CN115041455A - Pickling unit is used in processing of semiconductor equipment spare part - Google Patents
Pickling unit is used in processing of semiconductor equipment spare part Download PDFInfo
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- CN115041455A CN115041455A CN202210970006.6A CN202210970006A CN115041455A CN 115041455 A CN115041455 A CN 115041455A CN 202210970006 A CN202210970006 A CN 202210970006A CN 115041455 A CN115041455 A CN 115041455A
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- fixedly connected
- pickling
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- 238000005554 pickling Methods 0.000 title claims abstract description 123
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000007788 liquid Substances 0.000 claims description 91
- 239000012535 impurity Substances 0.000 claims description 22
- 238000005507 spraying Methods 0.000 claims description 7
- 238000005213 imbibition Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- 239000002699 waste material Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 19
- 238000009434 installation Methods 0.000 abstract 5
- 230000005389 magnetism Effects 0.000 description 13
- 235000021110 pickles Nutrition 0.000 description 10
- 238000005406 washing Methods 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 238000001914 filtration Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004063 acid-resistant material Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a pickling device for processing semiconductor equipment parts, which comprises a pickling tank, wherein a fixing frame is fixedly connected to the side wall of the pickling tank, an installation plate is fixedly connected to the side wall of the fixing frame, a pickling mechanism is installed on the installation plate and comprises a rod a rotatably connected to the side wall of the installation plate, a motor is fixedly connected to the side wall of the installation plate, the output end of the motor penetrates through the side wall of the installation plate and is fixedly connected with the rod a, a rod b is fixedly connected to the side wall of the rod a, a rod c is fixedly connected to the side wall of the rod b, a rod d is rotatably connected to the side wall of the rod c, a fixing block is fixedly connected to the lower end of the rod d, and a placing frame is fixedly connected to the side wall of the fixing block. The pickling mechanism in the invention enables the diodes in the placing frame to be continuously overturned, avoids the problem that the diodes are stacked together and cannot be fully contacted with pickling solution, so that the pickling effect is not ideal, and the pickling efficiency and effect are improved.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment processing, in particular to a pickling device for processing semiconductor equipment parts.
Background
The semiconductor is a material with the conductivity between a conductor and an insulator at normal temperature, and is widely applied to radio, television and temperature measurement, the diode is a common semiconductor device, dirt, oil stain, rust and the like may adhere to the surface of the diode in the production process, and the surface of the diode needs to be pickled to remove impurities on the surface of the diode.
When the existing diode is subjected to acid washing, the diode is usually placed in an acid washing tank and is soaked in acid washing liquid in a standing mode, the acid washing efficiency and the acid washing effect of the diode in the acid washing liquid in the standing mode are low, and the diode stacking part cannot effectively contact the acid washing liquid due to the fact that a plurality of diodes are stacked together, the diode cannot be sufficiently subjected to acid washing, and the acid washing effect is poor.
Based on this, we propose a pickling device for processing semiconductor equipment parts.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a pickling device for processing semiconductor equipment parts.
In order to achieve the purpose, the invention adopts the following technical scheme:
a pickling device for processing parts of semiconductor equipment comprises a pickling tank, wherein the side wall of the pickling tank is fixedly connected with a fixing frame, the side wall of the fixing frame is fixedly connected with a mounting plate, a pickling mechanism is arranged on the mounting plate and comprises a rod a which is rotatably connected with the side wall of the mounting plate, the side wall of the mounting plate is fixedly connected with a motor, the output end of the motor penetrates through the side wall of the mounting plate and is fixedly connected with the rod a, the side wall of the rod a is fixedly connected with a rod b, the side wall of the rod b is fixedly connected with a rod c, the side wall of the rod c is rotatably connected with a rod d, the lower end of the rod d is fixedly connected with a fixing block, the side wall of the fixing block is fixedly connected with a placing frame, the inner wall of the placing frame is provided with a plurality of liquid inlet holes, the side wall of the mounting plate is fixedly connected with a rod f, the side wall of the rod f is rotatably connected with a rod e, the rod d is arranged for penetrating through the rod e, just pole d lateral wall and pole e sliding connection, install pump liquid edulcoration mechanism on the descaling box, pump liquid edulcoration mechanism is including offering at the feed liquor groove I of descaling box lower extreme, a plurality of imbibition holes have been seted up at I interior top of feed liquor groove, and is a plurality of solenoid valve I is all installed to imbibition downthehole wall, I inner wall fixedly connected with filter screen in feed liquor groove.
Further, pump liquid edulcoration mechanism still includes the gasbag of fixed connection at the fixed block lateral wall, the gasbag other end and pickling tank inner wall fixed connection, the gasbag passes through pipette and I intercommunication in feed liquor groove, place the frame lateral wall and seted up feed liquor groove II, a plurality of hydrojet holes have been seted up to II inner walls in feed liquor groove, the gasbag passes through drain pipe and II intercommunications in feed liquor groove.
Furthermore, check valves are arranged on the inner walls of the liquid suction pipe and the liquid outlet pipe, and the check valves are arranged on the inner walls of the liquid spraying holes.
Further, install on the pickling case and carry out clear clean mechanism to the filter screen, clean mechanism includes the collecting box of fixed connection at the pickling case lower extreme, feed liquor groove I is through arranging miscellaneous pipe and collecting box intercommunication, arrange miscellaneous intraductal wall and install solenoid valve II.
Further, clean mechanism still includes that the symmetry sets up two recesses in the pickling tank, two recess inner wall sliding connection has two magnetism slides, two pole g of magnetism slide lateral wall fixedly connected with, two pole g one end runs through in recess inner wall extends to feed liquor groove I and common fixedly connected with faller, the faller is close to a plurality of thimbles of lateral wall fixedly connected with of filter screen, a plurality of springs of recess inner wall fixedly connected with, it is a plurality of the spring other end all with magnetism slide lateral wall fixed connection, recess inner wall fixedly connected with electro-magnet.
Further, pole b upper end fixedly connected with arc conducting block, mounting panel lateral wall symmetry fixedly connected with busbar I and busbar II, solenoid valve I and I electric connection of busbar, solenoid valve II and I and II equal electric connection of busbar, the electro-magnet and I and II equal electric connection of busbar.
Furthermore, conducting strip I and conducting strip II all are the arcwall form.
The invention has the following beneficial effects:
1. by arranging the pickling mechanism, the driving motor rotates clockwise, so that the placing frame can shake up and down while swinging left and right, the pickling mechanism is similar to a pot turning during cooking, the diodes in the placing frame can be turned up continuously, the situation that the diodes are stacked together and cannot be fully contacted with pickling solution in each part is avoided, the pickling effect is not ideal, in addition, the diodes continuously move in the pickling solution, the diodes and the pickling solution can continuously move to generate friction, the dirt and rust on the surfaces of the diodes can be washed away, and the pickling efficiency and effect are improved;
2. through the arrangement of the pump liquid impurity removal mechanism, in the pickling process, pickling liquid in a pickling tank intermittently enters the liquid inlet tank I through the liquid suction hole, the fixed block moves left and right to stretch and extrude the air bag continuously, the pickling liquid is continuously pumped out and then enters the pickling tank under the action of the air bag, and as the pickling liquid is filtered by the filter screen before entering the air bag, solid impurities in the pickling liquid can be intercepted by the filter screen, so that the pickling liquid entering the pickling tank again is filtered, the pickling liquid can be slowly filtered and recycled in the whole pickling process, the pickling effect can be effectively improved, the pickling liquid can be recycled, and the waste of the pickling liquid is avoided;
3. by arranging the pump liquid impurity removal mechanism, when the pickling liquid in the liquid inlet tank II is sprayed out through the liquid spraying holes, a water flow which flows transversely can be formed on the placing frame, the diode can be washed again, impurities such as dirt, rust and the like on the surface of the diode can be washed away, and the pickling effect is improved;
4. through setting up clean mechanism, when the gasbag is to II interior pump pickle in feed liquor groove, electro-magnet and solenoid valve II all cut off the power supply this moment, the electro-magnet outage does not possess magnetism, the magnetism slide can move right under the effect of spring for faller and filter screen laminating, thimble on the faller can pass the filter screen mesh, it is ejecting with the impurity of the interior jam of filter screen mesh, impurity falls into through the row miscellaneous pipe and collects to the collection incasement, thereby avoid the filter screen to be blockked up by impurity, make filter screen filtering quality descend, also block up the pickle simultaneously and get into in the gasbag.
Drawings
FIG. 1 is a schematic structural diagram of a pickling apparatus for processing semiconductor device parts according to the present invention;
FIG. 2 is a schematic cross-sectional view of the structure of FIG. 1 taken along line A-A;
FIG. 3 is an enlarged schematic view of the structure at B in FIG. 1;
FIG. 4 is an enlarged schematic view of the structure at C in FIG. 1;
FIG. 5 is an enlarged schematic view of the structure of FIG. 1 at D;
fig. 6 is a schematic diagram of the structures of the conductive strips i and ii in fig. 1.
In the figure: 1 pickling box, 2 fixing frames, 3 mounting plates, 4 rods a, 5 motors, 6 rods b, 7 rods c, 8 rods d, 9 fixing blocks, 10 placing frames, 11 liquid inlet holes, 12 rods f, 13 rods e, 14 liquid inlet grooves I, 15 liquid suction holes, 16 electromagnetic valves I, 17 filter screens, 18 air bags, 19 liquid suction pipes, 20 liquid inlet grooves II, 21 liquid spraying holes, 22 liquid outlet pipes, 23 collecting boxes, 24 impurity discharging pipes, 25 electromagnetic valves II, 26 grooves, 27 magnetic sliding plates, 28 rods g, 29 needle plates, 30 springs, 31 electromagnets, 32 arc-shaped conductive blocks, 33I and 34 conductive strips II.
Detailed Description
Referring to fig. 1-6, a pickling device for processing semiconductor equipment parts comprises a pickling tank 1, wherein support columns are symmetrically and fixedly connected to the lower end of the pickling tank 1, the lower end of each support column is fixedly connected with the ground through an expansion screw, a fixing frame 2 is fixedly connected to the side wall of the pickling tank 1, a mounting plate 3 is fixedly connected to the side wall of the fixing frame 2, a pickling mechanism is mounted on the mounting plate 3, the pickling mechanism comprises a rod a4 rotatably connected to the side wall of the mounting plate 3, a motor 5 is fixedly connected to the side wall of the mounting plate 3, the output end of the motor 5 penetrates through the side wall of the mounting plate 3 and is fixedly connected with a rod a4, a rod b6 is fixedly connected to the side wall of a4, a rod c7 is fixedly connected to the side wall of a rod b6, a rod d8 is rotatably connected to the side wall of a rod c7, a fixing block 9 is fixedly connected to the lower end of the rod d8, a placing frame 10 is fixedly connected to the side wall of the fixing block 9, a plurality of liquid inlet holes 11 are formed in the inner wall of the placing frame 10, 3 lateral walls fixedly connected with poles f12 of mounting panel, pole f12 lateral wall rotates and is connected with pole e13, pole d8 is for running through pole e13 setting, and pole d8 lateral wall and pole e13 sliding connection, install pump liquid edulcoration mechanism on the descaling box 1, pump liquid edulcoration mechanism is including offering at the feed liquor groove I14 of 1 lower extreme of descaling box, a plurality of imbibition holes 15 have been seted up at the top in feed liquor groove I14, solenoid valve I16 is all installed to a plurality of imbibition hole 15 inner walls, I14 inner wall fixedly connected with filter screen 17 in feed liquor groove.
It should be noted that the solenoid valve i 16 is opened when it is energized, and closed when it is de-energized.
Further, driving motor 5 rotates clockwise, drive pole a4 rotates clockwise, and then pole a4 drives pole d8 through pole b6 and pole c7 and reciprocates, and under the restriction of pole e13, pole d8 still can act on the arc-shaped swing, make and place frame 10 horizontal hunting while can shake from top to bottom, be similar to the pot tossing when frying dish, make and place the diode in the frame 10 and can be constantly tossed, avoid the diode to stack together each other and can't each part be abundant with the pickle contact, cause the pickling effect unsatisfactory, in addition the diode constantly removes in the pickle, can make the continuous mutual displacement of diode and pickle produce the friction, be more favorable to the dirt on diode surface, for washing down, improve the efficiency and the rust effect of pickling.
The liquid impurity removing mechanism of the pump further comprises an air bag 18 fixedly connected to the side wall of the fixing block 9, the air bag 18 is made of acid-resistant materials, the other end of the air bag 18 is fixedly connected with the inner wall of the pickling box 1, the air bag 18 is communicated with the liquid inlet groove I14 through a liquid suction pipe 19, a liquid inlet groove II 20 is formed in the side wall of the placing frame 10, a plurality of liquid spraying holes 21 are formed in the inner wall of the liquid inlet groove II 20, and the air bag 18 is communicated with the liquid inlet groove II 20 through a liquid outlet pipe 22.
Check valves are installed on the inner walls of the liquid suction pipe 19 and the liquid discharge pipe 22, and check valves are installed on the inner walls of the liquid spray holes 21, it should be noted that the check valves installed on the inner walls of the liquid suction pipe 19 only allow pickling liquid in the liquid inlet groove I14 to enter the air bag 18, the check valves installed on the inner walls of the liquid discharge pipe 22 only allow pickling liquid in the air bag 18 to enter the liquid inlet groove II 20, and the check valves installed on the inner walls of the liquid spray holes 21 only allow pickling liquid in the liquid inlet groove II 20 to enter the placement frame 10.
It should be noted that the bottom in the liquid inlet tank i 14 is arranged obliquely, so that the pickling solution in the liquid inlet tank i 14 can flow towards one end of the pipette 19, the pickling solution in the liquid inlet tank i 14 can be basically sucked away by the pipette 19, and the residue of the pickling solution in the liquid inlet tank i 14 is reduced.
Further, in the pickling process, the pickling solution in the pickling tank 1 intermittently enters the liquid inlet tank I14 through the solution sucking hole 15, the fixed block 9 moves left and right to continuously stretch and extrude the air bag 18, under the action of the air bag 18, the pickling solution in the liquid inlet tank I14 can be sucked into the air bag 18, the pickling solution in the air bag 18 is squeezed into the liquid inlet groove II 20, then the pickling solution enters the pickling tank 1 again through the liquid spraying hole 21, because the pickling solution in the liquid inlet tank I14 is filtered by the filter screen 17 before entering the air bag 18, solid impurities in the pickling solution are intercepted by the filter screen 17, so that the pickling solution which enters the pickling tank 1 again is filtered, the pickling solution can be slowly filtered and recycled in the whole pickling process, the pickling effect can be effectively improved, the pickling solution can be recycled, and the waste of the pickling solution is avoided.
It is worth mentioning that when the pickling solution in the liquid inlet tank II 20 is sprayed out through the liquid spraying holes 21, a water flow flowing transversely is formed on the placing frame 10, so that the diode can be washed again, impurities such as dirt and rust on the surface of the diode can be washed away, and the pickling effect is improved.
Install on pickling case 1 and carry out clear clean mechanism to filter screen 17, clean mechanism includes fixed connection at the collecting box 23 of 1 lower extreme of pickling case, and feed liquor groove I14 is through arranging miscellaneous pipe 24 and collecting box 23 intercommunication, arranges miscellaneous pipe 24 inner wall and installs solenoid valve II 25, and II 25 circular telegrams of solenoid valve then close, and the outage is then opened.
Cleaning mechanism still sets up two recesses 26 in pickling tank 1 including the symmetry, two recess 26 inner wall sliding connection have two magnetism slides 27, two magnetism slides 27 lateral wall fixedly connected with two poles g28, two poles g28 one end run through in recess 26 inner wall extends to feed liquor groove I14 and common fixedly connected with faller 29, faller 29 is close to a plurality of thimbles of lateral wall fixedly connected with of filter screen 17, and a plurality of thimbles set up with the mesh one-to-one on the filter screen 17 respectively, a plurality of springs 30 of recess 26 inner wall fixedly connected with, a plurality of springs 30 other ends all with magnetism slide 27 lateral wall fixed connection, recess 26 inner wall fixedly connected with electro-magnet 31.
The upper end of the rod b6 is fixedly connected with the arc-shaped conductive block 32, the side walls of the mounting plate 3 are symmetrically and fixedly connected with a conductive strip i 33 and a conductive strip ii 34, it should be noted that the distance between the side walls of the lower ends of the conductive strips i 33 and ii 34 is slightly greater than the length of the arc-shaped conductive block 32, so that the arc-shaped conductive block 32 can be immediately contacted with the conductive strip ii 34 when leaving the conductive strip i 33, but the arc-shaped conductive block 32 cannot be simultaneously contacted with the conductive strip i 33 and ii 34, the solenoid valve i 16 is electrically connected with the conductive strip i 33, the solenoid valve ii 25 is electrically connected with the conductive strips i 33 and ii 34, the electromagnet 31 is electrically connected with the conductive strips i 33 and ii 34, and the conductive strips i 33 and ii 34 are both arc-shaped.
Further, when the air bag 18 sucks the pickling solution in the liquid inlet tank I14, the electromagnet 31 and the electromagnetic valve II 25 are electrified, the magnetic sliding plate 27 moves to the left end of the groove 26 under the magnetic action of the electromagnet 31, so that the needle plate 29 cannot be attached to the filter screen 17, the needle plate 29 cannot block the filter screen 17, the electromagnetic valve II 25 is electrified and closed, the pickling solution in the liquid inlet tank I14 cannot flow into the collecting tank 23 through the impurity discharging pipe 24, when the air bag 18 pumps the pickling solution into the liquid inlet tank II 20, the electromagnet 31 and the electromagnetic valve II 25 are both powered off, the electromagnet 31 is powered off and does not have magnetism, the magnetic sliding plate 27 moves rightwards under the action of the spring 30 to drive the needle plate 29 to move rightwards, the needle plate 29 is attached to the filter screen 17, a thimble on the needle plate 29 penetrates through meshes of the filter screen 17 to eject the impurities blocked in the meshes of the filter screen 17, the impurities fall into the collecting tank 23 through the impurity discharging pipe 24 to be collected, thereby avoiding the filter screen 17 from being blocked by impurities, reducing the filtering performance of the filter screen 17 and simultaneously blocking the pickling solution from entering the air bag 18.
In the invention, all diodes needing pickling are placed in a placing frame 10, then pickling solution is injected into a pickling tank 1, then a driving motor 5 rotates clockwise to drive a rod a4 to rotate clockwise and a rod b6 to rotate clockwise, a rod c7 is driven to do circular motion by taking the circle center of the rod a4 as the center, under the limitation of a rod e13, a rod d8 is further driven to move up and down and swing left and right, a rod e13 swings up and down along with the rod d8, the rod d8 drives the placing frame 10 to swing left and right through a fixing block 9 and simultaneously shakes up and down in an arc shape, the operation is similar to the operation of turning a pot during frying, the diodes in the placing frame 10 can be turned up and down to avoid stacking of the diodes, all parts of the diodes can be fully contacted with the pickling solution, the pickling solution inlet effect is improved, and the pickling solution can come and go back from a hole 11 in the moving process of the placing frame 10, therefore, the fluidity of the pickling solution is increased, the pickling solution can form a scouring effect between the diodes, the surface of the diodes is conveniently corroded, dirt is washed away, the pickling effect is enhanced, and the pickling efficiency is improved.
When the rod d8 drives the placing frame 10 to move through the fixed block 9, the fixed block 9 swings left and right to continuously stretch and extrude the air bag 18, when the rod b6 rotates to the lower half circle, at this time, the fixed block 9 continuously stretches the air bag 18 in the whole rotation process of the lower half circle, and when the rod b6 just rotates to the lower half circle, the arc-shaped conductive block 32 starts to contact with the conductive strip I33, at this time, the electromagnetic valve I16 is powered on and opened, the electromagnetic valve II 25 is powered on and closed, the electromagnet 31 is powered on and has magnetism, under the magnetic attraction effect, the magnetic sliding plate 27 slides leftwards into the groove 26 to drive the needle plate 29 to slide leftwards, so that the needle plate 29 cannot be attached to the filter screen 17, the pickling solution in the pickling tank 1 enters the liquid inlet tank I14 through the pickling liquid hole 15, and the air bag 18 is in a stretched state, the pickling solution in the tank I14 is sucked into the air bag 18 through the pickling liquid inlet 19, before the pickling solution is sucked into the air bag 18 through the pipette 19, the pickling solution flows through the filter screen 17, the filter screen 17 intercepts solid impurities in the pickling solution, so that the pickling solution is filtered, when the rod a4 drives the arc-shaped conductive block 32 to rotate for 90 degrees in the lower half circle, the arc-shaped conductive block 32 does not contact with the conductive strip I33 any more and immediately contacts with the conductive strip II 34, the electromagnetic valve I16 is powered off and closed, the electromagnetic valve II 25 is still in the powered-on closed state, the electromagnet 31 is still powered on and has magnetism, so that the needle plate 29 cannot be attached to the filter screen 17, when the rod b6 drives the arc-shaped conductive block 32 to continue to rotate in the lower half circle, the residual pickling solution in the liquid inlet tank I14 is continuously sucked into the air bag 18 through the pipette 19, and when the rod b6 drives the arc-shaped conductive block 32 to rotate for more than 180 degrees and no more than the conductive strip II 34, at this time, all the pickling solution in the liquid inlet tank I14 is sucked into the air bag 18, and solenoid valve II 25 outage is opened this moment, and electro-magnet 31 also can cut off the power supply and lose magnetism, and magnetism slide 27 can slide right at recess 26 inner wall under the effect of spring 30, drives faller 29 and slides right for faller 29 and filter screen 17 laminating, the thimble on faller 29 can pass the mesh of filter screen 17, ejecting with the solid impurity that blocks up in the filter screen 17 mesh, fall into collection box 23 in through arranging miscellaneous pipe 24, clean filter screen 17, avoid blocking up impurity in the filter screen 17 mesh, influence filter screen 17's filtration performance.
When pole b6 rotated 180 degrees at last half-turn, whole in-process pole d8 can drive the continuous extrusion gasbag 18 of fixed block 9, the pickle in the gasbag 18 can be through the continuous quilt of drain pipe 22 crowded into in feed liquor groove II 20, then the pickle in cistern II 20 can enter into the descaling box 1 again through spouting liquid hole 21, make the pickle can reuse after filtration treatment, avoid the waste of pickle, the pickle is spout from spouting liquid hole 21 in addition, can form the rivers of lateral flow in placing frame 10, can wash once more the diode surface, with the dirt on diode surface, impurity such as corrosion washes cleanly, the effect of further promotion pickling.
Claims (7)
1. The utility model provides a pickling device is used in processing of semiconductor equipment spare part, includes pickling tank (1), its characterized in that, pickling tank (1) lateral wall fixedly connected with mount (2), mount (2) lateral wall fixedly connected with mounting panel (3), install pickling mechanism on mounting panel (3), pickling mechanism is including rotating pole a (4) of connecting at mounting panel (3) lateral wall, mounting panel (3) lateral wall fixedly connected with motor (5), motor (5) output run through mounting panel (3) lateral wall and with pole a (4) fixed connection, pole an (4) lateral wall fixedly connected with pole b (6), pole b (6) lateral wall fixedly connected with pole c (7), pole c (7) lateral wall rotates and is connected with pole d (8), pole d (8) lower extreme fixedly connected with fixed block (9), fixed block (9) lateral wall fixedly connected with places frame (10), place frame (10) inner wall and seted up a plurality of feed liquor holes (11), mounting panel (3) lateral wall fixedly connected with pole f (12), pole f (12) lateral wall rotates and is connected with pole e (13), pole d (8) set up for running through pole e (13), just pole d (8) lateral wall and pole e (13) sliding connection, install pump liquid edulcoration mechanism on descaling box (1), pump liquid edulcoration mechanism is including offering at feed liquor groove I (14) of descaling box (1) lower extreme, a plurality of imbibition holes (15) have been seted up at feed liquor groove I (14) interior top, and are a plurality of solenoid valve I (16) are all installed to imbibition hole (15) inner wall, feed liquor groove I (14) inner wall fixedly connected with filter screen (17).
2. The pickling device for processing the semiconductor equipment parts as claimed in claim 1, wherein the pump liquid impurity removing mechanism further comprises an air bag (18) fixedly connected to the side wall of the fixing block (9), the other end of the air bag (18) is fixedly connected with the inner wall of the pickling tank (1), the air bag (18) is communicated with the liquid inlet groove I (14) through a liquid suction pipe (19), the side wall of the placing frame (10) is provided with a liquid inlet groove II (20), the inner wall of the liquid inlet groove II (20) is provided with a plurality of liquid spraying holes (21), and the air bag (18) is communicated with the liquid inlet groove II (20) through a liquid outlet pipe (22).
3. The pickling apparatus for processing semiconductor device components according to claim 2, wherein check valves are installed on inner walls of the liquid suction pipe (19) and the liquid discharge pipe (22), and check valves are installed on inner walls of the plurality of liquid discharge holes (21).
4. The pickling device for processing the semiconductor equipment parts as claimed in claim 3, wherein the pickling tank (1) is provided with a cleaning mechanism for cleaning the filter screen (17), the cleaning mechanism comprises a collecting box (23) fixedly connected to the lower end of the pickling tank (1), the liquid inlet tank I (14) is communicated with the collecting box (23) through a waste discharge pipe (24), and the inner wall of the waste discharge pipe (24) is provided with an electromagnetic valve II (25).
5. The pickling apparatus for processing of semiconductor device parts as recited in claim 4, the cleaning mechanism further comprises two grooves (26) symmetrically arranged in the pickling tank (1), two magnetic sliding plates (27) are connected to the inner walls of the two grooves (26) in a sliding manner, two rods g (28) are fixedly connected to the side walls of the two magnetic sliding plates (27), one ends of the two rods g (28) penetrate through the inner walls of the grooves (26) and extend into the liquid inlet groove I (14) and are fixedly connected with a needle plate (29) together, a plurality of thimbles are fixedly connected on the side wall of the needle plate (29) close to the filter screen (17), the groove is characterized in that a plurality of springs (30) are fixedly connected to the inner wall of the groove (26), the other ends of the springs (30) are fixedly connected with the side wall of the magnetic sliding plate (27), and electromagnets (31) are fixedly connected to the inner wall of the groove (26).
6. The pickling device for processing the semiconductor equipment parts as claimed in claim 5, wherein the upper end of the rod b (6) is fixedly connected with an arc-shaped conductive block (32), the side wall of the mounting plate (3) is symmetrically and fixedly connected with a conductive bar I (33) and a conductive bar II (34), the electromagnetic valve I (16) is electrically connected with the conductive bar I (33), the electromagnetic valve II (25) is electrically connected with the conductive bar I (33) and the conductive bar II (34), and the electromagnet (31) is electrically connected with the conductive bar I (33) and the conductive bar II (34).
7. The pickling device for processing of semiconductor device components as claimed in claim 6, wherein each of the conductive strips I (33) and II (34) is arc-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210970006.6A CN115041455A (en) | 2022-08-12 | 2022-08-12 | Pickling unit is used in processing of semiconductor equipment spare part |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210970006.6A CN115041455A (en) | 2022-08-12 | 2022-08-12 | Pickling unit is used in processing of semiconductor equipment spare part |
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| CN115041455A true CN115041455A (en) | 2022-09-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210970006.6A Pending CN115041455A (en) | 2022-08-12 | 2022-08-12 | Pickling unit is used in processing of semiconductor equipment spare part |
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| CN112376062A (en) * | 2020-11-13 | 2021-02-19 | 湖南菱瑞新材料科技有限公司 | A acid dip pickle for metal surface treatment usefulness |
| CN215696232U (en) * | 2021-08-12 | 2022-02-01 | 江苏泰亚再生资源有限公司 | Waste steel part recycling and cleaning device for automobile recycling |
| CN114535198A (en) * | 2022-04-26 | 2022-05-27 | 潍坊市工程技师学院 | Machine part belt cleaning device |
| CN114823435A (en) * | 2022-06-29 | 2022-07-29 | 南通莱欧电子科技有限公司 | Diode pickling equipment for semiconductor electronic device production |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106823547A (en) * | 2017-03-11 | 2017-06-13 | 江西省科学院 | A kind of sewage water filtration environmental protecting device |
| CN108550540A (en) * | 2018-05-21 | 2018-09-18 | 李慧 | A kind of diode pickling processing system |
| CN112376062A (en) * | 2020-11-13 | 2021-02-19 | 湖南菱瑞新材料科技有限公司 | A acid dip pickle for metal surface treatment usefulness |
| CN215696232U (en) * | 2021-08-12 | 2022-02-01 | 江苏泰亚再生资源有限公司 | Waste steel part recycling and cleaning device for automobile recycling |
| CN114535198A (en) * | 2022-04-26 | 2022-05-27 | 潍坊市工程技师学院 | Machine part belt cleaning device |
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Application publication date: 20220913 |
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