CN114975212A - Wafer center positioning method, device, equipment and medium - Google Patents
Wafer center positioning method, device, equipment and medium Download PDFInfo
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- CN114975212A CN114975212A CN202210423340.XA CN202210423340A CN114975212A CN 114975212 A CN114975212 A CN 114975212A CN 202210423340 A CN202210423340 A CN 202210423340A CN 114975212 A CN114975212 A CN 114975212A
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
The invention discloses a method, a device, equipment and a medium for positioning a wafer center, wherein the method comprises the following steps: acquiring a wafer image; acquiring position information of at least three interest points in the wafer image under a rectangular coordinate system; fitting the at least three interest points to obtain a first reference circle, and calculating a first circle center position of the first reference circle by using the position information of the at least three interest points; extracting edge radian information of the wafer image; obtaining a second reference circle through arc fitting according to the edge radian information, and calculating a second circle center position of the second reference circle; and performing centroid calculation on the first circle center position and the second circle center position to obtain the wafer center.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a method, a device, equipment and a medium for positioning a center of a wafer.
Background
Currently, the angle correction and center position determination of wafers are important links in the integrated circuit manufacturing process. The current algorithm for correcting the angle and determining the center position of the wafer mainly comprises the steps of collecting a local edge image of the wafer, recording physical coordinates, selecting edge points on the image, and positioning the circle center through three points on a non-identical straight line. Based on the above background, how to improve the detection accuracy of the wafer center becomes a technical problem currently facing.
Disclosure of Invention
The embodiment of the invention provides a method, a device, equipment and a medium for positioning a wafer center, which are used for solving the problem of low accuracy of a wafer center positioning result.
In a first aspect, the present invention provides a method for positioning a center of a wafer, including: acquiring a wafer image; acquiring position information of at least three interest points in the wafer image under a rectangular coordinate system; fitting the at least three interest points to obtain a first reference circle, and calculating a first circle center position of the first reference circle by using the position information of the at least three interest points; extracting edge radian information of the wafer image; obtaining a second reference circle through arc fitting according to the edge radian information, and calculating a second circle center position of the second reference circle; and performing centroid calculation on the first circle center position and the second circle center position to obtain the center of the wafer.
The wafer center positioning method provided by the invention has the beneficial effects that: and based on the first circle center position calculated through the interest points of the mark points, the coordinates of the image and the motion system in the current state of the equipment are also obtained, and the arc of the image is calculated through a visual algorithm to perform circle fitting so as to obtain a second circle center position. And combining the first circle center position obtained by fitting and the second circle center position obtained by calculating the interest points, and calculating the centroids of the circle center points, wherein the centroids are used as the final wafer center, so that the accuracy of the wafer center positioning result is improved.
In one possible embodiment, extracting the edge curvature information of the wafer image includes: and extracting the edge radian information of the wafer image through an image vision algorithm.
In yet another possible embodiment, the acquiring the wafer image includes: the turntable rotates the wafer and collects wafer images frame by frame along the outer edge of the wafer; extracting the edge radian information of the wafer image through an image vision algorithm, wherein the method comprises the following steps: processing the collected wafer images frame by frame and extracting edge feature points of the wafer images; and fitting an arc line according to the edge characteristic points to obtain edge radian information of the wafer image. The method is beneficial to accurately extracting the characteristic points of the wafer image edge, so that the edge radian information of the wafer image is obtained.
In other possible embodiments, before processing the acquired wafer image frame by frame and extracting edge feature points of the wafer image, the method further includes: and performing Gaussian filtering on the wafer image.
In yet another possible embodiment, the three points of interest are chosen at unequal intervals.
In a second aspect, embodiments of the present invention further provide a wafer centering apparatus, which includes a module/unit for performing any one of the possible design methods of the first aspect. These modules/units may be implemented by hardware or by hardware executing corresponding software.
In a third aspect, an embodiment of the present invention provides an electronic device, which includes a processor and a memory. Wherein the memory is for storing one or more computer programs; the one or more computer programs stored in the memory, when executed by the processor, enable the electronic device to implement any of the possible design approaches of the second aspect described above.
In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, where the computer-readable storage medium includes a computer program, and when the computer program runs on an electronic device, the electronic device is caused to perform any one of the possible design methods of any one of the foregoing aspects.
In a fifth aspect, an embodiment of the present invention further provides a computer program product, which when run on a terminal, causes the electronic device to execute any one of the possible design methods of any one of the above aspects.
With respect to the advantageous effects of the above second to fifth aspects, reference may be made to the description of the above first aspect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a wafer center positioning apparatus according to an embodiment of the present invention;
fig. 2 is a schematic flow chart illustrating a wafer center positioning method according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a selected point of interest on a wafer image according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a wafer center positioning device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
In order to make the contents of the present invention more comprehensible, the present invention is further described below with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
In the following detailed description of the embodiments of the present invention, in order to clearly illustrate the structure of the present invention and to facilitate explanation, the structure shown in the drawings is not drawn to a general scale and is partially enlarged, deformed and simplified, so that the present invention should not be construed as limited thereto.
Referring to fig. 1, the present invention provides a possible wafer center positioning apparatus, where the apparatus includes a carrier table 1, the carrier table 1 is used to carry a wafer to be measured, in addition, the wafer center positioning apparatus further includes an image sensor 2, the image sensor 2 is used to collect an edge image of the wafer to be measured, the wafer center positioning apparatus further includes a driving device, and the driving device 3 is used to drive the carrier table to rotate.
Fig. 2 is a schematic flow chart of a wafer center positioning method according to an embodiment of the present invention. As shown in fig. 2, the method may be performed by an electronic device, the method comprising the steps of:
s201, acquiring a wafer image.
The turntable rotates the wafer and collects wafer images frame by frame along the outer edge of the wafer;
s202, acquiring the position information of at least three interest points in the wafer image under the rectangular coordinate system.
Illustratively, referring to fig. 3, the center of a circle is located by acquiring a local edge image of a wafer, recording physical coordinates, and manually selecting three interest points on the local edge image of the wafer, wherein the three interest points are not collinear. Wherein the selection intervals of the three interest points are unequal.
S203, fitting the at least three interest points to obtain a first reference circle, and calculating the position of a first circle center of the first reference circle by using the position information of the at least three interest points.
S204, extracting edge radian information of the wafer image; and obtaining a second reference circle through arc fitting according to the edge radian information, and calculating a second circle center position of the second reference circle.
Optionally, before processing the acquired wafer image frame by frame and extracting edge feature points of the wafer image, the method further includes: and performing Gaussian filtering on the wafer image.
In the step, the collected wafer images are processed frame by frame and edge feature points of the wafer images are extracted; and fitting an arc line according to the edge characteristic points to obtain edge radian information of the wafer image.
S205, performing centroid calculation on the first circle center position and the second circle center position to obtain the wafer center.
The wafer center obtained by the embodiment of the invention is mainly used for positioning the loaded wafer of the semiconductor equipment.
As can be seen, in the present embodiment, based on the first circle center position calculated by the mark point interest point, the coordinates of the image and the motion system in the current state of the device are also obtained, and the arc of the image is calculated by the visual algorithm to perform circle fitting, so as to obtain the second circle center position. And combining the first circle center position obtained by fitting and the second circle center position obtained by calculating the interest points, and calculating the centroids of the circle center points, wherein the centroids are used as the final wafer center, so that the accuracy of the wafer center positioning result is improved.
In summary, compared with the prior art, the wafer center positioning method provided in the embodiments of the present invention extracts the radian information of the wafer edge by combining the image of the selected edge point, obtains the center of a circle by fitting the circle with the arc, and performs centroid calculation on the obtained positions of the several centers of the circle to obtain the final wafer center, thereby avoiding the error caused by the traditional manually selected edge point, and the calculation result is more accurate.
In some embodiments of the present application, the present invention further discloses a wafer center positioning apparatus, as shown in fig. 4, which is used for implementing the method described in the above method embodiments, and includes: an obtaining unit 401, configured to obtain a wafer image; acquiring position information of at least three interest points in the wafer image under the rectangular coordinate system; the processing unit 402 is configured to obtain a first reference circle by fitting the at least three interest points, and calculate a first center position of the first reference circle by using the position information of the at least three interest points. An extracting unit 403, configured to extract edge radian information of the wafer image. The processing unit 402 is further configured to obtain a second reference circle through arc fitting according to the edge radian information, and calculate a second circle center position of the second reference circle; and performing centroid calculation on the first circle center position and the second circle center position to obtain the center of the wafer.
Optionally, before the extracting unit processes the acquired wafer image frame by frame and extracts the edge feature point of the wafer image, the apparatus further includes a filtering unit 404 configured to: gaussian filtering is carried out on the wafer image
All relevant contents of each step related to the above method embodiment may be referred to the functional description of the corresponding functional module, and are not described herein again.
In other embodiments of the present application, an embodiment of the present invention discloses an electronic device, which may include, as shown in fig. 5: one or more processors 501; a memory 502; a display 503; one or more application programs (not shown); and one or more computer programs 504, which may be connected via one or more communication buses 505. Wherein the one or more computer programs 504 are stored in the memory 502 and configured to be executed by the one or more processors 501, the one or more computer programs 504 comprising instructions which may be used to perform the steps as in fig. 2 and the corresponding embodiments.
Through the above description of the embodiments, it is clear to those skilled in the art that, for convenience and simplicity of description, the foregoing division of the functional modules is merely used as an example, and in practical applications, the above function distribution may be completed by different functional modules according to needs, that is, the internal structure of the device may be divided into different functional modules to complete all or part of the above described functions. For the specific working processes of the system, the apparatus and the unit described above, reference may be made to the corresponding processes in the foregoing method embodiments, and details are not described here again.
Each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present invention may be implemented in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, an electronic device, or a network device) or a processor to execute all or part of the steps of the methods described in the embodiments of the present application, or all or part of the technical solutions. And the aforementioned storage medium includes: flash memory, removable hard drive, read only memory, random access memory, magnetic or optical disk, and the like.
The above description is only a specific implementation of the embodiments of the present invention, but the scope of the embodiments of the present invention is not limited thereto, and any changes or substitutions within the technical scope disclosed by the embodiments of the present invention should be covered within the scope of the embodiments of the present invention. Therefore, the protection scope of the embodiments of the present invention shall be subject to the protection scope of the claims.
Claims (12)
1. A wafer center positioning method is characterized by comprising the following steps:
acquiring a wafer image;
acquiring position information of at least three interest points in the wafer image under a rectangular coordinate system;
fitting the at least three interest points to obtain a first reference circle, and calculating a first circle center position of the first reference circle by using the position information of the at least three interest points;
extracting edge radian information of the wafer image; obtaining a second reference circle through arc fitting according to the edge radian information, and calculating a second circle center position of the second reference circle;
and performing centroid calculation on the first circle center position and the second circle center position to obtain the center of the wafer.
2. The method of claim 1, wherein extracting edge curvature information for the wafer image comprises:
and extracting the edge radian information of the wafer image through an image vision algorithm.
3. The method of claim 2, wherein the acquiring the wafer image comprises:
the turntable rotates the wafer and collects wafer images frame by frame along the outer edge of the wafer;
extracting the edge radian information of the wafer image through an image vision algorithm, wherein the method comprises the following steps:
processing the collected wafer images frame by frame and extracting edge feature points of the wafer images;
and fitting an arc line according to the edge characteristic points to obtain edge radian information of the wafer image.
4. The method of claim 2, wherein before processing the collected wafer image frame by frame and extracting edge feature points of the wafer image, the method further comprises:
and performing Gaussian filtering on the wafer image.
5. The method of any one of claims 1 to 4, wherein the three points of interest are chosen at unequal intervals.
6. A wafer centering device, comprising:
the acquiring unit is used for acquiring a wafer image; acquiring position information of at least three interest points in the wafer image under the rectangular coordinate system;
the processing unit is used for obtaining a first reference circle by utilizing the fitting of the at least three interest points and calculating a first circle center position of the first reference circle by utilizing the position information of the at least three interest points;
the extraction unit is used for extracting the edge radian information of the wafer image;
the processing unit is further used for obtaining a second reference circle through arc fitting according to the edge radian information and calculating a second circle center position of the second reference circle; and performing centroid calculation on the first circle center position and the second circle center position to obtain the center of the wafer.
7. The apparatus of claim 6, wherein the extraction unit, when extracting the edge radian information of the wafer image, is configured to:
and extracting the edge radian information of the wafer image through an image vision algorithm.
8. The apparatus of claim 7, wherein the acquiring unit, when acquiring the wafer image, is configured to:
the turntable rotates the wafer and collects wafer images frame by frame along the outer edge of the wafer;
the extraction unit extracts the edge radian information of the wafer image through an image vision algorithm, and is specifically used for: processing the collected wafer images frame by frame and extracting edge feature points of the wafer images; and fitting an arc line according to the edge characteristic points to obtain edge radian information of the wafer image.
9. The apparatus of claim 7, wherein before the extracting unit processes the acquired wafer image frame by frame and extracts the edge feature point of the wafer image, the apparatus further comprises a filtering unit configured to:
and performing Gaussian filtering on the wafer image.
10. The apparatus according to any one of claims 6 to 9, wherein the three points of interest are chosen at unequal intervals.
11. An electronic device, comprising: a processor and a memory for storing a computer program; the processor is configured to execute the memory-stored computer program to cause the electronic device to perform the method of any of claims 1-5.
12. A computer-readable storage medium, having stored thereon a computer program, characterized in that the computer program, when being executed by a processor, implements the method of any of claims 1 to 5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210423340.XA CN114975212A (en) | 2022-04-21 | 2022-04-21 | Wafer center positioning method, device, equipment and medium |
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| CN202210423340.XA CN114975212A (en) | 2022-04-21 | 2022-04-21 | Wafer center positioning method, device, equipment and medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115546143A (en) * | 2022-09-30 | 2022-12-30 | 杭州长川科技股份有限公司 | Method and device for positioning center point of wafer, storage medium and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115546143A (en) * | 2022-09-30 | 2022-12-30 | 杭州长川科技股份有限公司 | Method and device for positioning center point of wafer, storage medium and electronic equipment |
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