CN115007539A - Method for removing residual glue and foreign matters of product in semiconductor packaging - Google Patents
Method for removing residual glue and foreign matters of product in semiconductor packaging Download PDFInfo
- Publication number
- CN115007539A CN115007539A CN202210633615.2A CN202210633615A CN115007539A CN 115007539 A CN115007539 A CN 115007539A CN 202210633615 A CN202210633615 A CN 202210633615A CN 115007539 A CN115007539 A CN 115007539A
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- product
- foreign matters
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- soaking
- cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Abstract
The invention relates to a method for removing residual glue and foreign matters of a product in semiconductor packaging, which comprises the following steps: stripping the product, and drying the product; soaking the dried product into a dissolving solution, wherein the dissolving solution is formed by mixing organic amine alkali and an organic solvent, and soaking the product for 60 to 90 minutes at normal temperature; after soaking, washing the product with alcohol; after washing, cleaning the product by using ultrasonic cleaning equipment filled with alcohol for 20-30 minutes at a temperature not higher than 40 ℃; and after the cleaning is finished, the product is dried for 20-30 minutes, so that the residual glue and foreign matters of the product are removed. The ratio of the residual glue and the foreign matters on the surface of the product after removal is below 1%, so that the effect of removing the residual glue and the foreign matters of the product is improved, and the appearance, the quality and the qualification rate of the product are ensured.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a method for removing residual glue and foreign matters of a product in semiconductor packaging.
Background
The method comprises the following steps of firstly, cleaning the product from a UV film by using alcohol, then, putting the product into ultrasonic equipment filled with 96% alcohol, cleaning the product for 20 minutes at constant temperature, then, soaking the product in 96% industrial alcohol for 20 minutes, then, drying the product for 30 minutes by using a deionized fan, confirming the appearance of the product under a microscope of 8-50X after drying the product, and then, enabling the product to enter the next process. After the product is cleaned by the existing alcohol cleaning operation, 20% of residual glue and foreign matters on the surface of the product cannot be taken out, the residual glue and foreign matters are in a risk of material clamping when continuing to a testing procedure, and the appearance, the electrical property and the yield of the product are influenced by the residual glue and the foreign matters.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a method for removing residual glue and foreign matters of a product in semiconductor packaging, and solves the problems that after the product is cleaned by using the existing alcohol, 20% of residual glue and foreign matters remain on the surface, so that the subsequent material clamping risk is easy to occur, and the appearance, the electrical property and the yield of the product are influenced.
The technical scheme for realizing the purpose is as follows:
the invention provides a method for removing residual glue and foreign matters of a product in semiconductor packaging, which comprises the following steps:
stripping the product, and drying the product;
soaking the dried product into a dissolving solution, wherein the dissolving solution is formed by mixing organic amine alkali and an organic solvent, and soaking the product for 60 to 90 minutes at normal temperature;
after soaking, washing the product with alcohol;
after washing, cleaning the product by using ultrasonic cleaning equipment filled with alcohol for 20-30 minutes at the cleaning temperature not higher than 40 ℃; and
and after the cleaning is finished, the product is dried for 20-30 minutes, so that the residual glue and foreign matters of the product are removed.
The method for removing the residual gum and the foreign matters adopts the dissolving solution to soak the product line, the residual gum and the foreign matters on the surface of the product are dissolved a little by a little through the swelling capacity of the organic solvent in the alkaline environment, the ratio of the residual gum and the foreign matters on the surface of the product cleaned after soaking is less than 1 percent, the effect of removing the residual gum and the foreign matters of the product is improved, and the appearance, the quality and the qualification rate of the product are ensured.
The method for removing the residual glue and the foreign matters in the semiconductor packaging is further improved in that the content of the organic amine alkali and the organic solvent is between 40 and 60 percent.
The method for removing the residual glue and the foreign matters in the semiconductor packaging is further improved in that the content of the organic amine alkali and the content of the organic solvent are both 50 percent.
The method for removing the residual glue and the foreign matters in the semiconductor packaging is further improved in that the organic amine base is formed by mixing 35-40% of hydroxyl, 10-15% of potassium tert-butoxide, 25-30% of butoxydiglycol and 20-25% of ethanolamine.
The method for removing the residual glue and the foreign matters in the semiconductor packaging is further improved in that the organic amine base is formed by mixing 35% of hydroxyl, 15% of potassium tert-butoxide, 30% of butoxydiglycol and 20% of ethanolamine.
The method for removing the residual glue and foreign matters in the semiconductor packaging is further improved in that the organic solvent comprises 25-35% of butyl ether, 35-45% of ethyl acetate and 20-40% of acetone.
The method for removing the residual glue and foreign matters in the semiconductor packaging is further improved in that the organic solvent comprises butyl ether with the content of 30%, ethyl acetate with the content of 40% and acetone with the content of 30%.
The method for removing the residual glue and the foreign matters of the product in the semiconductor packaging is further improved in that when the product is cleaned by ultrasonic cleaning equipment, the product is put into a screen, and the screen and the product are put into the ultrasonic cleaning equipment together for cleaning.
The method for removing the residual glue and the foreign matters of the product in the semiconductor packaging is further improved in that after the product is dried in the air, the product is placed under a microscope for appearance inspection.
The invention also provides a method for removing the residual glue and foreign matters of the product in the semiconductor packaging, which comprises the following steps:
stripping the product, and drying the product;
soaking the dried product into a dissolving solution, wherein the dissolving solution is formed by mixing ethanolamine and diethylene glycol monobutyl ether, and soaking the product for 60 to 90 minutes at normal temperature;
after soaking, washing the product with alcohol;
after washing, cleaning the product by using ultrasonic cleaning equipment filled with alcohol for 20-30 minutes at the cleaning temperature not higher than 40 ℃; and
and after the cleaning is finished, the product is dried for 20-30 minutes, so that the residual glue and foreign matters of the product are removed.
Drawings
Fig. 1 is a flow of removing residual glue and foreign matters from a product in the prior art.
FIG. 2 is a flowchart illustrating a method for removing residual glue and foreign matters in semiconductor package according to the present invention.
Detailed Description
The invention is further described with reference to the following figures and specific examples.
Referring to fig. 2, the present invention provides a method for removing residual glue and foreign matters from a product in a semiconductor package, so as to solve the problem that the residual glue and the foreign matters in the existing product cleaning operation account for 20% and affect the appearance and quality of the product. According to the invention, the product is soaked by using the newly researched dissolving solution, the dissolving solution is formed by mixing organic amine alkali and an organic solvent, the ratio of residual gum and foreign matters on the surface of the product after soaking and cleaning is below 1%, and the appearance, quality and qualification rate of the product can be well ensured. The following describes a method for removing residual glue and foreign matters in semiconductor packaging according to the present invention with reference to the accompanying drawings.
Referring to fig. 2, a flow chart of a method for removing product adhesive residue and foreign matters in the semiconductor package of the present invention is shown. The following describes a method for removing product residue and foreign matters in the semiconductor package according to the present invention with reference to fig. 2.
As shown in fig. 2, the method for removing the residual glue and the foreign matters in the semiconductor package of the present invention comprises the following steps:
step S21 is executed, the product is peeled off, and the product is dried; then, step S22 is executed;
step S22 is executed, the dried product is soaked in a dissolving solution, the dissolving solution is formed by mixing organic amine alkali and an organic solvent, and the product is soaked for 60 minutes to 90 minutes at normal temperature; then, step S23 is executed;
step S23 is executed, after the soaking in the step S is finished, the product is washed by alcohol; then, step S24 is executed;
step S24 is executed, after washing is finished, the product is washed by ultrasonic washing equipment filled with alcohol, the washing time is between 20 minutes and 30 minutes, and the washing temperature is not higher than 40 ℃; then, step S25 is executed;
and S25, after the cleaning is finished, airing the product for 20-30 minutes, thereby finishing the removal of the residual glue and the foreign matters of the product.
When the residual glue and foreign matters on the product are removed, the newly researched dissolving solution is adopted to soak the product, the dissolving solution is formed by mixing organic amine alkali and an organic solvent, the residual glue and the foreign matters on the surface of the product are dissolved a little by a little through the swelling capacity of the organic solvent in an alkaline environment, after the soaking is finished, alcohol is used for washing and filtering, the residual glue on the surface is removed after the residual glue is dissolved, the product is put into a screen and is cleaned in ultrasonic cleaning equipment filled with alcohol, the cleaning temperature is controlled, the reliability of the product is influenced by overhigh temperature, and the product is dried after the soaking is finished, so that the proportion of the residual glue and the foreign matters on the surface of the cleaned product is below 1 percent, and the appearance, the product quality and the qualification rate of the product are well ensured.
In one embodiment of the invention, the organic amine base and the organic solvent are present in an amount of between 40% and 60%. Wherein the organic amine base is 40%, 45%, 50%, or 60%, and correspondingly, the organic solvent is 60%, 55%, 50%, or 40%.
In one embodiment of the invention, the organic amine base and the organic solvent are both present in an amount of 50% and are mixed in a ratio of 1: 1.
In one embodiment of the present invention, the organic amine base is a mixture of 35% to 40% hydroxyl group, 10% to 15% potassium tert-butoxide, 25% to 30% butoxydiglycol, and 20% to 25% ethanolamine.
In one embodiment of the present invention, the organic amine base is a mixture of 35% hydroxyl, 15% potassium tert-butoxide, 30% butoxydiglycol and 20% ethanolamine.
The hydroxyl has solubility and is used for protecting the product, and the residual gum can be prevented from being attached to the product again after being dissolved; the potassium tert-butoxide is an organic alkaline corrosion product, can effectively dissolve foreign matters on the surface of a product and can protect the product; the butoxy diglycol has excellent decontamination, dispersion, solubilization and permeability properties; ethanolamine is used as a UV glue corrosion and surfactant to enhance the effect of removing foreign matters on the surface. The organic amine alkali formed by mixing the materials can separate polyvinyl chloride particles, and the main component of the residual glue on the product is polyvinyl chloride, so that the residual glue can be effectively removed.
In one embodiment of the invention, the organic solvent is selected from the group consisting of butyl ether in an amount of 25% to 35%, ethyl acetate in an amount of 35% to 45%, and acetone in an amount of 20% to 40%.
In one embodiment of the invention, the organic solvent is composed of 30% butyl ether, 40% ethyl acetate and 30% acetone.
Wherein butyl ether is capable of dissolving, decomposing and swelling the UV glue (i.e. polyvinyl chloride); the ethyl acetate can relieve, decompose and dissolve the UV glue easily; the acetone has solubility, and can be used for cleaning residual gum. The organic solvent formed by mixing the materials can dissolve organic compounds such as water-insoluble resin, rubber, dye and the like.
In one embodiment of the invention, when the product is cleaned by the ultrasonic cleaning device, the product is loaded into the screen and the screen is loaded into the ultrasonic cleaning device together with the product for cleaning.
The ultrasonic cleaning equipment is filled with 96% alcohol, and the cleaning time is 20 minutes.
In a specific embodiment of the present invention, when the product is dried, the product is dried by using a deionization fan, and the drying time is 20 minutes.
In one embodiment of the invention, after the product is air dried, the product is placed under a microscope for visual inspection.
In one embodiment of the invention, the product is soaked in the dissolution solution for a soaking time of 60 minutes.
The invention also provides a method for removing the residual glue and foreign matters of the product in the semiconductor package, which is explained below.
The removing method comprises the following steps:
stripping the product, and drying the product;
soaking the dried product into a dissolving solution, wherein the dissolving solution is formed by mixing ethanolamine and diethylene glycol monobutyl ether, and soaking the product for 60 to 90 minutes at normal temperature;
after soaking, washing the product with alcohol;
after washing, cleaning the product by using ultrasonic cleaning equipment filled with alcohol for 20-30 minutes at a temperature not higher than 40 ℃; and
and after the cleaning is finished, the product is dried for 20-30 minutes, so that the residual glue and foreign matters of the product are removed.
Wherein the content of ethanolamine and diethylene glycol monobutyl ether in the solution is 50 percent.
The dissolving solution is prepared by mixing ethanolamine and diethylene glycol monobutyl ether, residual gum and foreign matters on the surface of a product are dissolved a little by the swelling capacity of the diethylene glycol monobutyl ether in an alkaline environment, the product is washed and filtered by alcohol after soaking is finished, the residue after the surface residual gum is dissolved is removed, the product is put into a screen, the product is cleaned for 20 minutes in ultrasonic cleaning equipment with alcohol, the cleaning temperature is controlled to be not higher than 40 ℃, the reliability of the product is influenced by overhigh temperature, the product is dried by deionized air after the cleaning is finished, the drying time is 20 minutes, the ratio of the residual gum and the foreign matters on the surface of the cleaned product is less than 1%, and the appearance, the product quality and the qualification rate of the product are well guaranteed.
While the present invention has been described in detail and with reference to the embodiments thereof as illustrated in the accompanying drawings, it will be apparent to one skilled in the art that various changes and modifications can be made therein. Therefore, certain details of the embodiments are not to be interpreted as limiting, and the scope of the invention is to be determined by the appended claims.
Claims (10)
1. A method for removing residual glue and foreign matters of products in semiconductor packaging is characterized by comprising the following steps:
stripping the product, and drying the product;
soaking the dried product into a dissolving solution, wherein the dissolving solution is formed by mixing organic amine alkali and an organic solvent, and soaking the product at normal temperature for 60-90 minutes;
after soaking, washing the product with alcohol;
after washing, cleaning the product by using ultrasonic cleaning equipment filled with alcohol for 20-30 minutes at the cleaning temperature not higher than 40 ℃; and
and after the cleaning is finished, the product is dried for 20-30 minutes, so that the residual glue and foreign matters of the product are removed.
2. The method for removing adhesive residue and foreign matters in a semiconductor package according to claim 1, wherein the contents of the organic amine base and the organic solvent are between 40% and 60%.
3. The method of claim 1, wherein the organic amine base and the organic solvent are both present in an amount of 50%.
4. The method of claim 1, wherein the organic amine base is formed by mixing 35% to 40% of hydroxyl groups, 10% to 15% of potassium tert-butoxide, 25% to 30% of butoxydiglycol and 20% to 25% of ethanolamine.
5. The method of claim 1, wherein the organic amine base is formed by mixing 35% hydroxyl group, 15% potassium tert-butoxide, 30% butoxydiglycol and 20% ethanolamine.
6. The method of claim 1, wherein the organic solvent is selected from the group consisting of butyl ether 25-35%, ethyl acetate 35-45%, and acetone 20-40%.
7. The method of claim 1, wherein the organic solvent is selected from the group consisting of 30% butyl ether, 40% ethyl acetate, and 30% acetone.
8. The method of claim 1, wherein the product is loaded into a screen and the screen is placed into an ultrasonic cleaning device together with the product for cleaning when the product is cleaned by the ultrasonic cleaning device.
9. The method of claim 1, wherein after the product is dried, the product is placed under a microscope for visual inspection.
10. A method for removing adhesive residue and foreign matters of a product in semiconductor packaging is characterized by comprising the following steps:
stripping the product, and drying the product;
soaking the dried product into a dissolving solution, wherein the dissolving solution is formed by mixing ethanolamine and diethylene glycol monobutyl ether, and soaking the product for 60 to 90 minutes at normal temperature;
after soaking, washing the product with alcohol;
after washing, cleaning the product by using ultrasonic cleaning equipment filled with alcohol for 20-30 minutes at a temperature not higher than 40 ℃; and
and after the cleaning is finished, the product is dried for 20-30 minutes, so that the residual glue and foreign matters of the product are removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210633615.2A CN115007539A (en) | 2022-06-06 | 2022-06-06 | Method for removing residual glue and foreign matters of product in semiconductor packaging |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210633615.2A CN115007539A (en) | 2022-06-06 | 2022-06-06 | Method for removing residual glue and foreign matters of product in semiconductor packaging |
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| CN115007539A true CN115007539A (en) | 2022-09-06 |
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| CN202210633615.2A Pending CN115007539A (en) | 2022-06-06 | 2022-06-06 | Method for removing residual glue and foreign matters of product in semiconductor packaging |
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-
2022
- 2022-06-06 CN CN202210633615.2A patent/CN115007539A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20100242999A1 (en) * | 2009-03-27 | 2010-09-30 | Eastman Chemical Company | Compositions and methods for removing organic substances |
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| CN110071054A (en) * | 2018-01-23 | 2019-07-30 | 上海新阳半导体材料股份有限公司 | Gluing method is removed in a kind of post-processing of integrated antenna package |
| CN112934829A (en) * | 2019-11-26 | 2021-06-11 | 东莞新科技术研究开发有限公司 | Cleaning method of semiconductor clamp |
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| CN113441426A (en) * | 2020-03-24 | 2021-09-28 | 东莞新科技术研究开发有限公司 | Method for cleaning article with photoresist and photoresist cleaning agent |
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