CN114930645B

CN114930645B - Conductive member

Info

Publication number: CN114930645B
Application number: CN202180008416.6A
Authority: CN
Inventors: 今野英明; 石久保雅道
Original assignee: Polymatech Japan Co Ltd
Current assignee: Sekisui Polymatech Co Ltd
Priority date: 2020-03-31
Filing date: 2021-03-26
Publication date: 2023-07-07
Anticipated expiration: 2041-03-26
Also published as: WO2021200642A1; JPWO2021200642A1; JP6979737B1; CN114930645A

Abstract

Provided is a conductive member that is connected in conduction with a low load and a low resistance. The conductive member 10A for connecting the metal case C and the circuit board P in a conductive manner includes a plate body 11 made of a rubber-like elastic material and a conductive film 12 provided on the surface of the plate body 11 and capable of being deformed in a telescopic manner along with the deformation of the plate body 11, the plate body 11 includes a curved portion 11b protruding in the Z direction, the conductive film 12 includes a contact portion 12b, the contact portion 12b is connected in a surface contact state with at least one of the metal case C and the circuit board P by covering the curved portion 11b, and the conductive member 10A can be deformed in a flexible manner while maintaining a state in which the contact portion 12b is in contact with at least one of the metal case C and the circuit board P in the Z direction when receiving a pressing force generated by the metal case C and the circuit board P approaching each other.

Description

Conductive member

Technical Field

The present disclosure relates to a conductive member.

Background

Wireless communication devices, typified by smartphones, transmit and receive various electromagnetic waves of high frequency, and thus can become a source of noise generation. Noise generated from the wireless communication device may cause malfunction of the wireless communication device itself, peripheral electronic devices, and thus prevent normal operation of these devices. Therefore, in the interior of the wireless communication device, countermeasures against EMI (Electro Magnetic Interference: electromagnetic interference) are required to suppress noise emitted from the wireless communication device so that the wireless communication device itself and peripheral electronic devices are not affected.

As one of the methods for countermeasure against EMI, there is a grounding method (grounding) in which noise to be entered into an electronic circuit portion of an electronic device such as a wireless communication device is released to the ground. As one of EMI countermeasure components using this grounding method, a conductive contact is known. The conductive contact connects the ground pattern of the printed wiring board to the ground electrode to ground the printed wiring board, for example, to suppress the influence of noise.

Prior art literature

Patent literature

Patent document 1: japanese patent application laid-open No. 2008-524799, FIG. 2

Disclosure of Invention

Problems to be solved by the invention

However, as an EMI countermeasure component for electronic equipment, a general conductive rubber or metal plate spring is often used. These EMI countermeasure components electrically connect the case and the substrate in a state of being compressed. The external force required for compression deformation of the conductive rubber and compression deformation of the metal plate spring made of a material having high rigidity tends to be large, and the stress (repulsive force) thereof tends to be large. However, if the excessive compression of the stress exceeding the limit of the material is continued, the metal plate spring is plastically deformed and remains deformed, and the original shape may not be recovered, resulting in relaxation.

Moreover, the contact surface of the metal plate spring made of a material having high rigidity is less likely to be compressively deformed even when a load is applied from the object to be connected. Therefore, the contact surface of the metal leaf spring and the hard planar contact portion of the connection object tend to be point-contacted with a smaller cross-sectional area than the surface contact. If vibration or impact is applied to the electronic device in such a point contact state, the conductive connection between the metal plate spring and the connection object may be instantaneously cut off, and stable conduction may not be obtained.

On the other hand, the conductive rubber is, for example, a rubber as a binder, in which a conductive filler is dispersed. The conductive rubber can be reduced in electric resistance by adding a large amount of conductive filler, but also reduced in flexibility. In contrast, if flexibility is desired, the electric resistance of the conductive rubber becomes difficult to decrease. Therefore, an EMI countermeasure component is desired to have excellent performance in terms of both flexibility and conductivity, as compared with conductive rubber.

For example, as shown in patent document 1, there is known an electrical connector having an elastomer bump containing an elastic rubber and a metal layer continuously extending from a source side to a terminal side of a connector on an outer surface thereof, the electrical connector being crimped between a chip module and a printed wiring substrate. However, the conductive connector of patent document 1 has a block shape having a larger thickness toward the connection object disposed opposite to each other. Accordingly, in the conductive connector of patent document 1, a pressing load generated by compressing a pair of objects to be connected with the conductive connector interposed therebetween increases.

For example, in a smart phone, a plurality of EMI countermeasure components may be used for the ground connection as EMI countermeasures. At this time, since the number of EMI countermeasure components is large when the product is assembled, the pressing load increases, and it is difficult to achieve both the strength of the case and the board and the thickness and weight of the product.

Means for solving the problems

Several aspects disclosed in the present application have the following features.

That is, one aspect of the present disclosure is a conductive member for electrically connecting a first connection object and a second connection object, the conductive member including: a base material composed of a rubber-like elastic material, and a conductive coating film provided on a surface of the base material and capable of being deformed in a stretching manner together with deformation of the base material; the base material has a curved portion protruding in a first direction in which the first and second objects to be connected approach each other and separate from each other, and the conductive coating has a contact surface portion that is brought into conduction in a state of being in surface contact with at least one of the first and second objects to be connected by covering the curved portion, and the conductive member is capable of being deformed in a state of being spread and bent while maintaining the state of being in surface contact with at least one of the first and second objects to be connected when receiving a pressing force generated by the first and second objects to be connected approaching each other.

The conductive member has a base material made of a rubber-like elastic material and a conductive coating film capable of being deformed in an expanding and contracting manner in accordance with the deformation of the base material. Therefore, even when the conductive member receives a small pressing load generated by the first connection object and the second connection object, the conductive member can be deformed greatly. Therefore, according to this aspect, the pressing load of the first connection object and the second connection object on the conductive member and the stress (repulsive force) thereof can be reduced.

Further, the base material of the conductive member has a bending portion capable of being deformed in a bending manner, and the conductive coating of the conductive member has a contact surface portion which is brought into conduction in a surface contact state with at least one of the first object to be connected and the second object to be connected by covering the bending portion. Therefore, the conductive coating can ensure the cross-sectional area of the current path on the contact surface portion with at least one of the first connection object and the second connection object. Therefore, according to this aspect, the contact resistance value when the first connection object and the second connection object approach each other with respect to the conductive member and the contact surface portion starts to make conductive contact with at least one of the first connection object and the second connection object can be rapidly reduced.

The base material is not plastically deformed and has a stress to return to its original shape when receiving a pressing load by the first object to be connected and the second object to be connected. Therefore, the conductive member can maintain the surface contact state while being pressed by the first object to be connected and the second object to be connected. Therefore, according to this aspect, for example, even if the electronic device including the first connection object and the second connection object receives vibration or impact, stable conduction between the electronic device and the conductive member can be maintained.

The base material may be a plate body, and may be located between the first object to be connected and the second object to be connected, which are disposed in opposition to each other, and the bending portion may be deformed so as to be bent in a nearly flat manner when receiving a pressing force generated by the first object to be connected and the second object to be connected being brought close to each other.

According to this aspect, the conductive member is configured such that the base material is a plate body, and the bending portion is capable of being deformed so as to be bent in a nearly flat manner when receiving a pressing force generated by the first object to be connected and the second object to be connected being brought close to each other. Therefore, according to this aspect, since the bent portion is nearly flat, the contact area of the contact surface in a state of being in surface contact with at least one of the first object to be connected and the second object to be connected can be expanded. Therefore, according to this aspect, the contact resistance value of the conductive member with respect to at least one of the first connection object and the second connection object can be reduced without increasing the pressing load of the first connection object and the second connection object against the conductive member.

The base material may be a conductive rubber containing a conductive filler in a rubber material.

According to this aspect, the conductive member has a structure that not only the conductive coating but also the base material is conductive. Therefore, according to this aspect, the resistance of the entire conductive member can be reduced.

The conductive coating may have a structure that covers the entire surface of the base material.

According to this aspect, the entire surface of the conductive member is covered with the conductive coating film. Thereby, the entire surface of the conductive member becomes a current path. Therefore, according to this aspect, the conductive member can be electrically connected to the first connection object and the second connection object with reliability and low resistance by using the surface thereof as a current path. On the other hand, according to this aspect, the base material can be used as an insulating material such as insulating rubber. In general, if an insulating material is made conductive, flexibility tends to be lowered. However, according to this aspect, the substrate need not have conductivity. Therefore, according to this aspect, since a material having higher flexibility can be used for the base material, the conductive member can be flexibly deformed when receiving the pressing by the first object to be connected and the second object to be connected.

The base material may have a distal end portion extending from the bent portion, and the contact surface portion covering the bent portion may be in contact with one of the first object to be connected and the second object to be connected, and the other contact surface portion covering the distal end portion may be in contact with the other of the first object to be connected and the second object to be connected.

According to this aspect, the conductive member is pressed by the first object to be connected and the second object to be connected in a state where the other contact surface portion covering the distal end portion extending from the bent portion is in contact with the other one of the first object to be connected and the second object to be connected. Thus, the pressing load of the first and second objects to be connected to the conductive member becomes larger than that in a state where the tip portion is the free end. Therefore, according to this aspect, the pressing load of the first connection object and the second connection object on the conductive member does not become excessively small, and the first connection object and the second connection object can be kept appropriate.

The substrate may have a hardness of A1 to a90 as measured by a type a durometer in JIS K6253.

According to this embodiment, the base material has a hardness of A1 to A90 measured by a type A durometer in accordance with JIS K6253. This is soft enough to allow the base material to be easily deformed by bending when receiving a pressing force generated by the first object to be connected and the second object to be connected approaching each other. Therefore, compared with, for example, a metal plate spring used in a large amount as an EMI countermeasure component, the load when the conductive member is pressed by the first object to be connected and the second object to be connected can be sufficiently reduced. More specifically, it is preferable that the rubber-like elastic body of the base material has a hardness of A1 to a60 in the case of an insulating rubber, and has a hardness of a10 to a90 in the case of a conductive rubber.

The conductive member may have a fixing and holding portion provided with a fixing portion made of an adhesive material layer or a metal foil layer.

According to this aspect, the conductive member has the attaching portion, so the conductive member can be easily mounted to, for example, a circuit.

The substrate may be configured to extend in a cantilever shape from the fixed holding portion in a second direction intersecting the first direction.

According to this aspect, the base material is elongated in a cantilever shape from the fixed holding portion. Therefore, according to this aspect, the pressing load of the first connection object and the second connection object on the conductive member and the stress (repulsive force) thereof can be reduced.

The thickness of the material of the base material may be 0.05mm to 0.5mm.

According to this aspect, since the base material has an appropriate thickness, the conductive member can be flexibly deformed when being pressed by the first object to be connected and the second object to be connected.

The substrate may have a long side extending in a second direction intersecting the first direction, and the long side may be 0.5mm to 5mm.

According to this aspect, since the base material has a long side of a sufficient length, the conductive member can be flexibly deformed when being pressed by the first object to be connected and the second object to be connected.

The present invention also provides a conductive member for electrically connecting a first connection object and a second connection object, the conductive member comprising: a base material composed of a rubber-like elastic material, and a conductive coating film provided so as to cover a surface of the base material including a top surface, a bottom surface, and at least one side surface, the base material being capable of being deformed in a stretching manner together with deformation of the base material; the substrate has a curved portion protruding in a first direction in which the first and second objects to be connected approach each other and separate from each other, the conductive coating has a contact surface portion which is brought into conduction in a surface contact state with at least one of the first and second objects to be connected by covering the curved portion, the conductive member has exposed portions which are not covered by the conductive coating in 4 surfaces including two end surfaces in a long side direction and two end surfaces in a short side direction, and the substrate is a plate body which can flex in a state in which the contact surface portion is brought into contact with the surface of at least one of the first and second objects to be connected while maintaining the surface contact state in which the first and second objects to be connected approach each other, and the conductive member can flex in an unfolded and curved manner in a state in which the substrate is placed between the first and second objects to be connected to each other by pressing the first and second objects to be connected to each other in a flat state in which the substrate is pressed by the substrate.

The present invention also provides a conductive member for electrically connecting a first connection object and a second connection object, the conductive member including: a base material composed of a rubber-like elastic material, and a conductive coating film provided so as to cover a surface of the base material including a top surface, a bottom surface, and at least one side surface, the base material being capable of being deformed in a stretching manner together with deformation of the base material; the base material has a curved portion protruding in a first direction in which the first and second connection objects approach and separate from each other, the conductive coating has a contact surface portion which is brought into conduction in a surface contact state with at least one of the first and second connection objects by covering the curved portion, the conductive member has an exposed portion which is not covered with the conductive coating in 4 surfaces including two end surfaces in a long side direction and two end surfaces in a short side direction, and the base material has a front end portion which extends from the curved portion and covers the other of the first and second connection objects while maintaining a state in which the contact surface portion is brought into contact with the surface of at least one of the first and second connection objects, and the conductive member is brought into flexural deformation in a state in which the contact surface portion is brought into contact with the other of the first and second connection objects while expanding and bending.

The present invention also provides a conductive member for electrically connecting a first connection object and a second connection object, the conductive member including: a base material composed of a rubber-like elastic material, a conductive coating film provided in a coating manner on a surface of the base material including a top surface, a bottom surface, and at least one side surface, the conductive coating film being capable of being deformed in a telescopic manner together with deformation of the base material, and a fixing and holding portion provided with a fixing portion composed of an adhesive material layer or a metal foil layer; the base material has a curved portion protruding in a first direction in which the first and second connection objects approach and separate from each other, the conductive coating has a contact surface portion that is in surface contact with at least one of the first and second connection objects by covering the curved portion, and the conductive member has exposed portions that are not covered by the conductive coating in 4 regions including two end surfaces in a long-side direction and two end surfaces in a short-side direction, and is capable of being deformed in a state in which the contact surface portion is in contact with the at least one of the first and second connection objects while maintaining the surface contact state in which the conductive member is in cantilever form from the fixed holding portion in the second direction intersecting with the cantilever form.

Drawings

Fig. 1 is a diagram showing a conductive member according to a first embodiment, 1A in fig. 1 is a top view, and 1B in fig. 1 is a front view.

Fig. 2 is a diagram showing a conductive member according to a modification of the first embodiment, 2A in fig. 2 is a front view showing an example in which an adhesive material layer is attached to a fixed holding portion, and 2B in fig. 2 is a front view showing an example in which a metal foil layer is buried in advance as a fixed holding portion. Fig. 2C is a front view showing an example in which the conductive film is provided on only the top surface and the bottom surface, and fig. 2D is a front view showing an example in which the conductive film on the top surface is directly connected to the metal foil layer when the conductive film is provided on only the top surface.

Fig. 3 is a diagram illustrating the function of the conductive member, and 3A in fig. 3 is a sectional view taken along line IIIA-IIIA in fig. 1, which corresponds to line 1A showing a state before the conductive member is deformed by flexing. 3B in fig. 3 is a cross-sectional view taken along line IIIA-IIIA of fig. 1 corresponding to a state in which the conductive member is flattened by flexural deformation.

Fig. 4 is a diagram showing the conductive member of the second embodiment, 4A in fig. 4 is a top view, and 4B in fig. 4 is a front view.

Fig. 5 is a diagram showing the conductive member of the third embodiment, 5A in fig. 5 is a top view, and 5B in fig. 5 is a front view.

Fig. 6 is a diagram showing the conductive member of the fourth embodiment, 6A in fig. 6 is a top view, and 6B in fig. 6 is a front view.

Fig. 7 is a diagram showing a conductive member according to a modification of the fourth embodiment, 7A in fig. 7 is a front view showing an example in which an adhesive material layer is attached to a fixed holding portion, and 7B in fig. 7 is a front view showing an example in which a metal foil layer is buried in advance as a fixed holding portion.

8A in fig. 8 is a front view showing the conductive member of the fifth embodiment. Fig. 8B is a front view showing a conductive member according to a modification of the fifth embodiment in which an adhesive layer is attached to a fixing and holding portion. Fig. 8C is a front view showing a conductive member according to a modification of the fifth embodiment in which a metal foil layer is embedded as a fixing and holding portion.

9A in fig. 9 is a front view showing a conductive member of the sixth embodiment. 9B in fig. 9 is a front view showing the conductive member of the seventh embodiment.

Fig. 10 is a front view showing a conductive member of the eighth embodiment.

Fig. 11 is a diagram showing a conductive member of the ninth embodiment, 11A in fig. 11 is a top view, and 11B in fig. 11 is a front view.

Fig. 12A is a front view of a conductive member showing a modification of the seventh embodiment. 12B in fig. 12 is a front view showing a conductive member of the tenth embodiment.

Detailed Description

Examples of embodiments disclosed in the present application are described below with reference to the drawings. The same reference numerals are given to the structures common to the following embodiments, and repetitive description in the description will be omitted. Further, the method of use and the effects common to the embodiments will not be repeated. In the present specification and claims, the terms "first" and "second" are used for distinguishing between different components, and are not used for specifying a specific order, quality, or the like.

The "conductive member" disclosed in the present application is a member that conductively connects an adherend that is a "first connection object" and a "second connection object". As one embodiment of the "first connection object", a metal case of an electric device or the like can be exemplified. As one form of the "second connection object", a circuit board housed in a metal case can be exemplified. The "first connection object" and the "second connection object" may be reversed.

In the present specification and claims, for convenience, as shown in fig. 1A, 1B, and the like, the long side direction (left-right direction) of the conductive member 10 is referred to as the X direction, the short side direction (front-rear direction) is referred to as the Y direction, and the height direction (up-down direction) is referred to as the Z direction. Further, in the Y direction, the front side of 1B and the like in fig. 1 is referred to as the front side of the conductive member 10, and the back side is referred to as the back side of the conductive member 10. In the conductive member 10, the side placed on the circuit board P is referred to as the lower side in the Z direction, and the side where the metal case C is disposed is referred to as the upper side in the Z direction. However, these terms are not limited to the direction of connection, the compression direction, the orientation of the arrangement with respect to the electronic device, and the like of the conductive member 10.

First embodiment [ 1A in FIG. 1, 1B in FIG. 1 ]

The conductive member 10 of the present embodiment functions as an EMI countermeasure component, and as a ground for releasing noise that is to enter an electronic circuit section such as a wireless communication device to the ground. The conductive member 10 is configured to be connected in conduction in a state where the metal case C and the circuit board P, which are disposed so as to be opposed to each other in the Z direction, which is the "first direction", are compressed (see 3B in fig. 3).

The conductive member 10 has a plate body 11 as a "base material" and a conductive coating 12. The conductive member 10 is configured such that a surface of a plate body 11 which is a base of the structure is covered with a conductive coating 12. The conductive member 10 is located between the metal case C and the circuit board P disposed opposite to each other, and the board 11 is in contact with the metal case C and the circuit board P via the conductive coating 12.

The conductive member 10 has a thin plate shape, as shown by 1A in fig. 1, and has a plate surface that expands in the XY direction, as shown by 1B in fig. 1, and has a plate thickness in the Z direction. The conductive member 10 has an S-shape (sigmoid shape) when viewed from the front, and has a valley fold line extending in the Y direction at the left end in the X direction and a peak fold line extending in the Y direction at the right end. That is, the conductive member 10 has a plane low in position in the Z direction near the left end, a plane high in position near the right end, and an inclined surface between these planes, in other words, in the central portion in the X direction. In the conductive member 10, a bottom surface of a plane located at the left end of the lower end in the Z direction is placed on the circuit board P. On the other hand, the conductive member 10 is disposed such that the top surface of the right-hand end plane located at the upper end in the Z direction is in contact with the metal case C.

The plate 11 receives a load (pressing load) between the metal case C pressed by narrowing the gap in the Z direction and the circuit board P by a structure capable of being deflected (bent) and deformed in the gap, thereby reducing stress (repulsive force). Therefore, the plate body 11 is configured to be easily deflectable and deformable with respect to the pressing of the metal case C and the circuit board P, particularly in the Z direction. The plate body 11 of the present embodiment has a thin plate shape, for example, as shown in 1A in fig. 1, and has a plate surface longer in the X direction than in the Y direction and extending in the XY direction, and has a plate thickness in the Z direction, as shown in 1B in fig. 1. According to this structure, the plate body 11 is formed in a thin plate shape in the Z direction, so that the plate body 11 can be deformed and deflected particularly easily in the Z direction. At this time, since the plate body 11 is longer in the X direction than in the Y direction, the plate body 11 can be deformed by bending with the Y direction as an axis.

Further, the plate body 11 of the present embodiment is made of a rubber-like elastic material. The rubber-like elastomer has a property of low elastic modulus. Therefore, even if the conductive member 10 receives a small pressing load generated by the metal case C and the circuit board P, it can be deformed greatly. Therefore, according to the present embodiment, the pressing load on the conductive member 10 and the stress (repulsive force) thereof generated by the metal case C and the circuit board P can be reduced. In this way, the plate body 11 has higher flexibility than the conductive coating 12, and is a part of the conductive member 10 that is most likely to be deformed by external force.

The plate 11 is curved so as to extend to the right in the X direction while protruding upward in the Z direction, and has an S-shape (S-shape) when viewed from the front. The plate 11 has a plate base 11a and a bent portion 11b. The bent portion 11b is a region in which one of the metal case C and the circuit board P is initially in contact with the conductive member 10 when the metal case C and the circuit board P are close to each other, and is bent when viewed from the front. Therefore, the bent portion 11b becomes a region including any one of the upper and lower ends of the conductive member 10. The "bending" here may be bending (bending) with a clear corner in front view (see, for example, 1B in fig. 1), or smoothly bending (bending) (see, for example, 6B in fig. 6).

The board base 11a is a portion where the board 11 is placed on the circuit board P via the conductive coating 12. The plate body base 11a has a thin plate shape, and is directed from the left end of the plate body 11 to the right Fang Shenchang in the X direction when viewed from the front.

The bent portion 11b is a main portion for converting a load received from the metal case C and the circuit board P into a force for deforming the board 11. The bent portion 11b is formed protruding upward from the plate body base portion 11a as one of the "first direction". Since the bent portion 11b of the present embodiment is in contact with the metal case C located above, it is provided at a high position in the Z direction even in the plate body 11, that is, at the top including the upper end of the plate body 11.

The bent portion 11b is composed of an inclined piece portion 11c and a top side cross piece portion 11d each having a thin plate shape. The inclined piece portion 11c is directed to the right Fang Shenchang in the X direction so as to be inclined upward in the Z direction from the right end of the plate body base portion 11a when viewed from the front. The top side cross piece portion 11d is directed to the right Fang Shenchang in the X direction from the right end of the inclined piece portion 11c as viewed from the front. In the bending portion 11b, a bending angle θ1 in an initial state is formed by the top side cross piece portion 11d and the inclined piece portion 11c when viewed from the front (see 3A in fig. 3).

The top side cross piece portion 11d extends in the X direction so as to be parallel to the plate body base portion 11 a. In this way, when the metal case C is arranged parallel to the circuit board P, the contact area when the conductive member 10 starts to make conductive contact with the metal case C can be enlarged. Therefore, the conductive member 10 can stably maintain the surface contact state while receiving the pressing of the metal case C and the circuit board P after the conductive member 10 starts the conductive contact with the metal case C.

However, the top side cross piece portion 11d may be configured to be inclined in the X direction toward the right Fang Shenchang so as to be inclined downward in the Z direction from the right end of the inclined piece portion 11c in front view. Thus, when the metal case C and the circuit board P come close to each other, the right end of the conductive member 10 can be brought into contact with the circuit board P at an earlier stage. Further, by being pressed by the metal case C and the circuit board P in a state where the right end of the conductive member 10 is in contact with the circuit board P, the pressing load of the conductive member 10 by the metal case C and the circuit board P becomes larger than that in a state where the right end of the conductive member 10 is not in contact. Therefore, according to this structure, the pressing load of the metal case C and the circuit board P on the conductive member 10 does not become too small, and can be kept appropriate.

Both the front end surface and the rear end surface of the plate body 11 in the Y direction are exposed portions 11e formed as "cut surfaces". The exposed portion 11e is a portion of the surface of the plate 11 exposed without being covered with the conductive coating 12. Both of the pair of exposed portions 11e are formed along an XZ plane, which is a plane that is a direction intersecting an XY plane in which the conductive member 10 receives a pressing load of the metal case C and the circuit board P. The pair of exposed portions 11e are flush with the front end and the rear end of the conductive coating 12, which are formed as "cut surfaces".

Here, as described above, the plate body 11 has high flexibility as compared with the conductive coating 12. Therefore, the exposed portion 11e of the plate body 11, which is not covered with the conductive coating 12, is a portion that is easily deformed when subjected to an external force, as compared with the "covered portion" of the plate body 11, which is covered with the conductive coating 12. That is, when the plate body 11 is compressively deformed by being pressed, the exposed portion 11e can bulge and deform forward and backward with reference to the front end and the rear end of the conductive coating 12, respectively.

The exposed portions 11e of the plate 11 are opposite to each other, that is, facing opposite directions, and the XY plane receiving the pressing load of the metal case C and the circuit board P with respect to the conductive member 10 is a vertical plane. Therefore, when the plate body 11 is compressed in the Z direction, which is a direction perpendicular to the exposed portions 11e, by the metal case C and the circuit board P, the pair of exposed portions 11e can be effectively bulged outward in the Y direction. Therefore, the pressing load when compressed can be reduced in the conductive member 10.

The conductive coating 12 covers at least a part of the surface of the board 11, and connects the metal case C and the circuit board P in a conductive manner while expanding and contracting according to the deformation of the board 11. The conductive coating 12 is a thin conductive film having a thickness in the intersecting direction with respect to the area exposed in a planar shape on the surface. The conductive coating 12 is configured so as not to break when the conductive member 10 is pressed by the metal case C and the circuit board P, and so as to be elastically deformed together with the flexural deformation of the board 11.

As described above, the conductive coating 12 of the present embodiment covers the entire surface of the plate 11 except the front end surface and the rear end surface of the exposed portion 11 e. Therefore, the conductive coating 12 has a cylindrical shape having an S-shape (S-shape) when viewed from the front, and has a hollow region penetrating in the Y direction inside. That is, the top and bottom surfaces of the conductive coating 12 are not connected to the regions of the front and rear end surfaces of the plate body 11 as the exposed portion 11e, but are connected to the left and right side surfaces in a conductive manner. The conductive coating 12 has a fixed holding portion 12a and a contact surface portion 12b.

The fixing and holding portion 12a is a mounting portion of the conductive member 10 on the circuit board P as an adherend, and an electrical connection surface. The fixed holding portion 12a is located at the lower end of the conductive member 10. The fixed holding portion 12a is formed along the XY plane from the bottom surface of the conductive coating 12 that covers the bottom surface of the plate body base 11 a.

The contact surface 12b is an electrical connection surface of the conductive member 10 with respect to the metal case C. The contact surface portion 12b is located at the upper end of the conductive member 10. The contact surface portion 12b is a top surface of the conductive coating 12 covering the top surface of the bent portion 11b from above. The contact surface portion 12b has a curved surface shape formed along the curved portion 11 b.

In this way, the conductive member 10 is configured so that the contact surface portion 12b covering the bent portion 11b is also a bent surface in the same manner. Further, since the contact surface portion 12b, which is an electrical connection surface, is formed as a curved surface in the conductive member 10, a wider contact area between the conductive member 10 and the metal case C can be stably ensured, and contact resistance between them can be reduced. Accordingly, the conductive member 10 has the bent portion 11b and the contact surface portion 12b covering the bent portion, whereby the conductive connection of the conductive member 10 can be stabilized.

Modification of the first embodiment [ 2A in FIG. 2-2D in FIG. 2 ]

The conductive member 10 of the present embodiment can be deformed and implemented, and therefore, an example thereof will be described.

In the first embodiment, an example is shown in which the fixed holding portion 12a is simply formed on the bottom surface of the conductive coating 12. However, as shown in fig. 2A, the adhesive material layer 13a as a "fixing portion" may be attached to the fixing and holding portion 12A. For example, a conductive adhesive member that can adhere the conductive member 10A to the circuit board P can be used for the adhesive material layer 13a. Thus, the adhesive material layer 13a can bond the fixing and holding portion 12a and the circuit board P together and electrically connect them.

As the conductive adhesive member, for example, a conductive adhesive, a conductive tape in which a copper foil or the like is coated with a conductive adhesive in advance, or the like can be used. When the conductive adhesive member is used alone as the adhesive material layer 13a, the conductive adhesive member may be bonded to the fixing and holding portion 12a to be integrated with the conductive coating 12 formed separately.

According to the structure of this modification, since the conductive member 10A has the adhesive material layer 13a in the fixing and holding portion 12a, the conductive member 10A can be easily mounted on, for example, a circuit without soldering.

As another modification, as shown in fig. 2B, the fixing and holding portion 12a may be formed by embedding a metal foil layer 13B as a "fixing and attaching portion" in advance. For example, the metal foil layer 13b can be provided by insert molding a copper foil on the bottom surface of the board base 11a of the board 11. The material of the metal foil is not limited to copper, but may be aluminum, for example. The metal foil layer 13b can be mounted on the circuit board P by soldering, for example. Thus, the metal foil layer 13b can be electrically connected to the circuit board P while fixing the fixing and holding portion 12 a.

According to the structure of this alternative modification, since the conductive member 10B has the metal foil layer 13B in the fixing and holding portion 12a, the conductive member 10B can be easily mounted on, for example, a circuit by soldering.

As another modification, as shown in fig. 2C, the conductive coating 12 may be formed to cover only the top and bottom surfaces of the plate 11. In this case, the rubber-like elastic body of the plate body 11 may be conductive rubber.

According to the structure of the conductive member 10C of the further modification, since the plate body 11 has conductivity, conduction from the metal foil layer 13b to the contact surface portion 12b can be achieved through the plate body 11 and the conductive coating 12. Further, since the plate body 11 becomes the exposed portion 11e in addition to the front and rear end surfaces and the left and right end surfaces, the exposed portion 11e can be effectively bulged outward in the X direction as well as in the Y direction.

As another modification, as shown in fig. 2D, a connection hole 11h may be formed in the board 11, the connection hole 11h may be connected between a metal foil layer 13b embedded near the bottom surface of the board 11 and the top surface of the board 11, and the conductive coating 12 may have a filling portion 12e filled in the connection hole 11h. The rubber-like elastic body of the plate body 11 may be made of insulating rubber, and the plate body 11 may be provided with a connection hole 11h penetrating the plate body base 11 a. The conductive coating 12 covers the top surface of the board 11, and is provided as a filling portion 12e inside the connection hole 11h. The conductive film 12 provided in the filling portion 12e may be formed so as to be capable of electrically connecting the conductive film 12 on the top surface of the cover plate body 11 and the metal foil layer 13b, and may not necessarily have a film shape along the inner surface of the connection hole 11h.

According to the structure of the conductive member 10D of this further modification, conduction from the metal foil layer 13b to the contact surface portion 12b can be achieved through the filling portion 12e filling the connection hole 11h of the board body base portion 11a and the conductive coating 12 covering the top surface of the board body 11. At this time, the metal foil layer 13b and the contact surface portion 12b are directly connected by the conductive coating 12, so that the resistance of the conductive member 10D can be reduced.

The function of the first embodiment [ 3A in FIG. 3, 3B in FIG. 3 ]

Next, the operation of the conductive member 10 according to the present embodiment when mounted on the metal case C and the circuit board P will be described. Here, an example of the conductive member 10A having a modification of the adhesive material layer 13a as the "attachment portion" shown in fig. 2A will be described. However, the same effect as that of the conductive member 10A can be obtained also for the conductive member 10B having the modification of the metal foil layer 13B and the conductive member 10 not having these structures.

First, the conductive member 10A is bonded to the circuit board P through the adhesive material layer 13 a. The metal case C moves downward in the Z direction with respect to the circuit board P and comes into contact with the contact surface portion 12b (see 3A in fig. 3).

Here, the conductive member 10A of the present embodiment has a curved portion 11b protruding upward from the plate body 11 made of a rubber-like elastic material, and the contact surface portion 12b as a curved surface is in contact with the metal case C. The contact surface portion 12b of the conductive coating 12 is configured to be elastically deformable in response to deformation of the bent portion 11b of the plate body 11. Further, since the contact surface portion 12b is a curved surface, the contact area with the metal case C is reduced to a range near the apex of the curved surface, and thus the pressing load of the metal case C is easily concentrated, as compared with the case where the metal case C is brought into contact with the entire top surface of the conductive coating 12. In addition, the plate body 11 is made of a rubber-like elastic material, so that even if a small pressing load is applied to the metal case C, the plate body can be greatly deformed by compression, and the multipoint contact portions are easily crushed to be in a surface contact state. Thus, the contact surface portion 12b comes into surface contact with the metal case C.

In this way, the conductive coating 12 can ensure the sectional area of the current path at the contact surface 12b with the metal case C. Therefore, according to the present embodiment, the metal case C and the circuit board P are brought close to each other with respect to the conductive member 10A, and the contact resistance value when the contact surface portion 12b starts to make conductive contact with the metal case C can be reduced rapidly. The conductive coating 12 is electrically connected between the contact surface portion 12b as an electrical connection surface and the fixed holding portion 12a, irrespective of the conductivity of the plate body 11. Therefore, the conductive member 10A has the conductive coating 12, so that the metal case C and the circuit board P can be electrically connected with low resistance.

The bent portion 11B is located at a high position in the Z direction in an initial state where the bent portion is not in contact with the metal case C, the circuit board P, or the like and is not deformed by bending (see 3A in fig. 3, 1B in fig. 1, and 2A to 2D in fig. 2). That is, the conductive member 10A is configured such that the height H1 of the conductive member 10A in the initial state is large, and the length L1 of the conductive member 10A in the initial state is small. In front view, the bending angle θ1 in the initial state formed by the top side cross piece portion 11d and the inclined piece portion 11c is minimized as will be described later. The bending angle θ1 in the initial state is, for example, about 160 ° in the drawing.

The bending portion 11b is configured to be flexibly deformed from a shape having a protruding height in the Z direction and being bent when pressed so as to shorten the distance in the Z direction between the metal case C and the circuit board P, so as to spread the bending and planarize the bending. In this flexural deformation, the bent portion 11b is configured to be capable of extending in the X direction, which is the "second direction" intersecting the Z direction. That is, when the bending portion 11B receives a pressing load from the metal case C, the position in the Z direction is lowered, and the plate body 11 is deformed by bending, so that the length in the longitudinal direction from the left end of the plate body base portion 11a to the right end of the top side cross piece portion 11d is extended in the X direction (see 3B in fig. 3). That is, when compared with the height H1 of the conductive member 10A in the initial state, the height H2 of the conductive member 10A in the flattened state becomes smaller (H1 > H2). On the other hand, if the length L2 of the conductive member 10A in the flattened state is larger than the length L1 of the conductive member 10A in the initial state (L1 < L2).

Here, the bending portion 11b can be deformed in a bending manner such that the bending angle θ2 is approximately 180 ° when viewed from the front in a flattened state. The bending angle θ2 at the stage of flattening is, for example, 180 ° in the drawing, and is a value larger than about 160 ° of the bending angle θ1 in the initial state.

The pressing load required for the bending deformation of the bent portion 11b is sufficiently smaller than the pressing load required for the compression deformation of the plate body 11 itself, which is thinned. Therefore, by providing the bent portion 11b in the conductive member 10A, the stress (repulsive force) of the conductive member 10A until the bent shape of the bent portion 11b is flattened can be reduced. At this time, the bending portion 11b reverses the direction of bending the plate body 11 (bending angle θ2 exceeding 180 °) so as to generate a so-called Click feel (Click feel), and has a shape in which the fluctuation of the repulsive force does not change significantly instantaneously. Therefore, the plate body 11 can be flexibly flattened until the curved shape of the curved portion 11b is flattened.

The rubber-like elastic material has a property of high recovery when the load is removed. Therefore, the plate 11 has a stress to be restored to the original shape without plastic deformation in a state of receiving the pressing load of the metal case C and the circuit board P. The contact surface portion 12b can receive the stress and maintain the surface contact state while receiving the pressing of the metal case C and the circuit board P. Therefore, the bent portion 11b is nearly flat, and the contact area can be enlarged by enlarging the range in the X direction with respect to the area of the contact surface of the metal case C in the state of being in surface contact. As a result, according to the present embodiment, the contact resistance value of the conductive member 10A with respect to at least one of the metal case C and the circuit board P can be reduced without increasing the pressing load of the metal case C and the circuit board P against the conductive member 10A.

The plate body 11 may be folded back in the Z direction from the left end of the plate body base 11a as the "first end" to the right end of the top side cross piece portion 11d as the "second end" to extend, but does not have a "folded back portion" folded back in the left-right direction in the X direction. That is, the plate 11 does not have a "overlapping portion" where the plate 11 overlaps 2 or more sheets in plan view. Therefore, the plate 11 does not overlap in the Z direction when subjected to the pressing load of the metal case C and the circuit board P and is deformed in a bending manner. That is, the plate 11 has a structure in which the curved shape of the curved portion 11b is easily flattened.

In the conductive member 10A in which the Z-direction distance between the metal case C and the circuit board P reaches the thickness of the conductive member 10A from the initial state, compressive deformation is generated to reduce the plate thickness, and the stress (repulsive force) of the conductive member 10A increases rapidly. However, according to the structure in which the plate body 11 does not have the "folded portion" or the "overlapped portion", a longer distance from the contact of the metal case C with the contact surface portion 12b to the displacement of the bent portion 11b with respect to the circuit board P until flattening can be ensured. Thereby, the conductive member 10A can ensure a longer range in which the repulsive force thereof does not increase.

The plate 11 extends in the X direction in a cantilever shape from the fixed holding portion 12 a. Further, the flexural deformation of the plate body 11 in the stage before the conductive member 10A starts to generate the compressive deformation ends in the gap between the metal case C and the circuit board P. Therefore, in the stage of the flexural deformation of the board 11, friction resistance is less likely to occur due to contact of the right end or the like of the board 11 with the circuit board P. Therefore, according to the present embodiment, the pressing load of the metal case C and the circuit board P to the conductive member 10A and the stress (repulsive force) thereof can be reduced.

When the conductive member 10A continues to be pressed by the metal case C after being flattened, it eventually contacts the circuit board P. When the conductive member 10A is pressed from both the metal case C and the circuit board P, the conductive member 10A itself is crushed to reduce the thickness thereof. At this time, since the plate body 11 is made of a rubber-like elastic material, the pressing load of the metal case C and the circuit board P on the conductive member 10A and the stress (repulsive force) thereof can be reduced. At this time, if the conductive member 10A has the exposed portion 11e on the end surface in the Y direction, for example, the plate body 11 can be effectively bulged outward in the Y direction when compressed in the Z direction by the metal case C and the circuit board P. Therefore, in the conductive member 10A, the pressing load when compressed can be further reduced.

Here, the case where the conductive member 10A is mounted on the circuit board P and is pressed by the metal case C is described. However, the same effect can be obtained also in the case where the conductive member 10A is mounted on the metal case C and pressed by the circuit board P.

As described above, the conductive member 10A has the plate body 11 made of the rubber-like elastic material and the conductive coating 12 that can be deformed in a stretching manner according to the deformation of the plate body 11. Therefore, the conductive member 10A can be greatly deformed even under a small pressing load generated by the metal case C and the circuit board P. Therefore, according to the present embodiment, the pressing load of the metal case C and the circuit board P to the conductive member 10A and the stress (repulsive force) thereof can be reduced.

Further, the plate body 11 of the conductive member 10A has a bending portion 11b that can be deformed and bent in a manner of being unfolded and bent. The conductive coating 12 of the conductive member 10A has a contact surface portion 12b, and the contact surface portion 12b is electrically connected in surface contact with at least one of the metal case C and the circuit board P by covering the bent portion 11b. Therefore, the conductive coating 12 can ensure a cross-sectional area of the current path in the contact surface 12b with at least one of the metal case C and the circuit board P. Therefore, according to the present embodiment, the contact resistance value when the contact surface portion 12b comes into conductive contact with at least one of the metal case C and the circuit board P can be rapidly reduced by bringing the metal case C and the circuit board P into close contact with each other with respect to the conductive member 10A.

The plate 11 is subjected to a pressing load from the metal case C and the circuit board P, and has a stress to return to its original shape without plastic deformation. Accordingly, the conductive member 10A can maintain the surface contact state while receiving the pressing force of the metal case C and the circuit board P. Therefore, according to the present embodiment, even if an electronic device including the metal case C and the circuit board P receives vibration or impact, for example, stable conduction between the electronic device and the conductive member 10A can be maintained.

The rubber-like elasticity applicable to the plate body 11 includes rubber materials such as silicone rubber, other synthetic rubber, and thermoplastic elastomer. Among them, the plate 11 is preferably made of a silicone rubber having heat resistance and reduced compression set. The plate 11 is not limited to the composition, structure, or the like, and any elastic body having high flexibility and high recovery property when the plate is detached from the load may be used as the plate 11, and a porous body such as a polyurethane sponge or a resin film may be used. However, it is more preferable to use a rubber-like elastic material for the plate body 11, which has a lower compression set value than that of the porous material or the resin film and is hard to relax even after long-term use. Further, these materials may be used in combination of two or more kinds in the plate body 11 instead of using them alone.

When the compression set of the plate 11 exceeds 30%, the elastic force is insufficient when the metal case C and the circuit board P are compressed, and the plate is hard to return to the original shape. Therefore, the possibility that conduction between the metal case C and the circuit board P cannot be maintained becomes high. Therefore, the plate 11 is preferably configured to have a compression set of 30% or less. This ensures dimensional stability of the board 11, and maintains elastic force when the board 11 is compressed by the metal case C and the circuit board P.

Here, the compression set is defined as JISK6262:2013 is a value obtained under the condition of standing at 70 ℃ for 24 hours at a compression rate of 50%. Compression set means that the smaller the value, the more the original dimensions are maintained.

The plate 11 is preferably constructed from JISK6253-3: the hardness measured by a type a durometer of 2012 standard is A1 to a90. The plate 11 has a hardness of A1 or more, and can maintain conduction in a surface contact state by providing an appropriate repulsive force to the conductive member 10 by pressing the metal case C and the circuit board P. On the other hand, the hardness of the plate 11 is a90 or less. This makes the plate 11 sufficiently soft enough to be easily deformed by bending when receiving the pressing force generated by the metal case C and the circuit board P approaching each other. Therefore, compared with using a large amount of metal plate springs as an EMI countermeasure component, for example, the load when the conductive member 10 is pressed by the metal case C and the circuit board P can be sufficiently reduced. More specifically, it is preferable that the rubber-like elastic body of the base material has a hardness of A1 to a60 in the case of an insulating rubber and has a hardness of a10 to a90 in the case of a conductive rubber.

Here, the hardness of the type a durometer can be set as JISK6253-3:2012, measured at a temperature of 23 ℃.

In the conductive member 10, the conductive coating 12 having conductivity is used as a member independent of the plate body 11, and thus the plate body 11 does not need to have conductivity. Therefore, the conductive member 10 can be made of a sufficiently soft and easily deformable material to form the plate body 11.

However, the plate 11 may be made of conductive rubber containing a conductive filler in a rubber material. Thus, the conductive member 10 has a structure that not only the conductive coating 12 but also the connection plate 11 is conductive. Therefore, the plate 11 is made of conductive rubber, so that the resistance of the entire conductive member 10 can be reduced. A polymer material having conductivity such as a conductive rubber can be produced by mixing a conductive filler, which is a conductive filler imparting conductivity, into a base material such as a silicone rubber and dispersing the mixture. As the conductive filler, a powder of a conductive metal such as gold, silver, copper, nickel, iron, tin, or an alloy containing the same can be used in addition to carbon-based powder such as carbon black, carbon fiber, flake graphite powder, graphene, and carbon nanotube, and graphite-based powder. The conductive rubber composition is crosslinked and cured, and is molded into the shape of the plate body 11 having the bent portion 11 b.

The thickness of the material of the plate body 11, that is, the plate thickness is preferably 0.05mm to 0.5mm. By setting the thickness of the plate 11 to 0.05mm or more, the conductive member 10 can be kept in conduction in a surface contact state by providing an appropriate repulsive force against the pressing of the metal case C and the circuit board P. On the other hand, by making the thickness of the plate 11 0.5mm or less, the conductive member 10 can be flexibly deformed when receiving the pressing of the metal case C and the circuit board P.

The plate 11 preferably has a long side extending in the X direction intersecting the Z direction of 0.5mm to 5mm. By making the long side of the plate body 11 0.5mm or more, the plate body 11 has a sufficient length to be flexible and deformable, so that the conductive member 10 can be flexibly deformed when being pressed by the metal case C and the circuit board P. On the other hand, the conductive member 10 does not cause a particular problem in function because the long side of the plate body 11 is too long. Therefore, the upper limit of the length of the long side of the plate body 11 is not limited. However, by making the long side of the board 11 5mm or less, the conductive member 10 can be mounted to a particularly small electronic device.

As the conductive coating 12, a resin, a metal, or the like can be used. Among them, the conductive coating 12 is preferably made of a resin having stretchability, and is preferably made of a conductive polymer coating. Accordingly, the conductive coating 12 is not broken by bending or compression of the plate body 11, but can expand or contract, and therefore, the compressive load of the conductive member 10 is preferably reduced. The conductive coating 12 is a conductive film-like member in which conductive powder is contained as a filler in a polymer-based adhesive having elasticity, such as liquid silicone.

The conductive coating 12 and the plate 11 can be made of the same material. The "similar material" herein means that the polymer base material as the base material of the conductive coating film 12 is a material having the same bonding structure or functional group as the rubber-like elastic material as the material of the plate body 11. For example, when the plate 11 is made of silicone rubber, a silicone polymer having the same material as that of the plate 11 is used for the conductive coating 12.

In the conductive member 10, the conductive coating 12 covering the plate body 11 is made of the same material as the plate body 11, and thus the adhesion between the plate body 11 and the conductive coating 12 can be improved. Further, by forming the plate body 11 and the conductive coating 12 from the same material, the difference between the elastic modulus of the conductive coating 12 and the elastic modulus of the plate body 11 can be reduced. Therefore, the conductive coating 12 can be stretched and contracted following the deformed plate body 11.

The conductive powder can use the following conductive materials: a material composed of metals or alloys such as gold, silver, copper, nickel, iron, and tin; a metal or alloy material is coated on the surface by plating or the like; carbon/graphite materials such as carbon, graphite and graphene.

The conductive coating 12 may be formed by including flake-shaped metal particles in a polymer base material. In the sheet-like metal particles, even if the conductive coating 12 is deformed by elongation, the conductivity in the plane direction is easily maintained. Further, even if the filling amount of the flaky metal particles to the polymer base is small, the volume resistivity of the conductive coating 12 can be made low. Therefore, in the conductive member 10, the filling amount of the sheet-like metal particles with respect to the polymer base material can be reduced, and the difference between the elastic modulus of the conductive coating 12 and the elastic modulus of the plate 11 can be reduced. Further, in the sheet-like metal particles, the change in resistivity when the conductive coating 12 expands and contracts can be reduced. Therefore, a material having an aspect ratio larger than that of a sphere, such as a flake shape and a fiber shape, is preferably used for the conductive powder.

The conductive coating 12 tends to have a harder structure than the plate 11. Therefore, a material softer than the base material of the plate 11 may be used as the base material of the conductive coating 12. In this way, the difference in elastic modulus between the plate 11 and the conductive coating 12 can be reduced.

For example, the conductive coating 12 made of a conductive film containing silver is formed by the followingIn this method, a material containing liquid silicone and silver is dissolved in a diluting solvent to form a conductive paint, and the conductive paint is applied and then heated to volatilize the solvent, thereby curing the silicone film. The conductive coating 12 has a film thickness of 30 μm and a volume resistivity of 3.10 ^-3 Omega cm. The standard of the film thickness is a thickness capable of following the deformation of the plate body 11 made of a rubber-like elastic material, particularly, the deformation of the bent portion 11b when receiving the pressing load from the metal case C and the circuit board P. This makes it possible to bring either the metal case C or the circuit board P into surface contact with the contact surface portion 12 b.

The conductive paint is formed into a film shape on the outer surface of the board 11 by screen printing. In addition to screen printing, a method such as spray coating, dipping, brush coating, or the like can be used for coating the conductive coating material for forming the conductive coating film 12. The conductive coating material of the conductive coating film 12 may be applied directly in a state where the bent portion 11b of the plate body 11 has a three-dimensionally undulating shape, or may be applied after the bent portion 11b is stretched in a flattened manner.

In the conductive member 10, the aspect ratio of the flake-form metal particles is preferably 2 or more, and the average particle diameter is preferably 1 to 50. Mu.m. Thus, even if the conductive coating 12 is deformed by extension, the conductivity in the plane direction can be maintained. Further, the flake-like metal particles are preferably oriented in the plane direction of the surface of the conductive coating 12. This can improve the conductivity in the alignment direction.

The conductive coating 12 may cover at least a part of the surface of the board body 11 so as to conduct between the metal case C and the circuit board P. The plate 11 may have a region on its surface where the conductive coating 12, for example, a linear or lattice shape, is not formed. The plate 11 may be covered with the conductive coating 12 so as to cover only the top surface, the bottom surface, and at least one side surface of the plate 11. However, the conductive coating 12 is preferably provided entirely throughout each surface of the plate body 11. The conductive coating 12 is provided entirely over the respective surfaces of the board 11, so that the metal case C and the circuit board P can be electrically connected to each other with a high reliability and a low resistance.

The conductive member 10 can be formed by forming a plate body 11 having a plurality of lengths in the Y direction, and then forming a conductive coating 12 on the surface of the plate body 11, so that a continuous body formed by connecting a plurality of conductive members 10 in the Y direction is cut in the X direction. When the conductive member 10 is formed by this method, the exposed portion 11e exposed on the surface of the plate 11 is provided on the front and rear end surfaces of the conductive member, which are "cut surfaces".

However, the conductive coating 12 may cover the entire surface of the plate 11. This is obtained by cutting the continuous body of the plate body 11 in the X direction, and then forming the conductive coating 12 on the surface of each plate body 11.

The entire surface of the conductive member 10 formed by such a process is covered with the conductive coating 12. Thereby, the entire surface of the conductive member 10 becomes a current path. Therefore, the conductive member 10 can electrically connect the metal case C and the circuit board P with reliability and low resistance by using the surface thereof as a current path. On the other hand, according to this configuration, the plate body 11 can be made of an insulating material such as insulating rubber. In general, if an insulating material is made conductive, flexibility tends to be lowered. However, according to this structure, the plate body 11 does not need to be conductive. Therefore, according to this structure, since a material having higher flexibility can be used for the board 11, the conductive member 10 can be flexibly deformed when being pressed by the metal case C and the circuit board P.

Further, a metal foil having conductivity may be used for the conductive coating 12. Copper, aluminum, or the like can be used as the material of the metal foil. The conductive coating 12 in this case is integrated with the board 11 by, for example, attaching copper foil to the upper and lower surfaces of the board 11.

Second embodiment [ 4A in FIG. 4, 4B in FIG. 4 ]

Hereinafter, the conductive member 20 as the second embodiment will be mainly described with reference to the drawings, which are different from the above-described conductive member 10A in structure. The conductive member 20 can perform the same effect as the conductive member 10 described above unless otherwise stated.

As shown in fig. 4B, the conductive member 20 of the present embodiment includes a plate body 21 as a "base material", a conductive coating film 22, and an adhesive material layer 13a. The adhesive material layer 13a is the same in the conductive member 10A and the conductive member 20.

The conductive member 20 has the same structure as the conductive member 10A. However, the plate body 21 of the conductive member 20 extends not only rightward in the X-direction but also leftward from the plate body base 11 a. The conductive coating 22 covering the plate body 21 is formed not only rightward but also leftward from the plate body base 11 a.

The plate body 21 has a plate body base 11a, a bent portion 11b, and a bent portion 21b. The bent portion 21b has an inclined piece portion 21c and a top side cross piece portion 21d that extend in the direction opposite to the X direction of the bent portion 11 b. The curved portion 21b here has a shape symmetrical to the curved portion 11b about the plate body base 11 a. However, the curved portion 11b and the curved portion 21b may be formed in a laterally asymmetric shape.

The conductive coating 22 has a fixed holding portion 12a, a contact surface portion 12b, and a contact surface portion 22b. The contact surface portion 22b covers the inclined piece portion 21c and the top side cross piece portion 21d constituting the bent portion 21 b.

The conductive member 20 is configured to be in surface contact with the metal case C at 2 portions of the contact surface portion 12b and the contact surface portion 22b. Therefore, the conductive member 20 can secure a 2-fold cross-sectional area of the current path with respect to the metal case C, as compared with the conductive member 10A. Thus, according to the conductive member 20, the metal case C and the circuit board P can be conductively connected with a lower resistance.

Both the front end surface and the rear end surface of the plate body 21 in the Y direction are exposed portions 21e formed as "cut surfaces". The exposed portion 21e of the conductive member 20 of the present embodiment extends from the plate body base 11a in both directions in the X direction, as compared to the exposed portion 11e of the conductive member 10 of the first embodiment extending from the plate body base 11a in one direction in the X direction. In this way, the exposed portion 21e is different from the exposed portion 11e in shape, but is otherwise the same as the exposed portion 11 e.

Third embodiment [ 5A in FIG. 5, 5B in FIG. 5 ]

Hereinafter, the conductive member 30 as the third embodiment will be mainly described with reference to the drawings, which are different from the above-described conductive member 10B in structure. The conductive member 30 can exert the same effects as those of the conductive member 10 described above, unless otherwise specified.

As shown in fig. 5B, the conductive member 30 of the present embodiment includes a plate body 31 as a "base material", a conductive coating 32, and a metal foil layer 13B. In the present embodiment, the entire surface is covered with the conductive coating film 32, and the plate body 31 is not exposed. The metal foil layer 13B is the same in the conductive member 10B as in the conductive member 20.

The conductive member 30 has the same structure as the conductive member 10B. However, the plate body 31 of the conductive member 30 has a distal end portion 31f extending rightward from the bent portion 31 b. A distal end portion coating portion 32c that coats a distal end portion 31f on the right side of the contact surface portion 12b is formed on the conductive coating film 32 of the coating plate body 31. A substrate contact surface portion 32d serving as a "further contact surface portion" is formed on the bottom surface of the right end of the tip end portion covering portion 32c. The structure formed by the curved portion 31b and the distal end portion 31f here has a shape that is symmetrical about the contact surface portion 12 b. However, the structure formed by the bent portion 31b and the distal end portion 31f may be formed in a laterally asymmetric shape.

The contact surface portion 12b of the covered bent portion 31b is in contact with one of the metal case C and the circuit board P, and the substrate contact surface portion 32d of the covered distal end portion 31f is in contact with the other of the metal case C and the circuit board P.

According to the present embodiment, the conductive member 30 is pressed by the metal case C and the circuit board P in a state where the substrate contact surface portion 32d covering the distal end portion 31f extending from the bent portion 31b is in contact with the circuit board P. As a result, the pressing load of the metal case C and the circuit board P against the conductive member 30 is increased compared to a state in which the distal end portion 31f is free. Therefore, according to the present embodiment, the pressing load of the metal case C and the circuit board P against the conductive member 30 does not become too small, and the metal case C and the circuit board P can be kept appropriate.

Fourth embodiment [ 6A in FIG. 6, 6B in FIG. 6 ]

Hereinafter, the conductive member 40 as the fourth embodiment will be mainly described with reference to the drawings, which are different from the above-described conductive member 10 in structure. The conductive member 40 can exert the same effects as the conductive member 10 described above unless otherwise stated.

As shown in fig. 6B, the conductive member 40 of the present embodiment has a plate body 41 as a "base material" and a conductive coating 42. In the present embodiment, the entire surface is covered with the conductive coating 42, and the plate 41 is not exposed.

The plate body 41 of the conductive member 40 has a curved shape protruding upward. Therefore, the curved portion 41b is also curved. Further, a contact surface 42b having a curved shape is formed on the conductive coating 42 covering the curved portion 41 b.

The bending portion 41b does not have the bending angle θ1 as the bending portion 11b of the first embodiment. The curved portion 41b having a curved shape is curved and developed so that the curvature becomes smaller, that is, the curvature is close to a straight line when viewed from the front.

The conductive member 40 does not have a distinct corner at the bent portion 41 b. Therefore, in the conductive member 10, when the metal case C and the circuit board P are flattened by receiving a pressing force, the corners are not flattened and remain, and the flattening can be performed more smoothly. Further, since the conductive member 40 does not have a corner portion where stress is easily concentrated and is easily a starting point of breakage, fatigue breakage is less likely to occur even when the conductive member is repeatedly used, and durability can be improved.

Modification of the fourth embodiment [ 7A in FIG. 7, 7B in FIG. 7 ]

As with the conductive member 10, the conductive member 40A according to a modification may be provided with the adhesive material layer 13a as a "fixing portion" in the fixing and holding portion 12a as shown in fig. 7A. As another modified conductive member 40B, as shown in fig. 7B, the fixing and holding portion 12a may be formed by embedding a metal foil layer 13B as a "fixing portion" in advance.

Fifth embodiment [ 8A-8C in FIG. 8 ]

Hereinafter, the conductive member 50 as the fifth embodiment will be mainly described with reference to the drawings, which are different from the above-described conductive member 40 in structure. The conductive member 50 can exert the same effects as the conductive member 40 described above unless otherwise stated.

As shown in fig. 8A, the conductive member 50 of the present embodiment has a plate body 51 as a "base material" and a conductive coating film 52. In the present embodiment, the entire surface is covered with the conductive coating film 52, and the plate body 51 is not exposed.

The plate body 51 of the conductive member 50 is formed in a curved shape protruding downward, opposite to the plate body 41 of the conductive member 40. Therefore, the curved portion 51b is also a curved shape that is convex downward. Further, a contact surface portion 52b having a curved shape protruding downward is formed on the conductive coating film 52 covering the curved portion 51 b. Further, a fixed holding portion 52a is formed on the top surface of the conductive coating film 52 opposite to the fixed holding portion 12a of the conductive member 40.

Therefore, in the conductive member 50, when the metal case C is positioned above in the Z direction and the circuit board P is positioned below, the fixed holding portion 52a is connected to the metal case C in a conductive manner, and the contact surface portion 52b is connected to the circuit board P.

As with the conductive member 40, the conductive member 50A according to a modification may be provided with the adhesive material layer 13a as a "fixing portion" in the fixing and holding portion 52a as shown in fig. 8B. As another modified conductive member 50B, as shown in fig. 8C, the fixing and holding portion 52a may be formed by embedding a metal foil layer 13B as a "fixing portion" in advance.

Sixth embodiment [ 9A in FIG. 9 ]

Hereinafter, the conductive member 60 as the sixth embodiment will be mainly described with reference to the drawings, which are different from the conductive member 40B described above in terms of structure. The conductive member 60 can exert the same effects as the conductive member 30 described above unless otherwise stated.

As shown in fig. 9A, the conductive member 60 of the present embodiment has a plate body 61 as a "base material" and a conductive coating film 62. In the present embodiment, the entire surface is covered with the conductive coating film 62, and the plate body 61 is not exposed.

The bent portion 61B of the plate body 61 is formed in an upwardly convex bent shape like the conductive member 40B. However, the plate body 61 of the conductive member 60 has a distal end portion 61f extending rightward from the bent portion 61 b. A distal end portion coating portion 62c that coats the distal end portion 61f on the right side of the contact surface portion 62b is formed on the conductive coating film 62 of the coating plate body 61. A substrate contact surface portion 62d serving as a "further contact surface portion" is formed on the bottom surface of the right end of the tip end portion covering portion 62c. The conductive member 60 here has a shape symmetrical about the contact surface portion 62 b. However, the conductive member 60 may be formed in a laterally asymmetrical shape.

The contact surface portion 62b of the covered bent portion 61b is in contact with one of the metal case C and the circuit board P, and the substrate contact surface portion 62d of the covered distal end portion 61f is in contact with the other of the metal case C and the circuit board P.

Seventh embodiment [ 9B in FIG. 9 ]

Hereinafter, the conductive member 70 as the seventh embodiment will be mainly described with reference to the drawings, which are different from the above-described conductive member 60 in structure. The conductive member 70 can exert the same effects as those of the conductive member 20 described above, unless otherwise specified.

As shown in fig. 9B, the conductive member 70 of the present embodiment includes a plate body 71 and a conductive film 72 as "base materials" in addition to the plate body 61, the conductive film 62, and the metal foil layer 13B as "base materials". The plate body 61, the conductive film 62, and the metal foil layer 13b are the same as those of the conductive member 60 and the conductive member 70.

The conductive member 70 includes the same structure as the conductive member 60. However, in the conductive member 70, not only the plate body 61 but also the plate body 71 extends rightward in the X direction from the plate body base 61 a. In addition, in the conductive member 70, not only the conductive coating 62 covering the plate body 61 extending rightward from the plate body base 61a but also the conductive coating 72 covering the plate body 71 is formed leftward from the plate body base 61 a.

The plate body 71 has a curved portion 61b extending from the plate body base 61a, and a curved portion 71b and a distal end portion 71f extending in the X direction in a direction opposite to the distal end portion 61 f. The conductive member 70 here has a shape symmetrical to the left and right about the plate body base 61 a. However, the curved portion 71b and the distal end portion 71f may be formed in a shape that is asymmetric with respect to the curved portion 61b and the distal end portion 61 f.

The conductive coating 72 has a fixed holding portion 12a, a contact surface portion 62b, a contact surface portion 72b, a substrate contact surface portion 62d as "another contact surface portion", and a substrate contact surface portion 72d as "another contact surface portion".

The conductive member 70 is configured to be in surface contact with the metal case C at 2 portions of the contact surface portion 62b and the contact surface portion 72 b. Therefore, the conductive member 70 can secure a 2-fold cross-sectional area of the current path with respect to the metal case C, as compared with the conductive member 60. Similarly, the conductive member 70 is configured to be in surface contact with the circuit board P at 2 portions of the substrate contact surface portion 62d and the substrate contact surface portion 72d. Therefore, the conductive member 70 can secure a cross-sectional area of the current path 2 times larger than that of the conductive member 60 between the conductive member 70 and the circuit board P at the free end side of the conductive member 70 which is not mounted on the circuit board P, like the metal foil layer 13 b. Thus, according to the conductive member 70, the metal case C and the circuit board P can be conductively connected with a lower resistance.

Modification of the seventh embodiment [ 12A in FIG. 12 ]

As with the conductive member 10, the conductive member 70A as a modification example may have an exposed portion 61e and an exposed portion 71e formed as "cut surfaces" on both the front end surface and the rear end surface of the plate body 61 and the plate body 71 in the Y direction, as shown in 12A in fig. 12. Since the conductive member 70A has the exposed

portions

61e and 71e, the pressing load when compressed by the metal case C and the circuit board P can be reduced as in the conductive member 10 and the like.

Eighth embodiment [ FIG. 10 ]

Hereinafter, the conductive member 80 as the eighth embodiment will be mainly described with reference to the drawings, which are different from the above-described conductive member 60 in structure. The conductive member 80 can exert the same effects as the conductive member 60 described above unless otherwise stated.

As shown in fig. 10, the conductive member 80 of the present embodiment includes a plate 81 as a "base material" and a conductive coating 82. In the present embodiment, the entire surface is covered with the conductive coating film 82, and the plate 81 is not exposed.

The bent portion 81b of the plate 81 has an upwardly convex bent shape like the conductive member 60. However, in the bent portion 81b of the conductive member 80, the upper end in the Z direction is flat. Therefore, the contact surface 82b of the wrapping bent portion 11b is also flat. Thus, according to the conductive member 80, the contact surface 82b having a wide area can be connected to the metal case C in a conductive manner from the initial state in which the contact surface receives the pressing from the metal case C and the circuit board P.

Ninth embodiment [ 11A in FIG. 11, 11B in FIG. 11 ]

Hereinafter, a portion of the conductive member 90, which is the ninth embodiment, different from the structure of the conductive member 10 described above will be mainly described with reference to the drawings. The conductive member 90 can exert the same effects as those of the conductive member 10 described above, unless otherwise specified.

As shown by 11A in fig. 11 and 11B in fig. 11, the conductive member 90 is formed in a cap shape in which the center portion of the thin circular plate is deep drawn. The conductive member 90 includes a plate 91 and a conductive coating 92. The plate 91 has a curved portion 91b and a cap edge portion 91g. The curved portion 91b is formed such that a radially central portion of the annular rim portion 91g protrudes upward in the Z direction in a dome shape. A peak-shaped hollow 94 is formed below the curved portion 91 b. On the bottom surfaces of both sides of the cap edge 91g in the radial direction, ventilation grooves 95 are formed so as to be recessed upward, which communicate the hollow portion 94 with the outside in the radial direction of the cap edge 91g. The upper and lower surfaces of the plate 91 are covered with conductive coating films 92. A fixed holding portion 92a is formed on the bottom surface of the cap edge 91g, and a contact surface portion 92b is formed on the top surface of the curved portion 91 b.

In the conductive member 90, as in the other embodiments, the fixed holding portion 92a is connected to the circuit board P in a conductive manner, and the contact surface portion 92b is connected to the metal case C in a conductive manner. The bending portion 91b is pressed by the metal case C, and the bending portion 91b is deformed so as to be flexibly flattened while maintaining a state in which the contact surface portion 92b is in contact with the surface of the metal case C. During planarization, air occupying the hollow portion 94 is discharged to the outside through the ventilation grooves 95. The conductive member 90 is circular in plan view, and therefore can be connected to the circuit board P in the XY directions in a conductive manner.

Tenth embodiment [ 12B in FIG. 12 ]

Hereinafter, the conductive member 100 according to the tenth embodiment will be mainly described with reference to the drawings, which are different from the conductive member 70A described above in terms of structure. That is, the conductive member 100 can exert the same effects as those of the conductive member 70A described above unless otherwise specified.

As shown in fig. 12B, the conductive member 100 of the present embodiment includes a stretchable conductive protective film 66 and a stretchable conductive protective film 76 in addition to the plate body 61, the conductive film 62, the metal foil layer 13B, the plate body 71, and the conductive film 72, which are "base materials". The conductive member 100 is configured such that the top surfaces of the

conductive films

62 and 72 are covered with the stretchable conductive

protective films

66 and 76, respectively. The plate body 61, the metal foil layer 13b, and the plate body 71 are the same as those of the conductive member 100 in the conductive member 70A.

The

conductive films

62 and 72 have the same shape in the conductive member 70A and the conductive member 100. However, in the conductive member 100 in which the top surfaces of the

conductive films

62, 72 are covered with the stretchable conductive

protective films

66, 76, respectively, the

contact surface portions

62b, 72b, which are the constituent elements of the conductive member 70A, are not in contact with the metal case C. Instead, the regions corresponding to the

contact portions

62b, 72b in the conductive member 70A function as the

bent portions

62h, 72h of the conductive member 100 laminated on the bent portion 61b of the plate body 61 and the bent portion 71b of the plate body 71, respectively.

The

conductive coating films

62 and 72 can be formed by including conductive powder, for example, flake-like metal particles, in a polymer base material, similarly to the conductive coating film 12 and the like described above. As the conductive powder of the

conductive coating films

62 and 72, a conductive material having high conductivity, such as a material made of a metal or alloy such as gold, silver, copper, nickel, iron, tin, or the like, or a material coated with a metal or alloy on the surface thereof by plating or the like, is preferably used.

The stretchable conductive

protective films

66 and 76 have a film shape that is extremely thin in the Z direction compared to the XY direction, and are arranged so as to have a wave shape when viewed from the front. The stretchable conductive

protective films

66 and 76 are further laminated on the surfaces of the

conductive films

62 and 72, and are configured to be stretchable and deformable together with the

conductive films

62 and 72 according to the deformation of the

plate bodies

61 and 71. That is, the conductive member 100 is a conductive film formed by stacking the

conductive films

62 and 72 and the stretchable conductive

protective films

66 and 76, respectively. The stretchable conductive

protective films

66, 76 have

contact surfaces

66b, 76b, respectively. The

contact portions

66b and 76b are formed in regions covering the

bent portions

62h and 72h, respectively. The

contact surface portions

66b, 76b function as the

contact surface portions

62b, 72b of the conductive member 70A, for example.

In the conductive member 100, the

conductive films

62 and 72 are covered with the stretchable conductive

protective films

66 and 76, so that the

conductive films

62 and 72 can be protected from corrosion, oxidation, vulcanization, and the like, and migration (migration) without being exposed. Since the stretchable conductive

protective films

66 and 76 are configured to be stretchable and deformable together with the

conductive films

62 and 72 according to the deformation of the

plate bodies

61 and 71, the

plate bodies

61 and 71 can be flexibly deformed as in the case where the

conductive films

62 and 72 are not covered with the stretchable conductive

protective films

66 and 76.

In this way, the conductive member 100 is configured to have the

conductive films

62 and 72 and the stretchable conductive

protective films

66 and 76 having different properties (e.g., conductivity and flexibility). Therefore, when the metal case C and the circuit board P are compressed, the conductive member 100 electrically connected to each other at a low load can prevent aging due to corrosion or the like while maintaining the conductivity and flexibility (low compression load) of the conductive coating films 62 and 72 (age deterioration).

The flexible conductive

protective films

66 and 76 are constituted by, for example, allotropes of conductive carbon contained in a polymer base material. In the conductive member 100 in this case, the outermost layer that is exposed to the outside of the conductive member 100 and has the highest possibility of aging such as corrosion is composed of an allotrope of carbon excellent in corrosion resistance and the like.

Since the

conductive films

62 and 72 are covered with the stretchable conductive

protective films

66 and 76 containing the allotrope of carbon having conductivity in the polymer base material, the

conductive films

62 and 72 can be protected from corrosion or the like while maintaining the conductivity of the

conductive films

62 and 72 and the flexibility of the

plate bodies

61 and 71. Further, since the stretchable conductive

protective films

66 and 76 are the outermost layers of the conductive member 100, the conductive member 100 having excellent design can be formed in which the surface gloss of the

conductive coating films

62 and 72 is reduced (the metallic tone is removed) and black with high uniformity is exhibited. Further, since the carbon allotrope content is large on the surfaces of the stretchable conductive

protective films

66 and 76, the heat resistance and abrasion resistance of the surface of the conductive member 100 can be improved.

In the conductive member 100, the

conductive films

62 and 72 formed to have higher flexibility than the stretchable conductive

protective films

66 and 76 are adjacent to the

plate bodies

61 and 71, respectively. Therefore, peeling, particularly between layers, can be prevented when the

conductive coating films

62, 72 and the stretchable conductive

protective films

66, 76 are stretched and deformed together with the deformation of the

plate bodies

61, 71.

Further, the

conductive coating films

62 and 72 and the stretchable conductive

protective films

66 and 76 of the conductive member 100 have a multilayer structure, respectively, and the conductive member 100 has a structure in which allotropes of carbon are accumulated in the stretchable conductive

protective films

66 and 76. As a result, the conductive member 100 can ensure a large volume occupied by the

conductive films

62 and 72 having high flexibility and conductivity. In the conductive member 100, the

conductive films

62 and 72 and the stretchable conductive

protective films

66 and 76 have a multilayer structure, and the stretchable conductive

protective films

66 and 76 have a structure containing no metal particles. This prevents the metal particles from being exposed, thereby suppressing oxidation and migration of the

conductive coating films

62 and 72, and suppressing an increase in resistance value with time.

The stretchable conductive

protective films

66 and 76 preferably have a film thickness of 5 to 75 μm, and more preferably have a film thickness of 5 to 50 μm. Since the stretchable conductive

protective films

66 and 76 have appropriate film thicknesses, the flexible conductive

protective films

66 and 76 can have elasticity, flexibility, and conductivity to such an extent that flattening is possible, and the surfaces of the conductive members 100 can be protected from corrosion or the like of the

conductive coating films

62 and 72. Further, by providing the stretchable conductive

protective films

66 and 76 with an appropriate film thickness, the

conductive films

62 and 72 can be prevented from being transmitted, and a high design property can be imparted to the conductive member 100.

Examples of the polymer base material that can be used as the base material of the stretchable conductive

protective films

66 and 76 include polymers having high flexibility such as silicone, polyurethane, acrylic, and olefin. The stretchable conductive

protective films

66 and 76 can be made of the same material as the

conductive films

62 and 72. In this case, for example, when the

conductive films

62 and 72 are silicon polymers, silicon polymers are also used as the base polymers of the stretchable conductive

protective films

66 and 76.

If the stretchable conductive

protective films

66 and 76 laminated on the

conductive films

62 and 72 are made of the same material as the

conductive films

62 and 72, the adhesiveness between the

conductive films

62 and 72 and the stretchable conductive

protective films

66 and 76 can be improved. Further, by forming the

conductive films

62 and 72 and the stretchable conductive

protective films

66 and 76 from the same type of material, the difference between the elastic modulus of the

conductive films

62 and 72 and the elastic modulus of the stretchable conductive

protective films

66 and 76 can be reduced. Accordingly, the stretchable conductive

protective films

66 and 76 can be stretched together with the

conductive films

62 and 72 stretched following the

deformed plate bodies

61 and 71.

The stretchable conductive

protective films

66 and 76 have a hard structure as compared with the

conductive films

62 and 72. Therefore, the base materials of the stretchable conductive

protective films

66 and 76 may be made of a material softer than the base materials of the

conductive films

62 and 72, that is, having a greater penetration degree. By doing so, the difference between the elastic modulus of the

conductive coating films

62, 72 and the elastic modulus of the stretchable conductive

protective films

66, 76 can be reduced.

The stretchable conductive

protective films

66 and 76 are formed by containing a conductive filler in a polymer base material. As the conductive filler of the stretchable conductive

protective films

66 and 76, for example, carbon, graphite, graphene, or other carbon/graphite conductive material, that is, an allotrope of carbon having conductivity, can be used in addition to metals. The conductive filler may be a material other than a spherical shape, such as a flat shape, a flake shape, a needle shape, or a fiber shape.

In the stretchable conductive

protective films

66 and 76, for example, a conductive film-like member in which 60 parts by weight of carbon black and 20 parts by weight of multilayer graphene are blended with 100 parts by weight of a silicone polymer of a two-liquid curable liquid silicone rubber is used. As the carbon black, for example, mitsubishi conductive carbon black #3030B of mitsubishi chemical corporation having an arithmetic average particle diameter of 55nm can be used. As the multi-layered graphene, for example, high-purity graphene powder iGurafen- αs of itach, a product of the company, particle diameter of 10 μm can be used.

In this way, the stretchable conductive

protective films

66 and 76 are preferably formed to contain graphene. Further, as graphene, flake-shaped particles are preferably used. By orienting the scale-shaped graphene in the plane direction of the surfaces of the stretchable conductive

protective films

66 and 76, the conductivity in the orientation direction can be improved. Similarly, the stretchable conductive

protective films

66 and 76 are preferably composed of conductive carbon black. The carbon black is interposed between the periphery of the graphene and the graphene, so that conductivity can be improved in both the surface direction and the thickness direction of the surfaces of the stretchable conductive

protective films

66 and 76, and as a result, conductivity of the stretchable conductive

protective films

66 and 76 can be improved as a whole.

After the conductive film-like member containing silicon polymer, carbon black, and graphene is dissolved in a diluting solvent, the material is applied and heated, the solvent volatilizes, and the silicone film is cured, thereby forming a conductive film containing carbon/carbon fiber/graphite or the like. The stretchable conductive

protective films

66, 76 are formed to have a film thickness of 25 μm and a volume resistivity of 5.10, for example ^-1 Omega cm. The stretchable conductive

protective films

66 and 76 are formed preferably because their resistance values are often higher than those of the

conductive films

62 and 72 The film thickness is smaller than that of the

conductive coating films

62, 72. The conductive film-like members are discharged to the outer surfaces of the conductive films 62 and 72 (portions corresponding to the outer surfaces of the stretchable conductive film 33 of the conductive member 30), and are formed into a film shape by scraping with a doctor blade, for example. The method of applying the stretchable conductive

protective films

66, 76 is not limited to the discharge of the ink-like conductive composition and the doctor blade method, and may be dipping, transfer, or the like.

In the present embodiment, the stretchable conductive

protective films

66 and 76 are provided so as to cover only the top surfaces of the

conductive films

62 and 72, respectively. However, the stretchable conductive

protective films

66 and 76 may be provided so as to cover the bottom surfaces of the

conductive films

62 and 72, respectively. This also protects the bottom surfaces of the

conductive coatings

62 and 72 from corrosion and the like. At this time, for example, in the case where the conductive member 60 has the structure of the substrate contact surface portion 62d as "another contact surface portion", the stretchable conductive protective film 66 covering the substrate contact surface portion 62d functions similarly to the substrate contact surface portion 62d of the conductive member 60. Further, when the stretchable conductive

protective films

66 and 76 are provided so as to cover the top surfaces of the

conductive films

62 and 72, respectively, a pair of side surfaces of the

conductive films

62 and 72 positioned at the left and right ends in the X direction of 12B in fig. 12 may be formed.

The stretchable conductive

protective films

66 and 76 of the present embodiment can be applied to the other embodiments and modifications described above. In this case, for example, in the case of the conductive member 30 or the like without the exposed portion 11e, the stretchable conductive

protective films

66 and 76 may be formed so as to cover a pair of side surfaces of the front and rear ends in the Y direction.

The "conductive member" disclosed in the present application can freely combine the structures shown in the embodiments and the modifications within a range where no contradiction occurs. For example, in any "conductive member", the exposed portion 11e may be formed, or the exposed portion 11e may not be formed. The exposed portion 11e is not limited to 2 portions of the front end face and the rear end face in the Y direction, and may be 1 to 4 portions of 4 faces including the left end face and the right end face in the X direction. Further, in any of the "conductive members", the adhesive material layer 13a as the "attachment portion" may be attached to the fixing and holding portion 12a, or the metal foil layer 13b as the "attachment portion" may be embedded in advance.

Examples

Hereinafter, examples are shown to explain the conductive member 10 and the like of the present embodiment in more detail. However, the present embodiment is not limited to the following examples.

Example 1

In example 1, a conductive member 40A having a shape shown in 7A in fig. 7 was produced. The plate 41 is made of conductive silicone rubber. The conductive silicone rubber is press-molded to form a plate body 41 having a curved surface shape protruding upward when viewed from the front as shown in fig. 7A. The conductive coating 42 is a conductive paint of silver ink. By screen printing silver ink on the upper and lower surfaces of the formed plate 41, conductive coating films 42 are formed on the upper and lower surfaces of the conductive member 40A. The continuous body of the conductive member 40A thus formed was cut to a width of 1mm in the longitudinal direction, thereby obtaining a conductive member 40A.

In example 1, the conductive member 40A having the "exposed portion" of the plate body 41 is formed without the conductive coating 42 on the cut surface. As the adhesive material layer 13a of the "attachment portion", a double-sided tape is used. The double-sided tape is provided on the lower surface of the fixed holding portion 12 a. The conductive member 40A has a curved portion 41b having a thickness of 0.02mm, a height H1 from the mounting surface to the top of 0.7mm, and a length in the longitudinal direction of 2mm in plan view.

The conductive member 40A of example 1 formed in this manner was pressed from the top and bottom in the Z direction, and the resistance [ Ω ] between the fixed holding portion 12a and the contact surface portion 42b and the force [ N ] applied to the inside of the conductive member 40A were measured.

When the contact point approaching from above comes into contact with the contact surface portion 42b, the resistance value rapidly decreases to a low level. Further, the resistance value gradually decreases until the conductive member 40A is pressed, deformed, and flattened. On the other hand, the force applied to the inside of the conductive member 40A hardly changes before flattening.

Thus, in example 1, it can be seen that the pressing load of the metal case C and the circuit board P to the conductive member 40A and the stress (repulsive force) thereof are very small. Further, in example 1, it can be seen that the contact resistance value when the contact surface portion 42b starts to make conductive contact with at least one of the metal case C and the circuit board P is rapidly reduced.

Example 2

In example 2, a conductive member 40A having a shape shown in fig. 7A was also produced in the same manner as in example 1. In embodiment 2, the materials of the respective members constituting the conductive member 40A and the forming method thereof are the same as those of embodiment 1. However, in example 2, the order of the steps of the method for producing the conductive coating 42 is different from that of example 1.

That is, when viewed from the front as shown in fig. 7A, the continuous body of the plate body 41, which is press-formed into a curved surface shape protruding upward, is cut to a width of 1mm so as to extend in the longitudinal direction. Thereafter, silver ink is screen-printed on the entire surface of each cut plate 41, thereby forming a conductive coating 42 on the entire surface of the conductive member 40A. Thus, in example 2, the conductive member 40A having the conductive coating 42 on any surface was formed.

The electric resistance [ Ω ] between the fixed holding portion 12a and the contact surface portion 42b and the force [ N ] applied to the inside of the conductive member 40A were also measured for the conductive member 40A of example 2 by the same method.

When the contact point approaching from above comes into contact with the contact surface portion 42b, the resistance value rapidly decreases to an extremely low level. Therefore, the resistance value is maintained at an extremely low level until the conductive member 40A is pressed, deformed, and flattened. On the other hand, the force applied to the inside of the conductive member 40A is increased to be flattened, but maintained at a low level, as compared with embodiment 1.

Thus, in example 2, it can be seen that the pressing load of the metal case C and the circuit substrate P to the conductive member 40A and the stress (repulsive force) thereof are reduced. Further, in example 2, it can be seen that the contact resistance value at the time when the contact surface portion 42b starts to make conductive contact with at least one of the metal case C and the circuit board P is rapidly made extremely small.

As a result of the above example, it can be seen that in the conductive member 10 and the like of the present embodiment, the contact resistance value at the time of starting the conductive contact with at least one of the metal case C and the circuit board P can be quickly reduced. Further, it is shown that the pressing load and the stress (repulsive force) of the metal case C and the circuit board P to the conductive member 10 and the like can be reduced.

Description of the reference numerals

10: a conductive member (first embodiment),

10A: a conductive member (modification of the first embodiment),

10B: conductive member (another modification of the first embodiment),

11: a plate body (base material),

11a: a base part of the plate body,

11b: a bending part,

11c: an inclined piece part,

11d: a top side cross piece part,

11e: an exposed part,

11h: a connecting hole,

12: a conductive coating film,

12a: a fixed holding part,

12b: a contact surface portion,

12e: a filling part,

13a: an adhesive material layer (fixing part),

13b: a metal foil layer (fixing part),

20: a conductive member (second embodiment),

21: a plate body (base material),

21b: a bending part,

21c: an inclined piece part,

21d: a top side cross piece part,

22: a conductive coating film,

22b: a contact surface portion,

30: a conductive member (third embodiment),

31: a plate body (base material),

31b: a bending part,

31f: a front end part,

32: a conductive coating film,

32c: a front end coating part,

32d: a substrate contact surface portion (another contact surface portion),

40: a conductive member (fourth embodiment),

40A: a conductive member (modification of the fourth embodiment),

40B: conductive member (another modification of the fourth embodiment),

41: a plate body (base material),

41b: a bending part,

42: a conductive coating film,

42b: a contact surface portion,

50: a conductive member (fifth embodiment),

50A: a conductive member (modification of the fifth embodiment),

50B: conductive member (another modification of the fifth embodiment),

51: a plate body (base material),

51b: a bending part,

52: a conductive coating film,

52a: a fixed holding part,

52b: a contact surface portion,

60: a conductive member (sixth embodiment),

61: a plate body (base material),

61a: a base part of the plate body,

61b: a bending part,

61e: an exposed part,

61f: a front end part,

62: a conductive coating film,

62b: a contact surface portion,

62c: a front end coating part,

62d: a substrate contact surface portion (another contact surface portion),

62h: a bending part,

66: a flexible conductive protective film,

66b: a contact surface portion,

70: a conductive member (seventh embodiment),

70A: a conductive member (modification of the seventh embodiment),

71: a plate body (base material),

71b: a bending part,

71e: an exposed part,

71f: a front end part,

72: a conductive coating film,

72b: a contact surface part (another contact surface part),

72d: a substrate contact surface portion,

72h: a bending part,

76: a flexible conductive protective film,

76b: a contact surface portion,

80: a conductive member (eighth embodiment),

81: a plate body (base material),

81b: a bending part,

82: a conductive coating film,

82b: a contact surface portion,

90: a conductive member (ninth embodiment),

91: a plate body (base material),

91b: a bending part,

91g: a cap edge part,

92: a conductive coating film,

92a: a fixed holding part,

92b: a contact surface portion,

94: a hollow part,

95: a ventilation groove,

100: a conductive member (tenth embodiment),

C: a metal shell,

H1: height of the conductive member in the initial state,

H2: a height of the conductive member in a flattened state,

L1: length of the conductive member in the initial state,

L2: length of the conductive member in the flattened state,

P: a circuit board,

X: left-right direction (long side direction) (second direction),

Y: front-back direction (short side direction),

Z: a height direction, a vertical direction (first direction),

θ1: bending angle in initial state,

θ2: bending angle in a flattened state.

Claims

1. A conductive member that conductively connects a first connection object and a second connection object, the conductive member comprising:

the base material is made of rubber-like elastomer

A conductive coating film provided on a surface of the base material including a top surface, a bottom surface, and at least one side surface, the conductive coating film being capable of being deformed in a telescoping manner together with deformation of the base material;

the base material has a curved portion protruding in a first direction in which the first object to be connected and the second object to be connected approach each other and separate from each other,

the conductive coating has a contact surface portion that is brought into contact with at least one of the first object to be connected and the second object to be connected in a surface contact state by covering the curved portion,

the conductive member is capable of deforming the bending portion so as to be unfolded and bent while maintaining a state in which the contact surface portion is in contact with at least one of the surfaces of the first connection object and the second connection object when receiving a pressing force generated by the first connection object and the second connection object approaching each other,

the conductive member has exposed portions not covered with the conductive coating film at 1 to 4 parts of 4 surfaces including two end surfaces in a long side direction and two end surfaces in a short side direction,

The base material is a plate body, and is located between the first connection object and the second connection object, which are disposed in opposition to each other, and the bending portion is capable of being deformed so as to be bent in a nearly flat manner when receiving a pressing force generated by the first connection object and the second connection object approaching each other.

2. A conductive member that conductively connects a first connection object and a second connection object, the conductive member comprising:

the base material is made of rubber-like elastomer

the base material has a front end portion elongated from the curved portion,

the contact surface portion covering the curved portion is in contact with one of the first and second objects to be connected,

the other contact surface portion covering the distal end portion is in contact with the other of the first object to be connected and the second object to be connected.

3. A conductive member that conductively connects a first connection object and a second connection object, the conductive member comprising:

the base material is composed of a rubber-like elastic body,

a conductive coating film provided in a coating manner on a surface of the base material including a top surface, a bottom surface, and at least one side surface, capable of being deformed in a telescoping manner together with the deformation of the base material, and

a fixing and holding part provided with a fixing and attaching part formed by an adhesive material layer or a metal foil layer;

the base material is elongated from the fixed holding portion in a cantilever shape in a second direction intersecting the first direction.

4. The conductive member according to any one of claim 1 to 3, wherein,

the base material is a conductive rubber containing a conductive filler in a rubber material.

5. The conductive member according to any one of claim 1 to 3, wherein,

The conductive coating covers the entire surface of the substrate.

6. The conductive member according to any one of claim 1 to 3, wherein,

the hardness of the base material is A1 to A90 as measured by a type A durometer in JIS K6253.

7. The conductive member according to claim 1 or 2, wherein,

the adhesive tape further comprises a fixing and holding part provided with a fixing and attaching part formed by an adhesive material layer or a metal foil layer.

8. The conductive member of claim 7,

9. The conductive member according to any one of claim 1 to 3, wherein,

the thickness of the material of the base material is 0.05 mm-0.5 mm.

10. The conductive member according to any one of claim 1 to 3, wherein,

the base material has a long side extending in a second direction intersecting the first direction, and the long side is 0.5mm to 5mm.

11. The conductive member according to any one of claim 1 to 3, wherein,

the conductive member further includes a stretchable conductive protective film covering the contact surface portion, the stretchable conductive protective film being stretchable and deformable together with deformation of the base material and deformation of the conductive coating film, and being electrically connected in a surface contact state with at least one of the first connection object and the second connection object,

The stretchable conductive protective film can flex and deform the bending portion so as to be unfolded and bent while maintaining a state of contact with the surface of at least one of the first object to be connected and the second object to be connected.

12. The conductive member of claim 11,

the flexible conductive protective film is formed by including an allotrope of conductive carbon in a polymer base material.

13. The conductive member of claim 11,

the stretchable conductive protective film has a film thickness of 5 to 50 μm.

14. The conductive member of claim 11,

the flexible conductive protective film contains graphene, and the graphene is oriented along the surface direction of the surface of the flexible conductive protective film.