CN114934301A - Electrolytic copper foil production process - Google Patents
Electrolytic copper foil production process Download PDFInfo
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- CN114934301A CN114934301A CN202210547661.0A CN202210547661A CN114934301A CN 114934301 A CN114934301 A CN 114934301A CN 202210547661 A CN202210547661 A CN 202210547661A CN 114934301 A CN114934301 A CN 114934301A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 239000011889 copper foil Substances 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000003792 electrolyte Substances 0.000 claims abstract description 73
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 48
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims abstract description 44
- 238000002161 passivation Methods 0.000 claims abstract description 22
- 238000005406 washing Methods 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000654 additive Substances 0.000 claims abstract description 8
- 239000002270 dispersing agent Substances 0.000 claims abstract description 7
- 239000003112 inhibitor Substances 0.000 claims abstract description 7
- 230000000996 additive effect Effects 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims description 34
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- -1 polydithio-dipropyl Polymers 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 19
- 239000002202 Polyethylene glycol Substances 0.000 claims description 18
- 229920001223 polyethylene glycol Polymers 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 13
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 12
- 102000008186 Collagen Human genes 0.000 claims description 10
- 108010035532 Collagen Proteins 0.000 claims description 10
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- 229920001436 collagen Polymers 0.000 claims description 10
- 229910052708 sodium Inorganic materials 0.000 claims description 10
- 239000011734 sodium Substances 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 5
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 2
- 230000001276 controlling effect Effects 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- PXKSPZIOORAWIT-UHFFFAOYSA-N but-2-ynylbenzene Chemical group CC#CCC1=CC=CC=C1 PXKSPZIOORAWIT-UHFFFAOYSA-N 0.000 description 3
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- JGQCBROLCJAMBU-UHFFFAOYSA-N [Cu]CC1=CC=CC=C1 Chemical compound [Cu]CC1=CC=CC=C1 JGQCBROLCJAMBU-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
- H01M4/662—Alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a production process of electrolytic copper foil, which comprises the following steps: injecting the prepared electrolyte into an electrolytic cell, controlling the temperature of the electrolyte to be 45-60 ℃, and adding an additive into the electrolytic cell; step two, adjusting the current intensity to 20000-30000A and the flow rate of the electrolyte to 40-50m 3 Electroplating, and then washing; step three, carrying out chromic anhydride passivation treatment after water washing treatment; step four, performing chromic anhydride passivation treatment and then drying treatment to obtain a copper foil; wherein the additives comprise an inhibitor, a dispersant, an accelerator and a tensile agent. The tensile agent has excellent low-area leveling ability, wide application range, strong low-area leveling property and good long-acting property. The tensile strength of the prepared copper foil can be improved by adding the tensile agent.
Description
Technical Field
The invention belongs to the technical field of electrolytic copper foil, and particularly relates to a production process of electrolytic copper foil.
Background
The copper foil is one of key materials for producing the lithium ion battery, and the quality of the copper foil directly influences the manufacturing process and the comprehensive performance of the lithium ion battery. The tensile strength, elongation, appearance gloss and the like of the electrolytic copper foil have direct influence on the quality performance aspects such as the manufacturing process of the lithium ion battery negative electrode, the stability of the battery and the like.
The lithium battery may generate heat in the production process, and the negative electrode generates heat to cause expansion and fracture. The invention provides a production process of an electrolytic copper foil, which solves the technical problems that the existing copper foil is low in tensile strength and easy to break due to thermal expansion.
Disclosure of Invention
The invention aims to provide a production process of an electrolytic copper foil, which solves the technical problems that the existing electrolytic copper foil is low in tensile strength and easy to break due to thermal expansion.
The purpose of the invention can be realized by the following technical scheme:
the electrolytic copper foil production process comprises
Injecting the prepared electrolyte into an electrolytic cell, controlling the temperature of the electrolyte to be 45-60 ℃, and adding an additive into the electrolytic cell;
step two, adjusting the current intensity to 20000-30000A and the flow rate of the electrolyte to 40-50m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
step four, performing drying treatment after the chromic anhydride passivation treatment to obtain a copper foil;
wherein the additives comprise an inhibitor, a dispersant, an accelerator and a tensile agent.
Further, the inhibitor comprises collagen; the concentration of the inhibitor in the electrolyte is 5-10 ppm.
Further, the dispersant comprises polyethylene glycol; the concentration of the dispersant in the electrolyte is 0.5-1 ppm.
Further, the accelerator comprises sodium polydithio dipropyl sulfonate; the concentration of the accelerator in the electrolyte is 1-3 ppm.
Furthermore, the tensile agent comprises one or more of a circuit board copper plating displacement agent, benzyl-methyl alkynol pyridine inner salt and a copper acid strong leveling agent which are mixed in any proportion; the concentration of the tensile agent in the electrolyte is 10-30 ppm.
Further, the electrolyte comprises H with the concentration of 100-110g/L 2 SO 4 90-95g/L of Cu 2+ 20-30mg/L of Cl - 。
Further, the method also comprises the following steps after the additive is added into the electrolytic cell: adding activated carbon into the electrolytic cell at a speed of 5-60 g/h.
The invention has the beneficial effects that:
the tensile agent has excellent low-area leveling ability, wide application range, strong low-area leveling property and good long-acting property. The tensile agent may include one or more of a circuit board copper plating off-site agent, benzyl-methyl alkynol pyridine inner salt, or a copper acid strong leveling agent. According to the invention, the tensile property of the prepared copper foil can be effectively improved by adding the tensile agent into the electrolyte and regulating and controlling the composition and concentration of the tensile agent.
In addition, the addition of the tensile agent in the electrolyte does not greatly influence the glossiness of the prepared copper foil, and the prepared copper foil has small crystal grain size and fine crystals.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a scanning electron microscope photograph of a copper foil prepared by an electrolytic copper foil production process according to the present invention.
FIG. 2 is an electron back-scattered diffraction pattern of a copper foil prepared by the electrolytic copper foil production process provided by the present invention.
Fig. 3 is a scanning electron microscope photograph of a copper foil prepared by the prior art.
Fig. 4 is an electron back-scattered diffraction pattern of a copper foil prepared using the prior art.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The application provides a production process of electrolytic copper foil, which comprises
Step one, injecting the prepared electrolyte into an electrolytic cell, wherein the electrolyte comprises 100-110g/L H 2 SO 4 90-95g/L of Cu 2+ 20-30mg/L of Cl - Controlling the temperature of the electrolyte to be 45-60 ℃, and adding collagen (QS) with the concentration of 5-10ppm, polyethylene glycol (PEG) with the concentration of 0.5-1ppm and sodium polydithio-dipropyl Sulfonate (SP) with the concentration of 1-3ppm into the electrolytic cell; one or more of a circuit board copper plating displacement agent (SLP), benzyl-methylaynol pyridine inner salt (BOSS) and a copper acid strong leveling agent (POSS) with the concentration of 10-30ppm are mixed in any proportion; then adding activated carbon into the electrolyte at the speed of 5-60 g/h.
Step two, adjusting the current intensity to 20000-30000A and the flow of the electrolyte to 40-50m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
and step four, performing drying treatment after the chromic anhydride passivation treatment to obtain the 6-micron high-resistance copper foil.
The tensile agent has excellent low-area leveling capability, wide application range, strong low-area leveling property and good long-acting property. The tensile enhancing agent may include one or more of a board copper plating off-site agent, benzyl-methyl alkynol pyridine inner salt, or a copper acid strong leveling agent. According to the invention, the tensile property of the prepared copper foil can be effectively improved by adding the tensile agent into the electrolyte and regulating and controlling the composition and concentration of the tensile agent.
In addition, the addition of the tensile agent in the electrolyte does not greatly influence the glossiness of the prepared copper foil, and the prepared copper foil has the advantages of reduced grain size and fine crystal.
Example 1
Step one, injecting the prepared electrolyte into an electrolytic cell, wherein the electrolyte comprises 100g/L of H 2 SO 4 90g/L of Cu 2+ 20mg/L of Cl - Controlling the temperature of the electrolyte to be 45 ℃, and adding collagen (QS) with the concentration of 5ppm, polyethylene glycol (PEG) with the concentration of 0.5ppm and sodium polydithio dipropyl Sulfonate (SP) with the concentration of 1ppm into the electrolyte; a circuit board copper plating displacement agent (SLP), benzyl-methylacetylene alcohol pyridine inner salt (BOSS) and a strong copper acid leveling agent (POSS) with the concentration of 10 ppm; the copper plating displacement agent (SLP), benzyl-methylacetylene alcohol pyridine inner salt (BOSS) and strong copper acid leveling agent (POSS) of the circuit board are in a mass ratio of 4: 4: 2; then, activated carbon was added to the electrolyte at a rate of 5 g/h.
Step two, adjusting the current intensity to 20000A and the flow of the electrolyte to 40m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
and step four, performing drying treatment after the chromic anhydride passivation treatment to obtain the 6-micron high-resistance copper foil.
Example 2
Step one, injecting prepared electrolyte into an electrolytic cell, wherein the electrolyte comprises 105g/L of H 2 SO 4 93g/L of Cu 2+ 25mg/L of Cl - Controlling the temperature of the electrolyte to be 58 ℃, and adding 8ppm collagen (QS) with the concentration of 0.7ppm polyethylene glycol (PEG) and 2ppm sodium polydithio-dipropyl Sulfonate (SP) into the electrolyte; the copper plating agent (SLP) with the concentration of 20ppm, benzyl-methylacetylene alcohol pyridine inner salt (BOSS) and strong acid copper leveling agent (POSS) for the circuit board, wherein the copper plating agent (SLP) and the benzyl copper plating agent (POSS) for the circuit boardThe mass ratio of the base-methylalynol pyridine inner salt (BOSS) to the acid copper strong leveling agent (POSS) is 4: 4: 2; then, activated carbon was added to the electrolyte at a rate of 50 g/h.
Step two, controlling the electrolytic current to be 25000A and the flow rate of the electrolyte to be 45m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
and step four, performing drying treatment after the chromic anhydride passivation treatment to obtain the 6-micron high-resistance copper foil.
Example 3
Step one, injecting the prepared electrolyte into an electrolytic cell, wherein the electrolyte comprises 110g/L of H 2 SO 4 95g/L of Cu 2+ 30mg/L of Cl - Controlling the temperature of the electrolyte to be 60 ℃, and adding collagen (QS) with the concentration of 10ppm, polyethylene glycol (PEG) with the concentration of 1ppm and sodium polydithio dipropyl Sulfonate (SP) with the concentration of 3ppm into the electrolyte; the copper plating agent (SLP), the benzyl-methyl alkynol pyridine inner salt (BOSS) and the strong copper leveling agent (POSS) are added to the circuit board at a concentration of 30ppm, wherein the mass ratio of the copper plating agent (SLP), the benzyl-methyl alkynol pyridine inner salt (BOSS) and the strong copper leveling agent (POSS) is 4: 4: 2; then, activated carbon was added to the electrolyte at a rate of 60 g/h.
Step two, controlling the electrolytic current to be 30000A and the flow rate of the electrolyte to be 50m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
and step four, performing drying treatment after the chromic anhydride passivation treatment to obtain the 6-micron high-resistance copper foil.
Example 4
Step one, injecting prepared electrolyte into an electrolytic cell, wherein the electrolyte comprises 110g/L of H 2 SO 4 95g/L of Cu 2+ 30mg/L of Cl - Controlling the temperature of the electrolyte to be 60 ℃, and adding collagen (QS) with the concentration of 10ppm, polyethylene glycol (PEG) with the concentration of 1ppm and sodium polydithio dipropyl Sulfonate (SP) with the concentration of 3ppm into the electrolyte; a circuit board copper plating off agent (SLP) with a concentration of 20 ppm; then, the product is processedActivated carbon was added to the electrolyte at a rate of 50 g/h.
Step two, adjusting the current intensity to 30000A and the flow of the electrolyte to 50m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
and step four, performing drying treatment after the chromic anhydride passivation treatment to obtain the 6-micron high-resistance copper foil.
Example 5
Step one, injecting prepared electrolyte into an electrolytic cell, wherein the electrolyte comprises 110g/L of H 2 SO 4 95g/L of Cu 2+ 30mg/L of Cl - Adding collagen (QS) with the concentration of 10ppm, polyethylene glycol (PEG) with the concentration of 1ppm and sodium polydithio-dipropyl Sulfonate (SP) with the concentration of 3ppm into the electrolyte at the temperature of 60 ℃; benzyl-methylalkynol pyridine inner salt (BOSS) at a concentration of 30 ppm; then, activated carbon was added to the electrolyte at a rate of 50 g/h.
Step two, adjusting the current intensity to 30000A and the flow of the electrolyte to 50m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
and step four, performing drying treatment after the chromic anhydride passivation treatment to obtain the 6-micron high-resistance copper foil.
Example 6
Step one, injecting prepared electrolyte into an electrolytic cell, wherein the electrolyte comprises 110g/L of H 2 SO 4 95g/L of Cu 2+ 30mg/L of Cl - Adding collagen (QS) with the concentration of 10ppm, polyethylene glycol (PEG) with the concentration of 1ppm and sodium polydithio-dipropyl Sulfonate (SP) with the concentration of 3ppm into the electrolyte at the temperature of 60 ℃; a strong copper acid leveler (POSS) at a concentration of 20 ppm; then, activated carbon was added to the electrolyte at a rate of 50 g/h.
Step two, adjusting the current intensity to 30000A and the flow of the electrolyte to 50m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
and step four, performing drying treatment after the chromic anhydride passivation treatment to obtain the 6-micron high-resistance copper foil.
Comparative example 1
Step one, injecting prepared electrolyte into an electrolytic cell, wherein the electrolyte comprises 110g/L of H 2 SO 4 95g/L of Cu 2+ 30mg/L of Cl - Controlling the temperature of the electrolyte to be 60 ℃, and adding collagen (QS) with the concentration of 10ppm, polyethylene glycol (PEG) with the concentration of 1ppm and sodium polydithio dipropyl Sulfonate (SP) with the concentration of 3ppm into the electrolyte; then, activated carbon was added to the electrolyte at a rate of 50 g/h.
Step two, adjusting the current intensity to 30000A and the flow of the electrolyte to 50m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
and step four, performing drying treatment after the chromic anhydride passivation treatment to obtain the 6-micron high-resistance copper foil.
The copper foils prepared in examples 3 to 6 and comparative example 1 were tested, and the specific test results are shown in table 1:
TABLE 1
By analyzing the above test results, the following conclusions can be obtained:
(1) the tensile strength value at normal temperature of the prepared 6 mu m high-resistance copper foil reaches 69.12-69.95kgf/mm by adding a tensile agent into the electrolyte 2 Mean value of 69.535kgf/mm 2 (ii) a The baking tensile strength value reaches 62.04-65.60kgf/mm 2 Mean value of 63.82kgf/mm 2 (ii) a The baking elongation rate reaches 4.06-4.99%, and the average value is 4.53%; the tensile strength of the prepared 6-micron high-resistance copper foil can be obviously improved by adding the tensile agent into the electrolyte.
(2) Adding a tensile agent into the electrolyte to obtain the 6-micron high-resistance copper foil with the glossiness of 60-89GU and the average value of 74.5 GU; the invention shows that the 6-micron high-resistance copper foil prepared by adding the tensile agent into the electrolyte is consistent with the existing copper foil, and has no obvious difference in appearance.
The copper foils prepared in example 1 and comparative example 1 were also tested, and the specific test results are shown in fig. 1-4:
the surface texture morphology of the copper foil prepared in example 1 was observed by a Scanning Electron Microscope (SEM), resulting in an SEM image as shown in fig. 1; the microstructure of the crystal grains of the copper foil prepared in example 1 was observed by Electron Back Scattering Diffraction (EBSD), resulting in an EBSD pattern as shown in fig. 2; observing the surface texture morphology of the copper foil prepared in comparative example 1 through a Scanning Electron Microscope (SEM), and obtaining an SEM image shown in fig. 3; the grain microstructure of the copper foil prepared in comparative example 1 was observed by Electron Back Scattering Diffraction (EBSD), and an EBSD pattern as shown in fig. 4 was obtained.
By analyzing the above test results, the following conclusions can be obtained:
by adding the tensile agent into the electrolyte, the overall grain size of the prepared 6-micron high-resistance copper foil is reduced, and the crystals are fine.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely exemplary and illustrative of the principles of the present invention and various modifications, additions and substitutions of the specific embodiments described herein may be made by those skilled in the art without departing from the principles of the present invention or exceeding the scope of the claims set forth herein.
Claims (7)
1. The electrolytic copper foil production process is characterized by comprising the following steps: comprises that
Injecting the prepared electrolyte into an electrolytic cell, controlling the temperature of the electrolyte to be 45-60 ℃, and adding an additive into the electrolytic cell;
step two, adjusting the current intensity to 20000-30000A and the flow rate of the electrolyte to 40-50m 3 Electroplating, and then washing;
step three, carrying out chromic anhydride passivation treatment after water washing treatment;
step four, performing chromic anhydride passivation treatment and then drying treatment to obtain a copper foil;
wherein the additives comprise an inhibitor, a dispersant, an accelerator and a tensile agent.
2. The electrolytic copper foil production process according to claim 1, characterized in that: the inhibitor comprises collagen; the concentration of the inhibitor in the electrolyte is 5-10 ppm.
3. The electrolytic copper foil production process according to claim 1, characterized in that: the dispersant comprises polyethylene glycol; the concentration of the dispersant in the electrolyte is 0.5-1 ppm.
4. The electrolytic copper foil production process according to claim 1, characterized in that: the accelerator comprises sodium polydithio-dipropyl sulfonate; the concentration of the accelerator in the electrolyte is 1-3 ppm.
5. The electrolytic copper foil production process according to claim 1, characterized in that: the tensile agent comprises one or more of a circuit board copper plating displacement agent, benzyl-methyl alkynol pyridine inner salt and a strong acid copper leveling agent which are mixed in any proportion; the concentration of the tensile agent in the electrolyte is 10-30 ppm.
6. According to the claimsThe electrolytic copper foil production process according to claim 1 is characterized in that: the electrolyte comprises 100-110g/L H 2 SO 4 90-95g/L of Cu 2+ 20-30mg/L of Cl - 。
7. The electrolytic copper foil production process according to claim 1, characterized in that: after the additive is added into the electrolytic cell, the method also comprises the following steps: adding activated carbon into the electrolytic cell at a speed of 5-60 g/h.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116575084A (en) * | 2023-06-13 | 2023-08-11 | 湖南龙智新材料科技有限公司 | Additive for improving hardness and strength of copper foil and preparation method thereof |
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| CN109750334A (en) * | 2019-02-28 | 2019-05-14 | 灵宝华鑫铜箔有限责任公司 | A kind of production technology of 6 μm of double light high tensile additive for electrolytic copper foil and the electrolytic copper foil |
| CN113638014A (en) * | 2021-07-06 | 2021-11-12 | 铜陵市华创新材料有限公司 | Production method of ultrathin ultrahigh double-sided light-resistant lithium battery copper foil |
| CN116837426A (en) * | 2023-07-24 | 2023-10-03 | 安徽华创新材料股份有限公司 | Production method of ultrathin extremely-high-tensile double-sided photo-lithium electric copper foil |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116575084A (en) * | 2023-06-13 | 2023-08-11 | 湖南龙智新材料科技有限公司 | Additive for improving hardness and strength of copper foil and preparation method thereof |
| CN116575084B (en) * | 2023-06-13 | 2023-12-15 | 湖南龙智新材料科技有限公司 | Additive for improving hardness and strength of copper foil and preparation method thereof |
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