CN115008052B - Electric connection method for semiconductor laser Bar array package - Google Patents
Electric connection method for semiconductor laser Bar array package Download PDFInfo
- Publication number
- CN115008052B CN115008052B CN202210617069.3A CN202210617069A CN115008052B CN 115008052 B CN115008052 B CN 115008052B CN 202210617069 A CN202210617069 A CN 202210617069A CN 115008052 B CN115008052 B CN 115008052B
- Authority
- CN
- China
- Prior art keywords
- tungsten
- copper alloy
- solder
- alloy block
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 92
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims abstract description 92
- 229910000679 solder Inorganic materials 0.000 claims abstract description 60
- 238000003466 welding Methods 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000010292 electrical insulation Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000007774 longterm Effects 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
Abstract
The invention provides an electric connection method of a Bar array package of a semiconductor laser, which ensures the stability and reliability of the Bar array package, ensures the quality of the package surface and ensures the long-term stable state of an electric connection area. The method is characterized by comprising the following steps of: a, placing a pair of tungsten-copper alloy blocks, bar strips and a first solder sheet together by using a clamp, and heating to form a module; b, arranging adjacent modules in sequence, and embedding solder into a pairing groove between the opposite surfaces of the tungsten-copper alloy blocks, so that the tungsten-copper alloy blocks of the adjacent modules are quickly aligned and spliced through the solder, and then heating the modules to finish welding, and the solder in the pairing groove enables the two tungsten-copper alloy blocks which belong to the two modules to be completely attached.
Description
Technical Field
The invention relates to the technical field of Bar packaging, in particular to an electric connection method of a semiconductor laser Bar array packaging.
Background
With the increasing requirements of application fields on laser power, bar-packaged high-power semiconductor laser devices are emerging and rapidly developed. The high power is accompanied by the generation of large current, and the welding reliability determines a great factor in the actual production and the use process of customers. Particularly in the case of soft solder packaging, thermal migration and surface oxidation are liable to occur during operation, which results in negative effects such as increased voids, increased resistivity, etc., and electrical connection regions are liable to burn out and carbonize during long-term operation.
Therefore, it is highly desirable to find an electrical connection method for Bar array packages that is stable and reliable and ensures stable operation of the product.
Disclosure of Invention
In view of the above problems, the present invention provides an electrical connection method for a Bar array package of a semiconductor laser, which makes the Bar array package stable and reliable, ensures the quality of the package surface, and ensures a long-term stable state of the electrical connection area.
The electric connection method of the semiconductor laser Bar array package is characterized by comprising the following steps of:
a, placing a pair of tungsten-copper alloy blocks, bar strips and a first solder sheet together by using a clamp, and heating to form a module;
b, arranging adjacent modules in sequence, and embedding solder into a pairing groove between the opposite surfaces of the tungsten-copper alloy blocks, so that the tungsten-copper alloy blocks of the adjacent modules are quickly aligned and spliced through the solder, and then heating the modules to finish welding, and the solder in the pairing groove enables the two tungsten-copper alloy blocks which belong to the two modules to be completely attached.
It is further characterized by:
In the step a, a pair of tungsten-copper alloy blocks are specifically a first tungsten-copper alloy block and a second tungsten-copper alloy block, wherein the opposite inner surfaces of the first tungsten-copper alloy block and the second tungsten-copper alloy block are respectively stuck with a first solder piece, the central areas of the two first solder pieces clamp the corresponding surfaces of Bar strips, the inner surfaces of the first tungsten-copper alloy block and the second tungsten-copper alloy block clamp the Bar strips under the action of the clamping force of a clamp, and then the Bar strips are heated, so that the inner surfaces of the pair of tungsten-copper alloy blocks, the two first solder pieces and the Bar strips are combined to form independent modules, each first tungsten-copper alloy block and each second tungsten-copper alloy block are plane, at least one first copying inner groove is arranged on the surface area of the outer surface of the first tungsten-copper alloy block, at least one second copying inner groove is arranged on the surface area of the outer surface of the second tungsten-copper alloy block, the first copying inner grooves and the second copying inner grooves are the same in number, and the first copying inner grooves correspond to the first copying inner grooves in the height direction, and the first copying inner grooves are arranged in the first copying inner grooves;
B, the solder in the step b is profiled to the shape after the first profiling inner groove and the second profiling inner groove are spliced;
the first profiling inner groove and the second profiling inner groove are all arranged in a penetrating manner along the width direction of the outer surface of the tungsten copper alloy block, so that the solder is ensured to be stably and reliably connected with the two modules;
the longitudinal section shapes of the first profiling inner groove and the second profiling inner groove comprise profiling grooves such as trapezoid grooves, V-shaped grooves or semicircular grooves and semi-elliptic grooves;
The tungsten-copper alloy block is made of a material which is subjected to surface treatment and used for welding, and the tungsten-copper alloy block comprises, but is not limited to, a material which can be used for welding, such as tungsten-copper alloy block, red copper, oxygen-free copper and the like, or a material which can be used for welding after being prepared;
in the step a, the bottom of each tungsten-copper alloy block is welded and connected with an independent single ceramic radiating fin through a second flat welding flux piece;
In the step a, the bottom of the module welded into a whole is welded with a whole ceramic radiating fin through a second flat welding flux piece;
The ceramic radiating fins positioned at the two ends of the whole direction are provided with side end bulge supporting blocks, which ensure reasonable assembly operation of the whole structure and the heat sink base;
The materials of the first solder sheet and the second solder sheet are materials for electric connection, including but not limited to gold-tin solder, indium solder or other materials for welding metal, or other doped metals, and glue for electric conduction;
The surface of all the ceramic radiating fins can be combined with the module after being metallized;
The ceramic heat sink is made of a material for electrical insulation, including but not limited to a ceramic material such as alumina, aluminum nitride, zirconia, or other materials available by welding or bonding or materials prepared for heat dissipation by welding or bonding.
After the invention is adopted, each Bar chip and a pair of tungsten copper alloy blocks are combined in advance to form the module through the first solder piece, and as the exposed surface of each tungsten copper alloy block is provided with the pairing groove, the adjacent modules can be quickly paired and assembled through the solder during combination, and the connection operation of the solder piece, the solder and the attachment surface can be completed only through heating, so that the Bar array package is stable and reliable, the quality of the package surface is ensured, and the long-term stable state of an electric connection area is ensured.
Drawings
FIG. 1 is a schematic diagram of a module according to an embodiment of the present invention;
FIG. 2 is a schematic illustration of the split assembly of adjacent modules according to the present invention;
FIG. 3 is a front view of a first embodiment of a tungsten copper alloy block suitable for use in the present invention;
FIG. 4 is a front view of a second embodiment of a tungsten copper alloy block suitable for use in the present invention;
FIG. 5 is a front view of a third embodiment of a tungsten copper alloy block suitable for use in the present invention;
FIG. 6 is a schematic front view of the completed assembled integral module;
FIG. 7 is an assembled perspective view of the completed weld and heatsink base of the invention;
FIG. 8 is a schematic view of a partial enlarged structure at A in FIG. 7;
the part names of the corresponding serial numbers are as follows:
Tungsten copper alloy block 10, first tungsten copper alloy block 11, first profiling inner groove 111, second tungsten copper alloy block 12, second profiling inner groove 121, end tungsten copper alloy block 13, bar strip 20, first solder sheet 30, second solder sheet 40, ceramic heat sink 50, side end protrusion support block 51, solder 60, heat sink base 70, module 100.
Detailed Description
Electric connection method for semiconductor laser Bar array package
The first embodiment comprises the following steps:
a, placing a pair of tungsten copper alloy blocks 10, bar strips 20 and first solder sheets 30 together by using a clamp, welding the bottom of each tungsten copper alloy block 10 to connect an independent single ceramic cooling fin 50 by a tiled second solder sheet 40, and heating to form a module 100;
b, arranging adjacent modules 100 in sequence, and embedding solder 60 into a pairing groove between the opposite surfaces of the tungsten copper alloy blocks 10, so that the tungsten copper alloy blocks 10 of the adjacent modules 100 are quickly aligned and spliced through the solder, and then heating the modules, so that the adjacent modules 100 finish welding, and the two tungsten copper alloy blocks 10 which are respectively divided into two modules 100 are completely attached by the solder 60 in the pairing groove.
The second embodiment comprises the following steps:
a, placing a pair of tungsten copper alloy blocks 10, bar strips 20 and a first solder sheet 30 together by using a clamp, welding a whole ceramic radiating fin at the bottom of the tungsten copper alloy blocks 10 by a second solder sheet 40 which is tiled, and heating to form a module 100;
b, arranging adjacent modules 100 in sequence, and embedding solder 60 into a pairing groove between the opposite surfaces of the tungsten copper alloy blocks 10, so that the tungsten copper alloy blocks 10 of the adjacent modules 100 are quickly aligned and spliced through the solder, and then heating the modules, so that the adjacent modules 100 finish welding, and the two tungsten copper alloy blocks 10 which are respectively divided into two modules 100 are completely attached by the solder 60 in the pairing groove.
In the case of a specific implementation of the method,
In the step a, a pair of tungsten-copper alloy blocks 10 are specifically a first tungsten-copper alloy block 11 and a second tungsten-copper alloy block 12, the first tungsten-copper alloy block 11 and the second tungsten-copper alloy block 12 are identical tungsten-copper alloy blocks and are only symmetrically arranged about the center, first solder pieces 30 are respectively attached to opposite inner surfaces of the first tungsten-copper alloy block 11 and the second tungsten-copper alloy block 12, central areas of the two first solder pieces 30 clamp corresponding surfaces of Bar strips 20, inner surfaces of the first tungsten-copper alloy block 11 and the second tungsten-copper alloy block 12 clamp Bar strips 20 through the first solder pieces 30 under the action of the clamping force of a clamp, then the tungsten-copper alloy blocks are heated, so that the pair of tungsten-copper alloy blocks 10, the two first solder pieces 30 and the Bar strips 20 are combined to form an independent module 100, the inner surfaces of each first tungsten copper alloy block 11 and each second tungsten copper alloy block 12 are planes, at least one first profiling inner groove 111 is arranged on the surface area of the outer surface of each first tungsten copper alloy block 11, at least one second profiling inner groove 121 is arranged on the surface area of the outer surface of each second tungsten copper alloy block 12, the number of the first profiling inner grooves 111 and the number of the second profiling inner grooves 121 are the same, the height direction positions of the first profiling inner grooves 111 correspond to the height direction positions of the second profiling inner grooves 121, the first profiling inner grooves 111 and the second profiling inner grooves 121 are arranged in a one-to-one correspondence manner, and when the tungsten copper alloy block 10 is in specific implementation, the number of the first profiling inner grooves 111 and the second profiling inner grooves 121 is one and are arranged at the middle position of the height direction of the tungsten copper alloy block 12;
The solder 60 in the step b is formed by profiling the shape of the first profiling inner groove 111 and the second profiling inner groove 121 after being spliced;
The first profiling inner groove 111 and the second profiling inner groove 121 are all arranged in a penetrating manner along the width direction of the outer surface of the tungsten copper alloy block 10, so that the solder 60 is ensured to be stably and reliably connected with the two modules 100;
The longitudinal cross-sectional shapes of the first profiling inner groove 111 and the second profiling inner groove 121 include, but are not limited to, trapezoidal grooves (see fig. 3), V-shaped grooves (see fig. 4) or semicircular grooves (see fig. 5), semi-elliptical grooves;
The tungsten copper alloy block 10 is made of a material which is subjected to surface treatment and used for welding, and the tungsten copper alloy block comprises, but is not limited to, materials which can be used for welding, such as tungsten copper alloy blocks, red copper, oxygen-free copper and the like, or materials which can be used for welding after being prepared;
The materials of the first solder sheet 30 and the second solder sheet 40 are materials for making electrical connection, including but not limited to gold-tin solder, indium solder or other materials for soldering metal, or other doped metals, and glue for electrical conduction;
All the ceramic heat sinks 50 need to be metallized on their surfaces before being combined with the module;
the ceramic heat sink 50 is made of a material for electrical insulation, including but not limited to a ceramic material such as alumina, aluminum nitride, zirconia, or other materials available by welding or bonding or materials prepared for heat dissipation by welding or bonding.
In a specific embodiment, as shown in fig. 6-8, after the two end modules at the two ends in the whole direction are provided with the independent pairing tungsten copper alloy blocks, the independent end tungsten copper alloy blocks 13 are further arranged, and the ceramic cooling fins 50 at the bottom of the end tungsten copper alloy blocks 13 are provided with side end bulge supporting blocks 51, so that the reasonable assembly operation of the whole structure and the heat sink base 70 is ensured.
Before electric connection, processing tungsten-copper alloy blocks for packaging Bar strips, then gold-plating the tungsten-copper alloy blocks for packaging Bar strips, and synchronously carrying out surface metallization on ceramic radiating fins; and then each Bar chip and a pair of tungsten copper alloy blocks are combined in advance through a first solder sheet to form a module, and as the exposed surface of each tungsten copper alloy block is provided with a pairing groove, the adjacent modules can be quickly paired and assembled through solder during combination, and the connection operation of the solder sheet, the solder and the attachment surface is completed only through heating, so that the Bar array package is stable and reliable, the quality of the package surface is ensured, and the long-term stable state of an electric connection area is ensured.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. The electric connection method of the semiconductor laser Bar array package is characterized by comprising the following steps of:
a, placing a pair of tungsten-copper alloy blocks, bar strips and a first solder sheet together by using a clamp, and heating to form a module;
b, arranging adjacent modules in sequence, and embedding solder into a pairing groove between the opposite surfaces of the tungsten-copper alloy blocks, so that the tungsten-copper alloy blocks of the adjacent modules are quickly aligned and spliced through the solder, and then heating the modules to finish welding, and the solder in the pairing groove enables the two tungsten-copper alloy blocks which belong to the two modules to be completely attached;
In the step a, a pair of tungsten-copper alloy blocks are specifically a first tungsten-copper alloy block and a second tungsten-copper alloy block, wherein the opposite inner surfaces of the first tungsten-copper alloy block and the second tungsten-copper alloy block are respectively stuck with a first solder piece, the central areas of the two first solder pieces clamp the corresponding surfaces of Bar strips, the inner surfaces of the first tungsten-copper alloy block and the second tungsten-copper alloy block clamp the Bar strips under the action of the clamping force of a clamp, and then the Bar strips are heated, so that the inner surfaces of the pair of tungsten-copper alloy blocks, the two first solder pieces and the Bar strips are combined to form independent modules, each first tungsten-copper alloy block and each second tungsten-copper alloy block are plane, at least one first copying inner groove is arranged on the surface area of the outer surface of the first tungsten-copper alloy block, at least one second copying inner groove is arranged on the surface area of the outer surface of the second tungsten-copper alloy block, the first copying inner grooves and the second copying inner grooves are the same in number, and the first copying inner grooves correspond to the first copying inner grooves in the height direction, and the first copying inner grooves are arranged in the first copying inner grooves;
B, the solder in the step b is profiled to the shape after the first profiling inner groove and the second profiling inner groove are spliced;
The first profiling inner groove and the second profiling inner groove are all arranged in a penetrating manner along the width direction of the outer surface of the tungsten copper alloy block;
The longitudinal section shapes of the first profiling inner groove and the second profiling inner groove are trapezoid grooves, V-shaped grooves, semicircular grooves or semi-elliptic grooves.
2. The electrical connection method of the semiconductor laser Bar array package according to claim 1, wherein: the tungsten-copper alloy block is made of a material which is subjected to surface treatment and then is used for welding.
3. The electrical connection method of the semiconductor laser Bar array package according to claim 1, wherein: in the step a, the bottom of each tungsten copper alloy block is welded with an independent single ceramic radiating fin through a second flat welding flux piece.
4. The electrical connection method of the semiconductor laser Bar array package according to claim 1, wherein: in step a, the bottom of the module soldered as a whole is soldered with a monolithic ceramic heat sink by a tiled second solder sheet.
5. A method for electrically connecting a semiconductor laser Bar array package according to claim 3 or 4, wherein: the first solder sheet and the second solder sheet are made of materials for electric connection.
6. A method for electrically connecting a semiconductor laser Bar array package according to claim 3 or 4, wherein: the surface of all the ceramic radiating fins can be combined with the module after being metallized; the ceramic heat sink is made of a material for electrical insulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210617069.3A CN115008052B (en) | 2022-06-01 | 2022-06-01 | Electric connection method for semiconductor laser Bar array package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210617069.3A CN115008052B (en) | 2022-06-01 | 2022-06-01 | Electric connection method for semiconductor laser Bar array package |
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| Publication Number | Publication Date |
|---|---|
| CN115008052A CN115008052A (en) | 2022-09-06 |
| CN115008052B true CN115008052B (en) | 2024-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210617069.3A Active CN115008052B (en) | 2022-06-01 | 2022-06-01 | Electric connection method for semiconductor laser Bar array package |
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| Country | Link |
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| CN (1) | CN115008052B (en) |
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| CN112992691A (en) * | 2021-04-23 | 2021-06-18 | 度亘激光技术（苏州）有限公司 | Semiconductor device and soldering method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005005511A (en) * | 2003-06-12 | 2005-01-06 | Fanuc Ltd | Semiconductor laser apparatus |
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|---|---|---|---|---|
| CN102130426A (en) * | 2010-11-19 | 2011-07-20 | 无锡亮源激光技术有限公司 | Semiconductor laser horizontal array for wind cooling solid laser pump |
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| Publication number | Publication date |
|---|---|
| CN115008052A (en) | 2022-09-06 |
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