CN114967880B - Heat radiation system of portable electronic device - Google Patents

Heat radiation system of portable electronic device Download PDF

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Publication number
CN114967880B
CN114967880B CN202110196377.9A CN202110196377A CN114967880B CN 114967880 B CN114967880 B CN 114967880B CN 202110196377 A CN202110196377 A CN 202110196377A CN 114967880 B CN114967880 B CN 114967880B
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Prior art keywords
fan
heat
air
air outlet
heat dissipating
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CN202110196377.9A
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CN114967880A (en
Inventor
陈宗廷
廖文能
谢铮玟
林育民
陈伟今
林光华
王俊杰
郭书豪
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Acer Inc
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Acer Inc
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a heat dissipation system of a portable electronic device, which comprises a machine body and at least one fan. The heat source is disposed in the body. The fan is a centrifugal fan and is arranged in the machine body. The fan is provided with at least one air inlet, at least one air outlet and at least one spacing part, wherein the air outlet faces the heat source, and the spacing part surrounds the air inlet and is abutted against the machine body so as to isolate the air inlet and the heat source from two independent spaces in the machine body.

Description

Heat radiation system of portable electronic device
Technical Field
The present disclosure relates to heat dissipation systems, and particularly to a heat dissipation system for a portable electronic device.
Background
The current electronic industry is rapidly developing, and the performance of electronic components is continuously improved, and the heat generated by the electronic components is also greater along with the faster instruction period, so that in a portable electronic device, such as a notebook computer, the portable electronic device needs to discharge the air in the portable electronic device through a centrifugal fan, thereby reducing the internal temperature of the device.
Furthermore, in order to meet the current trend of devices toward light, thin, short, small and high performance, the heat dissipation components in the portable electronic device are also required to be miniaturized, so that the situation of insufficient heat dissipation efficiency is often faced.
Meanwhile, the existing fan is often provided with only one air outlet, the heat dissipation efficiency is limited, and on the premise of not increasing the number of the fans, the fan can adopt the design of two air outlets, but under the condition that the fan is not provided with the corresponding design airflow paths, the fan can not exert the effect, besides the heat dissipation capacity, the heat dissipation path conflict is easily generated in the device, or the excessive thermal impedance is caused in the device, so that the situation that heat accumulation cannot dissipate out of the portable electronic device is caused. For example, without a corresponding heat dissipation airflow path, heat that would otherwise be expelled from the device may be drawn into the device by the fan again.
Based on the above, how to match a specific air flow path for the fan to smoothly discharge heat to achieve the required heat dissipation effect is the problem that the related technicians need to think and solve
Disclosure of Invention
The invention is directed to a heat dissipation system of a portable electronic device, which isolates a heat source and an air inlet of a fan from two independent spaces in a machine body through a spacing part of the fan so as to ensure that heat dissipation airflow paths generated by the fan do not collide.
According to an embodiment of the invention, a heat dissipation system of a portable electronic device includes a body and at least one fan. The heat source is disposed in the body. The fan is a centrifugal fan and is arranged in the machine body. The fan is provided with at least one air inlet, at least one air outlet and at least one spacing part, wherein the air outlet faces the heat source, and the spacing part surrounds the air inlet and is abutted against the machine body so as to isolate the air inlet and the heat source from two independent spaces in the machine body.
Based on the above, the heat dissipation system of the portable electronic device is configured to surround the air inlet of the fan and abut against the body through the partition of the centrifugal fan, so that the air inlet and the heat source in the body can be isolated from two independent spaces by the partition, and therefore the air inlet can ensure that the air sucked by the air inlet only comes from the external environment of the body, and also avoid the possibility that the heat generated by the heat source is sucked by the fan again, thereby providing an improved countermeasure to the heat accumulation situation generated by the collision of the heat dissipation paths in the existing body.
Drawings
FIG. 1 is a schematic diagram of a portable electronic device according to an embodiment of the invention;
FIG. 2 is an exploded view of a heat dissipating system according to an embodiment of the present invention;
FIG. 3 is a top view of a heat dissipation system according to the present invention;
FIGS. 4A and 4B are cross-sectional views of the heat dissipation system of FIG. 3, respectively;
FIG. 5 is a partial cross-sectional view of a heat dissipation system in accordance with another embodiment of the invention;
fig. 6A and 6B are schematic diagrams illustrating a heat dissipation system in a portable electronic device at different viewing angles;
fig. 7A and fig. 7B are schematic diagrams of fans according to different embodiments of the invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1 is a schematic diagram of a portable electronic device according to an embodiment of the invention. Fig. 2 is an exploded view of a heat dissipating system according to an embodiment of the present invention. Fig. 3 is a top view of a heat dissipating system according to the present invention. The embodiment also provides rectangular coordinates X-Y-Z to facilitate component identification. Referring to fig. 1 to 3, in the present embodiment, the heat dissipation system 100 is suitable for a portable electronic device 10 (such as a notebook computer), and the heat dissipation system 100 includes a body 110 and at least one fan 120. The heat sources 11, 12 (e.g., a central processing unit CPU and a graphics processing unit GPU) are disposed in the body 110. The fan 120 is a centrifugal fan, and is disposed in the body 110. The fan 120 has at least one air inlet (according to fig. 1 to 3, the fan 120 has an air inlet N1, but another air inlet N2 is provided on the opposite side of the fan, as disclosed in the following figures), at least one air outlet (according to fig. 1 to 3, the fan 120 has a second air outlet N3, a first air outlet N4) and at least one partition (according to fig. 1 to 3, the fan 120 has partition portions 122, 123 disposed on opposite surfaces of the fan body 121), the first air outlet N4 faces the heat sources 11, 12, and the partition portions 122, 123 surround the corresponding air inlets N1, N2 and respectively abut against the machine body 110 to isolate the air inlets N1, N2 and the heat sources 11, 12 in the machine body 110 from two independent spaces.
Fig. 4A and fig. 4B are cross-sectional views of the heat dissipation system of fig. 3, respectively. Referring to fig. 2 to 4A, further, the body 110 includes an upper housing 111 and a lower housing 112, at least one of the upper housing 111 and the lower housing 112 has an opening corresponding to the air inlet, in this embodiment, the upper housing 111 has a (hole-shaped) opening 111a corresponding to the air inlet N1 of the fan, and the lower housing 112 has a (grid-shaped) opening 112a corresponding to the air inlet N2. Accordingly, when the fan 120 is operated, air in the environment outside the body 110 can flow into the fan 120 through the openings 111a, 112a and the air inlets N1, N2. Meanwhile, since the spacing portions 122 and 123 of the fan 120 are cushioning materials, such as foam, which has flexibility and elasticity and can be abutted against the upper housing 111 and the lower housing 112, the space in the machine body 110 where the air inlets N1 and N2 are located is isolated from the space in the machine body 110 where the heat sources 11 and 12 are located, so that the heat generated by the heat sources 11 and 12 is ensured not to affect the space in which the air inlets N1 and N2 are located, that is, the air inlets N1 and N2 can only suck the air in the external environment through the openings 111a and 112a of the machine body 110, the cool air sucked by the fan 120 is ensured, and the effective heat dissipation action on the heat sources 11 and 12 is facilitated when the cool air is blown out from the second air outlet N3 and the first air outlet N4. Here, the air inlets N1, N2 of the fan 120 are coaxially disposed, and as shown in fig. 2, the partition portions 122, 123 are disposed along the structural periphery of the fan body 121 of the fan 120 to form a closed contour.
Referring to fig. 3, fig. 4A and fig. 4B, in general, the body 110 of the present embodiment has at least one opening, and the air flow generated by the fan 120 flows out from the air outlet, dissipates heat from the heat sources 11, 12 or related heat dissipation components, and then flows out of the body 110 from the opening. In detail, the fan 120 of the present embodiment operates to suck cool air of the environment outside the body 110, i.e., air flow F1 as shown in the drawing, from the air inlets N1, N2. Furthermore, as shown in fig. 2, 3 and 4B, the body 110 has a plurality of openings 111B and 111c, and the heat dissipation system 100 of the portable electronic device 10 further has a heat conducting member 130 and a heat dissipation member 140, wherein, as shown in fig. 2 and 3, the heat conducting member 130 is, for example, a heat pipe, the heat dissipation member 140 is, for example, a heat dissipation fin (only shown in the drawings for simplicity of the embodiment), and the heat conducting member 130 is in thermal contact between the heat sources 11 and 12 and the heat dissipation member 140 so as to transfer the heat generated by the heat sources 11 and 12 to the heat dissipation member 140. In addition, since the fan 120 has the first air outlet N4 and the second air outlet N3, the airflows F2 and F3 generated by the fan 120 flow out from the first air outlet N4 and the second air outlet N3, respectively, the heat dissipation member 140 is located between the second air outlet N3 and the opening 111b, wherein the airflows F2 flowing out from the second air outlet N3 flow out of the body 110 from the opening 111b through the heat dissipation member 140, and the airflows F3 flowing out from the first air outlet N4 flow out of the body 110 from the opening 111c after passing through the heat sources 11 and 12.
In this way, the cool air sucked into the fan 120 can flow out from the first air outlet N4 and the second air outlet N3 respectively, wherein the cool air (air flow F3) flowing out from the first air outlet N4 can directly blow and dissipate heat to the heat sources 11, 12 in the machine body 110, and then blow out of the machine body 110 through the opening 111c of the machine body 110, and the cool air (air flow F2) flowing out from the second air outlet N3 can blow and dissipate heat to the heat dissipation member 140, and then blow out of the machine body 110 through the opening 111b of the machine body 110. In other words, the fan 120 of the present embodiment, and particularly the centrifugal fan, uses the axial air inlet and the spacing portions 122 and 123 respectively encircle the axial air inlet and form independent spaces, so as to ensure that the axial air inlet is to cool air of the external environment of the fan body 110, and the first air outlet N4, the second air outlet N3 and the spaces of the heat sources 11 and 12 and the heat sink 140 are isolated from each other, so that a unidirectional and non-conflicting heat dissipation airflow path can be provided, and the heat dissipation capability of the fan 120 is improved.
Fig. 5 is a partial cross-sectional view of a heat dissipating system according to another embodiment of the present invention. Referring to fig. 5, unlike the aforementioned embodiments in which the spacers 122 and 123 protrude from the fan body 121 of the fan 120, in the embodiment shown in fig. 5, the spacer 221 is also a fan body structure, that is, in this embodiment, the spacer 221 and the fan body are regarded as an integral structure and are directly abutted to the machine body 110, and as shown in fig. 5, the spacer 221 includes an upper top plate 221a and a lower top plate 221b respectively abutted to the upper casing 111 and the lower casing 112 of the machine body 110. In this way, the opening 111a at the upper case 111 is regarded as a structure conforming to the air inlet N1, and the opening 112a at the lower case 112 is regarded as a structure conforming to the air inlet N2.
Fig. 6A and 6B are schematic diagrams illustrating the heat dissipation system in the portable electronic device at different viewing angles, and the viewing angles of the two are substantially opposite to each other. That is, fig. 6A and 6B can be regarded as top and bottom views of the inside of the host of the notebook computer. Referring to fig. 6A and 6B, in the present embodiment, the heat dissipation system includes two fans, and the fan bodies 121 are respectively located at two opposite sides of the heat sources 11, 12. Similarly, each fan has two air outlets, and generates air flows F2 and F3 as shown in the figure, the air flow F2 is used for dissipating heat from the heat dissipating member 140, the air flow F3 is used for dissipating heat from the heat sources 11 and 12, and the description thereof will be omitted herein. In this embodiment, two fans are further provided as heat dissipation means, wherein the air outlets (corresponding to the first air outlet N4 of the previous embodiment) generating the air flow F3 are opposite to each other and all face the heat sources 11, 12, and the air outlets (corresponding to the second air outlet N3 of the previous embodiment) generating the air flow F2 are opposite to each other and all face the outside of the machine body 110, so as to provide better heat dissipation efficiency through such configuration.
It should be noted that, in addition to forming the independent spaces SP1, SP2 around the air inlet by the fan spacers 122B, 123B, the present embodiment further provides retaining walls 150, 160 in the machine body 110, respectively adjacent between the fan spacers 122B, 123B, and separate a different space again in the machine body 110. As shown in fig. 6A, the retaining wall 150, the partition 122B and the body 110 form a space SP3 partially, the heat sources 11, 12 are located in the space SP3, and as shown in fig. 6B, the retaining wall 160, the partition 123B and the body 110 form a space SP6 partially, and the heat sources 11, 12 and 15 (e.g. memory modules) are located in the space SP 6.
In the present embodiment, the portable electronic device 10 further includes a circuit board 13 and a battery 14, the heat sources 11, 12 and 15 and the retaining walls 150 and 160 are respectively disposed on two opposite surfaces of the circuit board 13, and the spaces SP3 and SP6 where the heat sources 11, 12 and 15 are located can be kept isolated from the spaces SP1 and SP2 where the air inlets are located or from the spaces SP4 and SP5 where other components (such as the battery 14) are located by the retaining walls 150 and 160 in the previous section, so as to avoid the influence of the heat generated by the heat sources 11, 12 and 15 on the fan or other components in the machine body. In this embodiment, the heat sources 11, 12 and 15 and the battery 14 are separated by the barriers 150 and 160, so that the battery 14 is prevented from being damaged due to heat transferred from the spaces SP3 and SP6 to the spaces SP4 and SP 5.
Fig. 7A and fig. 7B are schematic diagrams of fans according to different embodiments of the invention. Referring to fig. 7A, unlike the spacers 122 and 123 of the previous embodiment, the spacer 122A of the present embodiment is a buffer material and is disposed on the fan body 121 along the periphery of the air inlet N1 to form a closed profile. Next, referring to fig. 7B, in the present embodiment, the spacer 122D is a buffer material, and is in a closed contour and located between the air inlet N1 and the structural periphery of the fan body 121. Whether the partition portions 122, 123 or the partition portions 122A, 122D in the foregoing embodiment are the partition portions, it is possible to achieve a state in which the air inlet N1 and the air outlet (e.g., the first air outlet N4 and the second air outlet N3) of the fan are isolated from each other, so as to avoid the collision of the heat dissipation airflows. Furthermore, the number of air inlets is not limited in this embodiment, and only a single air inlet can be disposed on the impeller shaft of the fan body 121 according to the heat dissipation requirement. For example, taking fig. 2 as an example for comparison, the single air inlet can only leave the air inlet N1 on the fan body 121, so that the body 110 only needs to reserve the corresponding opening 111a on the upper housing 111, and the lower housing 112 can remove the opening 112a, and the body 110 can have a back-beautifying structure by removing the opening 112a because the opening 111a can be shielded by the keyboard of the notebook computer as shown in fig. 1, so that the portable electronic device 10 can obtain a better visual effect.
In summary, the heat dissipation system of the portable electronic device is configured to surround the air inlet of the fan and abut against the body through the partition of the centrifugal fan, so that the air inlet and the heat source in the body can be isolated from two independent spaces by the partition, and therefore the air inlet can ensure that the air sucked by the air inlet only comes from the external environment of the body, and also avoid the possibility that the heat generated by the heat source is sucked by the fan again, thereby providing an improved countermeasure to the heat accumulation situation generated by the collision of the heat dissipation paths in the existing body.
Further, for portable electronic devices (notebook computers), the heat dissipation system is always a major factor affecting the performance of the electronic components (e.g. CPU, GPU). The flow field arrangement disclosed in the above embodiment of the present invention provides a corresponding airflow path design for the fan with double air outlets, so that the fan can generate forced convection to solve the problem of overheating of the machine body, thereby further improving the efficiency of the electronic component and reducing the manufacturing cost of the heat dissipation system.
That is, the above embodiment of the present invention forms an effective isolation structure for the air inlet and the air outlet of the fan through the partition of the fan, so that the interference and the collision of the heat dissipation airflow paths can be effectively avoided, thereby providing an effective heat dissipation means for the heat source.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (11)

1. A heat dissipation system for a portable electronic device, comprising:
the portable electronic device comprises a body, at least one heat source of the portable electronic device is arranged in the body;
the two fans are centrifugal fans and are configured in the machine body, the fans are provided with at least one air inlet, at least one air outlet and at least one spacing part, the air outlet faces the heat source, the spacing part surrounds the air inlet and is abutted to the machine body so as to isolate the air inlet and the heat source from two independent spaces in the machine body, the two fans are respectively arranged on two opposite sides of the heat source, each fan is provided with a first air outlet and a second air outlet, the first air outlets are opposite to each other and face the heat source, and the second air outlets are opposite to each other and face the outside of the machine body; and
the heat source is positioned in a space surrounded by the retaining wall, the plurality of the spacing parts and part of the machine body.
2. The heat dissipating system of claim 1, wherein the housing comprises an upper housing and a lower housing, at least one of the upper housing and the lower housing has an opening corresponding to the air inlet, and ambient air outside the housing flows into the fan through the opening and the air inlet.
3. The heat dissipating system of claim 1, wherein the housing has at least one opening, and the air flow generated by the fan flows out of the air outlet and out of the housing through the opening after passing through the heat source.
4. The heat dissipating system of claim 3, wherein the housing has a plurality of openings, and the heat dissipating system of the portable electronic device further has a heat conducting member and a heat dissipating member, wherein the heat conducting member is in thermal contact between the heat source and the heat dissipating member to transfer heat generated by the heat source to the heat dissipating member, wherein the fan has a first air outlet and a second air outlet, and wherein the air flow generated by the fan flows out of the first air outlet and the second air outlet, respectively, and the heat dissipating member is located between the second air outlet and a portion of the plurality of openings, wherein the air flow flowing out of the second air outlet flows out of the housing through the heat dissipating member and a portion of the plurality of openings, and the air flow flowing out of the first air outlet flows out of the housing through the other portion of the plurality of openings after the air flow passes through the heat source.
5. The heat dissipating system of claim 1, wherein the spacer is a buffer material disposed along the periphery of the air inlet and has a closed contour.
6. The heat dissipating system of claim 1, wherein the spacer is a buffer material disposed along a structural periphery of the fan to form a closed profile.
7. The heat dissipating system of claim 1, wherein the spacer is a buffer material with a closed contour and is located between the air inlet and the structural periphery of the fan.
8. The heat dissipating system of claim 1, wherein the housing comprises an upper housing and a lower housing, and the fan has two air inlets and two spacers coaxially disposed in correspondence with each other, and the two spacers are made of a buffer material and respectively abut against the upper housing and the lower housing.
9. The heat dissipating system of claim 1, wherein the spacer protrudes from a fan body of the fan.
10. The heat dissipating system of claim 1, wherein the spacer is a fan body of the fan.
11. The heat dissipating system of claim 1, wherein the portable electronic device further comprises a circuit board and a battery, the heat source and the retaining wall are disposed on the circuit board, and the heat source and the battery are separated by the retaining wall into two spaces independent of each other.
CN202110196377.9A 2021-02-22 2021-02-22 Heat radiation system of portable electronic device Active CN114967880B (en)

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CN114967880B true CN114967880B (en) 2023-08-15

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Citations (5)

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CN1506792A (en) * 2002-12-09 2004-06-23 广达电脑股份有限公司 Heat isolator
CN202818851U (en) * 2012-10-02 2013-03-20 纬创资通股份有限公司 Fan module for generating different air flows and electronic device
WO2014103371A1 (en) * 2012-12-28 2014-07-03 株式会社東芝 Electronic device
CN105022463A (en) * 2014-04-29 2015-11-04 和硕联合科技股份有限公司 Electronic apparatus module
CN111212544A (en) * 2018-11-21 2020-05-29 英业达科技有限公司 Electronic device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4792103B2 (en) * 2009-12-25 2011-10-12 株式会社東芝 Centrifugal fans and electronics
JP4982590B2 (en) * 2010-06-18 2012-07-25 株式会社東芝 Display device and electronic device
TWI468100B (en) * 2011-01-31 2015-01-01 Inventec Corp Mobile computing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1506792A (en) * 2002-12-09 2004-06-23 广达电脑股份有限公司 Heat isolator
CN202818851U (en) * 2012-10-02 2013-03-20 纬创资通股份有限公司 Fan module for generating different air flows and electronic device
WO2014103371A1 (en) * 2012-12-28 2014-07-03 株式会社東芝 Electronic device
CN105022463A (en) * 2014-04-29 2015-11-04 和硕联合科技股份有限公司 Electronic apparatus module
CN111212544A (en) * 2018-11-21 2020-05-29 英业达科技有限公司 Electronic device

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