CN114940857A - Corrosion-resistant composite epoxy resin photocuring film and preparation method thereof - Google Patents
Corrosion-resistant composite epoxy resin photocuring film and preparation method thereof Download PDFInfo
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- CN114940857A CN114940857A CN202210714556.1A CN202210714556A CN114940857A CN 114940857 A CN114940857 A CN 114940857A CN 202210714556 A CN202210714556 A CN 202210714556A CN 114940857 A CN114940857 A CN 114940857A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
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Abstract
The invention discloses an anticorrosive composite epoxy resin photocuring film and a preparation method thereof, wherein the film is prepared from the following raw materials in parts by weight: 85-95 parts of bisphenol A epoxy resin, 1-15 parts of multifunctional epoxy resin and 2 parts of cationic initiator. The invention takes bisphenol A epoxy resin as a body, introduces multifunctional epoxy resin with a specific proportion into a formula, and carries out photopolymerization under the action of a cationic initiator to prepare the composite epoxy resin film, the multifunctional epoxy resin monomer can rapidly carry out ring-opening reaction after being irradiated and crosslinked, and the part of the multifunctional group generates more hydroxyl groups (-OH), so that the film has good crosslinking density and adhesiveness, and the film achieves higher corrosion resistance.
Description
Technical Field
The invention relates to the technical field of coatings, in particular to an anti-corrosion composite epoxy resin photocuring film and a preparation method thereof.
Background
The metal material has wide application range and high production value, but the cost derived from metal corrosion is considerable, and in recent years, the disasters derived from corrosion are increased along with climate change. The global anticorrosive material has the value of 248 hundred million dollars in 2017, and is expected to reach 317 hundred million dollars in 2022, and the annual composite growth rate reaches 5 percent. The need for corrosion protection is greatly influenced by the environment, such as high temperature, high humidity, and high salt content, which all affect the degree of corrosion. In addition, for ships or green energy construction in coastal areas in the future, different high-corrosion-resistance coating systems and construction procedures are needed for metal components, so that corrosion resistance and solid protection requirements are met. Therefore, the development of anticorrosive coatings and the development of coating engineering are actively invested in various countries, in particular to heavy anticorrosive coatings used for petrochemical industry pipelines, marine ships, green energy facilities and the like.
Early anticorrosive coatings were prepared by adding toxic antifouling agents to epoxy resin high molecular coatings, however, these toxic antifouling agents flowed into the ocean over time to cause secondary pollution. In addition, the conventional anticorrosive paint process is usually accompanied by highly volatile solvent, so that the concentration of volatile organic compounds in the air is too high to affect the air. Since the issue of environmental protection is continuously being regarded as important, the development of an anticorrosive coating that is environmentally friendly and effective is becoming the mainstream of development.
Disclosure of Invention
The invention provides an anticorrosive composite epoxy resin photocuring film and a preparation method thereof, wherein a photocuring process is used for replacing the traditional thermosetting process, and meanwhile, a multifunctional epoxy resin is introduced to improve the crosslinking density of the photocuring film so as to improve the anticorrosive capacity.
The invention adopts the following technical scheme:
the anti-corrosion composite epoxy resin photocuring film is prepared from the following raw materials in parts by weight: 85-95 parts of bisphenol A epoxy resin, 1-15 parts of multifunctional epoxy resin and 2 parts of cationic initiator.
Preferably, the multifunctional epoxy resin is commercially available epoxy resin SU-8; the cationic initiator is triarylsulfonium salt cationic initiator.
More preferably, the cationic initiator is a double molecule 1172.
The Doublecure 1172 uses propylene carbonate as a solvent, and has a solid content of 40 wt%.
A preparation method of an anti-corrosion composite epoxy resin photocuring film is characterized in that multifunctional epoxy resin is added into a bisphenol A epoxy resin body according to a specific weight proportion, and photopolymerization is carried out under the action of a cationic initiator to prepare the anti-corrosion photocuring film.
The preparation method comprises the following steps:
s1, cleaning the surface of the metal to be coated for later use;
s2, mixing bisphenol A epoxy resin, multifunctional epoxy resin and a cationic initiator according to a specific ratio to obtain a mixed solution;
s3, dripping the prepared mixed liquid on cleaned metal, controlling the thickness in a scraper coating mode to coat, standing for 10-15min at room temperature, and putting the metal into an oven to volatilize the solvent in the cationic initiator to obtain a coated intermediate;
s4, placing the intermediate under an ultraviolet lamp for photocuring for 10-15min to obtain the required film.
In the step S1, the metal to be coated is sequentially placed into a surfactant and acetone, washed by ultrasonic oscillation for 10-15min, then washed by 1 wt% sulfuric acid solution for 30-45S, and finally washed by deionized water.
The coating rate of the blade coating in the step S3 is 80-100m/min, and the temperature of the oven is 50-60 ℃.
The wavelength of the ultraviolet lamp in the step S4 is 365 nm.
The technical scheme of the invention has the following advantages:
the invention takes bisphenol A epoxy resin as a body, introduces multifunctional epoxy resin with a specific proportion into a formula, and carries out photopolymerization under the action of a cationic initiator to prepare the composite epoxy resin film, the multifunctional epoxy resin monomer can rapidly carry out ring-opening reaction after being irradiated and crosslinked, and the part of the multifunctional group generates more hydroxyl groups (-OH), so that the film has good crosslinking density and adhesiveness, and the film achieves higher corrosion resistance. In addition, the invention can reduce the use of solvent by preparing the film by photopolymerization, and has the advantages of high speed and low energy consumption.
Drawings
In order to more clearly illustrate the embodiments of the present invention, the drawings which are needed to be used in the embodiments will be briefly described below, and it is apparent that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained from the drawings without inventive labor to those skilled in the art.
FIG. 1 is a Photo-DSC plot (heat flow) of SB-0, SB-5, SB-10 and SB-15 formulations;
FIG. 2 is a Photo-DSC plot (double bond conversion efficiency) of SB-0, SB-5, SB-10 and SB-15 formulations;
FIG. 3 is a graph of the potentiometric polarization curves for the SB series;
FIG. 4 is a graph showing the polarization of the potentiodynamic effect of SB-15 at different exposure times;
FIG. 5 is a graph showing the polarization of the potentiodynamics of SB-15 at various storage times.
Detailed Description
The technical solutions of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a corrosion-resistant composite epoxy resin photocuring film which is prepared from the following raw materials in parts by weight: 85-95 parts of bisphenol A epoxy resin, 1-15 parts of multifunctional epoxy resin and 2 parts of cationic initiator. Bisphenol A epoxy resin (BE188) is common epoxy resin sold in the market, multifunctional epoxy resin is selected from commercially available epoxy resin SU-8, cationic initiator is triarylsulfonium salt cationic initiator, and Doublecure 1172 with propylene carbonate as solvent is selected, wherein the solid content is 40 wt%. The chemical structures of SU-8, BE188 and Doublecure 1172 are as follows:
the invention also provides a preparation method of the corrosion-resistant composite epoxy resin photocured film, which is characterized in that the multifunctional epoxy resin is added into the bisphenol A epoxy resin body according to a specific weight proportion and is photopolymerized under the action of a cationic initiator to prepare the corrosion-resistant photocured film. The preparation method comprises the following specific steps:
s1, sequentially putting the metal to be coated into a surfactant and acetone, respectively washing the metal by ultrasonic oscillation for 10-15min, then washing the metal by 1 wt% sulfuric acid solution for 30-45S, and finally washing the metal by deionized water for later use;
s2, mixing bisphenol A epoxy resin, multifunctional epoxy resin and cationic initiator according to a specific proportion to obtain a mixed solution;
s3, dripping the prepared mixed liquid onto cleaned metal, coating at a coating speed of 80-100m/min by controlling the thickness in a scraper coating mode, standing at room temperature for 10-15min, putting into an oven, and volatilizing the solvent in the cationic initiator at 50-60 ℃ to obtain a coated intermediate;
s4, placing the intermediate under an ultraviolet lamp with the wavelength of 365nm for photocuring for 10-15min to obtain the required film.
The polymer photo-curable coating has attracted attention because of its low solvent evaporation, small operation space, room temperature reaction, low energy consumption, shortened process time, and easy control of production quality. The photo-curing technique generally refers to the condition that the unsaturated monomer is converted from liquid state to solid state by the energy generated under the irradiation of ultraviolet light, visible light or electron beam. The photo initiator can be classified into a Cationic Polymerization (CP) photo-curing system and a Free Radical Polymerization (FRP) photo-curing system according to the structure and the energy transmission manner. The CP system needs to be matched with an epoxy resin monomer to implement the photocuring system used by the invention. The CP mechanism is that when the photoinitiator absorbs light energy, the molecules are converted from a ground state to an excited state, and undergo a photocleavage reaction to generate Lewis acid (Lewis acid) or Bronsted acid, and then undergo a ring opening reaction with an Epoxy group on the Epoxy resin.
The bisphenol A epoxy resin (BE188) selected by the invention has the advantages of water resistance, heat resistance, chemical agent resistance, insulativity, mechanical property, electrical property, bonding property and the like. The product can be widely used for manufacturing polycarbonate, plastic and other polymeric materials or electronic component packaging, adhesives, corrosion-resistant coatings, surface coatings, printing ink, flame retardants and the like. However, the weather resistance is poor. The multifunctional radical epoxy resin SU-8 is one kind of epoxy type negative photoresist material widely used in microsystem manufacture procedure, and has excellent sensitivity and high depth-width ratio, excellent light source penetrating rate, chemical amplified photochemical reaction and greatly reduced exposure dosage, so that it is suitable for thick film photoresist manufacture procedure. Has good heat resistance, chemical stability, adhesiveness and other capabilities, is convenient to control the size, and can be uniformly distributed in a solvent. After irradiation with light, the crosslinking can rapidly carry out ring-opening reaction, and the multifunctional group part generates more hydroxyl groups (-OH), so that the film has good crosslinking density and adhesiveness, and the film achieves higher corrosion resistance.
In order to verify the anticorrosive effect of the present invention, the following experimental examples were conducted.
Experimental example 1:
first, film preparation
The raw materials SU-8, BE188 and Doublecure 1172 were mixed in the proportions given in the table below to prepare a thin film.
TABLE 1, SU-8 and BE-188 proportioning Table
The preparation method comprises the following steps:
s1, 4 copper plates (2.5mm x 2.5mm) are washed by ultrasonic vibration with surfactant and acetone for 10min, then washed by 1 wt% sulfuric acid solution for 30S, and washed by DI water. Prepared samples of SB-0, SB-5, SB-10 and SB-15 are respectively dripped on 4 copper plates, coating is carried out in a scraper coating mode with the thickness of 150um and the speed of 100m/min, then standing is carried out for 10min at room temperature, and then the samples are put into an oven (55 ℃) to wait for the solvent to be volatilized. The coated copper plate was then cured by UV light (365 nm wavelength) for 10min to complete the preparation of 4 film samples.
Two, Photo-DSC test
The Photo-DSC test aims at discussing the photoreaction rate of the epoxy resin with different proportions so as to know the reactivity of the whole formula and avoid the phenomenon that the film is incompletely cured. When the photo-curing reaction occurs, the reaction heat is released, and the formula C ═ Δ H t /H max overall To calculate the photocuring conversion, where C is the photocuring conversion,. DELTA.H t The heat of reaction at time t is represented by the maximum exothermic peak in the formula as H max overall The wavelength of the light source (250-450nm) and the intensity of 180mW/cm 2 And (5) irradiating and curing. The formulation is shown in table 1, the experimental results are shown in fig. 1 and fig. 2, and the data are collated in table 2.
TABLE 2 Photo-DSC properties of SB-0, SB-5, SB-10 and SB-15 formulations a
a At 180mW/cm 2 UV lamp irradiation formula with wavelength of 250-450nm for 8min
b H max Peak of maximum heat release
c T max Maximum heat release time
As a result, it was found that SB-15 has the longest T max (i.e., slower reaction time) but with the largest exothermic peak H max The value was 405mW/mg, and thus the highest double bond conversion was obtained. All the maximum heat release peak values Hmax were in the order of SB-15 (56.61%)>SB-10(46.84％)>SB-5(40.59％)>SB-0 (39.69%), and the order of the maximum heat release time Tmax is SB-0(53s)>SB-5(57s)>SB-10(64s)>SB-15(71s)。It is shown that the introduction of SU-8 multifunctional epoxy resin increases the peak exotherm but decreases the maximum exotherm time due to the presence of multiple epoxy resin functional groups. However, it can be seen that all the formulations have completed their reaction within the measurement time range, indicating that the reactivity does not affect the final reaction level due to the addition of different formulations.
Three, moving potential polarization test
The variation of the cathode and anode potential values and the current value is recorded by using a potentiodynamic polarization method to obtain a polarization curve. And obtaining data such as corrosion voltage, corrosion current density, corrosion rate and the like by a Tafel extrapolation method, and judging the corrosion degree of the corrosion. Samples (Table 1) were coated on a steel plate using a doctor blade, cured by irradiation for 10min to a film thickness of about 50um, and etched in an area of 25mm controlled with PI tape 2 Thus, a test piece was prepared. The counter electrode is a platinum electrode, the reference electrode is a calomel electrode, the working electrode is a test piece, and the test piece is inserted into a 3M sodium chloride solution. The instrument was first allowed to stabilize for 1 hour, the voltage range was controlled between-2V to 1V, and the voltage increase rate was 30 mV/min. The polarization curves and data are as follows (fig. 3, table 3). It is known from the results that the use of SU-8 can increase the crosslinking density and the complexity of the network, and when it is used for cationic ring-opening photopolymerization, the multifunctional SU-8 can also increase the hydroxyl groups (-OH) to increase the adhesion between the film and the metal plate, so that corrosive ions are less likely to penetrate and the metal plate is less likely to be corroded from the interface, and the corrosion resistance of SAU is greatly improved. And when the content of SU-8 is increased to 15 wt%, the corrosion voltage (E) is increased corr ) Corrosion current density (I) corr ) Corrosion rate (R) corr ) And also decreases, thereby resulting in an increase in the polarization resistance value (Rp), and finally a corrosion inhibition rate as high as 99.92%.
TABLE 3 Tafel extrapolation method test results
In addition, in the comparative example, the polarization curves of the SB-15 formulation under different illumination time were investigated, and data such as the etching voltage, the etching current density, and the etching rate were obtained by Tafel extrapolation method, and the data are shown in FIG. 4 and Table 4. From the results, the corrosion inhibition rates were 67.26%, 99.92% and 79.91% for 5, 10 and 15 minutes of irradiation, respectively. The efficiency of the film tends to increase and decrease with the irradiation time, and the film has poor corrosion resistance efficiency at 5 minutes because the film has not been highly polymerized, while the film has a high crosslinking density and is hard and brittle when the irradiation time is too long and 15 minutes is long, thereby reducing the corrosion resistance efficiency. The test shows better results of corrosion resistance in 10 minutes.
TABLE 4 Tafel extrapolation of SB-15 at different exposure times
In addition, in the comparative example, the polarization curves of the SB-15 formulation under different storage times were also investigated, and the data of corrosion voltage, corrosion current density, corrosion rate, etc. were obtained by Tafel extrapolation method, and the data are shown in FIG. 5 and Table 5. From the results, the corrosion inhibition rates were 99.92%, 97.30% and 14.08% after 1, 7 and 30 days of storage, respectively. The efficiency tends to decrease with storage time, since cationic photocuring systems may suffer from post-curing problems, which may result in polymerization continuing to result in too high a cross-link density, for which the photoinitiator content may be adjusted or other cationic photoinitiators may be used to inhibit the post-curing effect.
TABLE 5 Tafel extrapolation results of SB-15 at different storage times
The invention takes bisphenol A epoxy resin as a body, introduces multifunctional epoxy resin with a specific proportion into a formula, and carries out photopolymerization under the action of a cationic initiator to prepare the composite epoxy resin film, the multifunctional epoxy resin monomer can rapidly carry out ring-opening reaction after being irradiated and crosslinked, and the part of the multifunctional group generates more hydroxyl groups (-OH), so that the film has good crosslinking density and adhesiveness, and the film achieves higher corrosion resistance. In addition, the invention can reduce the use of solvent by preparing the film by photopolymerization, and has the advantages of high speed and low energy consumption.
Nothing in this specification is said to apply to the prior art.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications therefrom are intended to be within the scope of the invention.
Claims (9)
1. The corrosion-resistant composite epoxy resin photocuring film is characterized by being prepared from the following raw materials in parts by weight:
85-95 parts of bisphenol A epoxy resin
1-15 parts of multifunctional epoxy resin
2 parts of cationic initiator.
2. The anticorrosive composite epoxy resin photocurable film according to claim 1, wherein the multifunctional epoxy resin is commercially available epoxy resin SU-8;
the cationic initiator is triarylsulfonium salt cationic initiator.
3. The anticorrosive composite epoxy photocurable film according to claim 2, wherein the cationic initiator is a double cure 1172.
4. The anticorrosive composite epoxy photocurable film according to claim 3, wherein the Doubcure 1172 is prepared from a propylene carbonate solvent and has a solid content of 40 wt%.
5. A preparation method of an anti-corrosion composite epoxy resin photocuring film is characterized in that multifunctional epoxy resin is added into a bisphenol A epoxy resin body according to a specific weight proportion, and photopolymerization is carried out under the action of a cationic initiator to prepare the photocuring film with anti-corrosion characteristics.
6. The method of claim 5, comprising the steps of:
s1, cleaning the surface of the metal to be coated for later use;
s2, mixing bisphenol A epoxy resin, multifunctional epoxy resin and a cationic initiator according to a specific ratio to obtain a mixed solution;
s3, dripping the prepared mixed liquid on cleaned metal, controlling the thickness in a scraper coating mode to coat, standing for 10-15min at room temperature, and putting the metal into an oven to volatilize the solvent in the cationic initiator to obtain a coated intermediate;
s4, placing the intermediate under an ultraviolet lamp for photocuring for 10-15min to obtain the required film.
7. The method according to claim 6, wherein in step S1, the metal to be coated is sequentially placed in the surfactant and acetone, washed by ultrasonic oscillation for 10-15min, then washed by 1 wt% sulfuric acid solution for 30-45S, and finally washed by deionized water.
8. The method according to claim 6, wherein the coating rate of the blade coating in the step S3 is 80-100m/min, and the temperature of the oven is 50-60 ℃.
9. The method according to claim 6, wherein the ultraviolet lamp in the step S4 has a wavelength of 365 nm.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5726216A (en) * | 1995-07-26 | 1998-03-10 | Lockheed Martin Energy Systems, Inc. | Toughened epoxy resin system and a method thereof |
| US20050260522A1 (en) * | 2004-02-13 | 2005-11-24 | William Weber | Permanent resist composition, cured product thereof, and use thereof |
| CN1934498A (en) * | 2004-02-13 | 2007-03-21 | 微量化学公司 | Permanent resist composition, cured product thereof, and use thereof |
| TW200813633A (en) * | 2006-07-14 | 2008-03-16 | Nippon Kayaku Kk | Photosensitive resin composition, laminate comprising the same, cured product of the same and method for forming pattern using the same (1) |
| CN101176038A (en) * | 2005-05-13 | 2008-05-07 | 微量化学公司 | Method of forming a photoresist element |
| US20100165044A1 (en) * | 2008-12-31 | 2010-07-01 | Samsung Electronics Co., Ltd. | Inkjet prtinthead and method of manufacturing the same |
| CN110073258A (en) * | 2016-12-21 | 2019-07-30 | 日东电工株式会社 | Optical waveguide, which is formed, to be formed with curability film with photosensitive epoxy composition, optical waveguide and transmits hybrid flexible print wiring board using its optical waveguide, optical electrical |
-
2022
- 2022-06-23 CN CN202210714556.1A patent/CN114940857A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5726216A (en) * | 1995-07-26 | 1998-03-10 | Lockheed Martin Energy Systems, Inc. | Toughened epoxy resin system and a method thereof |
| US20050260522A1 (en) * | 2004-02-13 | 2005-11-24 | William Weber | Permanent resist composition, cured product thereof, and use thereof |
| CN1934498A (en) * | 2004-02-13 | 2007-03-21 | 微量化学公司 | Permanent resist composition, cured product thereof, and use thereof |
| CN101176038A (en) * | 2005-05-13 | 2008-05-07 | 微量化学公司 | Method of forming a photoresist element |
| TW200813633A (en) * | 2006-07-14 | 2008-03-16 | Nippon Kayaku Kk | Photosensitive resin composition, laminate comprising the same, cured product of the same and method for forming pattern using the same (1) |
| US20100165044A1 (en) * | 2008-12-31 | 2010-07-01 | Samsung Electronics Co., Ltd. | Inkjet prtinthead and method of manufacturing the same |
| CN110073258A (en) * | 2016-12-21 | 2019-07-30 | 日东电工株式会社 | Optical waveguide, which is formed, to be formed with curability film with photosensitive epoxy composition, optical waveguide and transmits hybrid flexible print wiring board using its optical waveguide, optical electrical |
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