CN114921199A - Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof - Google Patents

Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof Download PDF

Info

Publication number
CN114921199A
CN114921199A CN202210635409.5A CN202210635409A CN114921199A CN 114921199 A CN114921199 A CN 114921199A CN 202210635409 A CN202210635409 A CN 202210635409A CN 114921199 A CN114921199 A CN 114921199A
Authority
CN
China
Prior art keywords
glue
ma50s
temperature
resistant
diluent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210635409.5A
Other languages
Chinese (zh)
Inventor
张�雄
刘明凯
李娟�
周秋胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Shenghao New Material Technology Co ltd
Original Assignee
Dongguan Shenghao New Material Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Shenghao New Material Technology Co ltd filed Critical Dongguan Shenghao New Material Technology Co ltd
Priority to CN202210635409.5A priority Critical patent/CN114921199A/en
Publication of CN114921199A publication Critical patent/CN114921199A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic

Abstract

The invention discloses a solvent type high-peeling-force high-temperature-and-humidity-resistant glue and a preparation method thereof, belonging to the technical field of glues. The glue is prepared by mixing 80-85% of MA50S, 0.8-1.2% of aziridine crosslinking agent and 15-20% of diluent, wherein MA50S is a two-liquid oily acrylate pressure-sensitive adhesive, and the diluent is methyl ethyl ketone which is commonly called methyl ethyl ketone. According to the invention, by adjusting the proportion of the monomer and the initiator in MA50S and adding the aziridine crosslinking agent, the use of other additives is reduced, the high temperature resistance of the glue is improved, and the cohesive strength of the glue is improved by adding quantitative methyl ethyl ketone, so that the glue does not generate the phenomena of denaturation, degumming, glue overflow, warping and the like at a high temperature of 85 ℃, and the peel strength reaches 1900g/inch to 2200 g/inch. The glue is simple in production process, saves materials and labor processing cost, and meets the energy-saving and environment-friendly requirement advocated by the state.

Description

Solvent type high-stripping-force high-temperature-and-humidity-resistant glue and preparation method thereof
Technical Field
The invention belongs to the technical field of glue, and particularly relates to solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and a preparation method thereof.
Background
The acrylic glue is also called organic glass glue and PMMA glue. At present, the acrylic glue is an indispensable product, is widely popularized in the automobile industry, the electronic industry, the plasticizing industry and the hardware industry, and plays an important role in the glue industry. However, in the current industry and markets, many high-temperature glues have too many acrylic system glues, when the acrylic system glues are used, a pasted object is easy to displace in a high-temperature high-humidity environment, and in order to reduce poor displacement after the pasted object is attached, a solvent type glue with high peeling force, high-temperature high-humidity resistance and no displacement is provided.
Disclosure of Invention
The invention aims to provide a solvent type high-stripping-force high-temperature and high-humidity resistant glue and a preparation method thereof, and aims to solve the problems in the background art. In order to realize the purpose, the invention adopts the technical scheme that: a solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and a preparation method thereof comprise the following raw materials in percentage by weight: MA 50S: 80% -85%, aziridine crosslinking agent: 0.8 to 1.2 percent of the total weight of the lubricant and 15 to 20 percent of the diluent. Wherein MA50S is two-component oil acrylic pressure-sensitive adhesive, which can be added with different types of cross-linking agent or auxiliary resin to change the performance of solution type high molecular polymer. The thinner is methyl ethyl ketone, commonly called methyl ethyl ketone, with a chemical formula of CH3COCH2CH3, and the methyl ethyl ketone is used as a thinner for glue because of various reactions easily occurring due to the carbonyl and active hydrogen adjacent to the carbonyl. By adding aziridine crosslinking agent into MA50S, the water resistance, chemical resistance, dry and wet rubbing resistance, surface anti-sticking property, coating fastness and adhesion on special substrate can be greatly improved.
A preparation method of solvent type high-stripping-force high-temperature and high-humidity resistant glue is characterized by comprising the following steps: the method comprises the following steps:
step one, carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, blending MA50S, an aziridine crosslinking agent and a diluent, and mixing for 10-20 minutes to obtain glue;
step two, heating the glue to 90-110 ℃ and drying for 2-3 minutes;
and step three, placing the dried glue at the temperature of 35-40 ℃ for 72-85 hours.
According to the invention, by adjusting the proportion of the monomer and the initiator in MA50S and adding the aziridine crosslinking agent, the use of other auxiliary agents is reduced, the high temperature resistance of the glue is improved, and the cohesive strength of the glue is improved by adding quantitative methyl ethyl ketone, so that the glue does not generate the phenomena of denaturation, degumming, glue overflow, warping and the like at the high temperature of 85 ℃, and the peel strength reaches 1900g/inch to 2200 g/inch. The glue is simple in production process, saves materials and labor processing cost, and meets the energy-saving and environment-friendly requirement advocated by the state.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the following description. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example 1
Carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, weighing MA 50S: 82%, aziridine crosslinking agent: 0.9 percent and 17.1 percent of diluent. Then blending MA50S, aziridine crosslinking agent and diluent, and mixing for 15 minutes to obtain glue;
heating the glue to 95 ℃ and drying for 2 minutes; and placing the dried glue at the temperature of 36 ℃ for 75 hours.
Example 2
Carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, weighing MA 50S: 83.74%, aziridine crosslinking agent: 0.987 percent and a diluent 15.273 percent. Then blending MA50S, aziridine crosslinking agent and diluent, and mixing for 17 minutes to obtain glue; heating the glue to 98 ℃ and drying for 2 minutes; and placing the dried glue at 38 ℃ for 80 hours.
Example 3
Carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, weighing MA 50S: 83.74%, aziridine crosslinking agent: 1.075% and diluent 15.185%. Then blending MA50S, aziridine crosslinking agent and diluent, and mixing for 17 minutes to obtain glue; heating the glue to 105 ℃ and drying for 2 minutes; and placing the dried glue at the temperature of 40 ℃ for 80 hours.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The above embodiments are only for illustrating the present invention and not for limiting the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore all equivalent technical solutions also belong to the scope of the present invention, and the protection scope of the present invention should be defined by the claims.

Claims (3)

1. A solvent type high-peeling-force high-temperature-resistant high-humidity-resistant glue is characterized in that: comprises the following raw materials in percentage by weight: MA 50S: 80% -85%, aziridine crosslinking agent: 0.8% -1.2% of a diluent, 15% -20% of a MA50S, wherein the diluent is two-liquid oily acrylate pressure-sensitive adhesive, the diluent is methyl ethyl ketone, commonly called methyl ethyl ketone, and the chemical formula is CH3COCH2CH 3.
2. A preparation method of solvent type high-stripping-force high-temperature-and-humidity-resistant glue is characterized by comprising the following steps: the method comprises the following steps:
step one, carrying out solution polymerization on a monomer, an initiator and a solvent to obtain MA50S, blending MA50S, an aziridine crosslinking agent and a diluent, and mixing for 10-20 minutes to obtain glue;
step two, heating the glue to 90-110 ℃ and drying for 2-3 minutes;
and step three, placing the dried glue at the temperature of 38-42 ℃ for 72-85 hours.
3. The preparation method of the solvent-based high-peel-force high-temperature and high-humidity resistant glue according to claim 2, wherein the peel strength of the glue is 1900g/inch to 2200 g/inch.
CN202210635409.5A 2022-06-07 2022-06-07 Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof Pending CN114921199A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210635409.5A CN114921199A (en) 2022-06-07 2022-06-07 Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210635409.5A CN114921199A (en) 2022-06-07 2022-06-07 Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof

Publications (1)

Publication Number Publication Date
CN114921199A true CN114921199A (en) 2022-08-19

Family

ID=82813217

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210635409.5A Pending CN114921199A (en) 2022-06-07 2022-06-07 Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof

Country Status (1)

Country Link
CN (1) CN114921199A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101945902A (en) * 2008-02-14 2011-01-12 3M创新有限公司 Acrylic psa with aziridine crosslinker
US20110054115A1 (en) * 2009-08-25 2011-03-03 3M Innovative Properties Company Acrylic pressure-sensitive adhesives with acylaziridine crosslinking agents
CN102057006A (en) * 2008-06-09 2011-05-11 3M创新有限公司 Acrylic pressure-sensitive adhesives with aziridine crosslinking agents
CN103205226A (en) * 2012-08-29 2013-07-17 湖北航天化学技术研究所 Solvent type acrylate pressure-sensitive adhesive, and preparation method and application thereof
CN104449486A (en) * 2014-12-03 2015-03-25 新丰杰力电工材料有限公司 Preparation method and application of high temperature solvent resistant acrylate pressure sensitive adhesive
CN108485556A (en) * 2018-02-07 2018-09-04 东莞市方恩电子材料科技有限公司 A kind of solvent acrylates type acid and alkali-resistance pressure sensitive adhesive adhesive tape and its preparation method and application
CN113549413A (en) * 2021-08-16 2021-10-26 江苏耐斯数码科技股份有限公司 Benzene-free solvent-type peelable pressure-sensitive adhesive and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101945902A (en) * 2008-02-14 2011-01-12 3M创新有限公司 Acrylic psa with aziridine crosslinker
CN102057006A (en) * 2008-06-09 2011-05-11 3M创新有限公司 Acrylic pressure-sensitive adhesives with aziridine crosslinking agents
US20110054115A1 (en) * 2009-08-25 2011-03-03 3M Innovative Properties Company Acrylic pressure-sensitive adhesives with acylaziridine crosslinking agents
CN103205226A (en) * 2012-08-29 2013-07-17 湖北航天化学技术研究所 Solvent type acrylate pressure-sensitive adhesive, and preparation method and application thereof
CN104449486A (en) * 2014-12-03 2015-03-25 新丰杰力电工材料有限公司 Preparation method and application of high temperature solvent resistant acrylate pressure sensitive adhesive
CN108485556A (en) * 2018-02-07 2018-09-04 东莞市方恩电子材料科技有限公司 A kind of solvent acrylates type acid and alkali-resistance pressure sensitive adhesive adhesive tape and its preparation method and application
CN113549413A (en) * 2021-08-16 2021-10-26 江苏耐斯数码科技股份有限公司 Benzene-free solvent-type peelable pressure-sensitive adhesive and preparation method thereof

Similar Documents

Publication Publication Date Title
CN111087950B (en) Adhesive, double-sided tape applying adhesive and preparation method of double-sided tape
CN111154429B (en) Polyacrylate pressure-sensitive adhesive
CN108276934B (en) PET (polyethylene terephthalate) base material rubber termination adhesive tape and preparation method thereof
CN102549097A (en) Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing same, and reinforced flexible printed wiring board
EP2475715B1 (en) Dual crosslinked tackified pressure sensitive adhesive
CN105038616B (en) Multifunctional aqueous environment protection thermal transfer printing back glue composition and preparation method thereof
CN108929639A (en) Adhesive composition used in bonding sheet and the bonding sheet
CN113278391A (en) Ultrahigh-temperature-resistant acrylate pressure-sensitive adhesive
CN111234727A (en) Waterborne environmental protection acrylic emulsion pressure sensitive adhesive protection film
CN113736398A (en) Electrolyte-resistant solvent type acrylate pressure-sensitive adhesive and preparation method thereof
CN110669459B (en) High-pressure color-changing pressure-sensitive adhesive, preparation method thereof, adhesive tape and application of high-pressure color-changing pressure-sensitive adhesive
CN114214006B (en) OCA optical glue with high filling property and OCA optical adhesive film
CN114921199A (en) Solvent type high-stripping-force high-temperature-resistant high-humidity-resistant glue and preparation method thereof
CN113913134A (en) Adhesive for battery cell protective film, protective film prepared from adhesive and application of protective film
WO2015002355A1 (en) Thermoplastic polyurethane hot-melt film
CN109852267B (en) Adhesive sheet
CN114350284B (en) Pressure-sensitive adhesive water, pressure-sensitive adhesive tape and preparation method thereof
CN110857330A (en) Special TDI tripolymer curing agent for gold stamping and preparation method thereof
CN112812713B (en) Preparation method of high-adhesion high-molecular-weight polymer waterproof adhesive for flexible circuit board
CN111087526B (en) Solvent-tolerant acrylate composition and application thereof
JPH02178378A (en) Acrylic pressure-sensitive adhesive
CN112358849A (en) Peelable gasket adhesive and preparation method thereof
CN110003381B (en) Anti-sagging resin and preparation method thereof
CN112920754B (en) High-adhesion high-molecular polymer waterproof adhesive for flexible circuit board and application thereof
CN116554811A (en) Impact-resistant protective optical adhesive and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20220819