CN114928958A - PCB and PCBA plane precision press-fitting method - Google Patents
PCB and PCBA plane precision press-fitting method Download PDFInfo
- Publication number
- CN114928958A CN114928958A CN202210729460.2A CN202210729460A CN114928958A CN 114928958 A CN114928958 A CN 114928958A CN 202210729460 A CN202210729460 A CN 202210729460A CN 114928958 A CN114928958 A CN 114928958A
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- CN
- China
- Prior art keywords
- pcb
- pcba
- plane
- tin
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 46
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 8
- 239000010959 steel Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 5
- 230000009191 jumping Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 150000003071 polychlorinated biphenyls Chemical group 0.000 claims 4
- 239000011324 bead Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention relates to the technical field of PCB or PCBA assembly, in particular to a PCB and PCBA plane precision press-fitting method; the method comprises the following steps: mass-producing machined parts with specified precision for determining a plane position; designing and manufacturing surface pads at the appointed position of the PCB or the PCBA, and controlling the tin amount on each surface pad by adopting a method of steel mesh and tin paste to ensure that the tin amount is equal; heating and melting the solder paste to enable the solder paste to be attached to the surface bonding pad; placing the PCB or the PCBA into a groove which is preset in a machined part to prepare a combined workpiece; putting the combined workpiece into a pressure tool, and pressing at a preset pressure value and speed; and taking out the combined workpiece, and obtaining an assembly workpiece of the PCB or the PCBA which meets the plane tolerance and the run-out by depending on the processing precision of the circuit board, improving the press mounting method of the PCB or the PCBA on the basis of the prior art, and enabling the surface of the circuit board to be flush with the surface of the precision workpiece by arranging tin beads on the PCB or the PCBA.
Description
Technical Field
The invention relates to the technical field of PCB or PCBA assembly, in particular to a PCB and PCBA plane precision press-fitting method.
Background
When actual design and application requirements are met, the PCB or the PCBA needs to be assembled to a specified plane, the target plane of the PCB or the PCBA assembly has positioning and plane jumping precision, and the precision requirements are within +/-5 micrometers.
However, in the high-precision assembling process, although the conventional common micrometer measurement assembling method has high assembling precision, the efficiency is low, the labor and material costs for assembling are high, and the method is difficult to be applied to actual production and assembly line operation.
However, there is no method for realizing rapid installation of a precise plane, so that a method having positioning and plane jumping precision, lower assembly material cost, assembly labor cost and higher assembly speed is needed.
Disclosure of Invention
The invention aims to provide a planar precision press-fitting method for PCBs (printed circuit boards) and PCBAs (printed circuit boards assemblies), which aims to solve the problems that in the prior art, the assembly cost of PCBs or PCBAs is high, and the actual production and assembly line operation are not facilitated.
In order to achieve the aim, the invention provides a planar precision press mounting method for PCBs and PCBAs, which comprises the following steps:
mass-producing machined parts with specified precision for determining a plane position;
designing and manufacturing surface bonding pads at the appointed positions of the PCB or the PCBA, and controlling the tin amount on each surface bonding pad by adopting a method of steel mesh and tin paste to ensure that the tin amount is equal;
heating and melting the solder paste to enable the solder paste to be attached to the surface bonding pad;
placing the PCB or the PCBA into a groove which is preset in the machined part, and smearing an adhesive for fixing between the PCB and the groove or between the PCBA and the groove to prepare a combined workpiece;
putting the combined workpiece into a pressure tool, and pressing at a preset pressure value and speed;
the combined workpiece is taken out, and an assembly workpiece of the PCB or the PCBA which meets the plane tolerance and the jumping can be obtained.
The method comprises the following steps of:
designing a plurality of sites on a PCB or PCBA, and manufacturing surface pads;
coating equal tin paste or placing equal tin wires on each point on the surface bonding pad;
and (3) putting the surface bonding pad coated with the tin paste or placed with the tin wire into a hot table or a heating box until the tin is completely melted and attached to the surface bonding pad to form a plurality of tin balls.
Wherein the machined part is provided with a precision plane and a bottom plane, wherein the plane jump and the tolerance of the precision plane and the bottom plane are within +/-5 mu m.
The method comprises the following steps of putting a combined workpiece into a pressure tool, and pressing the combined workpiece at a preset pressure value and speed, wherein the steps comprise:
placing the combined workpiece on a lower plate of the pressure tool, and driving an upper plate of the pressure tool, which is arranged opposite to the lower plate of the pressure tool, to be pressed downwards at a set speed and pressure by using a power device, wherein a fine machining gauge block is arranged on the lower plate of the pressure tool;
and pressing the PCB or the PCBA to be flush with the bottom plane under the action of the upper plate of the pressure tool.
The invention relates to a PCB and PCBA plane precision press-fitting method, which is improved based on the prior art, and the press-fitting method of the PCB or the PCBA is improved, the surface of a circuit board is flush with the surface of a precision workpiece by arranging tin beads on the PCB or the PCBA and matching with a press-fitting machine workpiece of a pressure tool and a combined workpiece formed by the PCB or the PCBA, so that the tolerance and the plane jump of the PCB or the PCBA are effectively improved to be within +/-5 mu m.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a surface bonding pad and a PCB or PCBA coating solder paste of the planar precision press-fitting method for the PCB or PCBA.
FIG. 2 is a schematic diagram of a combined workpiece of the planar precision press-fitting method for PCBA and PCBA provided by the invention.
Fig. 3 is a schematic diagram of pressing of a pressure-bearing tool of a combined workpiece in the planar precision press-fitting method for PCBs and PCBA according to the present invention.
Fig. 4 is a schematic step diagram of a planar precision press-fitting method for PCBs and PCBA provided by the invention.
FIG. 5 is a schematic diagram of a step of feeding by using a steel mesh and solder paste in the planar precision press-fitting method for PCBs and PCBAs provided by the present invention.
Fig. 6 is a schematic diagram of a pressing step performed by placing a combined workpiece into a pressure tool at a preset pressure value and speed according to the planar precision press-fitting method for PCBs and PCBAs provided by the present invention.
1-PCB or PCBA, 2-tin bead, 3-surface welding pad, 4-machining piece, 5-precision plane, 6-bottom plane, 7-upper plate of pressure tool, 8-lower plate of pressure tool, and 9-fine machining gauge block.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
Referring to fig. 1 to 6, fig. 1 is a schematic diagram of a surface pad of a PCB and PCBA plane precision press-fitting method and a PCB or PCBA coating solder paste, fig. 2 is a schematic diagram of a combined workpiece of the PCB and PCBA plane precision press-fitting method, fig. 3 is a schematic diagram of a press-fitting of the combined workpiece of the PCB and PCBA plane precision press-fitting method by a pressure tool, fig. 4 is a schematic diagram of steps of the PCB and PCBA plane precision press-fitting method, fig. 5 is a schematic diagram of steps of a press-fitting method of the PCB and PCBA plane precision press-fitting method which adopts a steel mesh and solder paste to cooperate and feed, and fig. 6 is a schematic diagram of a press-fitting step of the combined workpiece by the PCB and PCBA plane precision press-fitting method which is put into the pressure tool and performed at a preset pressure value and speed.
The invention provides a PCB and PCBA plane precision press-fitting method, which comprises the following steps:
s101: mass-producing machined parts 4 with prescribed accuracy for determining a plane position;
s102: designing and manufacturing surface pads 3 at the designated positions of a PCB or PCBA1, and controlling the amount of tin on each surface pad 3 by adopting a method of steel mesh and tin paste to ensure that the amount of tin is equal;
s103: heating and melting the solder paste to make the solder paste adhere to the surface bonding pad 3;
s104: placing the PCB or PCBA1 into a preset groove of the machined part 4, and coating an adhesive for fixing between the PCB and the groove or between the PCBA and the groove to prepare a combined workpiece;
s105: putting the combined workpiece into a pressure tool, and pressing at a preset pressure value and speed;
s106: the combined workpiece is removed and an assembled workpiece of PCB or PCBA1 can be obtained that meets the tolerances of the plane and runout.
In this embodiment, when the machined part 4 is produced, a groove into which the PCB or PCBA1 can be placed is provided, after the surface pad 3 is provided on the PCB or PCBA1, the solder paste is provided on the design site by using a steel mesh and solder paste, and then the solder paste is heated and melted to form the solder ball 2, and then the solder ball is placed into the groove to form a combined workpiece, and then the pressing is performed at a set pressure and speed until the surface of the PCB or PCBA1 is flush with the tapping solid, so that the press-fitting with tolerance and plane runout of ± 5 μm can be completed.
The method comprises the following steps of:
s201: designing a plurality of sites on a PCB or PCBA1, and manufacturing surface pads 3;
s202: coating equal tin paste or placing equal tin wires on each point on the surface bonding pad 3;
s203: and (3) putting the surface bonding pad 3 coated with the tin paste or placed with the tin wire into a hot table or a heating box until the tin is completely melted and attached to the surface bonding pad 3 to form a plurality of tin beads 2.
Wherein the machined part 4 has a precision plane 5 and a bottom plane, wherein the plane run-out and the tolerance of the precision plane 5 and the bottom plane are within +/-5 mu m.
The method comprises the following steps of putting a combined workpiece into a pressure tool, and pressing the combined workpiece at a preset pressure value and speed, wherein the steps comprise:
s301: placing the combined workpiece on a lower plate 8 of the pressure tool, driving an upper plate 7 of the pressure tool, which is arranged opposite to the lower plate of the pressure tool, to be pressed downwards at a set speed and pressure by using a power device, wherein a finish machining gauge block 9 is arranged on the lower plate 8 of the pressure tool;
s302: the upper plate 7 of the pressure tool presses the PCB or PCBA1 to be flush with the bottom plane.
In the present embodiment, the precision of the finishing gauge blocks 9 determines the final press-fitting effect.
The invention relates to a PCB and PCBA plane precision press-fitting method, which is improved on the basis of the prior art, and the press-fitting method of the PCB or PCBA is characterized in that solder balls 2 are arranged on the PCB or PCBA1, and then the surface of a circuit board is flush with the surface of a precision workpiece by matching with a press tool press-fitting machine workpiece 4 and a combined workpiece formed by the PCB or PCBA1, so that the tolerance and plane jump of the PCB or PCBA1 are effectively improved to be within +/-5 mu m.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (4)
- A plane precision press mounting method for PCB and PCBA is characterized in that,the method comprises the following steps:mass-producing machined parts with specified precision for determining a plane position;designing and manufacturing surface pads at the appointed position of the PCB or the PCBA, and controlling the tin amount on each surface pad by adopting a method of steel mesh and tin paste to ensure that the tin amount is equal;heating and melting the solder paste to enable the solder paste to be attached to the surface bonding pad;placing the PCB or the PCBA into a groove which is preset in the machined part, and smearing an adhesive for fixing between the PCB and the groove or between the PCBA and the groove to prepare a combined workpiece;putting the combined workpiece into a pressure tool, and pressing at a preset pressure value and speed;the combined workpiece is taken out, and an assembly workpiece of the PCB or the PCBA which meets the plane tolerance and the jumping can be obtained.
- 2. A planar precision press-fitting method for PCBs and PCBAs as claimed in claim 1, in which the step of press-fitting the inner surface of the PCB or PCBA into the inner surface of the press-fitting jig is performed by using a press-fitting tool,the method for feeding the solder paste by matching the steel mesh and the solder paste comprises the following steps:designing a plurality of sites on a PCB or PCBA, and manufacturing surface pads;coating equal tin paste or placing equal tin wires on each point on the surface bonding pad;and putting the surface bonding pad coated with the tin paste or placed with the tin wire into a hot table or a heating box until the tin is completely melted and attached to the surface bonding pad to form a plurality of tin balls.
- 3. A planar precision press-fitting method for PCBs and PCBAs as claimed in claim 2, wherein,the machined part is provided with a precision plane and a bottom plane, wherein the plane runout and the tolerance of the precision plane and the bottom plane are within +/-5 mu m.
- 4. A planar precision press-fitting method for PCBs and PCBAs as claimed in claim 3, in which the step of press-fitting the inner surface of the PCB or PCBA into the inner surface of the press-fitting jig is performed by using a press-fitting tool,the method for pressing the combined workpiece in the pressure tool at the preset pressure value and speed comprises the following steps of:placing the combined workpiece on a lower plate of the pressure tool, and driving an upper plate of the pressure tool, which is arranged opposite to the lower plate of the pressure tool, to be pressed downwards at a set speed and pressure by using a power device, wherein a finish machining gauge block is arranged on the lower plate of the pressure tool;and pressing the PCB or the PCBA to be flush with the bottom plane under the action of the upper plate of the pressure tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210729460.2A CN114928958A (en) | 2022-06-24 | 2022-06-24 | PCB and PCBA plane precision press-fitting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210729460.2A CN114928958A (en) | 2022-06-24 | 2022-06-24 | PCB and PCBA plane precision press-fitting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114928958A true CN114928958A (en) | 2022-08-19 |
Family
ID=82813850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210729460.2A Pending CN114928958A (en) | 2022-06-24 | 2022-06-24 | PCB and PCBA plane precision press-fitting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114928958A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6267650B1 (en) * | 1999-08-09 | 2001-07-31 | Micron Technology, Inc. | Apparatus and methods for substantial planarization of solder bumps |
| CN101388376A (en) * | 2007-09-14 | 2009-03-18 | 全懋精密科技股份有限公司 | Semi-conductor package substrate construction |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| US20110067908A1 (en) * | 2008-05-21 | 2011-03-24 | Weichslberger Guenther | Method for producing a printed circuit board and use and printed circuit board |
| CN103635034A (en) * | 2013-11-19 | 2014-03-12 | 利华科技(苏州)有限公司 | BGA (ball grid array) chip bonding pad printing solder paste positioning jig |
| CN108347829A (en) * | 2018-03-29 | 2018-07-31 | 广东欧珀移动通信有限公司 | The circuit board and its manufacturing method of continuous tin prevention |
| CN108538737A (en) * | 2018-03-22 | 2018-09-14 | 江西芯创光电有限公司 | The compression method of support plate |
-
2022
- 2022-06-24 CN CN202210729460.2A patent/CN114928958A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6267650B1 (en) * | 1999-08-09 | 2001-07-31 | Micron Technology, Inc. | Apparatus and methods for substantial planarization of solder bumps |
| CN101388376A (en) * | 2007-09-14 | 2009-03-18 | 全懋精密科技股份有限公司 | Semi-conductor package substrate construction |
| US20110067908A1 (en) * | 2008-05-21 | 2011-03-24 | Weichslberger Guenther | Method for producing a printed circuit board and use and printed circuit board |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN103635034A (en) * | 2013-11-19 | 2014-03-12 | 利华科技(苏州)有限公司 | BGA (ball grid array) chip bonding pad printing solder paste positioning jig |
| CN108538737A (en) * | 2018-03-22 | 2018-09-14 | 江西芯创光电有限公司 | The compression method of support plate |
| CN108347829A (en) * | 2018-03-29 | 2018-07-31 | 广东欧珀移动通信有限公司 | The circuit board and its manufacturing method of continuous tin prevention |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220819 |
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| RJ01 | Rejection of invention patent application after publication |