CN114967791A - Temperature control method, system, apparatus, computer device, medium and product - Google Patents

Temperature control method, system, apparatus, computer device, medium and product Download PDF

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Publication number
CN114967791A
CN114967791A CN202210758741.0A CN202210758741A CN114967791A CN 114967791 A CN114967791 A CN 114967791A CN 202210758741 A CN202210758741 A CN 202210758741A CN 114967791 A CN114967791 A CN 114967791A
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Prior art keywords
temperature
information
output voltage
module
voltage
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张文俊
唐豪钦
杜永聪
张海斌
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Hitachi Elevator China Co Ltd
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Hitachi Elevator China Co Ltd
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)

Abstract

The application relates to the technical field of automatic control, and provides a temperature control method, a system, a device, computer equipment, a storage medium and a computer program product. The method and the device can improve the accuracy of controlling the temperature of the module to be controlled. The method comprises the following steps: the temperature control method comprises the steps of receiving temperature information sent by a temperature acquisition unit, acquiring resistance information of a thermosensitive device by the temperature acquisition unit according to the resistance information, obtaining the thermosensitive device according to the resistance information, arranging the thermosensitive device in a module to be controlled, arranging the module to be controlled in a heat dissipation device, obtaining temperature change information corresponding to the thermosensitive device according to the temperature information, inputting output voltage corresponding to the temperature change information into a cooling device, enabling the cooling device to adjust the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled, and enabling the heat dissipation device to be located in the cooling area range of the cooling device.

Description

Temperature control method, system, apparatus, computer device, medium and product
Technical Field
The present application relates to the field of automatic control technologies, and in particular, to a temperature control method, system, apparatus, computer device, storage medium, and computer program product.
Background
With the development of automatic control technology, how to control the state of the module to be controlled becomes an important research direction. The temperature of the module can greatly influence the service life of the template, and the service life of the module to be controlled can be effectively prolonged by correctly controlling the temperature of the module to be controlled.
The conventional technology is generally operated by a cooling fan with a fixed rotating speed to control the temperature of a module to be controlled, but the accuracy of controlling the temperature of the module to be controlled by the technology is low.
Disclosure of Invention
In view of the above, it is necessary to provide a temperature control method, a system, an apparatus, a computer device, a computer readable storage medium and a computer program product for solving the above technical problems.
In a first aspect, the present application provides a method of temperature control. The method comprises the following steps:
receiving temperature information sent by a temperature acquisition unit; the temperature information is obtained by acquiring the resistance information of the thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device;
obtaining temperature change information corresponding to the thermosensitive device according to the temperature information;
inputting the output voltage corresponding to the temperature change information to a cooling device, and enabling the cooling device to adjust the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled; the heat dissipation device is located in the cooling area of the cooling device.
In one embodiment, after obtaining the temperature variation information corresponding to the thermosensitive device according to the temperature information, the method further includes:
acquiring temperature change instruction information;
subtracting the temperature change instruction information and the temperature change information to obtain an offset value;
and determining the output voltage corresponding to the deviation value as the output voltage corresponding to the temperature change information.
In a second aspect, the present application further provides a temperature control system. The system comprises: the temperature control device comprises a main control unit, a temperature acquisition unit, a thermosensitive device and a cooling device; the thermosensitive device is arranged in the module to be controlled, the module to be controlled is arranged in the heat dissipation device, and the heat dissipation device is positioned in the cooling area of the cooling device; the main control unit is respectively connected with the temperature acquisition unit and the temperature reduction device, and the temperature acquisition unit is also connected with the thermosensitive device;
the temperature acquisition unit is used for acquiring resistance information of the thermosensitive device and sending temperature information corresponding to the resistance information to the main control unit;
the main control unit is used for obtaining temperature change information corresponding to the thermosensitive device according to the received temperature information and inputting output voltage corresponding to the temperature change information to the cooling device;
and the temperature reduction device is used for adjusting the working mode of the temperature reduction device according to the output voltage so as to control the temperature of the module to be controlled.
In one embodiment, the main control unit comprises a change calculating device, a subtraction calculating device and a voltage calculating device; the subtraction calculating device is respectively connected with the change calculating device and the voltage calculating device;
the change calculating device is used for taking the slope information corresponding to the received temperature information as the temperature change information corresponding to the thermosensitive device and sending the temperature change information to the subtraction calculating device;
the subtraction calculating device is used for acquiring temperature change instruction information, subtracting the temperature change instruction information and the temperature change information to obtain an offset value, and sending the offset value to the voltage calculating device;
and the voltage calculating device is used for inputting the output voltage corresponding to the deviation value to the temperature reducing device.
In one embodiment, the voltage calculating device is further configured to obtain the output voltage by using the first adjusting parameter when the deviation value is greater than the first deviation threshold and less than or equal to the second deviation threshold; and under the condition that the deviation value is larger than the second deviation threshold value, obtaining the output voltage by utilizing the second adjusting parameter.
In one embodiment, the main control unit further comprises a voltage limiting device; the voltage amplitude limiting device is respectively connected with the subtraction computing device and the cooling device;
a voltage calculating device for inputting the output voltage to the voltage limiting device;
the voltage amplitude limiting device is used for inputting the output voltage to the temperature reduction device under the condition that the output voltage is greater than the first voltage threshold and less than or equal to the second voltage threshold; under the condition that the output voltage is greater than the second voltage threshold, inputting the second voltage threshold to the temperature reduction device; and under the condition that the output voltage is less than or equal to the first voltage threshold, inputting the first voltage threshold to the temperature reduction device.
In a third aspect, the present application further provides a temperature control device. The device comprises:
the temperature information receiving module is used for receiving the temperature information sent by the temperature acquisition unit; the temperature information is obtained by acquiring resistance information of a thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device;
the temperature change information obtaining module is used for obtaining temperature change information corresponding to the thermosensitive device according to the temperature information;
the output voltage input module is used for inputting the output voltage corresponding to the temperature change information to the temperature reduction device, so that the temperature reduction device adjusts the working mode of the temperature reduction device according to the output voltage to control the temperature of the module to be controlled; the heat dissipation device is located in the cooling area range of the cooling device.
In a fourth aspect, the present application further provides a computer device. The computer device comprises a memory storing a computer program and a processor implementing the following steps when executing the computer program:
receiving temperature information sent by a temperature acquisition unit; the temperature information is obtained by acquiring the resistance information of the thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device; obtaining temperature change information corresponding to the thermosensitive device according to the temperature information; inputting the output voltage corresponding to the temperature change information to a cooling device, and enabling the cooling device to adjust the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled; the heat dissipation device is located in the cooling area of the cooling device.
In a fifth aspect, the present application further provides a computer-readable storage medium. The computer-readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of:
receiving temperature information sent by a temperature acquisition unit; the temperature information is obtained by acquiring the resistance information of the thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device; obtaining temperature change information corresponding to the thermosensitive device according to the temperature information; inputting the output voltage corresponding to the temperature change information to a cooling device, and enabling the cooling device to adjust the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled; the heat dissipation device is located in the cooling area of the cooling device.
In a sixth aspect, the present application further provides a computer program product. The computer program product comprising a computer program which when executed by a processor performs the steps of:
receiving temperature information sent by a temperature acquisition unit; the temperature information is obtained by acquiring the resistance information of the thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device; obtaining temperature change information corresponding to the thermosensitive device according to the temperature information; inputting the output voltage corresponding to the temperature change information to a cooling device, and enabling the cooling device to adjust the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled; the heat dissipation device is located in the cooling area of the cooling device.
The temperature control method, the temperature control system, the temperature control device, the computer equipment, the storage medium and the computer program product receive temperature information sent by the temperature acquisition unit, the temperature information is acquired by the temperature acquisition unit through resistance information of a thermosensitive device, the thermosensitive device is arranged in a module to be controlled and the module to be controlled is arranged in a heat dissipation device, temperature change information corresponding to the thermosensitive device is acquired according to the temperature information, output voltage corresponding to the temperature change information is input to the temperature reduction device, the temperature reduction device adjusts the working mode of the temperature reduction device according to the output voltage to control the temperature of the module to be controlled, and the heat dissipation device is located in the temperature reduction area range of the temperature reduction device. The scheme includes that a temperature acquisition unit acquires resistance information of a thermosensitive device and sends the temperature information corresponding to the resistance information to a main control unit, the main control unit obtains temperature change information corresponding to the thermosensitive device according to the received temperature information and inputs output voltage corresponding to the temperature change information to a cooling device, and the cooling device adjusts the working mode of the cooling device according to the output voltage to control the temperature of a module to be controlled, so that the accuracy of controlling the temperature of the module to be controlled is improved.
Drawings
FIG. 1 is a diagram of an exemplary temperature control method;
FIG. 2 is a diagram of an environment in which a temperature control method according to another embodiment is applied;
FIG. 3 is a schematic diagram of a circuit for collecting resistance information of a thermosensitive device in one embodiment;
FIG. 4 is a temperature profile, a slope profile, and a wind speed profile of a temperature control method in one embodiment;
FIG. 5 is a schematic flow chart of a temperature control method according to an embodiment;
FIG. 6 is a block diagram showing the structure of a temperature control device according to an embodiment;
FIG. 7 is a diagram illustrating an internal structure of a computer device according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The temperature control method provided by the application can be applied to the application environment shown in fig. 1. The application scenario may include: the temperature acquisition unit and the main control unit can be in communication connection, and the main control unit and the cooling device can be in communication connection. Specifically, the temperature acquisition unit acquires resistance information of the thermosensitive device and sends temperature information corresponding to the resistance information to the main control unit; the main control unit obtains temperature change information corresponding to the thermosensitive device according to the received temperature information, and inputs output voltage corresponding to the temperature change information to the cooling device; and the cooling device adjusts the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled. The temperature acquisition unit may be, but is not limited to, a device that can detect resistance information (e.g., resistance value) of a thermosensitive device (which may be a thermistor, such as a negative temperature coefficient thermistor) and convert the resistance information into temperature information (e.g., temperature value); the main control unit can be but is not limited to various main control microcomputers, terminals, personal computers, notebook computers, tablet computers and servers; the cooling device may be, but is not limited to, a fan (e.g., a speed-adjustable fan, which may have a pwm control connection port, and may adjust the rotation speed output by the fan in real time).
In one embodiment, there is provided a temperature control system, referring to fig. 1, comprising: the temperature control device comprises a main control unit, a temperature acquisition unit, a thermosensitive device and a cooling device; the thermosensitive device is arranged in the module to be controlled, the module to be controlled is arranged in the heat dissipation device, and the heat dissipation device is positioned in the cooling area of the cooling device; the main control unit is respectively connected with the temperature acquisition unit and the cooling device, and the temperature acquisition unit is also connected with the thermosensitive device;
the temperature acquisition unit is used for acquiring resistance information of the thermosensitive device and sending temperature information corresponding to the resistance information to the main control unit; the main control unit is used for obtaining temperature change information corresponding to the thermosensitive device according to the received temperature information and inputting output voltage corresponding to the temperature change information to the cooling device; the cooling device is used for adjusting the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled.
Among them, as shown in fig. 2, the thermosensitive device may be a thermistor such as an NTC (negative temperature coefficient thermistor); the module to be controlled can be a module to be temperature controlled, such as an IGBT module (a power module formed by an insulated gate bipolar transistor, the module can greatly reduce the service life when the temperature of the module changes rapidly, and the service life can be effectively prolonged by reducing the temperature change speed of the module); the heat dissipation device may be a device for accelerating heat dissipation of the module to be controlled, such as a heat sink; the cooling area range can be an area range corresponding to the cooling device and capable of effectively providing cooling, for example, when the cooling device is a fan, the cooling area range can refer to an air outlet of the fan, so that air enters the heat dissipation device and the module to be controlled and heat dissipation is accelerated through air outlet; the resistance information may be a resistance value; the temperature information may be a temperature value; the temperature change information may be a slope of the temperature change; the operation mode may be a state in which the temperature reduction device operates according to different voltages, for example, when the temperature reduction device is a fan, the operation mode may refer to a rotation speed of the fan.
Specifically, as shown in fig. 1 and fig. 2, the temperature collecting unit collects resistance information of the thermosensitive device, for example, the temperature collecting unit may collect the resistance information of the thermosensitive device through a circuit (a digital-to-analog conversion circuit of the collecting unit) shown in fig. 3, where VCC (supply voltage) may be 5V voltage, GND may be a ground terminal of an electric wire, R1 may be a resistance with a resistance value of 1K, R2 may be a resistance with a resistance value of 10K, R3 may be a resistance with a resistance value of 10K, V0 may be an output voltage of the sampling circuit, in a case where other parameters are not changed, a value of V0 is determined by the resistance information (real-time resistance value) Rx of the thermosensitive device, a relationship between V0 and Rx may be V0 ═ 5 × 11Rx/(12Rx +10K), the temperature collecting unit may calculate the resistance information Rx of the thermosensitive device through V0 according to the relationship, and use a corresponding relationship between inherent temperature and resistance value of the thermosensitive device, determining the temperature information of the thermosensitive device (the temperature information in the operation time can be shown in figure 4), and sending the temperature information to the main control unit; the main control unit receives the temperature information sent by the temperature acquisition unit, obtains temperature change information corresponding to the thermosensitive device according to the temperature information (the temperature change information can be the slope of temperature change, and the slope of temperature change in operation time can be shown in fig. 4), determines corresponding output voltage according to the temperature change information, and provides the output voltage to the cooling device; the cooling device operates under the driving of the output voltage, and has different operating modes (such as different output powers, e.g., wind speeds in the operating time shown in fig. 4) under the condition of the change of the magnitude of the output voltage, so as to control the temperature of the module to be controlled within the cooling area of the cooling device (for example, the cooling device provides the cooling device with a cooling condition of forced air cooling, so that the module to be controlled in the cooling device performs accelerated heat dissipation).
In the temperature control system, the main control unit receives temperature information sent by the temperature acquisition unit, the temperature information is acquired by the temperature acquisition unit through resistance information of a thermosensitive device and is obtained according to the resistance information, the thermosensitive device is arranged in the module to be controlled, the module to be controlled is arranged in the heat dissipation device, temperature change information corresponding to the thermosensitive device is obtained according to the temperature information, output voltage corresponding to the temperature change information is input into the temperature reduction device, the temperature reduction device adjusts the working mode of the temperature reduction device according to the output voltage so as to control the temperature of the module to be controlled, and the heat dissipation device is located in the temperature reduction area range of the temperature reduction device. The scheme includes that a temperature acquisition unit acquires resistance information of a thermosensitive device and sends the temperature information corresponding to the resistance information to a main control unit, the main control unit obtains temperature change information corresponding to the thermosensitive device according to the received temperature information and inputs output voltage corresponding to the temperature change information to a cooling device, and the cooling device adjusts the working mode of the cooling device according to the output voltage to control the temperature of a module to be controlled, so that the accuracy of controlling the temperature of the module to be controlled is improved.
In one embodiment, as shown in fig. 2, the main control unit includes a variation calculating device, a subtraction calculating device, and a voltage calculating device; the subtraction calculating device is respectively connected with the change calculating device and the voltage calculating device;
the change calculating device is used for taking the slope information corresponding to the received temperature information as the temperature change information corresponding to the thermosensitive device and sending the temperature change information to the subtraction calculating device; the subtraction computing device is used for acquiring temperature change instruction information, subtracting the temperature change instruction information and the temperature change information to obtain an offset value, and sending the offset value to the voltage computing device; and the voltage calculating device is used for inputting the output voltage corresponding to the deviation value to the temperature reducing device.
Wherein, as shown in fig. 2, the variation calculating means may be a differentiator; the subtraction calculation device may be a subtractor; the voltage calculation device may be a PI regulator (proportional integral controller); the slope information may be a slope; the temperature change instruction information may be a temperature change instruction value, such as a target slope, which may be set to 0, and may also be set to a slope of a positive number or a slope of a negative number; the offset value may be the temperature change command information subtracted from the temperature change information.
Specifically, as shown in fig. 2, the change calculating device receives the temperature value sent by the temperature collecting unit, obtains a slope of a corresponding temperature change according to the temperature value, and sends the slope to the subtraction calculating device as temperature change information corresponding to the thermosensitive device; the subtraction computing device receives the temperature change information sent by the change computing device, subtracts the temperature change instruction information from the temperature change information to obtain a deviation value (the deviation value is equivalent to the deviation value between a target slope and an actual slope, if the temperature change instruction information is set to be 0, the temperature of the module to be controlled is kept unchanged or the temperature rise of the module to be controlled is kept at a minimum value, if the temperature change instruction information is set to be a positive number A, the temperature of the module to be controlled rises at the slope of A, and if the temperature change instruction information is set to be a negative number B, the temperature of the module to be controlled falls at the slope of B), and sends the deviation value to the voltage computing device; and the voltage calculation device receives the deviation value sent by the subtraction calculation device, determines corresponding output voltage according to the deviation value, and provides the output voltage to the temperature reduction device.
According to the technical scheme of the embodiment, the output voltage input to the cooling device is determined through the change calculating device, the subtraction calculating device and the voltage calculating device which are arranged in the main control unit, so that the accuracy of controlling the temperature of the module to be controlled is improved.
In one embodiment, the voltage calculating device is further configured to obtain the output voltage by using the first adjusting parameter when the deviation value is greater than the first deviation threshold and less than or equal to the second deviation threshold; and under the condition that the deviation value is larger than the second deviation threshold value, obtaining the output voltage by utilizing the second adjusting parameter.
Wherein the voltage calculating device may be a PI regulator having a control parameter (regulation parameter); the first deviation threshold may be a preset deviation threshold, the second deviation threshold may be a preset deviation threshold, and the first deviation threshold is smaller than the second deviation threshold; the first tuning parameter may be one set of P (proportional) and I (integral) parameters, and the second tuning parameter may be another set of P (proportional) and I (integral) parameters, with the second tuning parameter having a higher tuning speed than the first (e.g., a larger proportional parameter may speed up the tuning, a larger integral constant may reduce the integration effect, and vice versa, the stronger integral tuning may slow the dynamic response).
Specifically, the voltage calculation device receives an offset value sent by the subtraction calculation device, and when the offset value is greater than a first offset threshold and less than or equal to a second offset threshold, internal control parameters of the voltage calculation device are automatically set to a first group of adjustment parameters, and output voltage is obtained by using the first adjustment parameters; and under the condition that the deviation value is greater than the second deviation threshold value, automatically setting the internal control parameters of the voltage calculation device to be a second group of adjusting parameters, and obtaining the output voltage by using the second adjusting parameters.
Illustratively, the voltage calculating device receives the deviation value sent by the subtraction calculating device, and inside the voltage calculating device, the deviation value is respectively subjected to proportional and integral operations, the proportional and integral operations have calculating parameters (first adjusting parameters or second adjusting parameters), the larger the parameter is, the faster the adjusting speed is, the proportional and integral operation results are added to obtain a final operation result, and the final operation result is the output value of the voltage calculating device, i.e., the output voltage.
According to the technical scheme, the voltage calculation device can automatically set different internal regulation parameters under the condition that the deviation value is located in different numerical ranges, so that the deviation value can respond to faster temperature regulation when being larger, the overshoot can be smaller when the deviation value is smaller, and the temperature regulation is more stable, so that the accuracy and the stability of controlling the temperature of the module to be controlled are improved.
In one embodiment, as shown in fig. 2, the main control unit further includes a voltage limiting device; the voltage amplitude limiting device is respectively connected with the subtraction computing device and the cooling device;
the voltage calculation device is used for inputting the output voltage to the voltage amplitude limiting device; the voltage amplitude limiting device is used for inputting the output voltage to the temperature reduction device under the condition that the output voltage is greater than the first voltage threshold and less than or equal to the second voltage threshold; under the condition that the output voltage is larger than a second voltage threshold, inputting the second voltage threshold to the temperature reduction device; and under the condition that the output voltage is less than or equal to the first voltage threshold, inputting the first voltage threshold to the temperature reduction device.
As shown in fig. 2, the voltage limiting device may be a limiter, which may be used to limit the upper limit and the lower limit of the voltage output; the first voltage threshold may be a preset voltage threshold, for example, a rated voltage of the temperature reduction device, which is equivalent to a voltage minimum value, and the first voltage threshold is smaller than the second voltage threshold; the second voltage threshold may be a preset voltage threshold, for example, the highest input voltage of the temperature reduction device is equivalent to the maximum voltage, and a certain margin may also be left to prevent the temperature reduction device from being damaged.
Specifically, the voltage computing device provides an output voltage to the voltage amplitude limiting device, the voltage amplitude limiting device receives the output voltage provided by the voltage computing device, and the output voltage is input to the temperature reduction device under the condition that the output voltage is greater than a first voltage threshold and less than or equal to a second voltage threshold; under the condition that the output voltage is greater than the second voltage threshold, inputting the second voltage threshold to the temperature reduction device; and under the condition that the output voltage is less than or equal to the first voltage threshold, inputting the first voltage threshold to the temperature reduction device.
For example, when the module to be controlled stops operating or the elevator in which the module to be controlled is located stops operating, and the deviation value is lower than a third deviation threshold (the third deviation threshold may be set to be smaller than the first deviation threshold), the third voltage threshold may be substituted for the first voltage threshold, where the third voltage threshold is smaller than the first voltage threshold, for example, the third voltage threshold is set to be 0.
The technical scheme of this embodiment sets up the voltage amplitude limiting device through newly-adding to effective control output voltage is in suitable within range, thereby prolongs the life of cooling device, thereby is favorable to improving the sustainability of the temperature of control module.
In one embodiment, as shown in fig. 5, a temperature control method is provided, which is described by taking the method as an example applied to the main control unit in fig. 1, and includes the following steps:
step S501, temperature information sent by the temperature acquisition unit is received.
The temperature information is obtained by acquiring the resistance information of the thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device.
And step S502, obtaining temperature change information corresponding to the thermosensitive device according to the temperature information.
Step S503, the output voltage corresponding to the temperature change information is input to the cooling device, so that the cooling device adjusts the working mode of the cooling device according to the output voltage to control the temperature of the module to be controlled.
Wherein, the heat dissipation device is positioned in the cooling area range of the cooling device.
The temperature control method comprises the steps of receiving temperature information sent by a temperature acquisition unit, acquiring resistance information of a thermosensitive device by the temperature acquisition unit according to the temperature information, obtaining the temperature information according to the resistance information, arranging the thermosensitive device in a module to be controlled, arranging the module to be controlled in a heat dissipation device, obtaining temperature change information corresponding to the thermosensitive device according to the temperature information, inputting output voltage corresponding to the temperature change information into a cooling device, enabling the cooling device to adjust the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled, and enabling the heat dissipation device to be located in the cooling area range of the cooling device. The scheme includes that a temperature acquisition unit acquires resistance information of a thermosensitive device and sends the temperature information corresponding to the resistance information to a main control unit, the main control unit obtains temperature change information corresponding to the thermosensitive device according to the received temperature information and inputs output voltage corresponding to the temperature change information to a cooling device, and the cooling device adjusts the working mode of the cooling device according to the output voltage to control the temperature of a module to be controlled, so that the accuracy of controlling the temperature of the module to be controlled is improved.
In an embodiment, the method may further include determining an output voltage corresponding to the temperature change information by: acquiring temperature change instruction information; subtracting the temperature change instruction information and the temperature change information to obtain an offset value; and determining the output voltage corresponding to the deviation value as the output voltage corresponding to the temperature change information.
According to the technical scheme of the embodiment, the corresponding output voltage is determined as the output voltage corresponding to the temperature change information through the deviation value obtained by subtracting the temperature change instruction information and the temperature change information, so that the accuracy of controlling the temperature of the module to be controlled is improved.
It should be understood that, although the steps in the flowcharts related to the embodiments as described above are sequentially displayed as indicated by arrows, the steps are not necessarily performed sequentially as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a part of the steps in the flowcharts related to the embodiments described above may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the execution order of the steps or stages is not necessarily sequential, but may be rotated or alternated with other steps or at least a part of the steps or stages in other steps.
Based on the same inventive concept, the embodiment of the present application further provides a temperature control device for implementing the temperature control method. The solution of the problem provided by the apparatus is similar to the solution described in the above method, so the specific limitations in one or more embodiments of the temperature control apparatus provided below can be referred to the limitations of the temperature control method in the above, and are not described herein again.
In one embodiment, as shown in fig. 6, there is provided a temperature control apparatus 600, which may include:
the temperature information receiving module 601 is used for receiving temperature information sent by the temperature acquisition unit; the temperature information is obtained by acquiring resistance information of a thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device;
a temperature change information obtaining module 602, configured to obtain, according to the temperature information, temperature change information corresponding to the thermosensitive device;
an output voltage input module 603, configured to input an output voltage corresponding to the temperature change information to the temperature reduction device, so that the temperature reduction device adjusts a working mode of the temperature reduction device according to the output voltage to control the temperature of the module to be controlled; the heat dissipation device is located in the cooling area range of the cooling device.
In one embodiment, the apparatus 600 further comprises: the output voltage determining module is used for acquiring temperature change instruction information; subtracting the temperature change instruction information and the temperature change information to obtain an offset value; and determining the output voltage corresponding to the deviation value as the output voltage corresponding to the temperature change information.
The modules in the temperature control device can be wholly or partially realized by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 7. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless communication can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer equipment also comprises an input/output interface, wherein the input/output interface is a connecting circuit for exchanging information between the processor and external equipment, and is connected with the processor through a bus, and the input/output interface is called an I/O interface for short. The computer program is executed by a processor to implement a temperature control method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 7 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is further provided, which includes a memory and a processor, the memory stores a computer program, and the processor implements the steps of the above method embodiments when executing the computer program.
In an embodiment, a computer-readable storage medium is provided, on which a computer program is stored which, when being executed by a processor, carries out the steps of the above-mentioned method embodiments.
In an embodiment, a computer program product is provided, comprising a computer program which, when executed by a processor, carries out the steps in the method embodiments described above.
It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) referred to in the present application are information and data authorized by the user or sufficiently authorized by each party.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high-density embedded nonvolatile Memory, resistive Random Access Memory (ReRAM), Magnetic Random Access Memory (MRAM), Ferroelectric Random Access Memory (FRAM), Phase Change Memory (PCM), graphene Memory, and the like. Volatile Memory can include Random Access Memory (RAM), external cache Memory, and the like. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others. The databases referred to in various embodiments provided herein may include at least one of relational and non-relational databases. The non-relational database may include, but is not limited to, a block chain based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, quantum computing based data processing logic devices, etc., without limitation.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (10)

1. A temperature control system, the system comprising: the temperature control device comprises a main control unit, a temperature acquisition unit, a thermosensitive device and a cooling device; the thermosensitive device is arranged in the module to be controlled, the module to be controlled is arranged in the heat dissipation device, and the heat dissipation device is positioned in the cooling area of the cooling device; the main control unit is respectively connected with the temperature acquisition unit and the cooling device, and the temperature acquisition unit is also connected with the thermosensitive device;
the temperature acquisition unit is used for acquiring resistance information of the thermosensitive device and sending temperature information corresponding to the resistance information to the main control unit;
the main control unit is used for obtaining temperature change information corresponding to the thermosensitive device according to the received temperature information and inputting output voltage corresponding to the temperature change information to the cooling device;
and the cooling device is used for adjusting the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled.
2. The system of claim 1, wherein the master control unit comprises a change calculating device, a subtraction calculating device, and a voltage calculating device; the subtraction calculation device is respectively connected with the change calculation device and the voltage calculation device;
the change calculating device is used for taking the slope information corresponding to the received temperature information as the temperature change information corresponding to the thermosensitive device and sending the temperature change information to the subtraction calculating device;
the subtraction computing device is used for acquiring temperature change instruction information, subtracting the temperature change instruction information and the temperature change information to obtain an offset value, and sending the offset value to the voltage computing device;
and the voltage calculation device is used for inputting the output voltage corresponding to the deviation value to the temperature reduction device.
3. The system of claim 2, wherein the voltage calculating device is further configured to obtain the output voltage by using a first adjustment parameter if the deviation value is greater than a first deviation threshold and less than or equal to a second deviation threshold; and under the condition that the deviation value is larger than the second deviation threshold value, obtaining the output voltage by using a second adjusting parameter.
4. The system of claim 2, wherein the master control unit further comprises a voltage limiting device; the voltage amplitude limiting device is respectively connected with the subtraction computing device and the cooling device;
the voltage calculating device is used for inputting the output voltage to the voltage limiting device;
the voltage amplitude limiting device is used for inputting the output voltage to the temperature reduction device under the condition that the output voltage is greater than a first voltage threshold and less than or equal to a second voltage threshold; under the condition that the output voltage is larger than the second voltage threshold, inputting the second voltage threshold to the temperature reduction device; and under the condition that the output voltage is less than or equal to the first voltage threshold, inputting the first voltage threshold to the temperature reduction device.
5. A method of temperature control, the method comprising:
receiving temperature information sent by a temperature acquisition unit; the temperature information is obtained by acquiring resistance information of a thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device;
obtaining temperature change information corresponding to the thermosensitive device according to the temperature information;
inputting output voltage corresponding to the temperature change information to the cooling device, and enabling the cooling device to adjust the working mode of the cooling device according to the output voltage so as to control the temperature of the module to be controlled; the heat dissipation device is located in the cooling area range of the cooling device.
6. The method of claim 5, after obtaining information about temperature variation corresponding to the thermosensitive device according to the temperature information, further comprising:
acquiring temperature change instruction information;
subtracting the temperature change instruction information and the temperature change information to obtain an offset value;
and determining the output voltage corresponding to the deviation value as the output voltage corresponding to the temperature change information.
7. A temperature control apparatus, characterized in that the apparatus comprises:
the temperature information receiving module is used for receiving the temperature information sent by the temperature acquisition unit; the temperature information is obtained by acquiring resistance information of a thermosensitive device by the temperature acquisition unit according to the resistance information; the thermosensitive device is arranged in the module to be controlled, and the module to be controlled is arranged in the heat dissipation device;
the temperature change information obtaining module is used for obtaining temperature change information corresponding to the thermosensitive device according to the temperature information;
the output voltage input module is used for inputting the output voltage corresponding to the temperature change information to the temperature reduction device, so that the temperature reduction device adjusts the working mode of the temperature reduction device according to the output voltage to control the temperature of the module to be controlled; the heat dissipation device is located in the cooling area range of the cooling device.
8. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor realizes the steps of the method of any of claims 5 to 6 when executing the computer program.
9. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 5 to 6.
10. A computer program product comprising a computer program, characterized in that the computer program realizes the steps of the method of any one of claims 5 to 6 when executed by a processor.
CN202210758741.0A 2022-06-30 2022-06-30 Temperature control method, system, apparatus, computer device, medium and product Pending CN114967791A (en)

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CN101201636A (en) * 2007-07-27 2008-06-18 吉林大学 High-stability thermostatic controller
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CN106970692A (en) * 2017-03-31 2017-07-21 紫光华山信息技术有限公司 Rotation speed of the fan adjusting method and device
CN112649109A (en) * 2020-12-22 2021-04-13 日立电梯(中国)有限公司 Device and method for judging running state of radiating fan of frequency converter

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Publication number Priority date Publication date Assignee Title
CN101201636A (en) * 2007-07-27 2008-06-18 吉林大学 High-stability thermostatic controller
CN202301122U (en) * 2011-10-14 2012-07-04 杭州晟汗电子技术有限公司 Control system for direct current fan
CN103883642A (en) * 2014-04-16 2014-06-25 奇瑞汽车股份有限公司 Control method and device for clutch oil pressure
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