CN114957916A - Curable resin system, insulating material, preparation method and application thereof - Google Patents
Curable resin system, insulating material, preparation method and application thereof Download PDFInfo
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- CN114957916A CN114957916A CN202210584481.XA CN202210584481A CN114957916A CN 114957916 A CN114957916 A CN 114957916A CN 202210584481 A CN202210584481 A CN 202210584481A CN 114957916 A CN114957916 A CN 114957916A
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The invention belongs to the technical field of insulating materials, and particularly relates to a curable resin system, an insulating material, and preparation methods and applications thereof. The curable resin system provided by the invention comprises a component A and a component B, wherein the component A is epoxy resin, and the component B is a curing agent; the epoxy resin comprises bisphenol A type epoxy resin, novolac epoxy resin and isocyanic acid modified epoxy resin; the curing agent comprises one or more of dihydrodiamine and diaminodiphenyl sulfone, and the insulating material provided by the invention comprises a curable resin system, a filler and a reinforcing material. The embodiment result shows that the insulating material prepared by the curable resin system provided by the invention has good toughness and heat resistance, the glass transition temperature is more than 150 ℃, the 5% thermal decomposition temperature is more than 310 ℃, the cost is reduced by more than 30%, and the insulating material has the characteristic of strong dielectric property.
Description
Technical Field
The invention belongs to the technical field of insulating materials, and particularly relates to a curable resin system, an insulating material, and preparation methods and applications thereof.
Background
The electronic insulating board is a material with higher performance requirement in the insulating board, and mainly reflects the requirements on dielectric performance and heat resistance. The electronic insulating board mainly comprises a base body and a reinforcing material, wherein the commonly used reinforcing material is glass fiber which has good insulativity, strong heat resistance, good corrosion resistance and high mechanical strength, but has higher brittleness. When the electronic insulating board is manufactured, the resin system needs to be diluted to be low in viscosity, so that the resin system can easily penetrate among the glass fibers and can be soaked on the glass fibers, and then the molded electronic insulating board has very high strength through the procedures of baking, cutting, laminating, curing and the like. The glass transition temperature of the cured resin can directly influence the applicable scenes of the electronic insulating plate, while the glass transition temperature of the common cured epoxy resin is 110-115 ℃, but some application scenes such as generator sets, high-speed rail tops and the like require the glass transition temperature of the insulating material to be not lower than 135 ℃.
The prior insulating material system adds alicyclic diamine cross-linking agent for improving the glass transition temperature, but the alicyclic diamine cross-linking agent reacts too fast in the baking process and is not suitable for the processing characteristics of an electronic insulating board, the baking in the technical process can not control the gel time of a semi-cured product, and the finished product is not convenient to control in the hot press molding stage.
The composite material industry has a plurality of reports about insulating material systems, but the composite material has defects in heat resistance, and cannot meet the requirement of high-temperature use in the long-term operation process; researchers also match an oxazine structure or multifunctional epoxy resin in an insulating material system to improve the crosslinking density of the material and improve the glass transition temperature of the material to a certain extent, but the obtained material has high brittleness, and the brittleness is more obvious particularly in a low-temperature or frequent cold and hot alternation environment.
Disclosure of Invention
The insulating material prepared by the curable resin system has good toughness and heat resistance, the glass transition temperature is more than 150 ℃, the 5% thermal decomposition temperature is more than 310 ℃, and the cost is reduced by more than 30%.
In order to achieve the above purpose, the invention provides the following technical scheme:
the invention provides a curable resin system which comprises a component A and a component B, wherein the component A is epoxy resin, and the component B is a curing agent; the epoxy resin comprises bisphenol A type epoxy resin, novolac epoxy resin and isocyanic acid modified epoxy resin; the curing agent comprises one or more of dihydrodiamine and diamino diphenyl sulfone.
Preferably, the mass ratio of the epoxy resin to the curing agent is 85-95: 5 to 10.
Preferably, the content of the bisphenol A type epoxy resin in the epoxy resin is not less than 40 wt%, the content of the novolac epoxy resin is not less than 20 wt%, and the content of the isocyanate modified epoxy resin is not less than 10 wt%.
Preferably, when the curing agent includes a dihydrodiamine and a diaminodiphenyl sulfone, the content of the dihydrodiamine in the curing agent is not less than 90 wt%, and the content of the diaminodiphenyl sulfone is not less than 5 wt%.
Preferably, the epoxy equivalent of the bisphenol A epoxy resin is 450-500 g/eq, the epoxy equivalent of the novolac epoxy resin is 200-230 g/eq, and the epoxy equivalent of the isocyanic acid modified epoxy resin is 270-310 g/eq; the active hydrogen equivalent of the dihydrodiamine is 15-25 g/eq, and the active hydrogen equivalent of the diamino diphenyl sulfone is 60-65 g/eq.
Preferably, the structural formula of the bisphenol A type epoxy resin is as follows:
preferably, the novolac epoxy resin has a structural formula:
preferably, the structural formula of the isocyanate modified epoxy resin is as follows:
wherein n is 1 、n 2 And n 3 Is the degree of polymerization of the epoxy resin, said n 1 The value range of (A) is preferably 1-20, and more preferably 3-15; n is 2 The value range of (a) is preferably 2-25, and more preferably 7-20; n is 3 The value range of (a) is preferably 1 to 50, more preferably 10 to 40, and further preferably 20 to 30.
The invention also provides an insulating material which comprises a reinforcing material and an insulating resin layer coated on the surface of the reinforcing material, wherein the insulating resin layer is prepared from the curable resin system and the filler.
The invention also provides a preparation method of the insulating material, which comprises the following steps:
(1) mixing epoxy resin and a good solvent to obtain an epoxy solution;
(2) mixing a curing agent and a good solvent to obtain a curing agent solution;
(3) mixing the epoxy solution, the curing agent solution and the filler, and then carrying out curing reaction to obtain a mixed solution;
(4) loading the mixed solution on a reinforcing material and then drying to obtain an insulating material;
the step (1) and the step (2) have no requirement of time sequence.
Preferably, the temperature of the curing reaction is 45-55 ℃; the time of the curing reaction is not less than 5 h.
The invention also provides application of the insulating material prepared by the scheme or the preparation method in the scheme in the fields of insulation, fire prevention, humidity and heat resistance and extra-high voltage.
The invention provides a curable resin system which comprises a component A and a component B, wherein the component A is epoxy resin, and the component B is a curing agent; the epoxy resin comprises bisphenol A type epoxy resin, novolac epoxy resin and isocyanic acid modified epoxy resin; the curing agent comprises one or more of dihydrodiamine and diamino diphenyl sulfone. The raw materials of the curable resin system provided by the invention are easy to obtain, the cost is low, and the insulating material prepared by the curable resin system has good toughness, good heat resistance and high glass transition temperature.
The invention also provides an insulating material which comprises a reinforcing material and an insulating resin layer coated on the surface of the reinforcing material, wherein the insulating resin layer is prepared from the curable resin system and the filler. The insulating material provided by the invention has the characteristics of good toughness, good heat resistance, glass transition temperature of more than 150 ℃, 5% thermal decomposition temperature of more than 310 ℃, cost reduction of more than 30%, and strong dielectric property.
The invention also provides a preparation method of the insulating material. The preparation method provided by the invention constructs the novel epoxy resin on the basic epoxy resin. The preparation method provided by the invention has simple steps, does not change the original process conditions, further reduces the cost on the basis of ensuring high performance, controls the cost at a lower level, and has the prospect of large-scale industrial production.
The invention also provides application of the insulating material prepared by the scheme or the preparation method in the scheme in the fields of insulation, fire prevention, humidity and heat resistance and extra-high voltage. The insulating material provided by the invention has good toughness and high glass transition temperature, can meet the requirements of the application scenes on the glass transition temperature of the insulating material, and has good applicability in the field of high-end materials.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a process flow of the preparation method and application of the insulating material provided by the present invention.
Detailed Description
The invention provides a curable resin system which comprises a component A and a component B, wherein the component A is epoxy resin, and the component B is a curing agent; the epoxy resin comprises bisphenol A type epoxy resin, novolac epoxy resin and isocyanic acid modified epoxy resin; the curing agent comprises one or more of dihydrodiamine and diamino diphenyl sulfone.
In the invention, the mass ratio of the epoxy resin to the curing agent is preferably 85-95: 5 to 10, more preferably 87 to 93: 6 to 9, and more preferably 89 to 92: 7-9; the content of the bisphenol A type epoxy resin in the epoxy resin is preferably not less than 40 wt%, more preferably 40 wt% to 65 wt%, and further preferably 40 wt% to 55 wt%; the epoxy equivalent of the bisphenol A epoxy resin is preferably 450-500 g/eq, more preferably 460-490 g/eq; the content of the novolac epoxy resin in the epoxy resin is preferably not less than 20 wt%, more preferably 20 wt% to 45 wt%, and further preferably 20 wt% to 35 wt%; the epoxy equivalent of the novolac epoxy resin is preferably 200-230 g/eq, and more preferably 210-220 g/eq; the content of the isocyanate modified epoxy resin in the epoxy resin is preferably not less than 10 wt%, more preferably 10 wt% to 30 wt%, and still more preferably 10 wt% to 20 wt%; the epoxy equivalent of the isocyanate modified epoxy resin is preferably 270 to 310g/eq, and more preferably 280 to 300 g/eq.
In the present invention, the structural formula of the bisphenol a type epoxy resin is preferably:
the structural formula of the novolac epoxy resin is preferably as follows:
the structural formula of the isocyanate modified epoxy resin is preferably as follows:
wherein n is 1 、n 2 And n 3 Refers to the degree of polymerization of the epoxy resin, n 1 The value range of (A) is preferably 1-20, and more preferably 3-15; n is 2 The value range of (a) is preferably 2-25, and more preferably 7-20; n is 3 The value range of (a) is preferably 1 to 50, more preferably 10 to 40, and further preferably 20 to 30.
In the present invention, when the curing agent includes dihydrodiamine and diaminodiphenyl sulfone, the content of dihydrodiamine in the curing agent is preferably not less than 90 wt%, more preferably 90 wt% to 94 wt%, and further preferably 91 wt% to 93 wt%; the content of the diamino diphenyl sulfone is preferably not less than 5 wt%, more preferably 5 wt% to 9 wt%, and further preferably 6 wt% to 8 wt%; the active hydrogen equivalent of the dihydrodiamine is preferably 15-25 g/eq, and more preferably 21-23 g/eq; the active hydrogen equivalent of the diamino diphenyl sulfone is preferably 60-65 g/eq, and more preferably 62.1-63 g/eq.
In the present invention, the structural formula of the dihydrodiamine is preferably:
the formula of the diamino diphenyl sulfone is preferably as follows:
the invention also provides an insulating material which comprises a reinforcing material and an insulating resin layer coated on the surface of the reinforcing material, wherein the insulating resin layer is prepared from the curable resin system and the filler.
In the invention, the filler preferably comprises one or more of silicon dioxide, mica powder, silicon micropowder, aluminum hydroxide and talcum powder; the silicon micro powder preferably comprises one or more of crystalline silicon micro powder and fused silicon micro powder; the reinforcing material preferably comprises one or more of glass fiber cloth, carbon fiber cloth and aramid fiber cloth; the glass fiber cloth is preferably 7628 glass fiber cloth. The invention can improve the insulating property of the material by adding the non-metal oxide, and can improve the relative tracking index of the material by adding the metal hydroxide.
The invention also provides a preparation method of the insulating material, which comprises the following steps:
(1) mixing epoxy resin and a good solvent to obtain an epoxy solution;
(2) mixing a curing agent and a good solvent to obtain a curing agent solution;
(3) mixing the epoxy solution, the curing agent solution and the filler, and then carrying out curing reaction to obtain a mixed solution;
(4) loading the mixed solution on a reinforcing material and then drying to obtain an insulating material;
the step (1) and the step (2) have no requirement of time sequence.
The epoxy resin and the good solvent are mixed to obtain the epoxy solution. In the present invention, the good solvent of the epoxy resin preferably includes one or more of 2-butanone (MEK) and propylene glycol methyl ether; the concentration of the epoxy solution is preferably not more than 90 wt%, more preferably 70 wt% to 85 wt%.
The invention mixes the curing agent and good solvent to obtain curing agent solution. In the present invention, the good solvent of the curing agent preferably includes one or more of propylene glycol methyl ether acetate (PMA) and propylene glycol methyl ether; the concentration of the curing agent solution is preferably 5 to 15 wt%, more preferably 7.5 to 12 wt%.
After the epoxy solution and the curing agent solution are obtained, the epoxy solution, the curing agent solution and the filler are mixed and then subjected to curing reaction to obtain a mixed solution. In the invention, the mass ratio of the epoxy solution to the filler is preferably 2-5: 1; more preferably 2.5 to 4.5: 1; more preferably 2.8 to 3.6: 1. in the invention, the temperature of the curing reaction is preferably 45-55 ℃, more preferably 47-52 ℃, and further preferably 49-51 ℃; the time of the curing reaction is preferably not less than 5 hours, more preferably 5 to 20 hours, and further preferably 5 to 10 hours.
And after obtaining a mixed solution, loading the mixed solution on a reinforcing material, and drying to obtain the insulating material. In the present invention, the loading preferably includes immersing the reinforcing material in the mixed liquid or roll-coating the mixed liquid on the surface of the reinforcing material; the material-liquid ratio of the reinforcing material to the mixed liquid is preferably 4-6: 6; more preferably 4 to 5.5: 6; further preferably 4.2 to 5.2: 6; the dipping time is preferably not less than 3min, and more preferably 4-6 min; the drying is preferably baking; the baking temperature is preferably 172-180 ℃, and more preferably 175-178 ℃; the baking time is preferably not less than 3min, and more preferably 3-4 min. In the present invention, after the drying, the obtained insulating material is preferably cut to a size corresponding to the size of the material to be treated.
The invention also provides application of the insulating material prepared by the scheme or the preparation method in the scheme in the fields of insulation, fire prevention, humidity and heat resistance and extra-high voltage. In the present invention, the method of application preferably comprises: coating the insulating material on the surface of a material to be processed, and then pressing and forming; the press-forming temperature is preferably 170-200 ℃, and more preferably 175-190 ℃; the press-forming time is preferably 20-50 min, and more preferably 30-40 min; the material to be treated comprises any common material in the fields of insulation, fire protection, humidity and heat resistance and extra-high voltage.
In order to further illustrate the invention, the following detailed description of the embodiments of the invention is given with reference to the accompanying drawings and examples, which are not to be construed as limiting the scope of the invention.
Fig. 1 is a process flow of the preparation method and application of the insulating material provided by the invention. The invention firstly dissolves bisphenol A epoxy resin, novolac epoxy resin and isocyanic acid modified epoxy resin in MEK to obtain epoxy solution, and dissolves dihydrodiamine and diamino diphenyl sulfone in PMA to obtain curing agent solution, then mixes and cures the obtained epoxy solution and curing agent solution, and then carries out tabletting, namely dipping, drying and cutting, and finally carries out press-molding.
Example 1
(1) Mixing 50g of bisphenol A epoxy resin, 20g of novolac epoxy resin, 10g of isocyanic acid modified epoxy resin and 20g of MEK to obtain an epoxy solution;
(2) 2.4g of dihydrodiamine, 0.4g of diamino diphenyl sulfone and 20g of PMA are mixed to obtain a curing agent solution;
(3) mixing the epoxy solution, the curing agent solution, 15g of silicon dioxide and 15g of aluminum hydroxide, and then curing and reacting at 20 ℃ for 10 hours to obtain a mixed solution;
(4) soaking 7628 glass fiber 20g in the mixed solution for 6min, baking at 175 deg.C for 4min, and cutting to 30mm × 30mm to obtain insulating material;
(5) and covering the insulating material on the surface of the material to be processed, and then pressing and molding the insulating material and the material to be processed at 180 ℃ for 30 min.
Example 2
(1) Mixing 52g of bisphenol A epoxy resin, 19g of novolac epoxy resin, 9g of isocyanic acid modified epoxy resin and 22g of MEK to obtain an epoxy solution;
(2) 2.3g of dihydrodiamine, 0.5g of diamino diphenyl sulfone and 21g of PMA are mixed to obtain a curing agent solution;
(3) mixing the epoxy solution, the curing agent solution, 15g of silicon dioxide and 15g of aluminum hydroxide, and curing at 40 ℃ for 5 hours to obtain a mixed solution;
(4) soaking 7628 glass fiber 22g in the mixed solution for 5min, baking at 175 deg.C for 4min, and cutting to 30mm × 30mm to obtain insulating material;
(5) and coating the insulating material on the surface of the material to be treated, and then pressing and molding the insulating material and the material to be treated at 180 ℃ for 30 min.
Example 3
(1) Mixing 40g of bisphenol A epoxy resin, 24g of novolac epoxy resin, 13g of isocyanate modified epoxy resin and 20g of MEK (methyl ethyl ketone) to obtain an epoxy solution;
(2) 2.3g of dihydrodiamine, 0.5g of diamino diphenyl sulfone and 23g of PMA are mixed to obtain a curing agent solution;
(3) mixing the epoxy solution, the curing agent solution, 15g of silicon dioxide and 15g of aluminum hydroxide, and curing at 30 ℃ for 8 hours to obtain a mixed solution;
(4) soaking 7628 glass fiber 24g in the mixed solution for 6min, baking at 175 deg.C for 4min, and cutting to 35mm × 30mm to obtain insulating material;
(5) and covering the insulating material on the surface of the material to be processed, and then pressing and molding the insulating material and the material to be processed at 180 ℃ for 30 min.
Example 4
(1) Mixing 51g of bisphenol A epoxy resin, 22g of novolac epoxy resin, 14g of isocyanic acid modified epoxy resin and 22g of MEK to obtain an epoxy solution;
(2) 2.4g of dihydrodiamine, 0.3g of diamino diphenyl sulfone and 21g of PMA are mixed to obtain a curing agent solution;
(3) mixing the epoxy solution, the curing agent solution, 15g of silicon dioxide and 15g of aluminum hydroxide, and curing at 20 ℃ for 15h to obtain a mixed solution;
(4) soaking 7628 glass fiber 16g in the mixed solution for 4min, baking at 175 deg.C for 4min, and cutting into 22mm × 30mm to obtain insulating material;
(5) and covering the insulating material on the surface of the material to be processed, and then pressing and molding the insulating material and the material to be processed at 180 ℃ for 30 min.
Measurement of glass transition temperature T of the insulating materials obtained in examples 1 to 4 by DSC differential scanning calorimeter g The detection method comprises the following steps: taking the materials obtained in the press-molding in the embodiment 1-4 to prepare samples, respectively heating the samples from 25 ℃ to 220 ℃ at a ramp rate of 10 ℃/min, preserving heat at 220 ℃ for 3min, then cooling the samples to 25 ℃ at a ramp rate of 10 ℃/min, preserving heat at 25 ℃ for 3min, repeating the operation once again, and determining T from a second heating section g Initiation and T g The results are shown in Table 1.
TABLE 1 glass transition temperatures of insulating materials of examples 1 to 4
| Test items | Example 1 | Example 2 | Example 3 | Example 4 |
| DSC glass transition temperature/. degree.C | 153 | 152 | 156 | 151 |
As can be seen from Table 1, the insulating material prepared by the invention has the glass transition temperature of more than 150 ℃ and high glass transition temperature, and can meet the performance requirements of the insulating material in the insulating field, the fireproof field, the damp and hot resistant field and the extra-high voltage field.
The thermogravimetric analyzer of the insulating material obtained in examples 1 to 4 was used to determine the thermal weight loss temperature (5%), and the detection method was: controlling the nitrogen flow, the balance flow is 40mL/min, the sample flow is 60mL/min, and the temperature control program is as follows: the detection temperature is 25-400 ℃, the heating rate is 10 ℃/min, and the results are shown in Table 2.
TABLE 2 temperature of thermal weight loss of the insulating materials obtained in examples 1 to 4 (5%)
| Test items | Example 1 | Example 2 | Example 3 | Example 4 |
| TGA thermal weight loss temperature (5%)/. deg.C | 312 | 311 | 316 | 313 |
As can be seen from table 2, the thermal weight loss temperature (5%) of the insulation material prepared by the present invention is greater than 310 ℃, and it can be seen that the insulation material provided by the present invention has excellent heat resistance.
The insulating materials obtained in examples 1 to 4 were subjected to a bending strength performance test using a novel electronic tensile testing machine. The detection method comprises the following steps: according to the specification of 1mm, the middle width is 6mm, the length is 115mm, and the height of a proper clamp and the height of a sample are adjusted by using a quick up-down device and a quick down device and then are fixed; confirming that the distance between two gauge marks at the measuring position in the clamp is 25 mm; and pressing a processing key and an input key in sequence, inputting relevant parameters of the sample, storing the parameters, entering a data processing form, and directly exporting a result after pressing a report key to operate. The results are shown in Table 3.
TABLE 3 flexural Strength of insulating Material obtained in examples 1 to 4
As can be seen from Table 3, the bending strength of the insulation material prepared by the invention is obviously improved, and the bending strength is not lower than 307N, so that the toughness of the insulation material provided by the invention is good.
The embodiment shows that the insulating material provided by the invention has good toughness and heat resistance, the glass transition temperature is more than 150 ℃, the thermal decomposition temperature (5%) is more than 310 ℃, the cost is reduced by more than 30%, and the insulating material has the characteristic of strong dielectric property and can be used in the fields of insulation, fire prevention, humidity and heat resistance and extra-high voltage.
Although the above embodiments have been described in detail, they are only a part of the embodiments of the present invention, not all of the embodiments, and other embodiments can be obtained without inventive step according to the embodiments, and all of the embodiments belong to the protection scope of the present invention.
Claims (10)
1. A curable resin system is characterized by comprising a component A and a component B, wherein the component A is epoxy resin, and the component B is a curing agent; the epoxy resin comprises bisphenol A type epoxy resin, novolac epoxy resin and isocyanic acid modified epoxy resin; the curing agent comprises one or more of dihydrodiamine and diamino diphenyl sulfone.
2. The curable resin system according to claim 1, wherein the mass ratio of the epoxy resin to the curing agent is 85-95: 5 to 10.
3. The curable resin system of claim 1, wherein the epoxy resin comprises not less than 40 wt% of bisphenol a epoxy resin, not less than 20 wt% of novolac epoxy resin, and not less than 10 wt% of isocyanate-modified epoxy resin.
4. The curable resin system of claim 1, wherein when the curing agent comprises a dihydrodiamine and a diaminodiphenyl sulfone, the content of the dihydrodiamine in the curing agent is not less than 90 wt% and the content of the diaminodiphenyl sulfone is not less than 5 wt%.
5. The curable resin system according to claim 1, wherein the epoxy equivalent of the bisphenol a epoxy resin is 450 to 500g/eq, the epoxy equivalent of the novolac epoxy resin is 200 to 230g/eq, and the epoxy equivalent of the isocyanate-modified epoxy resin is 270 to 310 g/eq;
the active hydrogen equivalent of the dihydrodiamine is 15-25 g/eq, and the active hydrogen equivalent of the diamino diphenyl sulfone is 60-65 g/eq.
6. The curable resin system of claim 1, wherein the bisphenol a epoxy resin has the formula:
the structural formula of the novolac epoxy resin is as follows:
the structural formula of the isocyanate modified epoxy resin is as follows:
wherein n is 1 、n 2 And n 3 Is the degree of polymerization of the epoxy resin, said n 1 The value range of (A) is preferably 1-20, and more preferably 3-15; n is 2 The value range of (a) is preferably 2-25, and more preferably 7-20; n is 3 The value range of (a) is preferably 1 to 50, more preferably 10 to 40, and further preferably 20 to 30.
7. An insulating material comprising a reinforcing material and an insulating resin layer coated on the surface of the reinforcing material, wherein the insulating resin layer is prepared from the curable resin system of claims 1-6 and a filler.
8. A method of making the insulation of claim 7, comprising the steps of:
(1) mixing epoxy resin and a good solvent to obtain an epoxy solution;
(2) mixing a curing agent and a good solvent to obtain a curing agent solution;
(3) mixing the epoxy solution, the curing agent solution and the filler, and then carrying out curing reaction to obtain a mixed solution;
(4) loading the mixed solution on a reinforcing material and then drying to obtain an insulating material;
the step (1) and the step (2) have no requirement of time sequence.
9. The preparation method according to claim 8, wherein the temperature of the curing reaction is 45-55 ℃; the time of the curing reaction is not less than 5 h.
10. The insulating material according to claim 7 or the insulating material prepared by the preparation method according to any one of claims 8 to 9 is applied to the fields of insulation, fire protection, humidity and heat resistance and extra-high voltage.
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| CN116041670A (en) * | 2022-12-20 | 2023-05-02 | 江苏扬农锦湖化工有限公司 | Acid modified epoxy resin and preparation method and application thereof |
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| CN102898780A (en) * | 2011-07-28 | 2013-01-30 | 聚鼎科技股份有限公司 | Heat-conductive electrical insulating polymer and radiating substrate containing heat-conductive electrical insulating polymer |
| CN104119639A (en) * | 2013-04-24 | 2014-10-29 | 台光电子材料(昆山)有限公司 | Halogen-free resin composition, and copper foil substrate and printed circuit board applying it |
| CN106166874A (en) * | 2016-06-29 | 2016-11-30 | 上海南亚覆铜箔板有限公司 | Halogen-free copper-clad plate and preparation method thereof |
| CN107236257A (en) * | 2017-07-05 | 2017-10-10 | 无锡宏仁电子材料科技有限公司 | A kind of resistance to CAF, high Tg, high heat resistant resin composition for automobile copper-clad plate |
| CN111534056A (en) * | 2020-04-15 | 2020-08-14 | 浙江华正新材料股份有限公司 | Resin composition, prepreg and laminated board thereof |
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| CN116041670A (en) * | 2022-12-20 | 2023-05-02 | 江苏扬农锦湖化工有限公司 | Acid modified epoxy resin and preparation method and application thereof |
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