CN115016181B - Mini Led lamp backlight module and display - Google Patents
Mini Led lamp backlight module and display Download PDFInfo
- Publication number
- CN115016181B CN115016181B CN202210820306.6A CN202210820306A CN115016181B CN 115016181 B CN115016181 B CN 115016181B CN 202210820306 A CN202210820306 A CN 202210820306A CN 115016181 B CN115016181 B CN 115016181B
- Authority
- CN
- China
- Prior art keywords
- led lamp
- mini led
- light
- gasket
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 claims description 23
- 238000009792 diffusion process Methods 0.000 claims description 10
- 239000012788 optical film Substances 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 230000004069 differentiation Effects 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a Mini Led lamp backlight module and a display, comprising: the back plate and the side plates are arranged along the periphery of the back plate, an open cavity is formed between the back plate and the side plates, a direct type light entering component is arranged in the cavity, and the thickness of the direct type light entering component is close to that of the side light entering component, so that the back plate can realize optional direct type light entering and side light entering. Through trading the compatible, realize two kinds of mode backlight unit's that go into light selection, reduce the input of mould expense, increase the product differentiation function, richen the product series.
Description
Technical Field
The invention relates to the technical field of backlight modules, in particular to a Mini LED lamp backlight module and a display.
Background
The LED backlight module is used as an important component of the liquid crystal display, and the brightness, chromaticity, uniformity, viewing angle, thickness of the backlight module and the like of the light provided by the LED backlight module have great influence on the final performance of the display. According to different light source positions, the LED backlight module is mainly divided into a side-in type LED backlight and a direct type LED backlight. Since the market is pursuing a thinner display, many Led light-entering systems are side-entering systems. In the Mini Led technology which has been recently developed, since the Led chip is reduced to 1/100 of the original size, the Led light-in mode is direct type, and the thin display can be maintained. Because of the difference of the back plate structures of the direct type backlight module and the side-in type backlight module, the direct type backlight module and the side-in type backlight module are independent structures and cannot be compatible with one set of back plate structure.
Disclosure of Invention
The invention aims to provide a Mini LED lamp backlight module and a display, wherein the F-shaped bent back plate is provided with a direct type light inlet component with the thickness approaching to that of a side light inlet component, so that the side light inlet and the Mini LED direct type light inlet are compatible on the same back plate.
A Mini Led lamp backlight module comprising: the back plate and the side plates are arranged along the periphery of the back plate, an open cavity is formed between the back plate and the side plates, a direct type light entering component is arranged in the cavity, and the thickness of the direct type light entering component is close to that of the side light entering component, so that the back plate can realize optional direct type light entering and side light entering.
Further, a scrap bead gasket is fixed on one side of the side plate facing the cavity.
Further, the top surface of the lapping gasket is higher than the top surface of the side plate to form a lapping gap, the side surface, opposite to the lapping gap, of the lapping gasket protrudes inwards to form a flange, and the bottom of the flange is lapped on the top of the corresponding side edge.
Further, the direct type light incident assembly includes: a heat sink and a Mini led lamp panel; the heat dissipation piece comprises a leveling gasket, the lapping gasket and the leveling gasket are connected together at an angle, one surface of the leveling gasket is connected with the back plate, the other surface of the leveling gasket is connected with the Mini led lamp panel, and the thickness of the heat dissipation piece is equal to that of the heat dissipation piece in the side-in type assembly.
Further, the Mini led lamp panel includes: the LED lamp comprises a mounting plate and a plurality of Mini LED lamps, wherein the Mini LED lamps are arranged on one side, opposite to the optical assembly, of the mounting plate in a dot matrix mode.
Further, the optical assembly comprises an optical assembly, and the lapping pad is positioned at the periphery of the optical assembly; the optical component comprises a diffusion plate and an optical membrane which are sequentially arranged along the light emitting direction; the diffusion plate is located on the Mini led lamp panel, and the optical membrane is arranged on the diffusion plate.
Further, the side-in type light entering component comprises an LED component and a heat radiating piece, the heat radiating piece comprises a heat radiating fin, the bonding gasket and the heat radiating fin are connected together at an angle, the other surface of the bonding gasket is connected with the LED component, and one surface of the heat radiating fin is connected with the back plate.
Further, the LED module further comprises a reflecting sheet, a light guide plate and an optical film which are sequentially arranged on the other surface of the radiating sheet, wherein the light emitting surface of the LED module faces the light incident surface of the light guide plate.
Further, a boss for threading is arranged on the radiating fin along the direction of the Led assembly, and the sum of the height of the boss and the thickness of the boss is equal to the thickness of the radiating piece in the direct type assembly.
A display comprises the direct type light inlet component.
The invention has the beneficial effects that:
The thickness of the traditional side-in backlight module is about 7.0mm (back plate + reflector plate + light guide plate + membrane + reserved gap + hem), when the direct type backlight module of Mini Led achieves 0-1 OD, the thickness of the two backlight modules is close, and compatible design can be completed after money exchange. Through trading the compatible, realize two kinds of mode backlight unit's that go into light selection, reduce the input of mould expense, increase the product differentiation function, richen the product series.
Drawings
FIG. 1 is a schematic view of the back surface structure of a display with a direct type backlight module according to the present invention;
FIG. 2 is a schematic view of the back structure of a display with a side-entry backlight module according to the present invention;
FIG. 3 is a schematic diagram showing a cross-sectional line structure of a direct type backlight module display according to the present invention;
FIG. 4 is a schematic diagram showing a cross-sectional line structure of a side-entry backlight module display according to the present invention;
FIG. 5 is a schematic view of the thickness L2 of the direct type light incident module according to the present invention;
FIG. 6 is a schematic view of a thickness L1 of a side-entry light-entering module according to the present invention;
FIG. 7 is a schematic view of a flat gasket construction according to the present invention;
FIG. 8 is a schematic diagram of a heat sink according to the present invention;
reference numerals: 1-backboard, 11-side, 2-Mini LED lamp panel, 3-lapping pad, 4-flange, 5-leveling pad, 6-mounting board, 7-diffusion board, 8-optical film, 9-LED component, 10-heat sink, 11-reflector and 12-light guide plate.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but embodiments of the present invention are not limited thereto.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "configured," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1
A Mini Led lamp backlight module comprising: the back plate 1 and the side plates arranged along the periphery of the back plate 1, wherein the back plate 1 and the side plates form an open cavity, a direct type light entering component is arranged in the cavity, and the thickness of the direct type light entering component is close to that of the side type light entering component, so that the back plate 1 can realize optional direct type light entering and side type light entering.
It is worth to be noted that, in the prior art, the OD value of the direct-type lcd tv is generally greater than 8mm, and the greater the OD value, the greater the thickness of the tv, so that the ordinary direct-type lcd tv will be thicker. The application adopts the Mini led lamp panel 2, the gap between the Mini led lamp panel 2 and the optical group is reduced (namely, the OD value is 0-1), and the light emitted by the Mini led lamp panel 2 can uniformly irradiate on the optical component, so that the thickness of the direct type backlight module is greatly reduced. Mini led is a slightly larger led than Micro, where Micro led has a chip size of less than 80 μm and Mini led has a chip size of 80-300 μm, as defined in the industry. Mini led has the characteristics of high brightness, long service life, low cost and high contrast ratio.
The heat generated by the Mini led lamp panel 2 is transferred to the back plate 1 through the heat dissipation piece, so that sufficient heat dissipation can be performed, and overheating of the Mini led lamp panel 2 and the optical component is avoided. The heat dissipation element can be made of heat conduction materials such as aluminum or copper. The size of the heat dissipation piece is consistent with that of the Mini led lamp panel 2, so that the heat dissipation piece is in contact with the Mini led lamp panel 2 and dissipates heat of the Mini led lamp panel 2.
It should be noted that, the connection relationship between the back plate 1 and the side plate in the present application may be a connection manner such as splicing, inserting, or the like, or may be an integrally formed back plate 1 and a side plate, and illustratively, the back plate 1 and the side plate are in a vertical relationship, that is, the back plate 1 and a plurality of side plates surrounding the back plate 1 form a cavity between the plurality of side plates and the back plate 1, and the cavity is disposed with one end open.
Preferably, the back plate 1 is a rectangular plate, the number of the side plates is four, four side plates are arranged on four sides of the back plate 1 in a pairwise opposite manner, the distance between the two side plates which are arranged in an opposite manner is gradually widened in a direction away from the back plate 1, and any two adjacent side plates are connected in a smooth transition manner at the corresponding corners.
Example 2
On the basis of embodiment 1, a bead gasket 3 is fixed to one side of the side plate facing the cavity.
Specifically, the top surface of the overlap gasket 3 is higher than the top surface of the side plate to form an overlap gap, the side surface of the overlap gasket 3 opposite to the overlap gap protrudes inwards to form a flange 4, and the bottom of the flange 4 is overlapped at the top of the corresponding side 11.
It can be understood that, the bonding pad 3 is a structure for realizing compatibility design, and the edge of the bonding pad 3 can form a heat dissipation flat pad 5 towards the direction corner of the back plate 1, so as to be used for connecting the Mini led lamp panel 2 and realizing heat dissipation to the Mini led lamp panel 2. The LED lamp strip can be further connected to the lapping gasket 3, and fixing and heat dissipation of the LED lamp strip are achieved.
Specifically, the direct type light incidence assembly comprises: a heat sink and a Mini led lamp panel 2; the heat dissipation piece comprises a leveling gasket 5, the lapping gasket 3 and the leveling gasket 5 are connected together at an angle, the lapping gasket 3 is fixed on the side surface of the side plate facing the cavity, one surface of the leveling gasket 5 is connected with the back plate 1, the other surface of the leveling gasket 5 is connected with the Mini led lamp panel 2, and the thickness of the heat dissipation piece is equal to that of the heat dissipation piece in the side-in assembly.
The thickness of the flat gasket 5 is, for example, 4.12mm.
Specifically, the Mini led lamp panel 2 includes: the LED lamp comprises a mounting plate 6 and a plurality of Mini LED lamps, wherein the Mini LED lamps are arranged on the side, opposite to the optical assembly, of the mounting plate 6 in a dot matrix mode.
The mounting plate 6 is connected with the leveling gaskets 5 through heat conduction glue. The heat generated by the lamp panel is transferred out through the leveling pad 5 by adopting the heat-conducting glue. It will be appreciated that the side of the planar shim 5 adjacent the mounting plate 6 is planar.
Preferably, a groove is formed in one surface, close to the back plate 1, of the leveling pad 5, a boss matched with the groove is formed in the back plate 1, and installation and fixation are facilitated through the groove and the boss.
Specifically, the flat gasket 5 is connected with the back plate 1 by double faced adhesive tape.
Specifically, the connection between the lapping pad 3 and the leveling pad 5 may be splicing, inserting, or the like, and the lapping pad 3 and the leveling pad 5 may also be integrally formed.
The heat generated by the Mini led lamp panel 2 is transferred to the backboard 1 through the leveling pad 5, so that sufficient heat dissipation can be performed, and overheating of the Mini led lamp panel 2 and the optical component is avoided. The heat sink 10 may be made of a thermally conductive material such as aluminum or copper. The size of the leveling pad 5 can be consistent with the size of the Mini led lamp panel 2, so that the leveling pad can be in contact with the Mini led lamp panel 2 and can dissipate heat of the Mini led lamp panel 2.
Preferably, the mounting board 6 is a pcb aluminum substrate.
Preferably, a reflective film is also installed between the mounting plate 6 and the Mini led lamp. The reflective film has higher emissivity, so that the reflected light can be reflected back, the light energy utilization rate is increased, and the brightness of the backlight module is improved.
Specifically, the optical assembly is further included, and the lapping pad 3 is located at the periphery of the optical assembly.
Specifically, the optical assembly includes a diffusion plate 7 and an optical film 8 sequentially arranged along the light-emitting direction; the diffusion plate 7 is located on the Mini led lamp panel 2, and the optical film 8 is arranged on the diffusion plate 7.
It should be noted that the structures and compositions of the optical film in the direct type backlight module and the optical film 8 in the side-entry type backlight module may be the same or different, and the present application is not described herein in detail.
Specifically, the side-in light incident component comprises an LED component 9 and a heat dissipation piece, the heat dissipation piece comprises a heat dissipation fin 10, the bonding pad 3 and the heat dissipation fin 10 are connected together at an angle, one surface of the bonding pad 3 is fixed on the side surface of the side plate facing the cavity, the other surface of the bonding pad 3 is connected with the LED component 9, and one surface of the heat dissipation fin 10 is connected with the back plate 1.
Specifically, the connection between the bonding pad 3 and the heat sink 10 may be splicing, inserting, or the like, and the bonding pad 3 and the flat heat sink 10 may also be integrally formed.
Specifically, the LED module further comprises a reflecting sheet 11, a light guide plate 12 and an optical film which are sequentially arranged on the other surface of the radiating sheet 10, wherein the light emitting surface of the LED module 9 faces the light incident surface of the light guide plate 12.
The LED assembly 9 comprises an LED and a light bar plate, wherein the LED is welded on the light bar plate, the bottom surface of the light bar plate is attached to the inner side wall of the overlap gasket 3, the luminous surface of the LED faces the side surface of the light guide plate 12, and the side surface reflecting adhesive tape is positioned on the side surface of the LED facing one side of the side plate bracket.
Preferably, the light bar board is an aluminum substrate pcb.
Specifically, the heat sink 10 is provided with a boss for threading along the direction of the Led assembly, and the sum of the height of the boss and the thickness of the boss is equal to the thickness of the heat sink in the direct type assembly.
As shown in the figure, in the Mini Led lamp backlight module, the thickness L2 of the direct type light entering component is close to the thickness L1 of the side light entering component through design, so that the back plate 1 formed by one-time mold opening can be selectively assembled into the direct type backlight module or the side light entering module, and the direct type light entering and side light entering can be selectively realized.
Illustratively, the thickness A1 of the boss is 4.12mm, and the thickness A2 of the flat gasket 5 is 4.12mm.
Exemplary, thickness data for each element of the direct light entry module and side light entry module of the present application are shown in the following table:
TABLE 1 direct and side entry thickness data comparison along the light exit direction
The data in the table above prove that the thickness of the side-entry light-entering component is different from that of the direct-type light-entering component by 0.03, and the thickness of the side-entry light-entering component can be ignored.
Example 3
A display comprises the direct type light inlet component.
Example 4
A display comprises the side-in light-in component.
The foregoing description of the preferred embodiment of the invention is not intended to limit the invention in any way, but rather to cover all modifications, equivalents, improvements and alternatives falling within the spirit and principles of the invention.
Claims (5)
1. A Mini Led lamp backlight module comprising: backplate (1) and along the curb plate of backplate (1) periphery setting, backplate (1) and curb plate form open cavity, a serial communication port, optionally set up straight following formula income optical subassembly or side income optical subassembly in the cavity, be fixed with overlap edge gasket (3) on the side of curb plate towards the cavity, the top surface of overlap edge gasket (3) is higher than the top surface of curb plate and forms and set up the clearance, and overlap edge gasket (3) are gone up and are set up the side opposite in the clearance and bulge in the clearance and form flange (4), the bottom of flange (4) is set up at the side top that corresponds, straight following formula income optical subassembly includes: a heat dissipation piece and a Mini led lamp panel (2); the heat dissipation piece includes leveling gasket (5), overlap gasket (3) with leveling gasket (5) become an angle and link together, one side of leveling gasket (5) with backplate (1) is connected, the another side of leveling gasket (5) is connected with Mini LED lamp plate (2), the thickness of heat dissipation piece equals the thickness of heat dissipation piece in the side income formula subassembly, the side income formula income light subassembly includes LED subassembly (9), heat dissipation piece, the heat dissipation piece includes fin (10), overlap gasket (3) and fin (10) become an angle and link together, the another side of overlap gasket (3) is connected with LED subassembly (9), the one side of fin (10) with backplate (1) is connected, the thickness of light subassembly is gone into to the direct type is gone into to the thickness of light subassembly in the side income formula of approaching to make this backplate (1) realize optional direct type income light, side income formula income light.
2. The Mini Led lamp backlight module according to claim 1, wherein the Mini Led lamp panel (2) comprises: the LED lamp comprises a mounting plate (6) and a plurality of Mini LED lamps, wherein the Mini LED lamps are arranged on the mounting plate (6) in a dot matrix mode.
3. The Mini Led lamp backlight module according to claim 2, further comprising an optical assembly, wherein the bonding pad (3) is located at the periphery of the optical assembly; the optical component comprises a diffusion plate (7) and an optical membrane (8) which are sequentially arranged along the light emitting direction; the diffusion plate (7) is located on the Mini led lamp panel (2), and the optical membrane (8) is arranged on the diffusion plate (7).
4. A Mini Led lamp backlight module according to claim 3, further comprising a reflecting sheet, a light guide plate (12) and an optical film sequentially disposed on the other surface of the heat sink (10), wherein the light emitting surface of the Led assembly (9) faces the light incident surface of the light guide plate (12).
5. A display comprising a direct light entry assembly as claimed in any one of claims 1 to 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210820306.6A CN115016181B (en) | 2022-07-13 | 2022-07-13 | Mini Led lamp backlight module and display |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210820306.6A CN115016181B (en) | 2022-07-13 | 2022-07-13 | Mini Led lamp backlight module and display |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115016181A CN115016181A (en) | 2022-09-06 |
CN115016181B true CN115016181B (en) | 2024-04-30 |
Family
ID=83082069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210820306.6A Active CN115016181B (en) | 2022-07-13 | 2022-07-13 | Mini Led lamp backlight module and display |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115016181B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104864311A (en) * | 2015-05-06 | 2015-08-26 | 广州创维平面显示科技有限公司 | Liquid crystal display device and downright and side entry hybrid backlight module |
CN212846268U (en) * | 2020-08-31 | 2021-03-30 | 青岛国骐光电科技有限公司 | Ultrathin flat combined backlight module, display and television |
CN113835254A (en) * | 2021-09-18 | 2021-12-24 | 威海台基慧显光电有限公司 | Direct type backlight and side-in type backlight compatible liquid crystal module structure |
-
2022
- 2022-07-13 CN CN202210820306.6A patent/CN115016181B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104864311A (en) * | 2015-05-06 | 2015-08-26 | 广州创维平面显示科技有限公司 | Liquid crystal display device and downright and side entry hybrid backlight module |
CN212846268U (en) * | 2020-08-31 | 2021-03-30 | 青岛国骐光电科技有限公司 | Ultrathin flat combined backlight module, display and television |
CN113835254A (en) * | 2021-09-18 | 2021-12-24 | 威海台基慧显光电有限公司 | Direct type backlight and side-in type backlight compatible liquid crystal module structure |
Also Published As
Publication number | Publication date |
---|---|
CN115016181A (en) | 2022-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USRE49403E1 (en) | Backlight unit and liquid crystal display including the same | |
CN101625480B (en) | Liquid crystal display module | |
KR101698816B1 (en) | Backlight assembly | |
CN109765720B (en) | Liquid crystal display device having a plurality of pixel electrodes | |
EP2476950B1 (en) | Backlight unit and display apparatus using the same | |
US8477259B2 (en) | Liquid crystal display device | |
KR101511493B1 (en) | Liquid crystal display module and display apparatus set having the same, and method of assembling the liquid crystal display module | |
KR101807442B1 (en) | Backlight module and liquid crystal display device using backlight module | |
EP3101467B1 (en) | Backlight unit and liquid crystal display including the same | |
US9207392B2 (en) | Backlight unit, display device therewith, and lighting system therewith | |
US20080129927A1 (en) | Backlight unit and liquid crystal display device having the same | |
EP2469326B1 (en) | Display apparatus having thermally protected backlight assembly | |
CN201599655U (en) | Side reflecting type backlight component | |
US10698259B2 (en) | Deformed liquid crystal display device | |
WO2014021304A1 (en) | Illumination device, display device, and television reception device | |
WO2013166747A1 (en) | Backlight module | |
TWI405009B (en) | Liquid crystal display device | |
US20060232937A1 (en) | Heat conduction member and liquid crystal display having the same | |
CN115016181B (en) | Mini Led lamp backlight module and display | |
KR102047223B1 (en) | Backlight unit using LED and liquid crystal display device including the same | |
US10007047B2 (en) | Display apparatus having thermally protected backlight assembly | |
US7274414B2 (en) | Liquid crystal display module and assembling method thereof | |
KR102544404B1 (en) | Backlight Unit And Liquid Crystal Display Device Including The Same | |
CN219737952U (en) | Multi-screen display integrated backlight module | |
CN210015254U (en) | Side-in backlight module with special-shaped structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |