CN114928940A - Thick copper multilayer board drilling manufacturing method and thick copper multilayer board - Google Patents
Thick copper multilayer board drilling manufacturing method and thick copper multilayer board Download PDFInfo
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- CN114928940A CN114928940A CN202210318157.3A CN202210318157A CN114928940A CN 114928940 A CN114928940 A CN 114928940A CN 202210318157 A CN202210318157 A CN 202210318157A CN 114928940 A CN114928940 A CN 114928940A
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- thick copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The application provides a thick copper multilayer board and a drilling manufacturing method thereof. The method for drilling the thick copper multilayer board comprises the following steps: cutting the substrate; baking the substrate; performing a pre-drilling operation on the substrate to form a pre-drilled hole in the substrate; manufacturing an inner layer circuit pattern on a substrate to form a thick copper core plate; carrying out brown oxidation treatment on the thick copper core plate; carrying out pressing operation on the plurality of thick copper core plates to obtain a thick copper multilayer plate; and drilling the thick copper multilayer board at the position of the pre-drilled hole to form a finished through hole on the thick copper multilayer board, wherein the diameter of the pre-drilled hole is smaller than that of the finished through hole. Due to the fact that pre-drilling operation is conducted on the base plate, cutting amount of the drill bit is small when the drill bit conducts drilling operation on the thick copper multilayer board, time of the drill bit for cutting the thick copper multilayer board is shortened, temperature of the drill bit during drilling is further reduced, and passivation of the drill bit is restrained.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a thick copper multilayer board drilling manufacturing method and a thick copper multilayer board.
Background
With the development of printed circuit board technology, more and more devices adopt printed circuit boards to perform integrated optimization on internal circuits, and besides small electronic devices, circuit miniaturization of large devices also becomes a demand. In the production of printed circuit boards, the inner layer copper of the multilayer circuit board is required to be thicker to meet the requirement of bearing large current due to the design requirement of a power supply.
For drilling of a thick copper multilayer board, generally, one-time drilling operation is performed on the thick copper multilayer board so that a finished through hole is formed in a thick copper core board. However, the cutting time of the drill bit is longer due to the larger thickness of the thick copper multilayer plate, so that the temperature of the drill bit during drilling is higher, the rigidity of the drill bit is reduced, the abrasion of the drill bit is aggravated, namely, the drill bit is passivated, and the service life of the drill bit is shorter. Meanwhile, the drill bit is passivated, so that the drill bit is more in wire winding during drilling, and more wire winding can block a dust collecting system. In addition, because the temperature of drill bit is higher for the ductility of the copper sheet of thick copper multiply wood improves, and then makes the copper sheet of thick copper multiply wood protruding behind the drilling, and then has reduced the drilling quality of drill bit.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a thick copper multilayer board drilling method and a thick copper multilayer board, which have the advantages of higher drilling quality, smaller drill bit abrasion and less drill bit wire winding.
The purpose of the invention is realized by the following technical scheme:
a method for drilling a thick copper multilayer board comprises the following steps:
cutting the substrate;
carrying out baking operation on the substrate;
performing a pre-drilling operation on the substrate to form a pre-drilled hole on the substrate;
manufacturing an inner layer circuit pattern on the substrate to form a thick copper core plate;
carrying out brown oxidation treatment on the thick copper core plate;
carrying out pressing operation on the plurality of thick copper core plates to obtain a thick copper multilayer plate;
and drilling the thick copper multilayer board at a position corresponding to the pre-drilled hole to form a finished through hole on the thick copper multilayer board, wherein the diameter of the pre-drilled hole is smaller than that of the finished through hole.
In one embodiment, in the step of drilling the thick copper multilayer board at a position corresponding to the pre-drilled hole to form the finished through hole on the thick copper multilayer board, the pre-drilled hole has a diameter smaller than that of the finished through hole, a twist drill is used for drilling.
In one embodiment, in the step of performing a pre-drilling operation on the substrate to form the pre-drilled hole in the substrate, a drilling operation is performed using a twist drill.
In one embodiment, the step of forming the inner layer circuit pattern on the substrate to form the thick copper core board comprises:
carrying out polishing and brushing treatment on the copper surface of the substrate;
hot-pressing the corrosion-resistant dry film on the copper surface of the substrate;
carrying out exposure treatment on the substrate;
carrying out development treatment on the substrate;
and etching the substrate to form the inner layer circuit pattern on the substrate, thereby obtaining the thick copper core plate.
In one embodiment, the substrate is exposed by an LDI exposure machine.
In one embodiment, the thickness of the inner layer circuit pattern is greater than 50Z.
In one embodiment, the step of performing a pressing operation on a plurality of thick copper core boards to obtain a thick copper multilayer board includes:
stacking a first semi-solidified sheet between two thick copper core plates to obtain the thick copper stacked plate;
and carrying out pressing operation on the thick copper stacked plate to obtain a thick copper multilayer plate.
In one embodiment, the step of performing a pressing operation on the thick copper stacked board to obtain the thick copper multilayer board includes:
overlapping a second prepreg on the first laminated copper foil;
stacking the thick copper stacked plate on the second prepreg;
stacking a third prepreg on the thick copper stacked plate;
stacking the second pressed copper foil on the third prepreg to form a laminated plate;
and carrying out pressing operation on the laminated plate to obtain the thick copper multilayer plate.
In one embodiment, after the step of drilling the thick copper multilayer board at a position corresponding to the pre-drilled hole to form the finished through hole on the thick copper multilayer board, and the diameter of the pre-drilled hole is smaller than that of the finished through hole, the method for drilling the thick copper multilayer board further comprises: and carrying out metallization treatment on the finished through hole.
The thick copper multilayer board is manufactured by the method for drilling the thick copper multilayer board in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
1. because the base plate is subjected to pre-drilling operation, the cutting amount of the drill bit during the drilling operation of the thick copper multilayer board is small, the time for cutting the thick copper multilayer board by the drill bit is reduced, the temperature of the drill bit during drilling is further reduced, the rigidity of the drill bit during drilling is further improved, the passivation of the drill bit is restrained, and the service life of the drill bit is prolonged.
2. Because the drill bit has higher rigidity when in drilling, the wire winding of the drill bit is reduced, and the blockage of a dust collecting system is further inhibited.
3. Because the temperature of the drill bit is lower during drilling, the copper sheet bulge of the thick copper composite board is reduced and restrained, and the flatness of the copper sheet of the thick copper composite board is improved, namely, the quality of a finished through hole is improved, namely, the drilling quality of the drill bit is improved.
4. Because the diameter of the pre-drilled hole is smaller than that of the finished product through hole, namely, the thick copper core plates are provided with drill bit allowance, when the thick copper core plates are subjected to alignment pressing, if the alignment accuracy of each thick copper core plate is poor, namely, the pre-drilled hole of each thick copper core plate is partially staggered with the pre-drilled holes of other thick copper core plates, when the thick copper multilayer plate is drilled at the position corresponding to the pre-drilled hole, the peripheral wall of the pre-drilled hole of each thick copper core plate is within the drilling chip range of the drill bit, the influence of the alignment accuracy of each thick copper core plate on the subsequent operation of drilling the finished product through hole is avoided, the quality of the finished product through hole is further improved, and the quality of the thick copper multilayer plate is favorably improved.
5. Because the diameter of the pre-drilled hole is smaller than that of the finished product through hole, namely, the thick copper core plates are provided with drill bit allowance, if the thick copper multilayer plate has the problem of expansion and shrinkage, the pre-drilled hole of each thick copper core plate and the pre-drilled holes of other thick copper core plates have partial dislocation, when the thick copper multilayer plate is drilled at the position corresponding to the pre-drilled hole, the peripheral wall of the pre-drilled hole of each thick copper core plate is in the drilling chip range of the drill bit, the influence of the alignment precision of each thick copper core plate on the subsequent operation of drilling the finished product through hole is avoided, the quality of the finished product through hole is further improved, and the improvement of the quality of the thick copper multilayer plate is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a flowchart of a thick copper multilayer board drilling manufacturing method according to an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The application provides a thick copper multilayer board drilling manufacturing method, which comprises the following steps: cutting the substrate; carrying out baking operation on the substrate; performing a pre-drilling operation on the substrate to form a pre-drilled hole in the substrate; manufacturing an inner layer circuit pattern on the substrate to form a thick copper core plate; carrying out brown oxidation treatment on the thick copper core plate; carrying out pressing operation on the thick copper core plates to obtain a thick copper multilayer plate; and drilling the thick copper multilayer board at a position corresponding to the pre-drilled hole to form a finished through hole on the thick copper multilayer board, wherein the diameter of the pre-drilled hole is smaller than that of the finished through hole.
According to the thick copper multilayer board drilling manufacturing method, due to the fact that pre-drilling operation is carried out on the substrate, the cutting amount of the drill bit is small when the thick copper multilayer board is drilled, the time of the drill bit for cutting the thick copper multilayer board is shortened, the temperature of the drill bit during drilling is further reduced, the rigidity of the drill bit during drilling is further improved, passivation of the drill bit is restrained, and the service life of the drill bit is prolonged. Because the drill bit has higher rigidity when in drilling, the wire winding of the drill bit is reduced, and the blockage of a dust collecting system is further inhibited. Because the temperature of the drill bit is lower during drilling, the copper sheet bulge of the thick copper multilayer board is reduced and restrained, and the flatness of the copper sheet of the thick copper multilayer board is improved, namely the quality of a finished through hole is improved, namely the drilling quality of the drill bit is improved. Because the diameter of the pre-drilled hole is smaller than that of the finished product through hole, namely, the thick copper core plates are provided with drill bit allowance, when the thick copper core plates are subjected to alignment pressing, if the alignment accuracy of each thick copper core plate is poor, namely, the pre-drilled hole of each thick copper core plate is partially staggered with the pre-drilled holes of other thick copper core plates, when the thick copper multilayer plate is drilled at the position corresponding to the pre-drilled hole, the peripheral wall of the pre-drilled hole of each thick copper core plate is within the drilling chip range of the drill bit, the influence of the alignment accuracy of each thick copper core plate on the subsequent operation of drilling the finished product through hole is avoided, the quality of the finished product through hole is further improved, and the quality of the thick copper multilayer plate is favorably improved. Similarly, if the problem of harmomegathus appears in the thick copper multiply wood, make the situation that the part dislocation appears in the predrilled hole of each thick copper core board and the predrilled hole of other thick copper core boards, when drilling the thick copper multiply wood with the position that the predrilled hole corresponds, the perisporium of the predrilled hole of each thick copper core board all is in the drill chip scope of drill bit, the counterpoint precision of having avoided each thick copper core board produces the influence to the operation of follow-up drilling finished product through-hole, and then improved the quality of finished product through-hole, be favorable to improving the quality of thick copper multiply wood.
In order to better understand the technical scheme and the beneficial effects of the present application, the following detailed description is further provided in conjunction with specific embodiments:
as shown in fig. 1, an embodiment of the method for drilling a thick copper multilayer board includes:
s101: and carrying out cutting operation on the substrate.
In this embodiment, the substrate is cut to size for the work.
S103: and carrying out baking operation on the substrate.
In this embodiment, the baking operation is performed on the substrate to reduce the influence of the substrate expansion and contraction.
S105: and performing a pre-drilling operation on the substrate to form a pre-drilled hole on the substrate.
In this embodiment, the substrate is pre-drilled to form a through hole with a smaller diameter on the substrate, that is, a through hole smaller than the finished through hole is formed on the substrate, so as to reduce the cutting amount in subsequent drilling of the finished through hole. Moreover, the aperture of the through hole formed in the pre-drilling operation is smaller than that of the finished through hole, so that the precision of the finished through hole formed in the subsequent step is higher.
S107: and manufacturing an inner layer circuit pattern on the substrate to form the thick copper core plate.
In this embodiment, a portion of copper on the substrate is removed to form a copper-clad region and a copper-free 1 region on the substrate, so that a circuit pattern is formed on the substrate, thereby forming a thick copper core board.
S109: and performing brown oxidation treatment on the thick copper core plate.
In this embodiment, the brown oxidation treatment is performed on the thick copper core board to roughen the copper surface of the thick copper core board, and increase the contact area between the copper surface and the prepreg, so as to perform the pressing operation on the plurality of thick copper core boards in the following.
S111: and carrying out pressing operation on the thick copper core plates to obtain the thick copper multilayer plate.
In this embodiment, a plurality of thick copper core boards, prepregs, and laminated copper foils are stacked, and then the plurality of thick copper core boards are subjected to a laminating operation to obtain a thick copper multilayer board.
S113: and drilling the thick copper multilayer board at a position corresponding to the pre-drilled hole to form a finished through hole on the thick copper multilayer board, wherein the diameter of the pre-drilled hole is smaller than that of the finished through hole.
In this embodiment, the thick copper core multilayer board is subjected to a drilling operation at a position corresponding to the position of the pre-drilled hole to reduce the cutting amount of the drilling operation. The ultra-thick multilayer board is drilled to form a finished through hole on the thick copper multilayer board, and the aperture of the finished through hole is larger than that of the pre-drilled hole, so that drill bit allowance is reserved on each thick copper core board, and the drilling precision of the step is improved. .
According to the thick copper multilayer board drilling manufacturing method, due to the fact that pre-drilling operation is carried out on the substrate, the cutting amount of the drill bit is small when the thick copper multilayer board is drilled, the time of the drill bit for cutting the thick copper multilayer board is shortened, the temperature of the drill bit during drilling is further reduced, the rigidity of the drill bit during drilling is further improved, passivation of the drill bit is restrained, and the service life of the drill bit is prolonged. Because the drill bit has higher rigidity when in drilling, the wire winding of the drill bit is reduced, and the blockage of a dust collecting system is further inhibited. Because the temperature of the drill bit is lower during drilling, the copper sheet bulge of the thick copper composite board is reduced and restrained, and the flatness of the copper sheet of the thick copper composite board is improved, namely, the quality of a finished through hole is improved, namely, the drilling quality of the drill bit is improved. Because the diameter of the pre-drilled hole is smaller than that of the finished product through hole, namely, the thick copper core plates are provided with drill bit allowance, when the thick copper core plates are subjected to alignment pressing, if the alignment accuracy of each thick copper core plate is poor, namely, the pre-drilled hole of each thick copper core plate is partially staggered with the pre-drilled holes of other thick copper core plates, when the thick copper multilayer plate is drilled at the position corresponding to the pre-drilled hole, the peripheral wall of the pre-drilled hole of each thick copper core plate is within the drilling chip range of the drill bit, the influence of the alignment accuracy of each thick copper core plate on the subsequent operation of drilling the finished product through hole is avoided, the quality of the finished product through hole is further improved, and the quality of the thick copper multilayer plate is favorably improved. Similarly, if the problem of harmomegathus appears in the thick copper multiply wood, make the situation that the part dislocation appears in the predrilled hole of each thick copper core board and the predrilled hole of other thick copper core boards, when drilling the thick copper multiply wood with the position that the predrilled hole corresponds, the perisporium of the predrilled hole of each thick copper core board all is in the drill chip scope of drill bit, the counterpoint precision of having avoided each thick copper core board produces the influence to the operation of follow-up drilling finished product through-hole, and then improved the quality of finished product through-hole, be favorable to improving the quality of thick copper multiply wood.
In one embodiment, in the step of drilling the thick copper multilayer plate at a position corresponding to the pre-drilled hole to form the finished through hole on the thick copper multilayer plate, the diameter of the pre-drilled hole is smaller than that of the finished through hole, a twist drill is used for drilling. In this embodiment, adopt the fluted drill to carry out drilling operation, because the twolip symmetry during the fluted drill cutting for the drill atress is balanced, is difficult for producing the vibration, and then has improved drilling accuracy.
In one embodiment, in the step of performing a pre-drilling operation on the substrate to form the pre-drilled hole in the substrate, a drilling operation is performed using a twist drill. In this embodiment, adopt the fluted drill to carry out drilling operation, because the twolip symmetry during the fluted drill cutting for the drill atress is balanced, is difficult for producing the vibration, and then has improved drilling accuracy.
In one embodiment, the step of forming the inner layer circuit pattern on the substrate to form the thick copper core board comprises: carrying out polishing and brushing treatment on the copper surface of the substrate; hot-pressing the corrosion-resistant dry film on the copper surface of the substrate; carrying out exposure treatment on the substrate; carrying out developing treatment on the substrate; and etching the substrate to form the inner layer circuit pattern on the substrate, thereby obtaining the thick copper core plate.
In this embodiment, the copper surface of the substrate is first brushed to improve the roughness of the copper surface of the substrate, thereby increasing the bonding area between the copper surface of the substrate and the dry film, further increasing the bonding strength of the dry film, then hot pressing the dry film on the copper surface of the substrate, exposing the substrate to expose part of the dry film, developing the substrate, that is, the dry film resist which does not undergo chemical reaction is washed away by alkali liquor, the dry film resist which undergoes chemical reaction is retained on the copper surface, the dry film resist retained on the copper surface protects the corresponding copper surface during etching, and finally, the substrate is etched, etching the copper surface which is not adhered with the corrosion-resistant dry film, keeping the copper surface adhered with the corrosion-resistant dry film on the substrate, and finally taking out the corrosion-resistant dry film adhered on the copper surface to obtain an inner layer circuit image so as to obtain the thick copper core plate.
In one embodiment, the substrate is exposed by an LDI exposure machine. In this embodiment, because the LDI exposure machine realizes automated operation more easily than the semi-automatic exposure machine of traditional CCD, has saved the cost of labor, has more improved the quality of super thick copper multiply wood greatly, avoids the production of defective rate.
In one embodiment, the thickness of the inner layer circuit pattern is greater than 50Z, so that a thick copper circuit is formed on the substrate.
In an embodiment of the invention, the step of performing a pressing operation on a plurality of thick copper core boards to obtain a thick copper multilayer board includes: stacking a first semi-solidified sheet between two thick copper core plates to obtain a thick copper stacked plate; and carrying out pressing operation on the thick copper stacked plate to obtain a thick copper multilayer plate.
In this embodiment, the first semi-solidified sheet is stacked between the two thick copper core plates, so that two opposite sides of the first solidified sheet are respectively bonded with the two thick copper core plates, and the two thick copper core plates are fixed to each other, thereby inhibiting slippage of the two thick copper core plates in subsequent steps.
In an embodiment of the invention, the step of performing a pressing operation on the thick copper stacked board to obtain the thick copper multilayer board includes: overlapping a second prepreg on the first pressed copper foil; stacking the thick copper stacked plate on the second prepreg; stacking a third prepreg on the thick copper stacked plate; stacking the second pressed copper foil on the third prepreg to form a laminated plate; and carrying out pressing operation on the laminated plate to obtain the thick copper multilayer plate.
In this embodiment, first, a first lamination copper foil is placed on a lamination platform so that the lamination operation is performed on a plane, then a second prepreg is placed on the first lamination copper foil so that the second prepreg is used for bonding the first lamination copper foil and the thick copper stacked body, then the thick copper stacked body is placed on a side surface of the second prepreg departing from the first lamination copper foil so that one side of the thick copper stacked body and the first lamination copper foil are pre-fixed by the second prepreg, then a third prepreg is placed on a side surface of the thick copper stacked body departing from the second prepreg so that the third prepreg is used for bonding the thick copper stacked body and the second copper foil, then the second copper stacked body is placed on a side surface of the third prepreg departing from the thick copper stacked body so that the other side of the thick copper stacked body and the second lamination copper foil are pre-fixed by the third prepreg, and finally, carrying out pressing operation on the laminated board so as to sequentially stack and fix the first pressed copper foil, the second prepreg, the thick copper stacked body, the third prepreg and the second pressed copper foil, thereby obtaining the thick copper multilayer board.
In one embodiment, after the step of drilling the thick copper multilayer board at a position corresponding to the pre-drilled hole to form the finished through hole on the thick copper multilayer board, and the diameter of the pre-drilled hole is smaller than that of the finished through hole, the method for drilling the thick copper multilayer board further comprises: and carrying out metallization treatment on the finished through hole. In this embodiment, the finished vias are metallized to connect the circuits of the plurality of thick copper core boards.
In one embodiment, after the step of performing a pre-drilling operation on the substrate to form a pre-drilled hole on the substrate and before the step of fabricating an inner layer circuit pattern on the substrate to form a thick copper core board, the thick copper multilayer board drilling fabrication method further includes: and milling the base plate at the edge of the pre-drilled hole so that the peripheral edge of the pre-drilled hole forms a guide slope.
It can be understood that in the step of drilling the thick copper multilayer board at the position corresponding to the pre-drilled hole, when the drill bit drills to the thick copper core board, because the pre-drilled hole is formed at the thick copper core board, the cutting amount of the drill bit in unit time is reduced, the reaction force applied to the drill bit is changed greatly, the drill bit is easy to deform or even break, and the drilling quality of the drill bit is not improved. Moreover, when the drill bit drills to the thick copper core plate, the thick copper core plate is easy to slide due to the fact that the thick copper core plate is suddenly subjected to drill bit force, and the quality of the thick copper multilayer plate is not improved. In this embodiment, the substrate is subjected to a milling operation at the edge of the pre-drilled hole to mill away a portion of the material at the periphery of the pre-drilled hole, thereby forming a guide bevel at the periphery of the pre-drilled hole, i.e. a chamfer at the periphery of the pre-drilled hole. Therefore, in the step of drilling the thick copper multilayer board at the position corresponding to the pre-drilled hole to form a finished through hole on the thick copper multilayer board, when the drill bit drills to the thick copper core board, the drill bit is firstly contacted with the guide inclined plane, so that the drilling amount of the drill bit on the thick copper core board is gradually increased, the stress of the thick copper core board is gentle, the problem of slippage of the thick copper core board is effectively inhibited, and the quality of the thick copper multilayer board is improved.
It can be understood that it is right with the position that the predrilling corresponds is right in the step of thick copper multiply wood operation of driling, thick copper core is in the inside of thick copper multiply wood for the drill is chewed and is bored thick copper core when certain degree of depth, and then makes the sweeps that thick copper core produced have longer distance apart from the chip removal mouth, is unfavorable for the drill to chew the chip removal when boring thick copper core, and then is unfavorable for improving the quality of drilling. Therefore, when the number of layers of the thick copper multilayer board is large, the scraps generated by the thick copper core board far away from the initial surface of the drill are far away from the scrap discharge port, so that the scraps of the corresponding thick copper core board are difficult to discharge, and the problem of wire winding of the drill on the drill is solved. To this end, in one embodiment, after the step of milling the substrate at the edge of the pre-drilled hole to form a guiding bevel at the periphery of the pre-drilled hole, and before the step of forming an inner layer circuit pattern on the substrate to form a thick copper core board, the thick copper multilayer board drilling method further includes: and milling the substrate at the edge of the pre-drilled hole to form a plurality of wire breaking grooves arranged at intervals at the periphery of the pre-drilled hole, wherein each wire breaking groove is communicated with the pre-drilled hole.
In this embodiment, the edge of the pre-drilled hole is milled to the substrate, so that a plurality of wire breaking grooves are formed at the edge of the pre-drilled hole at intervals, and each wire breaking groove is communicated with the pre-drilled hole, so that the material to be drilled of the subsequent thick copper core plate is arranged at intervals, that is, the material to be drilled of the subsequent thick copper core plate is discontinuous. So, with the position that the pre-drilling hole corresponds is right the thick copper multiply wood carries out drilling operation, with in the step of forming the finished product through-hole on the thick copper multiply wood, when the drill bit bored to thick copper core board, the rotatory a week of drill bit will produce the multistage bits material for the length of bits material is shorter, and then has avoided the bits material to twine on the drill bit, has avoided the drill bit to twine the problem of silk promptly, makes the quality of the finished product through-hole that the drill bit drilled out higher. In order to ensure that the stress is uniform when the drill bit drills, further, the wire breaking grooves are uniformly arranged at the periphery of the pre-drilled hole, so that the stress is uniform when the drill bit drills to the thick copper core plate, and the quality of a finished through hole drilled by the drill bit is better while the wire winding of the drill bit is avoided.
However, the periphery of the pre-drilled hole is provided with spaced wire breaking grooves, so that a plurality of blocks to be drilled are formed at the periphery of the pre-drilled hole by each thick copper core plate at intervals, two sides of each block to be drilled are wire breaking grooves, and two sides of each block to be drilled are vacant areas. In the step of drilling the thick copper multilayer board at the position corresponding to the pre-drilled hole, because two sides of each block to be drilled are vacant areas, the stress of each block to be drilled is uneven during drilling, and the peripheral wall of the finished through hole is deformed, so that the precision of the finished through hole is not improved. In one embodiment, after the step of milling the substrate at the edge of the pre-drilled hole to form a plurality of wire cutting grooves arranged at intervals at the periphery of the pre-drilled hole, and each wire cutting groove is communicated with the pre-drilled hole, and before the step of manufacturing an inner layer circuit pattern on the substrate to form a thick copper core plate, the thick copper multilayer plate drilling manufacturing method further comprises the following steps: and filling the substrate to fill filler in the broken wire groove of the substrate. In this embodiment, the filler is filled in the wire breaking groove of the substrate, so that solid materials exist on two sides of each block to be drilled. Therefore, in the step of drilling the thick copper multilayer board at the position corresponding to the pre-drilled hole, when the drill bit drills the thick copper core board, the filler can provide acting force for each block to be drilled, so that the stress of each block to be drilled is uniform, the deformation of the peripheral wall of the finished through hole is restrained, and the quality of the finished through hole is improved.
In one embodiment, the filler is an elastomeric resin filler. It can be understood that the elastic resin filler has a good buffering effect, when the thick copper core plate is subjected to overlarge impact force caused by the drill bit, the force applied to the thick copper core plate can be buffered by the filler, so that the problem of drill bit breakage caused by the fact that the cutting speed of the drill bit is too high is solved, and the service life of the drill bit is well ensured.
The application also provides a thick copper multilayer board which is prepared by adopting the thick copper multilayer board drilling manufacturing method in any embodiment. Further, the thick copper multilayer board drilling manufacturing method comprises the following steps: cutting the substrate; carrying out baking operation on the substrate; performing a pre-drilling operation on the substrate to form a pre-drilled hole in the substrate; manufacturing an inner layer circuit pattern on the substrate to form a thick copper core plate; carrying out brown oxidation treatment on the thick copper core plate; carrying out pressing operation on the thick copper core plates to obtain a thick copper multilayer plate; and drilling the thick copper multilayer plate at a position corresponding to the pre-drilled hole to form a finished through hole on the thick copper multilayer plate, wherein the diameter of the pre-drilled hole is smaller than that of the finished through hole.
Foretell thick copper multiply wood owing to carried out the pre-drilling operation to the base plate for the cutting volume of drill bit when carrying out the drilling operation to thick copper multiply wood is less, has reduced the time of drill bit cutting thick copper multiply wood, and then has reduced the temperature of drill bit when drilling, and then has improved the rigidity of drill bit when drilling, so has restrained the passivation of drill bit, has improved the life of drill bit. Because the drill bit has higher rigidity when in drilling, the wire winding of the drill bit is reduced, and the blockage of a dust collecting system is further inhibited. Because the temperature of the drill bit is lower during drilling, the copper sheet bulge of the thick copper composite board is reduced and restrained, and the flatness of the copper sheet of the thick copper composite board is improved, namely, the quality of a finished through hole is improved, namely, the drilling quality of the drill bit is improved. Because the diameter of the pre-drilled hole is smaller than that of the finished product through hole, namely, the thick copper core plates are provided with drill bit allowance, when the thick copper core plates are subjected to alignment pressing, if the alignment accuracy of each thick copper core plate is poor, namely, the pre-drilled hole of each thick copper core plate is partially staggered with the pre-drilled holes of other thick copper core plates, when the thick copper multilayer plate is drilled at the position corresponding to the pre-drilled hole, the peripheral wall of the pre-drilled hole of each thick copper core plate is within the drilling chip range of the drill bit, the influence of the alignment accuracy of each thick copper core plate on the subsequent operation of drilling the finished product through hole is avoided, the quality of the finished product through hole is further improved, and the quality of the thick copper multilayer plate is favorably improved. Similarly, if the problem of harmomegathus appears in the thick copper multiply wood, make the situation that the part dislocation appears in the predrilled hole of each thick copper core board and the predrilled hole of other thick copper core boards, when drilling the thick copper multiply wood with the position that the predrilled hole corresponds, the perisporium of the predrilled hole of each thick copper core board all is in the drill chip scope of drill bit, the counterpoint precision of having avoided each thick copper core board produces the influence to the operation of follow-up drilling finished product through-hole, and then the quality of finished product through-hole has been improved, be favorable to improving the quality of thick copper multiply wood.
Compared with the prior art, the invention has at least the following advantages:
1. because the base plate is subjected to pre-drilling operation, the cutting amount of the drill bit is smaller when the thick copper composite board is subjected to drilling operation, the time for cutting the thick copper composite board by the drill bit is reduced, the temperature of the drill bit during drilling is further reduced, the rigidity of the drill bit during drilling is further improved, the passivation of the drill bit is restrained, and the service life of the drill bit is prolonged.
2. Because the drill bit has higher rigidity when in drilling, the wire winding of the drill bit is reduced, and the blockage of a dust collecting system is further inhibited.
3. Because the temperature of the drill bit is lower during drilling, the copper sheet bulge of the thick copper multilayer board is reduced and restrained, and the flatness of the copper sheet of the thick copper multilayer board is improved, namely the quality of a finished through hole is improved, namely the drilling quality of the drill bit is improved.
4. Because the diameter of the pre-drilled hole is smaller than that of the finished product through hole, namely, the thick copper core plates are provided with drill bit allowance, when the thick copper core plates are subjected to alignment pressing, if the alignment accuracy of each thick copper core plate is poor, namely, the pre-drilled hole of each thick copper core plate is partially staggered with the pre-drilled holes of other thick copper core plates, when the thick copper multilayer plate is drilled at the position corresponding to the pre-drilled hole, the peripheral wall of the pre-drilled hole of each thick copper core plate is within the drilling chip range of the drill bit, the influence of the alignment accuracy of each thick copper core plate on the subsequent operation of drilling the finished product through hole is avoided, the quality of the finished product through hole is further improved, and the quality of the thick copper multilayer plate is favorably improved.
5. Because the diameter of the pre-drilled hole is smaller than that of the finished product through hole, namely, the thick copper core plates are provided with drill bit allowance, if the thick copper multilayer plate has the problem of expansion and shrinkage, the pre-drilled hole of each thick copper core plate and the pre-drilled holes of other thick copper core plates have partial dislocation, when the thick copper multilayer plate is drilled at the position corresponding to the pre-drilled hole, the peripheral wall of the pre-drilled hole of each thick copper core plate is in the drilling chip range of the drill bit, the influence of the alignment precision of each thick copper core plate on the subsequent operation of drilling the finished product through hole is avoided, the quality of the finished product through hole is further improved, and the improvement of the quality of the thick copper multilayer plate is facilitated.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A thick copper multilayer board drilling manufacturing method is characterized by comprising the following steps:
cutting the substrate;
carrying out baking operation on the substrate;
performing a pre-drilling operation on the substrate to form a pre-drilled hole in the substrate;
manufacturing an inner layer circuit pattern on the substrate to form a thick copper core plate;
carrying out brown oxidation treatment on the thick copper core plate;
carrying out pressing operation on the plurality of thick copper core plates to obtain a thick copper multilayer plate;
and drilling the thick copper multilayer plate at a position corresponding to the pre-drilled hole to form a finished through hole on the thick copper multilayer plate, wherein the diameter of the pre-drilled hole is smaller than that of the finished through hole.
2. The thick copper multilayer board drilling manufacturing method according to claim 1, wherein in the step of drilling the thick copper multilayer board at a position corresponding to the pre-drilled hole to form the finished through hole on the thick copper multilayer board, and the diameter of the pre-drilled hole is smaller than that of the finished through hole, a twist drill is used for drilling.
3. The thick copper multilayer board drilling manufacturing method according to claim 1, wherein in the step of performing a pre-drilling operation on the substrate to form the pre-drilled hole on the substrate, a drilling operation is performed using a twist drill.
4. The thick copper multilayer board drilling manufacturing method according to claim 1, wherein the step of manufacturing an inner layer circuit pattern on the substrate to form the thick copper core board comprises the following steps:
carrying out polishing and brushing treatment on the copper surface of the substrate;
hot-pressing the corrosion-resistant dry film on the copper surface of the substrate;
carrying out exposure treatment on the substrate;
carrying out development treatment on the substrate;
and etching the substrate to form the inner layer circuit pattern on the substrate, thereby obtaining the thick copper core plate.
5. The thick copper multilayer board drilling manufacturing method according to claim 4, characterized in that the substrate is exposed by an LDI exposure machine.
6. The method of claim 4, wherein the thickness of the inner layer circuit pattern is greater than 50Z.
7. The method for drilling and manufacturing a thick copper multilayer board according to claim 1, wherein the step of performing a pressing operation on a plurality of thick copper core boards to obtain the thick copper multilayer board comprises the following steps:
stacking a first semi-solidified sheet between two thick copper core plates to obtain a thick copper stacked plate;
and carrying out pressing operation on the thick copper stacked plate to obtain a thick copper multilayer plate.
8. The thick copper multilayer board drilling manufacturing method according to claim 7, wherein the step of performing a pressing operation on the thick copper stacked board to obtain the thick copper multilayer board comprises the following steps:
overlapping a second prepreg on the first laminated copper foil;
stacking the thick copper stacked plate on the second prepreg;
stacking a third prepreg on the thick copper stacked plate;
stacking the second pressed copper foil on the third prepreg to form a laminated plate;
and carrying out pressing operation on the laminated plate to obtain the thick copper multilayer plate.
9. The thick copper multilayer board drilling manufacturing method according to claim 1, wherein after the step of performing a drilling operation on the thick copper multilayer board at a position corresponding to the pre-drilled hole to form the finished through hole on the thick copper multilayer board, and the diameter of the pre-drilled hole is smaller than that of the finished through hole, the thick copper multilayer board drilling manufacturing method further comprises: and carrying out metallization treatment on the finished through hole.
10. A thick copper multilayer board, characterized in that the thick copper multilayer board is prepared by the method for drilling the hole according to any one of claims 1 to 9.
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| CN202210318157.3A CN114928940B (en) | 2022-03-29 | 2022-03-29 | Drilling method for thick copper multilayer board and thick copper multilayer board |
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| US20080148561A1 (en) * | 2006-12-22 | 2008-06-26 | Motorola, Inc. | Methods for making printed wiring boards |
| CN104427768A (en) * | 2013-08-29 | 2015-03-18 | 北大方正集团有限公司 | Circuit board drilling method and circuit board manufactured by method |
| CN105430906A (en) * | 2014-09-18 | 2016-03-23 | 深南电路有限公司 | Drilling method of circuit board |
| CN107484356A (en) * | 2017-08-01 | 2017-12-15 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of the sandwich aluminium base of thick copper |
| US20180110133A1 (en) * | 2016-10-13 | 2018-04-19 | Sanmina Corporation | Multilayer printed circuit board via hole registration and accuracy |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080148561A1 (en) * | 2006-12-22 | 2008-06-26 | Motorola, Inc. | Methods for making printed wiring boards |
| CN104427768A (en) * | 2013-08-29 | 2015-03-18 | 北大方正集团有限公司 | Circuit board drilling method and circuit board manufactured by method |
| CN105430906A (en) * | 2014-09-18 | 2016-03-23 | 深南电路有限公司 | Drilling method of circuit board |
| US20180110133A1 (en) * | 2016-10-13 | 2018-04-19 | Sanmina Corporation | Multilayer printed circuit board via hole registration and accuracy |
| CN107484356A (en) * | 2017-08-01 | 2017-12-15 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of the sandwich aluminium base of thick copper |
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| CN114928940B (en) | 2023-07-21 |
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