0.8-1.7% and Na 2 O+K 2 O+Li 2 O 0.1-0.2%。
The invention also provides a preparation method of the low dielectric glass fiber, which comprises the following steps:
s1: compounding the low-dielectric glass fiber composition;
s2: mixing and homogenizing the prepared raw materials, and then heating to melt and clarify to obtain glass liquid;
s3: and drawing and molding the glass liquid to obtain the low dielectric glass fiber.
In step S2, the heating speed is 4-6 ℃/min and the heating time is 4-5 h; the temperature for melting and clarifying is 1550-.
In step S3, the diameter of the low dielectric glass fiber is 3 to 15 μm.
The invention also provides a low dielectric glass fiber prepared by the preparation method.
The low dielectric glass fiber has a dielectric constant of 4.5 or less and 6 x 10 or less at a frequency of 1GHz -4 The dielectric loss tangent of (1); specifically, the low dielectric glass fiber has a dielectric constant of 4.33 to 4.48 and a dielectric loss tangent of 3.69X 10 at a frequency of 1GHz -4 To 5.20X 10 -4 。
The low dielectric glass fiber has a dielectric constant of 4.4 or less and 2 x 10 or less at a frequency of 10GHz -3 The dielectric loss tangent of (1); specifically, the low dielectric glass fiber has a dielectric constant of 4.23 to 4.35 and a dielectric loss tangent of 1.38X 10 at a frequency of 10GHz -3 To 1.58X 10 -3 。
The low dielectric glass fiber of the invention has a glass viscosity of 1340-1390 ℃ at 1000P, and further 1344-1381 ℃.
The present invention also provides a product comprising the above low dielectric glass fiber, which is not strictly limited, and may be, for example, a printed circuit board, a woven fabric, a nonwoven fabric, a unidirectional fabric, a chopped strand mat, a composite material, a communication signal transmission medium, and the like.
The implementation of the invention has at least the following advantages:
1. the low-dielectric glass fiber composition provided by the invention has the advantages that the glass viscosity at 1000P is obviously reduced, and the high-temperature viscosity is reduced, so that the wire drawing temperature and the requirements on kiln equipment are reduced, the manufacturing cost of glass fibers is greatly reduced, and the large-scale manufacturing efficiency is improved;
2. the low-dielectric glass fiber has low drawing temperature, less bubbles and good processability, and improves the yield and production yield of products; meanwhile, the low dielectric glass fiber has lower dielectric constant and dielectric loss, excellent dielectric property, wider application range of products and higher economic benefit;
3. the low-dielectric glass fiber has improved water resistance, and the service life of the product under complex conditions is prolonged; in addition, the low dielectric glass fiber has obvious improvement effect on insertion loss, and is particularly beneficial to high-speed and low-loss transmission of high-frequency signals.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms also include the plural forms unless the context clearly dictates otherwise, and further, it is understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of the stated features, steps, operations, devices, components, and/or combinations thereof.
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples 1 to 8
The low dielectric glass fiber compositions of examples 1-8, comprising the following components in mass percent: SiO 2 2 50-58.5%,Al 2 O 3 8-16%,B 2 O 3 17-26%,CaO 0-1.0%,ZnO 0-5.0%,BaO 0.5-6.0%,SrO 0.5-3.0%,TiO 2 0.1-5.0%,F 2 0.1-1.8% and Na 2 O+K 2 O+Li 2 0.05 to 0.5 percent of O; examples 1-8 specific compositions of low dielectric glass fiber compositions are shown in table 1.
The preparation of the low dielectric glass fibers of examples 1-8 includes the following steps:
s1: compounding the low dielectric glass fiber composition into a mixture;
s2: mixing and homogenizing the prepared raw materials, and then heating to melt and clarify to obtain glass metal;
s3: drawing and molding the glass liquid to obtain low-dielectric glass fiber;
in step S2, the heating speed is 4-6 ℃/min and the heating time is 4-5 h; the temperature for melting and clarifying is 1550-. Examples 1-8 specific parameters in the process for preparing low dielectric glass fiber compositions can be determined for each component so long as the compositions of the low dielectric glass fiber compositions produced satisfy table 1.
The following methods were used for performance testing:
dielectric Property (D) k 、D f ): the test specimens were cut and ground to prepare specimens of 80 mm. times.3 mm. times.1 mm. The obtained sample was dried at 110 ℃ for 24 hours and kept at a constant temperature of 23 ℃ and a humidity of 60%Storing in a wet box for 24 h. Subsequently, the dielectric constant D of the above-mentioned sample was measured at 1GHz and 10GHz using a device for measuring the dielectric properties of a cavity resonator manufactured by AET of Japan, according to JIS C2565:1992 k And dielectric loss tangent D f 。
Liquidus temperature T L : putting a glass sample to be measured with the size of 10 multiplied by 10mm into a gradient furnace which is heated to 800-1300 ℃, carrying out heat treatment for 8 hours, and then taking out and cooling to room temperature to obtain the cooled glass. The inside of the cooling glass was observed for devitrification with a polarizing microscope: if the crystallization exists in the range within 2 mm from the surface of the cooled glass, judging that the temperature of the melting treatment is lower than the liquidus temperature of the glass sample to be measured; if no crystallization exists in the cooled glass, judging that the temperature of the melting treatment is higher than the liquidus temperature of the glass sample to be measured; if there is no crystallization in the range of the cooling glass within 2 mm from the surface thereof and there is crystallization in the range of the cooling glass within 2 mm from the surface thereof, the temperature at the position within the gradient furnace is taken as the liquidus temperature T of the glass sample to be measured L 。
T 3 And (3) temperature testing: the method comprises the steps of crushing glass to be measured into a proper particle size, weighing 100 g of the glass to be measured, placing the glass in a platinum crucible, placing the platinum crucible in a high-temperature heating furnace, adjusting the position of a platinum rotor in the center of the platinum crucible, starting to heat according to a program, keeping the temperature for a period of time after the temperature is raised to a high temperature, cooling according to the program, recording the torque of the rotor when the temperature reaches a set temperature, and converting the torque into a corresponding glass viscosity value at the temperature. Wherein T is 3 Temperature refers to the temperature corresponding to a viscosity equal to 1000 poise.
The test results are shown in Table 2.
TABLE 1 composition (wt%) of low dielectric glass fiber composition of each example
Comparative example 1
The comparative example uses E glass which is widely used in industry as a comparison, and the composition of the E glass is as follows:
SiO 2 54.8%,Al 2 O 3 14.3%,B 2 O 3 6.3%, CaO 22.6%, MgO 1.4% and F 2 0.6 percent; preparation and testing methods refer to example 1.
Comparative example 2
The comparative example uses NE glass fiber as a control, and the composition is as follows:
SiO 2 54.7%,Al 2 O 3 14.9%,B 2 O 3 19.9%,CaO 4.0%,MgO 4.0%,TiO 2 2.0% and F 2 0.5 percent; preparation and testing methods refer to example 1.
Comparative example 3
The composition of the glass fiber composition of this comparative example was as follows:
SiO 2 53.6%,Al 2 O 3 12.4%,B 2 O 3 22.7%,CaO 3.1%,MgO 1.0%,SrO 4.1%,TiO 2 2.1% and F 2 1.0 percent; preparation and testing methods refer to example 1.
Comparative example 4
The composition of the glass fiber composition of this comparative example was as follows:
SiO 2 57.72%,Al 2 O 3 11.33%,B 2 O 3 23.98%, CaO 5.82% and F 2 1.15 percent; preparation and testing methods refer to example 1.
Comparative example 5
The composition of the glass fiber composition of this comparative example is as follows:
SiO 2 50.73%,B 2 O 3 24.57%,Al 2 O 3 17.07%,P 2 O 5 3.96%,CaO 3.30%,MgO 0.04%,TiO 2 0.01%,Fe 2 O 3 0.03%,Na 2 O 0.04%,K 2 o0.01% and SnO 2 0.22 percent; preparation ofMethods and test methods reference was made to example 1.
TABLE 2 Performance test results for each of the low dielectric glass fibers
Note: in Table 2, "E-04" represents ". times.10 -4 "," E-03 "means". times.10 -3 ”。
Test example 1
The Loss performance test boards were prepared by using Low Loss grade plates and glass fibers according to examples 1 to 8 and comparative examples 1 to 5, and the Loss values were measured by using a vector network analyzer and an FD method, and the results are shown in table 3.
TABLE 3 insertion loss variation (dB/cm) of PCB signals collocated with each glass fiber at different frequencies
As can be seen from table 3, the low dielectric glass fibers of the embodiments of the present invention can reduce signal loss to some extent relative to E glass fibers, NE glass fibers, and other glass fibers; meanwhile, the higher the signal transmission frequency is, the more remarkable the improvement of the insertion loss by each low dielectric glass fiber is.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A low-dielectric glass fiber composition is characterized by comprising the following components in percentage by mass: SiO 2 2 50-58.5%,Al 2 O 3 8-16%,B 2 O 3 17-26%,CaO 0-1.0%,ZnO 0-5.0%,BaO 0.5-6.0%,SrO 0.5-3.0%,TiO 2 0.1-5.0%,F 2 0.1-1.8% and Na 2 O+K 2 O+Li 2 O 0.05-0.5%。
2. The low dielectric glass fiber composition of claim 1, comprising the following components in mass percent: SiO 2 2 52-58%,Al 2 O 3 8-13.5%,B 2 O 3 21-25%,CaO 0-1.0%,ZnO 0-4.5%,BaO 0.5-6.0%,SrO 0.5-3.0%,TiO 2 0.5-4.0%,F 2 0.5-1.8% and Na 2 O+K 2 O+Li 2 O 0.05-0.3%。
3. A preparation method of low dielectric glass fiber is characterized by comprising the following steps:
s1: a formulation of the low dielectric glass fiber composition of claim 1 or 2;
s2: mixing and homogenizing the prepared raw materials, and then heating to melt and clarify to obtain glass liquid;
s3: and drawing and molding the glass liquid to obtain the low dielectric glass fiber.
4. The preparation method according to claim 3, wherein the heating is carried out at a heating rate of 4-6 ℃/min for a heating time of 4-5 hours; the temperature for melting and clarifying is 1550-.
5. The method according to claim 3, wherein the low dielectric glass fiber has a diameter of 3 to 15 μm.
6. A low dielectric glass fiber produced by the production method according to any one of claims 3 to 5.
7. The low dielectric glass fiber of claim 6,characterized in that the low dielectric glass fiber has a dielectric constant of not more than 4.5 and not more than 6 x 10 at a frequency of 1GHz -4 The dielectric loss tangent of (1).
8. The low dielectric glass fiber of claim 6, wherein the low dielectric glass fiber has a dielectric constant of 4.4 or less and 2 x 10 or less at a frequency of 10GHz -3 The dielectric loss tangent of (1).
9. The low dielectric glass fiber of claim 6, wherein the low dielectric glass fiber has a glass viscosity of 1340-1390 ℃ at 1000P.
10. A product comprising the low dielectric glass fiber of any of claims 6-9, wherein the product is a printed circuit board, a woven fabric, a non-woven fabric, a unidirectional fabric, a chopped strand mat, a composite material, or a communication signal transmission medium.
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CN110028249A (en) * | 2019-01-30 | 2019-07-19 | 河南光远新材料股份有限公司 | A kind of dielectric glass fibre component and its manufacturing method |
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CN114007993A (en) * | 2020-04-10 | 2022-02-01 | 日东纺绩株式会社 | Glass composition for glass fiber, glass fiber fabric, and glass fiber-reinforced resin composition |
-
2022
- 2022-06-23 CN CN202210726068.2A patent/CN115043593A/en active Pending
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CN1186482A (en) * | 1995-06-05 | 1998-07-01 | 日东纺织株式会社 | Low-permittivity glass fibers |
TW450948B (en) * | 1996-10-16 | 2001-08-21 | Nitto Glass Fiber Mfg | Glass fiber of low dielectric constant |
JP2003137590A (en) * | 2001-05-09 | 2003-05-14 | Nippon Electric Glass Co Ltd | Low dielectric constant low dielectric dissipation factor glass, and glass fiber and glass fiber fabric using the glass |
TW200536801A (en) * | 2004-05-14 | 2005-11-16 | Ming On Ind Corp | Low-dielectric-constant fiberglass |
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CN110028249A (en) * | 2019-01-30 | 2019-07-19 | 河南光远新材料股份有限公司 | A kind of dielectric glass fibre component and its manufacturing method |
CN114007993A (en) * | 2020-04-10 | 2022-02-01 | 日东纺绩株式会社 | Glass composition for glass fiber, glass fiber fabric, and glass fiber-reinforced resin composition |
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