CN115016080B - Optical transmission assembly and method for assembling optical transmission assembly - Google Patents

Abstract

Embodiments of the present disclosure relate to an optical transmission assembly and a method for assembling an optical transmission assembly. The optical transmission component comprises a plurality of first laser emitting chips, a plurality of second laser emitting chips and a plurality of first reflecting units, wherein the plurality of first laser emitting chips are used for emitting laser to first reflecting surfaces of the plurality of first reflecting units corresponding to the first reflecting units respectively; the first reflection units are arranged in a split mode and used for respectively reflecting the laser from the corresponding first laser emitting chips to form multiple paths of laser reflected to the second reflection units; and the second reflecting unit is provided with at least one second reflecting surface and is used for respectively reflecting the multi-path laser from the plurality of first reflecting surfaces so that the reflected laser is transmitted to the target object along the same preset path. Therefore, the method and the device can effectively reduce the reflection times of the multi-path laser in each optical path, thereby obviously reducing the difference of the lengths of different optical paths and greatly improving the optical coupling efficiency.

Description

Optical transmission assembly and method for assembling optical transmission assembly

Technical Field

Embodiments of the present disclosure relate generally to the field of optical transmission, and more particularly to an optical transmission assembly and a method for assembling an optical transmission assembly.

Background

The optical communication technology is rapidly developed, and the requirement on the information transmission rate is continuously improved. At present, the information transmission rate of a single-channel optical transmission device has substantially reached the maximum limit. Increasing the rate based on WDM (Wavelength Division Multiplexing) Multiplexing becomes an effective method for increasing the information transmission rate. The four-channel optical path multiplexing is usually realized by adopting a four-channel wavelength division multiplexing scheme based on free space block (an optical component) to form integration. The overall optical path of this scheme is long, and the lengths of the four optical paths differ by several times (for example, up to 3 to 4 times), resulting in low optical coupling efficiency of the optical transmission device.

Disclosure of Invention

In view of the above problems, the present disclosure provides an optical transmission assembly and a method for assembling an optical transmission assembly, which can effectively reduce the number of times that multiple paths of laser light are reflected in each optical path, thereby significantly reducing the difference in the lengths of different optical paths and greatly improving the optical coupling efficiency.

According to a first aspect of the present disclosure, a light transmission assembly is provided. The optical transmission module includes: the first laser emitting chips are used for emitting laser to first reflecting surfaces of the first reflecting units corresponding to the first reflecting units respectively; the first reflection units are arranged in a split mode and used for respectively reflecting the laser from the corresponding first laser emitting chips to form multiple paths of laser reflected to the second reflection units; and the second reflecting unit is provided with at least one second reflecting surface and is used for respectively reflecting the multi-path laser from the plurality of first reflecting surfaces so that the reflected laser is transmitted to the target object along the same preset path.

In some embodiments, the second reflecting unit has a plurality of second reflecting surfaces respectively having different angles with respect to the predetermined path, and the plurality of first reflecting surfaces respectively having different angles with respect to the direction of emitting the laser light of the first laser emitting chip.

In some embodiments, each of the plurality of first reflective surfaces is parallel to a respective one of the plurality of second reflective surfaces.

In some embodiments, at least one of the plurality of second reflecting surfaces is disposed inside the second reflecting unit.

In some embodiments, at least one of the plurality of second reflective surfaces is provided with a film layer, and the film layer is used for at least one of the plurality of laser beams from the plurality of first reflective surfaces to pass through so as to reach other at least one of the plurality of second reflective surfaces.

In some embodiments, the plurality of second reflecting surfaces include a first surface of the second reflecting unit, and the first surface is provided with a first film layer for reflecting one of the plurality of laser beams from the plurality of first reflecting surfaces and allowing the other laser beams from the plurality of first reflecting surfaces to pass through so as to reach corresponding second reflecting surfaces arranged inside the second reflecting unit.

In some embodiments, the plurality of second reflective surfaces are respectively provided with a film layer, and the wavelengths of the laser light reflected by the plurality of film layers are different.

In some embodiments, a distance between each of the plurality of first reflecting units and the second reflecting unit along a direction parallel to the predetermined path is inversely related to a distance between the first reflecting unit and the second reflecting unit along a direction perpendicular to the predetermined path.

In some embodiments, a distance between each of the plurality of first reflecting units and the second reflecting unit along a direction parallel to the predetermined path is positively correlated with an angle of the first reflecting surface of the first reflecting unit with respect to the predetermined path.

In some embodiments, the optical transmission assembly further includes a second laser emitting chip for emitting laser to the second reflecting unit, so that the emitted laser passes through the second reflecting unit and then is transmitted to the target object along a predetermined path.

According to a second aspect of the present disclosure, a method for assembling a light transmission component is provided. The method is for assembling an optical transmission assembly according to the first aspect of the present disclosure. The method comprises the following steps: arranging a second reflection unit on the substrate; at the control equipment, acquiring a first light spot formed by a transmission light path of a second reflection unit and collected by a light spot detector on a preset path; determining whether the current first light spot meets a first preset condition; adjusting the angle of the second reflecting unit in response to the fact that the current first light spot is determined not to accord with the first preset condition until the current first light spot accords with the first preset condition; and sequentially arranging a plurality of first laser emitting chips and a plurality of corresponding first reflecting units by taking the second reflecting units as reference, so that second light spots formed by sequentially reflecting through the corresponding first reflecting units and the second reflecting units meet a second preset condition.

In some embodiments, sequentially disposing a plurality of first laser emitting chips, and the corresponding plurality of first reflecting units includes: at the control equipment, second light spots collected by the light spot detector on a preset path and formed after being reflected by the corresponding first reflection unit and the second reflection unit in sequence are obtained; determining whether the current second light spot meets a second preset condition; and adjusting the angle of the corresponding first reflection unit in response to determining that the current second light spot does not meet the second predetermined condition until the current second light spot meets the second predetermined condition.

It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present disclosure, nor do they limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description.

Drawings

The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements.

Fig. 1 shows a schematic structural diagram of an optical transmission assembly of an embodiment of the present disclosure.

Fig. 2 shows an enlarged schematic view of part a of fig. 1.

Fig. 3 illustrates a schematic view of an angle of a second reflection surface of a second reflection unit with respect to a predetermined path according to an embodiment of the present disclosure.

Fig. 4 shows a schematic structural diagram of an optical transmission assembly of an embodiment of the present disclosure.

Fig. 5 shows a schematic structural diagram of an optical transmission component of an embodiment of the present disclosure.

Fig. 6 shows a schematic diagram of a system for implementing a method for an optical transmission component of an embodiment of the present disclosure.

Fig. 7 shows a flow diagram of a method for an optical transmission assembly according to an embodiment of the present disclosure.

Fig. 8 illustrates a schematic view of disposing a second reflection unit on a substrate according to an embodiment of the present disclosure.

Fig. 9 shows a flowchart of a method for disposing a plurality of first laser emitting chips and a plurality of first reflecting units of an embodiment of the present disclosure.

Fig. 10 shows a schematic diagram of providing a plurality of first laser emitting chips and a plurality of first reflecting units.

FIG. 11 schematically shows a block diagram of an electronic device suitable for use to implement an embodiment of the disclosure.

Detailed Description

Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings, in which various details of the embodiments of the disclosure are included to assist understanding, and which are to be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

The term "include" and variations thereof as used herein is meant to be inclusive in an open-ended manner, i.e., "including but not limited to". Unless specifically stated otherwise, the term "or" means "and/or". The term "based on" means "based at least in part on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first," "second," and the like may refer to different or the same object. Other explicit and implicit definitions are also possible below.

As described above, in the conventional free space block-based four-channel wavelength division multiplexing scheme, the lengths of the four optical paths are greatly different, resulting in low optical coupling efficiency of the optical transmission device.

To address, at least in part, one or more of the above problems and other potential problems, example embodiments of the present disclosure propose an optical transmission assembly scheme. In the scheme of the disclosure, the plurality of first laser emitting chips respectively emit laser to the first reflecting surfaces of the corresponding first reflecting units in the plurality of first reflecting units; the laser from the corresponding first laser emitting chip is reflected by the first reflecting units arranged in a split manner respectively to form multiple paths of laser reflected to the second reflecting units; then, the multiple paths of laser light from the multiple first reflecting surfaces are respectively reflected by at least one second reflecting surface of the second reflecting unit, so that the reflected laser light is transmitted to the target object along the same preset path. The first reflecting units which are arranged in a split mode and the at least one second reflecting surface of the same second reflecting unit reflect, so that the reflecting times of multi-path laser in each optical path can be effectively reduced, the difference of the lengths of different optical paths is remarkably reduced, and the optical coupling efficiency is greatly improved.

The optical transmission assembly of the embodiment of the present disclosure is described in detail below with reference to fig. 1 to 5.

Fig. 1 shows a schematic structural diagram of an optical transmission assembly 100 of an embodiment of the present disclosure. Fig. 2 shows an enlarged schematic view of part a of fig. 1. For convenience of illustration, fig. 2 shows the first laser L1, the second laser L2, the third laser L3, and the predetermined path 120. Fig. 3 illustrates a schematic view of an angle of a second reflection surface of a second reflection unit with respect to a predetermined path according to an embodiment of the present disclosure. Fig. 4 shows a schematic structural diagram of the optical transmission assembly 100 of the embodiment of the present disclosure.

The optical transmission module 100 includes: a plurality of first laser emitting chips, a plurality of first reflecting units arranged separately, and a second reflecting unit 108. In some embodiments, the optical transmission component 100 further includes an optical isolator 122. The optical transmission module 100 further includes a substrate 140, a plurality of first laser emitting chips, a plurality of first reflecting units arranged separately, a plurality of second reflecting units 108, and an optical isolator 122, all of which are arranged on the substrate 140.

The first laser emitting chips are used for emitting laser to first reflecting surfaces corresponding to the first reflecting units in the first reflecting units respectively. The plurality of first reflecting units are arranged separately and are used for reflecting the laser light from the corresponding first laser emitting chips respectively to form a plurality of paths of laser light reflected to the second reflecting unit 108. The second reflecting unit 108 has at least one second reflecting surface for reflecting the multiple paths of laser light from the multiple first reflecting surfaces, respectively, so that the reflected laser light is transmitted to the target object 110 along the same predetermined path 120.

In the above scheme, the plurality of first reflection units are arranged in a split manner, and reflect the emitted laser from different first laser emission chips respectively, so that convenience is provided for the arrangement of the plurality of first laser emission chips. And the plurality of first reflecting units respectively reflect the laser from the corresponding first laser emitting chips to the second reflecting units, and the second reflecting units combine the multiple paths of laser into one path of laser through reflection. Therefore, the times of reflecting the multi-path laser in each light path are effectively reduced, the difference of the lengths of different light paths is obviously reduced, and the optical coupling efficiency is greatly improved.

An optical isolator 122 is disposed, for example, on the predetermined path 120 between the second reflecting unit 108 and the target object 110, for preventing the laser light from reflecting back from the target object 110 to the second reflecting unit 108. The target object 110 is, for example, an optical pin assembly.

In some embodiments, the plurality of first laser emitting chips include, for example, a laser emitting chip LD1, a laser emitting chip LD2, and a laser emitting chip LD3. The plurality of first reflection units include, for example, a reflection unit 102, a reflection unit 104, and a reflection unit 106. The reflection unit 102 is disposed corresponding to the laser emitting chip LD1, the reflection unit 104 is disposed corresponding to the laser emitting chip LD2, and the reflection unit 106 is disposed corresponding to the laser emitting chip LD3. The reflection unit 102 has a reflection surface 112, the reflection unit 104 has a reflection surface 114, and the reflection unit 106 has a reflection surface 116.

The laser emitting chip LD1 emits the laser light L11 to the reflection surface 112 of the reflection unit 102, and the reflection surface 112 of the reflection unit 102 reflects the laser light L11 from the laser emitting chip LD1 to form the first path of laser light L1 reflected to the second reflection unit 108. The laser emitting chip LD2 emits the laser light L22 toward the reflecting surface 114 of the reflecting unit 104, and the reflecting surface 114 of the reflecting unit 104 reflects the laser light L22 from the laser emitting chip LD2 to form the second path of laser light L2 reflected to the second reflecting unit 108. The laser emitting chip LD3 emits the laser light L33 toward the reflection surface 116 of the reflection unit 106, and the reflection surface 116 of the reflection unit 106 reflects the laser light L33 from the laser emitting chip LD3 to form a third path of laser light L3 reflected to the second reflection unit 108.

The second reflection unit 108 respectively reflects the first path of laser light L1, the second path of laser light L2, and the third path of laser light L3, so that the reflected laser light is transmitted to the target object 110 along the same predetermined path 120.

In some embodiments, the second reflecting unit has a plurality of second reflecting surfaces having different angles with respect to the predetermined path, respectively. The plurality of first reflecting surfaces have different angles with respect to a direction of emitting laser light of the first laser emitting chip, respectively.

For example, the second reflecting unit 108 has a reflecting surface 132, a reflecting surface 134, and a reflecting surface 136. The reflecting surface 132 is configured to reflect the first path of laser light L1, so that the reflected laser light is transmitted to the target object 110 along the predetermined path 120; the reflecting surface 134 is configured to reflect the second laser L2, so that the reflected laser is transmitted to the target object 110 along the predetermined path 120; the reflecting surface 136 is used for reflecting the third laser L3, so that the reflected laser is transmitted to the target object 110 along the predetermined path 120. Reflective surface 132 has an angle θ 4 with respect to predetermined path 120, reflective surface 134 has an angle θ 5 with respect to predetermined path 120, and reflective surface 136 has an angle θ 6 with respect to predetermined path 120. The angle θ 4, the angle θ 5, and the angle θ 6 are different. In some embodiments, angle θ 4> angle θ 5> angle θ 6.

The reflection surface 112 has an angle θ 1 with respect to the direction of the emitted laser light L11 of the laser emitting chip LD1, the reflection surface 114 has an angle θ 2 with respect to the direction of the emitted laser light L22 of the laser emitting chip LD2, the reflection surface 116 has an angle θ 3 with respect to the direction of the emitted laser light L33 of the laser emitting chip LD3, and the angle θ 1, the angle θ 2, and the angle θ 3 are different from each other. In some embodiments, angle θ 3> angle θ 2> angle θ 1.

It should be understood that the reflection points of the multiple laser lights reflected to the second reflection units at the corresponding second reflection surfaces are on the same straight line, and are all on the predetermined path. For example, a reflection point of the first laser light L1 at the reflection surface 132 is a reflection point P1, a reflection point of the second laser light L2 at the reflection surface 134 is a reflection point P2, and a reflection point of the third laser light L3 at the reflection surface 136 is a reflection point P3. The reflection point P1, the reflection point P2, and the reflection point P3 are on the same straight line, and are all on the predetermined path 120.

In some embodiments, the directions of emitting laser light of the plurality of first laser emitting chips are parallel to each other. In some embodiments, the directions of emitting laser light of the plurality of first laser emitting chips are parallel to each other and are each parallel to the predetermined path. For example, the direction of the emitted laser light L11 of the laser emitting chip LD1, the direction of the emitted laser light L22 of the laser emitting chip LD2, and the direction of the emitted laser light L33 of the laser emitting chip LD3 are parallel to each other, and are all parallel to the predetermined path 120. In this way, it is possible to facilitate arrangement of the plurality of first laser emitting chips and the positions of the plurality of first reflecting units, and to facilitate control of the direction of emitting laser light of the first laser emitting chips.

In some embodiments, each of the plurality of first reflective surfaces is parallel to one of the plurality of second reflective surfaces. For example, reflective surface 112 is parallel to reflective surface 132, reflective surface 114 is parallel to reflective surface 134, and reflective surface 116 is parallel to reflective surface 136. In this aspect, it may be convenient to orient the plurality of first reflecting surfaces so as to improve efficiency and accuracy of assembly in assembling the optical transmission component, thereby ensuring accuracy of the optical transmission component.

In some embodiments, at least one of the plurality of second reflecting surfaces is disposed inside the second reflecting unit. For example, the reflection surface 134 and the reflection surface 132 are provided inside the second reflection unit 108. In this scheme, at least one second plane of reflection in a plurality of second planes of reflection sets up in the inside of second reflection unit, can realize the reasonable setting of a plurality of second planes of reflection on second reflection unit, and the inside space of make full use of second reflection unit can reduce the volume of second reflection unit, saves space.

In some embodiments, at least one of the plurality of second reflective surfaces has a film layer disposed thereon, and the film layer is used for passing at least one of the plurality of laser beams from the plurality of first reflective surfaces to reach other at least one of the plurality of second reflective surfaces. For example, the reflective surface 136 is provided with a first film layer, which can reflect the laser light in the first wavelength range and can pass the laser light in the second wavelength range. The second wavelength range may for example comprise any wavelength outside the first wavelength range. The second wavelength range may be, for example, a wavelength range other than the first wavelength range. Similarly, the reflective surface 134 is provided with a second film layer, which can reflect the laser light in a certain wavelength range and allow the laser light in another wavelength range to pass through. In some embodiments, the wavelength of the laser light L11 emitted from the laser emitting chip LD1, the wavelength of the laser light L22 emitted from the laser emitting chip LD2, and the wavelength of the laser light L33 emitted from the laser emitting chip LD3 are different. The first film layer on the reflective surface 136 may reflect the first laser beam L1, and allow the second laser beam L2 and the third laser beam L3 to pass through, so as to reach the reflective surface 134 and the reflective surface 132, respectively; the second film layer on the reflective surface 134 can reflect the second laser L2 and pass the third laser L3 to reach the reflective surface 132. In the scheme, the film layer is reasonably arranged on the second reflecting surface, so that the laser can be conveniently screened based on the wavelength, the laser of the corresponding light path can be well reflected, and the laser of other light paths can be well transmitted, so that the coupling efficiency of each path of laser on the preset path can be improved.

In some embodiments, the plurality of second reflecting surfaces includes a first surface of the second reflecting unit, and the first surface is provided with a first film layer for reflecting one of the plurality of laser beams from the plurality of first reflecting surfaces and allowing the other laser beams from the plurality of first reflecting surfaces to pass through so as to reach corresponding second reflecting surfaces arranged inside the second reflecting unit. For example, the reflective surface 136 has a first film layer disposed thereon, and the first film layer can reflect the laser light in the first wavelength range and allow the laser light in the second wavelength range to pass through. The second wavelength range may for example comprise any wavelength outside the first wavelength range. The second wavelength range may be, for example, a wavelength range other than the first wavelength range. The first film layer on the reflective surface 136 can reflect the first laser light L1, and allow the second laser light L2 and the third laser light L3 to pass through, so as to reach the reflective surface 134 and the reflective surface 132, respectively. In this scheme, the first surface of the second reflecting unit is used as one of the second reflecting surfaces, so that the surface resources of the second reflecting unit can be fully utilized.

In some embodiments, the plurality of second reflective surfaces are respectively provided with a film layer, and the wavelengths of the laser light reflected by the plurality of film layers are different. For example, a first film layer is disposed on the reflective surface 136, a second film layer is disposed on the reflective surface 134, and a third film layer is disposed on the reflective surface 132. The first film layer, the second film layer and the third film layer respectively correspond to the reflected laser with different wavelengths. In this embodiment, each of the second reflective surfaces may be configured to specifically reflect the laser light having the corresponding target wavelength (e.g., having a specific wavelength or belonging to a specific wavelength range), so that the laser light having other wavelengths is transmitted to avoid entering the predetermined path, thereby improving the coupling efficiency of the laser light in the multiple light paths and reducing the interference of the light having the non-target wavelength.

In some embodiments, a distance between each of the plurality of first reflecting units and the second reflecting unit along a direction parallel to the predetermined path is inversely related to a distance between the first reflecting unit and the second reflecting unit along a direction perpendicular to the predetermined path.

In some embodiments, the distance between the first reflection unit and the second reflection unit along the direction parallel to the predetermined path and the distance along the direction perpendicular to the predetermined path are determined by taking a reflection point of the laser light emitted by the corresponding first laser emitting chip on the first reflection surface of the first reflection unit and an exit point of the multiple paths of laser light on the first surface of the second reflection unit as references. As shown in fig. 4, a reflection point of the laser light L11 emitted by the laser emitting chip LD1 at the reflection surface 112 of the reflection unit 102 is a reflection point P4, a reflection point of the laser light L22 emitted by the laser emitting chip LD2 at the reflection surface 114 of the reflection unit 104 is a reflection point P5, and a reflection point of the laser light L33 emitted by the laser emitting chip LD3 at the reflection surface 116 of the reflection unit 106 is a reflection point P6. After the first path of laser light L1, the second path of laser light L2, and the third path of laser light L3 are reflected by the corresponding second reflection surfaces of the second reflection unit 108, the exit point of the formed reflected laser light at the second reflection unit 108 is an exit point P7. It should be understood that when the first surface of the second reflecting unit 108 is configured as the reflecting surface 136, the exit point P7 coincides with the reflection point P3. With reference to the reflection point P4, the reflection point P5, the reflection point P6 and the exit point P7, it can be determined that the distance between the reflection unit 102 and the second reflection unit 108 along the direction parallel to the predetermined path 120 is a first distance T1, the distance between the reflection unit 104 and the second reflection unit 108 along the direction parallel to the predetermined path 120 is a second distance T2, and the distance between the reflection unit 106 and the second reflection unit 108 along the direction parallel to the predetermined path 120 is a third distance T3; a distance between the reflection unit 102 and the second reflection unit 108 along the direction perpendicular to the predetermined path 120 is a fourth distance D1, a distance between the reflection unit 104 and the second reflection unit 108 along the direction perpendicular to the predetermined path 120 is a fifth distance D2, and a distance between the reflection unit 106 and the second reflection unit 108 along the direction perpendicular to the predetermined path 120 is a sixth distance D3. The first distance T1, the second distance T2, and the third distance T3 have a negative correlation with the fourth distance D1, the fifth distance D2, and the sixth distance D3. That is, when the distance between a first reflection unit and a second reflection unit along the direction parallel to the predetermined path is relatively large, the distance between the first reflection unit and the second reflection unit along the direction perpendicular to the predetermined path is relatively small. In the scheme, by reasonably configuring the distance between the first reflection unit and the second reflection unit in the direction parallel to the predetermined path and the distance between the first reflection unit and the second reflection unit in the direction perpendicular to the predetermined path, after each path of laser light is emitted by the corresponding first laser emitting chip, the laser light is reflected by the corresponding first reflection unit and reaches the second reflection unit, the difference between the passed optical paths is small (the optical paths can be basically equal or even strictly equal), so that the coupling efficiency of the multiple paths of laser light is remarkably improved.

In some embodiments, the distance between the first reflection unit and the second reflection unit along a direction parallel to the predetermined path and the distance along a direction perpendicular to the predetermined path are determined with reference to a geometric center of the first reflection unit and a geometric center of the second reflection unit.

In some embodiments, a distance between each of the plurality of first reflecting units and the second reflecting unit along a direction parallel to the predetermined path is positively correlated with an angle of the first reflecting surface of the first reflecting unit with respect to the predetermined path. For example, when the direction of the emitted laser light L11 of the laser emitting chip LD1, the direction of the emitted laser light L22 of the laser emitting chip LD2, and the direction of the emitted laser light L33 of the laser emitting chip LD3 are parallel to each other and are all parallel to the predetermined path 120, the angle θ 1 may also represent the angle of the reflection surface 112 with respect to the predetermined path 120, the angle θ 2 may also represent the angle of the reflection surface 114 with respect to the predetermined path 120, and the angle θ 3 may also represent the angle of the reflection surface 116 with respect to the predetermined path 120. The first distance T1, the second distance T2, and the third distance T3 have positive correlations with the angle θ 1, the angle θ 2, and the angle θ 3. That is, when the distance between one of the first reflecting units and the second reflecting unit along the direction parallel to the predetermined path is relatively large, the angle of the first reflecting surface of the first reflecting unit with respect to the predetermined path is also large. In this scheme, can be convenient for realize the reasonable arrangement of a plurality of first reflection unit's position, make full use of the space on the base plate rationally.

Fig. 5 shows a schematic structural diagram of an optical transmission assembly 500 of an embodiment of the present disclosure. The optical transmission assembly 500 further includes a second laser emitting chip LD4. The second laser emitting chip LD4 is configured to emit laser light L44 to the second reflecting unit 108, so that the emitted laser light L44 passes through the second reflecting unit 108 and then is transmitted to the target object 110 along the predetermined path 120. It should be understood that the first film layer on the reflection surface 136, the second film layer on the reflection surface 134, and the third film layer on the reflection surface 132 can allow the laser light L44 emitted by the second reflection unit 108 to pass through. In this embodiment, by the transmission property of the second reflection unit, the light path is also formed in the transmission direction of the second reflection unit, so that the number of light paths that can be reused by the light transmission assembly 500 can be increased.

A method for assembling an optical transmission assembly according to an embodiment of the present disclosure is described below in conjunction with fig. 6-10. Fig. 6 shows a schematic diagram of a system 600 for implementing a method for an optical transmission component of an embodiment of the present disclosure. System 600 includes a control device 602, a light source 604, and a spot detector 606. Fig. 7 shows a flow diagram of a method 700 for an optical transmission assembly according to an embodiment of the present disclosure. Method 700 may be implemented by system 600 or by electronic device 1100 shown in fig. 11. It should be understood that method 700 may also include additional steps not shown and/or may omit steps shown, as the scope of the present disclosure is not limited in this respect.

The control device 602 may comprise, for example, the electronic device 1100 shown in fig. 11 to generate the control signal. The control device 602 may further comprise, for example, a robot arm to adjust the angles of the second reflection unit and the plurality of first reflection units according to the control signal. The light source 604 may be implemented, for example, using a laser emitting chip.

At step 702, a second reflective element is disposed on a substrate.

Fig. 8 illustrates a schematic view of disposing a second reflection unit on a substrate according to an embodiment of the present disclosure. Referring to fig. 8, the second reflection unit 108 is disposed on the substrate 140. It should be understood that positioning marks may be provided on the substrate 140, which match the target position of the second reflecting unit 108 on the substrate 140. The second reflecting unit 108 is disposed on the substrate 140 according to the positioning mark, so that an initial position of the second reflecting unit 108 on the substrate 140 approximately corresponds to a target position of the second reflecting unit 108, which is beneficial to improving efficiency of subsequently adjusting an angle of the second reflecting unit 108, thereby quickly achieving accurate matching between the second reflecting unit 108 and the target position.

At step 704, a first spot formed via the transmission optical path of the second reflection unit collected by the spot detector on a predetermined path is obtained at the control apparatus.

Referring to fig. 8, the light source 604 and the light spot detector 606 are disposed on a predetermined path and respectively located at two sides of the second reflecting unit 108. The light source 604 emits laser light so that the emitted laser light reaches the spot detector 606 via the transmission optical path of the second reflection unit 108. The spot detector 606 collects the first spot formed via the transmission optical path of the second reflection unit 108. Control apparatus 602 obtains a first spot from spot detector 606. The light source 604 may be implemented by the second laser emitting chip LD4. The second laser emitting chip LD4 may be mounted to its corresponding target position according to the positioning mark on the substrate 140.

At step 706, the control apparatus determines whether the current first spot meets a first predetermined condition. For example, the control device determines whether the first spot meets a first predetermined condition based on the shape of the first spot.

At step 708, if the control apparatus determines that the current first spot of light does not meet the first predetermined condition, the control apparatus adjusts the angle of the second reflecting unit until the current first spot of light meets the first predetermined condition.

At step 710, if the control device determines that the first spot currently meets the first predetermined condition, the control device determines that the current position of the second reflecting unit meets the target position, and fixes the second reflecting unit on the substrate.

For example, if the target shape of the first spot is circular, control device 602 generates a control signal to control the robot to adjust the angle of second reflection unit 108 relative to predetermined path 120 so that spot detector 606 reacquires the first spot if the current shape of the first spot is not circular. The above steps are repeated until the current first light spot is circular, the control device 602 determines that the current first light spot meets the first predetermined condition, the control device 602 stops adjusting the angle of the second reflection unit 108, determines that the current position of the second reflection unit 108 meets the target position, and fixes the second reflection unit 108 on the substrate 140.

At step 712, a plurality of first laser emitting chips and a corresponding plurality of first reflecting units are sequentially disposed with reference to the second reflecting unit, so that a second light spot formed by sequentially reflecting by the corresponding first reflecting unit and the second reflecting unit meets a second predetermined condition.

In the scheme, the second reflecting unit can be quickly installed, and the installation precision is ensured; and further taking the second reflecting unit as a reference, the installation of the plurality of first laser emitting chips and the corresponding plurality of first reflecting units is realized, and the installation accuracy of the plurality of first reflecting units is effectively ensured.

A method of disposing the plurality of first laser emitting chips and the plurality of first reflecting units will be described in detail below with reference to fig. 9 and 10. Fig. 9 shows a flow chart of a method 900 for providing a plurality of first laser emitting chips and a plurality of first reflecting units of an embodiment of the present disclosure. Method 900 may be implemented by system 600 or by electronic device 1100 shown in fig. 11. It should be understood that method 900 may also include additional steps not shown and/or may omit steps shown, as the scope of the present disclosure is not limited in this respect.

At step 902, at the control device, a second light spot, which is collected by the light spot detector on a predetermined path and is formed after being reflected by the corresponding first reflection unit and the second reflection unit in sequence, is obtained.

Fig. 10 shows a schematic diagram of providing a plurality of first laser emitting chips and a plurality of first reflecting units. Referring to fig. 10, the laser emitting chips LD1 are disposed at their corresponding target positions according to the positioning marks on the substrate 140. The reflection unit 102 is disposed on the substrate 140 in accordance with the positioning mark on the substrate 140, and the reflection surface 112 is made to face the laser emitting chip LD1. Determining the initial position of the reflecting unit 102 on the substrate 140 according to the positioning marks may improve the efficiency and accuracy of mounting the reflecting unit 102. Then, the laser light L11 emitted by the laser emitting chip LD1 is collected by the spot detector 606, and is reflected by the reflecting surface 112 of the reflecting unit 102 and the reflecting surface 132 of the second reflecting unit 108 in sequence, and then forms a second spot at the spot detector 606. Control apparatus 602 obtains a second spot from spot detector 606.

At step 904, the control apparatus determines whether the current second spot meets a second predetermined condition. For example, the control device determines whether the second spot meets a second predetermined condition based on the shape of the second spot.

At step 906, if the control device determines that the current second spot does not meet the second predetermined condition, the control device adjusts the angle of the corresponding first reflection unit until the current second spot meets the second predetermined condition.

At step 908, if the control device determines that the current second light spot meets the second predetermined condition, the control device determines that the current position of the corresponding first reflection unit meets the target position, and fixes the first reflection unit on the substrate.

For example, the target shape of the second spot is circular, and if the current shape of the second spot is not circular, control device 602 generates a control signal to control the robot arm to adjust the angle of reflection unit 102 with respect to predetermined path 120 so that spot detector 606 reacquires the second spot. The above steps are repeated until the current second light spot is circular, the control device 602 determines that the current second light spot meets the second predetermined condition, the control device 602 stops adjusting the angle of the reflection unit 102, determines that the current position of the reflection unit 102 meets the target position, and fixes the reflection unit 102 on the substrate 140.

According to the method 900, the mounting of the laser emitting chip LD2 and the laser emitting chip LD3 may be achieved.

It should be understood that the above is merely an exemplary illustration, and there is no sequential limitation in mounting the laser emitting chip LD1 (and the corresponding reflection unit 102), the laser emitting chip LD2 (and the corresponding reflection unit 104), and the laser emitting chip LD3 (and the corresponding reflection unit 106).

In the scheme, the installation of the plurality of first laser emitting chips and the corresponding plurality of first reflection units can be efficiently realized, and the installation accuracy of the plurality of first reflection units is effectively ensured.

FIG. 11 schematically shows a block diagram of an electronic device 1100 suitable for use to implement embodiments of the present disclosure. The electronic device 1100 may be used to perform the methods 700, 900 shown in fig. 7, 9. As shown in fig. 11, the electronic device 1100 includes a central processing unit (i.e., CPU 1101) that can perform various appropriate actions and processes according to computer program instructions stored in a read-only memory (i.e., ROM 1102) or loaded from a storage unit 1108 into a random access memory (i.e., RAM 1103). In the RAM 1103, various programs and data necessary for the operation of the electronic device 1100 may also be stored. The CPU 1101, ROM 1102, and RAM 1103 are connected to each other by a bus 1104. An input/output interface (i.e., I/O interface 1105) is also connected to bus 1104.

A number of components in electronic device 1100 connect to I/O interface 1105, including: an input unit 1106, an output unit 1107, a storage unit 1108, and the cpu 1101 perform the various methods and processes described above, e.g., perform the methods 700, 900. For example, in some embodiments, the methods 700, 900 may be implemented as a computer software program stored on a machine-readable medium, such as the storage unit 1108. In some embodiments, part or all of the computer program may be loaded and/or installed onto the electronic device 1100 via the ROM 1102 and/or the communication unit 1109. When the computer program is loaded into RAM 1103 and executed by CPU 1101, one or more of the operations of methods 700, 900 described above may be performed. Alternatively, in other embodiments, the CPU 1101 may be configured by any other suitable means (e.g., by way of firmware) to perform one or more of the acts of the methods 700, 900.

It should be further appreciated that the present disclosure may be embodied as methods, apparatus, systems, and/or computer program products. The computer program product may include a computer-readable storage medium having computer-readable program instructions embodied thereon for carrying out various aspects of the present disclosure.

The computer readable storage medium may be a tangible device that can hold and store the instructions for use by the instruction execution device. The computer readable storage medium may be, for example, but not limited to, an electronic memory device, a magnetic memory device, an optical memory device, an electromagnetic memory device, a semiconductor memory device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a Static Random Access Memory (SRAM), a portable compact disc read-only memory (CD-ROM), a Digital Versatile Disc (DVD), a memory stick, a floppy disk, a mechanical coding device, such as punch cards or in-groove projection structures having instructions stored thereon, and any suitable combination of the foregoing. Computer-readable storage media as used herein is not to be interpreted as a transitory signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., optical pulses through a fiber optic cable), or an electrical signal transmitted through an electrical wire.

The computer-readable program instructions described herein may be downloaded from a computer-readable storage medium to a respective computing/processing device, or to an external computer or external storage device over a network, such as the internet, a local area network, a wide area network, and/or a wireless network. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers and/or edge servers. The network adapter card or network interface in each computing/processing device receives computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable storage medium in the respective computing/processing device.

The computer program instructions for carrying out operations of the present disclosure may be assembler instructions, instruction Set Architecture (ISA) instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source or object code written in any combination of one or more programming languages, including an object oriented programming language such as Smalltalk, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The computer-readable program instructions may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider). In some embodiments, the electronic circuitry that can execute the computer-readable program instructions implements aspects of the present disclosure by utilizing the state information of the computer-readable program instructions to personalize the electronic circuitry, such as a programmable logic circuit, a Field Programmable Gate Array (FPGA), or a Programmable Logic Array (PLA).

Various aspects of the present disclosure are described herein with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the disclosure. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer-readable program instructions.

These computer-readable program instructions may be provided to a processor in a voice interaction device, a processing unit of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processing unit of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. These computer readable program instructions may also be stored in a computer readable storage medium that can direct a computer, programmable data processing apparatus, and/or other devices to function in a particular manner, such that the computer readable medium storing the instructions comprises an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks.

The computer readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer, other programmable apparatus or other devices implement the functions/acts specified in the flowchart and/or block diagram block or blocks.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

Having described embodiments of the present disclosure, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

The above are merely alternative embodiments of the present disclosure and are not intended to limit the present disclosure, which may be modified and varied by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.

Claims (13)

1. An optical transmission assembly, comprising:

the first laser emitting chips are used for emitting laser to first reflecting surfaces corresponding to the first reflecting units in the first reflecting units respectively;

the first reflection units are arranged in a split mode and used for respectively reflecting the laser from the corresponding first laser emitting chips to form multiple paths of laser reflected to the second reflection units; and

the second reflecting unit is provided with at least one second reflecting surface and is used for respectively reflecting the multi-path laser from the plurality of first reflecting surfaces so that the reflected laser is transmitted to the target object along the same preset path;

the second reflecting unit has a plurality of second reflecting surfaces having different angles with respect to the predetermined path, respectively.

2. The optical transmission assembly according to claim 1, wherein the plurality of first reflecting surfaces have different angles with respect to a direction of emitting laser light of the first laser emitting chip, respectively.

3. The light transmission assembly of claim 2, wherein each of the plurality of first reflective surfaces is parallel to a respective one of the plurality of second reflective surfaces.

4. The light transmission assembly of claim 2, wherein at least one of the plurality of second reflective surfaces is disposed inside the second reflective unit.

5. The light transmission assembly of claim 4, wherein at least one of the second reflective surfaces has a film layer disposed thereon for passing at least one of the plurality of laser beams from the first reflective surfaces to reach another at least one of the second reflective surfaces.

6. The optical transmission assembly according to claim 4, wherein the plurality of second reflective surfaces includes a first surface of the second reflective unit, and the first surface has a first film layer disposed thereon for reflecting one of the plurality of laser beams from the plurality of first reflective surfaces and allowing the other laser beams from the plurality of first reflective surfaces to pass through so as to reach a corresponding second reflective surface disposed inside the second reflective unit.

7. The optical transmission assembly of claim 2, wherein a plurality of second reflective surfaces are respectively provided with a film layer, and the wavelengths of the laser light reflected by the film layers are different.

8. The optical transmission assembly of claim 2, wherein a distance between each of the plurality of first reflective units and the second reflective unit along a direction parallel to the predetermined path is inversely related to a distance between the first reflective unit and the second reflective unit along a direction perpendicular to the predetermined path.

9. The optical transmission assembly according to claim 8, wherein a distance between each of the plurality of first reflection units and the second reflection unit along a direction parallel to the predetermined path positively correlates with an angle of the first reflection surface of the first reflection unit with respect to the predetermined path.

10. The optical transmission assembly according to claim 1, further comprising a second laser emitting chip for emitting laser light toward the second reflecting unit so that the emitted laser light passes through the second reflecting unit and then is transmitted toward the target object along a predetermined path.

11. A method for assembling an optical transmission assembly, for assembling an optical transmission assembly according to any one of claims 1 to 10, the method comprising:

arranging a second reflection unit on the substrate;

acquiring a first light spot formed by a transmission light path of a second reflection unit and collected by a light spot detector on a preset path at a control device;

determining whether the current first light spot meets a first preset condition;

in response to determining that the current first light spot does not meet the first predetermined condition, adjusting the angle of the second reflecting unit until the current first light spot meets the first predetermined condition; and

and taking the second reflection unit as a reference, sequentially arranging a plurality of first laser emission chips and a plurality of corresponding first reflection units so that second light spots formed by sequentially reflecting through the corresponding first reflection units and the second reflection units meet a second preset condition.

12. The method of claim 11, wherein disposing a plurality of first laser emitting chips in sequence and a corresponding plurality of first reflecting units comprises:

at the control equipment, second light spots collected by the light spot detector on a preset path and formed after being reflected by the corresponding first reflection unit and the second reflection unit in sequence are obtained;

determining whether the current second light spot meets a second preset condition; and

and adjusting the angle of the corresponding first reflection unit in response to determining that the current second light spot does not meet the second predetermined condition until the current second light spot meets the second predetermined condition.

13. A method for assembling an optical transmission assembly, the optical transmission assembly comprising:

the first laser emitting chips are used for emitting laser to first reflecting surfaces of the first reflecting units corresponding to the first reflecting units respectively;

the first reflection units are arranged in a split mode and used for respectively reflecting the laser from the corresponding first laser emitting chips to form multiple paths of laser reflected to the second reflection units; and

the second reflecting unit is provided with at least one second reflecting surface and is used for respectively reflecting the multi-path laser from the plurality of first reflecting surfaces so as to enable the reflected laser to be transmitted to the target object along the same preset path;

the method comprises the following steps:

arranging a second reflection unit on the substrate;

acquiring a first light spot formed by a transmission light path of a second reflection unit and collected by a light spot detector on a preset path at a control device;

determining whether the current first light spot meets a first preset condition;

adjusting the angle of the second reflecting unit in response to the fact that the current first light spot is determined not to accord with the first preset condition until the current first light spot accords with the first preset condition; and

and taking the second reflection unit as a reference, sequentially arranging a plurality of first laser emission chips and a plurality of corresponding first reflection units so that second light spots formed by sequentially reflecting through the corresponding first reflection units and the second reflection units meet a second preset condition.

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