CN115004018A - X-ray inspection system, X-ray inspection method, and program - Google Patents
X-ray inspection system, X-ray inspection method, and program Download PDFInfo
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- CN115004018A CN115004018A CN202080094590.2A CN202080094590A CN115004018A CN 115004018 A CN115004018 A CN 115004018A CN 202080094590 A CN202080094590 A CN 202080094590A CN 115004018 A CN115004018 A CN 115004018A
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- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
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Abstract
An X-ray inspection system having: an X-ray generation unit that irradiates an object to be inspected with X-rays; an X-ray imaging unit that images X-rays transmitted through the inspection object; a storage unit that stores at least information on the inspection target; a three-dimensional data creating unit that creates three-dimensional data of the inspection target using information of the plurality of X-ray images captured by the X-ray imaging unit; a user confirmation image creating unit that creates a user confirmation image in which the shape of the inspection target region in the inspection target is expressed as a two-dimensional shape of an observation target surface desired by a user, using the three-dimensional data of the inspection target; and a display unit that displays the image created by the image creating unit for user confirmation.
Description
Technical Field
The present invention relates to an X-ray inspection system, an inspection method using X-rays, and a program.
Background
Conventionally, there is known a technique of measuring a three-dimensional shape of an object using an image captured by irradiating the object with illumination light (for example, patent document 1), and checking the presence or absence and type of a defect in the object by, for example, comparing the measured shape with a preset criterion.
In the case where the inspection based on the three-dimensional shape of the object is performed in this way, it is desirable that the user can confirm how the part to be inspected is specified, whether the result of the determination of good/bad is appropriate, and the like. Further, it is desirable to confirm the actual state of the part to be inspected and the part to be measured even when a task (hereinafter referred to as teaching) for setting a determination criterion is performed before the inspection.
In contrast, patent document 2 proposes the following technique: by presenting the shape of the inspection target region in the appearance inspection apparatus with a plurality of images, the user can easily confirm the inspection target region. Specifically, it is disclosed that an image showing a state where a display target range of a component mounting board as an inspection target is viewed from above a board surface, an image with a YZ plane as a front surface, and an image with an XZ plane as a front surface are displayed on the same screen in a state where the images are aligned in scale and position.
In this specification, the vertical direction is the Z axis, the horizontal direction indicates the depth direction is the Y axis, and the horizontal direction is the X axis perpendicular to the Y axis.
On the other hand, in recent years, miniaturization and precision of various products have been advanced, and for example, even in a component mounting board or the like, a component mounting density has increased, and a portion which becomes a shadow of a field of view of an imaging device has increased, and thus components which cannot be accurately inspected in an appearance inspection have increased. In addition, a technique is known for inspecting a portion that cannot be inspected in appearance by X-ray CT inspection (for example, patent document 3).
Documents of the prior art
Patent document
Patent document 1: japanese patent application laid-open No. 2010-71782
Patent document 2: japanese patent laid-open No. 2012-149905
Patent document 3: japanese patent laid-open publication No. 2017-223468
Disclosure of Invention
Problems to be solved by the invention
However, as in the technique described in patent document 3, it is desirable that the user can confirm the state of the part to be examined even when the examination is performed by acquiring a three-dimensional shape by X-ray CT examination. However, the technique described in patent document 2 is applied to visual inspection using visible light, and has a problem that the state of a region to be inspected and a region to be measured cannot be confirmed in the inspection using an X-ray CT image.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a technique that enables a user to easily check the state of a part to be inspected when the three-dimensional shape of the object to be inspected is measured and inspected using a plurality of X-ray images.
Means for solving the problems
In order to achieve the above object, the present invention adopts the following configuration.
An X-ray inspection system of the present invention comprises: an X-ray generation unit for irradiating X-rays to an object to be inspected; an X-ray imaging unit that images X-rays transmitted through the inspection object; a storage unit that stores at least information on the inspection target; a three-dimensional data creating unit that creates three-dimensional data of the inspection target using information of the plurality of X-ray images captured by the X-ray imaging unit; a user confirmation image creating unit that creates a user confirmation image in which the shape of the inspection target region in the inspection target is expressed as a two-dimensional shape of an observation target surface desired by a user, using the three-dimensional data of the inspection target; and a display unit that displays the image created by the image creating unit for user confirmation.
The X-ray inspection system described above may be configured as an X-ray inspection apparatus in which the respective units are integrated. The "observation target surface desired by the user" is not limited to a surface that can be visually recognized from the appearance, and includes a cross section at an arbitrary position (and direction) in the shape defined by the three-dimensional data. With this configuration, the three-dimensional shape of the inspection object is measured from a plurality of image data obtained by X-ray imaging of the inspection object, and the region of the inspection object that the user wants to confirm is displayed as a two-dimensional shape indicated from the direction that the user wants to confirm. Therefore, the user can easily check the state of the portion that cannot be checked based on the appearance information of the inspection target.
Further, the user confirmation image creating unit may include: a reference plane specifying unit that specifies a predetermined horizontal tomographic position of the inspection target portion using three-dimensional data of the inspection target; a horizontal projection image acquisition unit that acquires a horizontal projection image obtained by performing projection processing by a predetermined distance in a vertical direction from the horizontal slice position; a luminance curve acquisition unit that acquires a luminance curve (profile) of the observation target surface desired by the user based on the horizontal projection image; and a relative shape curve creating unit that converts the luminance curve into a relative shape curve that represents a physical quantity related to the shape of the examination target portion as a relative value.
Here, the physical quantity related to the shape is, for example, a size, inclination, angle, or the like indicating a height, a width, or the like. With this configuration, it is possible to show the user an image showing the physical quantity related to the two-dimensional shape relatively showing the portion that the user wants to confirm from the direction in which the user wants to confirm, using the luminance curve obtained from the horizontal projection image that can be acquired based on the three-dimensional data of the inspection object. For example, instead of displaying an image whose size is expressed in absolute values, an image expressed by a relative outline using a predetermined point as a reference can be displayed, and an image having a two-dimensional shape can be displayed to the user without performing processing for converting a luminance curve into a size or the like.
Further, the luminance curve acquisition means may acquire the luminance curve by performing projection processing on the horizontal projection image in a depth direction of the observation target surface desired by the user at least in a projection range calculated using the information on the inspection target stored in the storage means.
With this configuration, since the range to be subjected to the projection processing can be determined using data such as the shape and size of the examination target region, it is possible to extract a region that the user wants to confirm in the examination target with high accuracy and perform the projection processing. This makes it possible to extract the luminance curve of the portion that the user wants to confirm with high accuracy.
Further, the user confirmation image creating means may further include scale matching means for performing processing of matching scales of a vertical axis and a horizontal axis in the user confirmation image, using the relative shape curve and the information on the inspection target stored in the storage means.
With this configuration, a two-dimensional image showing the shape of the examination target region in size can be displayed to the user using the size data of the examination target region and the like. Since the two-dimensional shape obtained from the relative shape curve represents only the relative outline of the examination target region, the examination target region is represented in a size in which the scales of the vertical axis and the horizontal axis are matched, and an easily observable image in which the sense of incongruity of the user is suppressed can be presented.
The inspection target may be a component mounting board, the inspection target may be a soldering portion of a component electrode, the observation target surface desired by the user may be a surface showing a long side or a short side direction of the component electrode, the predetermined horizontal cross-sectional position of the inspection target may be a bonding surface of solder and the board, and the physical quantity related to the shape of the inspection target may be a size showing a height.
With such a configuration, in a substrate having a high component mounting density, the wetting protrusion (hereinafter referred to as fillet) shape of the soldering portion at a portion that cannot be visually recognized can be easily recognized.
Further, the image creating means for user confirmation may further include fillet start position specifying means for specifying the start position of the solder fillet based on the gradient of the relative shape curve and the information stored in the storage means. Further, based on the thus determined start position of the solder fillet, an image of a two-dimensional shape in which the scales of the dimensions of the vertical axis and the horizontal axis of the shape of the soldering portion of the component electrode are matched may be displayed.
In addition, the user confirmation image creating means may further include electrode shape estimating means for estimating a shape of the component electrode based on the relative shape curve and the information stored in the storage means and reflecting the shape in the user confirmation image. With this configuration, even in a place where the user cannot visually recognize the shape of the solder fillet and the positional relationship of the component electrode can be confirmed together.
In addition, the storage unit may further store measurement information of an appearance inspection performed on the component mounting substrate, and the user confirmation image creating unit may further include an electrode shape synthesizing unit that acquires a shape of the component electrode from the measurement information, and reflects the shape of the component electrode in the user confirmation image after scaling to match the relative shape curve.
Since the shape of the component electrode can be determined from the image data for the visual inspection, the user can confirm the shapes of the component electrode and the solder fillet of the solder portion from the image reflecting the actual shape of the component electrode by using the obtained shapes of the component electrodes in combination.
Further, the user confirmation image creating unit may include: a reference plane determining unit that determines a horizontal slice position of a predetermined portion of the object to be measured based on the three-dimensional data of the object to be inspected; a horizontal projection image acquisition unit that acquires a horizontal projection image obtained by performing projection processing of three-dimensional data of the inspection target object by a predetermined distance in a vertical direction from a horizontal tomographic position of the predetermined portion; a luminance curve acquisition unit that acquires a luminance curve of an observation target surface desired by the user based on the horizontal projection image; a vertical projection image acquisition unit that acquires a vertical projection image obtained by projecting the three-dimensional data of the inspection target object in a depth direction of the observation target surface desired by the user; and an absolute shape curve creating unit that converts the luminance curve into an absolute shape curve in which a physical quantity relating to a shape of the examination target portion is expressed as an absolute value, using the vertical projection image.
With this configuration, it is possible to display an image showing the size of the two-dimensional shape indicating the region that the user wants to confirm from the direction that the user wants to confirm to the user. Therefore, the user can confirm the shape of the inspection target region with less discomfort by the image showing the two-dimensional shape matching the actual shape of the inspection target region.
Further, the vertical projection image acquisition means may determine a projection range for performing projection processing in a depth direction of the observation target surface desired by the user, using the horizontal projection image and the information on the inspection target stored in the storage means.
With this configuration, the range of the projection processing for obtaining the image of the luminance profile can be matched with the range of the projection processing for obtaining the vertical projection image, and the position of the inspection target region serving as a reference for obtaining the raw data of the absolute shape profile can be matched, thereby obtaining the absolute shape profile with high accuracy.
The user confirmation image creation means may further include electrode shape estimation means for estimating the shape of the component electrode based on the absolute shape curve and the information stored in the storage means and reflecting the estimated shape in the user confirmation image. With this configuration, the shape of the solder fillet and the positional relationship of the component electrode can be confirmed at the same time even in a place where the user cannot visually recognize.
In addition, the storage unit may further store measurement information of an appearance inspection performed on the component mounting substrate, and the user confirmation image creating unit may further include an electrode shape synthesizing unit that obtains a shape of the component electrode based on the measurement information, and reflects the shape of the component electrode in the user confirmation image after performing a scaling operation so as to match the absolute shape curve.
According to such a configuration, in the inspection of the component mounting substrate, the user can easily and accurately confirm the shape of the desired inspection target portion by the two-dimensional image showing the actual shape of the solder fillet obtained from the X-ray captured image and the actual shape of the component electrode obtained from the image at the time of the appearance inspection.
Further, the X-ray inspection method of the present invention includes the steps of: acquiring a plurality of X-ray images obtained by imaging an object to be inspected with X-rays; creating three-dimensional data of the inspection object using information of a plurality of X-ray images obtained by imaging the inspection object; creating a user confirmation screen for expressing the shape of the inspection target portion in the inspection target object as a two-dimensional shape of an observation target surface desired by a user, using the three-dimensional data of the inspection target object; and displaying the user confirmation screen.
The present invention can also be understood as a program for causing a computer to execute the above method, and a computer-readable recording medium which non-temporarily stores such a program.
The present invention can be configured by combining the above-described respective configurations and processes without causing any technical contradiction.
Effects of the invention
According to the present invention, it is possible to provide a technique by which a user can easily confirm the state of a part to be inspected when performing an inspection by measuring the three-dimensional shape of the inspection object using a plurality of X-ray images.
Drawings
FIG. 1 is a schematic view showing a schematic configuration of an X-ray inspection apparatus according to an application example of the present invention.
Fig. 2 is a flowchart showing a flow of a confirmation image display process in an X-ray inspection apparatus according to an application example of the present invention.
Fig. 3 is a block diagram showing a schematic configuration of an X-ray inspection system according to embodiment 1.
Fig. 4 is an explanatory diagram showing the relationship among the examination target region, the three-dimensional data thereof, the horizontal projection image, and the luminance value curve in embodiment 1.
Fig. 5 is a diagram showing an example of image processing in the X-ray inspection system according to embodiment 1.
Fig. 6 is a flowchart showing a flow of a confirmation image display process in the X-ray inspection system according to embodiment 1.
Fig. 7 is a block diagram showing a schematic configuration of an X-ray inspection system according to embodiment 2.
Fig. 8 is an explanatory diagram showing a relationship among three-dimensional data, a vertical projection image, and a luminance value curve of an examination target region according to embodiment 2.
Fig. 9 is a diagram showing an example of image processing in the X-ray inspection system according to embodiment 2.
Fig. 10 is a flowchart showing a flow of a confirmation image display process in the X-ray inspection system according to embodiment 2.
Fig. 11 is a block diagram showing a schematic configuration of an X-ray inspection system according to embodiment 3.
Detailed Description
< application example >
(construction of application example)
An example of an embodiment of the present invention will be described below. The present invention can be applied, for example, as an X-ray inspection apparatus for performing X-ray imaging of an inspection target (for example, a component mounting board) and inspecting the inspection target based on the imaged image. Fig. 1 is a schematic diagram showing a schematic configuration of an X-ray inspection apparatus 9 according to an application example. The X-ray inspection apparatus 9 is roughly configured to include a control terminal 91 and an imaging unit 94 including an X-ray source 92 and an X-ray camera 93.
The control terminal 91 may be configured by a general-purpose computer or the like, and includes functional units of a drive control unit 911, a storage unit 912, a three-dimensional data creation unit 913, an inspection unit 914, an image creation unit 915, and a display unit 916.
The X-ray source 92 irradiates X-rays on an inspection object O conveyed by a conveying roller, not shown, and the X-ray camera 93 captures the X-rays transmitted through the inspection object O. The X-ray source 92 can be moved by an X table 921 and a Y table 922, and the X-ray camera 93 can be moved by an X table 931 and a Y table 932. The X-ray source 92 and the X-ray camera 93 are moved on the circular tracks C1 and C2 by these tables, respectively, and perform imaging at a plurality of positions on the tracks.
The drive control unit 911 controls the drive of each unit constituting the X-ray inspection apparatus 9. Thus, the X-ray inspection apparatus 9 changes the relative positions of the radiation source 92 and the X-ray camera 93 of the inspection object O, X, and images the inspection object O from a plurality of imaging positions.
The storage unit 912 stores at least information on inspection standards such as information on the inspection object O (for example, if the inspection object is a component mounting board, the type, shape, size, and the like of the component), and a threshold value. Further, a program for controlling the inspection apparatus, data for creating an image for user confirmation, which will be described later, and the like may be stored.
The three-dimensional data creating unit 913 creates three-dimensional data of the inspection object O (or a part thereof) based on the plurality of X-ray images captured as described above. Since known techniques such as ct (computed tomography) and tomosynthesis can be applied to the method of creating (constructing) the data, detailed description thereof will be omitted. The inspection unit 914 performs an inspection for determining whether or not the inspection object O is good by comparing the three-dimensional data creating unit 913 with the inspection standard stored in the storage unit 912.
The image creating unit 915 creates an image for user confirmation (for example, an image with the XZ plane of the inspection target object as the front surface) in which the shape of the inspection target portion in the inspection target object O is expressed as a two-dimensional shape when viewed from a predetermined direction, using the three-dimensional data created by the three-dimensional data creating unit 913. The display unit 916 includes a display device such as a liquid crystal display, for example, and displays the user confirmation image generated by the image generation unit 91.
(flow of treatment)
Fig. 2 shows the procedure of the above-described processing performed by the X-ray inspection apparatus 9 in the present application example. First, the X-ray inspection apparatus 9 performs X-ray imaging of the inspection object O from a plurality of different positions to acquire a plurality of X-ray image data (S901). Next, the X-ray inspection apparatus 9 creates three-dimensional data of the inspection object O based on the plurality of X-ray image data acquired in step S901 (S902).
The X-ray inspection apparatus 9 then performs an inspection of the inspection object O based on the three-dimensional data created in step S902 (S903). Specifically, for example, the quality of the inspection object O is determined by comparing the three-dimensional data with inspection standards (threshold values) for the shape of the inspection object O held in the storage unit 912 in advance. The determination result may be displayed on the display 916.
The X-ray inspection apparatus 9 also performs preprocessing for creating a user confirmation image (described later) using the three-dimensional data created in step S902 (S904). Specifically, for example, a luminance curve in a user-desired direction (for example, a direction in which the XZ plane of the inspection target object O is a front surface) with respect to the inspection target portion is obtained from the three-dimensional data.
Then, based on the processing in step S904, the X-ray inspection apparatus 9 creates a user confirmation image in which the shape of the inspection target region in the inspection target object O is expressed as a two-dimensional shape when viewed from the direction desired by the user (S905). Specifically, for example, an image is created as a relative shape curve relatively representing the size of the shape of the examination target region.
Then, the X-ray inspection apparatus 9 displays the image created in step S904 on the display 916 (step S906), and the series of processes ends. The display on the display unit 916 may be an image that automatically displays a predetermined region to be examined, or may be an image that is displayed in response to an instruction after waiting for an instruction input from a user. In addition, the user confirmation image may be displayed together with the result of the check in step S903.
According to the X-ray inspection apparatus 9 of this application example, even when the form of the inspection target region cannot be visually confirmed, the user can easily confirm the shape of the region. Thus, in the X-ray inspection apparatus, the determination of the validity of the inspection result, the setting of the inspection standard, the correction, and the like can be easily performed.
< embodiment 1>
Next, a more detailed example of an embodiment for carrying out the present invention will be described with reference to fig. 3 to 6. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiment are not intended to limit the scope of the present invention to these values unless otherwise specified.
(System configuration)
Fig. 3 is a schematic block diagram showing a functional configuration of the X-ray inspection system 1 according to the present embodiment. Although not shown, the X-ray inspection system 1 of the present embodiment is configured to include a CT apparatus and an information processing terminal, and is used for inspecting a component mounting board, for example.
The CT apparatus includes an X-ray source 11, an X-ray camera 12, and a table 13 holding an object to be examined, and can acquire tomographic images of the object to be examined at different positions (and orientations) by moving these components relative to each other. Since a desired known technique can be employed for the CT apparatus, detailed descriptions of the X-ray source 11, the X-ray camera 12, the table 13, and the like are omitted.
The information processing terminal can be a general-purpose computer including a processor such as a CPU or DSP, a storage unit 24 including a main storage unit such as a read-only memory (ROM) or a Random Access Memory (RAM), an auxiliary storage unit such as an EPROM, a Hard Disk Drive (HDD) or a removable medium, an input unit 25 such as a keyboard or a mouse, and an output unit 26 such as a liquid crystal display. The information processing terminal may be constituted by a single computer or may be constituted by a plurality of computers cooperating with each other.
The functional units that achieve a predetermined object as described later can be realized by storing an Operating System (OS), various programs, various information on an inspection target, various inspection standards, and the like in the auxiliary storage unit, loading and executing the programs stored therein in the work area of the main storage unit, and controlling the respective components and the like by executing the programs. Some or all of the functional units may be realized by a hardware circuit such as an ASIC or FPGA.
Next, each functional unit provided in the information processing terminal will be described. The information processing terminal includes functional units of a control unit 21, a three-dimensional data creation unit 22, and a confirmation image creation unit 23. The control unit 21 is responsible for controlling various parts of the CT apparatus and the information processing terminal, and performs drive control of the X-ray source 11, the X-ray camera 12, and the table 13, control of input devices related to the input unit 25, output control to the output unit 26, and the like, for example.
The three-dimensional data creating unit 22 creates data of a three-dimensional shape of a part to be examined (hereinafter, also simply referred to as three-dimensional data) based on a plurality of X-ray tomographic images of the part to be examined acquired from the CT apparatus. Although not described in detail, the manufactured three-dimensional data is compared with a predetermined inspection standard to perform an inspection for determining whether or not the inspection target is good.
(image creating section for confirmation)
The confirmation image creating unit 23 creates a user confirmation image in which the shape of a desired inspection target region in the inspection target is expressed as a two-dimensional shape when viewed from a predetermined direction, using the three-dimensional data created by the three-dimensional data creating unit 22. The confirmation image creating unit 23 further includes functional units of a reference surface specifying unit 231, a horizontal projection image acquiring unit 232, a luminance curve acquiring unit 233, a relative shape curve creating unit 234, a fillet position determining unit 235, a scale matching unit 236, and an electrode shape estimating unit 237 in order to create the image.
The reference plane specifying unit 231 performs a process of specifying a horizontal tomographic position to be a reference plane (for example, a solder bonding surface) based on the image feature amount of the horizontal tomographic image (image of XY plane) having different Z-axis coordinates in the three-dimensional data. As the image feature amount, for example, the degree of a variation in luminance (hereinafter, referred to as a luminance variance) in an image or the like can be used.
As a specific processing method, for example, three-dimensional data is searched in the Z-axis direction, and a horizontal tomographic image having the highest luminance variance is determined. Then, a position shifted from the Z-axis coordinate of the horizontal tomographic image by a predetermined value in the-Z direction is determined as a reference plane. The predetermined value of the offset may be set by the user for each type of component in advance and stored in the storage unit 24.
The horizontal projection image acquisition unit 232 performs projection processing on the three-dimensional data in the predetermined range based on the reference surface determined by the reference surface determination unit 231, and creates a horizontal projection image in which the solder shape of the soldering portion to be inspected is emphasized. Specifically, for example, in the three-dimensional data, an average value projection of the horizontal tomographic image (an average value of luminance values of pixels of all the images is calculated and reflected for each pixel) is performed in the Z direction by a predetermined value from the Z-axis coordinate of the reference plane. Here, the range in which the projection processing is performed may be set in advance by the user based on information on the height of the solder-wetted bump obtained in advance from the component, and stored in the storage unit 24.
The luminance curve acquisition unit 233 performs a projection process on the horizontal projection image created by the horizontal projection image acquisition unit 232, and acquires a curve of the luminance value in a direction (the short-side direction or the long-side direction of the welded portion because the horizontal projection image is a horizontal image) (hereinafter, the luminance value curve in the short-side direction is described as a short-side luminance curve, and the luminance curve in the long-side direction is described as a long-side luminance curve). The projection range may be determined based on a luminance curve in a direction paired with a direction that the user wants to confirm in the horizontal projection image, component design information (for example, a pad width, an electrode width, and the like) stored in the storage unit 24, a luminance gradient, and the like. Here, the luminance curve refers to a contour shape obtained by plotting luminance values on two-dimensional coordinates.
Fig. 4 is an explanatory diagram showing the relationship between the inspection target region, its three-dimensional data, horizontal projection image, short-side direction luminance value curve, and long-side direction luminance value curve. Hereinafter, in this specification, a direction desired by a user is described as a longitudinal direction. When it is desired to check the curve of the luminance value in the longitudinal direction, the range in which the projection processing is performed is determined based on the luminance curve in the short direction or the like. Referring to fig. 4, the width of the electrode of the welded portion is determined based on the luminance curve in the short side direction, and the projection processing is performed in the long side direction by an amount corresponding to the width. In addition, the projection processing here is preferably based on maximum value projection (pixel reflecting the highest luminance value).
The relative shape curve creating unit 234 converts the luminance curve acquired by the luminance curve acquiring unit 233 into a curve (hereinafter, referred to as a relative height curve) indicating the shape of the relative Z-axis direction (i.e., height). Specifically, the luminance curve is converted with the reference plane (i.e., the bonding surface of the solder) set to 0% and the height at which the solder-wetting bump is the highest set to 100%. For example, the relative height may be determined by dividing a value obtained by subtracting the luminance value of the reference surface from the luminance curve value by subtracting the luminance value of the reference surface from the luminance of the position where the solder-wetting bump is highest, and multiplying the value by 100.
As an example, the luminance of the reference surface may be an average of the luminance of the solder outer region of the horizontally projected image. The solder outer region may be obtained by binarization processing of the horizontally projected image or the like. The brightness of the position where the solder wetting bump is highest may be set by the user in advance or may be set to 255 as a default value.
The fillet position determining section 235 determines the position of the fillet of the solder in the relative height curve based on the gradient of the relative height curve, the component design information (pad length) stored in the storage section 24, and the like. This process is performed for both the fillet located on the front side of the electrode when viewed from the outside (so-called front fillet) and the fillet located on the back side of the electrode (so-called back fillet) for which the shape is not visually recognized.
The scale matching unit 236 performs a process of matching the scales of the vertical axis (Z direction, height) and the horizontal axis (fillet length in the longitudinal direction) of the relative height curve. The relative height curve is created based on the luminance curve, and the coordinate in the vertical axis direction is completely different from the reference of the coordinate in the longitudinal direction in which the dimension is clearly defined as the component design information, such as the pad length. Therefore, by performing the processing of matching the scale in the vertical axis direction with the scale in the longitudinal direction, it is possible to provide a two-dimensional image without a sense of discomfort when visually confirmed by the user. Hereinafter, the result of the scale matching process performed on the relative height curve will be referred to as a post-process relative height curve.
The electrode shape estimating unit 237 estimates the approximate electrode shape of the member, and performs processing for superimposing and displaying the estimated electrode shape on the post-processing relative height curve. Specifically, for example, the minimum value of the portion of the processed relative height curve which becomes the valley between the fillet positions is assumed to be the end position of the electrode. Then, the relative height curve data of the back surface fillet position is approximated from the electrode tip position, and the rough electrode may be estimated from the part design information (electrode thickness) stored in the storage unit 24. Fig. 5 shows an example of a display of a post-treatment relative height curve in a case where the estimated shape of the electrode is superimposed and displayed.
(flow of image display processing for user confirmation)
Next, a flow of processing from capturing an X-ray image of a substrate as an inspection target to displaying an image for user confirmation in the present embodiment will be described with reference to fig. 6. First, under the control of the control unit 21, a CT apparatus captures an X-ray tomographic image of a substrate (S101). Then, the three-dimensional data creation unit 22 creates three-dimensional data of the substrate from the plurality of tomographic images (S102).
Next, the user sets, via the input unit 25, a land on which the user confirmation image is to be displayed, among the soldering portions (hereinafter, referred to as lands) of the components of the substrate (S103). The number of pads to be set is not limited to one, and a plurality of pads may be set. Then, the confirmation-use image creating unit 23 executes the processing of loop L1 described below for all the set pads.
In loop L1, first, the reference surface specifying unit 231 specifies a reference surface as a solder bonding surface based on the three-dimensional data created in step S102 (S104). Then, the horizontal projection image acquisition unit 232 performs projection processing on the three-dimensional data from the reference plane determined in step S104 to acquire a horizontal projection image (S105). Next, the luminance profile acquisition unit 233 further performs projection processing on the horizontal projection image acquired in step S105 to acquire a luminance profile of a direction that the user wants to confirm (S106). Further, the relative shape curve creating unit 234 performs a process of converting the luminance curve acquired in step S106 into a relative height curve (S107), and the fillet position determining unit 235 determines the fillet position in the relative height curve (S108). Next, the scale matching unit 236 performs a process of matching the scales of the vertical axis and the horizontal axis of the relative height curve (S109), and creates a post-process relative height curve. Then, the electrode shape estimating unit 237 estimates the approximate electrode shape of the target pad, and performs a process for superimposing and displaying the estimated electrode shape on the post-process relative height curve (S110), and the series of loop L1 processes is completed. The information of the created user confirmation image can be stored in the storage unit 24 by the confirmation image creating unit 23. The details of the processes in step S104 to step S110 are already described in the description of the functional units, and therefore are omitted.
When the processing of loop L1 is completed for all the pads, the control unit 21 waits for the user to designate a pad. When the user selects an arbitrary pad from the pads set in step S103 via the input unit 25 (S111), the control unit 21 executes a process of displaying the user confirmation image created in the loop L1 for the pad on the output unit 26 (S112), and once ends the routine.
According to the X-ray inspection system 1 as described above, the user can visually confirm the approximate outline shape of the welded portion of the component mounting board, which is not visible from the external appearance, as two-dimensional information when viewed from a desired position and direction. Therefore, in the X-ray inspection of the component mounting substrate, the validity of the inspection result can be easily determined. Further, teaching based on the inspection standard can be easily performed.
< embodiment 2>
Next, an X-ray inspection system 2 according to another embodiment of the present invention will be described with reference to fig. 7 to 10. Since the X-ray inspection system 2 of the present embodiment shares a plurality of configurations with the X-ray inspection system 1 described above, the same configurations and functions are denoted by the same reference numerals, and detailed description thereof is omitted.
Fig. 7 is a schematic block diagram showing a functional configuration of the X-ray inspection system 2 according to the present embodiment. As shown in fig. 7, the X-ray inspection system 2 of the present embodiment has the same configuration as the X-ray inspection system 1 except that a part of the functional units of the confirmation-use image creating unit 30 is different.
The confirmation image creating unit 30 in the X-ray inspection system 2 includes functional units of a reference surface specifying unit 231, a horizontal projection image acquiring unit 232, a luminance curve acquiring unit 233, a vertical projection image acquiring unit 301, a fillet height specifying unit 302, an absolute shape curve creating unit 303, and an electrode shape estimating unit 304. The reference surface specifying unit 231, the horizontal projection image acquiring unit 232, and the luminance profile acquiring unit 233 are the same as those of the X-ray inspection system 1, and therefore, description thereof is omitted.
The vertical projection image acquisition unit 301 performs projection processing in a direction (here, a longitudinal direction) that a user wants to confirm on the three-dimensional data created by the three-dimensional data creation unit 22, and acquires a vertical projection image of the welding portion to be inspected. The range (distance in the direction paired with the longitudinal direction) and the projection method for performing the projection processing are preferably the same range and method as those for the projection processing performed by the luminance profile acquisition unit 233 (i.e., maximum value projection). This makes it possible to match the range that forms the basis of the luminance curve with the range that forms the basis of the vertically projected image.
The fillet height determining unit 302 determines the wet bump height (hereinafter also referred to as fillet height) of the fillet based on the luminance curve acquired by the luminance curve acquiring unit 233 and the vertical projection image acquired by the vertical projection image acquiring unit 301.
Fig. 8 is an explanatory diagram showing a relationship among longitudinal luminance value curves of an examination target region, three-dimensional data thereof, a vertical projection image, and a horizontal projection image. Referring to fig. 8, first, the alignment process of the vertical projection image with the horizontal axis of the luminance curve is performed with reference to the peak P of the luminance curve. Next, the abscissa of the vertical projection image corresponding to the peak P of the luminance curve is determined, scanning is performed from the reference surface in the ordinate direction on the ordinate of the abscissa, and the fillet height F is determined from the gradient of the luminance value curve obtained by the scanning. Specifically, the luminance curve of the vertical axis of the scanned vertical projection image is first differentiated, and a portion where the first differentiated value is smallest (that is, a portion where the inclination of the luminance curve is largest) may be set as the fillet height F. Since the vertical projection image is obtained by performing projection processing on the three-dimensional data, when the vertical axis coordinate on the vertical projection image is determined, the actual height can be determined.
The absolute shape curve creation unit 303 performs processing of converting the luminance value into an absolute height using the fillet wetting and bulging height determined by the fillet height determination unit 302 and the longitudinal direction luminance curve. Specifically, the determined fillet height is associated with the peak value of the longitudinal luminance curve, the height of the reference surface (always 0) is associated with the luminance curve value corresponding to the fillet start position (i.e., the boundary with the reference surface), and the luminance value is converted into an absolute height. The conversion method can be, for example, a single conversion of ax + by + c 0(x is luminance and y is height). Fig. 9 is a diagram showing a longitudinal-direction luminance curve and an absolute height curve obtained by converting the longitudinal-direction luminance curve.
The electrode shape estimating unit 304 estimates the approximate electrode shape of the component, and performs processing for superimposing and displaying the estimated electrode shape on the absolute height curve. The specific method of the process is the same as that of the electrode shape estimating unit 237 in embodiment 1, and is different only in that the curve used for estimation is an absolute curve, and therefore, a detailed description thereof is omitted.
Next, although the processing from the X-ray image capturing of the substrate as the inspection object to the display of the image for user confirmation in the present embodiment will be described with reference to fig. 10, the description of the procedure for performing the same processing as that in embodiment 1 will be omitted.
Specifically, steps S101 to S103 are similar to embodiment 1, and an X-ray image is acquired, three-dimensional data is created, and the user designates an arbitrary pad on which a confirmation image is to be acquired. Thereafter, the confirmation-use image creating unit 30 executes loop L2 processing for creating an image for user confirmation for each of the set pads. Note that the processing of S104 to S106 in the loop L2 processing is the same as that in embodiment 1.
After the luminance curve is acquired in step S106, the vertical projection image acquisition unit 301 acquires a vertical projection image from the three-dimensional data created in step S102 (S201). Next, the fillet height determination section 302 determines the fillet height based on the luminance curve and the vertical projection image (step S202).
Next, the absolute shape curve creation unit 303 converts the luminance curve into an absolute height curve using the fillet height and the luminance curve determined in step S202 (S203). Thereafter, the electrode shape estimating unit 304 estimates the electrode shape of the component, and performs processing for displaying the estimated electrode shape superimposed on the absolute height curve (S204), and the series of processing of loop L2 ends.
The subsequent processing, step S111, and step S112 are the same as those in embodiment 1, and therefore, the description thereof is omitted. According to the X-ray inspection system 2 having such a configuration, the user can confirm the image showing the outline shape matching the actual solder shape, and thus the confidence of the user can be improved. This makes it possible to more efficiently confirm the validity of the inspection result, teach the inspection standard, and the like.
< embodiment 3>
Next, an X-ray inspection system 3 according to still another embodiment will be described with reference to fig. 11. Since the X-ray inspection system 3 of the present embodiment shares a plurality of configurations with the X-ray inspection system 1 described above, the same configurations and functions are denoted by the same reference numerals, and detailed description thereof is omitted.
Fig. 11 is a schematic block diagram showing a functional configuration of the X-ray inspection system 3 according to the present embodiment. As shown in fig. 11, the X-ray inspection system 3 of the present embodiment is configured to cooperate with an appearance inspection device 50 for performing an appearance inspection of an inspection target. The functional units of the confirmation-use image creating unit 40 are different from the X-ray inspection system 1 in that they include an electrode shape acquiring unit 401 and an electrode shape synthesizing unit 402.
The appearance inspection device 50 is a device for performing an appearance inspection of the component mounting substrate by a so-called color highlight system. The color highlight method is as follows: light of a plurality of colors (wavelengths) is irradiated to the substrate at different incident angles from each other, and the solder surface is imaged in a state where a color characteristic (color of the light source in a specular reflection direction when viewed from a camera) corresponding to a normal direction of the solder surface appears, whereby a three-dimensional shape of the solder surface is captured as two-dimensional hue information. By the inspection in this manner, the shape of the electrode and the degree of inclination of the fillet, which can be visually confirmed from the appearance, can be detected with high accuracy at the pad portion of the substrate.
The X-ray inspection system 3 according to the present embodiment is configured to be capable of acquiring information (e.g., color highlight image information) relating to the appearance inspection of the same substrate by the appearance inspection device 50 by communicating information with the appearance inspection device 50. The communication method may be a wired connection method or a wireless connection method, using a desired known technique. Further, at least a part of the information acquired from the appearance inspection apparatus 50 may be stored in the storage unit 24. With such a configuration, even when communication with the appearance inspection device 50 is interrupted, at least the information stored in the storage unit 24 can be used in the X-ray inspection system 3.
The electrode shape acquisition unit 401 acquires the shape of the electrode measured based on the color highlight image of the appearance inspection performed by the appearance inspection device 50 with respect to the inspection target substrate. The shape of the electrode based on the color highlight image may be measured by the appearance inspection device 50, and the shape of the electrode for each pad may be stored in the storage unit 24. However, only the color highlight image may be stored in the storage unit 24, and the electrode shape may be measured in the electrode shape acquisition unit 401.
The electrode shape synthesizing unit 402 performs a process of displaying the electrode shape (hereinafter, referred to as an actual electrode shape) acquired by the electrode shape acquiring unit 401 on the post-process relative height curve adjusted by the scale adjusting unit 236 in a superimposed manner. Specifically, the actual electrode shape is subjected to scale conversion (matching processing of resolution and coordinate system) in accordance with the post-processing relative height curve, and superimposed on the post-processing relative height curve. Thus, the outline shape of the welded portion reflecting the actual electrode shape can be shown in the user confirmation image output to the output unit 26.
In the present embodiment, the processing for displaying the image for user confirmation differs from the X-ray inspection system 1 of embodiment 1 only in the part related to the acquisition of the electrode shape and the superimposition processing, and therefore, the description thereof is omitted.
According to the X-ray inspection system 3 of the present embodiment as described above, the user can confirm the shapes of the component electrodes and the fillets of the welded portion by the image reflecting the actual electrode shape, and the user's sense of confidence can be improved.
< others >
The above embodiments are merely exemplary illustrations of the present invention, and the present invention is not limited to the above specific embodiments. The present invention can be variously modified and combined within the scope of its technical idea. For example, the X-ray inspection apparatus 2 according to embodiment 2 and the X-ray inspection apparatus according to embodiment 2 may be combined to display an image for user confirmation in which the actual electrode shape is superimposed on the absolute height curve.
In addition, at least a part of the storage unit in each of the above examples may be a storage device separate from the information processing terminal, or may be connected to a cloud. In contrast, in the above-described examples, the X-ray inspection system may be provided as an integrated apparatus, that is, an apparatus in which the CT apparatus and the console are integrated. In the above examples, the inspection of the substrate may be performed at any time between step S102 and step S112, or the inspection result may be displayed together on the user confirmation screen displayed in step S112.
In embodiment 1, before the scale matching process in step S109, the estimated electrode shape may be calculated, and then the scale of the relative height curve may be matched together with the electrode shape. That is, the processing in step S109 and step S110 may be exchanged. In embodiment 2, the process of step S201 may be performed before step S104 or step S105.
< notes in the attached paragraphs >
One embodiment of the present invention is an X-ray inspection system (1) including:
an X-ray generation unit (11) that irradiates an object to be examined with X-rays;
an X-ray imaging unit (12) that images X-rays that have passed through the object to be examined;
a storage unit (24) that stores at least information on the inspection target;
a three-dimensional data creation unit (22) for creating three-dimensional data of the inspection target object using information of the plurality of X-ray images captured by the X-ray imaging unit;
a user confirmation image creating means (23) for creating a user confirmation image in which the shape of the inspection target region in the inspection target is expressed as a two-dimensional shape of the observation target surface desired by the user, using the three-dimensional data of the inspection target; and
and a display unit (26) for displaying the image created by the image creation unit for user confirmation.
Another embodiment of the present invention is an X-ray inspection method including the steps of:
a step (S101) for acquiring a plurality of X-ray images obtained by imaging an object to be inspected with X-rays;
a step (S102) for creating three-dimensional data of the object to be inspected, using information of a plurality of X-ray images obtained by imaging the object to be inspected;
a step (L1) of creating, using the three-dimensional data of the object to be inspected, a user confirmation screen in which the shape of the part to be inspected in the object to be inspected is expressed as a two-dimensional shape of the observation target surface desired by the user; and
and a step (S112) for displaying the screen for user confirmation.
Description of the reference symbols
1. 2, 3: an X-ray inspection system; 9: an X-ray inspection device; 11. 92: an X-ray source; 12. 93: an X-ray camera; 921. 931: an X table; 922. 932: a Y-stage; c1, C2: a circular track; o: an object to be inspected; p: a peak value; f: the fillets wet the bump height.
Claims (15)
1. An X-ray inspection system having:
an X-ray generation unit that irradiates an object to be inspected with X-rays;
an X-ray imaging unit that images X-rays transmitted through the inspection object;
a storage unit that stores at least information on the inspection target;
a three-dimensional data creating unit that creates three-dimensional data of the inspection target using information of the plurality of X-ray images captured by the X-ray imaging unit;
a user confirmation image creating unit that creates a user confirmation image in which the shape of the inspection target region in the inspection target is expressed as a two-dimensional shape of an observation target surface desired by a user, using the three-dimensional data of the inspection target; and
and a display unit that displays the image created by the image creating unit for user confirmation.
2. The X-ray inspection system of claim 1,
the image creating unit for user confirmation includes:
a reference plane specifying unit that specifies a predetermined horizontal tomographic position of the inspection target portion using three-dimensional data of the inspection target;
a horizontal projection image acquisition unit that acquires a horizontal projection image obtained by performing projection processing by a predetermined distance in a vertical direction from the horizontal slice position;
a luminance curve acquisition unit that acquires a luminance curve of an observation target surface desired by the user based on the horizontal projection image; and
and a relative shape curve creating unit that converts the luminance curve into a relative shape curve that represents a physical quantity related to the shape of the examination target portion as a relative value.
3. The X-ray inspection system of claim 2,
the luminance curve acquisition means acquires the luminance curve by performing projection processing on the horizontal projection image in a depth direction of the observation target surface desired by the user at least in a projection range calculated using the information on the inspection target stored in the storage means.
4. X-ray inspection system according to claim 2 or 3,
the user confirmation image creating means further includes scale matching means for performing processing of matching scales of a vertical axis and a horizontal axis in the user confirmation image, using the relative shape curve and the information on the inspection target stored in the storage means.
5. X-ray inspection system according to any one of claims 2 to 4,
the object to be inspected is a component mounting board,
the inspection target site is a welding site of the component electrode,
the observation target surface desired by the user is a surface showing a long side or short side direction of the component electrode,
the predetermined horizontal fault position of the inspection target part is a bonding surface between the solder and the substrate,
the physical quantity related to the shape of the examination target portion is a size indicating a height.
6. The X-ray inspection system of claim 5,
the image creating means for user confirmation further includes fillet start position determining means for determining the start position of the solder fillet based on the gradient of the relative shape curve and the information stored in the storage means.
7. X-ray inspection system according to claim 5 or 6,
the image creating unit for user confirmation further includes an electrode shape estimating unit that estimates the shape of the component electrode based on the relative shape curve and the information stored in the storage unit and reflects the shape in the image for user confirmation.
8. X-ray inspection system according to claim 5 or 6,
the storage unit further stores measurement information of an appearance inspection performed on the component mounting substrate,
the image creating unit for user confirmation further includes an electrode shape synthesizing unit that acquires the shape of the component electrode from the measurement information, performs scaling so as to match the relative shape curve, and reflects the shape of the component electrode in the image for user confirmation.
9. The X-ray inspection system of claim 1,
the image creating unit for user confirmation includes:
a reference plane determining unit that determines a horizontal slice position of a predetermined portion of the object to be measured based on the three-dimensional data of the object to be inspected;
a horizontal projection image acquisition unit that acquires a horizontal projection image obtained by performing projection processing of three-dimensional data of the inspection target object by a predetermined distance in a vertical direction from a horizontal tomographic position of the predetermined portion;
a luminance curve acquisition unit that acquires a luminance curve of an observation target surface desired by the user based on the horizontal projection image;
a vertical projection image acquisition unit that acquires a vertical projection image obtained by projecting the three-dimensional data of the inspection target object in a depth direction of the observation target surface desired by the user; and
and an absolute shape curve creating unit that converts the luminance curve into an absolute shape curve in which a physical quantity relating to a shape of the examination target portion is expressed as an absolute value, using the vertical projection image.
10. The X-ray inspection system of claim 9,
the vertical projection image acquisition unit determines a projection range for performing projection processing in a depth direction of the observation target surface desired by the user, using the horizontal projection image and the information on the inspection target object stored in the storage unit.
11. X-ray inspection system according to claim 9 or 10,
the object to be inspected is a component mounting board,
the inspection target site is a welding site of the component electrode,
the observation target surface desired by the user is a surface showing a long side or short side direction of the component electrode,
the predetermined horizontal fault position of the inspection target part is a bonding surface between the solder and the substrate,
the physical quantity related to the shape of the examination target portion is a size indicating a height.
12. The X-ray inspection system of claim 11,
the image creating unit for user confirmation further includes an electrode shape estimating unit that estimates the shape of the component electrode based on the absolute shape curve and the information stored in the storage unit and reflects the shape in the image for user confirmation.
13. The X-ray inspection system of claim 11,
the storage unit further stores measurement information of an appearance inspection performed on the component mounting substrate,
the image creating unit for user confirmation further includes an electrode shape synthesizing unit that acquires the shape of the component electrode from the measurement information, performs scaling so as to match the absolute shape curve, and reflects the shape of the component electrode in the image for user confirmation.
14. An X-ray inspection method having the steps of:
acquiring a plurality of X-ray images obtained by imaging an object to be inspected with X-rays;
creating three-dimensional data of the inspection object using information of a plurality of X-ray images obtained by imaging the inspection object;
creating a user confirmation screen for expressing the shape of the inspection target portion in the inspection target object as a two-dimensional shape of an observation target surface desired by a user, using the three-dimensional data of the inspection target object; and
and displaying the user confirmation screen.
15. A program for causing a computer to execute the steps of the X-ray examination method recited in claim 14.
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| JP2020-031208 | 2020-02-27 | ||
| JP2020031208A JP7452091B2 (en) | 2020-02-27 | 2020-02-27 | X-ray inspection system, X-ray inspection method and program |
| PCT/JP2020/047019 WO2021171750A1 (en) | 2020-02-27 | 2020-12-16 | X-ray scanning system, x-ray scanning method, and program |
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| JP4631460B2 (en) | 2005-02-18 | 2011-02-16 | パナソニック株式会社 | X-ray inspection method |
| JP4711759B2 (en) | 2005-07-08 | 2011-06-29 | パナソニック株式会社 | X-ray inspection equipment |
| JP4728092B2 (en) | 2005-10-27 | 2011-07-20 | 名古屋電機工業株式会社 | X-ray image output apparatus, X-ray image output method, and X-ray image output program |
| JP2010071782A (en) | 2008-09-18 | 2010-04-02 | Omron Corp | Three-dimensional measurement apparatus and method thereof |
| JP2011080944A (en) | 2009-10-09 | 2011-04-21 | Shimadzu Corp | X-ray ct apparatus |
| JP5223876B2 (en) | 2010-03-12 | 2013-06-26 | オムロン株式会社 | X-ray inspection apparatus, X-ray inspection method, X-ray inspection program, and X-ray inspection system |
| JP5365645B2 (en) | 2011-01-17 | 2013-12-11 | オムロン株式会社 | Substrate inspection apparatus, substrate inspection system, and method of displaying screen for confirming substrate inspection result |
| US9841387B2 (en) | 2015-07-22 | 2017-12-12 | Test Research, Inc. | Inspection method and device |
| JP6485410B2 (en) | 2016-06-13 | 2019-03-20 | オムロン株式会社 | X-ray inspection apparatus and X-ray inspection method |
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