CN114932684A - Carbon fiber honeycomb panel injecting glue, rotary embedded part and microwave curing integrated device - Google Patents
Carbon fiber honeycomb panel injecting glue, rotary embedded part and microwave curing integrated device Download PDFInfo
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- CN114932684A CN114932684A CN202210472366.3A CN202210472366A CN114932684A CN 114932684 A CN114932684 A CN 114932684A CN 202210472366 A CN202210472366 A CN 202210472366A CN 114932684 A CN114932684 A CN 114932684A
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- embedded part
- glue
- microwave
- carbon fiber
- glue filling
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- 239000003292 glue Substances 0.000 title claims abstract description 125
- 229920000049 Carbon (fiber) Polymers 0.000 title claims abstract description 25
- 239000004917 carbon fiber Substances 0.000 title claims abstract description 25
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 238000011415 microwave curing Methods 0.000 title claims abstract description 23
- 238000002347 injection Methods 0.000 claims abstract description 36
- 239000007924 injection Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000000243 solution Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims description 32
- 239000000523 sample Substances 0.000 claims description 23
- 238000002513 implantation Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000001723 curing Methods 0.000 claims description 10
- 239000007943 implant Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/523—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by dipping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0855—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using microwave
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a glue injection, rotary embedded part and microwave curing integrated device for a carbon fiber honeycomb plate, which comprises a glue injection device, a rotary embedded part device and a microwave curing device. The three devices are integrated into an integrated carbon fiber honeycomb plate processing device. The device has satisfied downthehole encapsulating precision, and haplopore injecting glue precision 2 ~ 3ml enable to bury the piece and increase with downthehole glue solution adhesion degree. The rotary embedded part mechanism consists of a vacuum sucker, a stepping motor, a pneumatic connector, a hollow shaft and a spring, the hollow shaft containing the spring is compressed, and the sucker can apply certain pretightening force to the embedded part when grabbing is guaranteed. After the process is finished, the grabbing posture is kept for microwave curing, the microwave curing device can enable the rear embedded part to have certain axial strength within 10min, and the condition that the embedded part in the hole does not deviate or fall off under the conditions of later-stage transportation, storage and the like is met.
Description
Technical Field
The invention relates to a process device for an aluminum honeycomb core plate of a carbon fiber skin, and belongs to the technical field of honeycomb core plate processing processes.
Background
In order to ensure that the glue injection amount in the carbon fiber honeycomb plate is proper, the metal embedded part is rotationally implanted and cut to be fully contacted with the glue solution, the rapid curing after the process steps is completed and certain axial strength requirements are met. Because the glue is filled in the holes, if no detection device is provided, the glue solution is excessive or insufficient; if the metal embedded part can not be implanted in a rotating way, glue solution can splash, and if the metal embedded part can not be implanted in a vertical way, the inclination of the posture of the embedded part after solidification can be influenced; if the curing process is not performed quickly, the production efficiency will be low. Therefore, the device integrating glue injection, rotary embedding and microwave curing is invented to solve the problems in the process and ensure the quality of the subsequent embedded part after curing.
Therefore, the invention provides a device for glue injection, rotary embedding and microwave curing processing of the carbon fiber aluminum honeycomb core plate, which is very significant.
Disclosure of Invention
The invention aims to design an integrated processing device for punching, glue embedding and part embedding of a carbon fiber aluminum honeycomb panel, and meets the precision requirements of different hole diameters through a punching system; the glue filling system in the hole ensures the problem of glue solution amount and can realize the controllable requirement of the glue solution amount; the embedded part screwing system can ensure the stable screwing posture of the embedded part and prevent the glue solution from splashing and the like. In addition, the problem that the embedded part slides downwards in the embedded part hole when the embedded part is implanted and cured is solved. The requirement of the whole processing technology is ensured, and the technological efficiency is improved. According to the in-hole glue injection device, the accurate glue injection amount in the hole is ensured to be 2-3 ml, and the adhesion degree of the embedded part and the glue solution in the hole is met. It is downthehole to bury the piece rotation implantation injecting glue rear with the metal through an embedding piece screw in device, and this process guarantees that the glue solution does not splash, buries a rotatory in-process and the full contact of glue solution. The microwave curing device is used for curing the epoxy resin glue solution of the glued embedded part, and the embedded part can be ensured to have certain strength by applying microwaves for 10min, so that the subsequent transportation and other processes can not be deformed.
The invention adopts the technical scheme that the glue injection, rotary embedding and microwave curing integrated device for the carbon fiber honeycomb plate comprises three devices, namely a glue injection device, a rotary embedding device and a microwave curing device. The three devices are integrated into an integrated carbon fiber honeycomb plate processing device.
The glue filling device in the hole of the carbon fiber honeycomb plate comprises a glue filling controller (5), a glue filling barrel (2), a glue filling head (3), a buried part positioning tool (6), a module (7), a glue filling connecting plate (1), a liquid level sensor (4) and a fan-shaped tool. The glue filling connecting plate (1) is fixed on the first group of sliding blocks through threads, and a circular hole groove is formed in the glue filling connecting plate (1) and used for fixing the glue filling barrel (2). The bottom of the glue injection barrel (2) is screwed with a glue injection head (3) through threads. And a fan-shaped tool (21) is arranged on the lateral side of the glue pouring connecting plate (1) and used for fixing the liquid level sensor (4). The glue filling controller (5) is connected with the liquid level sensor (4) through a signal line, and the glue filling controller (5) is connected with the glue filling barrel (2) through an air pipe. The embedded part tool (6) is fixed on the working plane through a sliding groove mechanism. The module (7) is used for controlling the whole body to descend for glue injection, the glue injection head (3) can abut against the 16mm position at the lowest position in the hole for glue injection, so that the liquid level of the glue solution overflows along the plane, and the detection of the liquid level sensor (4) is facilitated. When the liquid level in the hole reaches a certain height, the liquid level sensor (4) detects the height of the liquid level to feed back signals. And the fed back signal is transmitted to the glue filling controller (5) to control the glue filling barrel (2) to stop glue filling.
The process of screwing the embedded part after injecting cement into the hole is as follows: the embedded part screwing device comprises a vacuum pump (14), an air swivel joint (9), a hollow shaft (11), a sucker (12), a stepping motor (10), a module (15), an embedded part implantation connecting plate (8) and a photoelectric sensor (13). The vacuum pump (14) is connected with the air rotating joint (9) through an air pipe, the lower end of the air rotating joint (9) is connected with a hollow shaft (11), and the hollow shaft penetrates through the stepping motor (10) and is connected with the sucker (12). The photoelectric sensor (13) is fixed on the side of the embedded part implantation connecting plate (8) through a bolt. The module (15) controls the whole body to descend to implant and grab the embedded part. When grabbing the embedded part, the embedded part is positioned through an embedded part tool (6) on a working plane, the distance of 150mm can be continuously reduced when the vacuum sucker contacts the upper surface of the metal embedded part in the descending process, the hollow shaft (11) and the internal spring are extruded to compress the spring, so that the vacuum sucker can grab the embedded part more firmly, and a positioning foundation is made in the subsequent implantation process. In the descending process, the hollow shaft rotates together with the vacuum chuck through the stepping motor, and the air swivel joint ensures that an air pipe linked in the rotation process cannot be wound due to rotation. When the metal embedded part is to be implanted into a position, a photoelectric sensor (13) installed outside the stepping motor (10) detects reflected light, and the set distance is about 100mm lower than the distance between the upper end surface of the metal embedded part and the carbon fiber honeycomb plate when the carbon fiber honeycomb plate is on a horizontal plane. Then, when the photoelectric sensor (13) feeds back a signal, the implantation of the implant into the position is finished.
And (3) performing microwave curing after injecting glue into the finished hole and screwing the embedded part into the hole as follows: the microwave curing device comprises a magnetron (18), a waveguide tube (16), a microwave irradiation probe (17) and a folding bracket (19). The magnetron (18) is integrated in the control box and is connected with the waveguide tube (16) through threads, the waveguide tube (16) is fixed on the surface of the folding bracket (19) through a binding band, one end of the folding bracket (19) is connected with the microwave irradiation probe (17) through a bolt, and the other end of the folding bracket (19) is fixed on the surface of the control box. Wherein the magnetron (18) can generate and emit microwaves with different powers through adjustment, and the generated microwaves are transmitted to the waveguide (16). One end of the waveguide tube (16) is connected with the outlet of the magnetron, and the other end is connected with the microwave irradiation type probe (17) to transmit the microwave to the microwave irradiation type probe (17). The microwave irradiation type probe (17) is responsible for emitting microwaves to a concentrated area, and the purpose of adopting the irradiation type probe is to enable the emitted microwaves to only irradiate a specific area, so that the phenomenon of uneven solidification caused by microwave dispersion is avoided.
The technical content of the equipment is as follows:
in view of the above structure of the present invention, the present invention has the following advantages:
1. the invention adopts a guide rail and sliding block mechanism, has simple structure and lower cost, and is easy to realize motion control.
2. According to the invention, the volume of glue solution is detected by the liquid level sensor, and the sucker is combined with the stepping motor, so that the problems of unsatisfactory manual glue filling and manual rotation for grabbing and releasing the embedded part are solved.
3. The invention adopts a servo motor linkage mode, greatly shortens the time of one-time processing flow and improves the process efficiency.
4. The liquid level sensor detection device is added, so that the height of the glue liquid level can be accurately detected, and the glue using amount can be further accurately determined.
5. The invention adds the photoelectric sensor, can detect whether the embedded part falls to the position where the upper end surface is parallel to the plane of the carbon fiber plate or not, and further ensures the curing posture of the embedded part.
In conclusion, the invention solves the problem of non-quantitative glue filling in the technological process for the technological equipment of the aluminum honeycomb core plate, optimizes the problem that glue overflows and is flush with the screwed-in rear end face of the embedded part in the manual embedded part implantation process, and ensures the curing efficiency and strength on the whole.
Drawings
Fig. 1 is a general diagram of an integrated device for injecting glue, embedding a part in a rotating mode and curing microwaves for a carbon fiber aluminum honeycomb panel.
FIG. 2 is a view of the glue injection part of the apparatus of the present invention.
Fig. 3 is a partial view of a rotary embedded part in the device of the invention.
FIG. 4 is a diagram of the microwave curing section of the apparatus of the present invention.
In the figure: 1. glue pouring connecting plates; 2. a glue injection barrel; 3. pouring a glue head; 4. a liquid level sensor; 5. a glue pouring controller; 6. embedding a part positioning tool; 7. a module; 8. the embedded part is embedded into the connecting plate 9 and the air swivel joint; 10. a stepping motor; 11. a hollow shaft; 12. a suction cup; 13. a photosensor; 14. a vacuum pump; 15. a module; 16. a waveguide; 17. a microwave irradiation probe; 18. a magnetron; 19. folding the bracket; 20. a guide rail slide block mechanism 21 and a fan blade-shaped tool.
Detailed Description
The technical solutions in the examples of the present invention will be described clearly and completely with reference to the accompanying drawings in the examples of the present invention, and it is obvious that the described examples are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to the attached drawings 1-4, the invention provides a carbon fiber aluminum honeycomb panel glue injection, rotary embedded part and microwave curing integrated device, which mainly comprises an embedded part tool (6), an embedded part embedding connecting plate (8), an air rotary joint (9), a stepping motor (10), a hollow shaft (11), a sucker (12), a vacuum pump (14), a waveguide tube (16), an irradiation type probe (17) and a magnetron (18) as shown in fig. 1.
The glue filling device shown in figure 2 comprises a glue filling controller (5), a glue filling barrel (2), a glue filling head (3), a sliding block, a guide rail, an embedded part positioning tool (6), a glue filling connecting plate (1), a liquid level sensor (4) and a module (7). The module (7) controls the whole device to move up and down. The glue filling connecting plate (1) is fixed on the sliding block through threads, and a circular hole groove is formed in the glue filling connecting plate (1) and used for fixing the glue filling barrel (2). The bottom of the glue injection barrel (2) is provided with a glue injection head (3) by screw thread selective tightening. A fan-shaped tool (21) is arranged on the side of the glue pouring connecting plate (1) and used for fixing the liquid level sensor (4). The glue filling controller (5) is respectively connected with the liquid level sensor (4) and the glue filling barrel (2) through a signal line and an air pipe, and when the liquid level sensor (4) feeds back a signal. Wherein the glue filling head (3) can abut against the lowest part in the hole to start glue filling, so that the liquid level of the glue solution overflows along the plane, and the detection of the liquid level sensor (4) is facilitated. When the liquid level in the hole reaches a certain height, the liquid level sensor (4) detects the height of the liquid level to feed back signals. At the moment, the feedback signal is transmitted to the glue filling controller (5) to control the glue filling barrel (2) to stop glue filling.
As shown in fig. 3, the embedded part screwing device comprises a vacuum pump (14), an air swivel joint (9), a hollow shaft (11), a sucker (12), a stepping motor (10), an embedded part implantation connecting plate (8), a module (15), an embedded part tool (6) and a photoelectric sensor (13). The module (15) controls the whole structure to move up and down. The embedded part tool (6) is fixed on the working plane through a sliding groove mechanism. The vacuum pump (14) is connected with the air adapter (9) through an air pipe, the lower end of the air adapter (9) is connected with a hollow shaft (11), and the hollow shaft penetrates through the stepping motor (10) and is connected with the sucker (12). The photoelectric sensor (13) is fixed on the side of the embedded part implantation connecting plate (8) through a bolt. The whole body is controlled to descend, implant and grab through the module (15). The embedded part grabbing device is positioned through an embedded part tool (6) on a working plane when grabbing an embedded part, and can continuously descend for a certain distance when a vacuum sucker contacts the upper surface of the metal embedded part in the descending process, and the hollow shaft (11) and an internal spring are extruded to compress the spring, so that the vacuum sucker can grab the embedded part more firmly, and a positioning foundation is made in the subsequent implantation process. In the descending process, the hollow shaft (11) is driven by the stepping motor to rotate together with the vacuum chuck (12), and the air rotating joint ensures that the linked air pipe cannot be wound due to rotation in the rotating process. When the metal embedded part is to be implanted in place, a photoelectric sensor (13) arranged on the outer side of the stepping motor (10) detects reflected light, and the set distance is the distance between the upper end surface of the metal embedded part and the carbon fiber honeycomb plate when the upper end surface of the metal embedded part is in a horizontal plane. Then, when the photoelectric sensor (13) feeds back a signal, the implantation of the implant into the position is finished.
Fig. 4 shows a microwave curing device comprising a magnetron (18), a waveguide (16), a microwave irradiation probe (17), a folding bracket (19), and the like. The magnetron (18) is integrated in the control box and is connected with the waveguide tube (16) through threads, the waveguide tube (16) is fixed on the surface of the folding bracket (19) through a binding band, one end of the folding bracket (19) is connected with the microwave irradiation probe (17) through a bolt, and the other end of the folding bracket is fixed on the surface of the control box. Wherein the magnetron (18) can generate and emit microwaves with different powers through adjustment, and the generated microwaves are transmitted to the waveguide (16). One end of the waveguide tube (16) is connected with the outlet of the magnetron, and the other end is connected with the microwave irradiation type probe (17) to transmit the microwave to the microwave irradiation type probe (17). The microwave irradiation type probe (17) is responsible for emitting microwaves to a concentrated area, and the purpose of adopting the irradiation type probe is to enable the emitted microwaves to only irradiate a specific area, so that the phenomenon of uneven solidification caused by microwave dispersion is avoided.
For example, when a glue injection process is to be performed on a certain coordinate position on a carbon fiber aluminum honeycomb panel, the method can be operated according to the following steps: when the glue injection device works, the glue injection device is moved to a position right opposite to the carbon fiber honeycomb plate hole through the guide rail sliding block mechanism (20), the whole body moves downwards through the module (7) driving device, the glue injection controller (5) starts to work when the front end glue injection head (3) abuts against the lower end face in the hole, and glue is discharged from the glue injection head (3). The liquid level sensor (4) is always at the height of the liquid level position in the detection hole in the glue injection process, and when the set height is reached, the liquid level sensor (4) is triggered to feed back a trigger signal to the glue injection controller (5). When the glue filling controller (5) receives the feedback signal, the glue filling head (3) is controlled to stop glue filling, then the device integrally moves upwards to reach the initial position through the guide rail sliding block mechanism, and glue filling is finished.
After the glue injection is finished, the device moves through a cross beam of the guide rail sliding block mechanism (20) to move the rotary embedded part device to the glue injection position in the previous step. After the vacuum pump (14) starts to work after the vacuum pump moves to the right position, the suction cup (12) in the embedded part rotating device descends through the guide rail sliding block mechanism to grab the embedded part. After grabbing, the hollow shaft (11) provided with the sucker is rotated through the stepping motor (10), the hollow shaft is implanted downwards while rotating, and the air rotating joint (9) ensures that the rotating middle air pipe cannot be wound. When the implant is implanted downwards, the photoelectric sensor on the side of the stepping motor (10) starts to detect whether the embedded part is implanted in place, when the embedded part is implanted in place, a feedback signal is sent to the vacuum pump (14) to stop working, the grabbed embedded part is separated from the sucker (12), the whole device moves upwards to an initial position, and the process of rotating and embedding the part is finished.
After the process steps of injecting glue and embedding the part in a rotating mode are completed, the embedded part needs to be subjected to microwave curing for a certain time, and the embedded part has certain axial strength. The irradiation position of the irradiation probe (17) can be adjusted by aligning the irradiation probe (17) to the embedded part area, adjusting the power of the microwave emitted by the magnetron (18), transmitting the microwave with required power to the irradiation probe (17) through the waveguide (16), and changing the angle of the folding bracket (19). After microwave curing is carried out for about 10min, the glue solution used for gluing the embedded part has a certain degree of curing, and the embedded part also has a certain axial strength, and all the operations are finished at this time.
The above is an example process of the present invention, and the processes of the different carbon fiber plate processing techniques are similar to the present invention, and the processes of injecting glue into the hole, embedding the part by rotation, and curing by microwave are all considered to be included in the scope of the present invention as long as they are consistent with the present invention.
Claims (4)
1. The utility model provides a carbon fiber honeycomb panel injecting glue, bury piece, microwave solidification integrated device soon which characterized in that: the device comprises three devices, namely a glue filling device, a rotary embedding device and a microwave curing device;
the glue filling device comprises a glue filling controller (5), a glue filling barrel (2), a glue filling head (3), an embedded part positioning tool (6), a module (7), a glue filling connecting plate (1), a liquid level sensor (4) and a fan blade-shaped tool; the glue pouring connecting plate (1) is fixed on the first group of sliding blocks through threads, and a circular hole groove is formed in the glue pouring connecting plate (1) and used for fixing the glue pouring barrel (2); the bottom of the glue injection barrel (2) is screwed with a glue injection head (3) through threads; a fan-shaped tool (21) is arranged on the side of the glue pouring connecting plate (1) and used for fixing the liquid level sensor (4); the glue filling controller (5) is connected with the liquid level sensor (4) through a signal line, and the glue filling controller (5) is connected with the glue injection barrel (2) through an air pipe; the embedded part tool (6) is fixed on the working plane through a chute mechanism; the module (7) is used for controlling the whole body to descend for glue injection;
the embedded part screwing device comprises a vacuum pump (14), an air swivel joint (9), a hollow shaft (11), a sucker (12), a stepping motor (10), a module (15), an embedded part implantation connecting plate (8) and a photoelectric sensor (13); the vacuum pump (14) is connected with the air swivel joint (9) through an air pipe, the lower end of the air swivel joint (9) is connected with a hollow shaft (11), and the hollow shaft penetrates through the stepping motor (10) and is connected with the sucker (12); the photoelectric sensor (13) is fixed on the side of the embedded part implantation connecting plate (8) through a bolt; the module (15) controls the whole body to descend to implant and grab the embedded part;
the microwave curing device comprises a magnetron (18), a waveguide tube (16), a microwave irradiation probe (17) and a folding bracket (19); the magnetron (18) is integrated in the control box and is connected with the waveguide tube (16) through threads, the waveguide tube (16) is fixed on the surface of the folding bracket (19) through a binding band, one end of the folding bracket (19) is connected with the microwave irradiation probe (17) through a bolt, and the other end of the folding bracket is fixed on the surface of the control box.
2. The carbon fiber honeycomb plate glue injection, rotary embedding and microwave curing integrated device according to claim 1, characterized in that: the glue filling head (3) can abut against the 16mm lowest position in the hole to start glue filling, so that the liquid level of the glue solution overflows along the plane, and the detection of the liquid level sensor (4) is facilitated; when the liquid level in the hole reaches a certain height, the liquid level sensor (4) detects the height of the liquid level and feeds back a signal; the feedback signal is transmitted to the glue filling controller (5) to control the glue filling barrel (2) to stop glue filling.
3. The carbon fiber honeycomb plate glue injection, rotary embedding and microwave curing integrated device according to claim 1, characterized in that: when the embedded part is grabbed, the embedded part is positioned through an embedded part tool (6) on the working plane, the embedded part can continuously descend for a distance of 150mm when the vacuum sucker contacts the upper surface of the metal embedded part in the descending process, and the hollow shaft (11) and the internal spring are extruded to compress the spring, so that the vacuum sucker can grab and embed the embedded part firmly and can be used as a positioning basis in the subsequent implantation process; in the descending process, the hollow shaft rotates together with the vacuum chuck through the stepping motor, and the air swivel joint ensures that an air pipe connected in the rotation process cannot be wound due to rotation; when the metal embedded part is to be implanted in place, a photoelectric sensor (13) arranged on the outer side of the stepping motor (10) detects reflected light, the set distance is the distance between the upper end surface of the metal embedded part and the carbon fiber honeycomb plate in the horizontal plane, and the distance is reduced by 100 mm; then, when the photoelectric sensor (13) feeds back a signal, the implantation of the implant into the position is finished.
4. The carbon fiber honeycomb plate glue injection, rotary embedding and microwave curing integrated device according to claim 1, characterized in that: the magnetron (18) generates and emits microwaves with different powers through regulation, and the generated microwaves are transmitted to the waveguide tube (16); one end of the waveguide tube (16) is connected with the outlet of the magnetron, and the other end is connected with the microwave irradiation type probe (17) to transmit the microwave to the microwave irradiation type probe (17); the microwave irradiation type probe (17) is responsible for transmitting the microwaves to the concentrated area, and the purpose of adopting the irradiation type probe is to enable the transmitted microwaves to irradiate a specific area only so as to avoid the phenomenon of uneven curing caused by microwave divergence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210472366.3A CN114932684B (en) | 2022-04-29 | 2022-04-29 | Carbon fiber honeycomb board injecting glue, rotary embedded part and microwave curing integrated device |
Applications Claiming Priority (1)
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| CN110187657A (en) * | 2019-05-17 | 2019-08-30 | 山东航天电子技术研究所 | A kind of intelligent electromechanical backboard satellite framework |
| CN210585651U (en) * | 2019-08-02 | 2020-05-22 | 深圳市欣音达科技有限公司 | Vacuum glue pouring device |
| CN211194615U (en) * | 2019-08-02 | 2020-08-07 | 宁波沥高复合材料有限公司 | Metal embedded part positioning device of composite material honeycomb sandwich structure |
| CN213798196U (en) * | 2020-09-02 | 2021-07-27 | 山东双一科技股份有限公司 | Manufacturing device for glass fiber reinforced plastic embedded part |
| CN113370594A (en) * | 2021-06-21 | 2021-09-10 | 航天科工火箭技术有限公司 | Method for designing and manufacturing honeycomb sandwich plate |
| CN215784539U (en) * | 2021-08-24 | 2022-02-11 | 常州铭赛机器人科技股份有限公司 | Glue pouring mechanism |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110187657A (en) * | 2019-05-17 | 2019-08-30 | 山东航天电子技术研究所 | A kind of intelligent electromechanical backboard satellite framework |
| CN210585651U (en) * | 2019-08-02 | 2020-05-22 | 深圳市欣音达科技有限公司 | Vacuum glue pouring device |
| CN211194615U (en) * | 2019-08-02 | 2020-08-07 | 宁波沥高复合材料有限公司 | Metal embedded part positioning device of composite material honeycomb sandwich structure |
| CN213798196U (en) * | 2020-09-02 | 2021-07-27 | 山东双一科技股份有限公司 | Manufacturing device for glass fiber reinforced plastic embedded part |
| CN113370594A (en) * | 2021-06-21 | 2021-09-10 | 航天科工火箭技术有限公司 | Method for designing and manufacturing honeycomb sandwich plate |
| CN215784539U (en) * | 2021-08-24 | 2022-02-11 | 常州铭赛机器人科技股份有限公司 | Glue pouring mechanism |
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