CN115016162A - Graphene-like radiating fin applied to liquid crystal display chip - Google Patents

Graphene-like radiating fin applied to liquid crystal display chip Download PDF

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Publication number
CN115016162A
CN115016162A CN202210740056.5A CN202210740056A CN115016162A CN 115016162 A CN115016162 A CN 115016162A CN 202210740056 A CN202210740056 A CN 202210740056A CN 115016162 A CN115016162 A CN 115016162A
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graphene
groove
block
plate
bottom end
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CN115016162B (en
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杨云胜
郭颢
束国法
蒋伟良
陈玲
陶勇
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Anhui Carbon China New Material Technology Co ltd
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Anhui Carbon China New Material Technology Co ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133382Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to the field of chip heat dissipation, and discloses a graphene-like heat sink applied to a liquid crystal display chip, which effectively solves the problems that the existing graphene-like heat sink is not easy to separate from the chip and the graphene-like heat sink is not easy to maintain and replace, and comprises a chip body, wherein a fixing frame is arranged at the bottom end of the chip body, the fixing frame is arranged in a shape of a Chinese character kou, a pressing component is arranged at the bottom end of the fixing frame, the pressing component comprises a mounting plate arranged at the bottom end of the fixing frame, and a bottom groove is formed in the mounting plate. The heat dissipation effect is improved.

Description

Graphene-like radiating fin applied to liquid crystal display chip
Technical Field
The invention belongs to the field of chip heat dissipation, and particularly relates to a graphene-like heat dissipation sheet applied to a liquid crystal display chip.
Background
Class graphite alkene fin adopts class graphite alkene material to make, because the heat conductivility of graphite alkene is better, thereby make the fin with graphite alkene, be used for the heat dissipation of chip, and class graphite alkene material possess with the same high heat conductivility of graphite alkene, thereby class graphite alkene fin is used on the heat dissipation of chip equally, and in the installation of class graphite alkene fin and chip, it is fixed that the diapire of class graphite alkene fin and chip passes through the viscose adhesion generally, thereby hug closely between class graphite alkene fin and the chip, thereby improve the radiating effect of class graphite alkene fin to the chip, but still there is following defect:
the similar graphene radiating fins are connected with the chip through the adhesive, so that the similar graphene is not easy to separate from the chip, and the similar graphene radiating fins are not easy to maintain and replace.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the graphene-like radiating fin applied to the liquid crystal display chip, and the problems that the graphene is not easy to separate from the chip and the graphene-like radiating fin is not easy to maintain and replace at present are effectively solved.
In order to achieve the purpose, the invention provides the following technical scheme: the graphene-like radiating fin applied to the liquid crystal display chip comprises a chip body, wherein a fixing frame is installed at the bottom end of the chip body and is arranged in a square shape, and a pressing assembly is installed at the bottom end of the fixing frame;
compress tightly the subassembly including the mounting panel of locating fixed frame bottom, the bottom groove has been seted up to the inside of mounting panel, the top of mounting panel is equipped with type graphite alkene fin, the inside of fixed frame is located to type graphite alkene fin, and type graphite alkene fin and fixed frame looks adaptation, the slot has evenly been seted up to the inside of mounting panel, the inside grafting of slot has the inserted block, the roof is installed on the top of inserted block, the diameter of roof is greater than the diameter of slot, first spring is installed to the bottom symmetry of roof, the bottom and the mounting panel fixed connection of first spring, the roof top is located to type graphite alkene fin, and type graphite alkene fin hugs closely with chip body diapire, the internally mounted of inserted block has adsorption component, the dismouting subassembly is installed on the top of mounting panel.
Preferably, the adsorption component comprises sliders symmetrically installed on two sides of the insertion block, the sliders are connected to the inside of the sliding grooves in a sliding mode, and the sliding grooves are symmetrically arranged on two sides of the insertion groove.
Preferably, a negative pressure cavity is formed in the inserting block, the negative pressure cavity penetrates through the top end of the top plate, a piston is connected to the inside of the negative pressure cavity in a sliding mode, and the outer wall of the piston is tightly attached to the inner wall of the negative pressure cavity.
Preferably, the bottom of the negative pressure cavity is provided with a screw groove, the inner thread of the screw groove is connected with a movable screw, the bottom of the movable screw is provided with a rotating handle, the top end of the movable screw is provided with a rotating block, the rotating block is rotatably connected inside the rotating groove, and the rotating groove is formed in the bottom end of the piston.
Preferably, the dismouting subassembly is including evenly offering the constant head tank in fixed frame bottom, and the draw-in groove has been seted up to one side that the constant head tank is close to the inserted block, and the inside of constant head tank is pegged graft and is had the locating piece, and the locating piece is evenly installed on the top of mounting panel.
Preferably, an inner groove is formed in the positioning block, a communicating groove is formed in one side, close to the clamping groove, of the inner groove, a clamping block is inserted into the communicating groove, the clamping block is clamped with the clamping groove, a top plate is installed at the top end of the clamping block, a third spring is installed on one side of the top plate, and one end of the third spring is fixedly connected with the inner wall of the inner groove.
Preferably, the inside sliding connection of inside groove has the movable block, and the ejector pin is installed to the top of movable block, and ejector pin and fixture block looks adaptation, the connecting rod is installed to the bottom of movable block, and the bottom of connecting rod runs through to the bottom of mounting panel, and the bottom board is installed to the bottom of connecting rod, and the fourth spring is installed to the bottom of movable block.
Preferably, the sill bar is installed to the bottom of changeing the handle, and the limiting plate is installed to the bottom of intercommunication groove, and the diameter of limiting plate is greater than the diameter of sill bar, and the lantern ring has been cup jointed in the outside of sill bar, installs the linkage unit between the lantern ring and the bottom plate.
Preferably, the linkage unit is including locating the dwang between the lantern ring and the bottom board, and the middle part of dwang is rotated and is connected with the swivel mount, the diapire fixed connection of swivel mount and mounting panel, and the movable groove has been seted up to the inside symmetry of dwang, and the inside sliding connection in movable groove has the movable block, and the second spring is all installed to one side that two movable blocks are close to each other, and the connecting rod is installed to the opposite side of movable block, and one of them connecting rod rotates with the lantern ring to be connected, and another connecting rod rotates with the bottom board to be connected.
Compared with the prior art, the invention has the beneficial effects that:
(1) according to the invention, the graphene-like radiating fins are arranged at the top end of the top plate, the graphene-like radiating fins are pushed into the fixed frame, the positioning blocks at the top end of the mounting plate are inserted into the positioning grooves, and the graphene-like radiating fins are tightly attached to the bottom wall of the chip body under the elastic action of the first spring, so that the graphene-like radiating fins can conveniently radiate the chip body, and the radiating effect is improved;
(2) according to the invention, the movable screw rod is rotated, and the movable screw rod is in threaded connection with the screw groove, so that the piston is driven to move downwards after the movable screw rod rotates, the top end of the top plate is tightly attached to the graphene-like radiating fin, and a negative pressure space is formed at the top end of the piston after the piston moves downwards, so that the inside of the negative pressure cavity generates an adsorption force on the graphene-like radiating fin, and the fixing effect of the graphene-like radiating fin is improved.
(3) According to the invention, after the movable screw rod moves downwards, the lantern ring is driven to move downwards, so that the rotating rod is driven to rotate, the bottom plate is pushed to move upwards, and the ejector rod is matched with the clamping block, so that after the bottom plate moves upwards, the ejector rod pushes the clamping block to move outwards and is inserted into the clamping groove, so that the mounting plate is clamped with the fixing frame, the device is convenient to mount and dismount, the graphene-like radiating fins are convenient to dismount, and the graphene-like radiating fins are convenient to replace and maintain.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the mounting plate structure of the present invention;
FIG. 3 is a schematic view of the pressing assembly of the present invention;
FIG. 4 is a schematic view of the structure of the insert block of the present invention;
FIG. 5 is a schematic view of the assembly and disassembly assembly of the present invention;
FIG. 6 is a schematic view of the structure of the adsorption assembly of the present invention;
FIG. 7 is a schematic view of a connecting unit according to the present invention;
FIG. 8 is a schematic view of the internal structure of the positioning block of the present invention;
in the figure: 1. a chip body; 2. a fixing frame; 3. a compression assembly; 301. mounting a plate; 302. a bottom groove; 303. a graphene-like heatsink; 304. a slot; 305. inserting a block; 306. a top plate; 307. a first spring; 4. an adsorption component; 401. a chute; 402. a slider; 403. a negative pressure chamber; 404. a screw groove; 405. a piston; 406. rotating the groove; 407. rotating the block; 408. moving the screw; 409. turning a handle; 5. disassembling and assembling the components; 501. a bottom bar; 502. a limiting plate; 503. a collar; 504. a connection unit; 5041. rotating the rod; 5042. rotating; 5043. a movable groove; 5044. a movable block; 5045. a second spring; 5046. a connecting rod; 505. a bottom plate; 506. positioning a groove; 507. a card slot; 508. positioning blocks; 509. an inner tank; 510. a communicating groove; 511. a clamping block; 512. a top plate; 513. a third spring; 514. a connecting rod; 515. a moving block; 516. a top rod; 517. and a fourth spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the first embodiment, as shown in fig. 1 to 8, the present invention includes a chip body 1, a fixing frame 2 is installed at the bottom end of the chip body 1, the fixing frame 2 is arranged in a square shape, a pressing component 3 is installed at the bottom end of the fixing frame 2, the pressing component 3 includes a mounting plate 301 installed at the bottom end of the fixing frame 2, a bottom groove 302 is opened inside the mounting plate 301, a graphene-like heat sink 303 is installed above the mounting plate 301, the graphene-like heat sink 303 is installed inside the fixing frame 2, the graphene-like heat sink 303 is adapted to the fixing frame 2, slots 304 are evenly opened inside the mounting plate 301, insertion blocks 305 are inserted inside the slots 304, a top plate 306 is installed at the top end of the insertion blocks 305, the diameter of the top plate 306 is larger than that of the slots 304, a first spring 307 is symmetrically installed at the bottom end of the top plate 306, the bottom end of the first spring 307 is fixedly connected to the mounting plate 301, the graphene-like heat sink 303 is installed at the top end of the top plate 306, the graphene-like heat radiating fin 303 is tightly attached to the bottom wall of the chip body 1, the adsorption component 4 is arranged inside the insertion block 305, and the dismounting component 5 is arranged at the top end of the mounting plate 301;
when using, place class graphite alkene fin 303 in roof 306 top, push class graphite alkene fin 303 inside fixed frame 2 afterwards, and make inside locating piece 508 on mounting panel 301 top inserted the constant head tank 506 of fixed frame 2 bottom, roof 306 pushes up class graphite alkene fin 303 and hugs closely with the diapire of chip body 1 under the spring action of first spring 307 this moment to make things convenient for class graphite alkene fin 303 to dispel the heat to chip body 1.
In the second embodiment, on the basis of the first embodiment, the adsorption component 4 includes sliders 402 symmetrically installed on two sides of the insertion block 305, the sliders 402 are slidably connected inside the sliding grooves 401, the sliding grooves 401 are symmetrically arranged on two sides of the insertion groove 304, the insertion block 305 is internally provided with the negative pressure cavity 403, the negative pressure cavity 403 penetrates through to the top end of the top plate 306, the negative pressure cavity 403 is internally and slidably connected with a piston 405, the outer wall of the piston 405 is tightly attached to the inner wall of the negative pressure cavity 403, the bottom end of the negative pressure cavity 403 is provided with a screw groove 404, the internal thread of the screw groove 404 is connected with a movable screw 408, the bottom end of the movable screw 408 is provided with a rotating handle 409, the top end of the movable screw 408 is provided with a rotating block 407, the rotating block 407 is rotatably connected inside the rotating groove 406, and the rotating groove 406 is arranged at the bottom end of the piston 405;
rotate and remove screw rod 408, because remove screw rod 408 and thread groove 404 threaded connection to make and remove screw rod 408 and rotate the back, drive piston 405 downstream, and the top and the class graphite alkene fin 303 of roof 306 are hugged closely, thereby make piston 405 top produce the negative pressure space, then under the negative pressure adsorption, make class graphite alkene fin 303 and roof 306 zonulae occludens, thereby improve class graphite alkene fin 303's fixed effect.
Third embodiment, on the basis of the first embodiment, the dismounting assembly 5 includes a positioning groove 506 uniformly opened at the bottom end of the fixing frame 2, a clamping groove 507 is opened at one side of the positioning groove 506 close to the insertion block 305, a positioning block 508 is inserted into the positioning groove 506, the positioning block 508 is uniformly installed at the top end of the mounting plate 301, an inner groove 509 is opened inside the positioning block 508, a communicating groove 510 is opened at one side of the inner groove 509 close to the clamping groove 507, a clamping block 511 is inserted into the communicating groove 510, the clamping block 511 is clamped with the clamping groove 507, a top plate 512 is installed at the top end of the clamping block 511, a third spring 513 is installed at one side of the top plate 512, one end of the third spring 513 is fixedly connected with the inner wall of the inner groove 509, a moving block 515 is slidably connected inside the inner groove 509, a top rod 516 is installed at the top end of the moving block 515, the top rod 516 is matched with the clamping block 511, a connecting rod 514 is installed at the bottom end of the moving block 515, and the bottom end of the connecting rod 514 penetrates to the bottom end of the mounting plate 301, a bottom plate 505 is installed at the bottom end of the connecting rod 514, a fourth spring 517 is installed at the bottom end of the moving block 515, a bottom rod 501 is installed at the bottom end of the rotating handle 409, a limiting plate 502 is installed at the bottom end of the communicating groove 510, the diameter of the limiting plate 502 is larger than that of the bottom rod 501, a lantern ring 503 is sleeved on the outer side of the bottom rod 501, a connecting unit 504 is installed between the lantern ring 503 and the bottom plate 505, the connecting unit 504 comprises a rotating rod 5041 arranged between the lantern ring 503 and the bottom plate 505, a rotating seat 5042 is rotatably connected to the middle of the rotating rod 5041, the rotating seat 5042 is fixedly connected with the bottom wall of the mounting plate 301, a moving groove 5043 is symmetrically arranged in the rotating rod 5041, a moving block 5044 is slidably connected in the moving groove 5043, a second spring 5045 is installed on one side, close to each other moving block 5044, a connecting rod 5046 is installed on the other side of the moving block 5044, one of the connecting rods 5046 is rotatably connected to the collar 503, and the other connecting rod 5046 is rotatably connected to the bottom plate 505;
after removing screw 408 downstream, drive the connecting rod 5046 one end rotation of being connected with lantern ring 503 rotation, thereby make dwang 5041 rotate, then drive the connecting rod 5046 rotation of being connected with bottom plate 505, thereby promote connecting rod 514 rebound, and ejector pin 516 and fixture block 511 looks adaptation, after ejector pin 516 rebound, promote fixture block 511 and outwards remove, thereby make the one end of fixture block 511 insert inside draw-in groove 507, thereby make mounting panel 301 and fixed frame 2 joint, thereby make things convenient for the dismouting of mounting panel 301, then make things convenient for the dismouting of class graphite alkene fin 303, thereby the convenience is to the change maintenance of class graphite alkene fin 303.

Claims (9)

1. Be applied to class graphite alkene fin of LCD chip, including chip body (1), its characterized in that: the bottom end of the chip body (1) is provided with a fixed frame (2), the fixed frame (2) is arranged in a square shape, and the bottom end of the fixed frame (2) is provided with a pressing assembly (3);
the pressing assembly (3) comprises a mounting plate (301) arranged at the bottom end of the fixing frame (2), a bottom groove (302) is formed in the mounting plate (301), a similar graphene cooling fin (303) is arranged above the mounting plate (301), the similar graphene cooling fin (303) is arranged in the fixing frame (2), the similar graphene cooling fin (303) is matched with the fixing frame (2), a slot (304) is uniformly formed in the mounting plate (301), an insert block (305) is inserted into the slot (304), a top plate (306) is arranged at the top end of the insert block (305), the diameter of the top plate (306) is larger than that of the slot (304), a first spring (307) is symmetrically arranged at the bottom end of the top plate (306), the bottom end of the first spring (307) is fixedly connected with the mounting plate (301), the similar graphene cooling fin (303) is arranged at the top end of the top plate (306), and the similar graphene cooling fin (303) is tightly attached to the bottom wall of the chip body (1), the inside of inserted block (305) is installed and is adsorbed subassembly (4), and dismouting subassembly (5) are installed on the top of mounting panel (301).
2. The graphene-like heat sink applied to a liquid crystal display chip according to claim 1, wherein: adsorption component (4) are including symmetrical slider (402) of installing in inserted block (305) both sides, slider (402) sliding connection in the inside of spout (401), and the both sides in slot (304) are seted up to spout (401) symmetry.
3. The graphene-like heat sink applied to a liquid crystal display chip according to claim 1, wherein: negative pressure chamber (403) have been seted up to the inside of inserted block (305), and negative pressure chamber (403) run through to the top of roof (306), and the inside sliding connection of negative pressure chamber (403) has piston (405), and the outer wall of piston (405) closely laminates with the inner wall in negative pressure chamber (403).
4. The graphene-like heat sink applied to a liquid crystal display chip according to claim 3, wherein: thread groove (404) have been seted up to the bottom in negative pressure chamber (403), and the internal thread of thread groove (404) is connected with and removes screw rod (408), and the bottom of removing screw rod (408) is installed and is changeed handle (409), and the top of removing screw rod (408) is installed and is changeed piece (407), changes piece (407) and rotates to be connected inside rotary tank (406), and rotary tank (406) are seted up in the bottom of piston (405).
5. The graphene-like heat sink applied to a liquid crystal display chip according to claim 1, wherein: dismouting subassembly (5) are including evenly opening constant head tank (506) of locating fixed frame (2) bottom, and draw-in groove (507) have been seted up to one side that constant head tank (506) are close to inserted block (305), and the inside grafting of constant head tank (506) has locating piece (508), and locating piece (508) evenly installed in the top of mounting panel (301).
6. The graphene-like heat sink applied to a liquid crystal display chip according to claim 5, wherein: an inner groove (509) is formed in the positioning block (508), a communicating groove (510) is formed in one side, close to the clamping groove (507), of the inner groove (509), a clamping block (511) is inserted into the communicating groove (510), the clamping block (511) is clamped with the clamping groove (507), a top plate (512) is installed at the top end of the clamping block (511), a third spring (513) is installed on one side of the top plate (512), and one end of the third spring (513) is fixedly connected with the inner wall of the inner groove (509).
7. The graphene-like heat sink applied to a liquid crystal display chip according to claim 6, wherein: the inner side of the inner groove (509) is connected with a moving block (515) in a sliding mode, a top rod (516) is installed at the top end of the moving block (515), the top rod (516) is matched with the clamping block (511), a connecting rod (514) is installed at the bottom end of the moving block (515), the bottom end of the connecting rod (514) penetrates through the bottom end of the mounting plate (301), a bottom plate (505) is installed at the bottom end of the connecting rod (514), and a fourth spring (517) is installed at the bottom end of the moving block (515).
8. The graphene-like heat sink applied to a liquid crystal display chip according to claim 4, wherein: bottom rod (501) is installed to the bottom of commentaries on classics handle (409), and limiting plate (502) are installed to the bottom of intercommunication groove (510), and the diameter of limiting plate (502) is greater than the diameter of bottom rod (501), and lantern ring (503) have been cup jointed in the outside of bottom rod (501), installs between lantern ring (503) and bottom plate (505) linkage unit (504).
9. The graphene-like heat sink applied to a liquid crystal display chip according to claim 8, wherein: connecting element (504) is including locating dwang (5041) between lantern ring (503) and bottom plate (505), the middle part of dwang (5041) is rotated and is connected with swivel mount (5042), the diapire fixed connection of swivel mount (5042) and mounting panel (301), movable groove (5043) have been seted up to the inside symmetry of dwang (5041), the inside sliding connection of movable groove (5043) has movable block (5044), second spring (5045) are all installed to one side that two movable blocks (5044) are close to each other, connecting rod (5046) are installed to the opposite side of movable block (5044), one of them connecting rod (5046) rotate with lantern ring (503) and are connected, another connecting rod (5046) rotate with bottom plate (505) and are connected.
CN202210740056.5A 2022-06-28 2022-06-28 Graphene-like cooling fin applied to liquid crystal display chip Active CN115016162B (en)

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CN115016162B CN115016162B (en) 2024-02-09

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN117497910A (en) * 2024-01-02 2024-02-02 深圳稀导技术有限公司 Heat dissipation film made of graphene material and mobile phone rear cover using same

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CN213182681U (en) * 2020-11-11 2021-05-11 深圳市深创鼎业科技有限公司 Heat dissipation type keyboard chip
CN215453722U (en) * 2021-06-24 2022-01-07 木德实业(深圳)有限公司 LED display screen based on efficient heat dissipation of graphene
CN215955265U (en) * 2021-07-29 2022-03-04 浙江珵美科技有限公司 10GEML high-speed TO area refrigeration chip heat abstractor

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Publication number Priority date Publication date Assignee Title
US20060245167A1 (en) * 2005-05-02 2006-11-02 Kwang-Jin Jeong Heat dissipating structure for IC chip of plasma display module and plasma display module having the same
WO2016090918A1 (en) * 2014-12-11 2016-06-16 中兴通讯股份有限公司 Buckle for heat radiation fin
CN208547788U (en) * 2018-04-02 2019-02-26 丹阳中谷新材料技术有限公司 Liquid crystal display chip with graphene radiator structure
CN111968952A (en) * 2020-08-04 2020-11-20 清华大学无锡应用技术研究院 High-power chip heat radiation structure of gallium nitride base
CN213182681U (en) * 2020-11-11 2021-05-11 深圳市深创鼎业科技有限公司 Heat dissipation type keyboard chip
CN215453722U (en) * 2021-06-24 2022-01-07 木德实业(深圳)有限公司 LED display screen based on efficient heat dissipation of graphene
CN215955265U (en) * 2021-07-29 2022-03-04 浙江珵美科技有限公司 10GEML high-speed TO area refrigeration chip heat abstractor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117497910A (en) * 2024-01-02 2024-02-02 深圳稀导技术有限公司 Heat dissipation film made of graphene material and mobile phone rear cover using same
CN117497910B (en) * 2024-01-02 2024-04-09 深圳稀导技术有限公司 Heat dissipation film made of graphene material and mobile phone rear cover using same

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