CN115022433B

CN115022433B - Camera module and terminal equipment

Info

Publication number: CN115022433B
Application number: CN202210824794.8A
Authority: CN
Inventors: 吴东; 朱凯翔; 时龙飞; 梁峰
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-07-14
Filing date: 2022-07-14
Publication date: 2022-12-23
Anticipated expiration: 2042-07-14
Also published as: CN115022433A

Abstract

The application provides a camera module and terminal equipment. The camera module comprises a circuit substrate, a camera, a connecting element and a grounding element. The circuit substrate comprises a first end and a second end, the first end is close to a target antenna on the terminal equipment, and the second end is far away from the target antenna. The connecting element is arranged on the circuit substrate and is close to the second end. The camera is electrically connected with a main board in the terminal equipment through the circuit substrate and the connecting element. The grounding element is arranged on the circuit substrate and positioned between the first end of the circuit substrate and the connecting element, and the grounding element is also electrically connected with the substrate ground of the circuit substrate and the mainboard ground of the mainboard respectively. According to the camera module, the grounding element is additionally arranged between the connecting element and the first end of the circuit substrate, so that efficient decoupling between the camera module and a target antenna can be realized, the problem of interference of the camera module is effectively solved, and a user obtains better shooting experience.

Description

Camera module and terminal equipment

Technical Field

The application relates to the technical field of terminals, in particular to a camera module and terminal equipment.

Background

With the continuous development of electronic technology, users have more and more functional requirements and communication requirements for terminal devices (such as smart phones, tablet computers, and the like), and have higher and higher performance requirements. In order to meet various requirements and requirements of users, functions loaded on the terminal device are increasing, in this case, the layout of the antenna is becoming denser, and in the limited space of the terminal device, the problem of electromagnetic interference caused by the antenna also becomes an important factor affecting the relevant functions and performance of the terminal device. Among them, the problem of electromagnetic interference caused by the antenna to the camera module is more and more frequent. For example, the distance between the camera on the mobile phone and the antenna is very close, and when the antenna works, the antenna can generate electromagnetic interference to the camera, so that the phenomena of screen splash, screen blockage, screen freezing and the like can occur when the camera is used for previewing, photographing, video calling and the like, and the use experience of a user is seriously influenced.

Disclosure of Invention

The application provides a camera module and terminal equipment can realize high-efficient decoupling zero between the antenna on camera module and the terminal equipment to solve effectively the disturbed problem of camera module.

In a first aspect, the present application provides a camera module including a circuit board, a camera, a connecting element, and a grounding element. The circuit substrate comprises a substrate ground, a first end and a second end, wherein the first end is close to a target antenna on a terminal device, and the second end is far away from the target antenna. The camera is arranged on the circuit substrate. The connecting element is arranged on the circuit substrate and is close to the second end. The connecting element is also used for being electrically connected with a main board in the terminal equipment, and the camera is electrically connected with the main board through the circuit substrate and the connecting element. The grounding element is arranged on the circuit substrate and electrically connected with the substrate of the circuit substrate. The grounding element is also used for electrically connecting with a main board of the main board. Wherein the grounding element is located between the first end of the circuit substrate and the connecting element.

The utility model provides a camera module is through connecting element with increase between circuit substrate's the first end ground element makes circuit substrate's first end extremely structure between the ground element forms the microstrip antenna of a 1/4 wavelength mode, can realize the camera module with high-efficient decoupling zero between the target antenna of near any frequency channel of first end to solved effectively the disturbed problem of camera module makes the user obtain better shooting experience.

In an embodiment, a length from the ground element to the first end is outside a range of one quarter of a wavelength corresponding to an operating frequency band of the target antenna, so that a resonant frequency band of the microstrip antenna and the operating frequency band of the target antenna are not overlapped, and a condition of electric field coupling between the microstrip antenna and the target antenna is destroyed, thereby preventing electric field coupling between the camera module and the target antenna.

In one embodiment, the length of the ground element to the first end is within a quarter of a wavelength corresponding to an operating frequency band of the target antenna. The grounding element is used for guiding the induction current to a mainboard ground of the mainboard when the camera module is coupled with the target antenna in an electric field manner and generates induction current on the camera module, so that the induction current is prevented from being coupled to MIPI signals generated by the camera module to interfere with the MIPI signals received by the mainboard. Therefore, under the condition that electric field coupling is generated between the micro-strip antenna and the target antenna cannot be damaged, the current strong point of the micro-strip antenna can be transferred to the position of the grounding element, so that a resonant field is limited on one side, away from the connecting element, of the grounding element, induced current generated on the micro-strip antenna is guided to a mainboard ground of a mainboard by the newly-added grounding element and is released out before reaching the connecting element, the purposes of weakening the induced current entering an MIPI (mobile industry processor interface) line of the camera module and improving the isolation between the MIPI line and the target antenna are achieved, and electromagnetic interference of the target antenna on the camera module can be eliminated or reduced.

In one embodiment, the grounding element includes a plurality of first grounding pins and a plurality of second grounding pins, and the plurality of first grounding pins are arranged side by side on the circuit substrate and electrically connected with the substrate of the circuit substrate. The plurality of second grounding pins are arranged on the mainboard side by side and are electrically connected with the mainboard of the mainboard. The plurality of first grounding pins and the plurality of second grounding pins are electrically connected in a one-to-one correspondence manner.

In an embodiment, two adjacent first ground pins are spaced apart from each other, and two adjacent second ground pins are spaced apart from each other, so that a routing space can be reserved for a transmission line corresponding to a pin of the connecting element on the surface layer of the circuit substrate and the surface layer of the motherboard, the surface layer of the circuit substrate can route the pin of the connecting element between the two adjacent first ground pins, and similarly, the surface layer of the motherboard can also route the pin of the connecting element between the two adjacent second ground pins, so that the routing space between the circuit substrate and the motherboard can be increased.

Optionally, the plurality of first ground pins are continuously arranged on the circuit substrate, and the plurality of second ground pins are continuously arranged on the main board, so that the resonance field is limited on one side of the ground element far away from the connecting element, and the anti-interference capability of the camera module is improved.

In one embodiment, the grounding element includes a spring, one end of the spring is electrically connected to the substrate of the circuit substrate, and the other end of the spring is electrically connected to the main board of the main board.

Optionally, the ground element includes a plurality of conductive pillars, one end of each conductive pillar is electrically connected to the substrate of the circuit substrate, and the other end of each conductive pillar is electrically connected to the motherboard of the motherboard.

In one embodiment, the circuit board includes a first substrate, a second substrate and a third substrate electrically connected in sequence, the camera is disposed on the first substrate, and the connecting element and the grounding element are both disposed on the third substrate. The first substrate and the third substrate are hard circuit boards, and the second substrate is a flexible substrate electrically connected between the first substrate and the third substrate. One end of the first substrate, which is far away from the second substrate, is a first end of the circuit substrate, and one end of the third substrate, which is far away from the second substrate, is a second end of the circuit substrate.

In one embodiment, the third substrate includes an extension portion extending in a direction toward the second substrate, and the ground element is disposed on the extension portion.

In one embodiment, the circuit substrate includes a first side and a second side opposite to each other, wherein the camera is located on the first side of the circuit substrate, and the connecting element and the grounding element are located on the second side of the circuit substrate.

In one embodiment, the connecting element includes a first connector and a second connector, wherein the first connector is disposed on the circuit substrate and electrically connected to the camera head. The second connector is arranged on the mainboard, and the camera is electrically connected with the mainboard through the first connector and the second connector. The first connector and the second connector are both board-to-board connectors. Therefore, the first connector and the second connector can be conveniently plugged and unplugged, and when the first connector and the second connector are plugged together, the camera can be electrically connected with the mainboard.

In a second aspect, the present application provides a terminal device, where the terminal device includes a middle frame, an antenna, a main board, and the camera module according to the first aspect. The antenna is arranged on the middle frame, the mainboard is fixed on the middle frame, and the circuit substrate of the camera module is fixed on the middle frame or above the mainboard. The first end of the circuit substrate is close to the antenna, and the second end of the circuit substrate is far away from the antenna.

In one embodiment, the antenna is disposed at an end of the middle frame and is located at a top end of the terminal device. The camera that the camera module includes is leading camera.

Compare with the required ground connection modes such as subsides conductive cloth, conductive bubble cotton of traditional anti-interference scheme of camera module, what the camera module that this application provided is the anti-interference scheme of mechanism's aspect in earlier stage, both can save terminal equipment's inner space can avoid producing again that the radiation is stray the scheduling problem. In addition, the anti-interference scheme of camera module that this application provided is applicable to the high-efficient decoupling zero between leading camera or rear camera on the terminal equipment and the target antenna, and does not have the defect of frequency band restriction, can solve effectively the disturbed problem of camera module.

Drawings

In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that for a person skilled in the art, other drawings can be derived from these drawings without inventive effort.

Fig. 1 is a schematic front-side structure diagram of a part of a terminal device according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a part of the internal structure of the terminal device shown in fig. 1.

Fig. 3 is a schematic diagram of another perspective of a part of the internal structure of the terminal device shown in fig. 1.

Fig. 4 is a functional block diagram of the terminal device shown in fig. 1.

Fig. 5 is a schematic partial structural view of a camera module according to a first embodiment of the present application.

Fig. 6 is a schematic structural diagram of the circuit substrate shown in fig. 5 from another view angle.

Fig. 7 is a schematic diagram illustrating the principle of coupling the camera module shown in fig. 5 with the antenna on the top of the terminal device.

Fig. 8 is a simulation diagram of the distribution of induced currents generated by the camera module shown in fig. 5 at a certain time.

Fig. 9 is a schematic diagram of a simulation curve of the coupling degrees between four MIPI lines included in the camera module shown in fig. 5 and a target antenna.

Fig. 10 is a schematic partial structural view of a camera module according to a second embodiment of the present application.

Fig. 11 is an exploded view of the camera module shown in fig. 10.

Fig. 12 is a schematic structural diagram of the circuit substrate shown in fig. 10 from another viewing angle.

Fig. 13 is a schematic diagram illustrating the principle of coupling the camera module shown in fig. 10 with the antenna on the top of the terminal device.

Fig. 14 is a simulation curve diagram of coupling degrees between four MIPI lines included in the camera module shown in fig. 10 and a target antenna.

Fig. 15 is a schematic partial structural view of a camera module according to a third embodiment of the present application.

Fig. 16 is a simulation curve diagram of the coupling degrees between four MIPI lines included in the camera module shown in fig. 15 and a target antenna.

Fig. 17 is a schematic partial structural view of a camera module according to a fourth embodiment of the present application.

Description of the main elements

Terminal device	1000
		Front camera	11
Display screen	12
		Middle frame	13
Antenna with a shield	14
		Main board	15
Processor with a memory having a plurality of memory cells	16
		Memory device	17
Camera module	201、202、203、204
		Camera head	21
Circuit board	22
		First end	22a
Second end	22b
		First substrate	221
Second substrate	222
		Third substrate	223
Extension part	2231
		Connecting element	23
First connector	231
		Second connector	232
Grounding element	24
		First grounding pin	241
Second grounding pin	242
		Target antenna	AN0
Microstrip antenna	AN1、AN2

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The drawings are for illustration purposes only and are merely schematic representations, not intended to limit the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Fig. 1 exemplarily illustrates a partial front structure diagram of a terminal device 1000 provided by an embodiment of the present application. The terminal device 1000 includes but is not limited to an electronic apparatus such as a smart phone, a tablet computer, a wearable device, and the like. The terminal device 1000 has photographing and displaying functions, and accordingly, as shown in fig. 1, the terminal device 1000 includes a front camera 11, a rear camera (not shown), and a display 12.

The terminal device 1000 further includes a middle frame 13 and a rear cover (not shown), wherein the middle frame 13 is used as a "skeleton" of the terminal device 1000, and is used for bearing and fixing other structures of the terminal device 1000, such as the front camera 11 and the display 12. The front camera 11 and the display screen 12 are located on the same side of the middle frame 13. It can be understood that an opening may be disposed on the display screen 12 corresponding to the front camera 11, and the front camera 11 may collect the ambient light signal for imaging through the opening. The rear cover can be fixedly connected with the middle frame 13 to enclose a containing cavity for loading the internal structure of the terminal device 1000.

As shown in fig. 2 and fig. 3, the terminal device 1000 further includes a camera module 201 and a main board 15, where the camera module 201 includes a camera 21 and a circuit board 22, and the camera 21 is disposed on the circuit board 22. The main board 15 may be fixed to the middle frame 13, and the circuit board 22 may be fixed above the middle frame 13 or the main board 15. In some embodiments, a supporting medium may be disposed between the circuit substrate 22 and the middle frame 13 or the main board 15, for example, a fixing bracket or a dielectric substrate made of a non-conductive material is disposed, or an insulating medium is filled, so as to fix the circuit substrate 22 to the middle frame 13 or the main board 15 through the supporting medium.

The terminal device 1000 further has a wireless communication function, and accordingly, the terminal device 1000 further includes a plurality of antennas. Under the condition that the terminal device 1000 is loaded with more and more functions, in the limited space of the terminal device 1000, the layout of the antennas is more and more dense, and the problem of electromagnetic interference caused by the antennas also becomes an important factor affecting the relevant functions and performance of the terminal device 1000. Wherein, the problem that the camera 21 is disturbed by the transmission and reception of signals by the antenna on the terminal device 1000 is more and more frequent.

The camera 21 (for example, a front camera or a rear camera) on the terminal device 1000 generally uses a Mobile Industry Processor Interface specification (MIPI) Interface to implement communication connection with the motherboard 15. Since the camera 21 is usually very close to the target antenna on the terminal device 1000, for example, a front camera, as shown in fig. 1, the front camera 11 is usually close to the top of the terminal device 1000, and an antenna 14 is usually disposed on a middle frame 13 on the top of the terminal device 1000, so that the front camera 11 is very close to the antenna 14 on the top of the terminal device 1000, for example, the distance between the front camera 11 and the antenna 14 is usually within 2 mm. When antenna 14 during operation, antenna 14 with produce extremely strong electric field coupling effect easily between the leading camera 11, the electromagnetic wave signal that antenna 14 radiated can be in the form loading of noise on the MIPI line of leading camera 11 to lead to the user to use phenomenons such as the flower screen can appear in leading camera 11 preview, take a picture, video conversation, the card is pause, or freeze the screen, has seriously influenced user's use experience. At present, the problem of interference on a front camera caused by an antenna on terminal equipment is one of the problems of the highest frequency in the anti-interference work of the current terminal equipment.

In this embodiment, taking the camera 21 as the front camera 11 of the terminal device 1000, and taking the target antenna as the antenna 14 which is arranged at the end of the middle frame 13 and located at the top end of the terminal device 1000 as an example, the interference and interference rejection principles of the camera 21 are analyzed and introduced. It should be noted that the structure of the antenna 14 shown in fig. 1 to 3 is a radiator or a conductor structure of the antenna 14 for radiating signals, and a part of the structure of the middle frame 13 may be directly used as a radiator, or a conductor structure may be attached to the middle frame 13 as a radiator. In other embodiments, the camera 21 may also be a rear camera of the terminal device 1000, and the target antenna may also be another antenna located at another position of the terminal device 1000 and close to the camera 21.

It is understood that fig. 1-3 only schematically illustrate some of the structural components included in the terminal device 1000, the actual configuration and location of the structural components are not limited by fig. 1-3, and the terminal device 1000 may actually have more or less structural components than those illustrated in fig. 1-3, for example, as shown in fig. 4, and the terminal device 1000 further includes electronic components such as the processor 16, the memory 17, and the like. The processor 16 and the memory 17 may be disposed on the main board 15, and the processor 16 is configured to process related data signals and control the operation of the camera 21. For example, the processor 16 may send a clock signal to the camera 21 to provide a corresponding clock signal to the camera 21. The processor 16 is further configured to receive image data generated by the camera 21 and perform corresponding image processing. The processor 16 may also send the processed image data to the display 12 for display or to the memory 17 for storage.

Referring to fig. 3 and 5, the circuit substrate 22 includes a first end 22a and a second end 22b, wherein the first end 22a is close to a target antenna (e.g., the antenna 14) on the terminal device 1000, and the second end 22b is far from the target antenna. The camera 21 is provided at a position close to the first end 22a of the circuit board 22.

In the first embodiment, the camera module 201 further includes a connecting element 23, and the connecting element 23 is disposed on the circuit substrate 22 and is close to the second end 22b of the circuit substrate 22. The connecting element 23 is electrically connected to the circuit board 22 and is used for electrically connecting to the main board 15 in the terminal device 1000. The camera 21 is electrically connected to the main board 15 via the circuit board 22 and the connecting member 23.

The circuit substrate 22 includes a first side and a second side opposite to each other, in the first embodiment, the camera 21 is located on the first side of the circuit substrate 22, and the connecting element 23 is located on the second side of the circuit substrate 22. That is, the camera 21 and the connection member 23 face in opposite directions, respectively, for example, the camera 21 faces the outside of the terminal apparatus 1000 to capture a picture to be photographed. The connecting element 23 faces the inside of the terminal device 1000, so as to be electrically connected to a main board 15 disposed inside the terminal device 1000, thereby achieving the electrical connection between the camera 21 and the main board 15, so as to control the camera 21 through a processor 16 on the main board 15, for example, control the camera 21 to take a picture or record a video, and receive image data transmitted by the camera 21. In other embodiments, the camera 21 and the connecting element 23 may be located on the same side of the circuit substrate 22.

The circuit board 22 further includes a first substrate 221, a second substrate 222, and a third substrate 223 electrically connected in sequence, the camera 21 is disposed on the first substrate 221, and the connection element 23 is disposed on the third substrate 223. The first substrate 221 and the third substrate 223 are rigid circuit boards, and the second substrate 222 is a flexible substrate electrically connected between the first substrate 221 and the third substrate 223. In the first embodiment, an end of the first substrate 221 away from the second substrate 222 is a first end 22a of the circuit substrate 22, and an end of the third substrate 223 away from the second substrate 222 is a second end 22b of the circuit substrate 22.

Referring to fig. 5 and fig. 6, the connecting element 23 includes a first connector 231 and a second connector 232, wherein the first connector 231 is disposed on the third substrate 223 of the circuit substrate 22 and electrically connected to the camera 21. The second connector 232 is disposed on the main board 15. In the first embodiment, the first connector 231 and the second connector 232 are board-to-board connectors and each includes a plurality of pins. Therefore, the first connector 231 and the second connector 232 can be conveniently connected by plugging, and when the first connector 231 and the second connector 232 are plugged together, the camera 21 can be electrically connected with the main board 15 through the circuit substrate 22, the first connector 231 and the second connector 232.

As described above, the camera typically uses an MIPI interface to implement a communication connection with the motherboard, and accordingly, the plurality of pins of the first connector 231 and the second connector 232 may correspond to a plurality of MIPI lines, such as a power line, a ground line, a clock line, a data line, and the like. The first connector 231 and the second connector 232 are used for transmitting MIPI signals between the camera 21 and the main board 15.

The coupling principle between the camera module 201 and the target antenna AN0 (e.g. the antenna 14 at the top of the terminal device 1000) will be described in detail below.

As shown in fig. 7, since the whole of the camera module 201 is a metal body, and is disposed above the main board 15, the connecting element 23 is connected between the circuit board 22 and the main board 15, and is in a low impedance state; the first end 22a of the circuit substrate 22 is open and in a high impedance state. Therefore, a resonant cavity is formed between the camera module 201 and the main board 15, the camera module 201 is substantially equivalent to a receiver or a receiving branch of a 1/4 wavelength mode microstrip antenna AN1, wherein a connection point between the connection element 23 and the circuit substrate 22 constitutes a short-circuit end/a ground return end of the microstrip antenna AN1, the first end 22a of the circuit substrate 22 constitutes AN open-circuit end of the microstrip antenna AN1, and a length from the first end 22a of the circuit substrate 22 to the connection element 23 is equal to a wavelength λ of a resonant frequency of the microstrip antenna AN1 ₁ One fourth of (a).

Since the camera module 201 is very close to the target antenna AN0, for example, within 2mm, and the resonance frequency band of the microstrip antenna AN1 equivalent to the camera module 201 at least partially overlaps with the working frequency band of the target antenna AN0, that is, the length from the first end 22a of the circuit substrate 22 to the connecting element 23 falls within the wavelength λ of the working frequency band of the target antenna AN0 ₀ When the target antenna AN0 operates, the microstrip antenna AN1 is coupled with the target antenna AN0 by AN electric field, so that the microstrip antenna AN1 is arranged in the target antenna AN0A resonant field is formed in the resonant cavity formed between the main board 15 and the microstrip antenna AN1, and AN induced current is generated. That is, the camera module 201 is essentially a microstrip antenna mode with a 1/4 wavelength as a disturbed physical mode. Fig. 8 is a schematic diagram illustrating AN induced current generated on the microstrip antenna AN1 at a certain time when the microstrip antenna AN1 and the target antenna AN0 generate electric field coupling.

In the first embodiment, AN example is that the working frequency band of the target antenna AN0 is located near a 3.5GHz frequency band, where the 3.5GHz frequency band may also be understood as a disturbed frequency band or a resonant frequency band of the camera module 201. Fig. 9 is a schematic diagram of a simulation curve of the coupling degree between the four MIPI lines L1 to L4 included in the camera module 201 shown in fig. 5 and the target antenna AN 0. For example, a high-frequency clock signal generated by the processor 16 disposed on the motherboard 15 may be transmitted to the camera 21 through the MIPI clock line, a high-frequency pixel clock signal generated by the camera 21 may be transmitted to the processor 16 through the MIPI clock line, and a data signal generated by the camera 21 may be transmitted to the processor 16 through the MIPI data line.

As shown in fig. 9, in the vicinity of the operating frequency band 3.5GHz of the target antenna AN0, for example, in the range of 3.3GHz to 3.8ghz, the coupling degree of the first MIPI line L1 is lower than the coupling degrees of the remaining three MIPI lines, and the coupling degree of the fourth MIPI line L4 is higher than the coupling degrees of the remaining three MIPI lines. Specifically, the coupling degree of the first MIPI line L1 ranges from minus 34.7dB to minus 30.1dB, and the coupling degree of the fourth MIPI line L4 ranges from minus 27dB to minus 22.9dB. It can be seen that the coupling of the 4 MIPI lines L1-L4 is high, which also reflects that the isolation between the 4 MIPI lines L1-L4 and the target antenna AN0 is poor. In this case, the MIPI signal transmitted to the motherboard 15 by the camera module 201 may be interfered by a stronger electromagnetic wave signal, which may cause the phenomenon of screen splash, screen blockage, screen freezing, etc. on the shot picture of the camera 21 displayed on the terminal device 1000.

Due to the limited space on the terminal device 1000 and the increasing demands of users for large screens, thin profiles, etc., it is obviously impossible for the front camera 11 to want to eliminate the electromagnetic interference of the antenna 14 to the front camera 11 by increasing the distance between the antenna 14 and the front camera 11.

The traditional method is to lay conductive cloth or conductive foam or point silver paste and other means at the later stage to solve the related disturbed problem of the front camera 11, and the protection scheme at the earlier stage mechanism level is lacked. Moreover, the anti-interference effect brought by the conductive cloth laying mode depends on the design condition of the antenna 14 to a great extent, and once clutter exists on the front-facing camera 11, the effect of laying the conductive cloth is greatly reduced, and only a method of sacrificing communication experience such as reducing power can be adopted. In addition, due to the non-linear impedance problem of the pasted conductive cloth at the electrical connection, there is a risk of generating Radiation Stray (RSE), which will cause the product not to conform to the related test index at the quality inspection stage. The method of laying the conductive foam can increase the overall thickness and volume of the terminal device 1000, or the working height of the conductive foam can not meet the relevant requirements. The use of the silver paste increases the cost of the terminal device 1000. It can be seen that the solutions for post-stage interference rejection of the camera adopted in the prior art all have many disadvantages, and for the camera 21, especially for the front camera 11, the key to solve the problem of the related interference of the camera is to decouple the antenna 14 from the front camera 11, that is, to improve the isolation between the MIPI data line, MIPI clock line, and the like in the front camera 11 and the antenna 14.

In order to achieve the decoupling between the camera module 201 and the target antenna AN0, as shown in fig. 10, a second embodiment of the present application provides a camera module 202, where the structure of the camera module 202 shown in fig. 10 is similar to that of the camera module 201 shown in fig. 5, except that: the camera module 202 shown in fig. 10 further includes a grounding element 24, the grounding element 24 is disposed on the circuit substrate 22 and electrically connected to the substrate of the circuit substrate 22, and the grounding element 24 is further used for electrically connecting to the main board of the main board 15. Wherein the grounding element 24 is located between the first end 22a of the circuit substrate 22 and the connecting element 23, that is, the grounding element 24 is located on the side of the connecting element 23 close to the first end 22a, and the distance between the grounding element 24 and the first end 22a is smaller than the distance between the connecting element 23 and the first end 22 a. It should be noted that "substrate ground" referred to in the present application refers to the ground layer of the circuit substrate 22, and "motherboard ground" refers to the ground layer of the motherboard 15.

In the second embodiment, the connecting element 23 and the grounding element 24 are located on the same side of the circuit substrate 22, i.e. both are located on the second side of the circuit substrate 22.

Referring to fig. 10 to 12, the connecting element 23 and the grounding element 24 are disposed on the third substrate 223. Specifically, the third substrate 223 includes an extension part 2231 extending toward the second substrate 222, and the grounding element 24 is disposed on the extension part 2231. The width of the extension 2231 may be, for example, 0.2 to 0.6mm, and the width of the extension 2231 is not limited in the second embodiment.

The ground element 24 includes a plurality of first ground pins 241 and a plurality of second ground pins 242, and the plurality of first ground pins 241 are arranged side by side on the circuit substrate 22 and electrically connected to the substrate of the circuit substrate 22. Specifically, the plurality of first ground pins 241 are arranged side by side on the extension part 2231 of the third substrate 223 and electrically connected to the ground layer of the third substrate 223. The plurality of second ground pins 242 are disposed side by side on the motherboard 15 and electrically connected to the motherboard of the motherboard 15. The plurality of first ground pins 241 and the plurality of second ground pins 242 are electrically connected in a one-to-one correspondence. For example, in the camera module 202 shown in fig. 11 and 12, the plurality of first ground pins 241 includes 12 ground pin male heads disposed side by side on the extension portion 2231 of the third substrate 223, and the plurality of second ground pins 242 includes 12 ground pin female heads disposed side by side on the motherboard 15, that is, the ground element 24 includes 12 pairs of ground pins in total, and the ground pin male heads are engaged with the corresponding ground pin female heads to achieve electrical connection therebetween. The number of the first ground pins 241 and the second ground pins 242 is not particularly limited.

In the second embodiment, the first connector 231 and the second connector 232 of the connecting element 23 each include two rows of pins, and the arrangement direction of the pins in each row is perpendicular to the length extension direction of the circuit substrate 22. The plurality of first ground pins 241 of the ground element 24 are arranged in a row, and the arrangement direction is perpendicular to the length extension direction of the circuit substrate 22; accordingly, the plurality of second ground pins 242 of the ground element 24 are arranged in a row, and the arrangement direction is perpendicular to the length extension direction of the circuit substrate 22.

In the second embodiment, the plurality of first ground pins 241 are continuously arranged on the circuit substrate 22, and the plurality of second ground pins 242 are continuously arranged on the main board 15. It should be noted that the "continuous arrangement" mentioned in the present application means that the ground pins are densely arranged on the circuit substrate 22 or the main board 15.

In one embodiment, the length from the grounding element 24 to the first end 22a is at a wavelength λ corresponding to the operating frequency band of the target antenna AN0 ₀ Is not included in the range of one-fourth, so as to avoid the electric field coupling between the camera module 202 and the target antenna AN 0.

In another embodiment, the length from the grounding element 24 to the first end 22a is at a wavelength λ corresponding to the operating frequency band of the target antenna AN0 ₀ Within a quarter of (a). The grounding element 24 is configured to guide the induced current to a motherboard ground of the motherboard 15 when the camera module 202 and the target antenna AN0 generate electric field coupling and induced current is generated on the camera module 202, so as to release the induced current to the motherboard ground, so as to prevent the induced current from being coupled to the MIPI signal generated by the camera module 202 and interfering with the MIPI signal received by the motherboard 15, and further eliminate electromagnetic interference of the target antenna AN0 on the camera module 202.

The decoupling principle between the camera module 202 and the target antenna AN0 is described in detail below.

Referring to fig. 10 and 13, the first end 22a of the circuit substrate 22 is open-circuited, the connection portion between the circuit substrate 22 and the grounding element 24 is connected to the main board ground of the main board 15 through the grounding element 24, so that a resonant cavity is formed between the structure from the first end 22a of the circuit substrate 22 to the grounding element 24 and the main board 15, the structure from the first end 22a of the circuit substrate 22 to the grounding element 24 is substantially equivalent to a receiving body or a receiving branch of a 1/4 wavelength mode microstrip antenna AN2, wherein the connection portion between the grounding element 24 and the circuit substrate 22 forms a ground return end of the microstrip antenna AN2, the first end 22a of the circuit substrate 22 forms AN open-circuited end of the microstrip antenna AN2, and the length from the first end 22a of the circuit substrate 22 to the grounding element 24 is equal to the wavelength λ of the resonant frequency of the microstrip antenna AN2 ₂ One quarter of (a).

If the length from the grounding element 24 to the first end 22a is within the wavelength λ corresponding to the working frequency band of the target antenna AN0 ₀ Is out of the range of one quarter, the resonance frequency band of the microstrip antenna AN2 does not overlap with the working frequency band of the target antenna AN 0. At this time, although the camera module 202 is very close to the target antenna AN0, for example, within 2mm, the condition of electric field coupling between the microstrip antenna AN2 and the target antenna AN0 is not satisfied. When the target antenna AN0 works, the microstrip antenna AN2 does not generate electric field coupling with the target antenna AN0, so that a resonance field is not formed in a resonance cavity formed between the microstrip antenna AN2 and the main board 15, and AN induced current is not generated on the microstrip antenna AN 2. However, it can be understood that if the length of the grounding element 24 to the first end 22a is increased to be larger than the wavelength λ corresponding to the working frequency band of the target antenna AN0 ₀ One fourth of the above, the camera module 202 needs to occupy a large space inside the terminal device 1000, and the inside of the terminal device 1000 may not provide enough space. If it isShortening the length from the grounding element 24 to the first end 22a to be less than the wavelength λ corresponding to the working frequency band of the target antenna AN0 ₀ One fourth of (a), it may be difficult to meet the design requirements of the camera module 202 itself. That is, in practical applications, it may be difficult to make the length from the grounding element 24 to the first end 22a to be the wavelength λ corresponding to the operating frequency band of the target antenna AN0 ₀ Is used to prevent the microstrip antenna AN2 from electric field coupling with the target antenna AN 0.

If the length from the grounding element 24 to the first end 22a is within the wavelength λ of the working frequency band of the target antenna AN0 ₀ Is within one quarter of the above range, the resonance frequency band of the microstrip antenna AN2 at least partially overlaps with the operating frequency band of the target antenna AN 0. Since the camera module 202 is very close to the target antenna AN0, when the target antenna AN0 works, the microstrip antenna AN2 and the target antenna AN0 generate electric field coupling, so that a resonant field is formed in a resonant cavity formed between the microstrip antenna AN2 and the main board 15, and AN induced current is generated on the microstrip antenna AN 2. That is, the physical mode of the camera module 202 is essentially a microstrip antenna mode with 1/4 wavelength.

Based on the principle of a microstrip antenna, the microstrip antenna is provided with a current strong point and an electric field strong point which are relatively fixed at a resonance frequency point, wherein the electric field strong point of the microstrip antenna is positioned at the open end of the microstrip antenna, and the current strong point is positioned at the position of the microstrip antenna, which is 1/4 wavelength away from the open end. Moreover, the current of the microstrip antenna at the grounding end is not uniform, and the current of the grounding end close to the inner side of the antenna cavity is far stronger than the current of the grounding end far away from the inner side of the antenna cavity. For example, as can be seen from the induced current distribution simulation diagram shown in fig. 8, the ground return end of the microstrip antenna AN1 is located at the position of the connection element 23, and the current intensity of the side of the connection element 23 close to the resonant cavity is much stronger than the current intensity of the side of the connection element 23 far from the resonant cavity. Or, based on the principle of the terminal short circuit/open circuit cavity, it can be known that the current at the side of the ground return end close to the open circuit end is much stronger than the current at the side of the ground return end far away from the open circuit end.

Based on the above principle, the camera module 202 of the second embodiment adds the grounding element 24 between the connecting element 23 and the first end 22a of the circuit substrate 22 as the grounding end of the new microstrip antenna AN2, so that the current strong point of the microstrip antenna AN2 is shifted to the position of the grounding element 24, thereby limiting the resonant field on the side of the grounding element 24 away from the connecting element 23, and the induced current generated on the microstrip antenna AN2 is mainly released from the added grounding element 24 to the motherboard ground. In this way, equivalent to separating the connection element 23 from the new microstrip antenna AN2, that is, the connection element 23 does not participate in the structure of the microstrip antenna AN2, the induced current on the microstrip antenna AN2 is already guided to the motherboard ground of the motherboard 15 and released before reaching the connection element 23, so that the induced current entering the MIPI line of the camera module 202 can be significantly reduced or eliminated, and further the isolation between the MIPI line and the target antenna AN0 can be significantly improved, thereby achieving efficient decoupling between the camera module 202 and the target antenna AN 0.

Fig. 14 is a simulation curve diagram of the coupling degrees between the four MIPI lines L1 to L4 included in the camera module 202 shown in fig. 10 and the target antenna AN 0. It should be noted that the four MIPI lines L1 to L4 shown in fig. 14 correspond to the four MIPI lines L1 to L4 shown in fig. 9.

As can be seen from fig. 14, in the vicinity of the operating frequency band 3.5GHz of the target antenna AN0, for example, in the range of 3.3GHz to 3.8ghz, the coupling degree of the first MIPI line L1 is still lower than the coupling degrees of the other three MIPI lines, and the coupling degree of the fourth MIPI line L4 is still higher than the coupling degrees of the other three MIPI lines. Specifically, the coupling degree of the first MIPI line L1 ranges from minus 43.5dB to minus 36.3dB, and the coupling degree of the fourth MIPI line L4 ranges from minus 39dB to minus 32.5dB.

Compared with the four MIPI lines of the camera module 201 of the first embodiment shown in fig. 9, the coupling degree of the first MIPI line L1 shown in fig. 14 is decreased by 6.2db to 8.8db, and accordingly, the isolation degree is increased by 6.2db to 8.8db; the coupling degree of the L4 of the fourth MIPI line is reduced by 9.6dB to 12dB, and correspondingly, the isolation degree is improved by 9.6dB to 12dB; the isolation of the other two MIPI lines L2 and L3 is also obviously improved. It can be seen that, by disposing the grounding element 24 between the connecting element 23 and the first end 22a of the circuit substrate 22 and disposing the grounding pins of the grounding element 24 in a continuous arrangement, the isolation between the MIPI line of the camera module 202 and the target antenna AN0 can be effectively improved.

In the case that the first connector 231 and the second connector 232 of the connecting element 23 both include two rows of pins, the first MIPI line L1 and the second MIPI line L2 can be understood as MIPI lines corresponding to two pins in a row of pins of the connecting element 23 farther from the first end 22a of the circuit substrate 22, and have relatively high isolation; the third MIPI line L3 and the fourth MIPI line L4 may be understood as MIPI lines corresponding to two pins in a row of pins of the connecting element 23 closer to the first end 22a of the circuit substrate 22, and have relatively low isolation.

Comparing the coupling simulation curves shown in fig. 9 and 14, it can be seen that after the grounding element 24 is added, the isolation of the MIPI lines corresponding to two pins in the row of pins closer to the first end 22a of the circuit substrate 22, that is, the third MIPI line L3 and the fourth MIPI line L4, is improved more greatly.

To sum up, in the camera module 202 provided in the second embodiment, the grounding element 24 is added between the connecting element 23 and the first end 22a of the circuit substrate 22, so that a new microstrip antenna AN2 with a 1/4 wavelength mode is formed in the structure between the first end 22a of the circuit substrate 22 and the grounding element 24, and the camera module 202 and the target antenna AN0 in any frequency band near the first end 22a of the circuit substrate 22 can be efficiently decoupled, thereby effectively solving the problem of interference of the camera module 202 and enabling a user to obtain better shooting experience.

Specifically, the camera module 202 can achieve the purpose of adjusting the resonant frequency band of the microstrip antenna AN2 by adding the grounding element 24 between the connecting element 23 and the first end 22a of the circuit substrate 22, and on one hand, the resonant frequency band of the microstrip antenna AN2 and the working frequency band of the target antenna AN0 are not overlapped, so as to achieve the purpose of breaking the condition of electric field coupling between the microstrip antenna AN2 and the target antenna AN0, so as to avoid the electric field coupling between the camera module 202 and the target antenna AN 0; on the other hand, under the condition that the condition of electric field coupling generated between the microstrip antenna AN2 and the target antenna AN0 cannot be destroyed, the current strong point of the microstrip antenna AN2 can be transferred to the position of the grounding element 24, so that the resonant field is limited at one side of the grounding element 24 away from the connecting element 23, induced current generated on the microstrip antenna AN2 is guided to the mainboard ground of the mainboard 15 by the newly added grounding element 24 before reaching the connecting element 23 and is released, the purposes of weakening the induced current entering the MIPI line of the camera module 202 and improving the isolation between the MIPI line and the target antenna AN0 are further achieved, and electromagnetic interference of the target antenna AN0 on the camera module 202 can be eliminated or reduced.

In addition, compare with the required ground connection modes such as electrically conductive cloth of subsides of traditional anti-interference scheme of camera module, electrically conductive bubble cotton, what camera module 202 that this application second embodiment provided is the anti-interference scheme of mechanism's aspect in earlier stage, both can save terminal equipment 1000's inner space can avoid producing again and Radiate Spurious (RSE) scheduling problem. In addition, the anti-interference scheme of the camera module 202 provided by the second embodiment is suitable for efficient decoupling between a front camera or a rear camera on the terminal device 1000 and a target antenna, and has no defect of frequency band limitation, so that the problem of interference of the camera module 202 can be effectively solved.

Referring to fig. 15, a camera module 203 is further provided in the third embodiment of the present application, wherein the structure of the camera module 203 shown in fig. 15 is similar to that of the camera module 202 shown in fig. 10 to 12, except that: in the camera module 203 shown in fig. 15, two adjacent first ground pins 241 are spaced apart from each other, and correspondingly, two adjacent second ground pins 242 are also spaced apart from each other.

For example, in the camera module 203 shown in fig. 15, the plurality of first ground pins 241 includes 6 ground pin male heads disposed on the extension portion 2231 of the third substrate 223 at intervals side by side, and correspondingly, the plurality of second ground pins 242 includes 6 ground pin female heads disposed on the main board 15 at intervals side by side, that is, the ground element 24 includes 6 pairs of ground pins in total, and the electrical connection between the two is realized by the engagement of the ground pin male heads and the corresponding ground pin female heads. The number of the first ground pins 241 and the second ground pins 242 is not particularly limited.

Fig. 16 is a schematic diagram of a simulation curve of the coupling degree between the four MIPI lines L1 to L4 included in the camera module 203 shown in fig. 15 and the target antenna AN 0. It should be noted that the four MIPI lines L1 to L4 shown in fig. 16 correspond to the four MIPI lines L1 to L4 shown in fig. 14.

As can be seen from fig. 16, in the vicinity of the operating frequency band 3.5GHz of the target antenna AN0, for example, in the range of 3.3GHz to 3.8ghz, the coupling degree of the first MIPI line L1 is still lower than the coupling degrees of the other three MIPI lines, and the coupling degree of the fourth MIPI line L4 is still higher than the coupling degrees of the other three MIPI lines. Specifically, the coupling degree of the fourth MIPI line L4 ranges from minus 36.3dB to minus 29.5dB.

Compared with the four MIPI wires of the camera module 201 in the first embodiment shown in fig. 9, the coupling degree of the fourth MIPI wire L4 shown in fig. 16 is reduced by 6.6db to 9.3db, accordingly, the isolation degree is improved by 6.6db to 9.3db, and the isolation degrees of the other three MIPI wires L1 to L3 are also obviously improved. It can be seen that the grounding element 24 is disposed between the connecting element 23 and the first end 22a of the circuit substrate 22, and the grounding pins of the grounding element 24 are sparsely and intermittently arranged, so that the isolation between the MIPI line of the camera module 202 and the target antenna AN0 can still be effectively improved.

Based on the decoupling principle between the camera module and the target antenna AN0 and the simulation curve diagram of the coupling degree between the MIPI lines L1 to L4 and the target antenna AN0 shown in fig. 14 and 16, it can be known that the larger the number of the grounding pins included in the grounding element 24 is, the more beneficial the induced current generated on the camera module is to be guided to the motherboard ground, so that the higher the isolation degree between the MIPI line of the camera module and the target antenna AN0 is, the stronger the anti-interference capability of the camera module is.

It can be understood that, the plurality of ground pins included in the ground element 24 are arranged on the circuit substrate 22 and the main board 15 in series, which is beneficial to limit the resonant field on the side of the ground element 24 away from the connecting element 23, so as to prevent the resonant field in the resonant cavity from passing through the ground element 24 to the connecting element 23, thereby improving the anti-interference capability of the camera module. However, for example, in the camera module 202 of the second embodiment shown in fig. 11 and 12, since the plurality of first ground pins 241 included in the ground element 24 are continuously arranged on the circuit substrate 22 and the plurality of second ground pins 242 included in the ground element 24 are continuously arranged on the main board 15, the ground pins included in the ground element 24 occupy more space on the surface layer of the third substrate 223 and the surface layer of the main board 15, so that there is not enough routing space on the surface layer of the third substrate 223 and the surface layer of the main board 15 for routing the transmission lines corresponding to the pins of the connection element 23. The transmission lines corresponding to the row of pins of the connecting element 23 close to the grounding element 24 can only be routed from the inner layer of the third substrate 223 and the inner layer of the main board 15 respectively.

In the camera module 203 of the third embodiment shown in fig. 15, since the plurality of ground pins included in the ground element 24 are sparsely and alternately arranged, it is beneficial to reserve a routing space for the transmission line corresponding to the pins of the connecting element 23 on the surface layer of the third substrate 223 and the surface layer of the main board 15, and the surface layer of the third substrate 223 can route the pins of the connecting element 23 between two adjacent first ground pins 241, and similarly, the surface layer of the main board 15 can also route the pins of the connecting element 23 between two adjacent second ground pins 242, so that the routing space between the third substrate 223 and the main board 15 can be increased. However, with the structure shown in fig. 15, since there is a gap between two adjacent ground pins of the ground element 24, part of the resonant field in the resonant cavity will pass through the gap between the ground pins of the ground element 24 and pass into the connecting element 23, which is not favorable for improving the interference immunity of the camera module 203.

Referring to fig. 17, a camera module 204 is further provided in the fourth embodiment of the present application, wherein the structure of the camera module 204 shown in fig. 17 is similar to that of the camera module 202 shown in fig. 10-12, and the difference is that: in the camera module 204 shown in fig. 17, the grounding element 24 includes a spring, one end of the spring is electrically connected to the substrate of the circuit substrate 22, and the other end of the spring is electrically connected to the main board of the main board 15.

It can be understood that the fourth embodiment adopts the elastic sheet as the grounding element, and the anti-interference effect brought to the camera module 204 is similar to the anti-interference effect obtained by the camera module 202 of the second embodiment shown in fig. 10 to 12 by using the grounding pins arranged continuously, which is not repeated herein.

Optionally, in other embodiments, the grounding element 24 may further include a plurality of conductive posts (not shown), wherein one end of each conductive post is electrically connected to the substrate of the circuit substrate 22, and the other end of each conductive post is electrically connected to the main board of the main board 15.

It can be understood that, if the plurality of conductive pillars included in the grounding element 24 are arranged continuously, the anti-interference effect brought to the camera module is similar to the anti-interference effect obtained by using the plurality of grounding pins arranged continuously in the camera module 202 of the second embodiment shown in fig. 10 to 12; if the plurality of conductive pillars included in the grounding element 24 are sparsely and intermittently arranged, the anti-interference effect brought to the camera module is similar to the anti-interference effect obtained by the camera module 203 of the third embodiment shown in fig. 15 using the plurality of grounding pins sparsely and intermittently arranged, which is not repeated herein.

The above embodiments are only a part of the present application, and the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all should be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A camera module, comprising:

the circuit substrate comprises a substrate ground, a first end and a second end, wherein the first end is close to a target antenna on the terminal equipment, and the second end is far away from the target antenna;

the camera is arranged on the circuit substrate;

the connecting element is arranged on the circuit substrate and is close to the second end; the connecting element is also used for being electrically connected with a main board in the terminal equipment, and the camera is electrically connected with the main board through the circuit substrate and the connecting element; and

a ground element provided on the circuit board and electrically connected to the circuit board; the grounding element is also used for electrically connecting with a mainboard of the mainboard;

wherein the grounding element is located between the first end of the circuit substrate and the connecting element.

2. The camera module of claim 1, wherein a length of the ground element to the first end is outside a range of one quarter of a wavelength corresponding to an operating frequency band of the target antenna.

3. The camera module of claim 1, wherein a length of the ground element to the first end is within a quarter of a wavelength corresponding to an operating frequency band of the target antenna;

the grounding element is used for guiding the induction current to a mainboard ground of the mainboard when the camera module generates electric field coupling with the target antenna and generates induction current on the camera module.

4. The camera module of any one of claims 1-3, wherein the grounding element comprises:

the first grounding pins are arranged on the circuit substrate side by side and are electrically connected with the substrate of the circuit substrate; and

the plurality of second grounding pins are arranged on the mainboard side by side and are electrically connected with the mainboard of the mainboard;

the plurality of first grounding pins and the plurality of second grounding pins are electrically connected in a one-to-one correspondence manner.

5. The camera module according to claim 4, wherein two adjacent first ground pins are spaced apart from each other, and two adjacent second ground pins are spaced apart from each other; or alternatively

The plurality of first grounding pins are continuously arranged on the circuit substrate, and the plurality of second grounding pins are continuously arranged on the mainboard.

6. The camera module according to any one of claims 1 to 3, wherein the grounding element comprises a spring, one end of the spring is electrically connected to the substrate of the circuit substrate, and the other end of the spring is electrically connected to the main board of the main board; or alternatively

The grounding element comprises a plurality of conductive columns, one ends of the conductive columns are electrically connected with the substrate of the circuit substrate, and the other ends of the conductive columns are electrically connected with the mainboard of the mainboard.

7. The camera module according to any one of claims 1 to 3, wherein the circuit substrate comprises a first substrate, a second substrate and a third substrate electrically connected in sequence, the camera is disposed on the first substrate, and the connecting element and the grounding element are both disposed on the third substrate;

the first substrate and the third substrate are hard circuit boards, and the second substrate is a flexible substrate electrically connected between the first substrate and the third substrate;

one end of the first substrate, which is far away from the second substrate, is a first end of the circuit substrate, and one end of the third substrate, which is far away from the second substrate, is a second end of the circuit substrate.

8. The camera module of claim 7, wherein the third substrate includes an extension portion extending in a direction toward the second substrate, and the grounding element is disposed on the extension portion.

9. The camera module of claim 1, wherein the circuit substrate includes first and second opposing sides, wherein the camera is located on the first side of the circuit substrate, and wherein the connecting element and the ground element are located on the second side of the circuit substrate.

10. The camera module of claim 1, wherein the connecting element comprises:

the first connector is arranged on the circuit substrate and is electrically connected with the camera; and

the second connector is arranged on the mainboard, and the camera is electrically connected with the mainboard through the first connector and the second connector;

wherein the first connector and the second connector are both board-to-board connectors.

11. A terminal device, comprising:

a middle frame;

the antenna is arranged on the middle frame;

the main board is fixed on the middle frame; and

the camera module according to any one of claims 1 to 10, wherein a circuit substrate of the camera module is fixed above the middle frame or the main board; the first end of the circuit substrate is close to the antenna, and the second end of the circuit substrate is far away from the antenna.

12. The terminal device according to claim 11, wherein the antenna is disposed at an end of the middle frame and located at a top end of the terminal device;

the camera that the camera module includes is leading camera.