CN115000734B

CN115000734B - Connecting seat, circuit board and electronic equipment

Info

Publication number: CN115000734B
Application number: CN202111271672.2A
Authority: CN
Inventors: 胡小锋; 上阿强; 弓志娜
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-10-29
Filing date: 2021-10-29
Publication date: 2023-03-28
Anticipated expiration: 2041-10-29
Also published as: CN115000734A

Abstract

The application discloses connecting seat, circuit board and electronic equipment belongs to electron device technical field. The connecting seat comprises a pad, a connecting part, a conductive part and a base. The pad, the connecting portion and the conductive portion are all disposed on the base. The pad includes a first pad electrically connected to the conductive portion. The conductive part is used for being electrically connected with other connecting seats. The connecting part is used for being clamped with other connecting seats. The pad is used for being welded with the circuit board through the welding material. The pad is provided with a first concave part, and when the pad is welded with the circuit board through welding materials, the welding materials are filled in the first concave part. So, when welding the material solidification back, fill the welding material of first depressed part and can play the effect of fixed pad like the nail to the welding strength of reinforcing connecting seat and circuit board, and then reduce the possibility that the connecting seat of welding on the circuit board drops.

Description

Connecting seat, circuit board and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a connecting socket, a circuit board and an electronic device.

Background

Electronic devices such as cell phones, tablet computers, and notebook computers typically include multiple circuit boards. If two of the plurality of circuit boards need to be electrically connected, a connecting socket may be soldered to each of the two circuit boards that need to be electrically connected, and each of the circuit boards is electrically connected to the connecting socket soldered thereto. Two connecting seats welded on the two circuit boards respectively can be clamped with each other, and the two connecting seats clamped with each other are electrically connected. Thus, the electric connection of the two circuit boards can be realized.

In the related art, the connecting socket has a pad, and the pad is soldered to the circuit board by low temperature solder paste. However, the low-temperature solder paste has poor solderability and low soldering strength, so that the connection seat soldered on the circuit board by the low-temperature solder paste is easy to fall off.

Disclosure of Invention

The application provides a connecting seat, circuit board and electronic equipment can strengthen the welding strength of connecting seat and circuit board to reduce the possibility that the connecting seat of welding on the circuit board drops. The technical scheme is as follows:

in a first aspect, there is provided a connection receptacle, comprising: the circuit board includes a pad, a connection portion, a conductive portion, and a base. The bonding pad, the connecting part and the conductive part are all positioned on the surface of the base. The pad includes a first pad electrically connected to the conductive portion. The conductive part is used for being electrically connected with other connecting seats, and the connecting part is used for being clamped with other connecting seats. The pad is used for being welded with the circuit board through the welding material. The pad is provided with a first concave part, and when the pad is welded with the circuit board, the welding material is filled in the first concave part.

In the present application, the connection socket includes a pad, a connection portion, a conductive portion, and a base. The pad, the connecting portion and the conductive portion are all disposed on the base. The pad includes a first pad electrically connected to the conductive portion. The conductive part is used for being electrically connected with other connecting seats. The connecting part is used for being clamped with other connecting seats. The pad is used for being welded with the circuit board through the welding material. When the first welding disc is welded with the circuit board, the first welding disc can be electrically connected with the circuit board. Therefore, the two connecting seats can be clamped through the connecting parts and are electrically connected through the conductive parts. When the circuit boards are respectively welded on the two connecting seats, the two circuit boards can be electrically connected through the first welding pads and the conductive parts of the two connecting seats. The pad is provided with a first concave part, and when the pad is welded with the circuit board through welding materials, the welding materials are filled in the first concave part. So, when welding the material solidification back, fill the welding material of first depressed part and can play the effect of fixed pad like the nail of nailing into the pad to the welding strength of reinforcing connecting seat and circuit board, and then reduce the possibility that the connecting seat of welding on the circuit board drops.

Optionally, the connecting portion and the conductive portion are located on a first surface of the base, and the first pad is located on a second surface of the base, which is adjacent to the first surface. The first bonding pad is provided with a welding surface, the welding surface of the first bonding pad is a surface parallel to and opposite to the first surface, and the welding surface of the first bonding pad is used for being welded with the circuit board. The first recess includes a blind hole or a through hole at the bonding surface of the first pad.

In the present application, the first recess may be a blind hole or a through hole extending from the bonding surface of the first pad to the preset surface of the first pad. The preset surface of the first bonding pad refers to one surface of the first bonding pad opposite to the welding surface. When the first sunken part is a through hole, the first sunken part penetrates through the first bonding pad; when the first recess is a blind hole, the first recess does not penetrate through the first pad.

Optionally, the shape of the first recess on the bonding surface of the first pad includes one or more of a circle, an ellipse, and a polygon.

Optionally, the connecting portion and the conductive portion are located on a first surface of the base, and the first pad is located on a second surface of the base, which is adjacent to the first surface. The first bonding pad is provided with a welding surface and a side surface, the welding surface of the first bonding pad is a surface parallel to and opposite to the first surface, the welding surface of the first bonding pad is used for welding with the circuit board, and the side surface of the first bonding pad is adjacent to the welding surface of the first bonding pad. The first depressed part includes a groove located at a side surface of the first pad, and the groove extends to the bonding surface of the first pad.

In the present application, the first recess may also be a groove located at a side of the first pad. The groove extends to the welding surface of the first welding disc, so that when the first welding disc is welded with the circuit board through the welding material, the welding material fills the first sunken part. The groove can also extend to the preset surface of the first bonding pad or not extend to the preset surface of the first bonding pad. The preset surface of the first bonding pad refers to one surface of the first bonding pad opposite to the welding surface.

Optionally, the pad further comprises a second pad. The connecting part and the conducting part are positioned on the first surface of the base, the first pad is positioned on the second surface, adjacent to the first surface, of the base, and the second pad is positioned on the third surface, adjacent to the first surface, of the base, and the third surface is different from the second surface. The second bonding pad is provided with a welding surface, the welding surface of the second bonding pad is a surface parallel to and opposite to the first surface, and the welding surface of the second bonding pad is used for welding with the circuit board. The first recess includes a blind hole or a through hole at the bonding surface of the second pad.

In the present application, the first recess may be a blind hole or a through hole extending from the bonding surface of the second pad to the preset surface of the second pad. The preset surface of the second bonding pad refers to one surface of the second bonding pad opposite to the welding surface. When the first sunken part is a through hole, the first sunken part penetrates through the second bonding pad; when the first concave part is a blind hole, the first concave part does not penetrate through the second bonding pad.

Optionally, the shape of the first recess on the bonding surface of the second pad includes one or more of a circle, an ellipse, and a polygon.

Optionally, the pad further comprises a second pad. The connecting part and the conductive part are positioned on the first surface of the base, the first pad is positioned on the second surface, adjacent to the first surface, of the base, the second pad is positioned on the third surface, adjacent to the first surface, of the base, and the third surface is different from the second surface. The second bonding pad is provided with a welding surface, and the welding surface of the second bonding pad is a surface parallel to and opposite to the first surface. The welding surface of the second welding disc is used for welding with the circuit board, and the side surface of the second welding disc is adjacent to the welding surface of the second welding disc. The first depressed part includes a groove located on a side surface of the second pad, and the groove extends to the bonding surface of the second pad.

In the present application, the first recess may also be a groove located at a side of the second pad. The groove extends to the welding surface of the second bonding pad, so that when the second bonding pad is welded with the circuit board through the welding material, the welding material is filled in the first concave part. The groove can also extend to the preset surface of the second bonding pad or not. The preset surface of the second bonding pad refers to one surface of the second bonding pad opposite to the welding surface.

Optionally, the connecting portion and the conductive portion are located on a first surface of the base, and the pad is located on a surface of the base adjacent to the first surface. The welding surface of the welding pad is a surface which is parallel to and opposite to the first surface, and the welding surface of the welding pad is used for welding with the circuit board. The welding surface of the welding pad is provided with a metal plating layer.

Optionally, the material of the metal plating layer includes at least one of gold, silver, and tin.

In this application, the face of weld of pad can have gold, silver, tin metallic coating, can increase the cohesion between pad and the welding material to the welding strength of reinforcing connecting seat and circuit board, and then reduce the possibility that the connecting seat of welding on the circuit board drops.

Optionally, the connecting portion and the conductive portion are located on a first surface of the base, and the pad is located on a surface of the base adjacent to the first surface. The pad has a plurality of first recesses, and a distance between any two adjacent first recesses in a radial direction of the pad is greater than or equal to a maximum length of each of the two first recesses in the radial direction of the pad. Wherein, the direction parallel to the first surface is the radial direction of the bonding pad.

In the present application, the direction parallel to the first surface is a radial direction of the pad. The distance between two adjacent first concave parts in the radial direction of the pad is larger than or equal to the maximum length of each first concave part in the radial direction of the pad. So, both can strengthen the welding strength of connecting seat and circuit board through making the welding material fill first depressed part, can guarantee again that the pad is used for the area with circuit board welded face of weld to reduce the connecting seat of welding on the circuit board and drop the possibility.

Optionally, a maximum length of the first recess in a radial direction of the pad is greater than or equal to 0.1 mm.

In a second aspect, a circuit board is provided that includes leads on a soldering surface of the circuit board. The welding surface of the circuit board is used for welding with the welding disc of the connecting seat through welding materials, and when the welding surface of the circuit board is welded with the welding disc, the conducting wire is electrically connected with the first welding disc in the welding disc. And the position of the welding surface of the circuit board corresponding to the welding pad is provided with a second sunken part, and when the welding surface of the circuit board is welded with the welding pad, the welding material is filled in the second sunken part.

In this application, the circuit board includes wires at the soldering face. The welding surface of the circuit board is used for welding with the welding plate of the connecting seat through welding materials. When the welding surface of the circuit board is welded with the welding pads, the lead is electrically connected with a first welding pad in the welding pads. Therefore, when the welding surface of the circuit board is welded with the welding pad, the conducting wire on the circuit board can be electrically connected with the conducting part of the connecting seat through the first welding pad. The welding surface of the circuit board is provided with a second sunken part, and when the welding surface of the circuit board is welded with the welding pad through the welding material, the welding material is filled in the second sunken part. So, after the welding material solidification, the welding material of filling the second depressed part can play the effect of fixed circuit board like the nail of nailing the circuit board to the welding strength of reinforcing connecting seat and circuit board, and then reduce the possibility that the connecting seat of welding on the circuit board drops.

Optionally, the pad further includes a second pad, and when the soldering surface of the circuit board is soldered to the second pad, the ground wire of the circuit board is electrically connected to the second pad. And a second sunken part is arranged at the position, corresponding to the second pad, of the welding surface of the circuit board, and when the welding surface of the circuit board is welded with the second pad, the welding material is filled in the second sunken part.

Optionally, the second pad has a first recess, and when the second pad is soldered to the soldering surface of the circuit board, the solder material fills the first recess, and the position of the second recess corresponds to the position of the first recess.

In this application, the second pad has a first recess, and the circuit board has a second recess, the position of which corresponds to the position of the first recess. So, after welding the material solidification, the welding material of filling first depressed part and second depressed part can play the effect of fixed pad and circuit board like two-way nail to the welding strength of reinforcing connecting seat and circuit board, and then the possibility that the connecting seat of reduction welding on the circuit board drops.

Optionally, a second concave portion is formed in a position, corresponding to the first pad, of the soldering surface of the circuit board, and when the soldering surface of the circuit board is soldered to the first pad, the second concave portion is filled with the soldering material.

Optionally, the first pad has a first recess, and when the first pad is soldered to the soldering surface of the circuit board, the solder material fills the first recess, and the position of the second recess corresponds to the position of the first recess.

In this application, the first pad has a first recess, and the circuit board has a second recess, the position of which corresponds to the position of the first recess. So, after welding the material solidification, the material of welding of filling first depressed part and second depressed part can play the effect of fixed pad and circuit board like two-way nail to the welding strength of reinforcing connecting seat and circuit board, and then the possibility that the connecting seat that reduces the welding on the circuit board drops.

Optionally, the second recess is a blind or through hole in the soldering face of the circuit board. When the second sunken part is a through hole positioned on the welding surface of the circuit board, the second sunken part penetrates through the circuit board; when the second sunken part is a blind hole positioned on the welding surface of the circuit board, the second sunken part penetrates through the circuit board.

Optionally, the shape of the second recess on the soldering surface of the circuit board includes one or more of a circle, an ellipse, and a polygon.

Optionally, the maximum length of the second recess in any direction of the soldering surface of the circuit board is greater than or equal to 0.1 mm.

In a third aspect, an electronic device is provided, which includes the connection socket according to any one of the first aspect, or/and the circuit board according to any one of the second aspect.

Optionally, the electronic device comprises the connection socket according to any one of the first aspect, and the circuit board according to any one of the second aspect.

Drawings

Fig. 1 is a schematic perspective view of a first connecting seat according to an embodiment of the present disclosure;

fig. 2 is a schematic top view of a first connecting seat according to an embodiment of the present disclosure;

fig. 3 is a schematic perspective view of a second connecting seat according to an embodiment of the present disclosure;

fig. 4 is a schematic perspective view of a third connecting seat according to an embodiment of the present disclosure;

fig. 5 is a schematic perspective view of a fourth connecting seat provided in the embodiment of the present application;

fig. 6 is a schematic perspective view of a fifth connecting seat according to an embodiment of the present disclosure;

fig. 7 is a schematic bottom view of a first connecting seat according to an embodiment of the present disclosure;

fig. 8 is a schematic bottom view of a second connecting seat provided in the embodiment of the present application;

fig. 9 is a schematic bottom view of a third connecting seat provided in the embodiment of the present application;

fig. 10 is a schematic perspective view of a sixth connection seat provided in the embodiment of the present application;

fig. 11 is a schematic bottom view of a fourth connecting seat provided in the embodiment of the present application;

fig. 12 is a schematic perspective view of a seventh connecting seat according to an embodiment of the present disclosure;

fig. 13 is a schematic bottom view of a fifth connecting seat provided in the embodiment of the present application;

fig. 14 is a schematic perspective view of an eighth connecting seat provided in the embodiment of the present application;

fig. 15 is a schematic bottom view of a sixth connecting seat provided in the embodiment of the present application;

fig. 16 is a schematic bottom view of a seventh connecting seat provided in the embodiment of the present application;

fig. 17 is a simulation diagram illustrating a maximum coupling force between the first connector holder and the circuit board according to an embodiment of the present application;

fig. 18 is a simulation diagram of the maximum principal stress of the first connector socket and the circuit board according to the embodiment of the present application;

fig. 19 is a simulation diagram of the maximum combining force between the second connecting socket and the circuit board according to the embodiment of the present application;

fig. 20 is a simulation diagram of the maximum principal stress of the second connector holder and the circuit board according to the embodiment of the present application;

fig. 21 is a simulation diagram of the maximum combining force between the third connecting socket and the circuit board according to the embodiment of the present application;

fig. 22 is a simulation diagram of the maximum principal stress of the third connecting socket and the circuit board according to the embodiment of the present application;

fig. 23 is a simulation diagram of the maximum combining force between the fourth connector holder and the circuit board according to the embodiment of the present application;

fig. 24 is a simulation diagram of the maximum principal stress of the fourth connector holder and the circuit board according to the embodiment of the present application;

fig. 25 is a simulation diagram of the maximum combining force between the fifth connecting seat and the circuit board according to the embodiment of the present application;

fig. 26 is a simulation diagram of maximum principal stress of the fifth connecting socket and the circuit board according to the embodiment of the present application;

FIG. 27 is a line graph showing the relationship between the maximum coupling force and the number of the first concave portions according to the embodiment of the present application;

fig. 28 is a schematic perspective view of a first circuit board according to an embodiment of the present application;

fig. 29 is a schematic perspective view of a second circuit board provided in an embodiment of the present application;

fig. 30 is a schematic perspective view of an electronic device according to an embodiment of the present application;

fig. 31 is a schematic longitudinal cross-sectional structure diagram of an electronic device according to an embodiment of the present application.

Wherein, the meanings represented by the reference numerals of the figures are respectively as follows:

10. a connecting seat;

102. a bonding surface of the bonding pad;

103. presetting a surface;

104. a first recess;

106. axial direction;

1082. a first radial direction;

1084. a second radial direction;

110. a pad;

112. a first bonding pad;

114. a second pad;

120. a connecting portion;

130. a conductive portion;

140. a base;

142. a first surface;

144. a second surface;

146. a third surface;

20. a circuit board;

202. a soldering surface of the circuit board;

204. a second recessed portion;

210. a wire;

220. a ground line;

30. an electronic device;

310. and (5) welding materials.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

It should be understood that reference to "a plurality" in this application means two or more. In the description of the present application, "/" means "or" unless otherwise stated, for example, a/B may mean a or B; "and/or" herein is only an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, for the convenience of clearly describing the technical solutions of the present application, the terms "first", "second", and the like are used to distinguish the same items or similar items having substantially the same functions and actions. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.

Before explaining the embodiments of the present application in detail, an application scenario of the embodiments of the present application will be described.

Electronic devices such as cell phones, tablet computers, and notebook computers typically include multiple circuit boards. If two of the plurality of circuit boards need to be electrically connected, a connecting socket may be soldered to each of the two circuit boards that need to be electrically connected, and each of the circuit boards is electrically connected to the connecting socket soldered thereto. Two connecting seats respectively welded on two circuit boards can be mutually clamped, and the two connecting seats mutually clamped are electrically connected. Thus, the electric connection of the two circuit boards can be realized.

In the related art, the connecting socket has a pad, and the pad is soldered to the circuit board by low temperature solder paste. However, the low-temperature solder paste has poor solderability and low soldering strength, so that the connection socket soldered on the circuit board by the low-temperature solder paste is easy to fall off.

Therefore, the embodiment of the application provides the connecting seat, the circuit board and the electronic device, which can enhance the welding strength of the connecting seat and the circuit board, thereby reducing the possibility that the connecting seat welded on the circuit board falls off.

The connection socket provided in the embodiments of the present application is explained in detail below. In the embodiments of the present application, the electrical connection between two devices means that two electronic devices are connected by a wire to perform transmission of an electrical signal. The welding between the two devices means that the two devices are fixedly connected through welding materials.

Fig. 1 is a schematic perspective view of a connection seat 10 according to an embodiment of the present disclosure, and fig. 2 is a schematic top view of the connection seat 10 according to the embodiment of the present disclosure. Referring to fig. 1 and 2, the connecting socket 10 includes a pad 110, a connecting portion 120, a conductive portion 130, and a base 140. The pad 110, the connecting portion 120, and the conductive portion 130 are all located on the surface of the base 140. That is, the base 140 is used to dispose the pad 110, the connection portion 120, and the conductive portion 130. Generally, the base 140 is a three-dimensional structure formed of an insulating material with a certain thickness. The connecting portion 120 is used for clamping with other connecting sockets 10. The conductive part 130 is used for electrically connecting with the conductive part 130 of the other connector holder 10 when the connecting part 120 is clamped with the other connector holder 10. The connection portion 120 and the conductive portion 130 may be located on the same surface of the base 140 to facilitate clamping and electrical connection between two connection sockets 10. As in the embodiment shown in fig. 1 and 2, the connection portion 120 and the conductive portion 130 are located on the first surface 142 of the base 140, and the first surface 142 of the base 140 is an upper surface of the base 140 in the paper surface direction. The pads 110 may include first pads 112. The first pads 112 may be located on a second surface 144 of the base 140, where the second surface 144 is the surface of the base 140 adjacent to the first surface 142. The first pad 112 is electrically connected to the conductive portion 130. The first bonding pad 112 is used for being bonded to a circuit board through a bonding material, where the bonding material may be, for example, low-temperature solder paste, or a welding rod or other common bonding materials. When the first pads 112 are soldered to the circuit board, electrical connection with the wires of the circuit board is simultaneously achieved. The wires of the circuit board are used for transmitting electrical signals. That is, when the first pad 112 of the connector holder 10 is soldered to the circuit board, the conductive portion 130 of the connector holder 10 is electrically connected to the conductive line of the circuit board through the first pad 112 and the solder material. The pad 110 can further include a second pad 114, and the second pad 114 can be located on a third surface 146 of the base 140, where the third surface 146 is the surface of the base 140 adjacent to the first surface 142, and the third surface 146 and the second surface 144 are two different surfaces. The second pad 114 and the first pad 112 are separated from each other. The second pad 114 is used for being soldered to the circuit board by a soldering material, like the first pad 112, so that the connector holder 10 can be soldered to the circuit board by the first pad 112 and the second pad 114.

It should be noted that fig. 1 and fig. 2 are only schematic structural diagrams of the connection socket 10 provided in the embodiment of the present application, and the specific shape thereof should not be understood as a limitation to the connection socket 10 of the present application. In other embodiments, as shown in fig. 3, the connecting part 120 may further have a clamping groove for clamping, so that the connecting part 120 of one connector holder 10 is clamped with the connecting part 120 of another connector holder 10.

The connecting socket 10 may be divided into a male connector and a female connector, and a connecting portion 120 of the connecting socket 10 as the male connector is adapted to be engaged with a connecting portion 120 of the connecting socket 10 as the female connector. The stereo structure of the son head can be shown in fig. 1, and the stereo structure of the mother head can be shown in fig. 4. As can be seen from fig. 1 and 4, the basic structure of the male and female heads is the same, and the difference is that the conductive portion 130 of the male head and the conductive portion 130 of the female head can be engaged. In this way, when the connection portion 120 of the sub-head and the connection portion 120 of the mother head are engaged, the conductive portion 130 of the sub-head and the conductive portion 130 of the mother head are in contact, and the conductive portion 130 of the sub-head and the conductive portion 130 of the mother head are electrically connected. It will be appreciated that the conductive portions 130 of the sub-header and the conductive portions 130 of the female header may have a variety of different shapes, and the shapes of the conductive portions 130 of the sub-header and the female header shown in fig. 1 and 4 should not be construed as limiting the connection socket 10 of the present application. For example, in some other embodiments, the conductive part 130 of the sub-header may have a protrusion, and the conductive part 130 of the mother header may have a recess, and when the connection part 120 of the sub-header is engaged with the connection part 120 of the mother header, the protrusion of the conductive part 130 of the sub-header is inserted into the recess of the conductive part 130 of the mother header, so that the conductive part 130 of the sub-header is electrically connected with the conductive part 130 of the mother header.

The pad 110 (including at least one of the first pad 112 and the second pad 114) has the first recess 104 so that when the pad 110 is soldered to the circuit board by the solder material, the solder material can fill the first recess 104. Generally, when the pad 110 is soldered to the circuit board by the solder material, the solder material may be in a fluid state. At this time, in the process of soldering the circuit board and the pad 110, the soldering material may be filled in the first recess 104 by pressing the pad 110. Thereafter, as the solder material is cooled and solidified, the solder material filling the first recess 104 may function as a nail for fixing the pad 110 as it is driven into the pad 110. In some specific embodiments, the connection socket 10 may have only the first pad 112 with the first recess 104, only the second pad 114 with the first recess 104, and both the first pad 112 and the second pad 114 with the first recess 104.

In the embodiment of the present application, the connection socket 10 includes a pad 110, a connection portion 120, a conductive portion 130, and a base 140. The pad 110, the connection portion 120, and the conductive portion 130 are disposed on the base 140. The conductive portion 130 is used to electrically connect with other connecting sockets 10. The connecting portion 120 is used for clamping with other connecting sockets 10. The pad 110 is used for soldering with a circuit board by a solder material. The pads 110 include a first pad 112 and a second pad 114. The first pad 112 is electrically connected to the conductive portion 130. The first pad 112 may be electrically connected to the circuit board when soldered to the circuit board. Thus, the two connecting sockets 10 can be engaged with each other through the connecting portion 120 and electrically connected through the conductive portion 130. When the circuit boards are respectively soldered to the first pads 112 of the two connector sockets 10, the two circuit boards can be electrically connected through the first pads 112 of the two connector sockets 10 and the conductive parts 130. The pad 110 has a first recess 104, and when the pad 110 is soldered to the circuit board by a solder material, the solder material fills the first recess 104. Thus, after the solder material is solidified, the solder material filling the first recess 104 can function as a nail for fixing the pad 110, thereby enhancing the welding strength between the connector socket 10 and the circuit board, and further reducing the possibility of the connector socket 10 welded on the circuit board falling off.

In some embodiments, the connection 120 may also be a conductor. In this case, the connection portion 120 may be electrically connected to the second pad 114. At this time, the second pads 114 are different from the first pads 112: the second pad 114 is not electrically connected to the conductive portion 130; and when the second pad 114 is soldered to the circuit board, electrical connection with the ground line of the circuit board is simultaneously achieved. That is, when the second pad 114 of the connector holder 10 is soldered to the circuit board, the connection portion 120 of the connector holder 10 is electrically connected to the ground of the circuit board through the second pad 114 and the solder material. At this time, as shown in fig. 1 to 4, the connection portion 120 of the connection socket 10 may be disposed around the conductive portion 130. Thus, when two connecting sockets 10 are respectively welded to a circuit board and the two connecting sockets 10 are clamped to each other, the two circuit boards can perform signal transmission through the conductive portions 130 of the two connecting sockets 10. Meanwhile, since the connecting portion 120 of each connecting socket 10 surrounds the conductive portion 130, and the connecting portion 120 is connected to the ground, when the two connecting sockets 10 are connected to each other in a clamping manner, the connecting portions 120 of the two connecting sockets 10 can shield interference of external electromagnetic signals to electrical signals transmitted in the conductive portions 130 of the two connecting sockets 10, and can also prevent the electrical signals transmitted in the conductive portions 130 of the two connecting sockets 10 from radiating electromagnetic signals outwards.

As is known from the above description, the first pad 112 and the second pad 114 are different in the way of electrical connection, that is, the first pad 112 is used for connecting with a conductive wire of a circuit board and is connected with the conductive portion 130 of the connecting socket 10; the second pad 114 is used for connection with a ground line of the circuit board and is connected with the connection portion 120 of the connector holder 10. From a structural point of view, the structure of the first pad 112 and the structure of the second pad 114 may be the same. Therefore, in the embodiment of the present application, when the structures of the first pad 112 and the second pad 114 are described, the first pad 112 and the second pad 114 are collectively referred to as the pad 110. A detailed implementation of the first recess 104 of the pad 110 is explained below with reference to the drawings.

Fig. 5 and 6 are schematic perspective views of connection holder 10 according to an embodiment of the present disclosure, and fig. 7 is a schematic bottom view of connection holder 10 according to an embodiment of the present disclosure. In some embodiments, as shown in fig. 5-7, the first recess 104 is a through hole located at the bonding face 102 of the pad 110.

Specifically, as shown in fig. 6 and 7, the land 110 has a soldering surface 102, and the soldering surface 102 of the land 110 is a surface of the land 110 for soldering to a circuit board. Generally, the bonding surface 102 of the bonding pad 110 is a surface of the bonding pad 110 parallel to and opposite to the first surface 142 of the base 140. In the paper direction, if the first surface 142 of the base 140 is the upper surface of the base 140, the bonding surface 102 of the pad 110 is the lower surface of the pad 110. In this way, when the soldering surface 102 of the pad 110 is soldered to the circuit board, the connecting portion 120 and the conductive portion 130 of the connector holder 10 are away from the circuit board, which facilitates the connection of the connector holder 10 with other connector holders 10. The bonding side 102 of the bonding pad 110 includes a side for bonding to a circuit board for the first bonding pad 112, and a side for bonding to a circuit board for the second bonding pad 114. As shown in fig. 5 and 6, the pad 110 further has a predetermined surface 103, and the predetermined surface 103 of the pad 110 is a surface of the pad 110 opposite to the bonding surface 102. In the paper direction, the bonding surface 102 of the pad 110 is the lower surface of the pad 110, and the predetermined surface 103 of the pad 110 is the upper surface of the pad 110. The predetermined surface 103 of the pad 110 includes a surface of the first pad 112 opposite to the bonding surface 102, and a surface of the second pad 114 opposite to the bonding surface 102. The first recess 104 may be a through hole at the bonding surface 102 of the pad 110. Here, the through hole located on the bonding surface 102 refers to a hole that extends from the bonding surface 102 of the pad 110 to the predetermined surface 103 of the pad 110, extends to the predetermined surface 103 of the pad 110, and penetrates the pad 110. In this manner, when the pad 110 is soldered to the circuit board by the solder material, the solder material may fill the through hole on the soldering surface 102, and as the solder material is solidified by cooling, the solder material filling the through hole on the soldering surface 102 may function as a nail for fixing the pad 110 as well as the nail for driving the pad 110.

In other embodiments, the first recess 104 may also be a blind hole located at the bonding surface 102 of the bonding pad 110. The blind via at the bonding surface 102 is a via that extends from the bonding surface 102 of the pad 110 to the predetermined surface 103 of the pad 110, but does not extend to the predetermined surface 103 of the pad 110 and does not penetrate the pad 110. In this way, when the pad 110 is soldered to the circuit board by the solder material, the solder material can fill the blind hole on the soldering surface 102, and as the solder material is cooled and solidified, the solder material filling the blind hole on the soldering surface 102 can function as a nail for fixing the pad 110. When the first recess 104 is a through hole located on the bonding surface 102 of the bonding pad 110, the bottom view of the connecting socket 10 can also be as shown in fig. 7.

In some embodiments, as shown in fig. 7, the shape of the first recess 104, which is a through-hole or a blind-hole, on the bonding face 102 may be circular. In other embodiments, as shown in fig. 8 and 9, the shape of the first recess 104 on the bonding surface 102, which is a through hole or a blind hole, may be rectangular or elliptical. In other embodiments, which are not shown, the shape of the first recess 104, which is a through hole or a blind hole, on the welding surface 102 may also be a polygon such as a triangle, a pentagon, or an irregular figure.

Fig. 10 is a schematic perspective view of another connection socket 10 provided in this embodiment of the present application, and fig. 11 is a schematic bottom view of the connection socket 10 corresponding to fig. 10 provided in this embodiment of the present application. As shown in fig. 10 and 11, in some embodiments, the first recess 104 may also be a groove located at a side of the pad 110. The side surface of the pad 110 abuts the bonding surface 102 of the pad 110. The groove extends to the bonding face 102 of the pad 110.

Specifically, as shown in fig. 10 and 11, the pad 110 has a bonding surface 102, a preset surface 103, and a side surface. The bonding surface 102 of the bonding pad 110 is a surface of the bonding pad 110 for bonding to a circuit board. Generally, the bonding surface 102 of the bonding pad 110 is a surface of the bonding pad 110 parallel to and opposite to the first surface 142 of the base 140. The predetermined surface 103 of the pad 110 is a surface of the pad 110 opposite to the bonding surface 102. In the paper plane direction, the bonding surface 102 of the pad 110 is the lower surface of the pad 110, and the predetermined surface 103 of the pad 110 is the upper surface of the pad 110. The side surface of the pad 110 refers to a surface of the pad 110 adjacent to the bonding surface 102, that is, the side surface of the pad 110 refers to a surface located between the bonding surface 102 and the predetermined surface 103 of the pad 110 and adjacent to the bonding surface 102 and the predetermined surface 103 of the pad 110. The first recess 104 is a groove located on a side surface of the pad 110, and the groove extends to the bonding surface 102 of the pad 110. Thus, when the pad 110 is soldered to the circuit board by the solder material, the solder material can fill the groove extending to the soldering surface 102. Thus, the soldering material filling the groove can clamp the connecting socket 10 in the middle along with the cooling and solidification of the soldering material, thereby playing a role of fixing the soldering pad 110.

In some embodiments, the groove on the side of the pad 110 may also extend to the predetermined surface 103 of the pad 110, and the groove may penetrate the pad 110. In this case, the perspective structure of the connecting seat 10 can be as shown in fig. 10, and the bottom structure can be as shown in fig. 11. In other specific embodiments, the groove on the side of the pad 110 does not extend to the predetermined surface 103 of the pad 110, and the groove does not extend through the pad 110. In this case, the perspective structure of the connecting seat 10 can be shown in fig. 12, and the bottom structure can be shown in fig. 13.

In some embodiments, when the first recess 104 is a groove located at a side of the pad 110, the shape of the first recess 104 on the bonding surface 102 of the pad 110 includes one or more of a semicircle, a semi-ellipse, and a semi-polygon. That is, when the first recess 104 is a groove located on the side surface of the pad 110, the shape of the first recess 104 on the bonding surface 102 of the pad 110 may be a circular half, an elliptical half, a triangular half, a rectangular half, a pentagonal half, an irregular pattern half, or the like. The "half" is not limited to only one half of a figure halving but may be a smaller half or a larger half.

In some embodiments, the bonding surface 102 of the bonding pad 110 has a metal plating. The material of the metal plating layer comprises at least one of gold, silver and tin. Generally, the material of the pad 110 may be copper. Because the welding strength of copper is lower, the welding face 102 of the pad 110 can have metal coatings such as gold, silver, tin and the like, so that the bonding force between the pad 110 and welding materials can be increased, the welding strength of the connecting seat 10 and the circuit board is enhanced, and the possibility that the connecting seat 10 welded on the circuit board falls off is reduced.

In some embodiments, the number of the first recesses 104 on any one of the pads 110 (including any one of the first pad 112 and the second pad 114) is plural. On the same pad 110, the distance between any two adjacent first recesses 104 in the radial direction of the pad 110 is greater than or equal to the maximum length of each of the two first recesses 104 in the radial direction of the pad 110. That is, in the same radial direction, the distance between any two adjacent first recesses 104 is greater than or equal to the maximum length of each of the two first recesses 104.

Specifically, fig. 14 is a schematic perspective view of another connection seat 10 provided in the embodiment of the present application, and fig. 15 is a schematic bottom view of the connection seat 10 corresponding to fig. 14 provided in the embodiment of the present application. As shown in fig. 14 and 15, the connection socket 10 may include a plurality of pads 110. Here, a plurality means two or more integers. As in the embodiment shown in fig. 15, the connection socket 10 includes two first pads 112, two second pads 114. The first pad 112 and the second pad 114 are distinguished in their electrical connection relationship. Each pad 110 has a plurality of first recesses 104 thereon.

The portion of the connecting socket 10 other than the pad 110 is taken as a combined body, that is, the connecting portion 120, the conductive portion 130 and the base 140 of the connecting socket 10 are taken as a combined body having a central axis. Specifically, the central axis of the combined body refers to a straight line dividing the combined body into symmetrical parts, and when the combined body is rotated 180 ° along the central axis, the various views (including the front view, the left view, the right view, the bottom view, the top view, and the rear view) of the combined body are completely unchanged. The direction along the central axis of the assembly is the axial direction 106, and the direction perpendicular to the axial direction 106 is the radial direction of the first land 112 and the second land 114. Alternatively, the direction perpendicular to the first surface 142 of the base 140 is the axial direction 106, and the direction parallel to the first surface 142 of the base 140 is the radial direction of the pad 110.

In the embodiment of the present application, as can be seen from fig. 14 and 15, the bonding surface 102 of the bonding pad 110 is perpendicular to the axial direction 106. Thus, any one direction on the bonding face 102 of the bonding pad 110 is a radial direction of the bonding pad 110, which, as in the embodiment shown in fig. 15, includes a first radial direction 1082 and a second radial direction 1084. The distance between two adjacent first recesses 104 in the radial direction of the pad 110 is the minimum distance between two adjacent first recesses 104 on the bonding surface 102 of the pad 110. As in the embodiment shown in fig. 15, a distance between two adjacent first recesses 104 on the first pad 112 in the radial direction of the pad 110 is a distance between two adjacent first recesses 104 on the first pad 112 along the first radial direction 1082. The distance between two adjacent first recesses 104 on the second pad 114 in the radial direction of the pad 110 is the distance between two adjacent first recesses 104 on the second pad 114 in the second radial direction 1084. The maximum length of each first recess 104 in the radial direction of the pad 110 in two adjacent first recesses 104 is the maximum width of the two first recesses 104 in the radial direction on the welding surface 102 of the pad 110. As shown in fig. 15, when the first recesses 104 are circular on the bonding surface 102, the maximum length of each first recess 104 in the radial direction of the bonding pad 110 in two adjacent first recesses 104 is the maximum diameter of the two circular recesses. When the first concave portions 104 are square on the welding surface 102, the maximum length of each first concave portion 104 in the radial direction of the welding pad 110 in two adjacent first concave portions 104 is the maximum side length of the two square concave portions. As shown in fig. 16, when the first recesses 104 are oval on the welding surface 102, the maximum length of each first recess 104 in the radial direction of the welding pad 110 in two adjacent first recesses 104 is the maximum long axis length of the two oval recesses. In the embodiment shown in fig. 16, the major axis of the elliptical recess in the first pad 112 refers to the length of the first recess 104 in the first radial direction 1082 on the first pad 112; the major axis of the elliptical recess in the second pad 114 refers to the length of the first recess 104 in the second radial direction 1084 in the second pad 114.

In some embodiments, if the bonding surface 102 of each bonding pad 110 has a plurality of circular first recesses 104, each circular first recess 104 has a diameter equal to 0.1 mm. The distance between two adjacent first concave portions 104 on the bonding surface 102 of the bonding pad 110 should be at least 0.1 mm, that is, the distance between two adjacent first concave portions 104 on the bonding surface 102 of the bonding pad 110 is greater than or equal to 0.1 mm. In other embodiments, if the bonding surface 102 of each bonding pad 110 has a plurality of square first recesses 104, and each of the square first recesses 104 has a side length equal to 0.15 mm. The distance between two adjacent first recesses 104 on the bonding surface 102 of the bonding pad 110 should be at least 0.15 mm. In the embodiment of the present application, a distance between two adjacent first recesses 104 in the radial direction of the bonding pad 110 is greater than or equal to a maximum length of each first recess 104 in the radial direction of the bonding pad 110. Thus, the welding strength between the connecting socket 10 and the circuit board can be enhanced by filling the first recess 104 with the welding material, and the area of the welding surface 102 of the welding pad 110 for welding with the circuit board can be ensured, so that the possibility that the connecting socket 10 welded on the circuit board falls off is reduced.

In some embodiments, a maximum length of the first recess 104 in a radial direction of the pad 110 is greater than or equal to 0.1 mm. For example, the maximum length of the first recess 104 in the radial direction of the pad 110 may be 0.1 mm, 0.15 mm, or 0.2 mm. In some specific embodiments, the maximum length of the first recess 104 in the radial direction of the pad 110 may be related to the material of the metal plating on the bonding surface 102. For example, when the material of the metal plating of the bonding surface 102 is gold or silver, the maximum length of the first recess 104 in the radial direction of the bonding pad 110 may be greater than 0.1 mm; when the material of the metal plating of the soldering surface 102 is tin, the maximum length of the first recess 104 in the radial direction of the soldering land 110 may be greater than 0.15 mm.

In some embodiments, the connection socket 10 includes one first pad 112 and two second pads 114. A plurality of first recesses 104 may be provided on each second pad 114. Each first concave part 104 on the second bonding pad 114 is a through hole penetrating through the bonding surface 102 and the preset surface 103 of the second bonding pad 114, and the shape and the size of each first concave part 104 on the bonding surface 102 on the second bonding pad 114 are the same. The distance between two adjacent first recesses 104 on each second land 114 in the radial direction of the second land 114 is greater than the maximum length of each first recess 104 in the radial direction of the second land 114.

The maximum bonding force and the maximum main stress after the connecting seat 10 provided by the embodiment of the application and the circuit board are welded are simulated by adopting low-temperature solder paste as a welding material, and the simulation results are shown in fig. 17 to 26. Fig. 17 shows the maximum bonding force of the connector holder 10 after being soldered to the circuit board when the pad 110 of the first connector holder 10 does not have the first recess 104. As can be seen from the figure, in this case, the maximum bonding force of the connecting socket 10 and the circuit board after being welded is 4.622 × 10 ^-4 N, i.e., 462.2ueN. Fig. 18 is a simulation diagram of the maximum principal stress after the connector holder 10 and the circuit board are soldered corresponding to fig. 17. Fig. 19 shows the maximum bonding force of the connector holder 10 after soldering with the circuit board when each second land 114 of the first connector holder 10 has three first recesses 104. As can be seen from the figure, in this case, the maximum bonding force of the connector holder 10 and the circuit board after being soldered is 8.482 × 10 ^-4 N, i.e., 848.2ueN. Fig. 20 is a simulation diagram of the maximum principal stress after the connector holder 10 and the circuit board are soldered, corresponding to fig. 19. Fig. 21 shows the maximum bonding force of the connector holder 10 after soldering with the circuit board when each second land 114 of the first connector holder 10 has four first recesses 104. As can be seen from the figure, in this case, the maximum bonding force of the connector holder 10 after being soldered to the circuit board is 9.304 × 10 ^-4 N, i.e., 930.4ueN. Fig. 22 is a simulation diagram of the maximum principal stress after the connector holder 10 and the circuit board are soldered corresponding to fig. 21. Fig. 23 shows the maximum coupling force of the connector holder 10 after soldering with the circuit board when each second land 114 of the first connector holder 10 has five first recesses 104. As can be seen from the figure, in this case, the maximum bonding force of the connecting socket 10 and the circuit board after being welded is 9.348 x 10 ^-4 N, i.e., 934.8ueN. Fig. 24 is a simulation diagram of the maximum principal stress after the connector holder 10 and the circuit board are soldered corresponding to fig. 23. Fig. 25 shows the maximum bonding force of the connector holder 10 after soldering with the circuit board when each second land 114 of the first connector holder 10 has six first recesses 104. It can be seen from the figure thatIn this case, the maximum bonding force between the connector socket 10 and the circuit board after soldering is 9.822 × 10 ^-4 N, i.e., 982.2ueN. Fig. 26 is a simulation diagram of the maximum principal stress after the connector holder 10 and the circuit board are soldered corresponding to fig. 25.

The simulation results obtained in fig. 19, 21, 23, and 25 are plotted as line graphs of the maximum bonding force with respect to the number of first recesses 104 per second pad 114, resulting in fig. 27. As can be seen from the drawing, as the number of the first recesses 104 on each of the second pads 114 increases, the maximum coupling force of the connector holder 10 after being soldered to the circuit board gradually increases. Meanwhile, as can be seen from fig. 20, 22, 24 and 26, as the number of the first recesses 104 on each of the second pads 114 increases, the maximum principal stress becomes greater at a position close to the first recesses 104 after the connection socket 10 is soldered to the circuit board. This can be said to make the solder material fill the first concave portion 104, which can enhance the soldering strength between the connecting socket 10 and the circuit board, and further reduce the possibility of the connecting socket 10 soldered on the circuit board falling off.

In the embodiment of the present application, the connection socket 10 includes a pad 110, a connection portion 120, a conductive portion 130, and a base 140. The pad 110, the connection portion 120, and the conductive portion 130 are disposed on the base 140. The pad 110 includes a first pad 112, and the first pad 112 is electrically connected to the conductive portion 130. The conductive portion 130 is used to electrically connect with other connecting sockets 10. The connecting portion 120 is used for clamping with other connecting sockets 10. The pad 110 is used for soldering with a circuit board by a solder material. The first pad 112 may be electrically connected to the circuit board when soldered to the circuit board. Thus, the two connecting sockets 10 can be engaged with each other through the connecting portion 120 and electrically connected through the conductive portion 130. When the circuit boards are respectively soldered to the first pads 112 of the two connector sockets 10, the two circuit boards can be electrically connected through the first pads 112 of the two connector sockets 10 and the conductive portions 130. The pad 110 has a first recess 104, and when the pad 110 is soldered to the circuit board by a solder material, the solder material fills the first recess 104. Thus, after the solder material is solidified, the solder material filling the first recess 104 can function as a nail for fixing the pad 110, thereby enhancing the welding strength between the connector socket 10 and the circuit board, and further reducing the possibility of the connector socket 10 welded on the circuit board falling off.

The connection portion 120 may be a conductor and electrically connected to the second pad 114. The second pad 114 is used for soldering to the circuit board and electrically connected to the ground line of the circuit board. The connection part 120 may be disposed around the conductive part 130. Thus, when two connecting sockets 10 are respectively welded to a circuit board and the two connecting sockets 10 are connected to each other in a clamping manner, the connecting portion 120 of the two connecting sockets 10 can shield the interference of external electromagnetic signals to the electrical signals transmitted in the conductive portions 130 of the two connecting sockets 10, and can also prevent the electrical signals transmitted in the conductive portions 130 of the two connecting sockets 10 from radiating electromagnetic signals outwards. The soldering surface 102 of the soldering land 110 may have gold, silver, tin metal plating layers, which may increase the bonding force between the soldering land 110 and the soldering material, thereby enhancing the soldering strength between the connecting socket 10 and the circuit board. The distance between two adjacent first recesses 104 in the radial direction of the pad 110 is greater than or equal to the maximum length of each first recess 104 in the radial direction of the pad 110. In this way, the soldering strength between the connector holder 10 and the circuit board can be enhanced by filling the first recess 104 with the soldering material, and the area of the soldering surface 102 of the soldering land 110 for soldering with the circuit board can be ensured, thereby reducing the possibility that the connector holder 10 soldered on the circuit board falls off.

Fig. 28 is a schematic perspective view of a circuit board 20 according to an embodiment of the present disclosure. As shown in fig. 28, the embodiment of the present application further provides a circuit board 20, which includes a conducting wire 210 located on the soldering surface 202 of the circuit board 20. The soldering surface 202 of the circuit board 20 is used for soldering with the soldering land 110 of the connector holder 10 by a soldering material. When the soldering surface 202 of the circuit board 20 is soldered to the first pads 112, the wires 210 are electrically connected to the first pads 112 of the pads 110. The soldering surface 202 of the circuit board 20 has a second concave portion 204 at a position corresponding to the soldering land 110, and when the soldering surface 202 of the circuit board 20 is soldered to the soldering land 110, the second concave portion 204 is filled with a soldering material.

Specifically, the circuit board 20 is used to mount a plurality of electronic devices. The circuit board 20 is a device that provides electrical connection for a plurality of electronic devices. Generally, the circuit board 20 has a plurality of connecting wires therein, and when a plurality of electronic devices are mounted on the circuit board 20, the plurality of electronic devices are electrically connected to each other through the connecting wires inside the circuit board 20. The circuit board 20 has a soldering surface 202, and the soldering surface 202 of the circuit board 20 is used for soldering with the connector holder 10 by soldering material. Generally, a plurality of electronic components are mounted to the mounting surface of the circuit board 20. The mounting face of the circuit board 20 and the soldering face 202 of the circuit board 20 are two opposite surfaces on the circuit board 20. The circuit board 20 is used to connect with other circuit boards 20 through the connector socket 10. The soldering side 202 of the circuit board 20 has a conductor 210, where the conductor 210 may be an extension of a connection line in the circuit board 20. When the bonding surface 202 of the circuit board 20 is bonded to the bonding pad 110, the wire 210 is electrically connected to the first bonding pad 112. Thus, when the soldering surface 202 of the circuit board 20 is soldered to the pad 110, the conductive wire 210 can be connected to the conductive portion 130 of the connecting socket 10. In this case, if the two circuit boards 20 are respectively welded with the connector sockets 10, the two circuit boards 20 can be electrically connected when the connector sockets 10 welded to the two circuit boards 20 are snapped.

The soldering surface 202 of the circuit board 20 has a second recess 204 at a position corresponding to the pad 110, so that when the soldering surface 202 of the circuit board 20 is soldered to the pad 110 of the connector socket 10 by a solder material, the solder material can fill the second recess 204. Generally, when the soldering surface 202 of the circuit board 20 is soldered to the soldering land 110 of the connector socket 10 by a solder material, the solder material may be in a fluid state. At this time, in the process of soldering the circuit board 20 and the pad 110, the solder material may be filled in the second recess 204 by pressing the pad 110 or the circuit board 20. Then, as the solder material is cooled and solidified, the solder material filling the second recess 204 may function as a nail driven into the circuit board 20 to fix the circuit board 20, thereby enhancing the welding strength between the connector holder 10 and the circuit board 20, and further reducing the possibility that the connector holder 10 soldered on the circuit board 20 is dropped.

In some embodiments, the soldering surface 202 of the circuit board 20 has a second recess 204 corresponding to the first pad 112, and when the soldering surface 202 of the circuit board 20 is soldered to the first pad 112, the solder material fills the second recess 204.

Further, the first pad 112 has a first recess 104. When the first pad 112 is soldered to the soldering surface 202 of the circuit board 20, the solder material fills the first recess 104, and the position of the second recess 204 corresponds to the position of the first recess 104. Thus, after the solder material is solidified, the solder material filling the first and

second recesses

104 and 204 can function as a bi-directional nail to fix the pad 110 and the circuit board 20, thereby enhancing the welding strength between the connector socket 10 and the circuit board 20 and further reducing the possibility of the connector socket 10 welded on the circuit board 20 falling off.

In some embodiments, the second recess 204 is a blind or through hole located at the soldering face 202 of the circuit board 20. Specifically, the second recess 204 may be a blind hole or a through hole extending from the soldering face 202 of the circuit board 20 to the mounting face of the circuit board 20. When the second recess 204 is a through hole, the second recess 204 penetrates the circuit board 20. When the second recess 204 is a blind hole, the second recess 204 does not penetrate the circuit board 20.

In some embodiments, the maximum length of the second recess 204 in any direction of the soldering face 202 of the circuit board 20 is greater than or equal to 0.1 mm.

In some embodiments, as shown in fig. 29, the bonding side 202 of the circuit board 20 also has a ground 220, where the ground 220 may be an extension of the ground 220 in the circuit board 20. When the soldering surface 202 of the circuit board 20 is soldered to the soldering lands 110, the ground lines 220 are electrically connected to the second soldering lands 114 of the soldering lands 110. Thus, when the soldering surface 202 of the circuit board 20 is soldered to the soldering land 110, the ground wire 220 is electrically connected to the connecting portion 120 of the connector holder 10. In this case, if the two circuit boards 20 are respectively welded with the connecting sockets 10, the ground wires in the two circuit boards 20 can be connected when the connecting sockets 10 welded on the two circuit boards 20 are clamped.

In some embodiments, pad 110 includes a second pad 114. The second pad 114 is electrically connected to the connection portion 120. When the soldering surface 202 of the circuit board 20 is soldered to the second soldering land 114, the ground line 220 of the circuit board 20 is electrically connected to the second soldering land 114. The soldering surface 202 of the circuit board 20 has a second recess 204 at a position corresponding to the second land 114, and when the soldering surface 202 of the circuit board 20 is soldered to the second land 114, the solder material fills the second recess 204.

Further, the second pad 114 has the first recess 104. When the second pad 114 is soldered to the soldering surface 202 of the circuit board 20, the solder material fills the first recess 104, and the position of the second recess 204 corresponds to the position of the first recess 104. Thus, after the solder material is solidified, the solder material filling the first and

second recesses

104 and 204 can function as a two-way nail to fix the solder pad 110 and the circuit board 20, thereby enhancing the soldering strength between the connector socket 10 and the circuit board 20 and further reducing the possibility of the connector socket 10 soldered on the circuit board 20 falling off.

In some embodiments, the shape of the second recess 204 on the soldering face 202 of the circuit board 20 includes one or more of a circle, an ellipse, and a polygon.

In the embodiment of the present application, the circuit board 20 includes a lead 210 at the soldering face 202. The soldering surface 202 of the circuit board 20 is used for soldering with the soldering land 110 of the connector holder 10 by a soldering material. When the bonding surface 202 of the circuit board 20 is bonded to the bonding pad 110, the wire 210 is electrically connected to the first bonding pad 112. Thus, when the soldering surface 202 of the circuit board 20 is soldered to the pad 110, the conductive wire 210 on the circuit board 20 can be electrically connected to the conductive portion 130 of the connecting socket 10 through the first pad 112. The soldering surface 202 of the circuit board 20 has a second concave portion 204, and when the soldering surface 202 of the circuit board 20 is soldered to the soldering land 110 by a soldering material, the soldering material fills the second concave portion 204. Thus, after the solder material is solidified, the solder material filling the second recess 204 can function as a nail for fixing the circuit board 20 like nailing into the circuit board 20, thereby enhancing the welding strength between the connector socket 10 and the circuit board 20 and further reducing the possibility that the connector socket 10 welded on the circuit board 20 falls off.

The embodiment of the present application further provides an electronic device 30, which includes the connection socket 10 as described in any one of the above embodiments, or/and the circuit board 20 as described in any one of the above embodiments.

Specifically, the electronic device 30 may be a mobile phone, a tablet computer, a notebook computer, and the like. The electronic device 30 includes two or more circuit boards 20. At least one connecting socket 10 is welded on each circuit board 20, so that two circuit boards 20 can be clamped together through the connecting sockets 10 welded on the two circuit boards 20. Typically, a set of connector sockets 10 and circuit boards 20 are soldered together, the connector sockets 10 being the connector sockets 10 described in any of the above embodiments, or/and the circuit boards 20 being the circuit boards 20 described in any of the above embodiments.

In some embodiments, the connection socket 10 includes a pad 110, a connection part 120, a conductive part 130, and a base 140. The pad 110, the connection portion 120, and the conductive portion 130 are located on the surface of the base 140. The pad 110 includes a first pad 112. The first pad 112 is electrically connected to the conductive portion 130, and the conductive portion 130 is used for electrically connecting to other connecting sockets 10. The connecting portion 120 is used for clamping with other connecting sockets 10. The pad 110 is used for being soldered to the circuit board 20 by a soldering material, the pad 110 has a first recess 104, and the soldering material fills the first recess 104 when the pad 110 is soldered to the circuit board 20.

In some embodiments, the connecting portion 120 and the conductive portion 130 are located on a first surface 142 of the base 140, and the first pad 112 is located on a second surface 144 of the base 140 adjacent to the first surface 142. The first land 112 has a soldering surface 102, the soldering surface 102 of the first land 112 is a surface of the first land 112 parallel to and opposite to the first surface 142, and the soldering surface 102 of the first land 112 is used for soldering with the circuit board 20. The first recess 104 includes a blind or through hole at the bonding face 102 of the first pad 112.

In some embodiments, the shape of the first recess 104 on the bonding face 102 of the first pad 112 includes one or more of a circle, an ellipse, and a polygon.

In some embodiments, the connecting portion 120 and the conductive portion 130 are located on a first surface 142 of the base 140, and the first pad 112 is located on a second surface 144 of the base 140 adjacent to the first surface 142. The first land 112 has a bonding surface 102 and a side surface, the bonding surface 102 of the first land 112 is a surface of the first land 112 parallel to and opposite to the first surface 142, the bonding surface 102 of the first land 112 is used for bonding with the circuit board 20, and the side surface of the first land 112 is adjacent to the bonding surface 102 of the first land 112. The first recess 104 includes a groove at a side of the first pad 112, and the groove extends to the bonding face 102 of the first pad 112.

In some embodiments, the pad 110 further includes a second pad 114. The connecting portion 120 and the conductive portion 130 are located on a first surface 142 of the base 140, the first pad 112 is located on a second surface 144 of the base 140 adjacent to the first surface 142, the second pad 114 is located on a third surface 146 of the base 140 adjacent to the first surface 142, and the third surface 146 is different from the second surface 144. The second bonding pad 114 has a bonding surface 102, the bonding surface 102 of the second bonding pad 114 is a surface of the second bonding pad 114 parallel to and opposite to the first surface 142, and the bonding surface 102 of the second bonding pad 114 is used for bonding with the circuit board 20. The first recess 104 includes a blind or through hole at the bonding surface 102 of the second pad 114.

In some embodiments, the shape of the first recess 104 on the bonding face 102 of the second pad 114 includes one or more of a circle, an ellipse, and a polygon.

In some embodiments, the pad 110 further includes a second pad 114. The connecting portion 120 and the conductive portion 130 are located on a first surface 142 of the base 140, the first pad 112 is located on a second surface 144 of the base 140 adjacent to the first surface 142, the second pad 114 is located on a third surface 146 of the base 140 adjacent to the first surface 142, and the third surface 146 is different from the second surface 144. The second pad 114 has a bonding surface 102, the bonding surface 102 of the second pad 114 is a surface of the second pad 114 parallel to and opposite to the first surface 142, the bonding surface 102 of the second pad 114 is used for bonding with the circuit board 20, and a side surface of the second pad 114 is adjacent to the bonding surface 102 of the second pad 114. The first recess 104 includes a groove at a side of the second land 114, and the groove extends to the bonding face 102 of the second land 114.

In some embodiments, the connecting portion 120 and the conductive portion 130 are located on the first surface 142 of the base 140, the pad 110 is located on a surface of the base 140 adjacent to the first surface 142, the pad 110 has a soldering surface 102, the soldering surface 102 of the pad 110 is a surface of the pad 110 parallel to and opposite to the first surface 142, and the soldering surface 102 of the pad 110 is used for soldering with the circuit board 20. The bonding surface 102 of the bonding pad 110 has a metal plating.

In some embodiments, the material of the metal plating layer includes at least one of gold, silver, and tin.

In some embodiments, the connecting portion 120 and the conductive portion 130 are located on the first surface 142 of the base 140, and the pad 110 is located on a surface of the base 140 adjacent to the first surface 142. The bonding pad 110 has a plurality of first recesses 104, and a distance between any two adjacent first recesses 104 in a radial direction of the bonding pad 110 is greater than or equal to a maximum length of each first recess 104 of the two first recesses 104 in the radial direction of the bonding pad 110. Wherein the direction parallel to the first surface 142 is a radial direction of the pad 110.

In some embodiments, a maximum length of the first recess 104 in a radial direction of the pad 110 is greater than or equal to 0.1 mm.

In some embodiments, the circuit board 20 includes a conductive wire 210 on the soldering surface 202 of the circuit board 20, the soldering surface 202 of the circuit board 20 is used for being soldered to the soldering land 110 of the connector holder 10 by a soldering material, and the conductive wire 210 is electrically connected to the first soldering land 112 of the soldering lands 110 when the soldering surface 202 of the circuit board 20 is soldered to the soldering land 110. The soldering surface 202 of the circuit board 20 has a second concave portion 204 at a position corresponding to the pad 110, and when the soldering surface 202 of the circuit board 20 is soldered to the pad 110, the second concave portion 204 is filled with a soldering material.

In some embodiments, the bonding pad 110 further includes a second bonding pad 114, and the ground line 220 of the circuit board 20 is electrically connected to the second bonding pad 114 when the bonding surface 202 of the circuit board 20 is bonded to the second bonding pad 114. The soldering surface 202 of the circuit board 20 has a second recess 204 at a position corresponding to the second pad 114, and when the soldering surface 202 of the circuit board 20 is soldered to the second pad 114, the solder material fills the second recess 204.

In some embodiments, the second pad 114 has a first recess 104, and when the second pad 114 is soldered to the soldering surface 202 of the circuit board 20, the solder material fills the first recess 104, and the position of the second recess 204 corresponds to the position of the first recess 104.

In some embodiments, the first pad 112 has a first recess 104, when the first pad 112 is soldered to the soldering surface 202 of the circuit board 20, the solder material fills the first recess 104, and the position of the second recess 204 corresponds to the position of the first recess 104.

In some embodiments, the second recess 204 is a blind or through hole located at the soldering face 202 of the circuit board 20.

Fig. 31 is a schematic longitudinal cross-sectional structure diagram of an electronic device 30 according to an embodiment of the present disclosure. As shown in fig. 31, in some embodiments, the electronic device 30 includes both the connection socket 10 in any one of the embodiments and the circuit board 20 in any one of the embodiments. Fig. 31 shows a cross-sectional structure of the electronic device 30 where a circuit board 20 and a connector holder 10 are soldered. Wherein the position of the first recess 104 in the pad 110 of the connecting socket 10 corresponds to the position of the second recess 204 in the soldering surface 202 of the circuit board 20. Here, the correspondence means that the first recess 104 and the second recess 204 overlap each other when viewed in the axial direction 106 of the combined body. In this way, after the solder material 30 is cured, the solder material 30 filling the first recessed portion 104 and the second recessed portion 204 can function as a two-way nail to fix the solder pad 110 and the circuit board 20, so as to enhance the welding strength between the connector holder 10 and the circuit board 20, and further reduce the possibility that the connector holder 10 welded on the circuit board 20 falls off.

In the embodiment of the present application, the connection socket 10 includes a pad 110, a connection portion 120, a conductive portion 130, and a base 140. The pad 110, the connection portion 120, and the conductive portion 130 are disposed on the base 140. The conductive part 130 is used to electrically connect with other connecting sockets 10. The connecting portion 120 is used for clamping with other connecting sockets 10. The pad 110 is used for soldering with the circuit board 20 by a soldering material. The pads 110 include a first pad 112 and a second pad 114. The first pads 112 may be electrically connected to the circuit board 20 when soldered to the circuit board 20. Thus, the two connecting sockets 10 can be engaged with each other through the connecting portion 120 and electrically connected through the conductive portion 130. When the circuit boards 20 are soldered to the first pads 112 of the two connector sockets 10, the two circuit boards 20 can be electrically connected through the first pads 112 of the two connector sockets 10 and the conductive parts 130. The pad 110 has a first recess 104, and when the pad 110 is soldered to the circuit board 20 by a solder material, the solder material fills the first recess 104. Thus, after the solder material is solidified, the solder material filling the first recess 104 can function as a nail for fixing the pad 110, so as to enhance the welding strength between the connector holder 10 and the circuit board 20, thereby reducing the possibility of the connector holder 10 welded on the circuit board 20 falling off.

The connection portion 120 may be a conductor and electrically connected to the second pad 114. The second land 114 is used for soldering with the circuit board 20 and is electrically connected to the ground line 220 of the circuit board 20. The connection part 120 may be disposed around the conductive part 130. Thus, when two connecting sockets 10 are respectively welded to a circuit board 20 and the two connecting sockets 10 are connected to each other in a clamping manner, the connecting portion 120 of the two connecting sockets 10 can shield the interference of external electromagnetic signals to the electrical signals transmitted in the conductive portions 130 of the two connecting sockets 10, and can also prevent the electrical signals transmitted in the conductive portions 130 of the two connecting sockets 10 from radiating electromagnetic signals outwards. The soldering surface 102 of the soldering land 110 may have gold, silver, or tin metal plating layers, which may increase the bonding force between the soldering land 110 and the soldering material, thereby enhancing the soldering strength between the connector socket 10 and the circuit board 20. The distance between two adjacent first recesses 104 in the radial direction of the pad 110 is greater than or equal to the maximum length of each first recess 104 in the radial direction of the pad 110. Thus, the soldering strength between the connector holder 10 and the circuit board 20 can be enhanced by filling the first recess 104 with the soldering material, and the area of the soldering surface 202 of the soldering land 110 for soldering with the circuit board 20 can be ensured, thereby reducing the possibility of the connector holder 10 soldered on the circuit board 20 falling off.

The circuit board 20 includes a lead 210 at the soldering face 202. The soldering face 202 of the circuit board 20 is used for soldering with the soldering land 110 of the connector holder 10 by a soldering material. When the bonding surface 202 of the circuit board 20 is bonded to the bonding pad 110, the wire 210 is electrically connected to the bonding pad 110. Thus, when the soldering surface 202 of the circuit board 20 is soldered to the soldering land 110, the conductive wire 210 on the circuit board 20 can be electrically connected to the conductive portion 130 of the connecting socket 10 through the soldering land 110. The soldering surface 202 of the circuit board 20 has a second concave portion 204, and when the soldering surface 202 of the circuit board 20 is soldered to the pad 110 by a solder material, the solder material fills the second concave portion 204. Thus, after the solder material is solidified, the solder material filling the second concave portion 204 can function as a nail driven into the circuit board 20 to fix the circuit board 20, thereby enhancing the welding strength between the connector holder 10 and the circuit board 20, and further reducing the possibility that the connector holder 10 welded on the circuit board 20 falls off.

The position of the first recess 104 in the pad 110 of the connector holder 10 corresponds to the position of the second recess 204 in the soldering face 202 of the circuit board 20. Thus, after the solder material 30 is cured, the solder material 30 filling the first and

second recesses

104 and 204 can function as a two-way nail for fixing the solder pad 110 and the circuit board 20, thereby enhancing the welding strength between the connector socket 10 and the circuit board 20 and further reducing the possibility of the connector socket 10 welded on the circuit board 20 falling off.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims

1. A connector receptacle, comprising: a pad, a connection portion, a conductive portion, and a base;

the bonding pad, the connecting part and the conductive part are all positioned on the surface of the base, the bonding pad comprises a first bonding pad, the first bonding pad is electrically connected with the conductive part, the conductive part is used for being electrically connected with other connecting seats, and the connecting part is used for being clamped with the other connecting seats;

the welding plate is used for welding with a circuit board through welding materials, the welding plate is provided with a first concave part, and when the welding plate is welded with the circuit board, the welding materials are filled in the first concave part;

the connecting part and the conductive part are positioned on a first surface of the base, and the pad is positioned on the surface of the base, which is adjacent to the first surface; the pad is provided with a plurality of first concave parts, and the distance between any two adjacent first concave parts in the radial direction of the pad is larger than or equal to the maximum length of each first concave part in the radial direction of the pad; wherein a direction parallel to the first surface is a radial direction of the pad.

2. The connector receptacle of claim 1, wherein the connecting portion and the conductive portion are located on a first surface of the base, and the first pad is located on a second surface of the base that is contiguous with the first surface; the first bonding pad is provided with a welding surface, the welding surface of the first bonding pad is a surface parallel to and opposite to the first surface of the first bonding pad, and the welding surface of the first bonding pad is used for welding with the circuit board;

the first depressed part includes a blind hole or a through hole located at the bonding face of the first pad.

3. The connector holder of claim 2, wherein the shape of the first recess on the bonding face of the first pad includes one or more of a circle, an ellipse, and a polygon.

4. The connector receptacle of claim 1, wherein the connecting portion and the conductive portion are located on a first surface of the base, and the first pad is located on a second surface of the base adjacent to the first surface; the first bonding pad is provided with a welding surface and a side surface, the welding surface of the first bonding pad is a surface parallel to and opposite to the first surface of the first bonding pad, the welding surface of the first bonding pad is used for welding the circuit board, and the side surface of the first bonding pad is adjacent to the welding surface of the first bonding pad;

the first recess portion includes a groove located on a side surface of the first pad, and the groove extends to a bonding surface of the first pad.

5. The connector receptacle of any of claims 1-4, wherein the pad further includes a second pad;

the connecting part and the conductive part are positioned on a first surface of the base, the first pad is positioned on a second surface, adjacent to the first surface, of the base, the second pad is positioned on a third surface, adjacent to the first surface, of the base, and the third surface is different from the second surface; the second bonding pad is provided with a welding surface, the welding surface of the second bonding pad is a surface parallel to and opposite to the first surface of the second bonding pad, and the welding surface of the second bonding pad is used for welding with the circuit board;

the first recess comprises a blind hole or a through hole located on the welding surface of the second welding pad.

6. The connector holder of claim 5, wherein the shape of the first recess on the bonding face of the second pad includes one or more of a circle, an ellipse, and a polygon.

7. The connector receptacle of any of claims 1-4, wherein the pad further includes a second pad;

the connecting part and the conductive part are positioned on a first surface of the base, the first pad is positioned on a second surface, adjacent to the first surface, of the base, the second pad is positioned on a third surface, adjacent to the first surface, of the base, and the third surface is different from the second surface; the second bonding pad is provided with a welding surface, the welding surface of the second bonding pad is a surface parallel to and opposite to the first surface of the second bonding pad, the welding surface of the second bonding pad is used for welding the circuit board, and the side surface of the second bonding pad is adjacent to the welding surface of the second bonding pad;

the first recess includes a groove located at a side of the second pad, and the groove extends to a bonding surface of the second pad.

8. The connector holder according to any one of claims 1 to 4, wherein the connecting portion and the conductive portion are located on a first surface of the base, the land is located on a surface of the base adjacent to the first surface, the land has a soldering surface, the soldering surface of the land is a surface of the land parallel to and opposite to the first surface, and the soldering surface of the land is used for soldering with the circuit board;

the welding surface of the welding pad is provided with a metal plating layer.

9. The connector receptacle of claim 8, wherein the metal plating comprises at least one of gold, silver, and tin.

10. The connector holder of claim 1, wherein a maximum length of the first recess in a radial direction of the land is greater than or equal to 0.1 mm.

11. A circuit board comprising a lead wire on a soldering surface of the circuit board for being soldered to the land of the connector holder according to any one of claims 1 to 10 by a solder material, the lead wire being electrically connected to a first one of the lands when the soldering surface of the circuit board is soldered to the land;

a second sunken part is arranged at a position, corresponding to the welding surface of the circuit board and the welding pad, of the welding surface of the circuit board, and when the welding surface of the circuit board is welded with the welding pad, the welding material is filled in the second sunken part;

the welding surface of the circuit board is provided with a second depressed part corresponding to the first welding pad, the first welding pad is provided with a first depressed part, the first welding pad is filled with welding materials when the welding surface of the circuit board is welded, and the position of the second depressed part corresponds to the position of the first depressed part.

12. The circuit board of claim 11, wherein the pads further comprise a second pad, and wherein when the bonding surface of the circuit board is bonded to the second pad, the ground trace of the circuit board is electrically connected to the second pad;

and a second sunken part is arranged at the position, corresponding to the second pad, of the welding surface of the circuit board, and the welding material is filled in the second sunken part when the welding surface of the circuit board is welded with the second pad.

13. The circuit board of claim 12, wherein the second pad has a first recess, and the solder material fills the first recess when the second pad is soldered to the soldering surface of the circuit board, and the second recess is located at a position corresponding to the first recess.

14. The circuit board according to any one of claims 11 to 13, wherein the second recess is a blind hole or a through hole at a soldering face of the circuit board.

15. The circuit board of claim 14, wherein the shape of the second recess on the soldering face of the circuit board comprises one or more of a circle, an ellipse, and a polygon.

16. The circuit board according to any one of claims 11 to 13, wherein a maximum length of the second recess portion in any direction of the soldering face of the circuit board is 0.1 mm or more.

17. An electronic device comprising a connection socket according to any one of claims 1 to 10, or/and a circuit board according to any one of claims 11 to 16.