CN114921199A - Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof - Google Patents
Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof Download PDFInfo
- Publication number
- CN114921199A CN114921199A CN202210635409.5A CN202210635409A CN114921199A CN 114921199 A CN114921199 A CN 114921199A CN 202210635409 A CN202210635409 A CN 202210635409A CN 114921199 A CN114921199 A CN 114921199A
- Authority
- CN
- China
- Prior art keywords
- glue
- ma50s
- temperature
- resistant
- diluent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 49
- 239000002904 solvent Substances 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 15
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003085 diluting agent Substances 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 239000003999 initiator Substances 0.000 claims abstract description 7
- 239000000178 monomer Substances 0.000 claims abstract description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract 2
- 239000007788 liquid Substances 0.000 claims abstract 2
- 238000001035 drying Methods 0.000 claims description 5
- 238000010528 free radical solution polymerization reaction Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 238000004925 denaturation Methods 0.000 abstract description 2
- 230000036425 denaturation Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 238000005303 weighing Methods 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
Abstract
The invention discloses a solvent type high-peeling-force high-temperature-and-humidity-resistant glue and a preparation method thereof, belonging to the technical field of glues. The glue is prepared by mixing 80-85% of MA50S, 0.8-1.2% of aziridine crosslinking agent and 15-20% of diluent, wherein MA50S is a two-liquid oily acrylate pressure-sensitive adhesive, and the diluent is methyl ethyl ketone which is commonly called methyl ethyl ketone. According to the invention, by adjusting the proportion of the monomer and the initiator in MA50S and adding the aziridine crosslinking agent, the use of other additives is reduced, the high temperature resistance of the glue is improved, and the cohesive strength of the glue is improved by adding quantitative methyl ethyl ketone, so that the glue does not generate the phenomena of denaturation, degumming, glue overflow, warping and the like at a high temperature of 85 ℃, and the peel strength reaches 1900g/inch to 2200 g/inch. The glue is simple in production process, saves materials and labor processing cost, and meets the energy-saving and environment-friendly requirement advocated by the state.
Description
Technical Field
The invention belongs to the technical field of glue, and particularly relates to solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and a preparation method thereof.
Background
The acrylic glue is also called organic glass glue and PMMA glue. At present, the acrylic glue is an indispensable product, is widely popularized in the automobile industry, the electronic industry, the plasticizing industry and the hardware industry, and plays an important role in the glue industry. However, in the current industry and markets, many high-temperature glues have too many acrylic system glues, when the acrylic system glues are used, a pasted object is easy to displace in a high-temperature high-humidity environment, and in order to reduce poor displacement after the pasted object is attached, a solvent type glue with high peeling force, high-temperature high-humidity resistance and no displacement is provided.
Disclosure of Invention
The invention aims to provide a solvent type high-stripping-force high-temperature and high-humidity resistant glue and a preparation method thereof, and aims to solve the problems in the background art. In order to realize the purpose, the invention adopts the technical scheme that: a solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and a preparation method thereof comprise the following raw materials in percentage by weight: MA 50S: 80% -85%, aziridine crosslinking agent: 0.8 to 1.2 percent of the total weight of the lubricant and 15 to 20 percent of the diluent. Wherein MA50S is two-component oil acrylic pressure-sensitive adhesive, which can be added with different types of cross-linking agent or auxiliary resin to change the performance of solution type high molecular polymer. The thinner is methyl ethyl ketone, commonly called methyl ethyl ketone, with a chemical formula of CH3COCH2CH3, and the methyl ethyl ketone is used as a thinner for glue because of various reactions easily occurring due to the carbonyl and active hydrogen adjacent to the carbonyl. By adding aziridine crosslinking agent into MA50S, the water resistance, chemical resistance, dry and wet rubbing resistance, surface anti-sticking property, coating fastness and adhesion on special substrate can be greatly improved.
A preparation method of solvent type high-stripping-force high-temperature and high-humidity resistant glue is characterized by comprising the following steps: the method comprises the following steps:
step one, carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, blending MA50S, an aziridine crosslinking agent and a diluent, and mixing for 10-20 minutes to obtain glue;
step two, heating the glue to 90-110 ℃ and drying for 2-3 minutes;
and step three, placing the dried glue at the temperature of 35-40 ℃ for 72-85 hours.
According to the invention, by adjusting the proportion of the monomer and the initiator in MA50S and adding the aziridine crosslinking agent, the use of other auxiliary agents is reduced, the high temperature resistance of the glue is improved, and the cohesive strength of the glue is improved by adding quantitative methyl ethyl ketone, so that the glue does not generate the phenomena of denaturation, degumming, glue overflow, warping and the like at the high temperature of 85 ℃, and the peel strength reaches 1900g/inch to 2200 g/inch. The glue is simple in production process, saves materials and labor processing cost, and meets the energy-saving and environment-friendly requirement advocated by the state.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the following description. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example 1
Carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, weighing MA 50S: 82%, aziridine crosslinking agent: 0.9 percent and 17.1 percent of diluent. Then blending MA50S, aziridine crosslinking agent and diluent, and mixing for 15 minutes to obtain glue;
heating the glue to 95 ℃ and drying for 2 minutes; and placing the dried glue at the temperature of 36 ℃ for 75 hours.
Example 2
Carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, weighing MA 50S: 83.74%, aziridine crosslinking agent: 0.987 percent and a diluent 15.273 percent. Then blending MA50S, aziridine crosslinking agent and diluent, and mixing for 17 minutes to obtain glue; heating the glue to 98 ℃ and drying for 2 minutes; and placing the dried glue at 38 ℃ for 80 hours.
Example 3
Carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, weighing MA 50S: 83.74%, aziridine crosslinking agent: 1.075% and diluent 15.185%. Then blending MA50S, aziridine crosslinking agent and diluent, and mixing for 17 minutes to obtain glue; heating the glue to 105 ℃ and drying for 2 minutes; and placing the dried glue at the temperature of 40 ℃ for 80 hours.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The above embodiments are only for illustrating the present invention and not for limiting the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore all equivalent technical solutions also belong to the scope of the present invention, and the protection scope of the present invention should be defined by the claims.
Claims (3)
1. A solvent type high-peeling-force high-temperature-resistant high-humidity-resistant glue is characterized in that: comprises the following raw materials in percentage by weight: MA 50S: 80% -85%, aziridine crosslinking agent: 0.8% -1.2% of a diluent, 15% -20% of a MA50S, wherein the diluent is two-liquid oily acrylate pressure-sensitive adhesive, the diluent is methyl ethyl ketone, commonly called methyl ethyl ketone, and the chemical formula is CH3COCH2CH 3.
2. A preparation method of solvent type high-stripping-force high-temperature-and-humidity-resistant glue is characterized by comprising the following steps: the method comprises the following steps:
step one, carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, blending MA50S, an aziridine crosslinking agent and a diluent, and mixing for 10-20 minutes to obtain glue;
step two, heating the glue to 90-110 ℃ and drying for 2-3 minutes;
and step three, placing the dried glue at the temperature of 38-42 ℃ for 72-85 hours.
3. The preparation method of the solvent-based high-peel-force high-temperature and high-humidity resistant glue according to claim 2, wherein the peel strength of the glue is 1900g/inch to 2200 g/inch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210635409.5A CN114921199A (en) | 2022-06-07 | 2022-06-07 | Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210635409.5A CN114921199A (en) | 2022-06-07 | 2022-06-07 | Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114921199A true CN114921199A (en) | 2022-08-19 |
Family
ID=82813217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210635409.5A Pending CN114921199A (en) | 2022-06-07 | 2022-06-07 | Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114921199A (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101945902A (en) * | 2008-02-14 | 2011-01-12 | 3M创新有限公司 | Acrylic psa with aziridine crosslinker |
US20110054115A1 (en) * | 2009-08-25 | 2011-03-03 | 3M Innovative Properties Company | Acrylic pressure-sensitive adhesives with acylaziridine crosslinking agents |
CN102057006A (en) * | 2008-06-09 | 2011-05-11 | 3M创新有限公司 | Acrylic pressure-sensitive adhesives with aziridine crosslinking agents |
CN103205226A (en) * | 2012-08-29 | 2013-07-17 | 湖北航天化学技术研究所 | Solvent type acrylate pressure-sensitive adhesive, and preparation method and application thereof |
CN104449486A (en) * | 2014-12-03 | 2015-03-25 | 新丰杰力电工材料有限公司 | Preparation method and application of high temperature solvent resistant acrylate pressure sensitive adhesive |
CN108485556A (en) * | 2018-02-07 | 2018-09-04 | 东莞市方恩电子材料科技有限公司 | A kind of solvent acrylates type acid and alkali-resistance pressure sensitive adhesive adhesive tape and its preparation method and application |
CN113549413A (en) * | 2021-08-16 | 2021-10-26 | 江苏耐斯数码科技股份有限公司 | Benzene-free solvent-type peelable pressure-sensitive adhesive and preparation method thereof |
-
2022
- 2022-06-07 CN CN202210635409.5A patent/CN114921199A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101945902A (en) * | 2008-02-14 | 2011-01-12 | 3M创新有限公司 | Acrylic psa with aziridine crosslinker |
CN102057006A (en) * | 2008-06-09 | 2011-05-11 | 3M创新有限公司 | Acrylic pressure-sensitive adhesives with aziridine crosslinking agents |
US20110054115A1 (en) * | 2009-08-25 | 2011-03-03 | 3M Innovative Properties Company | Acrylic pressure-sensitive adhesives with acylaziridine crosslinking agents |
CN103205226A (en) * | 2012-08-29 | 2013-07-17 | 湖北航天化学技术研究所 | Solvent type acrylate pressure-sensitive adhesive, and preparation method and application thereof |
CN104449486A (en) * | 2014-12-03 | 2015-03-25 | 新丰杰力电工材料有限公司 | Preparation method and application of high temperature solvent resistant acrylate pressure sensitive adhesive |
CN108485556A (en) * | 2018-02-07 | 2018-09-04 | 东莞市方恩电子材料科技有限公司 | A kind of solvent acrylates type acid and alkali-resistance pressure sensitive adhesive adhesive tape and its preparation method and application |
CN113549413A (en) * | 2021-08-16 | 2021-10-26 | 江苏耐斯数码科技股份有限公司 | Benzene-free solvent-type peelable pressure-sensitive adhesive and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111087950B (en) | Adhesive, double-sided tape applying adhesive and preparation method of double-sided tape | |
CN111154429B (en) | Polyacrylate pressure-sensitive adhesive | |
CN108276934B (en) | PET (polyethylene terephthalate) base material rubber termination adhesive tape and preparation method thereof | |
CN102549097A (en) | Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing same, and reinforced flexible printed wiring board | |
EP2475715B1 (en) | Dual crosslinked tackified pressure sensitive adhesive | |
CN105038616B (en) | Multifunctional aqueous environment protection thermal transfer printing back glue composition and preparation method thereof | |
CN108929639A (en) | Adhesive composition used in bonding sheet and the bonding sheet | |
CN113278391A (en) | Ultrahigh-temperature-resistant acrylate pressure-sensitive adhesive | |
CN111234727A (en) | Waterborne environmental protection acrylic emulsion pressure sensitive adhesive protection film | |
CN113736398A (en) | Electrolyte-resistant solvent type acrylate pressure-sensitive adhesive and preparation method thereof | |
CN110669459B (en) | High-pressure color-changing pressure-sensitive adhesive, preparation method thereof, adhesive tape and application of high-pressure color-changing pressure-sensitive adhesive | |
CN114214006B (en) | OCA optical glue with high filling property and OCA optical adhesive film | |
CN114921199A (en) | Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof | |
CN113913134A (en) | Adhesive for battery cell protective film, protective film prepared from adhesive and application of protective film | |
WO2015002355A1 (en) | Thermoplastic polyurethane hot-melt film | |
CN109852267B (en) | Adhesive sheet | |
CN114350284B (en) | Pressure-sensitive adhesive water, pressure-sensitive adhesive tape and preparation method thereof | |
CN110857330A (en) | Special TDI tripolymer curing agent for gold stamping and preparation method thereof | |
CN112812713B (en) | Preparation method of high-adhesion high-molecular-weight polymer waterproof adhesive for flexible circuit board | |
CN111087526B (en) | Solvent-tolerant acrylate composition and application thereof | |
JPH02178378A (en) | Acrylic pressure-sensitive adhesive | |
CN112358849A (en) | Peelable gasket adhesive and preparation method thereof | |
CN110003381B (en) | Anti-sagging resin and preparation method thereof | |
CN112920754B (en) | High-adhesion high-molecular polymer waterproof adhesive for flexible circuit board and application thereof | |
CN116554811A (en) | Impact-resistant protective optical adhesive and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220819 |