CN115015738A - Testing device capable of simulating heating of electronic equipment, testing method and simulation module - Google Patents
Testing device capable of simulating heating of electronic equipment, testing method and simulation module Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
Abstract
The invention provides a testing device, a testing method and a simulation module capable of simulating the heating of electronic equipment, wherein the testing device comprises a simulation module, a data acquisition module, a controller and an output module; the simulation module is used for simulating heating conditions when the electronic components of the electronic equipment work; the controller is used for calculating simulation operation parameters according to the simulation operation data, and acquiring simulation correction values of a simulation module according to the simulation operation parameters and rated parameters of the electronic component , so that the simulation module can be corrected to acquire corrected simulation operation data. The invention can effectively solve the curve relation condition of the temperature change with time under the condition that the rated power and the size of the known electronic component are unknown and the actual working condition is unknown, the resistor unit can be corrected at any time by using the bread board for the covered electronic component, the efficiency of circuit adjustment is improved, the time and the economic cost are saved, and meanwhile, the simulation module is combined to accurately simulate the heating of the electronic equipment at low cost.
Description
Technical Field
The invention relates to the technical field of electronic component packaging and thermal control, in particular to a testing device, a testing method and a simulation module capable of simulating heating of electronic equipment.
Background
Along with the continuous reduction of the size of electronic components in electronic equipment, the continuous improvement of working frequency, the gradual development towards the direction of integration and the like, the volume power density or the area power density of the electronic components in the electronic equipment is higher and higher, and the heat generated by the electronic components is more and more. The over-high temperature caused by the over-high temperature can reduce the working stability of the electronic components and increase the error rate; meanwhile, the thermal stress formed between the inside of the module and the external environment of the module can directly influence the electrical property, the working frequency and the mechanical strength of electronic components, and can cause self-oscillation of the circuit, voltage variation, thermoelectric potential variation and transmission delay time variation of the integrated circuit; the performance of the electronic components is affected by the above problems, and the performance of the whole electronic device is further affected, so that the influence of the temperature on the electronic device cannot be ignored, and the thermal analysis and the thermal management of the electronic device are particularly important.
The existing test research technology is that on the basis of obtaining a PCBA board inside electronic equipment, an electronic equipment testing device is set up to perform test verification on a finite element analysis designed structure; the technique has the advantages that the PCBA same as the final product can be used for testing, the test result corresponds to the actual domain controller condition one by one, and the accuracy of the test data is high.
The second existing experimental research technology is to simulate the heating condition of main electronic components by combining a copper block and a heating pipe under the condition of not using a PCBA board, and the second technology has the advantages that a large number of electronic components such as chips and resistors are not required to be purchased, a circuit diagram is not required to be drawn, time and economic cost are saved, but the second technology has the defects that the thickness of the copper block for simulating the heating power of the electronic components is at least 6mm, and the interference condition of the copper block and a radiator can occur under the condition that the distance between the radiator of the electronic equipment and the actual PCBA board is small.
In the third existing test research technology, the test cost, the test period and other factors are considered, and on the basis of the known test method, the actual working condition of the chip is simulated by using a mode of combining the ceramic heating sheet and the programmable control module, which is specifically referred to as the patent: the test method (CN 110673015A) simulates the heating power and surface temperature of the chip. The patent technology has the advantages that the test verification of the finite element structure design scheme can be carried out under the condition of not using actual electronic components, wherein the output voltage control curve can be loaded to the corresponding ceramic heating sheet through the programmable control module so as to simulate the working condition of an actual chip; however, the patent technology has the following disadvantages: 1. a programmable control module is needed, so that the cost is high; 2. the technology is based on the curve relation between the surface temperature of the actual electronic component and the time, and when no corresponding electronic component exists in the initial stage of project research and development, the technology is not applicable any more.
Disclosure of Invention
In order to solve the above problems, the present invention provides a testing apparatus, a testing method, and a simulation module capable of simulating heat generation of an electronic device, which can accurately simulate heat generation of the electronic device at low cost under the condition that at least 50 electronic components are known, and the curve relationship of the surface temperature of the electronic components changing with time under the actual working condition is not known.
The invention discloses a device for simulating the heating of electronic equipment, which comprises:
the simulation module is used for storing a simulation model constructed according to the circuit and structural characteristics of the electronic equipment and obtaining simulation operation data of the simulation model;
the simulation module is at least used for simulating the heating condition of electronic components of the electronic equipment during working;
the data acquisition module is used for acquiring the simulation operation data of the simulation module;
the controller is used for calculating simulation operation parameters according to the simulation operation data and acquiring simulation correction values of the simulation module according to the simulation operation parameters and rated parameters of electronic components of the electronic equipment, so that the simulation module can be corrected to acquire corrected simulation operation data;
and the output module is used for comparing the simulation operation data with the corrected simulation operation data and outputting a comparison result.
The simulation module of the invention constructs a simulation model according to the circuit and the structural characteristics of the electronic equipment by using simulation software, and also can construct the simulation model according to the design drawing or the semi-finished product of the electronic equipment, so that the known rated power of the electronic components is used for preliminary heating evaluation under the condition that no corresponding electronic components are in the initial stage of project research and development; furthermore, the simulation module simulates the electronic components of the electronic equipment by using corresponding equipment, and corrects the resistance unit by using the controller, so that the heating condition of the electronic components can be simulated more accurately; and meanwhile, comparing the simulated operation data with the corrected simulated operation data, and comprehensively evaluating the heating condition of the electronic component for evaluating whether the circuit and the structure of the electronic equipment are reasonable in the aspect of heating effect.
Further, the simulation module specifically includes: a substrate, a heating unit, a bread board, a resistance unit and a power supply;
the substrate is used for simulating a circuit board of the electronic equipment; the board with similar performance to the simulated circuit board, especially the board with similar heating and heat dissipation effect, even the same board, but not limited to this, can be selected.
The heating units are arranged on the substrate and connected in parallel, and are used for simulating the electronic components;
the bread board is used for inserting the resistor unit; considering that the number of the simulated electronic components is more than 50, which means that the number of the resistor units is also more than 50, when the bread board is selected, the bread board with enough jacks is selected; the bread board is used, so that the resistor units connected in series with the heating units can be replaced at any time, the test and circuit adjustment efficiency is improved, and the time and the economic cost are saved.
And the resistor units with the same number as the heating units are used for limiting circuit current and adjusting the actual power of the heating units, so that the actual power of the heating units is as close to the rated power of the electronic components as possible, and the simulation accuracy is improved.
The power supply is used for supplying power to the heating unit and the resistance unit;
the whole connection of the simulation module is that the power supply is connected to the bread board by a power line, the resistance units are inserted into the bread board, each resistance unit is connected with one heating unit in series by a power line, and the heating units are bonded and fixed on the substrate. Wherein the heating unit is not energized intermediate the substrate.
The resistance unit comprises a resistor, the resistance value of the resistor before correction is Rn, and the formula of the resistance value Rn is as follows:
the resistance Ro is a resistance value of the heating unit connected in series with the resistance unit before power-on, the voltage U is an analog voltage U provided by the power supply, and the voltage U is selected according to the analog electronic device. The rated power P is the heating power of the electronic component corresponding to each heating unit.
And simultaneously, the simulation module also comprises a device for simulating the working environment of the electronic equipment, and is used for simulating the actual working environment of the electronic equipment, including the temperature and the space of actual work, and simultaneously testing whether the heating unit interferes with the device for simulating the working environment of the electronic equipment or not in the simulation process.
Meanwhile, the data acquisition module includes: the temperature sensor is arranged on each or any heating unit and is used for measuring the temperature Tn of each or any heating unit; and a sensor for measuring a resistance value, a current value, and a voltage value applied to each of the heating units. By measuring the obtained current and voltage values, simulated operating parameters are calculated, including the actual power of the heat generating unit in the heat generating state.
Further, the substrate is made of flame-retardant materials, and the size of the substrate is the same as that of the simulated circuit board; the heating unit is a square ceramic heating sheet with the same size as the corresponding electronic component; the reason for choosing a square ceramic heater chip is that it is the same size as the electronic components, and in particular, it is not as thick as the copper block, which avoids interference.
The square ceramic heating plate is fixedly bonded on the substrate through heat-conducting glue, and the fixed position corresponds to the position of the corresponding electronic component fixed on the circuit board;
the invention also provides a simulation module for simulating the heating condition of the electronic equipment, wherein the simulation module is the simulation module described above.
The invention also discloses a test method based on the simulated electronic equipment heating test device, which comprises the following steps:
s1: constructing a simulation model according to the circuit and structural characteristics of electronic equipment to obtain simulation operation data of the simulation model;
s2: acquiring simulation operation data of the simulation module after the preset time of electrifying the simulation module; wherein the simulation module is the simulation module of claim 2; because the resistance value of the heating unit increases along with the temperature rise after the power-on, the voltage value and the current value of each heating unit are measured when the temperature fluctuation of the heating unit is within a preset range after the simulation module operates for a preset time, so that the effect of accurate calculation can be achieved.
S3: calculating a simulation operation parameter according to the simulation operation data, acquiring a simulation correction value of a simulation module according to the simulation operation parameter and a rated parameter of an electronic component of the electronic equipment, and correcting the simulation module;
s4: and comparing the simulation operation data with the corrected simulation operation data, and outputting a comparison result.
Further, the method for acquiring the analog correction value in step S3 specifically includes:
s31: calculating the actual power Pn of the nth heating unit by the formula:
pn ═ Un ═ In; wherein n is a natural number not equal to 0, Un is a voltage value at two ends of the heating unit, and In is a current value flowing through the heating unit;
s32: comparing the actual power Pn of the nth heating unit with the rated power P of the simulated electronic component to obtain a power difference value delta P; if Δ P is smaller than the preset value, go to step S33; otherwise, n is incremented by 1, and the step S31 is entered; the Δ P formula is:
ΔP＝Pn-P；
this is because after power-on, the resistance values of the heating unit and the resistance unit increase with the temperature rise, and the internal resistance of the power supply and the tiny resistance of the connection line are also considered in the power-on situation, so the resistance value of the heating unit at this time will be greater than the resistance value Ro measured before power-on, further resulting in a gap between the actual power Pn of the heating unit and the rated power P;
s33, calculating an analog correction value Rn ' of the resistor connected in series with the nth heating unit, and if the calculation of all the analog correction values Rn ' is completed, correcting the corresponding resistor unit according to the analog correction value Rn '; otherwise, n is incremented by 1, and the step S31 is entered; the analog correction value Rn' formula is as follows:
the significance of the formula is that Un/In is used for accurately representing the resistance of the heating unit under the power-on condition, the total voltage value of the heating unit and the resistance unit is accurately represented by (In x Rn + Un), namely the influence of temperature on the resistance of the heating unit is considered, the influence of the internal resistance of the direct current power supply and the resistance of a connecting line In a circuit after power-on is removed, and the analog correction value Rn is more accurately calculated.
The invention also provides a computer-readable storage medium, on which a computer program is stored, which, when executed by a processor, implements the above-described testing method.
The invention provides a test device, a test method and a simulation module capable of simulating the heating of electronic equipment, wherein the test device comprises a simulation module, a simulation module and a control module, wherein the simulation module is used for storing a simulation model constructed according to the circuit and the structural characteristics of the electronic equipment and is used for acquiring the simulation operation data of the simulation model; the simulation module is at least used for simulating the heating condition of electronic components of the electronic equipment during working; the data acquisition module is used for acquiring the simulation operation data of the simulation module; the controller is used for calculating simulation operation parameters according to the simulation operation data and acquiring simulation correction values of the simulation module according to the simulation operation parameters and rated parameters of electronic components of the electronic equipment, so that the simulation module can be corrected to acquire corrected simulation operation data; and the output module is used for comparing the simulation operation data with the corrected simulation operation data and outputting a comparison result.
The invention has the advantages that the invention can effectively solve the problem that the electronic component manufacturer only provides the rated power and the size of the electronic component but not provides the curve relation of the temperature changing along with the time under the actual working condition of the electronic component, and the resistance unit can be corrected at any time by using the bread board, thereby greatly improving the efficiency of circuit adjustment, saving the time and the economic cost, and simultaneously combining the simulation module to accurately simulate the heating of the electronic equipment with low cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a heating device of an analog electronic device according to the present invention;
FIG. 2 is an electrical connection diagram of a heat generating device of an analog electronic device according to the present invention;
fig. 3 is a flowchart of a method for simulating heat generation of an electronic device according to the present invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
A testing device capable of simulating the heating of electronic equipment comprises a simulation module, a data acquisition module, a controller and an output module.
The simulation module stores a simulation model constructed according to circuit and structural characteristics of an electronic device and is used for obtaining simulation operation data of the simulation model. The simulation module is used for constructing a simulation model according to the circuit and structural characteristics of the electronic equipment by using simulation software, and also can be used for constructing the simulation model according to the design drawing or semi-finished product of the electronic equipment, so that the known rated power of the electronic components is used for preliminary heating evaluation under the condition that no corresponding electronic component real object exists in the initial stage of project research and development; the common thermal simulation software is FlothERM, ICEPAK, FIoEFD and the like, the ICEPAK is selected as the simulation software in the embodiment, the simulated electronic device can be various PCB circuit boards, and the embodiment is a vehicle-mounted domain controller. The electronic components in the simulation model are constructed according to the sizes of the simulated electronic components, and the rated power of the electronic components in the simulation model is 0.15W and 0.5W in the electronic components commonly used in the embodiment, such as 0.15W, 0.25W and 0.5W; the overall size of the simulation model can be 300mm multiplied by 200mm multiplied by 60mm, and the specific size is simulated according to actual needs; the simulation module obtains a simulation temperature value T1 of the electronic component by operating the simulation model.
Wherein, the simulation module is used for simulating at least the situation of generating heat of electronic components during operation of electronic equipment specifically includes: the bread maker comprises a substrate, a heating unit, a bread board, a resistance unit and a power supply.
The substrate is used for simulating a circuit board of the electronic equipment; the board with similar performance to the simulated circuit board can be selected, especially the board with similar heating and radiating effects, even the same board; the substrate is made of a flame-retardant material, an FR4 board is selected in the embodiment, the FR4 epoxy glass fiber board (epoxy board) is mainly made of an imported prepreg, the prepreg is white, yellow and green in color, high mechanical strength is achieved at 150 ℃, electrical performance is good and flame-retardant in dry and wet states, and the prepreg is widely applied to insulating structure parts in the industries of electricity, electronics and the like.
The FR4 board selected in this embodiment is the same as the PCB board of the electronic device in length, width and thickness, the PCB board of the electronic device simulated in this embodiment is 294mm × 181mm × 1.6mm, and the FR4 board is consistent with it.
The heating units are arranged on the substrate and connected in parallel, and are used for simulating the electronic components; the heating unit is a square ceramic heating sheet with the same size as the corresponding electronic component; the square ceramic heating plate is fixedly bonded on the substrate through heat conducting glue, and the fixed position corresponds to the position where the corresponding electronic component is fixed on the circuit board; the general thickness of square ceramic heating piece is selected to be 1 ~ 2mm in this embodiment, and this thickness is far less than the thickness 6mm of simulation copper billet, can avoid square ceramic heating piece and the appearance that the device of simulation electronic equipment operational environment took place the interference condition. Meanwhile, the resistance value of the heating unit increases along with the temperature rise after power-on, and the characteristic is one of the reasons for the correction of the controller.
The heat-conducting glue is a high-end heat-conducting compound, is synthesized by multiple materials, and the types of common heat-conducting glue on the market are very many: heat-conducting silica gel, epoxy resin AB glue, acrylic acid heat-conducting glue and polyurethane heat-conducting glue. The heat conducting glue can be widely applied to contact surfaces between heating bodies (power tubes, silicon controlled rectifiers, electrothermal stacks and the like) and heat dissipation facilities (radiating fins, radiating strips, shells and the like) in various electronic products and electrical equipment, and has the functions of heat conducting media and performances of moisture prevention, dust prevention, corrosion prevention, shock prevention and the like. The embodiment selects the heat-conducting silica gel, which is formed by mixing organic silica gel serving as a main body, and polymer materials such as filling materials, heat conduction materials and the like, has good heat-conducting and electric-insulating properties, and is widely applied to electronic components. The heat-conducting silica gel is used for adhering a transformer, a transistor and other heating elements to a printed circuit board assembly or a radiator, is suitable for surface coating or integral encapsulation of various microwave devices such as microwave communication, microwave transmission equipment, a microwave special power supply, a stabilized voltage supply and the like, and the silicon material provides excellent heat-conducting effect for electronic elements generating heat.
The bread board is used for inserting the resistor unit; the bread board is designed and manufactured for the solderless experiment of the electronic circuit, and a plurality of small jacks are arranged on the bread board. Because various electronic components can be inserted or pulled out at will according to needs, the welding is saved, the assembly time of the circuit is saved, and the components can be reused, so the device is very suitable for the assembly, debugging and training of the electronic circuit. The bread board is divided into a non-welding bread board, a combined bread board and a combined bread board. Considering that the number of the simulated electronic components is more than 50, which means that the number of the resistor units is also more than 50, when the bread board is selected, the bread board with enough jacks is selected; the combined bread board is selected according to needs in the embodiment, and has the advantages of conveniently switching on and off a power supply, large area, capability of large-scale tests, high mobility and wide application range, but has the defects of large volume, heavy weight and inconvenience for carrying. The bread board has the advantages that the resistor units connected in series with the heating units can be replaced at any time, so that the efficiency of testing and circuit adjustment is greatly improved, and the time and the economic cost are saved.
The resistor units with the same number as the heating units are used for limiting circuit current and adjusting the actual power of the heating units; the magnitude of the resistance of a resistive element is generally related to temperature, material, length, and also cross-sectional area, and the physical quantity that measures the magnitude of the resistance affected by temperature is the temperature coefficient, which is defined as the percentage of the change in resistance value for each 1 c increase in temperature. The resistor has the function of enabling the actual power of the heating unit to be as close to the rated power of the electronic component as possible, and the simulation accuracy is improved. In this example, a metal film resistor was selected.
The resistance unit comprises a resistor, the resistance value of the resistor before correction is Rn, and the formula of the resistance value Rn is as follows:
the resistance Ro is a resistance value of the heating units connected in series with the resistance units before power-on, the voltage U is an analog voltage U provided by the power supply, and the rated power P is a heating power of an electronic component corresponding to each heating unit.
In this embodiment, since the number of the square ceramic heating sheets is greater than 50, a part of the square ceramic heating sheets is selected for detailed description, and the calculation result is shown in table 1.
Table 1 resistance value of the first resistance unit Rn
The power supply is used for supplying power to the heating unit and the resistance unit; the power supply may be an ac power supply or a dc power supply, and the dc power supply is adopted in this embodiment, and is adapted to the simulated electronic device selected in this embodiment: and a vehicle-mounted domain controller. The DC power supply can provide a constant voltage of 0-18V, and in this embodiment, a 12V DC voltage is used.
As shown in fig. 1 and 2, the power supply is connected to the bread board by power lines, the resistor units are inserted into the bread board, and each resistor unit is connected in series with one heating unit by power lines, and the heating units are fixed on the substrate in an adhering manner;
the simulation module also comprises a device for simulating the working environment of the electronic equipment, the device is used for simulating the actual working environment of the electronic equipment and can be a thermostat or other environment simulators, and the device for simulating the working environment of the electronic equipment is an important means for improving the quality of the electronic equipment and ensuring the working reliability of products in severe environments. In the embodiment, the front and rear cover sample pieces of the radiator of the vehicle-mounted domain controller are used for providing the actual working temperature of the vehicle-mounted domain controller at 85 ℃, and whether the square ceramic heating plate interferes with the front and rear cover sample pieces of the radiator of the vehicle-mounted domain controller or not can be tested.
The data acquisition module is used for acquiring simulation operation data of the simulation module; the method specifically comprises the following steps: the temperature sensor is arranged on each or any heating unit and is used for measuring the temperature Tn of each or any heating unit; and a sensor for measuring a resistance value, a current value, and a voltage value applied to each of the heating units. And calculating the heating power of the heating unit in a heating state by measuring the obtained current value and voltage value, and meanwhile, calculating the simulation operation parameters.
A temperature sensor is a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument and has a plurality of varieties. The measurement method can be divided into a contact type and a non-contact type, and the measurement method can be divided into a thermal resistor and a thermocouple according to the characteristics of sensor materials and electronic elements. In the embodiment, the temperature sensor is a thermocouple sensor, and a thermocouple wire is bonded above the square ceramic heating plate with large heating value, high rated power and large volume and is used for measuring the real-time temperature of the square ceramic heating plate.
The common voltage sensors can be broadly classified into: voltage transformers, hall voltage sensors, and fiber optic voltage sensors, among others. The current sensors are different according to the measurement principle and can be mainly divided into a shunt, an electromagnetic current transformer, an electronic current transformer and the like; in this embodiment, a hall voltage sensor and a hall current sensor are used.
The controller is used for calculating simulation operation parameters according to the simulation operation data, and acquiring simulation correction values of the simulation module according to the simulation operation parameters and rated parameters of electronic components of the electronic equipment, so that the simulation module can be corrected to acquire corrected simulation operation data.
And the output module compares the simulation operation data with the corrected simulation operation data and outputs a comparison result. The output module compares the average value of at least two groups of simulation operation data provided by the corrected simulation module with the simulation operation data and outputs a comparison result to evaluate the heat dissipation condition of the electronic components of the electronic equipment.
The invention also provides a simulation module for simulating the heating condition of the electronic equipment, wherein the simulation module is the simulation module described above.
As shown in fig. 3, the present invention also discloses a testing method based on the simulatable electronic device heating testing apparatus, which comprises the following steps:
s1: constructing a simulation model according to the circuit and structural characteristics of electronic equipment to obtain simulation operation data of the simulation model; the simulation operation data refers to a simulation temperature value T1 of the electronic component.
S2: acquiring simulation operation data of the simulation module after the preset time of electrifying the simulation module; the simulation module is the simulation module; because the resistance values of the heating unit and the resistance unit increase along with the temperature rise after the power is turned on, the voltage value and the current value of each heating unit are measured when the temperature fluctuation of the heating unit is within a preset range after the simulation module operates for a preset time, and thus the effect of accurate measurement and calculation can be achieved.
The predetermined time may be 3, 4 or 5 hours, but is not limited thereto, and In this embodiment, the voltage Un and the current In of each of the heating units are measured when the temperature of the heating units fluctuates within plus or minus 3 degrees celsius after the simulation module operates for 4 hours.
S3: calculating a simulation operation parameter according to the simulation operation data, acquiring a simulation correction value of a simulation module according to the simulation operation parameter and a rated parameter of an electronic component of the electronic equipment, and correcting the simulation module;
further, the method for acquiring the analog correction value specifically includes:
s31: calculating the actual power Pn of the nth heating unit by the formula:
pn ═ Un × IN; wherein n is a natural number not equal to 0; un is a voltage value across the heating unit, and In is a current value flowing through the heating unit.
S32: comparing the actual power Pn of the nth heating unit with the rated power P of the simulated electronic component to obtain a power difference value delta P; if the Δ P is smaller than the preset value, go to step S33; otherwise, n is incremented by 1, and the step S31 is entered; the Δ P formula is:
ΔP＝Pn-P；
the preset value may be set to a specific value, or a percentage of the rated power P, or a value in a certain range, but is not limited thereto, and the preset value needs to be set in combination with the characteristics of the simulated electronic component, which is beneficial to accurately obtain the simulation correction value.
In this embodiment, the preset value of Δ P is set to-0.005W, and the specific Δ P data is detailed in table 2.
TABLE 2 comparison of actual power and rated power of each ceramic heating plate
After the calculation, only the Δ P of the heating unit numbered a41 is greater than the preset value, so the resistance Rn corresponding to the heating unit numbered a41 does not need to be corrected, and the resistances of the other heating units need to be corrected.
This is because after power-on, the resistance values of the heating unit and the resistance unit increase with the temperature rise, and the internal resistance of the power supply and the tiny resistance of the connection line are also considered in the power-on situation, so the resistance value of the heating unit is greater than the resistance value Ro measured before power-on, further resulting in a difference Δ P between the actual power Pn of the heating unit and the rated power P;
s33: calculating an analog correction value Rn ' of the resistance unit connected in series with the nth heating unit, and if the calculation of all the analog correction values Rn ' is completed, correcting the corresponding resistance unit according to the analog correction value Rn '; otherwise, n is incremented by 1, and the step S31 is entered; the analog correction value Rn' formula is as follows:
the significance of the formula is that Un/In is used for accurately representing the resistance of the heating unit Tn under the power-on condition, and (In + Rn + Un) is used for accurately representing the total voltage value of the heating unit and the resistance unit, namely, the influence of temperature on the resistance of the heating unit is considered, the influence of the internal resistance of the direct-current power supply In a circuit after power-on and the resistance of a connecting line is removed, and the analog correction value Rn is calculated more accurately.
Correcting the corresponding resistance unit through the analog correction value Rn'; in this embodiment, the resistance corresponding to the heating unit numbered in table 3 is corrected by plugging and unplugging, and the resistance before correction is Rn, and is replaced with the resistance with the analog correction value Rn'.
The corrected actual power Pn 'of the heating unit is closer to the rated power P through correction, the test error is reduced, the corrected power difference value delta P' is within a preset range, and verification can be performed if necessary. Calculating an actual power Pn ' by measuring the corrected voltage Un ' and current In ' of each of the heating units; specific verification data are detailed in table 3.
TABLE 3 comparison of actual power and rated power of each ceramic heating plate after correction
As proved by verification, the delta P' of the heating units with the numbers is already larger than the preset value. The correction has compensated for the actual power Pn' of the heating unit. Wherein Δ P' after compensation of the a34 heating unit is about 43% of the rated power P, the deviation is too large, which indicates that there is a problem in the calibration process and that recalibration is necessary.
S4: and comparing the simulation operation data with the corrected simulation operation data, and outputting a comparison result.
And after the simulation module is corrected and operates for a preset time, acquiring at least 2 groups of temperature measurement values of the temperature detection unit, and obtaining an average value of the temperature measurement values to be used as heating test data of the domain controller to be tested.
In this embodiment, after the analog module to be corrected operates for 4 hours, 5 groups of temperature measurement values of the temperature detection unit are obtained, and an average value T2 is obtained.
And comparing the simulated temperature value T1 with the simulated operation temperature average value T2, outputting a comparative analysis report, comprehensively evaluating the heating condition of the electronic component, and further evaluating whether the circuit and the structure of the electronic equipment are reasonable in the aspect of heating effect.
The invention also provides a computer-readable storage medium, on which a computer program is stored, which, when executed by a processor, implements the above-described testing method.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (10)
1. A testing device capable of simulating the heating of electronic equipment is characterized by comprising:
the simulation module is used for storing a simulation model constructed according to the circuit and structural characteristics of the electronic equipment and obtaining simulation operation data of the simulation model;
the simulation module is at least used for simulating the heating condition of electronic components of the electronic equipment during working;
the data acquisition module is used for acquiring the simulation operation data of the simulation module;
the controller is used for calculating simulation operation parameters according to the simulation operation data and acquiring simulation correction values of the simulation module according to the simulation operation parameters and rated parameters of electronic components of the electronic equipment, so that the simulation module can be corrected to acquire corrected simulation operation data;
and the output module is used for comparing the simulation operation data with the corrected simulation operation data and outputting a comparison result.
2. The device of claim 1, wherein the simulation module comprises:
a substrate for simulating a circuit board of the electronic device;
the heating units are arranged on the substrate and connected in parallel and used for simulating the electronic components;
a bread board;
the resistor units are the same as the heating units in number and are used for limiting circuit current and adjusting the actual power of the heating units; and
a power supply for supplying power to the heating unit and the resistance unit;
the power supply is connected to the bread board by a power line, the resistor units are inserted into the bread board, meanwhile, each resistor unit is connected with one heating unit in series by a power line, and the heating units are fixedly bonded on the substrate;
the resistance unit comprises a resistor, the resistance value of the resistor before correction is Rn, and the formula of the resistance value Rn is as follows:
the resistance Ro is a resistance value of the heating units connected in series with the resistance units before power-on, the voltage U is an analog voltage U provided by the power supply, and the rated power P is a heating power of the electronic component corresponding to each heating unit.
3. A test device capable of simulating heat generation of an electronic device according to claim 2, wherein the simulation module further comprises a device for simulating an operating environment of the electronic device, so as to simulate an actual operating environment of the electronic device.
4. The device of claim 2, wherein the data acquisition module comprises:
the temperature sensor is arranged on each or any heating unit and is used for measuring the temperature Tn of each or any heating unit; and
and the sensor is used for measuring the resistance value, the current value and the voltage value applied to each heating unit.
5. The device of claim 2, wherein the substrate is made of a flame-resistant material and has the same dimensions as the circuit board to be simulated;
the heating unit is a square ceramic heating sheet with the same size as the corresponding electronic component; and
the square ceramic heating plate is fixedly bonded on the substrate through heat conducting glue, and the fixed position corresponds to the position where the corresponding electronic component is fixed on the circuit board.
6. An analog module for simulating heat generation of an electronic device, wherein the analog module is the analog module according to any one of claims 2 to 5.
7. A testing method based on the testing device of claim 1, characterized by comprising the following steps:
s1: constructing a simulation model according to the circuit and structural characteristics of electronic equipment to obtain simulation operation data of the simulation model; s2: acquiring simulated operation data of the simulation module after the preset time of electrifying the simulation module; wherein the simulation module is the simulation module of claim 2;
s3: calculating a simulation operation parameter according to the simulation operation data, acquiring a simulation correction value of a simulation module according to the simulation operation parameter and a rated parameter of an electronic component of the electronic equipment, and correcting the simulation module;
s4: and comparing the simulation operation data with the corrected simulation operation data, and outputting a comparison result.
8. The testing method according to claim 7, wherein the method for obtaining the analog correction value in step S3 is specifically:
s31: calculating the actual power Pn of the nth heating unit by the formula:
pn ═ Un ═ In; wherein n is a natural number not equal to 0, Un is a voltage value at two ends of the heating unit, and In is a current value flowing through the heating unit;
s32: comparing the actual power Pn of the nth heating unit with the rated power P of the simulated electronic component to obtain a power difference value delta P; if the Δ P is smaller than the preset value, go to step S33; otherwise, n is incremented by 1, and the step S31 is entered; the Δ P formula is:
ΔP＝Pn-P；
s33: calculating an analog correction value Rn ' of the resistance unit connected in series with the nth heating unit, and if the calculation of all the analog correction values Rn ' is completed, correcting the corresponding resistance unit according to the analog correction value Rn '; otherwise, n is incremented by 1, and the step S31 is entered; the formula of the analog correction value Rn' is as follows:
9. the testing method according to claim 8, wherein in step S4, at least two sets of the simulated operation data of the corrected simulation module are obtained, and an average value of the at least two sets of the simulated operation data is compared with the simulated operation data to obtain the comparison result.
10. A computer-readable storage medium, on which a computer program is stored which, when executed by a processor, carries out the testing method of any one of claims 7 to 9.
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| CN202210705059.5A CN115015738A (en) | 2022-06-21 | 2022-06-21 | Testing device capable of simulating heating of electronic equipment, testing method and simulation module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115639380B (en) * | 2022-12-23 | 2023-04-07 | 四川华丰科技股份有限公司 | Power simulator and simulation method |
| CN117750741A (en) * | 2024-02-21 | 2024-03-22 | 成都市卫莱科技有限公司 | Built-in high-density phase change heat regulation and control device, deployment system and method |
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2022
- 2022-06-21 CN CN202210705059.5A patent/CN115015738A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115639380B (en) * | 2022-12-23 | 2023-04-07 | 四川华丰科技股份有限公司 | Power simulator and simulation method |
| CN117750741A (en) * | 2024-02-21 | 2024-03-22 | 成都市卫莱科技有限公司 | Built-in high-density phase change heat regulation and control device, deployment system and method |
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