CN114970091B - Electromagnetic compatibility analysis design method for high-density magnetic wafer coil array - Google Patents
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Abstract
The invention relates to an electromagnetic compatibility analysis design method for a high-density magnetic wafer coil array. In the method, single magnetic wafer coils arranged in an array are attached to the surface of a single device, and the method comprises the following steps: firstly, carrying out predictive analysis and evaluation on the self-compatible condition of the equipment; and then, a receiving and transmitting pair with potential interference for single equipment is designed by adopting measures such as shielding, filtering, grounding, isolation and the like. When a plurality of devices are arranged, a single device is firstly analyzed, then the electromagnetic compatibility between the devices is predicted, analyzed and evaluated, and finally, the receiving and transmitting pairs with potential interference between the devices are designed by adopting measures such as shielding, filtering, grounding, isolation and the like. The self-compatible predictive analysis of the magnetic coupling equipment is realized, the electromagnetic compatibility design of the magnetic coupling energy taking and communication system is realized, the electromagnetic interference problem between the equipment and the equipment can be solved, and a technical foundation is laid for the electromagnetic compatibility design of the magnetic coupling energy taking and communication system.
Description
Technical Field
The invention belongs to the field of electromagnetic compatibility design, and mainly relates to an electromagnetic compatibility design method of equipment/subsystems, in particular to an electromagnetic compatibility analysis design method of a high-density magnetic wafer coil array.
Background
With the increasing integration, modularization and intellectualization of power electronic systems, wireless energy harvesting and communication have become a new trend in system design. In the implementation technology of wireless energy taking and communication, the magnetic coupling technology has the advantages of stability, low energy consumption, strong anti-electric interference capability and the like, and has been widely applied to the fields of wireless power supply, underwater communication and the like.
The magnetic wafer coil array is a magnetic coupling technical system capable of simultaneously realizing wireless energy taking and communication, and has wide application prospect in the field of equipment design, in particular to the aspect of cabling. The magnetic wafer coil array is a high-density array formed by uniformly arranging a plurality of single magnetic wafer coils, and a magnetic wafer coil connection network is formed, and each magnetic wafer coil is composed of a coil and a TMR sensor. The magnetic wafer coil array is used as a magnetic connection interface to replace a traditional cable interface so as to realize energy and signal transmission.
The magnetic wafer coil array adopts a magnetic field as an information and energy transmission carrier, so that the magnetic wafer coil array has stronger electric interference resistance. The magnetic coupling energy taking and communication system is only applied to a few fields of wireless power supply, underwater communication and the like, and the system lacks a professional electromagnetic compatibility design method. The national standard GB/T37132-2018 general electromagnetic compatibility requirement and test method of wireless charging equipment specifies the electromagnetic compatibility design basis of the wireless charging equipment, but no corresponding design method exists, and the magnetic coupling communication system lacks the electromagnetic compatibility requirement. In the high density magnetic wafer coil array operating mode, the following problems exist with devices configured on the magnetic wafer coil array: 1. electromagnetic interference signals emitted by an equipment internal module are received by other modules through magnetic induction coupling between coils of the configured magnetic wafer, so that the self-compatibility problem of the equipment is caused; 2. the high-density magnetic wafer coil array has obvious magnetic field resonance coupling among units, and electromagnetic interference signals emitted by a single device can enter a magnetic wafer coil network through mutual coupling of the magnetic wafer coils, so that normal operation of other devices is influenced, and the problem of electromagnetic interference among the devices is caused; 3. the high-density magnetic wafer coil array is arranged in a close distance between devices, and obvious radiation interference can be formed between the devices through shell-to-shell coupling. Therefore, the device comprising the high-density magnetic wafer coil array has a special electromagnetic interference formation mechanism, and the research on the electromagnetic compatibility analysis design method has important significance for guaranteeing the compatibility work among the devices.
At present, the electromagnetic compatibility design method mainly comprises a problem solving method, a standard specification method and a predictive analysis method. Aiming at the design problem of electromagnetic compatibility of equipment/subsystems, the main technologies include shielding, filtering, grounding and the like. The above methods and techniques are directed to cabled systems and cannot provide technical support for wireless energy extraction and electromagnetic compatibility design of communication systems.
Disclosure of Invention
The invention aims at providing a design method for analyzing electromagnetic compatibility of a high-density magnetic wafer coil array aiming at the electromagnetic compatibility design requirements of a magnetic coupling energy taking and communication system.
The invention provides a design method for electromagnetic compatibility analysis of a high-density magnetic wafer coil array, which is characterized by comprising the following steps of: the surface of the adopted single equipment is attached with array-type arranged single magnetic wafer coils;
In the method, a single magnetic wafer coil is defined as a magnetic port, a high-density magnetic wafer coil matrix is equivalent to a multi-port network, the coupling degree among the ports is simulated, and a magnetic coupling incidence matrix of the network is established; the method comprises the following steps:
1) Predictive analysis and assessment of device self-compatibility status
1.1, Establishing a device self-interference prediction equation: assuming that the equipment has M1 magnetic transmitting ports and M2 magnetic receiving ports, the total interference power received by the ith receiving port is
Wherein the method comprises the steps ofAn interference power spectrum function of a j-th magnetic emission port of the equipment; t ij (f) is the coupling transfer function from the jth magnetic transmit port to the ith magnetic receive port; p i R (f) is the sensitivity threshold;
1.2 determining interference Power function for all magnetic emission ports of device
1.3, Constructing a magnetic coupling incidence matrix of the equipment, simulating the coupling degree among ports, and completing element filling of the incidence matrix;
1.4 determination of the magnetic coupling transfer function from the coupling incidence matrix
Tij(f)＝f(Cij),i＝1,...M2,j＝1,...,M1
1.5 Determining sensitivity thresholds P i S (f), i=1, M1 for all magnetic receiving ports of the device based on design parameters of the device;
1.6 evaluating device self-compatibility conditions using predictive equations: determining the total interference power P i R (f) received by each receiving port of the device, and comparing P i S (f) with P i R (f) Conversion to dB form
Will beCompared with a pre-specified threshold delta, ifThe port is not disturbed; if it isThe port is disturbed ifThen the signal is in an adjacent interference state, and all potential interference receiving and transmitting pairs are determined based on the adjacent interference state;
2) For the receiving and transmitting pair with potential interference of a single device, measures such as shielding, filtering, grounding and isolation are adopted in a targeted manner based on three elements of electromagnetic compatibility.
In the step 1, 1.3, a coupling correlation matrix is constructed by taking the coupling degree C between ports as an element:
When the equipment comprises a plurality of pieces of equipment, defining the shell as an electric port, simulating the shell-shell coupling of each piece of equipment, and establishing an electric coupling incidence matrix among the pieces of equipment; the method also comprises
Step 3) carrying out predictive analysis and evaluation on electromagnetic compatibility conditions among devices, wherein the steps are as follows:
3.1, establishing an inter-device electromagnetic compatibility prediction equation: assuming that P devices are distributed on the magnetic wafer coil array and comprise M1 magnetic transmitting ports, M2 magnetic receiving ports, N1 electric transmitting ports and N2 electric receiving ports in total, the total interference power received by the ith electric receiving port is
Wherein the method comprises the steps ofA power function of interference transmitted from the housing port for the j-th device; For coupling transfer function from the j-th device housing port to the i-th device housing port
The total interference power received by the ith magnetic receiving port of the equipment combination is as follows
Wherein the method comprises the steps ofCombining an interference power function of a j-th magnetic transmission port for the device; Is a coupling transfer function from the jth magnetic transmit port to the ith magnetic receive port.
3.2 Based on design parameters of the device, determining interference power function of all magnetic emission ports combined by the device by adopting theoretical calculation, simulation analysis or test meansDetermining interference power function of equipment combining all shell emission ports
3.3, Constructing a magnetic coupling incidence matrix of the equipment combination, simulating the coupling degree between each magnetic port in the incidence matrix, and completing the element filling of the incidence matrix;
3.4 determining the magnetic coupling transfer function from the magnetic coupling incidence matrix
3.5, Constructing an inter-equipment electric coupling incidence matrix, simulating shell-shell coupling among ports in the incidence matrix, and completing element filling of the electric incidence matrix;
3.6 determining the electric coupling transfer function from the electric coupling incidence matrix
3.7 Determining a device combination determination sensitivity threshold P i Sm (f), i=1, M2 for all magnetic receiving ports of the device combination based on design parameters of the device; determining sensitivity thresholds P i Se (f), i=1, N2 for all enclosure receiving ports of the device combination;
3.8, evaluating the interference condition between devices by using an electromagnetic compatibility prediction equation between the devices: determining total interference power P i Re (f) and P i Rm (f) received by each receiving port of the equipment, and comparing the total interference power with P i Se (f) and P i Sm (f) respectively Conversion to dB form
Will beCompared with a pre-specified threshold delta, ifThe port is not disturbed; if it isThe port is disturbed ifThen the signal is in an adjacent interference state, and based on this, all potential interference transceiver pairs are determined.
4) For the receiving and transmitting pairs with potential interference among devices, measures such as shielding, filtering, grounding and isolation are adopted in a targeted manner based on three elements of electromagnetic compatibility.
In the step 3, 3.3 is a magnetic coupling association matrix of the device combination constructed by using the coupling degree C between the ports as an element:
in the step 3, 3.5 is to construct an inter-device electrical coupling correlation matrix by using the inter-port coupling degree C2 as an element:
compared with the prior art, the invention has the following advantages:
1. Self-compatible predictive analysis of the magnetic coupling device is realized: the device self-compatibility problem of the configuration magnetic wafer coils is different from the mechanism of the cabled device, and the device self-compatibility problem is mainly transmitted to interference through coupling among the magnetic wafer coils. The invention establishes a coupling incidence matrix among ports by defining a magnetic port; and realizing the self-compatible predictive analysis of the equipment by establishing an equipment self-compatible predictive analysis equation and guiding the design.
2. Realizes the design of magnetic coupling energy taking and electromagnetic compatibility of a communication system: the invention establishes a coupling incidence matrix between ports by defining a magnetic port and an electric port; and an electromagnetic compatibility prediction equation is established, electromagnetic compatibility prediction analysis of the high-density magnetic wafer coil array is realized, and design is guided.
3. The invention provides an electromagnetic compatibility analysis design method of a high-density magnetic wafer coil array, which not only can analyze and design a single device, but also can analyze and design a plurality of devices, can solve the electromagnetic interference problem between the devices and the devices, and lays a technical foundation for electromagnetic compatibility design of a magnetic coupling energy taking and communication system.
Drawings
FIG. 1 is a schematic diagram of a magnetic wafer coil array;
FIG. 2 is a schematic diagram of magnetic interference between modules within a device;
FIG. 3 is a schematic diagram of electromagnetic interference between devices;
FIG. 4 is a schematic diagram of the apparatus of example 1;
fig. 5a and 5b are interference power spectra of magnetic transmit ports 1 and 2, respectively;
FIG. 6 is a port coupling simulation model;
Fig. 7 is a simulation result of coupling degree between ports: fig. 7a, 7b, 7c, 7d represent the coupling degree of the transmitting port 1 to the receiving port 1, the transmitting port 1 to the receiving port 2, the transmitting port 2 to the receiving port 1, the transmitting port 2 to the receiving port 2, respectively;
FIGS. 8a and 8b are sensitivities of the magnetic receiving ports 1 and 2, respectively;
fig. 9 is a magnetic two receive port interference power versus sensitivity comparison: fig. 9a is the sensitivity and interference power of the magnetic receiving port 1; fig. 9b is the sensitivity and interference power of the magnetic receiving port 2;
FIG. 10 is a schematic view of the apparatus of example 2;
fig. 11 is an interference power spectrum of the magnetic emission ports 1 to 4: fig. 11a, 11b, 11c, 11d represent interference power spectra of the magnetic emission port 1, the magnetic emission port 2, the magnetic emission port 3, the magnetic emission port 4, respectively;
Fig. 12 is an interference power spectrum of the electric emission port 1;
Fig. 13 is a simulation result of the coupling degree between ports: fig. 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h represent the coupling degree of transmit port 1 to receive port 1, transmit port 2 to receive port 1, transmit port 3 to receive port 1, transmit port 4 to receive port 1, transmit port 1 to receive port 2, transmit port 2 to receive port 2, transmit port 3 to receive port 2, transmit port 4 to receive port 2, respectively;
FIG. 14 is a simulation result of the degree of coupling between electrical ports;
FIGS. 15a and 15b are sensitivities of the magnetic receiving ports 1 and 2, respectively;
FIG. 16 is an electrical receive port sensitivity;
FIGS. 17a and 17b are the interference power and sensitivity of the magnetic receiving ports 1 and 2, respectively;
Fig. 18 is a comparison of electrical receive port interference power and sensitivity.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
The existing magnetic wafer coil array principle is shown in figure 1, wherein a plurality of single magnetic wafer coils are uniformly arranged to form a high-density array, and a magnetic wafer coil connection network is formed; each magnetic wafer coil is composed of a coil and a TMR sensor, and is used as a magnetic connection interface, and different devices needing energy taking or communication are used for configuring a single magnetic wafer coil or a plurality of magnetic wafer coils to form corresponding combinations according to requirements.
In the high-density magnetic wafer coil array working mode, on one hand, electromagnetic interference signals emitted by an internal module of the equipment are received by other modules of the equipment through magnetic induction coupling among the magnetic wafer coils, and the self-compatibility problem of the equipment is caused, as shown in fig. 2; on the other hand, obvious magnetic field resonance coupling exists among units of the high-density magnetic wafer coil array, electromagnetic interference signals emitted by a single device can enter a magnetic wafer coil network through mutual coupling among the wafers, and then normal operation of other devices is affected, and the problem of electromagnetic interference among the devices is caused. And the devices of the high-density magnetic wafer coil array are distributed in a short distance, and obvious radiation interference is formed between the devices through shell-to-shell coupling, as shown in fig. 3.
The design principle of the method is as follows: and an electromagnetic compatibility prediction equation is established based on three elements of electromagnetic interference, so that electromagnetic compatibility prediction analysis of the high-density magnetic wafer coil array is realized, and design is guided.
Example 1
A design method for electromagnetic compatibility analysis of a high-density magnetic wafer coil array defines a single magnetic wafer coil as a magnetic port, specifically comprises a magnetic transmitting port and a magnetic receiving port, and the high-density magnetic wafer coil array is equivalent to a multi-port network, so that the coupling degree among the ports is simulated, and a magnetic coupling incidence matrix of the network is established.
The device in this embodiment is shown in fig. 4, and includes 2 magnetic transmitting ports and 2 magnetic receiving ports, where it is assumed that the signals transmitted by the two transmitting ports are rectangular pulse sequence signals, the amplitude, period and pulse width of the port 1 are a 1＝165V、T1＝5×10-5s、τ1＝3×10-5 s respectively, and the amplitude, period and pulse width of the port 2 are a 2＝300V、T2＝5×10- 5s、τ2＝3×10-5 s respectively; the sensitivity of the magnetic receive port is the in-band operating level minus 6dB.
1) Predictive analysis and assessment of device self-compatibility status
1.1, Establishing a device self-interference prediction equation. Because the equipment has 2 magnetic transmitting ports and 2 magnetic receiving ports, the total interference power received by the 1 st and 2 nd receiving ports is respectively
Wherein the method comprises the steps ofAndInterference power spectrum functions of the 1 st and 2 nd magnetic emission ports of the device respectively; t 11(f)、T12(f)、T21(f)、T22 (f) is the interference transfer function of transmit ports 1 and 2 to receive ports 1 and 2, respectively.
1.2 Determining an interference Power function of two magnetic emission ports of a device based on design parameters of the deviceAnd
In this embodiment, discrete fourier transform is applied, and simplified and approximated to obtain interference power spectrums of the magnetic transmitting ports 1 and 2:
The interference power spectrums dB of the magnetic emission ports 1 and 2 are shown in FIG. 5, and FIG. 5a reflects the variation situation of the interference power of the magnetic emission port 1 along with the frequency in the frequency range of 1 kHz-1 MHz; fig. 5b shows the variation of the interference power of the magnetic transmitting port 2 with frequency in the frequency range of 1 kHz-1 MHz.
1.3, Constructing a device magnetic coupling incidence matrix, and constructing the coupling incidence matrix by taking the coupling degree C among ports as an element:
and simulating the coupling degree between the ports to complete the filling of the elements of the incidence matrix, wherein the simulation model and the simulation result of the coupling degree between the ports are shown in fig. 6 and 7.
1.4 Determination of the magnetic coupling transfer function from the coupling incidence matrix
Function f (C ij) converts the value of C ij from dB to amplitude, ensures ANDMatching;
1.5 simulation determination of sensitivity P 1 S (f) and sensitivity of two magnetic receiving ports based on design parameters of the device As shown in fig. 8, wherein fig. 8a shows the sensitivity of the magnetic receiving port 1 in the frequency range of 1kHz to 1 MHz; fig. 8b shows the sensitivity of the magnetic receiving port 2 in the frequency range of 1kHz to 1 MHz.
1.6 Evaluating device self-compatibility conditions using predictive equations: specifying a threshold delta=0db, and determining the total interference power P 1 R (f) and the total interference power P 1 R (f) received by each receiving port of the equipmentRespectively with P 1 S (f) andComparison is shown in fig. 9. Wherein fig. 9a shows the interference power versus sensitivity of the magnetic receiving port 1 and fig. 9b shows the interference power versus sensitivity of the magnetic receiving port 2. Separately solve forAndConverted into dB form, compared with delta, foundAndIt can be seen that both receive ports are disturbed around the 10kHz frequency.
2) According to the equipment self-compatibility predictive analysis method, carrying out self-compatibility predictive analysis on the equipment configured by the magnetic wafer coil array one by one; for a receiving-transmitting pair with potential interference, based on three electromagnetic compatibility factors, measures such as shielding, filtering, grounding, isolation and the like are adopted for design in a targeted manner:
in this embodiment, according to the device self-compatible predictive analysis result, a filter is added in front of the magnetic emission port 1, the interference suppression capability of the filter is not less than 10dB near 10kHz, a filter is added in front of the magnetic emission port 2, and the interference suppression capability is not less than 13dB near 10 kHz.
Example 2
A design method for electromagnetic compatibility analysis of high-density magnetic wafer coil array defines a single magnetic wafer coil as a magnetic port, and specifically comprises a magnetic transmitting port and a magnetic receiving port.
In this embodiment, two devices are included, including 4 magnetic transmitting ports, 2 magnetic receiving ports, including 1 housing electric transmitting port and 1 housing electric receiving port, as shown in fig. 10. The self-compatibility analysis method of the two devices is the same as that of embodiment 1, and this embodiment is not repeated, and only the electromagnetic compatibility analysis between the devices is described.
1) Predictive analysis and assessment of inter-device electromagnetic compatibility
1.1 Establishing an electromagnetic compatibility prediction equation between devices. The total interference power received by 1 electric receiving port of the equipment combination is that
Wherein the method comprises the steps ofA function of interference power emitted from the housing port for the electrical emission device; Is a coupling transfer function that couples from a housing port of an electrical transmitting device to a housing port of an electrical receiving device.
The total interference power received by the 1 st and the 2 nd magnetic receiving ports of the equipment combination is respectively
Wherein the method comprises the steps ofCombining an interference power function of a j-th magnetic transmission port for the device; And The coupling transfer functions from the jth magnetic transmit port to the 1 st and 2 nd magnetic receive ports, respectively.
And respectively obtaining the total interference power at the electric and magnetic receiving ports through the two prediction equations, and comparing the total interference power with a sensitivity threshold to determine whether a potential electromagnetic interference problem exists.
1.2 Determining an interference Power function for a device to combine all magnetic emission ports based on test dataAs shown in fig. 11, wherein fig. 11a, 11b, 11c, 11d are interference power spectra of the magnetic transmitting ports 1,2, 3, 4, respectively; determining interference power function of emission port of shell of electric emission deviceAs shown in fig. 12.
1.3, Constructing a magnetic coupling incidence matrix of the equipment combination by taking the coupling degree C among the ports as an element:
The coupling degree between each magnetic port in the incidence matrix is simulated to complete the element filling of the incidence matrix, and as shown in fig. 13, fig. 13a to 13h are the simulation results of the coupling degree between the transmitting port-receiving port pairs 1-1, 2-1, 3-1, 4-1, 1-2, 2-2, 3-2 and 4-2 respectively.
1.4 Determining the magnetic coupling transfer function from the magnetic coupling incidence matrix
Function f (C ij) converts the value of C ij from dB to amplitude, ensures ANDMatching;
1.5 constructing an inter-device electrical coupling correlation matrix by taking the inter-port coupling degree C2 as an element:
[C211]
The shell-to-shell coupling was simulated, the electrical correlation matrix element filling was completed, and the shell-to-shell coupling was as shown in fig. 14.
1.6 Determining an electric coupling transfer function from an electric coupling correlation matrix
Function f (C2 ij) converts the value of C2 ij from dB to amplitude, ensures ANDMatching;
1.7 assuming that the sensitivity of the magnetic receiving ports is the in-band operating level minus 6dB, the simulation device combines the sensitivity thresholds P 1 Sm (f) and the sensitivity thresholds of the two magnetic receiving ports As shown in fig. 15, wherein fig. 15a is the sensitivity of the magnetic receiving port 1, and fig. 15b is the sensitivity of the magnetic receiving port 2; a sensitivity threshold P 1 Se (f) for the device combination housing receiving port is determined, as shown in fig. 16.
1.8 Evaluation of electromagnetic compatibility conditions between devices using predictive equations. Specifying a threshold delta=0db, and determining the total interference power P 1 Rm (f) and the total interference power P 1 Rm (f) received by two magnetic receiving ports of the deviceRespectively with P 1 Sm (f) andComparison is shown in fig. 17. Separately solve forAndConverted into dB form, compared with delta, foundIt can be seen that both receive ports are disturbed around the 10kHz frequency. The total interference power P 1 Re (f) of the device electrical receiving port is determined and compared with P 1 Se (f), as shown in fig. 18. Solving forConverted into dB form, compared with delta, foundIt can be seen that both receiving ports are disturbed around the 2MHz frequency.
2) According to the method for predicting and analyzing the electromagnetic compatibility among the devices, predicting and analyzing the electromagnetic compatibility among the devices of the device combination configured by the magnetic wafer coil array; for a receiving-transmitting pair with potential interference, based on three electromagnetic compatibility factors, measures such as shielding, filtering, grounding, isolation and the like are adopted for design in a targeted manner:
in this embodiment, according to the result of the electromagnetic compatibility prediction analysis between devices, a filter is added in front of the magnetic emission port 2, the interference suppression capability of the filter is not less than 20dB near 10kHz, and a filter is added in front of the magnetic emission port 2, and the interference suppression capability is not less than 20dB near 10 kHz. On the other hand, in order to inhibit the radiation coupling of the equipment shell and the shell, on the premise that the mobile equipment cannot be spatially isolated, shielding measures are needed to be adopted for the emission shell, and a shielding shell is additionally arranged, so that the shielding efficiency is not lower than 20dB.
Claims (5)
1. The design method for electromagnetic compatibility analysis of the high-density magnetic wafer coil array is characterized by comprising the following steps of: the surface of the adopted single equipment is attached with array-type arranged single magnetic wafer coils;
In the method, a single magnetic wafer coil is defined as a magnetic port, a high-density magnetic wafer coil matrix is equivalent to a multi-port network, the coupling degree among the ports is simulated, and a magnetic coupling incidence matrix of the network is established; the method comprises the following steps:
1) Predictive analysis and assessment of device self-compatibility status
1.1, Establishing a device self-interference prediction equation: assuming that the equipment has M1 magnetic transmitting ports and M2 magnetic receiving ports, the total interference power received by the ith receiving port is
Wherein the method comprises the steps ofAn interference power spectrum function of a j-th magnetic emission port of the equipment; t ij (f) is the coupling transfer function from the jth magnetic transmit port to the ith magnetic receive port; p i R (f) is the sensitivity threshold;
1.2 determining interference Power function for all magnetic emission ports of device
1.3, Constructing a magnetic coupling incidence matrix of the equipment, simulating the coupling degree among ports, and completing element filling of the incidence matrix;
1.4 determination of the magnetic coupling transfer function from the coupling incidence matrix
Tij(f)＝f(Cij),i＝1,...M2,j＝1,...,M1
1.5 Determining sensitivity thresholds P i S (f), i=1, M1 for all magnetic receiving ports of the device based on design parameters of the device;
1.6 evaluating device self-compatibility conditions using predictive equations: determining the total interference power P i R (f) received by each receiving port of the device, and comparing P i S (f) with P i R (f) Conversion to dB form
Will beCompared with a pre-specified threshold delta, ifThe port is not disturbed; if it isThe port is disturbed ifThen the signal is in an adjacent interference state, and all potential interference receiving and transmitting pairs are determined based on the adjacent interference state;
2) For the receiving and transmitting pair with potential interference of a single device, measures such as shielding, filtering, grounding and isolation are adopted in a targeted manner based on three elements of electromagnetic compatibility.
2. The method for designing electromagnetic compatibility analysis of a high-density magnetic wafer coil array according to claim 1, wherein: in the step 1, 1.3 is to construct a coupling association matrix by taking the coupling degree C between ports as an element:
3. The electromagnetic compatibility analysis design method of the high-density magnetic wafer coil array according to claim 1 or 2, characterized in that: when the equipment comprises a plurality of pieces of equipment, defining the shell as an electric port, simulating the shell-shell coupling of each piece of equipment, and establishing an electric coupling incidence matrix among the pieces of equipment;
the method also comprises the step 3) of carrying out predictive analysis and evaluation on electromagnetic compatibility conditions among devices, and the steps are as follows:
3.1, establishing an inter-device electromagnetic compatibility prediction equation: assuming that P devices are distributed on the magnetic wafer coil array and comprise M1 magnetic transmitting ports, M2 magnetic receiving ports, N1 electric transmitting ports and N2 electric receiving ports in total, the total interference power received by the ith electric receiving port is
Wherein the method comprises the steps ofA power function of interference transmitted from the housing port for the j-th device; For coupling transfer function from the j-th device housing port to the i-th device housing port
The total interference power received by the ith magnetic receiving port of the equipment combination is as follows
Wherein the method comprises the steps ofCombining an interference power function of a j-th magnetic transmission port for the device; Is a coupling transfer function coupled from the jth magnetic transmit port to the ith magnetic receive port;
3.2 based on design parameters of the device, determining interference power function of all magnetic emission ports combined by the device by adopting theoretical calculation, simulation analysis or test means Determining interference power function of equipment combining all shell emission ports
3.3, Constructing a magnetic coupling incidence matrix of the equipment combination, simulating the coupling degree between each magnetic port in the incidence matrix, and completing the element filling of the incidence matrix;
3.4 determining the magnetic coupling transfer function from the magnetic coupling incidence matrix
3.5, Constructing an inter-equipment electric coupling incidence matrix, simulating shell-shell coupling among ports in the incidence matrix, and completing element filling of the electric incidence matrix;
3.6 determining the electric coupling transfer function from the electric coupling incidence matrix
3.7 Determining a device combination determination sensitivity threshold P i Sm (f), i=1, M2 for all magnetic receiving ports of the device combination based on design parameters of the device; determining sensitivity thresholds P i Se (f), i=1, N2 for all enclosure receiving ports of the device combination;
3.8, evaluating the interference condition between devices by using an electromagnetic compatibility prediction equation between the devices: determining total interference power P i Re (f) and P i Rm (f) received by each receiving port of the equipment, and comparing the total interference power with P i Se (f) and P i Sm (f) respectively Conversion to dB form
Will beCompared with a pre-specified threshold delta, ifThe port is not disturbed; if it isThe port is disturbed ifThen the signal is in an adjacent interference state, and all potential interference receiving and transmitting pairs are determined based on the adjacent interference state;
4) For the receiving and transmitting pairs with potential interference among devices, measures such as shielding, filtering, grounding and isolation are adopted in a targeted manner based on three elements of electromagnetic compatibility.
4. The electromagnetic compatibility analysis design method for the high-density magnetic wafer coil array according to claim 3, wherein: in the step 3, 3.3 is a magnetic coupling association matrix of the device combination constructed by taking the coupling degree C among the ports as an element:
。
5. the method for designing electromagnetic compatibility analysis of a high-density magnetic wafer coil array according to claim 4, wherein: in the step 3, 3.5 is to construct an inter-device electrical coupling correlation matrix by using the inter-port coupling degree C2 as an element:
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