CN114933862A - Hot melt adhesive film for composite shoe sole and preparation method thereof - Google Patents
Hot melt adhesive film for composite shoe sole and preparation method thereof Download PDFInfo
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- CN114933862A CN114933862A CN202210453019.6A CN202210453019A CN114933862A CN 114933862 A CN114933862 A CN 114933862A CN 202210453019 A CN202210453019 A CN 202210453019A CN 114933862 A CN114933862 A CN 114933862A
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- hot melt
- melt adhesive
- adhesive film
- composite shoe
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 43
- 239000002131 composite material Substances 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 15
- 229920001971 elastomer Polymers 0.000 claims abstract description 15
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 15
- 239000005060 rubber Substances 0.000 claims abstract description 15
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 13
- 229920001897 terpolymer Polymers 0.000 claims abstract description 13
- 229920002635 polyurethane Polymers 0.000 claims abstract description 11
- 239000004814 polyurethane Substances 0.000 claims abstract description 11
- 239000006100 radiation absorber Substances 0.000 claims abstract description 10
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000005977 Ethylene Substances 0.000 claims abstract description 9
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 8
- 238000005266 casting Methods 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 12
- 239000012768 molten material Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 10
- 239000011358 absorbing material Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 6
- 239000012943 hotmelt Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 6
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 244000043261 Hevea brasiliensis Species 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 239000012190 activator Substances 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 239000003431 cross linking reagent Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 229920003052 natural elastomer Polymers 0.000 claims description 3
- 229920001194 natural rubber Polymers 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the field of hot melt adhesive films, in particular to a hot melt adhesive film for a composite sole, which comprises the following components in parts by weight: 55-70 parts of ethylene-vinyl acetate copolymer; 5-10 parts of polybutadiene polyurethane; 15-30 parts of an ethylene terpolymer; 5-10 parts of electromagnetic radiation absorber; 2-10 parts of rubber; and 1-4 parts of an auxiliary agent. The invention provides a hot melt adhesive film for composite soles, which improves the bonding performance and is durable. The invention also provides a preparation method of the hot melt adhesive film for the composite sole, which is simple in process and convenient and fast to operate.
Description
Technical Field
The invention relates to the field of hot melt adhesive films, in particular to a hot melt adhesive film for a composite sole and a preparation method thereof.
Background
At present, the sole is mostly bonded with the outsole and the middle-low sole through liquid glue in the production process, and the used liquid glue is solvent-type urethane glue or polyurethane glue. The technological process of adopting liquid glue to bond includes the steps of roughening treatment, brushing low coating agent, gluing, drying solvent, bonding and the like to the outsole and the middle outsole, and the process mainly has the following defects: 1. the production process is complex, time-consuming and labor-consuming, and high in cost; 2. manual gluing is easy to cause uneven coating, air is easy to mix in glue, and the bonding effect is poor; 3. the volatilization of the organic solvent in the glue causes great harm to human bodies and the environment, and is not environment-friendly.
The sole bonding material produced by the prior art has certain effect, but cannot realize high-efficiency firm bonding due to the complex preparation process, insufficient material performance and limitation of material performance. Therefore, it is necessary to provide a hot melt adhesive film for composite shoe soles and a preparation method thereof.
Disclosure of Invention
In order to solve the technical problems, the invention provides a hot melt adhesive film for a composite sole, which improves the adhesive property and is durable.
The invention also provides a preparation method of the hot melt adhesive film for the composite shoe sole, which is simple in process and convenient and fast to operate.
The invention adopts the following technical scheme:
a hot melt adhesive film for composite soles comprises the following components in parts by mass:
the technical proposal is further improved in that the content of the vinyl acetate in the ethylene-vinyl acetate copolymer is 45 to 50 percent.
The further improvement of the technical proposal is that the softening point of the polybutadiene polyurethane is 110- 3 The tensile strength is 16-20 MPa.
The technical proposal is further improved in that the ethylene terpolymer is an ethylene-acrylate-glycidyl methacrylate terpolymer.
The technical proposal is further improved in that the electromagnetic radiation absorber is a mixture of thermoplastic polyurethane and microwave absorbing materials.
The technical proposal is further improved in that the mass ratio of the thermoplastic polyurethane to the microwave absorbing material is 1-3: 1-3.
The technical proposal is further improved in that the microwave absorbing material is one or a mixture of more of silicon carbide, metal oxide, carbon fiber and nano nickel material.
The technical proposal is further improved in that the rubber is one or a mixture of more of natural rubber, butadiene rubber, liquid butadiene and liquid silicon rubber.
The technical proposal is further improved in that the auxiliary agent comprises one or a mixture of more of an ultraviolet absorbent, an antioxidant, a coupling agent, a rubber activator, a cross-linking agent and a catalyst.
A preparation method of a hot melt adhesive film for a composite sole comprises the following steps:
s1, adding the materials with the formula ratio into a high-speed mixer for premixing to obtain molten materials, wherein the melting temperature is 135-150 ℃, the stirring speed is 550-700r/min, and the stirring time is 5-10 minutes;
s2, adding the molten material obtained in the step S1 into a double-screw extruder for extrusion to obtain hot-melt rubber particles, wherein the extrusion temperature is 150-165 ℃, and the stirring speed is 700-800 r/min;
s3, adding the hot melt adhesive particles obtained in the step S2 into a casting machine for casting to obtain a hot melt adhesive film, wherein the casting temperature is 180-195 ℃.
The beneficial effects of the invention are as follows:
according to the invention, the electromagnetic radiation absorber is added to prepare the hot melt adhesive film for the composite sole, when electromagnetic radiation is applied, the hot melt adhesive film can effectively absorb electromagnetic radiation energy and convert the electromagnetic radiation energy into heat energy, and can be used for effectively bonding the middle sole and the large sole of the sole, so that the manufacturing convenience of the sole can be improved; meanwhile, the epoxy group-containing vinyl terpolymer is introduced, and the epoxy group can react with hydroxyl groups and other groups on the surface of the base material in the curing process to form firm chemical bonds, so that the physical properties such as tensile property, heat resistance and the like can be comprehensively improved while the bonding property to the base material is greatly enhanced; the hot melt adhesive film has the advantages of strong tensile strength, high elongation at break and good wear resistance by adding polybutadiene polyurethane and modifying and combining.
Detailed Description
The invention will now be further illustrated by reference to specific examples, which are intended to be illustrative of the invention and are not intended to be a further limitation of the invention.
A hot melt adhesive film for composite soles comprises the following components in parts by mass: 55-70 parts of ethylene-vinyl acetate copolymer; 5-10 parts of polybutadiene polyurethane; 15-30 parts of an ethylene terpolymer; 5-10 parts of electromagnetic radiation absorber; 2-10 parts of rubber; and 1-4 parts of an auxiliary agent.
Further, the ethylene-vinyl acetate copolymer has a vinyl acetate content of 45% to 50%.
Further, the softening point of the polybutadiene polyurethane is 110-130 ℃, the Shore A hardness is 90-95, and the specific gravity is 1.2-1.5g/cm 3 The tensile strength is 16-20 Mpa.
Further, the ethylene terpolymer is an ethylene-acrylate-glycidyl methacrylate terpolymer.
Further, the electromagnetic radiation absorber is a mixture of thermoplastic polyurethane and microwave absorbing material.
Further, the mass ratio of the thermoplastic polyurethane to the microwave absorbing material is 1-3: 1-3.
Further, the microwave absorbing material is one or a mixture of silicon carbide, metal oxide, carbon fiber and nano nickel material.
Further, the rubber is one or a mixture of more of natural rubber, butadiene rubber, liquid butadiene and liquid silicone rubber.
Further, the auxiliary agent comprises one or more of a mixture of an ultraviolet absorber, an antioxidant, a coupling agent, a rubber activator, a cross-linking agent and a catalyst.
A preparation method of a hot melt adhesive film for a composite sole comprises the following steps:
s1, adding the materials with the formula ratio into a high-speed mixer for premixing to obtain molten materials, wherein the melting temperature is 135-150 ℃, the stirring speed is 550-700r/min, and the stirring time is 5-10 minutes;
s2, adding the molten material obtained in the step S1 into a double-screw extruder for extrusion to obtain hot melt colloidal particles, wherein the extrusion temperature is 150-165 ℃, and the stirring speed is 700-800 r/min;
s3, adding the hot melt adhesive particles obtained in the step S2 into a casting machine for casting to obtain a hot melt adhesive film, wherein the casting temperature is 180-195 ℃.
Example 1
S1, sequentially mixing 55 parts of ethylene-vinyl acetate copolymer; 5 parts of polybutadiene polyurethane; 15 parts of an ethylene terpolymer; 5 parts of an electromagnetic radiation absorber; 2 parts of rubber; adding 1 part of the auxiliary agent into a high-speed mixer for premixing to obtain a molten material, wherein the melting temperature is 135 ℃, the stirring speed is 550r/min, and the stirring time is 5 minutes;
s2, adding the molten material obtained in the step S1 into a double-screw extruder to be extruded to obtain hot melt rubber particles, wherein the extrusion temperature is 150 ℃, and the stirring speed is 700 r/min;
s3, adding the hot melt adhesive particles obtained in the step S2 into a casting machine for casting to obtain a hot melt adhesive film, wherein the casting temperature is 180 ℃.
Example 2
S1, sequentially mixing 60 parts of ethylene-vinyl acetate copolymer; 8 parts of polybutadiene polyurethane; 15 parts of an ethylene terpolymer; 5 parts of an electromagnetic radiation absorber; 5 parts of rubber; adding 2 parts of an auxiliary agent into a high-speed mixer for premixing to obtain a molten material, wherein the melting temperature is 150 ℃, the stirring speed is 700r/min, and the stirring time is 10 minutes;
s2, adding the molten material obtained in the step S1 into a double-screw extruder to be extruded to obtain hot melt rubber particles, wherein the extrusion temperature is 165 ℃, and the stirring speed is 800 r/min;
s3, adding the hot melt adhesive particles obtained in the step S2 into a casting machine for casting to obtain a hot melt adhesive film, wherein the casting temperature is 195 ℃.
Example 3
S1, sequentially mixing 70 parts of ethylene-vinyl acetate copolymer; 10 parts of polybutadiene polyurethane; 30 parts of ethylene terpolymer; 10 parts of an electromagnetic radiation absorber; 10 parts of rubber; adding 4 parts of an auxiliary agent into a high-speed mixer for premixing to obtain a molten material, wherein the melting temperature is 150 ℃, the stirring speed is 700r/min, and the stirring time is 10 minutes;
s2, adding the molten material obtained in the step S1 into a double-screw extruder for extrusion to obtain hot melt colloidal particles, wherein the extrusion temperature is 165 ℃, and the stirring speed is 800 r/min;
s3, adding the hot melt adhesive particles obtained in the step S2 into a casting machine for casting to obtain a hot melt adhesive film, wherein the casting temperature is 195 ℃.
Comparative example 1
The components and procedure were the same as in example 1 except that the polybutadiene polyurethane component was omitted.
Comparative example 2
The components and procedure were as in example 2 except that the ethylene terpolymer component was omitted.
Comparative example 3
The components and procedure were the same as in example 3, except that the electromagnetic radiation absorber component was omitted.
The hot melt adhesive films obtained in examples 1 to 3 and comparative examples 1 to 3 were subjected to adhesion test, tensile strength test and heat resistance test by the following test methods, as shown in Table 1.
Testing the adhesive force: laminating in a mode of shoe material/hot melt adhesive film/shoe material, and hot pressing for 90 seconds under the action of a heating iron with the temperature set at 150 ℃ to obtain a sample; test conditions of the test: the temperature is 23 ℃, and the relative humidity is 50%; the performance characterization method comprises the following steps: the adhesive force between the hot melt adhesive film and the shoe material is tested according to GB/T2790-2008 'test method for 180-degree peel strength of adhesive'.
Tensile strength: according to ISO 527 + 2012 test method for tensile properties of plastics, the test specimens are stretched until breaking during the tensile test.
TABLE 1
Variations and modifications to the above-described embodiments may also occur to those skilled in the art to which the invention pertains. Therefore, the above examples illustrate the detailed methods of the present invention, but the present invention is not limited to the specific embodiments disclosed and described above, and it is not intended that the present invention be implemented by relying on the above detailed methods, any modifications and variations of the present invention, equivalent substitutions of each raw material of the product of the present invention, addition of auxiliary components, selection of specific embodiments, etc., should also fall within the scope of the claims of the present invention.
Claims (10)
1. The hot melt adhesive film for the composite shoe sole is characterized by comprising the following components in parts by mass:
2. the hot melt adhesive film for composite shoe soles according to claim 1, wherein the ethylene-vinyl acetate copolymer has a vinyl acetate content of 45% to 50%.
3. The hot melt adhesive film for the composite shoe sole as claimed in claim 1, wherein the polybutadiene polyurethane has a softening point of 110- 3 The tensile strength is 16-20 MPa.
4. The hot melt adhesive film for composite shoe soles according to claim 1, wherein the ethylene terpolymer is an ethylene-acrylate-glycidyl methacrylate terpolymer.
5. The hot melt adhesive film for composite shoe soles according to claim 1, wherein said electromagnetic radiation absorber is a mixture of thermoplastic polyurethane and microwave absorbing material.
6. The hot melt adhesive film for the composite shoe sole according to claim 5, wherein the mass ratio of the thermoplastic polyurethane to the microwave absorbing material is 1-3: 1-3.
7. The hot melt adhesive film for the composite shoe sole according to claim 5, wherein the microwave absorbing material is a mixture of one or more of silicon carbide, metal oxide, carbon fiber and nano nickel material.
8. The hot melt adhesive film for composite shoe soles according to claim 1, wherein the rubber is a mixture of one or more of natural rubber, butadiene rubber, liquid butadiene rubber and liquid silicone rubber.
9. The hot melt adhesive film for composite shoe soles according to claim 1, wherein the auxiliary agent comprises one or more of a mixture of an ultraviolet absorber, an antioxidant, a coupling agent, a rubber activator, a crosslinking agent and a catalyst.
10. The preparation method of the hot melt adhesive film for the composite shoe sole is characterized by comprising the following steps:
s1, adding the materials with the formula ratio into a high-speed mixer for premixing to obtain molten materials, wherein the melting temperature is 135-;
s2, adding the molten material obtained in the step S1 into a double-screw extruder for extrusion to obtain hot-melt rubber particles, wherein the extrusion temperature is 150-165 ℃, and the stirring speed is 700-800 r/min;
s3, adding the hot melt adhesive particles obtained in the step S2 into a casting machine for casting to obtain a hot melt adhesive film, wherein the casting temperature is 180-195 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210453019.6A CN114933862A (en) | 2022-04-24 | 2022-04-24 | Hot melt adhesive film for composite shoe sole and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210453019.6A CN114933862A (en) | 2022-04-24 | 2022-04-24 | Hot melt adhesive film for composite shoe sole and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN114933862A true CN114933862A (en) | 2022-08-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210453019.6A Pending CN114933862A (en) | 2022-04-24 | 2022-04-24 | Hot melt adhesive film for composite shoe sole and preparation method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856563A (en) * | 2018-02-13 | 2020-03-03 | 陈志勇 | Hot melt adhesive film composition and method for manufacturing shoe sole |
| CN112226180A (en) * | 2020-10-10 | 2021-01-15 | 厦门联合信诺新材料有限公司 | Hot melt adhesive film for composite shoe sole and preparation method thereof |
-
2022
- 2022-04-24 CN CN202210453019.6A patent/CN114933862A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856563A (en) * | 2018-02-13 | 2020-03-03 | 陈志勇 | Hot melt adhesive film composition and method for manufacturing shoe sole |
| CN112226180A (en) * | 2020-10-10 | 2021-01-15 | 厦门联合信诺新材料有限公司 | Hot melt adhesive film for composite shoe sole and preparation method thereof |
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Application publication date: 20220823 |