CN114942270A - Portable ultrasonic phased array detection imaging system - Google Patents
Portable ultrasonic phased array detection imaging system Download PDFInfo
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- CN114942270A CN114942270A CN202210483293.8A CN202210483293A CN114942270A CN 114942270 A CN114942270 A CN 114942270A CN 202210483293 A CN202210483293 A CN 202210483293A CN 114942270 A CN114942270 A CN 114942270A
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- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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Abstract
The invention relates to a portable ultrasonic phased array detection imaging system, which comprises: the system comprises a phased array probe module, an ultrasonic phased array circuit module, a main control module and a display interaction module. The probe is used for scanning a workpiece to be detected, detection parameters are set, the circuit module calculates a focusing rule, and each array element of the ultrasonic probe is excited to obtain an echo signal. And (3) drawing images of A scanning, B scanning and C scanning by the echo signal, obtaining an image of S scanning by the image of B scanning through coordinate conversion, 2.8-9.6MHZ band-pass filtering and bicubic interpolation operation, and evaluating the defect position and shape of the detected workpiece according to various imaging modes. The ultrasonic phased array detection imaging system has the advantages of small volume, easiness in carrying, simplicity and convenience in operation, convenience in parameter setting, flexibility in imaging mode, high detection speed, high precision and the like, and is very suitable for industrial nondestructive detection.
Description
Technical Field
The invention relates to the field of ultrasonic nondestructive detection, and aims to detect the structures, properties and states of various engineering materials, structures and parts on an industrial site and display the positions and shapes of defects by one-dimensional and two-dimensional images, in particular to a portable ultrasonic phased array detection imaging system.
Background
With the development of modern industry, higher and higher requirements are put on product quality, structural safety and use reliability. The Non-destructive Testing (NDT) technology has the greatest characteristics of no damage to a tested object, wide detection range, accurate defect positioning, high sensitivity, safety and harmlessness to a human body, capability of detecting tiny defects and internal defects which cannot be observed by naked eyes, and plays an increasingly important role in ensuring product quality and engineering quality. At present, the nondestructive testing technology is not only applied to the manufacturing inspection and the in-use inspection of the boiler pressure container, but also widely applied to a plurality of industries and departments in China. Such as machinery, metallurgy, petroleum and gas, petrochemicals, chemical industry, aerospace, marine, rail, electrical, nuclear, weaponry, coal, non-ferrous metals, construction, recreational equipment (roller coaster, etc.), and the like.
The ultrasonic nondestructive testing method is one of nondestructive testing methods with the highest frequency of use at home and abroad, and the ultrasonic testing is subjected to stages from qualitative analysis of nondestructive testing to quantitative analysis of nondestructive testing. Ultrasonic non-destructive testing was first applied to radar, in phased array radar, many sub-antenna elements were arranged in a specific shape, and the phase of each electromagnetic wave was adjusted by controlling the amplitude and delay of the electromagnetic wave transmitted by each sub-antenna, thereby achieving flexible synthesis of a focused and scanned radar beam. By using the beam synthesis of radar, the ultrasonic phased array detection technology controls array elements in an ultrasonic phased array probe array through an electronic system, and transmits and receives ultrasonic waves according to a certain delay time rule, so that the deflection and focusing of ultrasonic beams in a workpiece are dynamically controlled. The detection speed is high, the detection flexibility is strong, and the detection of the position defects of complex structural parts and blind areas can be realized.
Modern ultrasonic nondestructive detection technology is developing towards the direction of digitalization, automation, intellectualization and systematization, and the reliability of positioning, qualification and quantification in material defect detection is continuously improved, so that the technology can better play a great role in the industrial fields of nuclear energy, aviation, electric power, machinery and the like.
Disclosure of Invention
The invention aims to meet the requirement of the current industrial field on the portable development of instruments, and develops a small, simple, convenient and easy-to-operate ultrasonic phased array detection imaging system so as to meet the current requirements of nondestructive testing.
The technical solution of the invention is as follows:
a portable ultrasonic phased array detection imaging system mainly comprises the following components: the ultrasonic phased array probe, the ultrasonic phased array circuit module, the main control module and the display interaction module. The phased array probe is connected to a phased array circuit system through a coaxial circuit, the phased array circuit module is connected with a main control module, the main control module is connected with a display interaction module, and the display interaction module is embodied through a touch screen.
The portable ultrasonic phased array detection imaging system comprises the following specific detection processes:
scanning a workpiece to be detected by using an ultrasonic probe, setting detection parameters, calculating a focusing rule by using a circuit module, exciting each array element of the ultrasonic probe, and transmitting ultrasonic waves to the workpiece to be detected to obtain echo signals;
and step two, drawing an A-scan image, a B-scan image and a C-scan image by the echo signals, and obtaining an S-scan image by the B-scan image through coordinate conversion, 2.8-9.6MHZ band-pass filtering and bicubic interpolation operation.
And step three, evaluating the defect position and shape of the workpiece to be measured according to various imaging modes.
The invention also has the following technical characteristics:
1) the main control module adopts an ARM chip, the ultrasonic phased array circuit system adopts an FPGA chip, and the display interaction module adopts an embedded design based on Linux and a QT platform.
2) The main control unit of the system is composed of a circuit module, a main control module and a display interaction module, detailed parameters are configured in the display interaction module according to the requirements of a detected workpiece and hardware equipment, a parameter instruction is issued by the main control module, and the circuit module carries out focusing rule calculation and gives transmitting/receiving ultrasonic control signals.
3) The ultrasonic phased array probe is a linear array with working frequency of 5MHZ and 32 array elements, and consists of a probe, a cable, a shell and accessories thereof.
4) The display interaction module comprises a parameter interface, an image display selection interface, a data storage interface, a basic information display interface and the like. The display interaction module can flexibly provide 4 different display modes of the defect image according to requirements: a-scan, B-scan, C-scan, and S-scan, and defect data as well as images can be saved.
Compared with the existing ultrasonic phased array imaging system, the ultrasonic phased array imaging system has the following obvious advantages:
1) the ultrasonic phased array detection imaging system utilizes an ultrasonic transducer consisting of a plurality of linear arrays, and can generate sound beams with different deflection angles and focuses by utilizing different focusing delays, so that a measured object can scan a certain section without moving. The characteristic reduces detection errors caused by manual operation and improves measurement precision.
2) The defect display part of the invention combines the image processing technology, so that the defects are easier to read and easier to locate.
3) The defect display part of the invention is flexible, can customize the display mode according to the requirements of operators, gives at most 4 different display modes at the same time and can ensure the accuracy and the real-time performance of the detection imaging result.
Drawings
Fig. 1 is a general structural diagram of an ultrasonic phased array inspection imaging system of an embodiment.
Fig. 2 is a diagram of an ultrasound phased array scanning mode.
Fig. 3 is an ultrasonic phased array S-scan imaging coordinate transformation diagram.
Fig. 4 is a schematic diagram of bicubic interpolation.
Fig. 5 is a fan-scan diagram after the bicubic interpolation process.
Fig. 6 is a sector scanning implementation diagram of the portable ultrasonic phased array inspection imaging system.
Fig. 7 is a schematic B-block geometry.
Fig. 8 is a schematic diagram of various imaging displays of the portable ultrasonic phased array detection imaging system.
Detailed Description
The invention will now be described in more detail by way of example with reference to the accompanying drawings in which:
with reference to fig. 1, the portable ultrasonic phased array inspection imaging system includes: the ultrasonic phased array comprises a main control module, an ultrasonic phased array circuit module, an ultrasonic phased array probe and a display interaction module. The ultrasonic phased array probe is connected with the ultrasonic phased array circuit module through a coaxial cable, the ultrasonic phased array circuit module is connected with the main control module, the main control module is connected with the display interaction module, and the display interaction module is embodied by the touch screen.
The display interaction module: adopt the embedded design based on Linux and QT platform, according to the detection demand, can set up software interface menu parameter through the touch-sensitive screen, set up the main parameter of probe and voussoir: array element number, array element spacing, wedge block angle, wedge block first array element height, wedge block sound velocity, measured object sound velocity, sector scanning range, angle stepping and the like; setting parameters of an ultrasonic phased array scanning working mode: a focusing manner, a focusing depth, and the like; setting parameters of an image display mode: display type, display combination, etc.; setting conventional parameters of ultrasonic phased array detection: gain, sampling range, pulse repetition frequency, etc. The ultrasonic phased array scanning work mode is divided into three modes, as shown in fig. 2; the image display types are divided into a-scan, B-scan, C-scan, and S-scan, and can be displayed in any combination. The display interaction module has the main functions of setting detection parameters, transmitting the detection parameters to the main control module and displaying echo data, so that man-machine interaction is realized.
The main control module: the main control module adopts an ARM chip and sends the ARM chip to the circuit module according to the parameters set by the user; and receiving the echo signal of the circuit module, and sending the echo signal to the display interaction module for display.
Ultrasonic phased array circuit module: the circuit module adopts an FPGA chip, calculates a focusing rule according to configuration parameters sent by the main control module, sends detection control information to the ultrasonic transmitting/receiving circuit, and the ultrasonic transmitting/receiving circuit generates corresponding electric pulse signals according to the sent control signals, so that the ultrasonic phased array probe is controlled, and the collection of detection echo data is realized.
Ultrasonic phased array probe: proper amount of couplant is smeared on the surface of the object to be measured and the probe, and the couplant is vertically placed on the surface of the workpiece to be measured, and according to the focusing rule, the phase delay of each array element is controlled and ultrasonic sound beams corresponding to the deflection angle and the focal length are generated.
In the embodiment, the display interaction module can display four imaging modes, namely, a-scan, B-scan, C-scan and S-scan in real time. For S-scan imaging, the coordinate transformation is required to be carried out from B-scan, S-scan matrixes are filled one by one according to B-scan matrix data,in the process, original image information can not be omitted, and image information can not be added. Referring to the principle of FIG. 3 for coordinate transformation, the pixel (x, y) in the B-scan coordinate system 1 corresponds to the pixel (x ', y') in the data matrix in the S-scan coordinate system 2, and the length of the sampling sequence for each deflection angle in the S-scan coordinate system 2 is assumed to be L, where θ is 0 As a starting angle, theta end For the termination angle, Δ θ is the angular step, and N is the number of sampling points, and the corresponding coordinate conversion relationship is:
the coordinate transformation of the B-scan image to obtain the S-scan image is a process of obtaining a target image matrix from an original image matrix, and in this process, it cannot be ensured that the position of the S-scan polar coordinate corresponds to the B-scan pixel points one by one, so that the coordinate-transformed fan-scan image may have some pixel points whose values cannot be determined, and these pixel points seriously affect the image quality. In order to compensate the problem that the pixel points of the original image and the target image are not completely corresponding, image interpolation processing needs to be performed, bicubic interpolation is adopted, and the principle of the bicubic interpolation is as shown in fig. 4, and the pixel values of 4 x 4 integer points around a floating point type coordinate point are used for calculating a target pixel value.
The interpolation of a floating-point coordinate point is a weighted sum of the pixel values of its surrounding 4 x 4 integer coordinate points:
the weight is calculated as the following formula, wherein a is in a value range of-1 to 0, and is generally a fixed value of-0.5.
W(i，j)＝W(d xi )*W(d yj )
d xi ＝x i -x′
d yj ＝y j -y′
The fan-scanned image after bicubic interpolation is shown in fig. 5.
Further, the specific detection process of the portable ultrasonic phased array detection imaging system is as follows:
placing a workpiece to be detected, determining a defect area to be detected, mounting a probe on a wedge block, coating a coupling agent on a contact surface of the wedge block and an object to be detected, placing a phase control array probe and the wedge block on the object to be detected, starting a system power supply, and setting parameters through a display interaction module according to detection requirements;
secondly, the main control module receives and displays the parameters of the interaction module and sends the parameters to the ultrasonic phased array circuit module, the circuit module calculates a focusing rule according to the parameters, and the calculation result is transmitted to the transmitting circuit so as to control the ultrasonic phased array probe to excite a corresponding sound beam;
step three, transmitting an acoustic beam generated by the excitation of the ultrasonic phased array probe in a measured object, reflecting the acoustic beam when the acoustic beam contacts the internal defects of the measured object, and processing the acoustic beam according to the receiving delay through a receiving circuit to obtain a detection echo signal;
and step four, transmitting the echo signals to a main control module, and transmitting the signals to a display interaction module by the main control module to perform defect imaging display.
And fifthly, drawing images of A scanning, B scanning and C scanning by the echo signals, and obtaining an image of S scanning by the image of B scanning through coordinate conversion, band-pass filtering of 2.8-9.6MHZ and bicubic interpolation operation.
And step six, evaluating the defect position and shape of the workpiece to be measured according to various imaging modes.
Referring to fig. 6, in this embodiment, a 32-array phased array probe with a working frequency of 5MHZ is used, the angle of a wedge is 36 °, the sound velocity in the wedge is 2337m/s, the probe is mounted on the wedge, and the probe is coupled with an object to be measured by a coupling agent. The measured object is one of the standard test blocks adopted by the international ultrasonic phased array instrument: type B test block, geometric representation as in fig. 7. And (3) carrying out equal-sound-path sector scanning on the vertical through holes in the B-type test block for detection imaging, wherein the deflection angle is 35-70 degrees, the angular stepping is 1 degree, the scanning lines are 36, and the focusing depth is 25 mm. The results of the tests performed by the example system are as follows:
as a result, as shown in fig. 8, 10 through holes can be clearly seen from the graph, no obvious missing inspection occurs, the measured defect size and shape are not significantly stretched or compressed, the distance between two adjacent through holes in the vertical direction also coincides with the actual distance, the images of the a scan, the B scan, the S scan and the C scan can be observed at the same time, and the defect information can be further supplemented.
As can be seen from the above detection results, the system of the embodiment can detect the defects of the test block and reflect the shape and position information of the defects.
Claims (6)
1. A portable ultrasonic phased array detection imaging system is characterized by comprising the following specific steps: scanning a workpiece to be detected by using an ultrasonic probe, setting detection parameters, calculating a focusing rule by using a circuit module, exciting each array element of the ultrasonic probe, and transmitting ultrasonic waves to the workpiece to be detected to obtain echo signals; drawing images of A scanning, B scanning and C scanning by echo signals, and obtaining an image of S scanning by the image of B scanning through coordinate conversion, 2.8-9.6MHZ band-pass filtering and bicubic interpolation operation; the position and the shape of the defect of the workpiece to be detected can be evaluated according to various imaging modes.
2. The portable ultrasonic phased array inspection imaging system of claim 1, characterized in that the main components comprise an ultrasonic phased array probe, an ultrasonic phased array circuit module, a main control module and a display interaction module; the display module sets detection parameters and displays echo data; the main control module issues detection parameters to the circuit module, receives echo data and sends the echo data to the display module for display; the circuit module calculates a focusing rule, excites array elements of the probe and collects echo data and transmits the data to the main control module.
3. The portable ultrasonic phased array detection imaging system according to claim 1, wherein the ultrasonic phased array circuit module can calculate the delay time of each array element of the ultrasonic phased array probe according to the deflection angle and the focusing depth set by the display interaction module.
4. The portable ultrasonic phased array inspection imaging system according to claim 1, wherein the display interaction module can display four imaging modes, namely, a-scan, B-scan, C-scan and S-scan in real time, and can flexibly combine a plurality of imaging modes.
5. The system according to claim 1, wherein for S-scan imaging, the S-scan matrix is filled with B-scan matrix data one by one, and coordinate transformation is performed by referring to the principle that a pixel (x, y) in B-scan coordinate system 1 corresponds to a pixel (x ', y') in the data matrix in S-scan coordinate system 2, and assuming that the sampling sequence length of each deflection angle in coordinate system 2 is L, where θ is 0 As a starting angle, theta end For the termination angle, Δ θ is the angular step, and N is the number of sampling points, and the corresponding coordinate conversion relationship is:
6. the system according to claim 1, wherein B-scan imaging is transformed into S-scan imaging, and bi-cubic interpolation is used to calculate the target pixel value using pixel values of 4 x 4 integer points around a floating point type coordinate point in order to compensate for the incomplete correspondence between pixels of the original image and the target image.
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| CN116058866A (en) * | 2022-12-12 | 2023-05-05 | 声索生物科技(上海)有限公司 | Depth detection device and detection method for ultrasonic imaging equipment |
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