CN114953065B - Bamboo chip flattening device for high-temperature microwave bamboo flattening processing and flattening method thereof - Google Patents
Bamboo chip flattening device for high-temperature microwave bamboo flattening processing and flattening method thereof Download PDFInfo
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- CN114953065B CN114953065B CN202210575929.1A CN202210575929A CN114953065B CN 114953065 B CN114953065 B CN 114953065B CN 202210575929 A CN202210575929 A CN 202210575929A CN 114953065 B CN114953065 B CN 114953065B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D3/00—Veneer presses; Press plates; Plywood presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27G—ACCESSORY MACHINES OR APPARATUS FOR WORKING WOOD OR SIMILAR MATERIALS; TOOLS FOR WORKING WOOD OR SIMILAR MATERIALS; SAFETY DEVICES FOR WOOD WORKING MACHINES OR TOOLS
- B27G3/00—Arrangements for removing bark-zones, chips, waste, or dust, specially designed for use in connection with wood-working machine or in wood-working plants
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
- B27K5/003—Treating of wood not provided for in groups B27K1/00, B27K3/00 by using electromagnetic radiation or mechanical waves
- B27K5/0055—Radio-waves, e.g. microwaves
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- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
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Abstract
The utility model discloses a bamboo chip flattening device for flattening processing of high-temperature microwave bamboo and a flattening method thereof, relates to the technical field of flattening devices for bamboo flattening processes, and aims to solve the problems that in the prior art, when the bamboo chip flattening device is used, processing residues need to be cleaned timely, flattening quality is ensured, but the flattening workbench surface area is large, the cleaning time of staff is long, and flattening efficiency is affected. The bamboo chip flattening device comprises a bamboo chip flattening device body, wherein a flattening groove is formed in the bamboo chip flattening device body, a flattening workbench is arranged on the lower surface of the flattening groove, a microwave pressing plate is arranged in the flattening groove, a scraping mechanism is arranged outside the microwave pressing plate, scraping mechanism driving screw rods are respectively arranged at the left end and the right end of the scraping mechanism driving screw rods, a scraping plate driving block is arranged at the lower end of the scraping mechanism driving screw rods in a driving mode, a scraping plate is fixedly connected to the lower portion of the scraping plate driving block, and a microwave blocking mechanism is arranged on one side, far away from the microwave pressing plate, of the scraping plate.
Description
Technical Field
The utility model relates to the technical field of flattening devices for bamboo flattening processes, in particular to a bamboo chip flattening device for high-temperature microwave bamboo flattening processing and a flattening method thereof.
Background
The bamboo flattening technology is an efficient processing technology of bamboo materials for manufacturing straight bamboo chips through the procedures of softening, flattening, drying, shaping and the like of bamboo tubes or arc bamboo chips. Firstly, removing green and yellow of the cut bamboo tube and slotting, or longitudinally splitting the bamboo tube into arc-shaped bamboo chips; and then softening the bamboo by heating modes such as saturated steam, microwaves and the like, and flattening the bamboo by one-time pressurization or continuously flattening the bamboo step by step to prepare the bamboo flattening plate. Can be used in the fields of bamboo chopping boards, bamboo floors, sliced bamboo veneers, bamboo furniture, bamboo daily necessities, beam column structural materials and the like. The high-temperature microwave flattening device utilizes the heat radiation principle, adopts an electronic element to emit electromagnetic waves, enables water molecules in a workpiece to generate high-frequency oscillation friction heating, and enables the workpiece to be heated simultaneously and uniformly no matter whether the workpiece is inside or outside, so that the water is synchronously and uniformly discharged, the product is smoother and difficult to deform, insect eggs can be killed, the insect eggs are prevented from being damaged by worms, and the device has the characteristics of no need of preheating, instant use and three-second response.
The Chinese patent publication No. CN202862316U, the authorized bulletin day is 2013, 4 and 10, discloses a microwave hot press, which comprises a hot press frame, a control circuit, a pressing device, a moisture discharging device, a protective cover device and a conveying mechanism, and also comprises a microwave heating device, wherein the microwave heating device is positioned in the middle of the hot press frame and comprises a metal shielding box body, a plurality of microwave generators and a waveguide connected with the microwave generators. The utility model cancels the traditional external heating device and the metal shielding box body of the hot pressing plate. According to the microwave hot press disclosed by the utility model, the glued plate is quickly solidified through microwave heating while being pressurized, so that the glued plate is ensured to be heated uniformly, the gluing quality is improved, the production efficiency is greatly improved, and the environment is safe and pollution-free; in addition, the utility model has simple structure, convenient installation and easy mass production.
The prior art solutions described above have the following drawbacks: when the bamboo chip flattening device in the prior art is used, processing residues need to be cleaned in time, flattening quality is guaranteed, but the flattening workbench is large in area, and staff is long in cleaning time, so that flattening efficiency is affected.
Disclosure of Invention
The utility model aims to provide a bamboo chip flattening device for flattening processing of high-temperature microwave bamboo and a flattening method thereof, which are used for solving the problems that in the prior art, when the bamboo chip flattening device is used, processing residues need to be cleaned in time, the flattening quality is ensured, but the flattening worktable has large area, the cleaning time of staff is long, and the flattening efficiency is affected.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a bamboo chip flattening device is used in processing of high temperature microwave bamboo exhibition flat, includes bamboo chip flattening device body, the inside of bamboo chip flattening device body is provided with the flattening groove, the lower surface of flattening groove is provided with flattening workbench, the inside of flattening groove is provided with the microwave clamp plate, the outside of microwave clamp plate is provided with scrapes clear mechanism, scrape the both ends about clear mechanism and be provided with respectively and scrape clear mechanism drive lead screw, and scrape clear mechanism drive lead screw and be located the left and right sides of microwave clamp plate, the top of scraping clear mechanism drive lead screw both sides is provided with scrapes clear mechanism telescopic link, and scrapes the inner wall fixed connection of clear mechanism telescopic link and flattening groove, the lower extreme drive of scraping clear mechanism drive lead screw is provided with scrapes the material version driving block, the below fixedly connected with of scraping the material version driving block scrapes the material board, and scrapes the material board and be located the front and back both ends of microwave clamp plate, one side of scraping the material board is kept away from the microwave separation mechanism, and the upper surface fixed connection of microwave separation mechanism and flattening groove.
Preferably, eight microwave pressing plate telescopic rods are arranged between the upper end of the microwave pressing plate and the upper surface of the flattening groove in a rectangular mode, two roller conveying mechanism grooves are symmetrically formed in the flattening workbench, and roller conveying mechanisms are movably arranged in the roller conveying mechanism grooves.
Preferably, roller conveying mechanism telescopic link grooves are symmetrically formed in two sides of each roller conveying mechanism groove, roller conveying mechanism telescopic link grooves are formed in roller conveying mechanism telescopic link grooves, two sides of the lower end of each roller conveying mechanism extend to the inner parts of the roller conveying mechanism telescopic link grooves, the upper ends of the roller conveying mechanism telescopic link grooves are fixedly connected with two sides of the lower end of each roller conveying mechanism, and the upper end face of each roller conveying mechanism is higher than the upper end face of the flattening workbench.
Preferably, the inner walls of the left end and the right end of the flattening groove are symmetrically provided with dehumidifying air outlet plates, one side of the lower end of the bamboo chip flattening device body is provided with a sundry groove, and the sundry groove is positioned below between the microwave pressing plate and the microwave blocking mechanism on one side.
Preferably, the upper end of the microwave blocking mechanism is provided with an upper supporting plate of the microwave blocking mechanism, the lower end of the microwave blocking mechanism is provided with a lower sealing plate of the microwave blocking mechanism, the inner part of the upper end of the lower sealing plate of the microwave blocking mechanism is provided with a telescopic rod groove of the microwave blocking mechanism, the lower end of the upper supporting plate of the microwave blocking mechanism extends to the inner part of the telescopic rod groove of the microwave blocking mechanism, and a telescopic rod of the microwave blocking mechanism is arranged between the lower end surface of the upper supporting plate of the microwave blocking mechanism and the inner wall of the lower end of the telescopic rod groove of the microwave blocking mechanism.
Preferably, the inside of microwave separation mechanism lower extreme closing plate lower extreme is provided with the correlation laser sensor emission end groove, the both sides and the intermediate position department in correlation laser sensor emission end groove are provided with three sets of correlation laser sensor emission end respectively, are provided with human infrared sensor between the adjacent set of correlation laser sensor emission end.
Preferably, opposite-shooting laser sensor receiving end grooves are respectively arranged at two sides and the middle position of the upper end of the flattening workbench, opposite-shooting laser sensor receiving ends are arranged in the opposite-shooting laser sensor receiving end grooves, the opposite-shooting laser sensor receiving ends and opposite-shooting laser sensor transmitting ends are correspondingly arranged, and the opposite-shooting laser sensor receiving ends, the opposite-shooting laser sensor transmitting ends and the human infrared sensors are respectively electrically connected with the telescopic rod of the microwave blocking mechanism.
Preferably, the scraping plate is of a V-shaped structure, the lower end of the scraping plate is inclined towards the direction of the microwave pressing plate, the V-shaped structure of the scraping plate is identical to the shape of one side of the impurity trough, and the width of the scraping plate is larger than that of the impurity trough.
A flattening method of a bamboo chip flattening device for flattening processing of high-temperature microwave bamboo comprises the following steps:
step 1: when the bamboo strip flattening machine is used, the upper end face of the roller conveying mechanism is higher than the upper end face of the flattening workbench, bamboo strips to be flattened are arranged and placed above the roller conveying mechanism, the roller conveying mechanism is started to drive the bamboo strips to be flattened to the position right below the microwave pressing plate, the upper surface of the roller conveying mechanism is driven to move to the position below the upper end face of the flattening workbench by the shrinkage of the telescopic rod of the roller conveying mechanism, and therefore the bamboo strips to be flattened are placed above the flattening workbench;
step 2: the method comprises the steps that laser is sent out by a transmitting end of the opposite-shooting laser sensor, when no article blocks the laser, the laser can be received by a receiving end of the opposite-shooting laser sensor, when the article blocks light, the expansion link of the microwave blocking mechanism is prevented from being stretched to cause the article to be damaged by pressure, meanwhile, the human infrared sensor monitors whether human infrared rays exist below the microwave pressing plate, when the human infrared sensor monitors the fact that the expansion link of the microwave blocking mechanism is stretched to cause the injury to the body of a worker, and when the article and the human infrared rays are not monitored, the expansion link of the microwave blocking mechanism is stretched to enable the lower sealing plate of the microwave blocking mechanism to be downwards stretched and attached to the flattening workbench;
step 3: stretching a telescopic rod of the microwave pressing plate to enable the microwave pressing plate to move downwards to press the bamboo chips, starting an electronic element in the microwave pressing plate to emit electromagnetic waves and a dehumidifying mechanism, enabling water molecules in the bamboo chips to generate high-frequency oscillation friction heating to cause the effect of spin motion of the water molecules, converting field energy of a microwave field into heat energy in the bamboo chips at the moment, enabling the temperature of the bamboo chips to rise, achieving the purpose of microwave heating and drying, and absorbing the heated water molecules through the dehumidifying mechanism to obtain the bamboo chips;
step 4: after flattening, the telescopic rods of the shrinkage microwave pressing plates drive the microwave pressing plates to move upwards, the telescopic rods of the shrinkage microwave blocking mechanisms drive the microwave blocking mechanisms on two sides to shrink, meanwhile, the telescopic rods of the roller conveying mechanisms move upwards to drive the roller conveying mechanisms to move upwards until the upper end surfaces of the roller conveying mechanisms are higher than the upper end surfaces of the flattening working tables, and after the bamboo boards are supported, the roller conveying mechanisms are started to drive the bamboo boards to the bamboo board flattening device body, and the telescopic rods of the roller conveying mechanisms retract the roller conveying mechanisms;
step 5: scrape the upper surface impurity of flattening the workstation through scraping the mechanism, extend earlier and scrape the telescopic link of the mechanism and let the up end of scraping the flitch be less than the lower terminal surface of microwave clamp plate, the lower terminal surface of scraping the flitch simultaneously is laminated mutually with the up end of flattening the workstation, thereby the drive is scraped the mechanism and is driven and scrape the flitch drive piece and move the opposite side to the below of microwave clamp plate from one side of the below of microwave clamp plate to promote the impurity of flattening the workstation surface to the inside of miscellaneous silo, the shrink of the telescopic link of the mechanism drive lead screw drive of rethread scraping the mechanism and scrape the drive of scraping the flitch and reset.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the bamboo chip flattening device, the scraping mechanism is arranged to clean and scrape impurities on the upper surface of the flattening workbench, the screw rod is driven by the scraping mechanism to be located on two sides of the microwave pressing plate so as to avoid the microwave pressing plate, independent work between scraping and flattening is achieved, residues in processing can be efficiently scraped through the bonding of the scraping plate and the flattening workbench, the impurities on the upper surface of the flattening workbench can be scraped to be concentrated towards the middle through the V-shaped arrangement of the scraping plate, and finally pushed to the interior of the impurity groove, meanwhile, the impurity groove, the microwave pressing plate and the microwave blocking mechanism are arranged in a staggered mode, the influence on flattening can be prevented, the problem that the bamboo chip flattening device in the prior art needs to clean the processing residues in time when in use, the flattening quality is guaranteed, but the flattening workbench surface area is large, the cleaning time of workers is long, and the flattening efficiency is affected is solved.
2. According to the utility model, the laser is sent out by the emitting end of the opposite-emission laser sensor, when no article blocks the laser, the laser can be received by the receiving end of the opposite-emission laser sensor, when the article blocks light, the expansion of the telescopic rod of the microwave blocking mechanism is prevented from causing the article to be crushed, meanwhile, the human infrared sensor monitors whether human infrared is arranged below the microwave pressing plate, when the infrared is monitored, the telescopic rod of the microwave blocking mechanism is prevented from being expanded to cause the injury to the body of a worker, and when the article and the human infrared are not monitored, the telescopic rod of the microwave blocking mechanism is expanded to enable the lower sealing plate of the microwave blocking mechanism to be downwards extended and be attached to the flattening workbench, and the position of the bamboo sheet and whether the body part of the worker is arranged in the bamboo sheet flattening device body before pressing can be prevented from damaging the worker when the microwave pressing plate and the microwave blocking mechanism are pressed down.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a cross-sectional view taken along the direction A-A of FIG. 1 in accordance with the present utility model;
FIG. 3 is a cross-sectional view in the direction B-B of FIG. 1 in accordance with the present utility model;
FIG. 4 is an enlarged view of a portion of the area C of FIG. 2 in accordance with the present utility model;
FIG. 5 is a diagram showing the connection relationship among the microwave blocking mechanism, the microwave blocking mechanism and the roller conveying mechanism;
fig. 6 is a sectional view in the direction D-D of fig. 1 in the present utility model.
In the figure: 1. a bamboo chip flattening device body; 2. flattening the groove; 3. a microwave pressing plate; 4. a microwave pressing plate telescopic rod; 5. flattening the workbench; 6. roller conveying mechanism; 7. a microwave blocking mechanism; 8. a scraping mechanism; 9. a roller conveying mechanism telescopic rod; 10. a dehumidifying air outlet plate; 11. a sundry tank; 12. a support plate on the microwave blocking mechanism; 13. a lower sealing plate of the microwave blocking mechanism; 14. a telescopic rod groove of the microwave blocking mechanism; 15. a telescopic rod of the microwave blocking mechanism; 16. a telescopic rod of the scraping mechanism; 17. the scraping mechanism drives the screw rod; 18. a scraping plate driving block; 19. a scraping plate; 20. an emission end groove of the correlation laser sensor; 21. an emission end of the correlation laser sensor; 22. a human body infrared sensor; 23. a receiving end slot of the correlation laser sensor; 24. a receiving end of the correlation laser sensor; 25. a roller conveying mechanism telescopic rod groove; 26. roller conveying mechanism groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-6, an embodiment of the present utility model is provided: the utility model provides a bamboo chip flattening device is used in processing of high temperature microwave bamboo exhibition flat, including bamboo chip flattening device body 1, the inside of bamboo chip flattening device body 1 is provided with the flattening groove 2, the lower surface of flattening groove 2 is provided with flattening workstation 5, the inside of flattening groove 2 is provided with microwave clamp plate 3, the outside of microwave clamp plate 3 is provided with scrapes clear mechanism 8, scrape the both ends about clear mechanism 8 and be provided with respectively and scrape clear mechanism drive lead screw 17, and scrape clear mechanism drive lead screw 17 and be located the left and right sides of microwave clamp plate 3, the top of scraping clear mechanism drive lead screw 17 both sides is provided with scrapes clear mechanism telescopic link 16, and scrape clear mechanism telescopic link 16 and the inner wall fixed connection of flattening groove 2, the lower extreme drive of scraping clear mechanism drive lead screw 17 is provided with scrapes material version drive piece 18, the below fixedly connected with scraping material board 19 of scraping material version drive piece 18, and scrape the material board 19 and be located the front and back both ends of microwave clamp plate 3, one side that scrapes the material board 19 kept away from microwave barrier mechanism 7, and microwave barrier mechanism 7 and the upper surface fixed connection of pressing groove 2.
Referring to fig. 1 and 2, eight microwave pressing plate telescopic rods 4 are rectangular between the upper end of the microwave pressing plate 3 and the upper surface of the flattening groove 2, the microwave pressing plate 3 can be driven to be pressed down by the arrangement of the microwave pressing plate telescopic rods 4, two roller conveying mechanism grooves 26 are symmetrically formed in the flattening workbench 5, roller conveying mechanisms 6 are movably arranged in the roller conveying mechanism grooves 26, and feeding and discharging of bamboo materials can be efficiently achieved through the arrangement of the roller conveying mechanisms 6.
Referring to fig. 1 and 5, roller conveying mechanism telescopic rod grooves 25 are symmetrically formed in two sides of a roller conveying mechanism groove 26, roller conveying mechanism telescopic rods 9 are arranged in the roller conveying mechanism telescopic rod grooves 25, two sides of the lower end of a roller conveying mechanism 6 extend to the inner part of the roller conveying mechanism telescopic rod grooves 25, the roller conveying mechanism telescopic rods 9 extend to drive the roller conveying mechanism 6 to move up and down, accordingly bamboo materials can be supported for feeding and discharging, the upper ends of the roller conveying mechanism telescopic rods 9 are fixedly connected with two sides of the lower end of the roller conveying mechanism 6, and the upper end face of the roller conveying mechanism 6 is higher than the upper end face of the flattening workbench 5.
Referring to fig. 2, 3 and 6, the inner walls of the left and right ends of the flattening groove 2 are symmetrically provided with dehumidifying air outlet plates 10, the dehumidifying air outlet plates 10 are provided with a dehumidifying mechanism for sucking water molecules released after heating, one side of the lower end of the bamboo chip flattening device body 1 is provided with a impurity groove 11, the impurity groove 11 is located below between the microwave pressing plate 3 and the microwave blocking mechanism 7 on one side, and the impurity groove 11 is used for collecting processing residues on the upper surface of the flattening workbench 5.
Referring to fig. 4, an upper end of a microwave blocking mechanism 7 is provided with an upper supporting plate 12 of the microwave blocking mechanism, a lower end of the microwave blocking mechanism 7 is provided with a lower sealing plate 13 of the microwave blocking mechanism, a telescopic rod groove 14 of the microwave blocking mechanism is provided in the upper end of the lower sealing plate 13 of the microwave blocking mechanism, the lower end of the upper supporting plate 12 of the microwave blocking mechanism extends to the inner part of the telescopic rod groove 14 of the microwave blocking mechanism, a telescopic rod 15 of the microwave blocking mechanism is provided between the lower end surface of the upper supporting plate 12 of the microwave blocking mechanism and the inner wall of the lower end of the telescopic rod groove 14 of the microwave blocking mechanism, and the telescopic rod 15 of the microwave blocking mechanism can drive the microwave blocking mechanism 7 to lift and descend.
Referring to fig. 5, an opposite emission laser sensor emission end slot 20 is provided in the lower end of the lower sealing plate 13 of the microwave blocking mechanism, three sets of opposite emission laser sensor emission ends 21 are respectively provided at two sides and a middle position of the opposite emission laser sensor emission end slot 20, a human body infrared sensor 22 is provided between adjacent sets of opposite emission laser sensor emission ends 21, and the human body infrared sensor 22 can enter a monitoring range for whether a human body enters or not, so that workers are protected from being damaged by the downward pressing of the microwave blocking mechanism 7.
Referring to fig. 4 and 5, opposite laser sensor receiving end slots 23 are respectively disposed at two sides and a middle position of an upper end of the flattening table 5, opposite laser sensor receiving ends 24 are disposed in the opposite laser sensor receiving end slots 23, opposite laser sensor receiving ends 24 and opposite laser sensor transmitting ends 21 are correspondingly disposed, and the corresponding arrangement can detect whether laser is blocked or not, prevent damage to materials caused by pressing down of the microwave blocking mechanism 7, and the opposite laser sensor receiving ends 24, the opposite laser sensor transmitting ends 21 and the human infrared sensors 22 are respectively electrically connected with the microwave blocking mechanism telescopic rod 15.
Referring to fig. 4 and 6, the scraping plate 19 has a V-shaped structure, the V-shaped structure is arranged to effectively collect impurities above the flattening table 5 toward the middle, the lower end of the scraping plate 19 is inclined toward the microwave pressing plate 3, the V-shaped structure of the scraping plate 19 is identical to one side of the impurity trough 11 in shape, and the width of the scraping plate 19 is larger than that of the impurity trough 11.
A flattening method of a bamboo chip flattening device for flattening processing of high-temperature microwave bamboo comprises the following steps:
step 1: when the bamboo flattening machine is used, the upper end face of the roller conveying mechanism 6 is higher than the upper end face of the flattening workbench 5, bamboo chips to be flattened are arranged and placed above the roller conveying mechanism 6, the roller conveying mechanism 6 is started to drive the bamboo chips to be flattened to be right below the microwave pressing plate 3, the upper surface of the roller conveying mechanism 6 is driven to move to the lower part of the upper end face of the flattening workbench 5 through the shrinkage of the telescopic rod 9 of the roller conveying mechanism, and therefore the bamboo chips to be flattened are placed above the flattening workbench 5;
step 2: the opposite-emission laser sensor transmitting end 21 transmits laser, when no article blocks the laser, the laser can be received by the opposite-emission laser sensor receiving end 24, when the article blocks light, the expansion of the microwave blocking mechanism telescopic rod 15 is prevented from causing the article to be crushed, meanwhile, the human infrared sensor 22 monitors whether human infrared rays exist below the microwave pressing plate 3, when the infrared rays are monitored, the expansion of the microwave blocking mechanism telescopic rod 15 is prevented from causing the injury to the body of a worker, and when the article and the human infrared rays are not monitored, the microwave blocking mechanism telescopic rod 15 is expanded so as to enable the lower sealing plate 13 of the microwave blocking mechanism to extend downwards and be attached to the flattening workbench 5;
step 3: stretching a microwave pressing plate telescopic rod 4 to enable the microwave pressing plate 3 to move downwards to press the bamboo chips, starting an electronic element in the microwave pressing plate 3 to emit electromagnetic waves and a dehumidifying mechanism, enabling water molecules in the bamboo chips to generate high-frequency oscillation friction heating to cause the effect of spin movement of the water molecules, converting field energy of a microwave field into heat energy in the bamboo chips at the moment, enabling the temperature of the bamboo chips to rise, achieving the purpose of microwave heating and drying, and absorbing the heated and released water molecules through a dehumidifying air outlet plate 10 by the dehumidifying mechanism to obtain the bamboo chips;
step 4: after flattening, the microwave pressing plate 3 is driven to move upwards by the shrinkage microwave pressing plate telescopic rod 4, the microwave blocking mechanisms 7 at two sides are driven to shrink by the shrinkage microwave blocking mechanism telescopic rod 15, meanwhile, the roller conveying mechanism telescopic rod 9 moves upwards to drive the roller conveying mechanism 6 to move upwards until the upper end surface of the roller conveying mechanism 6 is higher than the upper end surface of the flattening workbench 5, and after the bamboo boards are supported, the roller conveying mechanism 6 is started to drive the bamboo boards to the outside of the bamboo board flattening device body 1, and the roller conveying mechanism 6 is retracted by the roller conveying mechanism telescopic rod 9;
step 5: scrape the upper surface impurity of flattening workstation 5 through scraping clear mechanism 8, extend earlier and scrape clear mechanism telescopic link 16 and let the up end that scrapes flitch 19 be less than the lower terminal surface of microwave clamp plate 3, the lower terminal surface that scrapes flitch 19 simultaneously is laminated with the up end of flattening workstation 5, thereby the drive scrapes clear mechanism 8 and drives and scrape flitch drive piece 18 and remove the opposite side of the below of microwave clamp plate 3 from the one side of the below of microwave clamp plate 3 to with the impurity on flattening workstation 5 surface promotes the inside of miscellaneous silo 11, the rethread scrapes and scrapes the shrink of clear mechanism telescopic link 16 and drive and scrape flitch 19 and reset.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. The utility model provides a high temperature microwave bamboo flattens processing with bamboo chip flattening device, includes bamboo chip flattening device body (1), its characterized in that: the inside of bamboo chip flattening device body (1) is provided with flattening groove (2), the lower surface of flattening groove (2) is provided with flattening workbench (5), the inside of flattening groove (2) is provided with microwave clamp plate (3), the outside of microwave clamp plate (3) is provided with scrapes and clears mechanism (8), the both ends of scraping about mechanism (8) are provided with respectively scrapes and clear mechanism drive lead screw (17), and scrape the left and right sides that mechanism drive lead screw (17) is located microwave clamp plate (3), the top of scraping mechanism drive lead screw (17) both sides is provided with scrapes and clear mechanism telescopic link (16), and scrapes the inner wall fixed connection of mechanism telescopic link (16) and flattening groove (2), the lower extreme drive of scraping mechanism drive lead screw (17) is provided with scrapes material version drive block (18), the below of scraping material version drive block (18) is fixedly connected with scrapes flitch (19), and scrapes flitch (19) and be located the front and back plate (17) of microwave clamp plate (3), scrape the both ends (19) and be provided with microwave clamp plate (3) and the microwave clamp plate (3) of flattening groove (2) and the microwave clamp plate (3) of being kept away from each other, microwave clamp plate (7) and the surface of flattening groove (2) are kept away from each other and are provided with microwave clamp plate (7), two roller conveying mechanism grooves (26) are symmetrically formed in the flattening workbench (5), roller conveying mechanisms (6) are movably arranged in the roller conveying mechanism grooves (26), roller conveying mechanism telescopic rod grooves (25) are symmetrically formed in two sides of the roller conveying mechanism grooves (26), roller conveying mechanism telescopic rods (9) are arranged in the roller conveying mechanism telescopic rod grooves (25), dehumidification air outlet plates (10) are symmetrically arranged on inner walls of the left end and the right end of the flattening groove (2), a sundry tank (11) is arranged on one side of the lower end of the bamboo chip flattening device body (1), a microwave blocking mechanism upper supporting plate (12) is arranged at the upper end of the microwave blocking mechanism (7), a microwave blocking mechanism lower sealing plate (13) is arranged at the lower end of the microwave blocking mechanism lower sealing plate (13), a microwave blocking mechanism telescopic rod groove (14) is arranged in the inner portion of the upper end of the roller conveying mechanism telescopic rod groove (25), a dehumidification air outlet plate (10) is symmetrically arranged on the inner walls of the left end and right end of the flattening groove (2), a microwave blocking mechanism lower end face of the upper supporting plate (12) is provided with a microwave blocking mechanism lower sealing plate (13), a microwave blocking mechanism lower end face (20) is arranged at the lower end of the microwave blocking mechanism lower end of the microwave device (13), three groups of opposite-emission laser sensor emitting ends (21) are respectively arranged at the two sides and the middle position of the opposite-emission laser sensor emitting end groove (20), human body infrared sensors (22) are arranged between the adjacent groups of opposite-emission laser sensor emitting ends (21), opposite-emission laser sensor receiving end grooves (23) are respectively arranged at the two sides and the middle position of the upper end of the flattening workbench (5), and opposite-emission laser sensor receiving ends (24) are arranged in the opposite-emission laser sensor receiving end grooves (23);
the method for flattening the bamboo chips by using the bamboo chip flattening device for flattening the high-temperature microwave bamboo comprises the following steps:
step 1: when the bamboo strip flattening machine is used, the upper end face of the roller conveying mechanism (6) is higher than the upper end face of the flattening workbench (5), bamboo strips to be flattened are arranged above the roller conveying mechanism (6), the roller conveying mechanism (6) is started to drive the bamboo strips to be flattened to the position right below the microwave pressing plate (3), and the upper surface of the roller conveying mechanism (6) is driven to move to the position below the upper end face of the flattening workbench (5) through the shrinkage of the telescopic rod (9) of the roller conveying mechanism, so that the bamboo strips to be flattened are arranged above the flattening workbench (5);
step 2: the opposite-emission laser sensor transmitting end (21) transmits laser, when no article blocks the laser, the laser can be received by the opposite-emission laser sensor receiving end (24), when the article blocks light, the expansion of the microwave blocking mechanism telescopic rod (15) is prevented from causing the article to be crushed, meanwhile, the human infrared sensor (22) monitors whether human infrared rays exist below the microwave pressing plate (3), when the infrared rays are monitored, the expansion of the microwave blocking mechanism telescopic rod (15) is prevented from causing the injury to the body of a worker, and when the article and the human infrared rays are not monitored, the microwave blocking mechanism telescopic rod (15) is expanded to enable the lower sealing plate (13) of the microwave blocking mechanism to extend downwards and be attached to the flattening workbench (5);
step 3: stretching a microwave pressing plate telescopic rod (4) to enable the microwave pressing plate (3) to move downwards to press the bamboo chips, starting an electronic element in the microwave pressing plate (3) to emit electromagnetic waves and a dehumidifying mechanism, enabling water molecules in the bamboo chips to generate high-frequency vibration friction heating to cause the effect of spin movement of the water molecules, converting the field energy of a microwave field into heat energy in the bamboo chips at the moment to enable the temperature of the bamboo chips to rise, achieving the purpose of microwave heating and drying, and absorbing the heated and released water molecules through a dehumidifying air outlet plate (10) by the dehumidifying mechanism to obtain the bamboo chips;
step 4: after flattening, the microwave pressing plate (3) is driven to move upwards by the telescopic rod (4) of the shrinkage microwave pressing plate, the telescopic rods (15) of the shrinkage microwave blocking mechanism drive the microwave blocking mechanisms (7) at two sides to shrink, meanwhile, the telescopic rod (9) of the roller conveying mechanism moves upwards to drive the roller conveying mechanism (6) to move upwards until the upper end face of the roller conveying mechanism (6) is higher than the upper end face of the flattening workbench (5), and after the bamboo board is lifted, the roller conveying mechanism (6) is started to drive the bamboo board to the outer shrinkage roller conveying mechanism telescopic rod (9) of the bamboo board flattening device body (1) to retract the roller conveying mechanism (6);
step 5: scrape upper surface impurity that washs work platform (5) through scraping mechanism (8), stretch earlier and scrape mechanism telescopic link (16) and let the up end of scraping flitch (19) be less than the lower terminal surface of microwave clamp plate (3), the lower terminal surface of scraping flitch (19) is laminated mutually with the up end of flattening work platform (5) simultaneously, thereby drive scrape mechanism (8) drive scrape flitch drive piece (18) and remove the opposite side of the below of microwave clamp plate (3) from one side of the below of microwave clamp plate (3) to scrape flitch (19), thereby promote the impurity of flattening work platform (5) surface to the inside of miscellaneous silo (11), the drive of rethread scraping mechanism drive lead screw (17) and the shrink of scraping mechanism telescopic link (16) drive scrape flitch (19) and reset.
2. The bamboo chip flattening device for flattening processing of high-temperature microwave bamboo according to claim 1, wherein: the two sides of the lower end of the roller conveying mechanism (6) extend to the inside of a roller conveying mechanism telescopic rod groove (25), the upper end of a roller conveying mechanism telescopic rod (9) is fixedly connected with the two sides of the lower end of the roller conveying mechanism (6), and the upper end face of the roller conveying mechanism (6) is higher than the upper end face of the flattening workbench (5).
3. The bamboo chip flattening device for flattening processing of high-temperature microwave bamboo according to claim 2, wherein: the impurity trough (11) is positioned below the space between the microwave pressing plate (3) and the one-side microwave blocking mechanism (7).
4. The bamboo chip flattening device for flattening processing of high-temperature microwave bamboo according to claim 3, wherein: the opposite-emission laser sensor receiving end (24) is arranged corresponding to the opposite-emission laser sensor transmitting end (21), and the opposite-emission laser sensor receiving end (24), the opposite-emission laser sensor transmitting end (21) and the human body infrared sensor (22) are respectively and electrically connected with the microwave blocking mechanism telescopic rod (15).
5. The bamboo chip flattening device for flattening processing of high-temperature microwave bamboo according to claim 4, wherein: the scraping plate (19) is of a V-shaped structure, the lower end of the scraping plate (19) is inclined towards the microwave pressing plate (3), the V-shaped structure of the scraping plate (19) is identical to one side of the impurity trough (11), and the width of the scraping plate (19) is larger than that of the impurity trough (11).
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| CN112092116B (en) * | 2020-08-26 | 2022-01-28 | 和县薛氏木制品制造有限公司 | Hot press for processing wooden products and processing method thereof |
| CN112077957B (en) * | 2020-10-12 | 2023-11-28 | 国际竹藤中心 | High-frequency hot-pressing continuous automatic production line of bamboo specification material and production method thereof |
| CN214081900U (en) * | 2020-12-15 | 2021-08-31 | 临沂市兰山区成鑫利木业有限公司 | Plywood compression fittings |
| CN214772683U (en) * | 2021-05-14 | 2021-11-19 | 厦门尚美主张家具有限公司 | Cold press for wood working |
| CN215702469U (en) * | 2021-09-07 | 2022-02-01 | 佛山市万威智能科技有限公司 | Full-automatic microwave heating composite press |
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