CN114956374A - Method for treating hypophosphorous acid in chemical nickel plating wastewater - Google Patents
Method for treating hypophosphorous acid in chemical nickel plating wastewater Download PDFInfo
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- CN114956374A CN114956374A CN202210512451.8A CN202210512451A CN114956374A CN 114956374 A CN114956374 A CN 114956374A CN 202210512451 A CN202210512451 A CN 202210512451A CN 114956374 A CN114956374 A CN 114956374A
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 172
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 85
- 238000007747 plating Methods 0.000 title claims abstract description 74
- 239000002351 wastewater Substances 0.000 title claims abstract description 71
- 239000000126 substance Substances 0.000 title claims abstract description 69
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000006228 supernatant Substances 0.000 claims abstract description 54
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 30
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000011574 phosphorus Substances 0.000 claims abstract description 26
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 26
- 238000001556 precipitation Methods 0.000 claims abstract description 16
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000012279 sodium borohydride Substances 0.000 claims description 11
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000002244 precipitate Substances 0.000 claims description 9
- 229910021645 metal ion Inorganic materials 0.000 claims description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 230000035484 reaction time Effects 0.000 claims description 4
- 239000000920 calcium hydroxide Substances 0.000 claims description 3
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 3
- 238000004062 sedimentation Methods 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- -1 tetrahydroborate Chemical compound 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 230000009467 reduction Effects 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 3
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- RECVMTHOQWMYFX-UHFFFAOYSA-N oxygen(1+) dihydride Chemical compound [OH2+] RECVMTHOQWMYFX-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 239000012716 precipitator Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/70—Treatment of water, waste water, or sewage by reduction
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/52—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
- C02F1/5236—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities using inorganic agents
- C02F1/5245—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities using inorganic agents using basic salts, e.g. of aluminium and iron
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/66—Treatment of water, waste water, or sewage by neutralisation; pH adjustment
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2101/00—Nature of the contaminant
- C02F2101/10—Inorganic compounds
- C02F2101/105—Phosphorus compounds
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2101/00—Nature of the contaminant
- C02F2101/10—Inorganic compounds
- C02F2101/20—Heavy metals or heavy metal compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W10/00—Technologies for wastewater treatment
- Y02W10/30—Wastewater or sewage treatment systems using renewable energies
- Y02W10/37—Wastewater or sewage treatment systems using renewable energies using solar energy
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Removal Of Specific Substances (AREA)
Abstract
The invention discloses a method for treating hypophosphorous acid in chemical nickel plating wastewater, which comprises the following steps: providing chemical nickel plating wastewater containing phosphorous; carrying out primary precipitation treatment on the chemical nickel plating wastewater, and reserving a first supernatant; adding a sufficient amount of reducing agent into the first supernatant, reacting sufficiently to reduce the hypophosphorous acid into elemental phosphorus, and retaining the second supernatant. According to the method for treating the hypophosphorous acid in the chemical nickel plating wastewater, after primary precipitation, the hypophosphorous acid is reduced into a phosphorus simple substance by adopting a reducing agent, and the reduced phosphorus simple substance is separated out from the first supernatant, so that the removal of the hypophosphorous acid in the chemical nickel plating wastewater is realized. The method for treating the hypophosphorous acid in the chemical nickel plating wastewater directly reduces the hypophosphorous acid into phosphorus simple substances to be separated out by a reduction method, thereby omitting the subsequent precipitation step. The method for treating the hypophosphorous acid in the chemical nickel plating wastewater is relatively simple to operate and relatively short in time consumption.
Description
Technical Field
The invention relates to the field of sewage treatment, in particular to a method for treating hypophosphorous acid in chemical nickel plating wastewater.
Background
Electroless nickel plating is a surface treatment technique that deposits a nickel-boron alloy nickel coating on a metal surface by means of the self-redox reaction of an electroless nickel plating solution, which can improve the corrosion resistance and wear resistance of a workpiece.
The reducing agent used in the electroless nickel plating includes sodium hypophosphite, sodium phosphite and the like, which causes the electroless nickel plating waste water generated by the electroless nickel plating to contain a large amount of phosphorus. Generally, phosphorus in electroless nickel plating wastewater is usually in the +1 valence, +2 valence, +3 valence, +4 valence, and is collectively called hypophosphorous acid. Because the hypophosphorous acid can play a role of a buffering agent, the pH adjustment of the chemical nickel plating wastewater is extremely difficult, and the hypophosphorous acid in the chemical nickel plating wastewater needs to be removed firstly in order to fully remove nickel in the chemical nickel plating wastewater.
In the traditional treatment of chemical nickel plating waste water, in order to remove the hypophosphorous acid, the primary precipitation is generally used for primarily removing impurities, then the oxidant is used for oxidizing the hypophosphorous acid in the chemical nickel plating waste water for multiple times, so that the phosphorus is converted into +5 valence to form phosphate radical, and then the precipitator is added to ensure that the phosphate radical is combined with cation to form precipitation, thereby removing the hypophosphorous acid in the chemical nickel plating waste water.
Namely, the traditional chemical nickel plating wastewater needs three steps of primary precipitation, multiple oxidation and precipitation when removing the hypophosphorous acid, and the operation is complex and takes a long time.
Disclosure of Invention
Therefore, it is necessary to provide a method for treating hypophosphorous acid in electroless nickel plating wastewater, which can solve the above problems.
A method for treating hypophosphorous acid in chemical nickel plating wastewater comprises the following steps:
providing chemical nickel plating wastewater containing phosphorous;
carrying out primary sedimentation treatment on the chemical nickel plating wastewater, and reserving a first supernatant; and
adding a sufficient amount of reducing agent to the first supernatant to react sufficiently to reduce the hypophosphorous acid to elemental phosphorus, and retaining a second supernatant.
In one embodiment, the reducing agent is a soluble tetrahydroborate salt.
In one embodiment, the reducing agent is sodium borohydride.
In one embodiment, the molar ratio of the reducing agent to the hypophosphorous acid is 8 to 18: 1.
in one embodiment, the molar ratio of the reducing agent to the hypophosphorous acid is 11 to 13: 1.
in one embodiment, in the operation of adding a sufficient amount of reducing agent to the first supernatant, the reaction temperature is 15 ℃ to 40 ℃.
In one embodiment, in the operation of adding a sufficient amount of reducing agent to the first supernatant, the reaction time is 20min to 120 min.
In one embodiment, the operation of performing primary precipitation treatment on the electroless nickel plating wastewater comprises the following steps: and adjusting the pH value of the chemical nickel plating wastewater to 8-10 through an alkaline substance, so that metal ions in the chemical nickel plating wastewater form precipitates.
In one embodiment, the alkaline substance is at least one of sodium hydroxide, potassium hydroxide, calcium hydroxide, and sodium carbonate.
In one embodiment, the following operation is further included after the operation of retaining the second supernatant: adjusting the pH of the second supernatant to 8-10 by the alkaline substance, so that the metal ions in the second supernatant form a precipitate.
According to the method for treating the hypophosphorous acid in the chemical nickel plating wastewater, after primary precipitation, the hypophosphorous acid is reduced into a phosphorus simple substance by adopting a reducing agent, and the reduced phosphorus simple substance is separated out from the first supernatant, so that the removal of the hypophosphorous acid in the chemical nickel plating wastewater is realized.
Compared with the traditional method for removing the hypophosphorous acid in the chemical nickel plating wastewater by oxidation, the method for treating the hypophosphorous acid in the chemical nickel plating wastewater directly reduces the hypophosphorous acid into phosphorus simple substances to be separated out by a reduction method, thereby omitting the subsequent precipitation step. The method for treating the hypophosphorous acid in the chemical nickel plating wastewater is relatively simple to operate and relatively short in time consumption.
By combining the data in the specific embodiment part of the specification, the concentrations of nickel and phosphorus in the wastewater treated by the method for treating the hypophosphorous acid in the electroless nickel plating wastewater are both below 0.5mg/L and meet the relevant standards.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
FIG. 1 is a flowchart of a method for treating phosphorous in electroless nickel plating wastewater according to an embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One embodiment of the method for treating hypophosphorous acid in electroless nickel plating wastewater shown in fig. 1 comprises the following steps:
s10, providing the chemical nickel plating wastewater containing the phosphorous.
The reducing agent used in the electroless nickel plating comprises sodium hypophosphite, sodium phosphite and the like, so that the wastewater generated by the electroless nickel plating contains a large amount of phosphorus.
Generally, phosphorus in electroless nickel plating wastewater is usually in the +1 valence, +2 valence, +3 valence, +4 valence, and is collectively called hypophosphorous acid.
S20, carrying out primary sedimentation treatment on the chemical nickel plating wastewater, and reserving a first supernatant.
The primary precipitation treatment is mainly used for primarily removing impurities from the chemical nickel plating wastewater, so that the concentration of metal particles in the chemical nickel plating wastewater is reduced, and the subsequent large consumption of a reducing agent is avoided.
Generally, the operation of primary precipitation treatment of the electroless nickel plating wastewater comprises the following steps: and (3) adjusting the pH value of the chemical nickel plating wastewater to 8-10 (preferably 8-8.5) by using an alkaline substance, so that metal ions in the chemical nickel plating wastewater form precipitates.
Specifically, the alkaline substance is at least one of sodium hydroxide, potassium hydroxide, calcium hydroxide, and sodium carbonate.
And S30, adding a sufficient amount of reducing agent into the first supernatant, fully reacting to reduce the hypophosphorous acid into phosphorus simple substance, and keeping the second supernatant.
Compared with the traditional oxidation method, the hypophosphorous acid is treated by the reducing agent, so that the hypophosphorous acid can be directly reduced into phosphorus simple substance to be separated out, and the precipitation step of the oxidation method can be omitted.
In general, S30 shows that most of the nickel in the first supernatant forms Ni (OH) during the reduction of phosphorous 2 And precipitating, wherein a small part of nickel is reduced into a nickel simple substance, so that the phosphorus simple substance, the nickel hydroxide and the nickel simple substance are precipitated together to form black granular solids.
The approximate chemical reaction formula is as follows:
BH 4 -1 +P +1 +P +2 +P +3 +P +4 +P +5 →P+B 2 O 3 +H 2 。
it is to be noted here that the first supernatant was in an alkaline state, but nickel ions could not be precipitated due to the buffering action of hypophosphorous acid. When the phosphorous is reduced and removed, the nickel ions form Ni (OH) 2 And (4) precipitating.
Preferably, in this embodiment, the reducing agent is a soluble tetrahydroborate salt.
It should be noted that in S30, the reducing agent needs to be prepared into an aqueous solution and then added to the first supernatant.
More preferably, in this embodiment, the reducing agent is sodium borohydride.
The sodium borohydride is proper in price and good in water solubility, the sodium borohydride is good in reducibility, and the process of reducing the hypophosphorous acid into the elemental phosphorus can be well realized.
Preferably, in the present embodiment, the molar ratio of the reducing agent to the hypophosphorous acid is 8 to 18: 1.
more preferably, in the present embodiment, the molar ratio of the reducing agent to the hypophosphorous acid is 11 to 13: 1.
it should be noted that in S30, the reaction temperature is usually normal temperature, the reaction time is not limited in general, and the reaction is completed when the color of the first supernatant is found to change significantly from green (or blue-green) to colorless and transparent.
Preferably, the reducing agent is added to the first supernatant in an amount sufficient to achieve a reaction temperature of from 15 ℃ to 40 ℃.
Preferably, in the operation of adding a sufficient amount of the reducing agent to the first supernatant, the reaction time is 20min to 120 min.
Preferably, the method for treating hypophosphorous acid in electroless nickel plating wastewater of the present embodiment further includes the following operation after the operation of retaining the second supernatant liquid: and adjusting the pH value of the second supernatant to 8-10 (preferably 8-8.5) by using an alkaline substance, so that the metal ions in the second supernatant form precipitates. The operation step can further remove metal ions.
According to the method for treating the hypophosphorous acid in the chemical nickel plating wastewater, after primary precipitation, the hypophosphorous acid is reduced into a phosphorus simple substance by adopting a reducing agent, and the reduced phosphorus simple substance is separated out from the first supernatant, so that the removal of the hypophosphorous acid in the chemical nickel plating wastewater is realized.
Compared with the traditional method for removing the hypophosphorous acid in the chemical nickel plating wastewater by oxidation, the method for treating the hypophosphorous acid in the chemical nickel plating wastewater directly reduces the hypophosphorous acid into phosphorus simple substances to be separated out by a reduction method, thereby omitting the subsequent precipitation step. The method for treating the hypophosphorous acid in the electroless nickel plating wastewater is relatively simple to operate and relatively short in time consumption.
By combining the data in the specific embodiment part of the specification, the concentrations of nickel and phosphorus in the wastewater treated by the method for treating the hypophosphorous acid in the electroless nickel plating wastewater are both below 0.5mg/L and meet the relevant standards.
The following are specific examples.
The chemical nickel plating wastewater used in the examples is from a Shenzhen electroplating factory, and the detection shows that the chemical nickel plating wastewater contains 18.1g/L of nickel sulfate, 25.8g/L of sodium citrate, 9.6g/L of sodium acetate, 18g/L of sodium hypophosphite and trace other stabilizers.
In the specific embodiment, the content of each element was measured by a water ion test pack and a water ion automatic analyzer (KYORITSU Co., Ltd., detection range 0.02 mg/L-2 mg/L).
Example 1
At room temperature, lime water is added into the chemical nickel plating wastewater until the pH value is 8.5, and the first supernatant is reserved after the mixture is kept stand for 0.5 h.
And adding a sodium borohydride solution into the first supernatant until the concentration of the sodium borohydride in the first supernatant reaches 63g/L, fully stirring, standing for reacting for 1h, changing the color of the first supernatant from green to a colorless transparent state, allowing black granular precipitate to appear at the bottom, and keeping the second supernatant.
Through detection, the total phosphorus content in the second supernatant is 0.4mg/L, and the nickel content is 0.3 mg/L.
Example 2
At room temperature, adding lime water into the chemical nickel plating wastewater until the pH value is 8, standing for 0.5h, and then retaining a first supernatant.
And adding a sodium borohydride solution into the first supernatant until the concentration of the sodium borohydride in the first supernatant reaches 90g/L, fully stirring, standing for reacting for 1.5h, changing the color of the first supernatant from green to a colorless transparent state, allowing black granular precipitate to appear at the bottom, and keeping the second supernatant.
The total phosphorus content in the second supernatant is 0.2mg/L and the nickel content is 0.26mg/L through detection.
Example 3
At room temperature, adding lime water into the chemical nickel plating wastewater until the pH value is 8, standing for 0.5h, and then retaining a first supernatant.
And adding a sodium borohydride solution into the first supernatant until the concentration of the sodium borohydride in the first supernatant reaches 50g/L, fully stirring, standing for reacting for 1h, changing the color of the first supernatant from green to a colorless transparent state, allowing black granular precipitate to appear at the bottom, and keeping the second supernatant.
Adding the second supernatant to pH 10, standing for 0.5h, and retaining the third supernatant.
Through detection, the total phosphorus content in the third supernatant is 0.47mg/L, and the nickel content is 0.36 mg/L.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for treating hypophosphorous acid in chemical nickel plating wastewater is characterized by comprising the following steps:
providing chemical nickel plating wastewater containing phosphorous;
carrying out primary sedimentation treatment on the chemical nickel plating wastewater, and reserving a first supernatant; and
adding a sufficient amount of reducing agent to the first supernatant to react sufficiently to reduce the hypophosphorous acid to elemental phosphorus, and retaining a second supernatant.
2. The method for treating hypophosphorous acid in electroless nickel plating wastewater according to claim 1, wherein the reducing agent is a soluble tetrahydroborate.
3. The method for treating hypophosphorous acid in electroless nickel plating wastewater according to claim 2, characterized in that the reducing agent is sodium borohydride.
4. The method for treating the hypophosphorous acid in the electroless nickel plating wastewater according to claim 2, wherein the molar ratio of the reducing agent to the hypophosphorous acid is 8-18: 1.
5. the method for treating the hypophosphorous acid in the electroless nickel plating wastewater according to claim 4, wherein the molar ratio of the reducing agent to the hypophosphorous acid is 11-13: 1.
6. the method for treating hypophosphorous acid in electroless nickel plating wastewater according to claim 4, wherein the reaction temperature in the operation of adding a sufficient amount of reducing agent to the first supernatant is 15-40 ℃.
7. The method for treating hypophosphorous acid in electroless nickel plating wastewater according to claim 6, wherein the reaction time in the operation of adding a sufficient amount of reducing agent to the first supernatant is 20min to 120 min.
8. The method for treating the hypophosphorous acid in the electroless nickel plating wastewater according to any one of claims 1 to 7, wherein the operation of primary precipitation treatment on the electroless nickel plating wastewater comprises the following steps: and adjusting the pH value of the chemical nickel plating wastewater to 8-10 through an alkaline substance, so that metal ions in the chemical nickel plating wastewater form precipitates.
9. The method of claim 8 wherein said alkaline material is at least one of sodium hydroxide, potassium hydroxide, calcium hydroxide and sodium carbonate.
10. The method for treating hypophosphorous acid in electroless nickel plating wastewater according to claim 8, characterized by further comprising the following operation after the operation of retaining the second supernatant liquid: adjusting the pH of the second supernatant to 8-10 by the alkaline substance, so that the metal ions in the second supernatant form a precipitate.
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