CN115014630B - Pressure measuring device - Google Patents
Pressure measuring device Download PDFInfo
- Publication number
- CN115014630B CN115014630B CN202210196820.7A CN202210196820A CN115014630B CN 115014630 B CN115014630 B CN 115014630B CN 202210196820 A CN202210196820 A CN 202210196820A CN 115014630 B CN115014630 B CN 115014630B
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- China
- Prior art keywords
- pressure
- main body
- tubule
- circuit board
- sensor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 210000005239 tubule Anatomy 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 230000005540 biological transmission Effects 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 239000011810 insulating material Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 238000003466 welding Methods 0.000 description 11
- 238000005476 soldering Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000009530 blood pressure measurement Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
Abstract
The invention provides a pressure measuring device capable of miniaturizing a main body. The pressure measuring device (1) has a main body (2), and a pressure sensor chip (23) and a sensor housing (32) accommodating the pressure sensor chip are provided in an inner space (26) of the main body, and the pressure sensor chip receives a pressure of a pressure transmission medium (25) filled between pressure receiving diaphragms (12, 13) to detect the pressure. The sensor housing is formed of an insulating material and has an opening for introducing the pressure of the pressure transmission medium into the pressure sensor chip. The main body has first and second pressure guide paths (15, 16) leading from the pressure transmitting chambers (12, 14) to the internal space. The internal space is provided with first and second gaskets (17, 18) attached to the open ends of the pressure guide path, first and second tubules (21, 22), and a substrate (36) on which a circuit for generating an electric signal based on the detection output of the pressure sensor chip is mounted. The sensor housing is mounted on the substrate.
Description
Technical Field
The present invention relates to a pressure measuring device including a sensor chip and a substrate in an internal space of a main body.
Background
As a conventional pressure measuring device, for example, a device described in patent document 1 is known. The pressure measurement device disclosed in patent document 1 includes: a main body having a pressure receiving portion provided at one end side thereof for receiving the pressure of the fluid to be measured; a pressure sensor connected to the pressure receiving portion via a pressure-guiding tube, and detecting the pressure of the fluid to be measured; and a circuit board on which a circuit related to the processing of the electric signal from the pressure sensor is provided. The pressure sensor and the circuit substrate are accommodated inside the main body. The pressure sensor is disposed adjacent to the pressure receiving portion, and the circuit board is disposed at the other end of the main body such that the pressure sensor is located between the circuit board and the pressure receiving portion.
Prior art literature
Patent literature
Patent document 1: japanese patent No. 4955394
Disclosure of Invention
Problems to be solved by the invention
In the pressure measurement device disclosed in patent document 1, a space for mounting a pressure sensor and a space for mounting a circuit board are required in the main body, respectively, and thus there is a problem that the main body is enlarged.
The invention aims to provide a pressure measuring device capable of miniaturizing a main body.
Technical means for solving the problems
In order to achieve the object, a pressure measurement device according to the present invention includes a main body including a pressure receiving diaphragm that receives a pressure of a process fluid to be measured, a pressure sensor chip that receives a pressure of a pressure transmission medium filled between the pressure receiving diaphragm to detect the pressure, and a sensor case that accommodates the pressure sensor chip, wherein the sensor case is formed of an insulating material and has an opening portion for introducing the pressure of the pressure transmission medium into the pressure sensor chip, the main body includes a pressure guide path that opens from a pressure transmission chamber that is formed as a part of a wall and accommodates a part of the pressure transmission medium, and the pressure transmission chamber includes: a stainless steel gasket having a through hole, which is attached to an opening end of the pressure guide path, which opens into the internal space of the main body; a tubule having one end inserted into and joined to the through hole of the gasket and the other end penetrating through the opening of the sensor case and communicating with the pressure sensor chip, the tubule being filled with the pressure transmission medium; and a circuit board on which a circuit for generating an electrical signal based on the detection output of the pressure sensor chip is mounted, wherein the sensor case is mounted on the circuit board.
In the pressure measuring device according to the present invention, the circuit board may have a slit at an end portion thereof for allowing the thin tube to pass therethrough, and the sensor housing may be placed on a peripheral portion of the slit on the circuit board.
In the pressure measuring device according to the present invention, the circuit board may be fixed to the main body in a state where the direction in which the opening end of the pressure guide path is directed is a thickness direction, and a through hole may be formed in a position of the circuit board facing the opening end of the pressure guide path.
In the present invention, bonding pads connected to the circuit may be provided at three sides of the circuit board where the hole portion surrounding the notch is formed, and electrode pads connected to the bonding pads and connected to the bonding pads may be provided on a bottom surface of the sensor case, which is a mounting surface mounted on the circuit board.
ADVANTAGEOUS EFFECTS OF INVENTION
In the present invention, since the sensor housing can be mounted on the circuit board, the space occupied by the circuit board and the sensor housing can be minimized, and the circuit board and the sensor housing can be compactly disposed in the main body. Accordingly, a pressure measuring device that can be miniaturized in the main body can be provided.
Drawings
FIG. 1 is a cross-sectional view of a pressure measuring apparatus of the present invention.
Fig. 2 is a perspective sectional view of the pressure measuring device.
Fig. 3 is an exploded perspective view showing a main body of the pressure measuring device and a resin case in a cutaway.
Fig. 4 is a perspective cross-sectional view of the pressure sensor assembly.
Fig. 5 is an enlarged cross-sectional view showing the joint of the sensor housing and the pressure sensor chip with the capillary tube.
Fig. 6 is an enlarged cross-sectional view showing the joint of the gasket and the thin tube.
FIG. 7 is a plan view of a pressure sensor assembly and a substrate.
Fig. 8 is a perspective view of the pressure sensor assembly and the substrate.
Fig. 9 is a perspective sectional view for explaining a step of welding the gasket to the body.
Fig. 10 is a plan view of a substrate of the second embodiment.
Fig. 11 is an enlarged plan view showing a main portion of the substrate.
Fig. 12 is a perspective view of the pressure sensor assembly and the substrate.
Fig. 13 is a perspective view of the pressure sensor assembly and the substrate.
Fig. 14 is a diagram showing a substrate according to a third embodiment.
Fig. 15 is a perspective view of the pressure sensor assembly.
Detailed Description
(first embodiment)
An embodiment of the pressure measuring apparatus according to the present invention will be described in detail below with reference to fig. 1 to 9.
The pressure measuring device 1 shown in fig. 1 is formed by assembling a plurality of functional components described later to a main body 2 depicted in fig. 1 at a central portion. The main body 2 has a pressure receiving portion 3 depicted on the lower side in fig. 1 and a detecting portion 4 depicted on the upper side. The main body 2 of the present embodiment is made of stainless steel.
The pressure receiving portion 3 is formed in a plate shape having a thickness direction in the left-right direction in fig. 1, and has a first pipe 5 connected to one end in the thickness direction and a second pipe 6 connected to the other end in the thickness direction. The first pipe 5 is filled with a first process fluid 7 to be measured. The second pipe 6 is filled with a second process fluid 8 to be measured.
A first pressure receiving diaphragm 11 that receives the pressure of the first process fluid 7 is provided at one end of the pressure receiving portion 3 connected to the first pipe 5, and a first pressure transmitting chamber 12 is formed in which the first pressure receiving diaphragm 11 is a wall.
A second pressure receiving diaphragm 13 that receives the pressure of the second process fluid 8 is provided at the other end portion of the pressure receiving portion 3 that is connected to the second pipe 6, and a second pressure transmitting chamber 14 is formed in which the second pressure receiving diaphragm 13 is a part of the wall.
As shown in fig. 2, the first pressure transmission chamber 12 and the second pressure transmission chamber 14 communicate with a pressure chamber 24 (see fig. 5) of a pressure sensor chip 23 via a first pressure guide path 15 and a second pressure guide path 16 formed in the main body 2, a first gasket 17 and a second gasket 18 of the detection unit 4 described later, and a first tubule 21 and a second tubule 22. The pressure transfer system from the first pressure transfer chamber 12 and the second pressure transfer chamber 14 to the pressure chamber 24 is filled with a pressure transfer medium 25 (see fig. 1, 5). The pressure sensor chip 23 receives the pressure of the pressure transmission medium 25 filled between the first pressure receiving diaphragm 11 and the second pressure receiving diaphragm 13 to detect the pressure.
The detection portion 4 of the main body 2 is formed in a cylindrical shape and opens in a direction opposite to the pressure receiving portion 3. An internal space 26 of the main body 2 is formed in the detection section 4. The opening of the detection unit 4 is fitted with a cover 27 (see fig. 1), and is closed by the cover 27.
As shown in fig. 3, a first pressure guide passage 15 and a second pressure guide passage 16 are opened at the inner bottom of the detection portion 4. The first pressure guide passage 15 and the second pressure guide passage 16 are formed inside the main body 2 so as to open from the first pressure transmission chamber 12 and the second pressure transmission chamber 14 to the internal space 26 of the main body 2.
As shown in fig. 2, a first gasket 17 is attached to an open end of the first pressure guide passage 15 that opens into the internal space 26. A second gasket 18 is mounted at the open end of the second pressure guide 16 that opens into the interior space 26. The first gasket 17 and the second gasket 18 are each formed of stainless steel in a circular plate shape, and are welded to the main body 2.
As shown in fig. 6, the first gasket 17 and the second gasket 18 are provided with protruding portions 17a and 18a facing the inside of the first pressure guide path 15 and the second pressure guide path 16 at the center portions thereof, and through holes 28 and 29 are formed. As shown in fig. 4, one end of a first tubule 21, which will be described later, is inserted into and bonded to the through hole 28 of the first gasket 17. One end of a second tubule 22, which will be described later, is inserted into and joined to the through hole 29 of the second gasket 18.
The first tubule 21 and the second tubule 22 are each formed of stainless steel and are each bent into a predetermined shape. The first tubule 21 and the second tubule 22 are joined to the first gasket 17 and the second gasket 18 by welding the outer peripheral portions of the tips of the tubules 21 and 22 to the opening edges of the through holes 28 and 29 that open to the protruding portions 17a and 18 a. As shown in fig. 6, the welding is performed so that the first and second gaskets 17 and 18 and the first and second tubules 21 and 22 are sealed in a liquid-tight manner by the welded portion 30.
The first tubule 21 welded to the first gasket 17 and the second tubule 22 welded to the second gasket 18 form part of a pressure sensor assembly, indicated by 31 in fig. 4.
As shown in fig. 4, the pressure sensor assembly 31 is constituted by the first and second gaskets 17 and 18 joined to one ends of the first and second tubules 21 and 22, and the sensor housing 32 and the pressure sensor chip 23 joined to the other ends of the first and second tubules 21 and 22. The first tubule 21 and the second tubule 22 extend from the first gasket 17 and the second gasket 18 in a direction opposite to the pressure receiving portion 3 of the main body 2, and are bent between the first gasket 17 and the second gasket 18 and the sensor housing 32 so that the distance between the tubules 21 and 22 becomes narrower. The interval between the first tubule 21 and the second tubule 22 is widened at one end welded to the first gasket 17 and the second gasket 18, and narrowed at the other end joined to the sensor housing 32.
The sensor housing 32 is constituted by a housing main body 33 formed of a ceramic material and a cover 34 formed of a ceramic material or a metal material. The pressure sensor chip 23 is formed in a cube by overlapping a plurality of plate-like members made of silicon in the thickness direction, and is accommodated in the sensor housing 32.
The case main body 33 of the sensor case 32 is formed in a bottomed tubular shape that is open upward in fig. 4 in a direction opposite to the pressure receiving portion 3 of the main body 2. The cover 34 is formed in a plate shape, and is fixed to the case main body 33 by brazing, seam welding, or the like in a state where the opening of the case main body 33 is closed. To be vacuumized or N-coated in the case body 33 2 The operation of joining the lid 34 to the case main body 33 is performed so that the lid is hermetically sealed in the filled state.
As shown in fig. 4, a plurality of electrode pads 35 electrically connected to a plurality of terminals (not shown) of the pressure sensor chip 23 are formed on the bottom surface of the sensor housing 32, that is, the surface of the housing outside of the bottom wall 33a of the housing main body 33. The electrode pads 35 of this embodiment are disposed at both ends of the bottom wall 33a in a direction orthogonal to the direction in which the first tubule 21 and the second tubule 22 are aligned.
These electrode pads 35 are stacked and soldered on soldering pads 37 formed on a substrate 36 (see fig. 3). By performing this soldering, the sensor housing 32 is electrically connected (mounted) to the soldering pad 37 in a state of being mounted on the substrate 36. In this embodiment, the substrate 36 corresponds to a "circuit substrate" in the present invention.
As shown in fig. 3, the substrate 36 is formed in a disk shape. Two circular through holes 38 and 38 through which the first gasket 17 and the second gasket 18 can pass and a slit 39 connecting these through holes 38 are formed in the substrate 36. As shown in fig. 2, the through hole 38 is formed in the substrate 36 at a position facing the open ends of the first pressure guide path 15 and the second pressure guide path 16.
The operation of superposing the sensor housing 32 on the substrate 36 is performed by passing the first gasket 17 and the second gasket 18 through the through holes 38 and passing the first tubule 21 and the second tubule 22 through the slit 39. As shown in fig. 7 and 8, a circuit 40 for generating an electrical signal based on the detection output of the pressure sensor chip 23 and a connector terminal 41 for external connection are mounted on the substrate 36. Although not shown, a wiring pattern for electrically connecting the bonding pad 37 and the circuit 40 and a wiring pattern for electrically connecting the circuit 40 and the connector terminal 41 are formed on the substrate 36. The positions of the mounting circuit 40 and the connector terminals 41 are not limited to the illustrated positions and may be changed as appropriate.
The substrate 36 of this embodiment is supported by a resin case 51 (see fig. 3), and is supported by the main body 2 via the resin case 51. The resin case 51 is formed in a bottomed cylindrical shape that can be accommodated in the internal space 26 of the main body 2. The resin case 51 has a mounting surface 52 on which the substrate 36 is mounted, a claw piece 53 for mounting and locking the substrate 36 on the mounting surface 52, and two through holes 54, 54 for passing the first gasket 17 and the second gasket 18.
Around the through hole 54, two circular protrusions 55, 55 protruding downward in fig. 3, i.e., in the direction toward the pressure receiving portion 3 of the main body 2, from the bottom wall 51a of the resin case 51, and two cylindrical bodies 56, 56 protruding in the direction opposite to the pressure receiving portion 3 from the bottom wall 51a of the resin case 51 are provided. The circular protrusion 55 is fitted in a circular recess 57 formed in the main body 2 so as to surround the first pressure guide passage 15 and the second pressure guide passage 16. The tubular body 56 is formed with a recess 58 for passing the first tubule 21 and the second tubule 22.
The first gasket 17 and the second gasket 18 are welded to the main body 2 in a state where the substrate 36 is mounted on the resin case 51, whereby the substrate 36 is fixed to the main body 2 in a state where the thickness direction of the substrate 36 is in the up-down direction in fig. 1. The vertical direction in fig. 1 is the direction in which the open ends of the first pressure guide path 15 and the second pressure guide path 16 are directed.
As shown in fig. 5, mounting seats 61 for supporting both side portions of the pressure sensor chip 23 are formed in the bottom wall 33a of the case main body 33, and a first opening 62 and a second opening 63 for introducing the pressure of the pressure transmission medium 25 into the pressure sensor chip 23 are formed (see fig. 4).
As shown in fig. 4, the pressure sensor chip 23 is formed with a first hole 64 into which the other end of the first tubule 21 is inserted and a second hole 65 into which the other end of the second tubule 22 is inserted, and the pressure sensor chip 23 is fixed to the mount 61 of the housing main body 33 by, for example, brazing. The pressure sensor chip 23 is arranged to detect a pressure difference between the pressure of the pressure transmission medium 25 transmitted to the first hole 64 and the pressure of the pressure transmission medium 25 transmitted to the second hole 65.
The first opening 62 and the second opening 63 of the case main body 33 are formed as through holes penetrating the bottom wall 33 a. The apertures of the first opening 62 and the second opening 63 are apertures through which the other ends of the first tubule 21 and the second tubule 22 can pass. The other end of the first tubule 21 penetrates the first opening 62, is inserted into the first hole 64 of the pressure sensor chip 23, and communicates with the pressure sensor chip 23. The other end of the second tubule 22 penetrates the second opening 63 and is inserted into the second hole 65 of the pressure sensor chip 23, and communicates with the pressure sensor chip 23.
As shown in fig. 5, the first tubule 21 and the second tubule 22 are bonded to the pressure sensor chip 23 by an adhesive 66. As the adhesive 66, an epoxy-based adhesive can be used. The inside of the sensor case 32 is in a state in which the epoxy-based adhesive does not absorb moisture. The state being a vacuum state or filled with N 2 And inert gas such as gas. In order to maintain the inside of the sensor housing 32 in such an inert state, the portions of the first tubule 21 and the second tubule 22 that penetrate the first opening 62 and the second opening 63 of the sensor housing 32 are sealed by welding. Soldering to make solder 67 open at firstThe wetting and spreading are performed over the entire area around the opening 62 and the second opening 63.
The first opening 62 and the second opening 63 of the case main body 33 are metallized so that the welding can be performed. Further, the first tubule 21 and the second tubule 22 are coated with a coating for welding at the portions welded to the first opening 62 and the second opening 63. The plating layer for soldering is an Au plating layer based on Ni.
Next, a procedure for assembling the pressure measuring apparatus 1 configured as described above will be described. In assembling the pressure measuring apparatus 1, first, the portions of the first tubule 21 and the second tubule 22 welded to the first opening 62 and the second opening 63 are coated with a coating for welding. In addition, the portions of the case main body 33 where the first opening 62 and the second opening 63 are joined to the lid 34 are metalized in advance.
Then, the first and second washers 17 and 18 are welded to the first and second tubules 21 and 22. Thereafter, the first tubule 21 and the second tubule 22 are passed through the first opening 62 and the second opening 63 of the housing body 33, and the first tubule 21 and the second tubule 22 are bonded to the pressure sensor chip 23. Then, the pressure sensor chip 23 is bonded to the case main body 33, and the pressure sensor chip 23 and the conductive portion of the case main body 33 are connected by, for example, a bonding wire (not shown).
After the pressure sensor chip 23 is mounted on the sensor housing 32 in this way, the first tubule 21 and the second tubule 22 are welded to the first opening 62 and the second opening 63 of the housing main body 33, and the tubule penetration portion is sealed. Then, the case main body 33, the first tubule 21, and the second tubule 22 are loaded into a joining device, not shown, and the inside of the case main body 33 is made inert, and the lid 34 is attached to the case main body 33 by brazing or seam welding. The pressure sensor assembly 31 is completed by the cover 34 being engaged with the housing main body 33.
The pressure sensor assembly 31 is then mounted to the substrate 36. The installation operation is performed as follows: the sensor housing 32 is welded to the substrate 36 by passing the first gasket 17 and the second gasket 18 through the through-hole 38 of the substrate 36 and passing the first tubule 21 and the second tubule 22 through the slit 39. Then, the substrate 36 is locked to the resin case 51, and the resin case 51 is inserted into the internal space 26 of the main body 2. When the substrate 36 is assembled to the resin case 51, the positions of the substrate 36 are adjusted so that the first gasket 17 and the second gasket 18 enter the through hole 54 of the resin case 51 while the first gasket 17 and the second gasket 18 are observed through the through hole 38 of the substrate 36. Then, the circular protrusion 55 of the resin case 51 is fitted into the circular recess 57 of the main body 2, and the projections 17a, 18a of the first gasket 17 and the second gasket 18 are inserted into the first pressure guide path 15 and the second pressure guide path 16.
Next, the first gasket 17 and the second gasket 18 are welded to the main body 2. As shown in fig. 9, the welding is performed by placing the main body 2 on the lower electrode 71, pressing the upper electrode 72 against the first gasket 17 and the second gasket 18, and resistance welding. The upper electrode 72 is formed in a rod shape, and overlaps the first gasket 17 and the second gasket 18 through the through-hole 54 of the resin case 51 and the through-hole 38 of the substrate 36. A slit 73 is formed at the distal end portion of the upper electrode 72 to allow the first tubule 21 and the second tubule 22 to pass through.
After the first gasket 17 and the second gasket 18 are welded to the main body 2, the pressure transmission medium 25 is filled into the pressure transmission path from the first pressure transmission chamber 12 and the second pressure transmission chamber 14 into the pressure sensor chip 23. The filling is performed using filling holes (not shown) extending from the first pressure transmission chamber 12 and the second pressure transmission chamber 14 to the outside of the main body 2.
The sensor housing 32 of the pressure measuring apparatus 1 thus constructed is mounted on the substrate 36. Therefore, since the sensor housing 32 can be mounted on the substrate 36, the occupied space of the substrate 36 and the sensor housing 32 can be minimized, and the substrate 36 and the sensor housing 32 can be compactly disposed in the main body 2. Therefore, according to this embodiment, a pressure measuring device that can reduce the size of the main body can be provided.
(second embodiment)
The substrate and the pressure sensor assembly may be configured as shown in fig. 10 to 13. In fig. 10 to 13, the same or equivalent members as those described with reference to fig. 1 to 9 are denoted by the same reference numerals, and detailed description thereof is appropriately omitted.
The substrate 81 shown in fig. 10 is formed in a circular plate shape, and has two through holes 38 and a cutout 82 located at one position of the outer peripheral portion. The two through holes 38 and 38 are formed at the same positions as those in the first embodiment, that is, at positions facing the open ends of the first pressure guide passage 15 and the second pressure guide passage 16. Further, the circuit 40 and the connector terminals 41 are mounted on the substrate 81. The positions of the mounting circuit 40 and the connector terminals 41 are not limited to the positions shown in fig. 10, and may be changed as appropriate.
The slit 82 is formed at the radial end of the disk-shaped substrate 81 to extend from the outer peripheral edge 81a of the substrate 81 toward the center for passing the first tubule 21 and the second tubule 22. The slit 82 of this embodiment extends in a direction orthogonal to the virtual line L connecting the centers of the two through holes 38. Therefore, the notch 82 extends toward the center between the one through hole 38 and the other through hole 38. The slit 82 has a first side 82a and a second side 82b extending from the outer peripheral edge 81a of the substrate 81 to the virtual line L, and a third side 82c extending parallel to the virtual line L so as to connect one ends of the sides, and is formed so that the opening is surrounded by the first side 82a to the third side 82 c.
As shown in fig. 11, a plurality of bonding pads 83 are formed on a portion of the substrate 81 where the first side 82a of the cutout 82 is formed. A plurality of bonding pads 84 are formed on the portion of the substrate 81 where the second side 82b of the cutout 82 is formed. A plurality of bonding pads 85 are formed on the portion of the substrate 81 on which the third side 82c of the cutout 82 is formed. The bonding pads 83 to 85 are connected to the circuit 40 mounted on the substrate 81 through a wiring pattern not shown. The sensor housing 32 is mounted on the bonding pads 83 to 85. That is, the sensor housing 32 is mounted and fixed on the periphery of the slit 82 on the substrate 81 in a state where the first tubule 21 and the second tubule 22 pass through the slit 82.
When the bonding pads 83 to 85 are disposed in the vicinity of one side of the cutout 82, stress concentration occurs when external force is applied to the sensor case 32 during the process of manufacturing the pressure measuring device or when thermal stress is generated in the bonding portion due to a change in ambient temperature. In addition, since the area of each bonding surface of the electrode pad 35 on the sensor housing 32 side is small, the process difficulty is high, and the bonding strength of the electrode pad 35 is also small. In order to avoid such a problem, in the present embodiment, bonding pads 83 to 85 are disposed at 3-side portions of the notch 82 in a dispersed manner.
The plurality of bonding pads 83 provided near the first side 82a and the plurality of bonding pads 84 provided near the second side 82b are preferably arranged symmetrically left and right in fig. 11. Therefore, when the bonding pads 83 and 84 are asymmetric, a dummy bonding pad without wiring is provided on the substrate 81, and a dummy electrode pad without wiring is provided on the sensor housing 32, thereby realizing a laterally symmetric structure. In this embodiment, the bonding pads 85 for passing the sensor signal are provided so as to be aligned along the third side 8 c. By adopting this configuration, efficiency in mounting the sensor housing 32 on the substrate 81 improves.
The first tubule 21 and the second tubule 22 of this embodiment are formed to be curved as shown in fig. 12 or 13. The first tubule 21 and the second tubule 22 shown in fig. 12 have two curved portions 21a, 21b, 22a, and 22b, respectively, and are formed in a splayed shape when viewed from a direction orthogonal to the main surface 81b of the substrate 81.
The first tubule 21 and the second tubule 22 shown in fig. 13 have three curved portions 21a to 21c, 22a to 22c, respectively, and are formed in L-shapes when viewed from a direction orthogonal to the main surface 81b of the substrate 81.
As shown in this embodiment, since the slit 82 is formed at the end of the substrate 81 and the sensor housing 32 is placed and fixed on the peripheral portion of the slit 82, the slit 39 for passing the first tubule 21 and the second tubule 22 is not required in the substrate 81, and therefore the central portion of the substrate 81 can be used as the component mounting space 86 (see fig. 10). Therefore, a large number of electronic components can be mounted on the substrate 81 without enlarging the substrate 81.
(third embodiment)
The substrate and the pressure sensor assembly are configured as shown in fig. 14 (a) and (B) and fig. 15. In fig. 14 and 15, the same or equivalent members as those described with reference to fig. 1 to 13 are denoted by the same reference numerals, and detailed description thereof is appropriately omitted. Fig. 14 (a) is a side view of the substrate viewed from the front surface side where the sensor housing is mounted, and fig. 14 (B) is a side view of the substrate viewed from the rear surface side where the sensor housing is not mounted. Fig. 14 (a) and (B) are drawn in a state where the first tubule and the second tubule are not mounted on the sensor housing.
The substrate 91 shown in fig. 14 (a) and (B) is formed in a rectangular plate shape, and has a slit 82 at one end in the longitudinal direction. In fig. 14 (a) and (B), four holes 92 provided in the substrate 91 are holes for passing mounting bolts, not shown. The mounting bolts fix the substrate 91 to a support bracket on the main body 2 side, not shown. The main surface 91a of the substrate 91 extends parallel to the longitudinal direction of the main body 2 (the direction in which the pressure receiving portion 3 and the detecting portion 4 are aligned, and the vertical direction in (a) and (B) of fig. 14), and the slit 82 is fixed to the main body 2 via a support bracket in a posture approaching the pressure receiving portion 3.
The portions of the substrate 91 where the cutouts 82 are formed are provided with bonding pads 83 to 85 as in the second embodiment, and the sensor housing 32 is mounted, placed, and fixed on these bonding pads 83 to 85. As shown in fig. 15, the first tubule 21 and the second tubule 22 of this embodiment are bent so that the other ends 95 and 96 connected to the first gasket 17 and the second gasket 18 are perpendicular to the ends 93 and 94 connected to the sensor housing 32.
As shown in this embodiment, by disposing the substrate 91 so as to extend parallel to the direction in which the pressure receiving portion 3 and the detecting portion 4 of the main body 2 are arranged, the detecting portion 4 can be compactly formed so that the exclusive area becomes small.
Symbol description
The pressure measuring device 1 …, the pressure measuring device 2, the …, the process fluid 8, the …, the process fluid 11, …, the pressure receiving diaphragm 12, …, the pressure transmitting chamber 13, …, the pressure receiving diaphragm 14, …, the pressure transmitting chamber 15, …, the pressure transmitting path 16, …, the gasket 17, …, the gasket 18, …, the first tubule 21, …, the second tubule 22, the pressure sensor chip 23, …, the pressure transmitting medium 25, …, the internal space 26, the through holes 28, 29, …, the sensor housing 32, the electrode pad 35, the electrode pad 36, 81, 91, …, the circuit board (circuit board), the opening 63, the second opening 63, the opening 82, …, the cutout 38, the through holes 82a …, the first side 82a …, the second side 82b …, the third side 82c …, and the bonding pad for bonding 37, 83, 85, ….
Claims (5)
1. A pressure measuring device comprising a main body having a pressure receiving diaphragm for receiving a pressure of a process fluid to be measured, wherein a pressure sensor chip for receiving a pressure of a pressure transmission medium filled between the pressure sensor chip and the pressure receiving diaphragm to detect the pressure and a sensor case for accommodating the pressure sensor chip are provided in an inner space of the main body,
the pressure measuring device is characterized in that,
the sensor housing is formed of an insulating material and has an opening for introducing the pressure of the pressure transmission medium into the pressure sensor chip,
the body having a pressure guide leading from a pressure transmitting chamber, which forms the pressure receiving diaphragm as a part of a wall and accommodates a part of the pressure transmitting medium, to the internal space of the body,
in the internal space of the main body, there are provided:
a stainless steel gasket welded to an opening end of the pressure guide passage which opens into the internal space of the main body and having a through hole,
a tubule having one end inserted into and joined to the through hole of the gasket and the other end penetrating through the opening of the sensor case and communicating with the pressure sensor chip, the tubule being filled with the pressure transmission medium; and
a circuit board on which a circuit for generating an electrical signal based on the detection output of the pressure sensor chip is mounted,
the sensor housing is mounted on the circuit substrate,
and a through hole is formed in the circuit board at a position facing the opening end of the pressure guide path, and the sensor housing does not overlap with the through hole of the circuit board.
2. The pressure measuring apparatus according to claim 1, wherein,
the circuit board has a slit at an end portion for passing the tubule,
the sensor housing is placed on a peripheral portion of the cutout on the circuit board.
3. A pressure measuring apparatus according to claim 2, wherein,
the circuit board is fixed to the main body in a state in which the direction in which the opening end of the pressure guide path is directed is a thickness direction.
4. A pressure measuring apparatus according to claim 2, wherein,
the circuit board is fixed on the main body in a state that a direction orthogonal to a direction in which the opening end of the pressure guide path points is a thickness direction,
the tubule is bent so that the other end connected to the gasket is perpendicular to the one end connected to the sensor housing.
5. A pressure measuring device according to any one of claim 2 to 4, wherein,
bonding pads connected to the circuit are provided on three sides of the circuit board where the hole portions surrounding the notch are formed,
an electrode pad connected to the bonding pad and electrically connected thereto is provided on a bottom surface of the sensor housing, which is a mounting surface mounted on the circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-033367 | 2021-03-03 | ||
| JP2021033367A JP2022134312A (en) | 2021-03-03 | 2021-03-03 | Pressure measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115014630A CN115014630A (en) | 2022-09-06 |
| CN115014630B true CN115014630B (en) | 2024-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210196820.7A Active CN115014630B (en) | 2021-03-03 | 2022-03-01 | Pressure measuring device |
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| Country | Link |
|---|---|
| JP (1) | JP2022134312A (en) |
| KR (1) | KR102628745B1 (en) |
| CN (1) | CN115014630B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2022134312A (en) | 2022-09-15 |
| KR20220124648A (en) | 2022-09-14 |
| KR102628745B1 (en) | 2024-01-23 |
| CN115014630A (en) | 2022-09-06 |
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