CN115027103A - Low-frequency sound absorption structure in electronic product and preparation method thereof - Google Patents
Low-frequency sound absorption structure in electronic product and preparation method thereof Download PDFInfo
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- CN115027103A CN115027103A CN202210542789.8A CN202210542789A CN115027103A CN 115027103 A CN115027103 A CN 115027103A CN 202210542789 A CN202210542789 A CN 202210542789A CN 115027103 A CN115027103 A CN 115027103A
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Abstract
The invention discloses a low-frequency sound absorption structure in an electronic product and a preparation method thereof, wherein the preparation method comprises the following steps: step S1, dissolving a polymer for preparing electrostatic spinning into deionized water, adding a solvent, and stirring to obtain a spinning solution; step S2, performing electrostatic spinning on the base layer by using the spinning solution to form a nanofiber membrane on the base layer as an electrostatic spinning layer; step S3, performing nano vacuum coating on the sound absorption inner layer obtained in the step S2, and plating a waterproof and oilproof coating on all surfaces of the sound absorption inner layer; step S4, baking the process element obtained in the step S3; and S5, cooling the process element obtained in the step S4 to a set temperature to obtain the low-frequency sound absorption structure in the medium electronic product. The low-frequency sound absorption structure in the electronic product and the preparation method thereof can reduce the low-frequency noise reduction of the electronic product and reduce the environmental pollution. The invention helps to reduce wind noise.
Description
Technical Field
The invention belongs to the technical field of noise processing, relates to a sound absorption structure, and particularly relates to a low-frequency sound absorption structure in an electronic product and a preparation method thereof.
Background
In the world, noise pollution not only becomes one of four pollution sources in the world, but also seriously affects the life and emotion of people and harms the physical and psychological health of people; sound absorbers are increasingly used to reduce environmental and domestic noise.
In daily life, household appliances using a motor, such as washing machines, refrigerators, range hoods, juicers, and the like, are noisy due to vibration of the motor; and noise due to sound leakage from sound-producing products, such as televisions, cell phones, VR, AR, etc.
In the conventional electronic products, foam is generally used as a sound absorbing material to achieve the effect of reducing noise. When sound is transmitted into the surface of the foam material, a portion of the sound energy is reflected, a portion penetrates the material, and a portion of the sound energy is converted from the sound energy into heat energy due to the vibration of the foam or the friction between the surrounding medium as the sound propagates through the material, and the sound energy is lost, i.e., the sound is absorbed by the material.
However, the high frequency sound absorption effect of the material is good, but the noise frequency of the electronic product is generally between 100Hz to 4000 Hz at the medium and low frequency, and the audible frequency of human ears is 300-3400 Hz.
The foam has poor sound absorption effect at medium and low frequency; meanwhile, the material is easy to damage and absorb moisture, and is easy to cause corrosion and short circuit of electronic products.
In view of the above, there is a need to design a new noise processing method to overcome at least some of the above-mentioned disadvantages of the existing noise processing methods.
Disclosure of Invention
The invention provides a low-and-medium frequency sound absorption structure of an electronic product and a preparation method thereof, which can reduce the low-and-medium frequency noise reduction of the electronic product and reduce the environmental pollution.
In order to solve the technical problem, according to one aspect of the invention, the following technical scheme is adopted:
a low-frequency sound absorption structure in an electronic product comprises a substrate layer and an electrostatic spinning layer, wherein the electrostatic spinning layer is arranged on one side of the substrate layer to form a sound insulation inner layer; the periphery of the sound insulation inner layer is plated with a nanometer coating layer.
As an embodiment of the present invention, the middle and low frequency sound absorbing structure has a rectangular parallelepiped shape.
As an embodiment of the present invention, the electrospun layer is disposed above the base layer; the upper side, the lower side, the left side and the right side of the sound insulation inner layer are respectively surrounded by the nano coating layers.
As an embodiment of the present invention, the substrate layer is a foam layer or a spun layer or a polyester layer or a nonwoven layer.
As an embodiment of the present invention, the substrate layer is a polyurethane foam layer.
As an embodiment of the present invention, the layer of electrospun is a layer of polymeric material.
As an embodiment of the present invention, the polymer material layer is a polyvinylidene fluoride material layer.
In one embodiment of the present invention, the nano-coating layer is a nanofiber material layer.
In one embodiment of the present invention, the thickness of the substrate layer is 1mm to 2m, the thickness of the electrostatic spinning layer is 0.1mm to 1m, and the thickness of the nano-coating layer is 10 to 200 μm.
According to one aspect of the invention, the following technical scheme is adopted: a preparation method of the low-frequency sound absorption structure in the electronic product comprises the following steps:
step S1, dissolving a polymer for preparing electrostatic spinning into deionized water, adding a solvent, and stirring to obtain a spinning solution;
step S2, performing electrostatic spinning on the base layer by using the spinning solution to form a nanofiber membrane on the base layer as an electrostatic spinning layer;
step S3, performing nano vacuum coating on the sound absorption inner layer obtained in the step S2, and plating a waterproof and oilproof coating on all surfaces of the sound absorption inner layer;
step S4, baking the process element obtained in the step S3;
and S5, cooling the process element obtained in the step S4 to a set temperature to obtain the low-frequency sound absorption structure in the medium electronic product.
In step S3, the sound absorption inner layer obtained in step S2 is placed in a sealed steam environment, and is chemically reacted on all contact surfaces by plasma discharge to form a nano vacuum coating film, and all surfaces of the sound absorption inner layer are coated with a water-and oil-repellent coating.
As an embodiment of the present invention, in step S1, the solvent includes N, N-dimethylformamide solvent;
as an embodiment of the present invention, in step S2, the electrostatic spinning voltage is set to 12 to 15kV, and the PVDF solution concentration of the spinning solution is set to 10% to 12%; the base layer is a polyurethane cotton layer, the thickness of the polyurethane cotton layer is 1mm-2m, and the flow resistance range of the polyurethane cotton layer is 10MKS Rayls-100000MKS Rayls.
The invention has the beneficial effects that: the low-and-medium frequency sound absorption structure of the electronic product and the preparation method thereof can reduce the low-and-medium frequency noise reduction of the electronic product and reduce the environmental pollution. Meanwhile, wind noise generally occurs at low frequency and is normally 200-500 Hz, and the method is beneficial to reducing the wind noise.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a low-frequency sound absorption structure in an electronic product according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a low-frequency sound absorption structure in an electronic product according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a test result of a sound insulation effect of the sound absorption structure according to an embodiment of the present invention.
FIG. 4 is a graphical representation of the results of testing the acoustic impedance of the sound absorbing structure in one embodiment of the present invention.
FIG. 5 is a schematic view under a microscope of a surface of a sound absorbing structure in an embodiment of the present invention.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
For a further understanding of the invention, reference will now be made to the preferred embodiments of the invention by way of example, and it is to be understood that the description is intended to further illustrate features and advantages of the invention, and not to limit the scope of the claims.
The description in this section is for several exemplary embodiments only, and the present invention is not limited only to the scope of the embodiments described. It is within the scope of the present disclosure and protection that the same or similar prior art means and some features of the embodiments may be interchanged.
The term "connected" in the specification includes both direct connection and indirect connection.
The invention discloses a low-frequency sound absorption structure in an electronic product, and fig. 2 is a schematic structural diagram of the low-frequency sound absorption structure in the electronic product in one embodiment of the invention; referring to fig. 2, the middle and low frequency sound absorption structure includes a substrate layer (which may be formed of a foam material and is used as a foam layer 1), and an electrostatic spinning layer 2, where the electrostatic spinning layer 2 is disposed on one side of the foam layer 1 to form a sound insulation inner layer; the periphery of the sound insulation inner layer is plated with a nanometer coating layer 3. Of course, the substrate layer may also be a spun layer, and the material of the spun layer may be the same as (or different from) the electrospun layer 2; or a polyester layer or a nonwoven layer.
In an embodiment of the present invention, the middle and low frequency sound absorbing structure has a rectangular parallelepiped shape. The electrostatic spinning layer 2 is arranged above the foam layer 1; the upper part, the lower part, the left side and the right side of the sound insulation inner layer are respectively surrounded by the nano film coating layer 3.
In an embodiment of the present invention, the foam layer 1 is a polyurethane foam layer, the electrostatic spinning layer 2 is a polymer material layer, the polymer material layer is a polyvinylidene fluoride material layer, and the nano coating layer 3 is a nano fiber material layer. In one embodiment, the foam layer 1 has a thickness of 1mm to 2m, the electrostatic spinning layer 2 has a thickness of 0.1mm to 1m, and the nano coating layer 3 has a thickness of 50 nm.
The thickness of the low-frequency sound absorption and noise reduction material in the electronic product is 1mm-2m, the thickness of the polymer fiber is 0.1 mm-1 m, and the thickness of the nanofiber of the vacuum coating is 50 nm.
The materials used in the electrostatic spinning can include polymers such as PVDF polyvinylidene fluoride and the like, the molecular weight MW is 260000-550000, N, N-Dimethylformamide (DMF) is used as analytical pure, deionized water is self-prepared in a laboratory, and the carrier is a polyurethane cotton plate with the thickness of 1 mm.
The polymer material may be polyvinylidene fluoride (PVDF), but also polyvinylidene fluoride-co-hexafluoropropylene, perfluoropolymer, polyvinyl chloride or polyvinylidene chloride and copolymers thereof, polyether ketone, polyether imide, polytetrafluoroethylene, polyurethane may be used. The foam may include at least one of PU foam, antistatic foam, conductive foam, EPE, antistatic EPE, CR, EVA, bridging PE, SBR, EPDM, etc. The foam material can be polyurethane, ethylene-vinyl acetate copolymer, polyethylene, chloroprene rubber, styrene butadiene rubber, and the like.
The waterproof contact angle of the metamaterial is greatly improved from 80 without the waterproof coating to 158 degrees, the corn oil contact angle is improved from 60 degrees to 143 degrees, and the test equipment is German Kruss and is model number DA 30S. The surface of the metamaterial was observed using a scanning electron microscope model Apreo C of Saimer Feishel, Inc. as shown in FIG. 5.
The invention further discloses a method for manufacturing the low-frequency sound absorption structure in the electronic product, and fig. 1 is a flow chart of the method for manufacturing the low-frequency sound absorption structure in the electronic product in one embodiment of the invention; referring to fig. 1, the preparation method includes:
[ step S1 ] the polymer for preparing electrostatic spinning is dissolved in deionized water, and a solvent is added and stirred to obtain a spinning solution.
In one embodiment, the polymer may comprise polyvinylidene fluoride (PVDF), and may further comprise poly (vinylidene fluoride-co-hexafluoropropylene), perfluoropolymers, polyvinyl chloride or polyvinylidene chloride and copolymers thereof, polyetherketones, polyetherimides, polytetrafluoroethylene, polyurethanes. The solvent comprises N, N-dimethylformamide solvent; the stirring mode can be magnetic stirring, motor stirring and the like.
In step S2, the spinning solution is used to perform electrostatic spinning on the foundation layer, so that a nanofiber film is formed on the foundation layer as an electrostatic spinning layer. The substrate layer can be made of foam materials or/and spinning materials and used as a foam layer or/and a spinning layer.
The material of the foam layer can comprise PU foam, antistatic foam, conductive foam, EPE, antistatic EPE, CR, EVA, bridging PE, SBR, EPDM and the like. The foam material may be polyurethane, ethylene-vinyl acetate copolymer, polyethylene, chloroprene rubber, styrene butadiene rubber, or the like.
In addition, the electrostatic spinning voltage can be set to be 12-15kV, the concentration of the PVDF solution of the spinning solution can be set to be 10% -12%, the thickness of the polyurethane cotton layer can be set to be 1mm-2m, and the Flow resistance range of the polyurethane cotton layer is 10MKS Rays-100000 MKS Rays (Nanjing Acoustic Flow technology Sound Flow, model number is SF-AR-06200K).
And (S3) performing nano vacuum coating on the sound absorption inner layer obtained in the step S2, and coating a waterproof and oilproof coating on all surfaces of the sound absorption inner layer. In one embodiment, the sound absorption inner layer obtained in step S2 is placed in a sealed steam environment, and a chemical reaction occurs on all contact surfaces of the sound absorption inner layer through plasma discharge, so as to form a nano vacuum coating, and all surfaces of the sound absorption inner layer are coated with a water-proof and oil-proof coating.
Step S4, the process piece obtained in step S3 is baked (baking temperature may be set to 80 ℃, and baking place may be in the baking tunnel).
And (S5) cooling the process piece obtained in the step S4 to a set temperature to obtain the low-frequency sound absorption structure in the medium electronic product.
In an embodiment, the process piece obtained in step S4 may be placed to room temperature in a ten-thousand-level clean workshop, and the sound absorption coefficient may be measured online without damage, so as to obtain the electroacoustic metamaterial.
According to the sound insulation quality law, the noise reduction effect of the medium and low frequency material is improved, and the surface density, the quality and the thickness of the material are required to be enhanced. This patent is through carrying out the electrostatic spinning of polymers such as polyvinylidene fluoride on polyurethane foam, increases quality and thickness to carry out nanometer vacuum coating at the skin, improve surface density. Meanwhile, after the metamaterial is heated through the drying tunnel, the metamaterial naturally shrinks, and the electrostatic spinning layer is tensioned to reduce the acoustic reactance rate of the metamaterial. With the increase of the mass, the sound absorption characteristic frequency of the metamaterial is moved from high frequency to low frequency, namely the sound absorption is submerged to medium and low frequency, and a new vibration mode is generated; after the electrostatic spinning layer is tensioned, the noise reduction and insulation quantity far higher than the mass law can be realized by utilizing the anti-common vibration characteristic and the opposite vibration displacement of the center and the periphery, so that the excellent sound absorption and noise reduction effect is generated.
Introduction of sound insulation quality law:
where ω is the angular frequency, ρ is the density of the material, D is the thickness of the material, ρ 0 Is the density of air, c 0 Is the speed of sound. When rho D is doubled, the noise reduction and sound insulation quantity can be improved by 6 dB. Therefore, the sound insulation and noise reduction effects can be improved by improving the surface density, thickness and quality of physical indexes.
Measurement of sound insulation at specific frequencies:
for example: under the condition of sound input of 94dB at 200Hz, the compression ratio of the sample is 40% +/-4% when the sample is transmitted along the cylindrical surface direction of the sample, and the air sound isolation amount is more than 23 dB.
Based on ASTM E1050-19, ISO 10534-2:1998E and GB/T18696-2:2002 test standards and relevant extensions of industrial application thereof, acoustic transmission line theory is adopted to carry out acoustic transmission loss test on the sample to be tested. The test equipment uses an impedance tube of Nanjing Sound Flow technology Sound Flow, and the model is SFIT-STL-5020K.
The test procedure was as follows:
the first step is as follows: the input signal is a single-frequency sinusoidal signal, the frequency is 200Hz, and the output power is 94 dB.
The second step is that: the input signal is a broadband acoustic excitation signal (100Hz-3kHz), and the output power is 94 dB.
The measurement results are shown in fig. 3 and table 1.
Sample (I) | Thickness of | Sound insulation effect |
No.1 | 50cm | 23.2dB |
No.2 | 60cm | 24.8dB |
Table 1 sound insulation effect test results table
wherein, alpha is sound absorption coefficient, Rr sound resistivity, R i Acoustic reactance rate. The sound absorption coefficient can be improved by reducing the sound resistance rate, namely the sound absorption and noise reduction effects are improved; as can be seen in fig. 4. The acoustic impedance of the material is measured by using an impedance tube of Sound Flow technology of Nanjing, with the model of SFIT-MAI-1010K.
In summary, the low-medium frequency sound absorption structure of the electronic product and the preparation method thereof provided by the invention can reduce the low-medium frequency noise reduction of the electronic product and reduce the environmental pollution. Meanwhile, wind noise generally occurs at low frequency and is normally 200-500 Hz, and the method is beneficial to reducing the wind noise.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The description and applications of the invention herein are illustrative and are not intended to limit the scope of the invention to the embodiments described above. Effects or advantages referred to in the embodiments may not be reflected in the embodiments due to interference of various factors, and the description of the effects or advantages is not intended to limit the embodiments. Variations and modifications of the embodiments disclosed herein are possible, and alternative and equivalent various components of the embodiments will be apparent to those skilled in the art. It will be clear to those skilled in the art that the present invention may be embodied in other forms, structures, arrangements, proportions, and with other components, materials, and parts, without departing from the spirit or essential characteristics thereof. Other variations and modifications of the embodiments disclosed herein may be made without departing from the scope and spirit of the invention.
Claims (10)
1. The middle-low frequency sound absorption structure of the electronic product is characterized by comprising a substrate layer and an electrostatic spinning layer, wherein the electrostatic spinning layer is arranged on one side of the substrate layer to form a sound absorption inner layer; and a nano coating layer is plated on the periphery of the sound absorption inner layer.
2. The low frequency sound absorbing structure in an electronic product according to claim 1, wherein:
the middle and low frequency sound absorption structure is cuboid.
3. The low frequency sound absorbing structure in an electronic product according to claim 2, wherein:
the electrostatic spinning layer is arranged above the substrate layer; the upper side, the lower side, the left side and the right side of the sound insulation inner layer are respectively surrounded by the nano coating layers.
4. The low frequency sound absorbing structure in an electronic product according to claim 1, wherein:
the substrate layer is a foam layer or a spinning layer or a polyester layer or a non-woven fabric layer.
5. The low frequency sound absorbing structure in an electronic product according to claim 4, wherein:
the foam layer is a polyurethane foam layer; the electrostatic spinning layer is a polymer material layer, and the polymer material layer is a polyvinylidene fluoride material layer; the nano coating layer is a nano fiber material layer.
6. The low frequency sound absorbing structure in an electronic product according to claim 1, wherein:
the thickness of the substrate layer is 1mm-2m, the thickness of the electrostatic spinning layer is 0.1 mm-1 m, and the thickness of the nano coating layer is 10-200 mu m.
7. A method for preparing a low-frequency sound absorbing structure in an electronic product according to any one of claims 1 to 6, wherein the method comprises:
step S1, dissolving a polymer for preparing electrostatic spinning into deionized water, adding a solvent, and stirring to obtain a spinning solution;
step S2, performing electrostatic spinning on the base layer by using the spinning solution to form a nanofiber membrane on the base layer as an electrostatic spinning layer;
step S3, performing nano vacuum coating on the sound absorption inner layer obtained in the step S2, and plating a waterproof and oilproof coating on all surfaces of the sound absorption inner layer;
step S4, baking the process element obtained in the step S3;
and S5, cooling the process element obtained in the step S4 to a set temperature to obtain the low-frequency sound absorption structure in the medium electronic product.
8. The method for producing according to claim 7, characterized in that:
in step S3, the sound absorption inner layer obtained in step S2 is placed in a sealed steam environment, and chemical reaction occurs on all contact surfaces thereof through plasma discharge, so that a nano vacuum coating film is formed, and all surfaces of the sound absorption inner layer are coated with a water-proof and oil-proof coating.
9. The method of claim 7, wherein:
in step S1, the solvent includes N, N-dimethylformamide solvent.
10. The method of claim 7, wherein:
in the step S2, the electrostatic spinning voltage is set to be 12-15kV, and the concentration of the PVDF solution of the spinning solution is set to be 10% -12%; the substrate layer is a polyurethane foam layer, the thickness of the polyurethane foam layer is 1mm-2m, and the flow resistance range of the polyurethane foam layer is 10MKS Rayls-100000MKS Rayls.
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US20170200441A1 (en) * | 2016-03-30 | 2017-07-13 | Maryam Mohammadi Gojani | Sound absorbing structure including nanofibers |
CN108749235A (en) * | 2018-05-06 | 2018-11-06 | 李磊 | A kind of super-hydrophobic sound-absorbing needling non-woven composite material for weaving of polytetrafluoroethylene (PTFE) interlayer and preparation method thereof |
CN210459820U (en) * | 2019-04-29 | 2020-05-05 | 广州俊麒无纺布企业有限公司 | Sound insulation non-woven fabric |
CN111519263A (en) * | 2020-04-23 | 2020-08-11 | 东华大学 | Light medium-low frequency sound absorption material and preparation method thereof |
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US20170200441A1 (en) * | 2016-03-30 | 2017-07-13 | Maryam Mohammadi Gojani | Sound absorbing structure including nanofibers |
CN108749235A (en) * | 2018-05-06 | 2018-11-06 | 李磊 | A kind of super-hydrophobic sound-absorbing needling non-woven composite material for weaving of polytetrafluoroethylene (PTFE) interlayer and preparation method thereof |
CN210459820U (en) * | 2019-04-29 | 2020-05-05 | 广州俊麒无纺布企业有限公司 | Sound insulation non-woven fabric |
CN111519263A (en) * | 2020-04-23 | 2020-08-11 | 东华大学 | Light medium-low frequency sound absorption material and preparation method thereof |
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