CN114975222A - Chuck device of cleaning equipment and cleaning equipment - Google Patents
Chuck device of cleaning equipment and cleaning equipment Download PDFInfo
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- CN114975222A CN114975222A CN202210757438.9A CN202210757438A CN114975222A CN 114975222 A CN114975222 A CN 114975222A CN 202210757438 A CN202210757438 A CN 202210757438A CN 114975222 A CN114975222 A CN 114975222A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a chuck device of cleaning equipment and the cleaning equipment, wherein the chuck device comprises: the chuck comprises a chuck body, a nozzle, an air supply pipeline and a mounting assembly; the bottom of the chuck main body is provided with a mounting hole, and the nozzle is arranged in the mounting hole and is not connected with the chuck main body; a second gas channel for conveying gas to the first gas channel is formed in the nozzle; the mounting assembly for mounting the nozzle comprises a through pipe in which the air supply line is arranged; an annular slit is formed between the outer peripheral surface of the straight-through pipe and the inner peripheral surface of the mounting hole; a third gas channel is also formed in the nozzle, and a gas inlet of the third gas channel is communicated with the gas supply pipeline; the gas outlet of the third gas channel faces the side departing from the bearing surface and is arranged corresponding to the top end of the annular slit and used for ventilating the annular slit to prevent suck-back by utilizing downward gas flow, so that the gas blown to the surface of the wafer is prevented from carrying tiny particles, and the yield of the wafer is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductor process equipment, in particular to a chuck and cleaning equipment applying the chuck.
Background
In the semiconductor manufacturing process, a back cleaning process is usually required to remove the redundant materials such as the photoresist and the like attached to the back and the side of the wafer, so that the overall cleanliness of the wafer is ensured, and the precision of the subsequent process is ensured. Currently, the back side cleaning process employs a back side cleaning machine that typically includes a bernoulli chuck. The front surface of the wafer faces the chuck, the cleaning equipment is used for cleaning the back surface of the wafer, the front surface of the wafer is generally the surface which is subjected to the previous process or is used as the surface to be processed of the subsequent process, and the Bernoulli chuck can blow air to the surface of the wafer placed on the wafer, so that high-speed air flow is formed between the wafer and the Bernoulli chuck, and the wafer can be limited and fixed through a clamping piece on the chuck. According to the bernoulli effect principle: when the fluid speed is increased, the pressure on the contact interface of the object and the fluid is reduced, so that the wafer can be clamped by the Bernoulli chuck, and a certain distance can be kept between the wafer and the Bernoulli chuck, namely, the wafer is suspended above the Bernoulli chuck, and the front surface of the wafer is prevented from being scratched.
However, in the conventional bernoulli chuck, fine particles are inevitably carried in the gas flow delivered to the nozzle, and when the bernoulli chuck blows the front surface of the wafer directly, the fine particles remain on the surface of the wafer, and the surface of the wafer is damaged, which affects the yield of the wafer.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a chuck device of a cleaning device and the cleaning device, which can prevent gas blown to the surface of a wafer from carrying micro particles, thereby ensuring the yield of the wafer.
The chuck device of the cleaning equipment comprises a chuck body, a first clamping device and a second clamping device, wherein the chuck body is provided with a bearing surface for bearing a wafer; a first gas channel is formed in the chuck body, and a gas outlet of the first gas channel is formed in the bearing surface and used for ventilating the wafer. The chuck assembly further includes: a nozzle, an air supply line and a mounting assembly; wherein the content of the first and second substances,
the chuck body is internally provided with a mounting hole, and the nozzle is arranged in the mounting hole and is not connected with the chuck body; a second gas channel is formed in the nozzle, a gas outlet of the second gas channel is communicated with a gas inlet of the first gas channel, and a gas inlet of the second gas channel is communicated with the gas supply pipeline so as to convey gas to the first gas channel;
the mounting assembly is used for mounting the nozzle in the mounting hole; the mounting assembly comprises a straight-through pipe, the top end of the straight-through pipe is connected with the nozzle and is positioned in the mounting hole, and the air supply pipeline is positioned in the straight-through pipe; an annular slit is formed between the outer peripheral surface of the straight-through pipe and the inner peripheral surface of the mounting hole;
a third gas channel is further formed in the nozzle, and a gas inlet of the third gas channel is communicated with the gas supply pipeline; the gas outlet of the third gas channel faces to one side departing from the bearing surface and is arranged corresponding to the top end of the annular slit and used for ventilating the annular slit.
Optionally, the gas inlet of the third gas channel is communicated with the second gas channel, and the gas outlet of the third gas channel is lower than the gas inlet.
Optionally, the second gas channel comprises a plurality of second sub-channels extending in an oblique direction; the air inlets of the second sub-channels are communicated with the air supply pipeline, and the air outlets of the second sub-channels are uniformly distributed on the upper surface of the nozzle;
the third gas channel comprises third sub-channels which are arranged in one-to-one correspondence with the second sub-channels; and the air inlet of each third sub-channel is communicated with the corresponding second sub-channel.
Optionally, an included angle between the axis of the third sub-channel and the vertical direction ranges from 40 ° to 50 °, and the aperture range of the third sub-channel ranges from 1mm to 2 mm.
Optionally, the chuck further comprises a drive assembly; the driving assembly is provided with an annular power output end;
the power output end is connected with the chuck body through the mounting assembly and used for driving the chuck body to rotate; the power output end is arranged around the through pipe and is not connected with the through pipe, so that the through pipe and the nozzle do not rotate along with the chuck body.
Optionally, the mounting assembly further comprises a sealing member and a bearing member; the sealing component is respectively connected with the chuck main body and the power output end in a sealing way; the sealing component is arranged around the straight-through pipe;
the bearing member is positioned between the through pipe and the power output end and is connected with the through pipe, the sealing member and the power output end respectively so that the sealing member and the power output end can rotate relative to the through pipe.
Optionally, the sealing component comprises a first sealing element and a second sealing element, the first sealing element and the second sealing element are respectively connected with the top end and the bottom end of the power output end in a sealing manner, and the first sealing element is connected with the chuck main body in a sealing manner;
the bearing component comprises a first bearing and a second bearing, and the first bearing and the second bearing are respectively arranged corresponding to the first sealing element and the second sealing element.
Optionally, at least one first vent hole is formed in the side surface of the straight-through pipe, and the first vent hole and the second vent hole are both located between the first sealing element and the second sealing element;
the bottom of the straight-through pipe is provided with at least one second vent hole communicated with the atmospheric environment.
Optionally, the first sealing element is arranged on the inner circumferential surface of the first sealing element and/or
The position of the peripheral surface of the straight-through pipe opposite to the inner peripheral surface of the mounting hole and/or
And a labyrinth structure is arranged on the peripheral surface of the nozzle.
Optionally, the labyrinth structure includes an annular groove and an annular protrusion, and the annular groove and the annular protrusion are arranged in a direction parallel to the axis of the through pipe and are alternately arranged.
As another technical solution, an embodiment of the present invention further provides a cleaning apparatus, which includes the chuck device according to any of the above embodiments.
The invention has the following beneficial effects:
the invention provides a chuck device of cleaning equipment, which comprises a chuck main body, a nozzle and an air supply pipeline. The wafer bearing device comprises a chuck body, a nozzle, a first gas channel, a second gas channel and a gas supply pipeline, wherein the nozzle is internally provided with the second gas channel which is respectively communicated with the first gas channel and the gas supply pipeline in the chuck body, so that gas sequentially flows through the gas supply pipeline, the nozzle and the first gas channel and is finally blown to the surface of a wafer, and the wafer is suspended above a bearing surface by utilizing the Bernoulli effect generated by gas flow between the wafer and the chuck body.
The third gas channel is arranged in the nozzle, a gas inlet of the third gas channel is communicated with a gas outlet of the gas supply pipeline, the gas outlet of the third gas channel faces towards the annular slit between the outer peripheral surface of the straight-through pipe and the inner peripheral surface of the mounting hole, so that the gas can be ventilated to the annular slit, the downward gas flow is utilized to block the gas which flows out from the annular slit and carries the micro particles from entering the gas channel in the chuck body, the contact between the micro particles and the surface of the wafer is avoided, and the wafer yield is ensured.
Drawings
FIG. 1 is a schematic diagram of a prior art Bernoulli chuck;
FIG. 2 is a schematic structural diagram of a chuck device of a cleaning apparatus according to an embodiment of the present invention;
FIG. 3 is an enlarged partial view of a chuck assembly according to an embodiment of the present invention;
FIG. 4 is an enlarged partial view of another embodiment of the chuck assembly according to the present invention;
FIG. 5 is a cross-sectional view and a perspective view of a nozzle in a chuck device according to an embodiment of the present invention;
fig. 6 is a sectional view and a perspective view of a through pipe in the chuck apparatus according to the embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the chuck device of the cleaning apparatus and the cleaning apparatus using the same provided by the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, the bernoulli chuck apparatus employed in the conventional back side cleaning apparatus generally comprises: the chuck device comprises a chuck device main body 01 for bearing a wafer, a Bernoulli air supply pipe 02, Bernoulli nozzles 04, screws 03, a through pipe 05, an adapter shaft 06 and a motor 07. The bernoulli gas supply pipe 02 is communicated with the bernoulli nozzles 04 and is used for supplying gas to the bernoulli nozzles 04 so as to blow gas to the surface of the wafer placed on the chuck main body 01 through the inner cavity of the chuck main body 01 of the bernoulli nozzles 04, and the wafer is suspended by the bernoulli effect generated by the gas flow between the wafer and the chuck main body 01. The chuck main body 01 is fixedly connected with the adapter shaft 06 through a screw 03, and the motor 07 is connected with the adapter shaft 06; the straight-through pipe 05 is connected with the adapter shaft 06 through a bearing, so that when the motor 07 drives the adapter shaft 06 to drive the chuck main body 01 to rotate, the straight-through pipe 05 cannot rotate along with the adapter shaft, and accordingly, the Bernoulli nozzle 04 connected with the straight-through pipe 05 cannot rotate along with the adapter shaft.
As described above, since neither the bernoulli nozzle 04 nor the through pipe 05 rotates with the chuck body 01, there is a gap between the outer peripheral surfaces of the bernoulli nozzle 04 and the through pipe 05 and the corresponding surfaces of the chuck body 01 to avoid severe friction with the outer peripheral surfaces of the bernoulli nozzle 04 and the through pipe 05 when the chuck body 01 rotates relative to the bernoulli nozzle 04 and the through pipe 05; similarly, a gap is formed between the outer peripheral surface of the straight-through pipe 05 and the adapting shaft 06 and the motor 07, and is communicated with the gap; also, as shown in fig. 1, the two slits communicate with the internal cavity of the chuck body 01. However, when the bernoulli nozzle 04 supplies gas to the cavity inside the chuck body 01, the flow inside the cavity inside the chuck body 01 also generates the bernoulli effect, so that the cavity inside the chuck body 01 will generate a certain suction force to the communicated gap, and the gas in the gap is pumped out to the cavity inside the chuck body 01, and further the gas in the gap carries a certain amount of fine particles into the cavity inside the chuck body 01, and then blows the fine particles to the surface of the wafer, so that the fine particles remain on the surface of the wafer, and the yield of the wafer is affected.
Referring to fig. 2, to solve the above technical problems, the present embodiment provides a chuck apparatus for a cleaning device, which also includes a chuck body 1, wherein the chuck body 1 has a carrying surface for carrying a wafer; the chuck body 1 is internally provided with a first gas channel 11, and a gas outlet of the first gas channel 11 is arranged on the bearing surface and used for blowing gas to the wafer so as to enable the wafer to be suspended on the bearing surface after the gas flow exists between the wafer and the chuck body 1. Specifically, as shown in fig. 2, the chuck body 1 includes a base 13, a base 14 provided on the base 13, and a cover plate 15 provided on the base 14; wherein, the upper surface of the cover plate 15 is used as the bearing surface; the first gas channel 11 is formed between the surfaces of the cover plate 15 opposite to the base 14, so that the shape of the first gas channel 11 depends on the shape of the lower surface of the cover plate 15 and the shape of the upper surface of the base, such as the chuck body shown in fig. 2, wherein the first gas channel 11 is substantially in the shape of a disk bent upward at the edge; as also shown in fig. 2, the air outlets of the first gas channels 11 are located in the edge region of the carrying surface.
The chuck device provided by the embodiment further comprises: a nozzle 2, an air supply line 3 and a mounting assembly; as shown in fig. 2, a mounting hole 12 is provided in the chuck body 1, and the nozzle 2 is provided in the mounting hole 12 and is not connected to the chuck body 1. Specifically, as shown in fig. 2, the opening of the mounting hole 12 is located at the bottom of the chuck body 1 and at the central region of the chuck body 1. The mounting assembly is disposed around the air supply line 3 and the nozzle 2 and is connected to the nozzle 2 and the chuck body 1, respectively, for mounting the nozzle in the mounting hole 12.
The mounting assembly comprises a straight-through pipe 5 arranged around the air supply pipeline 3 and the nozzle 2, and the top end of the straight-through pipe 5 is connected with the nozzle and is positioned in the mounting hole 12 so as to fix the nozzle 2 and protect the air supply pipeline 3; in order to realize that the nozzle is positioned in the mounting hole 12 and is not connected and fixed with the chuck body 1, the through pipe 5 is also connected and fixed with a non-mounting hole, and an annular slit is formed between the outer circumferential surface of the through pipe 5 and the inner circumferential surface of the mounting hole 12.
As shown in fig. 3, a second gas channel 21 is opened inside the nozzle 2, the gas outlet of the second gas channel 21 is communicated with the gas inlet of the first gas channel 11 in the chuck body 1, and a gap exists between the top surface of the nozzle 2 and the bottom surface of the cover plate 15 to communicate with the first gas channel 11; the gas inlet of the second gas passage 21 communicates with the gas supply line 3 to supply gas to the first gas passage 11.
As shown in fig. 3, a third gas passage 22 is further opened inside the nozzle 2, and a gas inlet of the third gas passage 22 is communicated with the gas supply pipeline 3. The air outlet of the third air channel 22 faces to the side away from the bearing surface so as to convey the air flow downwards in an outward direction; and is provided corresponding to the top end of the annular slit to convey downward airflow into the annular slit. Thereby can block the air current of the upflow from this annular slit, and then avoided the gas in this annular slit to carry the tiny particle to get into the first gas channel 11 in chuck main part 1, thereby can greatly reduced tiny particle remains the risk on wafer surface, guarantee the yield of wafer.
It should be noted that "disposed corresponding to the top end of the annular slit" in the above is not limited to that the air outlet of the third air channel 22 exactly faces the top end of the annular slit, and the air outlet is disposed in a manner that the air flow output from the air outlet of the third air channel 22 can pass through the annular slit. Taking the chuck device as an example as shown in fig. 4, the outlet of the third gas passage 22 is arranged toward the inner circumferential surface of the mounting hole 12, so that the obliquely downward gas flow continues to flow downward after colliding with the inner circumferential surface of the mounting hole 12, and flows into the annular slit.
In some embodiments, the gas inlet of the third gas channel 22 is communicated with the second gas channel 21, and the gas outlet of the third gas channel 22 is lower than the gas inlet, i.e. the third gas channel 22 is inclined downwards to direct the gas flow inside the third gas channel 22 obliquely downwards.
In some embodiments, as shown in fig. 5, the second gas passage 21 includes a plurality of second sub-passages extending in an oblique direction; the air inlets of the plurality of second sub-channels are communicated with the air supply pipeline 3, and the air outlets of the plurality of second sub-channels are uniformly distributed on the upper surface of the nozzle 2; in some preferred embodiments, as shown in FIG. 5, the second gas channel 21 further comprises a central sub-channel disposed coaxially with the nozzle; the air inlet of the second air channel 21 is arranged at the bottom of the nozzle and is communicated with the air supply pipeline 3; the air inlets of the plurality of second sub-channels converge at the air outlet of the central sub-channel and are communicated with the air outlet of the central sub-channel.
The third gas passage 22 includes third sub-passages provided in one-to-one correspondence with each of the above-described second sub-passages; and the air inlet of each third sub-channel is communicated with the corresponding second sub-channel. Taking the nozzle shown in fig. 5 as an example, the third sub-passage is connected to the middle of the second sub-passage so as to be divided into an obliquely upward flow and an obliquely downward flow when the flows reach the connection.
In some preferred embodiments, the angle between the axis of the third sub-channel and the vertical direction is in the range of 40 ° to 50 °, and the aperture of the third sub-channel is in the range of 1mm to 2 mm.
In some preferred embodiments, as shown in fig. 5, the nozzle 2 includes a substantially cylindrical gas injection portion 23 and a connecting portion 24, the gas injection portion 23 having an outer diameter larger than that of the connecting portion 24; the inner peripheral surface of the through pipe 5 surrounds the connection portion 24, and the top surface of the through pipe 5 abuts against the bottom surface of the gas ejection portion 23 to provide a supporting force for the nozzle 2 in the axial direction and to be sealingly connected with the nozzle 2 in the circumferential direction. On this basis, it is preferable that, as shown in fig. 3 and 5, since the outer edge of the bottom surface of the gas ejecting section 23 is directed to the boundary between the through pipe 5 and the inner peripheral surface of the mounting hole 12 after the nozzle 2 is fitted to the through pipe 5, the gas outlet of the third gas passage 22 is opened at the outer edge of the bottom surface of the gas ejecting section 23 to just allow the gas flow to flow into the annular slit between the through pipe and the mounting hole 12.
In some embodiments, as shown in fig. 2, the chuck assembly further comprises a drive assembly 4, the drive assembly 4 having an annular power output 41. The power take-off 41 is connected to the chuck body by a mounting assembly for driving the chuck body to rotate. The power take-off 41 is arranged around the through pipe 5 but is not connected to the through pipe 5 so that the through pipe 5 and the nozzle 2 do not follow the rotation of the chuck body 1.
In some embodiments, the mounting assembly further comprises a sealing member 6 and a bearing member 7; wherein, the sealing component is respectively connected with the chuck body 1 and the power output end 41 in a sealing way; the sealing member is arranged around the through pipe 5; the bearing member 7 is located between the through pipe 5 and the power take-off 41 and is connected to the through pipe 5, the sealing member 6 and the power take-off 41, respectively, so that the sealing member 6 and the power take-off 41 can rotate relative to the through pipe 5, whereby the through pipe 5 can be kept stationary while the chuck body 1 rotates.
In some embodiments, the sealing member 6 includes a first sealing member 61 and a second sealing member 62, and the first sealing member 61 and the second sealing member 62 are respectively connected to the top end and the bottom end of the power output end 41 in a sealing manner; further, the first seal 61 is sealingly connected to the chuck body 1. As shown in fig. 4, an annular slit extending from the top end of the first seal 61 to the bottom end of the second seal 62 is formed between the first seal 61, the second seal 62, the power take-off end 41 and the outer peripheral surface of the through pipe 5, and as shown in fig. 4, the annular slit communicates with the annular slit formed between the outer peripheral surface of the through pipe 5 and the inner peripheral surface of the mounting hole 12, so that when the downward gas flow is supplied to the top end of the annular slit from the third gas passage 22 of the nozzle 2, the downward gas flow further flows into the annular slit below.
As shown in fig. 3, the bearing member 7 includes a first bearing 71 and a second bearing 72, and the first bearing 71 and the second bearing 72 are respectively disposed corresponding to the first sealing member 61 and the second sealing member 62, so that the power output end 41 can drive the chuck body 1 to rotate around its axis through the first sealing member 61. Thus, the first bearing 71 and the second bearing 72 are provided at both ends of the power take-off 41, respectively, to enable uniform application of the supporting force to the through pipe 5 and the power take-off 41.
In some embodiments, as shown in fig. 3, the first seal 61 includes a first sleeve 611 having a first projection projecting from an outer circumferential surface; the first sleeve 611 is disposed around the through pipe 5 and is not connected thereto; the outer peripheral surface of the first boss 611 is connected to a part of the inner peripheral surface of the mounting hole 12, and the upper surface of the first boss is connected to the bottom surface of the chuck body 1.
The first seal 61 further includes a second collar 612 having a second projection projecting from an outer peripheral surface thereof, the second collar 612 being disposed around the through pipe 5 without being connected thereto; the outer peripheral surface of the second collar 612 is connected with part of the inner peripheral surface of the power output end 41, the upper surface of the second boss is connected with the first boss in a sealing manner, and the lower surface of the second boss is connected with the upper end surface of the power output end 41.
The sealing member 6 further includes a second seal member 62 provided at the bottom of the power take-off 41, the second seal member 62 including a third boss having a third projection projecting from the outer peripheral surface; a third collar is provided around the through pipe 5 and the top face of the third collar is used to carry the second bearing 72; the upper surface of the third boss is connected with the bottom surface of the power output end 41, and specifically, the third boss is fixedly connected with the bottom surface of the power output end 41 by screws.
The first bearing 71 and the second bearing 72 are connected to the power output end 41 at the outer peripheral surfaces thereof, and connected to the through pipe 5 at the inner peripheral surfaces thereof, so that the through pipe 5 does not rotate when the chuck body 1 is rotated by the driving unit 4. Moreover, as shown in fig. 3, a first step protruding outwards is arranged at a position of the through pipe 5 corresponding to the first bearing 71, and the bottom surface of the first step is abutted against the top surface of the inner ring of the first bearing 71; the inner peripheral surface of the power output end 41 is provided with a second step protruding outwards, and the top surface of the second step is abutted against the bottom surface of the outer ring of the first bearing 71 so as to be matched with the first step to fix the first bearing 71 together; the bottom surface of the second step abuts against the top surface of the outer ring of the second bearing 72; the top surface of the third sleeve abuts against the bottom surface of the inner race of the second bearing 72, and thus cooperates with the second step to fix the second bearing 72 together.
As described above, the annular slit between the first seal 61, the second seal 62, the power output end 41 and the outer peripheral surface of the through pipe 5 communicates with the annular slit between the outer peripheral surface of the through pipe 5 and the inner peripheral surface of the mounting hole 12. Since the gas flow from the third gas passage 22 to the annular slit is continuously downward, if the two annular slits are completely sealed, the gas pressure in the annular slits will increase, and even the gas will flow back into the first gas passage 11 in the chuck body 1. To avoid this, in some preferred embodiments, as shown in fig. 3 and 6, at least one first vent hole 51 is opened on the side surface of the straight-through pipe 5, and both are located between the first sealing element 61 and the second sealing element 62; specifically, the first vent hole 51 is located in the middle of the straight-through pipe 5; the bottom of the straight-through pipe 5 is provided with at least one second vent hole 52 communicated with the atmospheric environment; in this way, the annular slit between the outer peripheral surface of the through pipe 5 and the inner peripheral surface of the power take-off 41, the internal space of the through pipe 5, and the atmospheric environment communicate with each other, so that the third gas passage 22 can output a gas flow to the outside continuously to the atmospheric environment without hindrance.
In some preferred embodiments, the number of the first ventilation holes 51 ranges from 1 to 4, and the diameter of the first ventilation holes ranges from 3mm to 6 mm.
In some embodiments, as shown in fig. 4, a labyrinth structure 8 is provided on the inner circumferential surface of the first seal 61, and in particular, the labyrinth structure 8 is provided on the inner circumferential surface of the second sleeve 612; moreover, in some embodiments, the labyrinth structure 8 is also provided at a position where the outer peripheral surface of the through pipe 5 is opposite to the inner peripheral surface of the mounting hole 12, so that when the gas flows backward inside the annular slit between the outer peripheral surface of the through pipe 5 and the inner peripheral surface of the mounting hole 12, minute particles in the gas are blocked from entering the first gas passage 11. Furthermore, in some embodiments, as shown in fig. 4, the top of the outer surface of the nozzle 2 is also provided with a labyrinth 8.
Specifically, the labyrinth structure 8 includes annular grooves and annular protrusions, which are arranged along a direction parallel to the axis of the straight-through pipe and are alternately arranged; as shown in fig. 4, a narrow passage with multiple bends can be formed between the concave-convex inner surface of the labyrinth structure 8 and the flat outer circumferential surface of the through pipe 5 to further block the fine particles carried in the gas flow, so that when the gas flow rate inside the first gas passage 11 is suddenly increased, the fine particles are prevented from being instantaneously sucked into the first gas passage 11 by the abruptly increased suction force.
As another technical solution, the embodiment further provides a cleaning apparatus, which includes the chuck device described above, and is used for fixing a wafer to be cleaned. Specifically, the cleaning equipment further comprises a clamping piece, the clamping piece can be a plurality of fixing pins, eccentric shafts are arranged at the tops of the fixing pins, the fixing pins are located above the chuck device and distributed along the circumferential direction of the chuck device, and the fixing pins are rotated to enable the eccentric shafts to be matched with and clamp the wafer suspended above the bearing surface.
In the chuck device provided in this embodiment, the nozzle is provided with a second gas channel inside, which is respectively communicated with the first gas channel and the gas supply pipeline inside the chuck body, so that the gas sequentially flows through the gas supply pipeline, the nozzle and the first gas channel, and finally blows the gas to the surface of the wafer, thereby utilizing the bernoulli effect generated by the gas flow between the wafer and the chuck body to suspend the wafer above the bearing surface. The third gas channel is arranged in the nozzle, a gas inlet of the third gas channel is communicated with a gas outlet of the gas supply pipeline, the gas outlet of the third gas channel faces towards the annular slit between the outer peripheral surface of the straight-through pipe and the inner peripheral surface of the mounting hole, so that the gas can be ventilated to the annular slit, the downward gas flow is utilized to block the gas which flows out from the annular slit and carries the micro particles from entering the gas channel in the chuck body, the contact between the micro particles and the surface of the wafer is avoided, and the wafer yield is ensured.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (11)
1. A chuck device of a cleaning device comprises a chuck body, a cleaning device and a control device, wherein the chuck body is provided with a bearing surface for bearing a wafer; a first gas channel is formed in the chuck main body, and a gas outlet of the first gas channel is formed in the bearing surface and used for ventilating the wafer; characterized in that, the chuck device further comprises: a nozzle, an air supply line and a mounting assembly; wherein the content of the first and second substances,
the chuck body is internally provided with a mounting hole, and the nozzle is arranged in the mounting hole and is not connected with the chuck body; a second gas channel is formed in the nozzle, a gas outlet of the second gas channel is communicated with a gas inlet of the first gas channel, and a gas inlet of the second gas channel is communicated with the gas supply pipeline so as to convey gas to the first gas channel;
the mounting assembly is used for mounting the nozzle in the mounting hole; the mounting assembly comprises a straight-through pipe, the top end of the straight-through pipe is connected with the nozzle and is positioned in the mounting hole, and the air supply pipeline is positioned in the straight-through pipe; an annular slit is formed between the outer peripheral surface of the straight-through pipe and the inner peripheral surface of the mounting hole;
a third gas channel is further formed in the nozzle, and a gas inlet of the third gas channel is communicated with the gas supply pipeline; the gas outlet of the third gas channel faces to one side departing from the bearing surface and is arranged corresponding to the top end of the annular slit and used for ventilating the annular slit.
2. The chuck apparatus according to claim 1, wherein the gas inlet of the third gas passage communicates with the second gas passage, and the gas outlet of the third gas passage is lower than the gas inlet.
3. The chuck assembly according to claim 2, wherein the second gas passage includes a plurality of second sub-passages extending in an oblique direction; the air inlets of the second sub-channels are communicated with the air supply pipeline, and the air outlets of the second sub-channels are uniformly distributed on the upper surface of the nozzle;
the third gas channel comprises third sub-channels which are arranged in one-to-one correspondence with the second sub-channels; and the air inlet of each third sub-channel is communicated with the corresponding second sub-channel.
4. The chuck device according to claim 3, wherein the angle between the axis of the third sub-channel and the vertical direction is in the range of 40 ° to 50 °, and the aperture of the third sub-channel is in the range of 1mm to 2 mm.
5. The chuck assembly according to claim 1, wherein the chuck further comprises a drive assembly; the driving assembly is provided with an annular power output end;
the power output end is connected with the chuck body through the mounting assembly and used for driving the chuck body to rotate; the power output end is arranged around the through pipe and is not connected with the through pipe, so that the through pipe and the nozzle do not rotate along with the chuck body.
6. The chuck assembly according to claim 5, wherein said mounting assembly further comprises a sealing member and a bearing member; the sealing component is respectively connected with the chuck main body and the power output end in a sealing way; the sealing component is arranged around the straight-through pipe;
the bearing member is positioned between the through pipe and the power output end and is connected to the through pipe, the sealing member and the power output end, respectively, so that the sealing member and the power output end can rotate relative to the through pipe.
7. The chuck assembly of claim 6, wherein the sealing member includes first and second seals sealingly coupled to top and bottom ends of the power take-off respectively, and the first seal sealingly coupled to the chuck body;
the bearing component comprises a first bearing and a second bearing, and the first bearing and the second bearing are respectively arranged corresponding to the first sealing element and the second sealing element.
8. The chuck device according to claim 7, wherein the through pipe has at least one first vent hole opened on a side surface thereof, and both are located between the first sealing member and the second sealing member;
the bottom of the straight-through pipe is provided with at least one second vent hole communicated with the atmospheric environment.
9. The chuck device according to claim 7, characterized in that the first sealing member is provided on the inner peripheral surface thereof and/or
The position of the peripheral surface of the straight-through pipe opposite to the inner peripheral surface of the mounting hole and/or
And a labyrinth structure is arranged on the peripheral surface of the nozzle.
10. The chuck device according to claim 9, wherein the labyrinth structure comprises annular grooves and annular protrusions, which are arranged in a direction parallel to the axis of the through pipe and are arranged alternately.
11. A cleaning apparatus comprising a chuck assembly according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210757438.9A CN114975222A (en) | 2022-06-30 | 2022-06-30 | Chuck device of cleaning equipment and cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210757438.9A CN114975222A (en) | 2022-06-30 | 2022-06-30 | Chuck device of cleaning equipment and cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114975222A true CN114975222A (en) | 2022-08-30 |
Family
ID=82967529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210757438.9A Pending CN114975222A (en) | 2022-06-30 | 2022-06-30 | Chuck device of cleaning equipment and cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114975222A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115410963A (en) * | 2022-11-02 | 2022-11-29 | 华海清科股份有限公司 | Wafer post-processing device |
-
2022
- 2022-06-30 CN CN202210757438.9A patent/CN114975222A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115410963A (en) * | 2022-11-02 | 2022-11-29 | 华海清科股份有限公司 | Wafer post-processing device |
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