CN114975506A - Back plate and preparation method thereof, backlight module, display panel and display terminal - Google Patents

Back plate and preparation method thereof, backlight module, display panel and display terminal Download PDF

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Publication number
CN114975506A
CN114975506A CN202210573695.7A CN202210573695A CN114975506A CN 114975506 A CN114975506 A CN 114975506A CN 202210573695 A CN202210573695 A CN 202210573695A CN 114975506 A CN114975506 A CN 114975506A
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flexible substrate
planarization layer
layer
thickness
planarization
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李娟�
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN202210573695.7A priority Critical patent/CN114975506A/en
Priority to PCT/CN2022/100214 priority patent/WO2023226121A1/en
Priority to US17/759,392 priority patent/US20240215391A1/en
Publication of CN114975506A publication Critical patent/CN114975506A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention provides a back plate and a preparation method thereof, a backlight module, a display panel and a display terminal, wherein the back plate comprises a flexible substrate, a planarization layer and a driving circuit layer; the surface roughness of one side of the planarization layer, which is close to the driving circuit layer, is smaller than that of one side of the flexible substrate, which is close to the planarization layer; according to the invention, the planarization layer is arranged between the flexible substrate and the drive circuit layer, so that the surface roughness of one side, close to the drive circuit layer, of the planarization layer is smaller than the surface roughness of one side, close to the planarization layer, of the flexible substrate, the offset of the protrusions on the flexible substrate and the flexible substrate is planarized, the influence of the protrusions on the drive circuit layer is reduced, the drive circuit layer can be deposited flatly, the risk that the metal conducting layer is punctured and broken is reduced, the reliability of the back plate is improved, and the display quality is improved; and the machine table does not need to be cleaned repeatedly, the manufacturing process is simple, and the added planarization layer can reduce the risk that the metal conducting layer is damaged when the bottom glass substrate is stripped.

Description

Back plate and preparation method thereof, backlight module, display panel and display terminal
Technical Field
The invention relates to the technical field of display, in particular to a back plate and a preparation method thereof, a backlight module, a display panel and a display terminal.
Background
The flexible backplane generally directly prepares the driving circuit layer on the glass substrate, and peels off the glass substrate after the transfer of the rear-end Light Emitting Diode (LED) is completed, so as to achieve the purpose of flexible display. However, since the glass substrate is difficult to be peeled off by directly depositing the metal conductive layer on the glass substrate, it is necessary to deposit the flexible substrate on the glass substrate and then deposit the metal conductive layer on the flexible substrate in order to facilitate the peeling of the glass substrate from the flexible substrate.
However, since the material of the flexible substrate is generally an organic polymer, there may be some residues with insufficient or incomplete reaction in the process of preparing the flexible substrate, and there are also a lot of dusts and particles in the air and on the machine equipment, resulting in a plurality of protrusions on the upper surface of the prepared flexible substrate. When a metal conducting layer is deposited on the flexible substrate subsequently, the metal conducting layer can climb at the position with the protrusion, and the metal conducting layer is easily pierced by the protrusion to cause wire breakage, bright and dark wires are caused, the lighting result is influenced, and the yield is reduced. If the method of cleaning the machine table is adopted to reduce dust and particles, not only is the machine time, manpower and materials of the flexible substrate wasted, but also the bulges cannot be completely cleaned, and the risk of wire breakage still exists. In addition, if only the flexible substrate is provided between the glass substrate and the driver circuit layer, the risk of damage to the metal conductive layer is high when the underlying glass substrate is peeled off. Therefore, it is necessary to improve this defect.
Disclosure of Invention
The embodiment of the invention provides a back plate, aiming at improving the yield of the back plate and reducing the cost.
The embodiment of the invention provides a backboard, which comprises a flexible substrate, a planarization layer and a driving circuit layer, wherein the flexible substrate is provided with a first end and a second end; the planarization layer is positioned on the flexible substrate; the driving circuit layer is positioned on the planarization layer; wherein the surface roughness of one side of the planarization layer close to the driving circuit layer is smaller than the surface roughness of one side of the flexible substrate close to the planarization layer.
In the backplane provided by the embodiment of the present invention, in a direction from the flexible substrate to the planarization layer, the thickness of the planarization layer is greater than or equal to half of the thickness of the flexible substrate and less than or equal to twice the thickness of the flexible substrate.
In the backplane provided by the embodiment of the present invention, the material of the planarization layer is an inorganic insulating material, and in a direction from the flexible substrate to the planarization layer, the thickness of the planarization layer is greater than or equal to the thickness of the flexible substrate and less than or equal to twice the thickness of the flexible substrate.
In the backplate provided by the embodiment of the present invention, the material of the planarization layer is any one of silicon nitride, silicon oxide, and silicon oxynitride.
In the backplane provided by the embodiment of the present invention, the material of the planarization layer is an organic insulating material, and in a direction from the flexible substrate to the planarization layer, the thickness of the planarization layer is greater than or equal to half of the thickness of the flexible substrate and less than the thickness of the flexible substrate.
In the backplane provided by the embodiment of the invention, the thickness of the planarization layer is greater than or equal to 10 micrometers and less than or equal to 20 micrometers in the direction from the flexible substrate to the planarization layer.
In the backplane provided by the embodiment of the present invention, the backplane further includes a plurality of light emitting devices located on the driving circuit layer, and the plurality of light emitting devices are electrically connected to the driving circuit layer.
In the backplane provided by the embodiment of the present invention, the backplane includes a bending region and non-bending regions located at two sides of the bending region, wherein an elastic modulus of the planarization layer located in the bending region is greater than an elastic modulus of the planarization layer located in the non-bending regions.
The embodiment of the invention provides a preparation method of a back plate, which comprises the following steps: preparing a flexible substrate on a glass substrate; preparing a planarization layer on the flexible substrate; preparing a driving circuit layer on the planarization layer, wherein the surface roughness of one side of the planarization layer close to the driving circuit layer is smaller than that of one side of the flexible substrate close to the planarization layer; and peeling the glass substrate from the flexible substrate.
The embodiment of the invention provides a backlight module, which comprises the backboard and an optical diaphragm group, wherein the optical diaphragm group is positioned at the light emergent side of the backboard.
The embodiment of the invention provides a display panel, which comprises the backboard and a protective layer, wherein the protective layer is positioned on the light emergent side of the backboard.
The embodiment of the invention also provides a display terminal which comprises a terminal main body and the display panel, wherein the terminal main body and the display panel are combined into a whole.
Has the advantages that: the embodiment of the invention provides a backboard, which comprises a flexible substrate, a planarization layer and a driving circuit layer, wherein the flexible substrate is provided with a first electrode and a second electrode; the planarization layer is positioned on the flexible substrate; the drive circuit layer is positioned on the planarization layer; the surface roughness of one side of the planarization layer, which is close to the driving circuit layer, is smaller than that of one side of the flexible substrate, which is close to the planarization layer; according to the invention, the planarization layer is arranged between the flexible substrate and the drive circuit layer, so that the surface roughness of one side, close to the drive circuit layer, of the planarization layer is smaller than the surface roughness of one side, close to the planarization layer, of the flexible substrate, the offset of the protrusions on the flexible substrate and the flexible substrate is planarized, the influence of the protrusions on the drive circuit layer is reduced, the drive circuit layer can be deposited flatly, the risk that the metal conducting layer is punctured and broken is reduced, the reliability of the back plate is improved, and the display quality is improved; and the machine table does not need to be cleaned repeatedly, the manufacturing process is simple, and the added planarization layer can reduce the risk that the metal conducting layer is damaged when the bottom glass substrate is stripped.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a top view of a back plate according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of the back plate of fig. 1 taken along the direction a-a'.
Fig. 3 is an enlarged view of a driving circuit layer according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a basic structure of another back plate according to an embodiment of the present invention.
Fig. 5 is a flowchart of a method for manufacturing a back plate according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a basic structure of a semi-finished product in a process flow of manufacturing a back plate according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. In the drawings, the size and thickness of components illustrated in the drawings are not to scale for clarity and ease of understanding and description.
As shown in fig. 1 and fig. 2, which are a top view of the backplate provided by the embodiment of the present invention and a cross-sectional view of the backplate in the direction a-a' in fig. 1, respectively, the backplate 100 includes a flexible substrate 10, a planarization layer 20, and a driving circuit layer 30; the planarization layer 20 is located on the flexible substrate 10; the driving circuit layer 30 is located on the planarization layer 20; wherein, the surface roughness of the side of the planarization layer 20 close to the driving circuit layer 30 is less than the surface roughness of the side of the flexible substrate 10 close to the planarization layer 20.
It can be understood that, in the prior art, a flexible substrate is generally prepared on a glass substrate, and a driving circuit layer is prepared on the flexible substrate, so as to peel the glass substrate from the flexible substrate, but because the material of the flexible substrate is generally an organic polymer, during the preparation process, some residues with insufficient reaction or incomplete reaction may exist, and meanwhile, a large amount of dust and particles also exist in the air and on a machine, so that a plurality of protrusions exist on the upper surface of the prepared flexible substrate, and when a metal conductive layer is subsequently deposited on the flexible substrate, the metal conductive layer will climb at the positions with the protrusions to break the wire; if the method of cleaning the machine table is adopted to reduce dust and particles, the protrusions cannot be completely cleaned, and in addition, if only the flexible substrate is arranged between the glass substrate and the driving circuit layer, the damage risk of the metal conducting layer is higher when the bottom glass substrate is stripped.
According to the invention, by adding the planarization layer 20 between the flexible substrate 10 and the driving circuit layer 30, the added planarization layer 20 can cover the protrusions 40 on the flexible substrate 10, so that a flat substrate is provided for the deposition of the metal conductive layer, the possibility of the metal conductive layer being pierced can be reduced, and particularly, a process station which needs to apply pressure on a plane at a later stage; the added planarization layer 20 can also reduce the probability of climbing at the position of the protrusion 40 of the metal conductive layer, reduce the risk of line breaking due to climbing, reduce the dark lines caused by line breaking, and improve the display quality; the added flattening layer 20 can cover the bulge 40, so that the problems caused by flattening treatment can be reduced without cleaning a machine table, and the waste of manpower and material resources caused by cleaning the machine table is avoided; the process of the back plate preparation process has a plurality of stations, the film layer is easy to damage, the planarization layer 20 is added, the total film layer thickness of the back plate 100 can be increased, and the film layer damage caused by bad operations (such as bending stress, sharp scratch and the like) in the operation process is reduced.
In one embodiment, the thickness d2 of the planarization layer 20 is greater than or equal to half the thickness d3 of the flexible substrate 10 and less than or equal to twice the thickness d3 of the flexible substrate 10 in the direction from the flexible substrate 10 to the planarization layer 20.
It should be noted that the material of the planarization layer 20 is an insulating material, which may be an inorganic insulating material, or an organic insulating material, wherein the planarization effect of the organic insulating material is better than that of the inorganic insulating material, and therefore, if the planarization layer 20 is made of an organic insulating material, the thickness of the organic insulating material may be set to be thinner than that of the flexible substrate 10; if the planarization layer 20 is made of an inorganic insulating material, the thickness of the inorganic insulating material may be set to be thicker than the flexible substrate 10.
In one embodiment, the material of the planarization layer 20 is an inorganic insulating material, and the thickness d2 of the planarization layer 20 is greater than or equal to the thickness d3 of the flexible substrate 10 and less than or equal to twice the thickness d3 of the flexible substrate 10 in the direction from the flexible substrate 10 to the planarization layer 20.
In the embodiment, the planarization layer 20 is made of an inorganic insulating material, so that the influence of the acidic etching solution on the planarization layer 20 can be reduced; meanwhile, the thickness of the inorganic insulating material is set to be greater than or equal to the thickness d3 of the flexible substrate 10 and less than or equal to twice the thickness d3 of the flexible substrate 10, so that the effectiveness and stability of the inorganic insulating material can be improved, and the planarization effect is better.
In one embodiment, the material of the planarization layer 20 is any one of silicon nitride, silicon oxide, and silicon oxynitride.
In one embodiment, the material of the planarization layer 20 is an organic insulating material, and the thickness d2 of the planarization layer 20 is greater than or equal to half of the thickness d3 of the flexible substrate 10 and less than the thickness d3 of the flexible substrate 10 in the direction from the flexible substrate 10 to the planarization layer 20.
It can be understood that, in the embodiment, by using the organic insulating material for the planarization layer 20, the planarization effect of the organic insulating material is better, so that the thickness of the organic insulating material can be set to be greater than or equal to half of the thickness d3 of the flexible substrate 10 and less than the thickness d3 of the flexible substrate 10, which not only can planarize the protrusions 40 on the flexible substrate 10, but also the organic insulating material has better flexibility and is easy to bend, so as not to increase the overall thickness of the backplate 100 too much.
In one embodiment, the thickness d2 of the planarization layer 20 is greater than or equal to 10 microns and less than or equal to 20 microns in the direction from the flexible substrate 10 to the planarization layer 20. Specifically, when the flexible substrate 10 has a plurality of protrusions 40 on the side close to the planarization layer 20, the safety distance d1 from the side surface of the planarization layer 20 close to the driving circuit layer 30 to the side surface of the protrusion 40 away from the flexible substrate 10 is smaller than the thickness d2 of the planarization layer 20 in the direction from the flexible substrate 10 to the planarization layer 20.
It is understood that the protrusions 40 are residues with insufficient or incomplete reaction in the process of preparing the flexible substrate 10, or dust and particles falling from air and machine equipment, and the method of cleaning the machine cannot completely remove the residues and wastes machine time, labor and materials. According to the invention, the planarization layer 20 is arranged on the flexible substrate 10, and the safety distance d1 is arranged between the upper surface of the planarization layer 20 and the highest point of the protrusion 40, so that the protrusion 40 cannot pierce through the planarization layer 20, the driving circuit layer 30 on the planarization layer 20 is not affected, the metal conductive layer in the driving circuit layer 30 is not caused to climb and break, and the stability of the back plate 100 is increased.
In one embodiment, the rear panel 100 further includes a plurality of light emitting devices 50 on the driving circuit layer 30, and the plurality of light emitting devices 50 are electrically connected to the driving circuit layer 30.
In an embodiment, the back plate 100 is a back plate of a backlight module, the light emitting devices 50 are backlight sources, and all the backlight sources are blue light emitting diodes, or the backlight sources are a plurality of red light emitting diodes, a plurality of green light emitting diodes, and a plurality of blue light emitting diodes.
In one embodiment, the back plate 100 is a back plate of an organic light emitting diode display panel, and the light emitting device 50 is an organic light emitting layer, wherein the organic light emitting layer is electrically connected to the driving circuit layer 30 through an anode (not shown).
In one embodiment, the backplane 100 is a backplane of a micro-led display panel, and the light emitting devices 50 are micro-leds or mini-leds.
In an embodiment, please refer to fig. 3, which is an enlarged view of a driving circuit layer according to an embodiment of the present invention, where fig. 3 illustrates a light emitting device 50 as a micro light emitting diode, where the driving circuit layer 30 includes a plurality of thin film transistors 31 on a planarization layer 20, only one thin film transistor 31 is illustrated in fig. 3, and the thin film transistor 31 includes a gate layer 311, a gate insulating layer 312, an active layer 313, an interlayer insulating layer 314, a source 315, and a drain 316; the backplane also includes a power supply line 317 and a passivation layer 318.
The gate layer 311 is located on the planarization layer 20, the gate insulating layer 312 covers the gate layer 311, the active layer 313 is located on the gate insulating layer 312, the interlayer insulating layer 314 covers the active layer 313, the source 315 and the drain 316 are located on the interlayer insulating layer 314, and the source 315 and the drain 316 are electrically connected to two ends of the active layer 313 through via holes in the interlayer insulating layer 314, respectively.
The power line 317 is disposed at the same layer as the source 315 and the drain 316, and the light emitting device 50 is electrically connected to the drain 316 and the power line 317 through a via hole on the passivation layer 318.
Next, referring to fig. 4, a basic structure diagram of another back plate according to an embodiment of the present invention is shown, where the back plate 100 includes a flexible substrate 10, a planarization layer 20, and a driving circuit layer 30; the planarization layer 20 is located on the flexible substrate 10; the driving circuit layer 30 is located on the planarization layer 20; wherein, the surface roughness of the side of the planarization layer 20 close to the driving circuit layer 30 is less than the surface roughness of the side of the flexible substrate 10 close to the planarization layer 20.
In the present embodiment, the back plate 100 includes a bending region a1 and a non-bending region a2 located at two sides of the bending region a1, wherein the elastic modulus of the planarization layer 20 located at the bending region a1 is greater than the elastic modulus of the planarization layer 20 located at the non-bending region a 2.
The larger the elastic modulus, the less likely the material is to deform, and the stronger the rigidity and the greater the hardness. From a macroscopic perspective, the modulus of elasticity is a measure of the amount of resistance of an object to elastic deformation.
It can be understood that, in the present embodiment, by setting the elastic modulus of the planarization layer 20 located in the bending region a1 to be greater than the elastic modulus of the planarization layer 20 located in the non-bending region a2, that is, the deformation resistance of the planarization layer 20 in the bending region a1 is greater than the deformation resistance of the planarization layer 20 in the non-bending region a2, the present embodiment reduces the deformation degree of the planarization layer 20 in the bending region a1 by enhancing the deformation resistance of the planarization layer 20 in the bending region a1, and avoids the protrusions 40 located in the bending region a1 from piercing the planarization layer 20 during the bending process, thereby causing the disconnection of the driving circuit layer 30.
Next, referring to fig. 5, a flowchart of a method for manufacturing a backplane according to an embodiment of the present invention is shown, where the method for manufacturing a backplane includes:
s1, preparing a flexible substrate on the glass substrate;
s2, preparing a planarization layer on the flexible substrate;
s3, preparing a driving circuit layer on the planarization layer, wherein the surface roughness of one side, close to the driving circuit layer, of the planarization layer is smaller than that of one side, close to the planarization layer, of the flexible substrate;
and S4, peeling the glass substrate from the flexible substrate.
The flexible substrate is planarized and then the driving circuit layer is deposited, so that the possibility that a metal conductive layer in the driving circuit layer is punctured can be reduced, and particularly, a process station which needs to apply pressure on a plane at the later stage is provided; the planarization layer can also reduce the probability of climbing at the position of the protrusion of the metal conductive layer on the flexible substrate, reduce the risk of wire breakage due to climbing, reduce the hidden wire caused by wire breakage and improve the display quality; the planarization layer can cover the bulges, so that the problems caused by the planarization treatment can be reduced without cleaning a machine table, and the waste of manpower and material resources caused by cleaning the machine table is avoided; the back plate preparation process has multiple flow stations, the film layer is easy to damage, the increase of the planarization layer can increase the total film layer thickness of the back plate, and the film layer damage caused by bad operations such as bending stress, sharp instrument scratch and the like in the operation process is reduced.
Next, referring to fig. 6, which is a schematic diagram of a basic structure of a semi-finished product in a process flow of manufacturing a backplane according to an embodiment of the present invention, in the process flow, a flexible substrate 10, a planarization layer 20, a driving circuit layer 30, and a light emitting device 50 need to be formed on a glass substrate 11 first, and after the light emitting device 50 is manufactured, the glass substrate 11 is peeled off from the flexible substrate 10 to obtain the flexible backplane.
The embodiment of the invention provides a backlight module, which comprises the backboard and an optical diaphragm group, wherein the optical diaphragm group is positioned at the light emergent side of the backboard. Please refer to fig. 1 to 6 and related descriptions, which are not repeated herein, wherein the optical diaphragm set includes at least one optical diaphragm, and the optical diaphragm includes a diffusion film and a brightness enhancement film. It can be understood that the back plate provided by the embodiment of the invention can be a back plate of a backlight module.
The embodiment of the invention provides a display panel, which comprises the backboard and a protective layer, wherein the protective layer is positioned on the light emergent side of the backboard. Please refer to fig. 1 to 6 and related descriptions, which are not repeated herein, and the protection layer is used to protect the light emitting device on the backplane. It can be understood that the backplane provided by the embodiment of the present invention may be a backplane of a display panel.
The embodiment of the invention also provides a display terminal which comprises a terminal main body and the display panel, wherein the terminal main body and the display panel are combined into a whole. The display terminal provided by the embodiment of the invention can be as follows: products or components with display functions such as mobile phones, tablet computers, notebook computers, televisions, digital cameras, navigators and the like.
In summary, the backplate provided in the embodiments of the present invention includes a flexible substrate, a planarization layer, and a driving circuit layer; the planarization layer is positioned on the flexible substrate; the drive circuit layer is positioned on the planarization layer; the surface roughness of one side of the planarization layer, which is close to the driving circuit layer, is smaller than the surface roughness of one side of the flexible substrate, which is close to the planarization layer; according to the invention, the planarization layer is arranged between the flexible substrate and the drive circuit layer, so that the surface roughness of one side, close to the drive circuit layer, of the planarization layer is smaller than the surface roughness of one side, close to the planarization layer, of the flexible substrate, the offset of the protrusions on the flexible substrate and the flexible substrate is planarized, the influence of the protrusions on the drive circuit layer is reduced, the drive circuit layer can be deposited flatly, the risk that the metal conducting layer is punctured and broken is reduced, the reliability of the back plate is improved, and the display quality is improved; the risk that the metal conducting layer is damaged when the bottom glass substrate is stripped can be reduced by the added planarization layer, and the problem that the metal conducting layer is easily pierced to cause climbing and wire breaking because a plurality of bulges are arranged on the flexible substrate of the back plate in the prior art is solved; if the cleaning machine is adopted to reduce the convex objects, not only is the machine time, labor and materials wasted, but also the cleaning cannot be realized; and the technical problem that the damage risk of the metal conducting layer is higher when the bottom glass substrate is stripped.
The backplane, the preparation method thereof, the backlight module, the display panel and the display terminal provided by the embodiment of the invention are described in detail above. It should be understood that the exemplary embodiments described herein should be considered merely illustrative for facilitating understanding of the method of the present invention and its core ideas, and not restrictive.

Claims (12)

1. A backing sheet, comprising:
a flexible substrate;
a planarization layer on the flexible substrate;
a driving circuit layer on the planarization layer;
wherein, the surface roughness of one side of the planarization layer close to the driving circuit layer is smaller than that of one side of the flexible substrate close to the planarization layer.
2. The backplane of claim 1, wherein a thickness of the planarization layer is greater than or equal to half a thickness of the flexible substrate and less than or equal to twice the thickness of the flexible substrate in a direction from the flexible substrate to the planarization layer.
3. The backplate of claim 2, wherein the material of the planarization layer is an inorganic insulating material, and the thickness of the planarization layer is greater than or equal to the thickness of the flexible substrate and less than or equal to twice the thickness of the flexible substrate in the direction from the flexible substrate to the planarization layer.
4. The backplate of claim 3, wherein the material of the planarization layer is any one of silicon nitride, silicon oxide, and silicon oxynitride.
5. The backplate of claim 2, wherein the material of the planarization layer is an organic insulating material, and the thickness of the planarization layer is greater than or equal to half the thickness of the flexible substrate and less than the thickness of the flexible substrate in the direction from the flexible substrate to the planarization layer.
6. The backplane of claim 2, wherein a thickness of the planarization layer in a direction from the flexible substrate to the planarization layer is greater than or equal to 10 microns and less than or equal to 20 microns.
7. The backplane of claim 1, further comprising a plurality of light emitting devices on the driver circuit layer, the plurality of light emitting devices electrically connected to the driver circuit layer.
8. The backplate of claim 1, wherein the backplate comprises a buckled region and non-buckled regions on both sides of the buckled region, wherein the modulus of elasticity of the planarization layer in the buckled region is greater than the modulus of elasticity of the planarization layer in the non-buckled regions.
9. A method of making a backsheet, comprising:
preparing a flexible substrate on a glass substrate;
preparing a planarization layer on the flexible substrate;
preparing a driving circuit layer on the planarization layer, wherein the surface roughness of one side of the planarization layer close to the driving circuit layer is smaller than that of one side of the flexible substrate close to the planarization layer;
and peeling the glass substrate from the flexible substrate.
10. A backlight module comprising the back plate of any one of claims 1 to 8 and an optical film set, wherein the optical film set is located at the light-emitting side of the back plate.
11. A display panel comprising the backsheet according to any one of claims 1 to 8 and a protective layer on the light exit side of the backsheet.
12. A display terminal comprising a terminal body and the display panel according to claim 11, the terminal body being integrated with the display panel.
CN202210573695.7A 2022-05-24 2022-05-24 Back plate and preparation method thereof, backlight module, display panel and display terminal Pending CN114975506A (en)

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KR20160135804A (en) * 2014-03-24 2016-11-28 파이오니아 가부시키가이샤 Light-emitting device and production method for light-emitting device
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CN110071230B (en) * 2019-05-30 2020-08-11 武汉华星光电半导体显示技术有限公司 Flexible substrate, manufacturing method thereof and display panel
CN110518118B (en) * 2019-08-08 2021-05-28 武汉华星光电半导体显示技术有限公司 Display panel and manufacturing method thereof
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