CN114939936B - Cutting device with protective structure for wafer processing - Google Patents
Cutting device with protective structure for wafer processing Download PDFInfo
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- CN114939936B CN114939936B CN202210749181.2A CN202210749181A CN114939936B CN 114939936 B CN114939936 B CN 114939936B CN 202210749181 A CN202210749181 A CN 202210749181A CN 114939936 B CN114939936 B CN 114939936B
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- bevel gear
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- fixedly connected
- cutting
- heat dissipation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention discloses a cutting device with a protective structure for processing wafers, which comprises a wafer cutting machine body, wherein two first sliding rails are symmetrically arranged on two sides of the top of the wafer cutting machine body, hydraulic telescopic rods are arranged on one sides of the bottoms of the two first sliding rails, the output ends of the two hydraulic telescopic rods are fixedly connected with a portal frame, and a cutting moving mechanism is arranged on the top of one side of the portal frame.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a cutting device with a protection structure for wafer processing.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, and after grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, namely the wafer, and the domestic wafer production line is mainly 8 inches and 12 inches;
the processing technology of the wafer is complex and various, the wafer cutting is one of them, the wafer cutting mode that is common at present includes abrasive wheel cutting, laser cutting, the method of dividing the sword splitting, diamond wire cutting etc. abrasive wheel cutting is one of them uses comparatively extensively, however the wafer cutting device on the market at present easily appears the circumstances that the piece splashes in cutting process, the security of going of cutting has been reduced, simultaneously in cutting process, can send a large amount of heats on wafer and the abrasive wheel, the heat is not in time given off and is easily led to the fact irreversible injury to the wafer, dust and impurity on wafer surface can influence the quality of wafer equally simultaneously, and the degree of automation of current wafer cutting equipment cutting process is low, need artifical participation, and be difficult to cut the wafer of different sizes.
Disclosure of Invention
The present invention is directed to a wafer processing dicing apparatus with a protection structure, so as to solve the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a cutting device is used in wafer processing with protective structure, includes the wafer cutting machine body, two first slide rails are installed to wafer cutting machine body top bilateral symmetry, and two first slide rail bottom one side all installs hydraulic telescoping rod, two hydraulic telescoping rod output fixedly connected with portal frame, and portal frame one side top installs the cutting mobile mechanism, cutting mobile mechanism one side bottom fixedly connected with fixed plate, and fixed plate one side top installs the protection casing, protection casing one side fixedly connected with protection machanism, and the cooling machanism is installed to the protection casing opposite side.
Preferably, supporting legs are welded and fixed at four corners of the bottom of the wafer cutting machine body respectively, and side coamings are arranged at the edge of the top of the wafer cutting machine body.
Preferably, the cutting moving mechanism comprises side plates, a first screw rod, a hand wheel, a reinforcing block, a moving block, a first guide rod, a second screw rod, a fixing frame, a lifting block, a cutting motor and a servo motor, wherein two side plates are symmetrically arranged at the top of one side of the portal frame, the first screw rod is connected with the two side plates in a rotating way at the center of one side opposite to the side plates, the servo motor is fixedly connected with one side center of one side plate, the output end of the servo motor is fixedly connected with one end of the first screw rod, the center of the first screw rod is matched and connected with the moving block through a ball nut, one side center of the moving block is fixedly connected with the fixing frame, the center of the fixing frame movably penetrates through the second screw rod, the second screw rod is rotationally connected with the fixing frame, the hand wheel is arranged at the center of the top of the fixing frame, the hand wheel is fixedly connected with the top of the second screw rod through a ball nut, the lifting block is arranged at the middle lower part of the second screw rod in a matched and is provided with the lifting block on one side of the cutting motor, the two sides of the lifting block respectively movably penetrates through the second guide rods at two sides of the center of the lifting block, and two ends of the second guide rods are respectively fixedly connected with the top and two sides of the bottom of the fixing frame.
Preferably, the two sides of the center of the moving block are respectively and movably penetrated with a first guide rod, two ends of the two first guide rods are respectively and fixedly connected with one opposite sides of the two side plates, two reinforcing blocks are symmetrically arranged on one side of the moving block, and two opposite sides of the two reinforcing blocks are respectively and fixedly connected with the centers of two sides of the fixing frame.
Preferably, the end face of the output end of the cutting motor is fixedly connected with one side of the fixed plate, the output end of the cutting motor movably penetrates through the center of the fixed plate, and the output end of the cutting motor is sleeved and fixed with a cutting wheel.
Preferably, the protection machanism includes activity guard shield, screw thread piece, fastening screw, second slide rail, slider and spout, two second slide rails are installed to guard shield one side symmetry, and two slide rails have all been seted up at two second slide rail top centers, two slide rail inside sliding connection has two sliders, and two screw thread pieces of two slider top center fixedly connected with, two screw thread piece top fixedly connected with activity guard shield, and activity guard shield top bilateral symmetry runs through two fastening screw, two fastening screw centers pass through screw thread fixed connection with two screw thread pieces, and two fastening screw bottoms run through two sliders, and two fastening screw bottoms are laminated with two slide rail inside bottom surfaces.
Preferably, the heat dissipation mechanism comprises a heat dissipation box, a drive bevel gear, a driven bevel gear, a fixed shaft, an installation seat, a first reduction bevel gear, a filter screen, a second reduction bevel gear, a linkage shaft, a fixing base, a third reduction bevel gear, a drive shaft, a bearing seat, a drive bevel gear, blades and an air outlet, wherein the heat dissipation box is installed on the other side of the protective cover, the installation seat is installed at the top of one side of the inside of the heat dissipation box, the installation seat is movably penetrated with the fixed shaft, the fixed shaft is rotationally connected with the installation seat, the driven bevel gear is installed at one end of the fixed shaft, the drive bevel gear is meshed with the outer circumference of the driven bevel gear, the drive bevel gear is sleeved and fixed at the center of the output end of the cutting motor, the first reduction bevel gear is installed at the other end of the fixed shaft, the second reduction bevel gear is meshed with the outer circumference bottom of the first reduction bevel gear, the second reduction bevel gear is fixedly penetrated with the linkage shaft, the fixing base is sleeved and fixed at the center of the linkage shaft, the fixing base is rotationally connected with the linkage shaft, and the fixing base is installed at the center of the other side of the inside of the heat dissipation box.
Preferably, the driving bevel gear is meshed on one side of the outer circumference of the third speed reduction bevel gear, the driving shaft penetrates through the center of the driving bevel gear, the blades are installed at one end of the driving shaft, the bearing seat is sleeved at one end of the center of the driving shaft and connected with the driving shaft in a rotating mode through the bearing, the bearing seat is installed on one side of the bottom face inside the heat dissipation box, the air outlet is formed in the bottom of one side of the heat dissipation box, the air inlet is formed in the top of the other side of the heat dissipation box, and the filter screen is installed on the air inlet.
Preferably, an objective table is installed on one side of the top of the wafer cutting machine body, and a wafer is installed on the objective table through a clamp.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention has high cutting automation degree, does not need a large amount of manual participation, reduces labor cost, simultaneously, is convenient for cutting wafers with different sizes by installing the cutting moving mechanism, and expands the application range of equipment;
2. according to the invention, through the installation of the protection mechanism and the protection cover, the occurrence of the splashing situation of scraps in the cutting process is greatly reduced, and meanwhile, the movable protection cover in the protection mechanism can be flexibly moved, so that the position of the movable protection cover can be adjusted according to the actual situation, and the protection capability is improved;
3. according to the invention, the heat radiation mechanism is linked with the cutting motor in the cutting moving mechanism, and the rotation of the output end of the cutting motor drives the blades to rotate for heat radiation after the speed reduction of the speed reduction gear set, so that the heat radiation capability of the equipment is improved, and meanwhile, the rotation of the blades is beneficial to removing dust and impurities on the surface of a wafer, and the practicability of the equipment is improved.
Drawings
FIG. 1 is a perspective view of the overall structure of the present invention;
FIG. 2 is an enlarged schematic view of area A of FIG. 1 in accordance with the present invention;
FIG. 3 is a front elevational view of the overall structure of the present invention;
FIG. 4 is a front cross-sectional view of the guard mechanism of the present invention;
FIG. 5 is a side view of the overall structure of the present invention;
FIG. 6 is a front cross-sectional view of a heat dissipating mechanism of the present invention;
FIG. 7 is a top view of the overall structure of the present invention;
in the figure: 1. a wafer cutter body; 2. support legs; 3. a first slide rail; 4. an objective table; 5. a protective mechanism; 6. a fixing plate; 7. a cutting movement mechanism; 8. a portal frame; 9. a heat dissipation mechanism; 10. side coaming; 11. a protective cover; 12. a cutting wheel; 13. a hydraulic telescopic rod; 701. a side plate; 702. a first screw rod; 703. a hand wheel; 704. a reinforcing block; 705. a moving block; 706. a first guide bar; 707. a second guide bar; 708. a second screw rod; 709. a fixing frame; 710. a lifting block; 711. a cutting motor; 712. a servo motor; 501. a movable shield; 502. a screw block; 503. a fastening screw; 504. a second slide rail; 505. a slide block; 506. a chute; 901. a heat radiation box; 902. a drive bevel gear; 903. a driven bevel gear; 904. a fixed shaft; 905. a mounting base; 906. a first reduction bevel gear; 907. a filter screen; 908. a second reduction bevel gear; 909. a linkage shaft; 910. a fixing seat; 911. a third reduction bevel gear; 912. a drive shaft; 913. a bearing seat; 914. driving a bevel gear; 915. a blade; 916. and an air outlet.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-7, an embodiment of the present invention is provided: the cutting device with the protection structure for processing the wafer comprises a wafer cutting machine body 1, supporting legs 2 are welded and fixed at four corners of the bottom of the wafer cutting machine body 1 respectively, a side wall plate 10 is arranged at the edge of the top of the wafer cutting machine body 1, an objective table 4 is arranged on one side of the top of the wafer cutting machine body 1, a wafer is arranged on the objective table 4 through a clamp, the installation equipment which is favorable for being stabilized by the supporting legs 2 is symmetrically arranged on two sides of the top of the wafer cutting machine body 1, two first sliding rails 3 are symmetrically arranged on one side of the bottom of the two first sliding rails 3, hydraulic telescopic rods 13 are respectively arranged on one side of the bottom of the two first sliding rails 3, the output ends of the two hydraulic telescopic rods 13 are fixedly connected with a portal frame 8, a cutting moving mechanism 7 is arranged on one side of the portal frame 8, the cutting moving mechanism 7 comprises a side plate 701, a first lead screw 702, a hand wheel 703, a reinforcing block 704, a moving block, a first guide rod 706, a second guide rod fixing frame 707, a second lead screw 708, 709, a lifting block 710, a cutting motor 711 and a servo motor 712, two side plates 701 are symmetrically arranged at the top of one side of the portal frame 8, a first screw mandrel 702 is rotationally connected with the centers of the opposite sides of the two side plates 701, a servo motor 712 is fixedly connected with the center of one side of the side plate 701, the output end of the servo motor 712 is fixedly connected with one end center of the first screw mandrel 702, the center of the first screw mandrel 702 is connected with a moving block 705 through a ball nut in a matching way, a fixed frame 709 is fixedly connected with the center of one side of the moving block 705, a second screw mandrel 708 movably penetrates through the center of the fixed frame 709, the second screw mandrel 708 is rotationally connected with the fixed frame 709, a hand wheel 703 is arranged at the center of the top of the fixed frame 709, the hand wheel 703 is fixedly connected with the center of the top of the second screw mandrel 708 through a connecting shaft, a lifting block 710 is connected with the middle lower part of the second screw mandrel 708 through the ball nut in a matching way, and a cutting motor 711 is installed on one side of the lifting block 710, two sides of the center of the lifting block 710 are respectively and movably penetrated by a second guide rod 707, two ends of the two second guide rods 707 are respectively and fixedly connected with two sides of the top and bottom of the fixing frame 709, two sides of the center of the moving block 705 are respectively and movably penetrated by a first guide rod 706, two ends of the two first guide rods 706 are respectively and fixedly connected with one side of the two side plates 701 opposite to each other, two reinforcing blocks 704 are symmetrically installed on one side of the moving block 705, two opposite sides of the two reinforcing blocks 704 are respectively and fixedly connected with the centers of two sides of the fixing frame 709, the end face position of the output end of the cutting motor 711 is fixedly connected with one side of the fixing plate 6, the output end of the cutting motor 711 is movably penetrated through the center of the fixing plate 6, the output end of the cutting motor 711 is sheathed and fixed with a cutting wheel 12 which is beneficial to cutting wafers of different sizes by the cutting moving mechanism 7, the bottom of one side of the cutting moving mechanism 7 is fixedly connected with a fixed plate 6, the top of one side of the fixed plate 6 is provided with a protective cover 11, one side of the protective cover 11 is fixedly connected with a protective mechanism 5, the protective mechanism 5 comprises a movable protective cover 501, thread blocks 502, fastening screws 503, second sliding rails 504, sliding blocks 505 and sliding grooves 506, two second sliding rails 504 are symmetrically arranged on one side of the protective cover 11, the centers of the tops of the two second sliding rails 504 are respectively provided with a sliding groove 506, two sliding blocks 505 are slidably connected inside the two sliding grooves 506, the centers of the tops of the two sliding blocks 505 are fixedly connected with two thread blocks 502, the tops of the two thread blocks 502 are fixedly connected with a movable protective cover 501, two fastening screws 503 are symmetrically penetrated through the two sides of the top of the movable protective cover 501, the centers of the two fastening screws 503 are fixedly connected with the two thread blocks 502 through threads, the bottoms of the two fastening screws 503 penetrate the two sliding blocks 505, and the bottoms of the two fastening screws 503 are attached to the inner bottom surfaces of the two sliding grooves 506, so that the expansion and contraction of the movable shield 501 can be realized through the protection mechanism 5, the other side of the protection cover 11 is provided with the heat dissipation mechanism 9, the heat dissipation mechanism 9 comprises a heat dissipation box 901, a drive bevel gear 902, a driven bevel gear 903, a fixed shaft 904, a mounting seat 905, a first reduction bevel gear 906, a filter screen 907, a second reduction bevel gear 908, a linkage shaft 909, a fixed seat 910, a third reduction bevel gear 911, a driving shaft 912, a bearing seat 913, a driving bevel gear 914, blades 915 and an air outlet 916, the other side of the protection cover 11 is provided with the heat dissipation box 901, the top of one side of the inside of the heat dissipation box 901 is provided with the mounting seat 905, the center of the mounting seat 905 movably penetrates through the fixed shaft 904, the fixed shaft 904 is rotatably connected with the mounting seat 905, one end of the fixed shaft 904 is provided with the driven bevel gear 903, and the outer circumference of the driven bevel gear 903 is meshed with the drive bevel gear 902, the drive bevel gear 902 is sleeved and fixed at the center of the output end of the cutting motor 711, the other end of the fixed shaft 904 is provided with a first reduction bevel gear 906, the bottom of the outer circumference of the first reduction bevel gear 906 is meshed with a second reduction bevel gear 908, the center of the second reduction bevel gear 908 is fixedly penetrated with a linkage shaft 909, the center of the linkage shaft 909 is sleeved and fixed with a fixed seat 910, the fixed seat 910 is rotationally connected with the linkage shaft 909, the fixed seat 910 is arranged at the center of the other side inside the heat dissipation box 901, the bottom of the linkage shaft 909 is sleeved and fixed with a third reduction bevel gear 911, one side of the outer circumference of the third reduction bevel gear 911 is meshed with a drive bevel gear 914, the center of the drive bevel gear 914 is fixedly penetrated with a drive shaft 912, one end of the drive shaft 912 is provided with a blade 915, one end of the center of the drive shaft 912 is sleeved with a bearing seat 913, the bearing seat 913 is rotationally connected with the drive shaft 912 through a bearing, and the bearing frame 913 is installed in the inside bottom surface one side of heat dissipation case 901, and air outlet 916 has been seted up to heat dissipation case 901 one side bottom, and the air intake has been seted up at heat dissipation case 901 opposite side top, and installs filter screen 907 on the air intake, is favorable to realizing the quick heat dissipation of equipment.
Working principle: in the use process of the invention, firstly, a wafer to be processed and cut is placed on a clamp on a stage 4, then the height of a cutting motor 711 is adjusted according to the thickness of the wafer, a hand wheel 703 is rotated, then a second screw rod 708 is driven to rotate, because the second screw rod 708 is connected with a lifting block 710 in a matched manner through a ball nut, then the lifting block 710 is driven to move upwards along a second guide rod 707, then the cutting motor 711 is driven to move upwards, then a fixing plate 6 is driven to move upwards, then a cutting wheel 12 is driven to move upwards, the hand wheel 703 is reversed, the downward movement of the cutting wheel 12 is realized, the wafers with different thicknesses are conveniently cut, the position of a movable shield 501 in a protection mechanism 5 is adjusted before cutting, a fastening screw 503 is unscrewed, the pressing and fixing of the fastening screw 503 to a second sliding rail 504 are loosened, and a sliding block 505 is slid along the direction of a sliding groove 506 at the moment, the screw block 502 is driven to slide along the direction of the sliding groove 506, the movable shield 501 is driven to slide along the direction of the sliding groove 506, the fastening screw 503 is screwed after the movable shield 501 is regulated to a proper position, the position regulation of the movable shield 501 is completed, the protection capability is improved, the cutting motor 711 is opened to cut, the output end of the cutting motor 711 drives the cutting wheel 12 to rotate to cut in the cutting process, the hydraulic telescopic rod 13 drives the portal frame 8 to move along the X axis direction, the cutting motor 711 is driven to move along the X axis direction, meanwhile, the rotation of the servo motor 712 drives the first screw rod 702 to rotate, the first screw rod 702 is connected with the movable block 705 in a matched manner through the ball nut, the movable block 705 is driven to move along the Y axis direction along the first guide rod 706, the movement of the cutting motor 711 along the Y axis direction is realized, the automatic cutting of a wafer is realized without a large amount of manual cooperation, the practicability of the device is improved, meanwhile, in the process of rotating the output end of the cutting motor 711, the driving bevel gear 902 is driven to rotate, then the driven bevel gear 903 is driven to rotate, the tooth ratio of the driven bevel gear 903 to the driving bevel gear 902 is 1:1, then the fixed shaft 904 is driven to rotate, then the first reduction bevel gear 906 is driven to rotate, then the second reduction bevel gear 908 is driven to rotate, the tooth ratio of the first reduction bevel gear 906 to the second reduction bevel gear 908 is 1:1.5, then the universal driving shaft 909 is driven to rotate, then the third reduction bevel gear 911 is driven to rotate, then the driving shaft 912 is driven to rotate, then the blades 915 are driven to rotate, so that the blades 915 are utilized to perform blowing and heat dissipation, dust and impurities on the surface of a wafer are blown out, the filter screen 907 is used for filtering dust, the fixed shaft 904 is arranged on the fixed shaft 905, and the bearing seat 913 is used for fixing the universal driving shaft 909 is used for fixing the driving shaft 912.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. Cutting device is used in wafer processing with protective structure, including wafer cutting machine body (1), its characterized in that: two first sliding rails (3) are symmetrically arranged on two sides of the top of the wafer cutting machine body (1), hydraulic telescopic rods (13) are respectively arranged on one side of the bottom of each of the two first sliding rails (3), the output ends of the two hydraulic telescopic rods (13) are fixedly connected with a portal frame (8), a cutting moving mechanism (7) is arranged on one side top of each portal frame (8), a fixed plate (6) is fixedly connected with one side bottom of each cutting moving mechanism (7), a protective cover (11) is arranged on one side top of each fixed plate (6), a protective cover (11) is fixedly connected with a protective mechanism (5), a heat dissipation mechanism (9) is arranged on the other side of each protective cover (11), each cutting moving mechanism (7) comprises a side plate (701), a first screw rod (702), a hand wheel (703), a reinforcing block (704), a moving block (705), a first guide rod (706), a second guide rod (707), a second screw rod (708), a fixed frame (709), a lifting block (710), a cutting motor (711) and a servo motor (712), two side plates (701) are symmetrically arranged on one side top of each portal frame (8), two side plates (701), two side plates are rotatably connected with one side plate (702) and one side plate (712) is connected with one side (712) by one side opposite to the center plate (which is fixedly connected with one side (712), the output end of the servo motor (712) is fixedly connected with one end center of the first screw rod (702), the center of the first screw rod (702) is connected with a moving block (705) through a ball nut, one side center of the moving block (705) is fixedly connected with a fixing frame (709), the center of the fixing frame (709) is movably penetrated with a second screw rod (708), the second screw rod (708) is rotationally connected with the fixing frame (709), the center of the top of the fixing frame (709) is provided with a hand wheel (703), the hand wheel (703) is fixedly connected with the center of the top of the second screw rod (708) through a connecting shaft, the middle lower part of the second screw rod (708) is connected with a lifting block (710) through a ball nut, one side of the lifting block (710) is provided with a cutting motor (711), two sides of the center of the lifting block (710) are movably penetrated with second guide rods (707), two ends of the two second guide rods (707) are respectively fixedly connected with two sides of the top and bottom of the fixing frame (709), the protection mechanism (5) comprises a movable protection cover (501), a threaded block (502), a fastening screw (503), a second sliding rail (504), a sliding block (505) and a sliding groove (506) are fixedly connected with the top of the second sliding rail (506), one side of the protection cover (11) is provided with a second sliding rail (504), two sliding blocks (505) are connected inside the two sliding grooves (506), two thread blocks (502) are fixedly connected to the centers of the tops of the two sliding blocks (505), a movable shield (501) is fixedly connected to the tops of the two thread blocks (502), two fastening screws (503) are symmetrically penetrated through the two sides of the tops of the movable shield (501), the centers of the two fastening screws (503) are fixedly connected with the two thread blocks (502) through threads, the bottoms of the two fastening screws (503) penetrate through the two sliding blocks (505), the bottoms of the two fastening screws (503) are attached to the bottom surfaces inside the two sliding grooves (506), the heat dissipation mechanism (9) comprises a heat dissipation box (901), a driving bevel gear (902), a driven bevel gear (903), a fixed shaft (904), a mounting seat (905), a first reduction bevel gear (906), a filter screen (907), a second reduction bevel gear (908), a linkage shaft (909), a fixed seat (910), a third reduction bevel gear (911), a driving shaft (912), a bearing seat (913), a driving bevel gear (915), a blade (915) and an air outlet (916), a heat dissipation box (901) is mounted on the other side of the shield (11), and the heat dissipation box (905) is mounted on one side of the heat dissipation box (905) and the inner side of the heat dissipation box (905) is internally provided with the movable shield, and fixed axle (904) are connected with mount pad (905) rotation, driven bevel gear (903) are installed to fixed axle (904) one end, and driven bevel gear (903) outer circumference meshing has initiative bevel gear (902), initiative bevel gear (902) cup joint and fix in the output center of cutting motor (711), first speed reduction bevel gear (906) are installed to the fixed axle (904) other end, and first speed reduction bevel gear (906) outer circumference bottom meshing has second speed reduction bevel gear (908), second speed reduction bevel gear (908) center fixed the penetration has universal driving shaft (909), and universal driving shaft (909) center cup joint and be fixed with fixing base (910), fixing base (910) are connected with universal driving shaft (909) rotation, and fixing base (910) are installed at the inside opposite side center of heat dissipation case (901), third speed reduction bevel gear (911) are cup jointed and are fixed in the universal driving shaft (909) bottom.
2. The wafer processing dicing apparatus with a protective structure according to claim 1, wherein: supporting legs (2) are welded and fixed at four corners of the bottom of the wafer cutting machine body (1) respectively, and side coamings (10) are arranged at the edge of the top of the wafer cutting machine body (1).
3. The wafer processing dicing apparatus with a protective structure according to claim 1, wherein: the two sides of the center of the moving block (705) are respectively and movably penetrated with a first guide rod (706), two ends of the two first guide rods (706) are respectively and fixedly connected with one side of the two side plates (701) opposite to each other, two reinforcing blocks (704) are symmetrically arranged on one side of the moving block (705), and two opposite sides of the two reinforcing blocks (704) are respectively and fixedly connected with the centers of two sides of the fixing frame (709).
4. The wafer processing dicing apparatus with a protective structure according to claim 1, wherein: the end face of the output end of the cutting motor (711) is fixedly connected with one side of the fixed plate (6), the output end of the cutting motor (711) movably penetrates through the center of the fixed plate (6), and the output end of the cutting motor (711) is sleeved and fixed with a cutting wheel (12).
5. The wafer processing dicing apparatus with a protective structure according to claim 1, wherein: the third speed reduction bevel gear (911) is meshed with the drive bevel gear (914) on one side of the outer circumference, the center of the drive bevel gear (914) is fixedly penetrated with the drive shaft (912), one end of the drive shaft (912) is provided with the blade (915), one end of the center of the drive shaft (912) is sleeved with the bearing seat (913), the bearing seat (913) is rotationally connected with the drive shaft (912) through the bearing, the bearing seat (913) is arranged on one side of the inner bottom surface of the heat dissipation box (901), the bottom of one side of the heat dissipation box (901) is provided with the air outlet (916), the top of the other side of the heat dissipation box (901) is provided with the air inlet, and the air inlet is provided with the filter screen (907).
6. The wafer processing dicing apparatus with a protective structure according to claim 2, wherein: an objective table (4) is arranged on one side of the top of the wafer cutting machine body (1), and a wafer is arranged on the objective table (4) through a clamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210749181.2A CN114939936B (en) | 2022-06-29 | 2022-06-29 | Cutting device with protective structure for wafer processing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210749181.2A CN114939936B (en) | 2022-06-29 | 2022-06-29 | Cutting device with protective structure for wafer processing |
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| CN114939936A CN114939936A (en) | 2022-08-26 |
| CN114939936B true CN114939936B (en) | 2023-07-14 |
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| CN115519687B (en) * | 2022-11-02 | 2023-09-26 | 江苏宝浦莱半导体有限公司 | Prevent wafer scribing cutting equipment of edge breakage |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111085721A (en) * | 2019-12-17 | 2020-05-01 | 郑祥模 | Cutting device with angle material collecting function for mechanical equipment production |
| CN111660127A (en) * | 2020-07-14 | 2020-09-15 | 泉州京锯智能科技有限公司 | Full automatic cutout machine of intelligence based on thing networking |
| CN213267306U (en) * | 2020-07-01 | 2021-05-25 | 江西微驰自动化科技有限公司 | Cutting machine |
| CN215589632U (en) * | 2021-01-20 | 2022-01-21 | 上海晶石陶瓷有限公司 | Ceramic cutting machine is used in processing of corrosion-resistant ceramic axle sleeve with protective structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110357409B (en) * | 2019-08-09 | 2020-07-24 | 佛山市博觉水晶有限公司 | Protection type glass cutting machine |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111085721A (en) * | 2019-12-17 | 2020-05-01 | 郑祥模 | Cutting device with angle material collecting function for mechanical equipment production |
| CN213267306U (en) * | 2020-07-01 | 2021-05-25 | 江西微驰自动化科技有限公司 | Cutting machine |
| CN111660127A (en) * | 2020-07-14 | 2020-09-15 | 泉州京锯智能科技有限公司 | Full automatic cutout machine of intelligence based on thing networking |
| CN215589632U (en) * | 2021-01-20 | 2022-01-21 | 上海晶石陶瓷有限公司 | Ceramic cutting machine is used in processing of corrosion-resistant ceramic axle sleeve with protective structure |
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