CN114910335A - Tablet press and method for manufacturing sample wafer by using tablet press - Google Patents

Abstract

The application discloses tablet press includes: the second supporting seat is arranged opposite to the first supporting seat and is fixedly connected with the first supporting seat through a bracket; the fixed end of the first pressure applying assembly is located on the first supporting seat, the fixed end of the second pressure applying assembly is fixedly connected with the second supporting seat, and the free end of the first pressure applying assembly and the free end of the second pressure applying assembly are movably arranged in opposite directions and are suitable for bidirectional pressure application; the lower end of the die cylinder is sleeved on the free end of the first pressure applying assembly; the second supporting seat is provided with a through hole parallel to the pressure applying direction, the second pressure applying assembly is provided with a demolding auxiliary part, one end of the demolding auxiliary part is arranged on the second pressure applying assembly, and the other end of the demolding auxiliary part penetrates through the through hole and selectively applies pressure to the mold cylinder. According to the tablet press, the sample wafer is in a bidirectional pressure applying state in the process of pushing out the die cylinder, the situation that the edge part of the sample wafer is stripped and cracked can be obviously relieved, and the probability of one-time successful tablet making is improved.

Description

Tablet press and method for manufacturing sample wafer by using tablet press

Technical Field

The application relates to the technical field of tablet presses, in particular to a tablet press and a method for manufacturing sample tablets by using the tablet press.

Background

The existing powder tablet press is mostly obtained in a mode of pushing a pressed sample tablet out of a die cylinder in a demoulding process, the edge part of the sample tablet rubs with the inner wall of the die cylinder in the pushing-out process, and the stripping and cracking of the edge part are easy to occur, so that the sample tablet needs to be re-processed to ensure the integrity of the sample tablet, the waste of labor cost and material cost is caused, and impurities can be introduced in the repeated processing process for many times to influence the quality of a sample.

Disclosure of Invention

The present application is directed to solving at least one of the problems in the prior art.

For example, the application provides a tablet press machine which can reduce the problems of cracking, peeling and the like of a sample tablet in the demoulding process;

the application also provides a manufacturing method of the sample wafer, and the tablet press is used.

In order to solve the above problems, a first aspect of the present application provides a tablet press comprising: a first support base; the second supporting seat is opposite to the first supporting seat and is fixedly connected with the first supporting seat through a bracket; the fixed end of the first pressing component is located on the first supporting seat, the fixed end of the second pressing component is fixedly connected with the second supporting seat, and the free end of the first pressing component and the free end of the second pressing component are movably arranged in opposite directions and are suitable for bidirectional pressing; the lower end of the die cylinder is sleeved on the free end of the first pressing component, an accommodating space is defined in the die cylinder, and raw material powder or sample wafers which are pressed are contained in the accommodating space; the second supporting seat is provided with a through hole parallel to the pressure applying direction, the second pressure applying assembly is provided with a demolding auxiliary piece, one end of the demolding auxiliary piece is arranged on the second pressure applying assembly, and the other end of the demolding auxiliary piece penetrates through the through hole and can selectively apply pressure to the die cylinder.

According to the tablet press, the first pressing component and the second pressing component respectively press the upper part and the lower part of the sample wafer in the die cylinder, so that the sample wafer is always in a bidirectional clamping and pressing state, and is pushed to the die cylinder by the aid of the demolding auxiliary part, the situation that the edge part of the sample wafer is stripped and cracked can be obviously relieved in the process of pushing out the die cylinder, and the one-time success probability of tablet making is improved.

Further, the first pressure applying assembly includes: one end of the first driving mechanism is fixedly connected with the first supporting seat; the first plunger is arranged at the other end of the first driving mechanism, and the die cylinder is sleeved on the first plunger so as to enable the first plunger to be close to or far away from the free end of the second pressure applying assembly under the driving of the first driving mechanism.

Further, the first pressure applying assembly further includes a first support disposed between the first drive mechanism and the first plunger.

Further, a plurality of bosses are arranged on the circumferential direction of the first plunger, and the plurality of bosses are arranged at intervals in the axial direction of the first plunger.

Furthermore, a tip end is arranged on the boss and is abutted against the inner peripheral wall of the die cylinder.

Further, the second pressure applying assembly includes: one end of the second driving mechanism is fixedly connected with the second supporting seat; the second plunger is arranged at the other end of the second driving mechanism so as to be close to or far away from the free end of the first pressing component under the driving of the second driving mechanism.

Further, the demolding auxiliary part is configured as a push rod, one end of the push rod is fixed with the second driving mechanism, and the other end of the push rod penetrates through the through hole and selectively applies pressure to the mold cylinder.

Furthermore, a limiting part is arranged at the other end of the push rod, and the size of the limiting part is larger than the diameter of the through hole.

Further, the stopper is configured as a stopper plate.

Further, the first driving mechanism and the second driving mechanism are one of an oil cylinder, a hydraulic cylinder, an air cylinder and an electric push rod.

Further, the die cylinder includes: the die cylinder comprises a die cylinder body, wherein raw material powder or sample wafers which are pressed are contained in the die cylinder body; the limiting plate can selectively stop the bulge, and the sample wafer can be pushed out of the die cylinder body.

Further, the inner peripheral wall of the die cylinder body is provided with a wear-resistant layer.

Further, at least part of the inner diameter of the die cylinder body is gradually reduced from top to bottom.

Further, still include: and the elastic part is matched with the lower end of the die cylinder to support the die cylinder.

Further, in the demolding process, the first pressing assembly and the second pressing assembly respectively press the sample wafer in the mold cylinder, and the mold cylinder can be relatively displaced relative to the free end of the first pressing assembly and the free end of the second pressing assembly.

Further, the first pressing assembly is capable of applying a first pressure to the powder in the die cylinder during tabletting and a second pressure to the sample wafer in the die cylinder during demoulding, wherein the second pressure is less than the first pressure; and/or the second pressing assembly is capable of applying a first pressure to the powder in the die cylinder during tablet pressing and a second pressure to the sample tablet in the die cylinder during demolding, wherein the second pressure is less than the first pressure.

Further, the second pressure is 1/10-1/1000 of the first pressure.

In a second aspect of the present application, there is disclosed a method for manufacturing a sample wafer, which is manufactured by using the tablet press, comprising the steps of:

adding raw material powder for preparing a sample into the die cylinder;

the first pressing assembly or/and the second pressing assembly move to bidirectionally press the raw material powder to press the raw material powder into a sample wafer; and

maintaining the bidirectional pressure and applying external force to the die cylinder so as to gradually push the pressed sample wafer out of the die cylinder.

Further, in the process of pressing the raw material powder into the sample wafer, the applied pressure is a first pressure; and in the process of gradually pushing the sample wafer out of the die cylinder after the pressing is finished, applying a second pressure to the sample wafer, wherein the second pressure is smaller than the first pressure.

Further, the second pressure is 1/10-1/1000 of the first pressure.

In a third aspect of the present application, there is disclosed a method for manufacturing a sample wafer, which is manufactured by using the tablet press, comprising the steps of:

adding raw material powder for preparing a sample into the die cylinder;

the first pressing assembly or/and the second pressing assembly move to bidirectionally press the raw material powder to press the raw material powder into a sample wafer; and

the first pressure applying assembly and the second pressure applying assembly respectively apply unequal pressure to the sample wafer after the pressing is finished, and apply external force to the mold cylinder so as to gradually push the sample wafer after the pressing is finished out of the mold cylinder.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

Other objects and advantages of the present disclosure will become apparent from the following description of the disclosure, which is made with reference to the accompanying drawings, and can assist in a comprehensive understanding of the disclosure.

Fig. 1 is a schematic view of an initial state of a tablet press according to an embodiment of the present application;

fig. 2 is a schematic representation of a tablet press machine compressing into tablets according to an embodiment of the present application;

fig. 3 is a schematic illustration of a tablet press with a demolded tablet removal according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a first plunger according to an embodiment of the present application;

FIG. 5 is a cross-sectional view of a die cylinder body according to an embodiment of the present application;

FIG. 6 is a schematic view of an intermediate state during ejection of a sheet according to an embodiment of the present application;

FIG. 7 is a schematic view of a die cylinder engaged with a first plunger according to an embodiment of the present application.

It is noted that, for the sake of clarity, in the drawings used to describe embodiments of the present disclosure, structures or regions may be enlarged or reduced in size, i.e., the drawings are not drawn to actual scale.

Reference numerals:

a tablet press machine 1000 is provided,

the first supporting seat (1) is provided with a supporting seat,

the second supporting seat (2) is provided with a second supporting seat,

the support (3) is provided with a support,

the die cylinder 4, the die cylinder body 41, the first section 411, the second section 412, the boss 42, the wear-resistant layer 43,

the raw material powder 51, the sample piece 52,

the first drive mechanism 61, the first plunger 62, the boss 621, the tip 622,

the relative positions of the second drive mechanism 71, the second plunger 72,

the support part (8) is provided with a support part,

the elastic part (9) is provided with a plurality of elastic parts,

the number of the position limiting plates 10 is less than the number of the position limiting plates,

ejection aid 11, via 1101.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art. The use of "first," "second," and the like in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.

In this document, unless specifically stated otherwise, directional terms such as "upper", "lower", "left", "right", "inside", "outside", and the like are used to indicate orientations or positional relationships based on the orientation shown in the drawings, merely for convenience in describing the present disclosure, and do not indicate or imply that the referenced device, element, or component must have a particular orientation, be constructed or operated in a particular orientation. It should be understood that when the absolute positions of the described objects are changed, the relative positional relationships they represent may also change accordingly. Accordingly, these directional terms should not be construed as limiting the present disclosure.

The currently used tablet press for preparing a blank from powder mainly comprises three steps in the process of preparing a sample tablet, wherein the three steps are as follows: feeding, closing the mold, pressing to prepare a blank, and demolding to obtain the blank. In the prior art, during the process of demoulding and blank taking, a piston on one side is usually taken away, and then a sample wafer is pushed out from a mould cylinder by applying force through the piston on the other side. In the process that the sample wafer is separated from the die cylinder, because one side of the sample wafer, which is taken away from the piston, has no pressure, the edge part of the sample wafer can not keep the integrity of the sample wafer under the friction with the inner wall of the die cylinder, and the edge part is easy to peel and crack, so that the sample wafer needs to be re-processed, the waste of labor cost and material cost is caused, and the quality of a sample can be influenced by introducing impurities in the repeated processing process for many times.

This application has increased the success rate of making complete sample piece in the base is got in the drawing of patterns through the improvement to the tablet press, has solved the edge part and has very easily taken place to shell the technical problem that the layer ftractures when the drawing of patterns.

A tablet press 1000 according to an embodiment of the present application is described below with reference to fig. 1-7.

It should be noted that the specific orientation of each component in the tablet press 1000 is not limited in the present application, and each component may be arranged in a longitudinal direction, i.e., as shown in fig. 1 to 3, the first support seat 1 is at the lower side of the second support seat 2, and the free end of the first pressure applying assembly and the free end of the second pressure applying assembly are disposed opposite to each other in the up-down direction, or may be arranged in a horizontal direction, i.e., the first support seat 1 is at one side of the second support seat 2, and the free end of the first pressure applying assembly and the free end of the second pressure applying assembly are disposed opposite to each other in the left-right direction (front-back direction), and all the above arrangements can implement the technical solution of the present application, and belong to the protection scope of the present application.

In order to better explain the technical solution of the present application, the following explanation will be explained with reference to the arrangement direction of the respective constituent elements in fig. 1 to 3.

According to an embodiment of the present application, there is provided a tablet press 1000 comprising: the device comprises a first supporting seat 1, a second supporting seat 2, a first pressure applying assembly, a second pressure applying assembly, a die cylinder 4 and a demolding auxiliary part.

Specifically, the second supporting seat 2 is opposite to the first supporting seat 1 and is fixedly connected with the first supporting seat 1 through the support 3, the fixed end of the first pressure applying assembly is located on the first supporting seat 1, the fixed end of the second pressure applying assembly is fixedly connected with the second supporting seat 2, and the free end of the first pressure applying assembly and the free end of the second pressure applying assembly are movably arranged in opposite directions and are suitable for bidirectional pressure application.

The first supporting seat 1, the second supporting seat 2 and the bracket 3 form a framework of the tablet press 1000, as shown in fig. 1-3, the first supporting seat 1 is equivalent to a base of the tablet press 1000, and a first pressing component is placed on the base, and a fixed end of the first pressing component may be fixedly connected with the first pressing component, or may be unconnected, and is only a part placed on the first supporting seat 1. The free end of the first pressure applying component and the free end of the second pressure applying component are arranged oppositely and can move oppositely, and the free ends can be mutually compressed after moving oppositely.

It should be noted that, if the first pressing assembly and the first supporting seat 1 are not connected, the tablet press 1000 needs to be corrected before use, and the free end of the first pressing assembly and the free end of the second pressing assembly are opposite to each other, so as to meet the requirement that mutual pressing can be realized during the pressing and tablet making process of the sample 52.

The lower end of the die cylinder 4 is sleeved on the free end of the first pressure applying assembly, a containing space is defined in the die cylinder 4, and raw material powder 51 or sample wafers 52 which are pressed are contained in the containing space.

The die cylinder 4 is constructed as a hollow pipe barrel, the lower end of the die cylinder 4 is sleeved on the free end of the first pressure applying assembly, the upper end of the die cylinder 4 is at a certain distance from the free end of the first pressure applying assembly, and the die cylinder 4 and the free end of the first pressure applying assembly are matched to form a containing space for storing the prepared sample wafer 52 or the raw material powder 51. The free end of the first pressure applying assembly is allowed to move in the axial direction of the die cylinder 4 due to the clearance fit of the inner diameter of the die cylinder 4 with the diameter of the free end of the first pressure applying assembly.

During the pressing, the free end of the first pressing member is moved upward, and the free end of the second pressing member is moved downward, so that the raw material powder 51 in the barrel 4 is subjected to the two-way pressing to form the sample 52. The two-way pressure application can avoid the difference phenomenon of the compactness of the upper part and the lower part of the prepared sample wafer 52, and the sample wafer 52 after press forming is not easy to warp and deform due to the difference of the shrinkage rates of the upper part and the lower part.

During the demolding, the first pressing assembly and the second pressing assembly respectively press the sample wafer 52 in the mold cylinder 4, and the mold cylinder 4 can be relatively displaced with respect to the free end of the first pressing assembly and the free end of the second pressing assembly.

It can be understood that, during the demolding process, the first pressing assembly and the second pressing assembly can apply the same pressure to the sample wafer 52 in the mold cylinder 4, and the mold cylinder 4 is relatively displaced under the action of external force relative to the free end of the first pressing assembly and the free end of the second pressing assembly, so that the sample wafer 52 is pushed out of the mold cylinder 4; the first and second pressing assemblies can also apply different pressures to the sample wafer 52 in the mold cylinder 4, and the pressing assembly with the larger pressure in the first and second pressing assemblies pushes the sample wafer 52 to move, and the mold cylinder 4 is kept still under the action of external force, namely, the mold cylinder 4 is relatively displaced with respect to the free end of the first pressing assembly and the free end of the second pressing assembly until the sample wafer 52 in the mold cylinder 4 is completely pushed out.

In the process of demoulding and taking the sample, the sample 52 is always in a compact state by continuously pressing in two directions, so that the problem of stripping and cracking of the edge part when the sample 52 is separated from the mould cylinder 4 is avoided to the maximum extent.

The second supporting seat is provided with a through hole parallel to the pressing direction, the second pressing assembly is provided with a demolding auxiliary part 11, one end of the demolding auxiliary part 11 is arranged on the second pressing assembly, and the other end of the demolding auxiliary part 11 penetrates through the through hole and selectively presses the mold cylinder.

As shown in fig. 1 to 3, a through hole 1101 is provided in the thickness direction of the second support base 2, and the other end of the auxiliary mold release 11 penetrates through the through hole 1101, and the auxiliary mold release moves in the penetrating direction when the second drive mechanism 71 is operated. The via hole 1101 has a certain guiding function for the auxiliary member, and the auxiliary member can be moved up and down in the direction in which the via hole 1101 penetrates.

During the demolding, the demolding auxiliary member 11 applies an external force to the mold cylinder 4, so that the mold cylinder 4 is relatively displaced with respect to the free end of the first pressing member and the free end of the second pressing member. During the force application, the other end of the auxiliary member 11 abuts against the upper end of the cylinder 4, and then the cylinder 4 is pushed downward to displace the cylinder 4 relative to the first and second pressing members to expose the sample wafer 52 on the free end of the first pressing member.

According to the tablet press, the first pressure applying assembly and the second pressure applying assembly apply pressure to the upper end and the lower end of the sample wafer in the die cylinder respectively, so that the sample wafer is always in a bidirectional clamping and pressing state, the die cylinder is pushed by the demolding auxiliary part, the situation that the edge part of the sample wafer is stripped and cracked can be obviously relieved in the process of pushing out the die cylinder, and the one-time success probability of tablet making is improved.

According to one embodiment of the present application, the first pressing assembly is capable of applying a first pressure to the raw material powder 51 in the die cylinder 4 during the tableting process and a second pressure to the sample wafer 52 in the die cylinder 4 during the demolding process, wherein the second pressure is less than the first pressure; and/or the second pressing assembly is capable of applying a first pressure to the raw material powder 51 in the die cylinder 4 during the tableting process and applying a second pressure to the sample wafer 52 in the die cylinder 4 during the demolding process, wherein the second pressure is less than the first pressure.

According to experience and experimental data, the quartz and alumina powders with an average particle size of 200 mesh can be prepared by using a mold cylinder with a diameter of 20mm, and the ideal pressure application degree is 10000N-80000N.

According to the desired degree of pressure application, the first and second pressure application units apply pressure to the sample wafer 52 in both directions, and then apply an external force to the mold cylinder 4 to gradually push the sample wafer 52 out of the mold cylinder 4 after pressing. The second pressure for bidirectionally pressing the sample sheet in the process of releasing the mold is required to be lower than the first pressure for bidirectionally pressing the sample sheet 52, that is, the first pressure for bidirectionally pressing the sample sheet 52 is ideally set to a pressure of 10000N to 80000N, and the second pressure for bidirectionally pressing the sample sheet in the process of releasing the mold is required to be lower than 10000N to 80000N.

Preferably, the second pressure is 1/10-1/1000 of the first pressure.

Most preferably, the pressing force applied when pressing the sample sheet 52 is 1/10 to 1/1000. Using a mold cylinder 4 having a diameter of 20mm, for example, quartz and alumina powders having an average particle size of 200 mesh, the desired mold release pressure is 10N to 8000N.

It will be appreciated that the second pressure being less than the first pressure is advantageous to improve the integrity of the coupon 52 when demolded. Specifically, when the force of the bidirectional pressure applied to the sample in the demolding process is higher than 1/10 of the force of the bidirectional pressure applied in the sample preparation 52, the resistance of the sample 52 pushed out of the mold cylinder 4 is too large due to the large pressure application, so that the separation difficulty is increased, and the sample 52 is most likely to be crushed by the pressing force of the bidirectional pressure after being pushed out of the mold cylinder 4; when the force of the two-way pressing of the sample piece 52 during the mold release is higher than 1/1000, which is the force of the two-way pressing during the sample piece 52 preparation, the smaller pressure makes the bonding force between the raw material powder particles insufficient, and cannot overcome the shearing force generated during the mold release, resulting in the cracking of one part of the ejected mold cylinder from the other part of the unextruded mold cylinder.

According to one embodiment of the present application, a first pressure applicator assembly comprises: a first drive mechanism 61 and a first plunger 62.

Specifically, one end of the first driving mechanism is fixedly connected with the first supporting seat 1, the first plunger 62 is arranged at the other end of the first driving mechanism, and the die cylinder 4 is sleeved on the first plunger 62 so as to enable the first plunger 62 to be close to or far away from the free end of the second pressing component under the driving of the first driving mechanism 61.

It will be appreciated that the first drive mechanism 61 and the first plunger 62 are arranged one above the other, with the first plunger 62 being disposed on the upper side of the first drive mechanism 61, closer to the free end of the second pressure applying assembly. During the compression tableting process, the first driving mechanism 61 drives the first plunger 62 to be close to the free end of the second pressing assembly, and the first plunger 62 and the second plunger 72 are pressed against each other; after demolding is complete, the first drive mechanism 61 drives the first plunger 62 away from the free end of the second pressing assembly (second plunger 72).

The first driving mechanism 61 may be configured as a device in which an oil cylinder, an air cylinder, a hydraulic cylinder, an electric push rod, a jack, or the like can apply thrust to the first plunger 62 to move the first plunger 62 up and down.

According to one embodiment of the present application, the first pressure applicator assembly further comprises a support 8, the support 8 being disposed between the first drive mechanism 61 and the first plunger 62.

Stress is generated during the process of pressing the first plunger 62 and the second plunger 72 against each other, and the direct connection of the first drive mechanism 61 and the first plunger 62 may cause damage to the housing of the first drive mechanism 61. In the present application, therefore, a support 8 is provided between the first plunger 62 and the first drive mechanism 61 to relieve the first plunger 62 from stressing the first drive mechanism 61.

It will of course be appreciated that the surface area of the connection face of the support 8 to the first plunger 62 needs to be greater than the diameter of the first plunger 62 to distribute the stress effects.

According to an embodiment of the present application, a plurality of bosses 621 are provided in the circumferential direction of the first plunger 62, and the plurality of bosses 621 are provided at intervals in the axial direction of the first plunger 62.

Fig. 4 is a schematic structural view of the first plunger 62 according to an exemplary embodiment of the present application. As shown in fig. 4, the first plunger 62 has a plurality of projections 621 on its surface, and the projections 621 are provided at intervals in the axial direction of the first plunger 62, and the projections 621 can contact the inner peripheral wall of the cylinder 4, and the projections 621 prevent the raw material powder 51 from overflowing after the raw material powder 51 is added to the containing space.

According to an embodiment of the present application, the boss 621 is provided with a tip portion 622, and the tip portion 622 abuts against the inner circumferential wall of the die cylinder 4.

The boss 621 is provided with a tip 622, and the tip 622 may be an edge of the boss 621, and the edge is perpendicular to the moving direction of the first plunger 62. During the process of removing the tablet from the mold, since the mold cylinder 4 can be relatively displaced with respect to the first plunger 62, the tip 622 can timely scrape off the raw material powder 51 adhered to the inner peripheral wall of the mold cylinder 4.

According to one embodiment of the present application, the second pressure applying assembly includes: a second drive mechanism 71 and a second plunger 72.

Specifically, one end of the second driving mechanism is fixedly connected to the second support seat 2, and the second plunger 72 is disposed at the other end of the second driving mechanism, so that the second plunger 72 is close to or away from the free end of the first pressing component under the driving of the second driving mechanism 71.

The second drive mechanism 71 and the second plunger 72 act in the same manner as the first drive mechanism 61 and the first plunger 62, but in the opposite direction. It will be appreciated that the second drive mechanism 71 and the second plunger 72 are arranged one above the other, with the second plunger 72 being disposed on the underside of the second drive mechanism 71, closer to the free end of the first pressure applying assembly. During the compression tableting process, the second driving mechanism 71 drives the second plunger 72 to be close to the free end of the first compression assembly, and the second plunger is pressed with the first plunger 62; after demolding is complete, second drive mechanism 71 drives second plunger 72 away from the free end of the first pressure applicator assembly (first plunger 62).

The second driving mechanism 71 may be configured as a cylinder, an air cylinder, a hydraulic cylinder, an electric push rod, a jack, or the like, which can apply a pushing force to the second plunger 72 to move the second plunger 72 up and down.

According to an embodiment of the present application, the second pressing assembly also includes a support 8 therein, and the support 8 is provided at the second driving mechanism 71 and the second plunger 72.

The function of the support 8 between the first plunger 62 and the first drive mechanism 61 is exactly the same as the function between the second plunger 72 and the second drive mechanism 71, both acting as a stress-dispersing function, and will not be described in detail herein.

According to one embodiment of the present application, the demolding aid 11 is configured as a push rod, one end of which is fixed to the second driving mechanism 71, and the other end of which penetrates the through hole and selectively presses the mold cylinder 4.

As shown in fig. 1, the push rod is housed at the uppermost end, and one end of the push rod is fixed to the second drive mechanism 71. The first plunger 62 and the die cylinder 4 are moved upward by the first driving mechanism 61 in fig. 2, completing the tablet pressing process. The process of demoulding and taking the sample wafer is shown in fig. 3, the second driving mechanism 71 drives the push rod to move downwards to stop against the die cylinder 4, at this time, the first driving mechanism 61 keeps thrust, the second driving mechanism 71 continues to apply thrust to the die cylinder 4, the die cylinder 4 sends relative displacement with the first pressing component and the second pressing component under the pressure action of the push rod, and finally the sample wafer 52 on the free end of the first pressing component is exposed.

According to an embodiment of the application, a limiting piece is arranged at the other end of the push rod, and the size of the limiting piece is larger than the diameter of the through hole.

In the process that the push rod moves up and down along the penetrating direction of the via hole 1101, in order to prevent the push rod from coming off the second supporting seat 2, a limiting part is fixed at the other end of the push rod, and the size of the limiting part needs to be larger than the diameter of the via hole.

Preferably, the stopper is configured as a stopper plate 10. The dimensions of the limiting plate 10 can be understood as the length and width of the limiting plate 10, and both the length and width of the limiting plate 10 must be larger than the diameter of the through hole 1101 to prevent the thrust rod from falling out of the second support seat 2.

In addition, as shown in fig. 3, the lower surface of the limiting plate 10 is a contact surface with the die cylinder 4, so that the contact area with the die cylinder 4 can be increased, and the increase of the contact area is beneficial to conveniently applying thrust in the pushing process.

According to one embodiment of the present application, the die cylinder 4 includes: a die cylinder body 41 and a boss 42.

Specifically, the die cylinder body 41 contains raw material powder 51 or a sample piece 52 which is pressed; the boss 42 is provided on the outer peripheral wall of the cylinder body 41, and the stopper plate 10 selectively stops against the boss, and is adapted to push the sample out of the cylinder body.

The die cylinder body 41 is configured as a tubular structure in which a containing space is configured to contain the raw material powder 51 or the pressed sample piece 52.

The boss 42 is provided on the outer peripheral wall of the cylinder body 41, and the boss 42 may be an annular boss, i.e., the boss 42 surrounds the outer peripheral wall of the cylinder body 41 once, or may be a dot boss, i.e., the boss 42 is provided in the form of a convex block on the outer peripheral wall of the cylinder body 41. During the process of demoulding and embryo making, the push rod exerts external force on the convex part 42, so that the mould cylinder 4 and the free end of the first pressure applying component and the free end of the second pressure applying component are displaced relatively.

It will be appreciated that the boss 42 serves as a point of application for facilitating the application of force to the die cylinder 4. When the boss 42 is configured as a boss, the position of the boss is opposed to the position of the push rod in the force application direction, and the push rod can be made to act on the boss.

According to one embodiment of the present application, the inner circumferential wall of the die cylinder body 41 is provided with a wear-resistant layer 43.

Fig. 5 is a cross-sectional view of the die cylinder body 41, wherein a layer of material with higher hardness and good wear resistance is attached to the inner circumferential wall of the die cylinder body 41, so as to prevent the situation that the inner circumferential wall of the die cylinder 4 is scratched and damaged due to the fact that the tip 622 is continuously scratched against the inner circumferential wall of the die cylinder body 41 when the first plunger 62 and the die cylinder body 41 are relatively displaced after the tablet press 1000 is used for a long time, and the process of demolding and tablet taking is affected. For example, the sample 52 may be damaged by scratches on the inner circumferential wall.

In the process of removing the mold from the mold, an external force needs to be applied to the outer peripheral wall of the cylinder body 41, and therefore the outer peripheral wall of the cylinder body 41 needs to be made of a material with strong strength and good toughness and can bear the external force of pressing and pulling for many times.

The sample piece expands after being released from the constraint of the die cylinder, and at present, in the process of demoulding and blank taking by using a tablet press, an intermediate state exists, namely, a part of the sample piece is pushed out of the die cylinder, and the other part of the sample piece is still in the die cylinder, the part of the demoulded die cylinder releases all elastic deformation at one time due to sudden release of the constraint of the die cylinder, the other part of the demoulded die cylinder cannot release the elastic deformation due to the constraint of the die cylinder, and the large difference of expansion causes excessive shear stress at the boundary, so that the part of the demoulded die cylinder and the other part of the demoulded die cylinder crack and even peel off, as shown in fig. 6 in particular.

According to one embodiment of the present application, to ensure the integrity of the coupon 52 during ejection, at least a portion of the inner diameter of the die cylinder body 41 is tapered from top to bottom.

As shown in fig. 7, the upper end of the cylinder body 41 has a large inner diameter, and then the inner diameter gradually decreases from top to bottom. The sample piece 52 is formed at the smallest inner diameter, the sample piece 52 is gradually moved upward by the pushing force of the free end of the first pressing member, and the swelling force is gradually released during the upward movement of the sample piece 52 until the maximum inner diameter of the cylinder body 41, and the swelling force is completely released. Under the action of the die cylinder body 41 with the inner diameter changed, the elastic deformation of the sample piece 52 is slowly recovered, so that the internal friction provided by the physical bond bonding between the powder particles exceeds the shear stress caused by the elastic deformation, and the sample piece 52 with a complete edge is obtained in the process of gradual pushing.

It should be noted that the minimum inside diameter of the die cylinder body 41 can be clearance fit with the free end of the first pressure applicator assembly.

According to tablet press 1000 of this application, because the internal diameter of one of them part gradually changes on mould body 41 for sample 52 breaks away from the in-process of mould body 41 gradually and for having the gradual inflation of gradient, elastic deformation has reduced the shear stress variation range between the powder granule in the sample by a wide margin by the process that releases gradually, effectively avoids sample 52 to split.

According to an embodiment of the present application, as shown in fig. 7, the die cartridge body 41 includes a first section 411 and a second section 412, an upper end of the first section 411 is connected with a lower end of the second section 412, an inner diameter of the second section 412 is gradually reduced from top to bottom, and the inner diameter of the first section 411 is the same as the inner diameter of the lower end of the second section 412.

The lower end of the first section 411 is sleeved on the first plunger 62, a certain length is reserved after the first section 411 is sleeved on the first plunger 62 to accommodate the raw material powder 51 and the sample wafer 52, and the pressing process is completed in the first section 411, so that the diameter of the sample wafer 52 which is just manufactured is the same as the inner diameter of the first section 411.

The second section 412 is located at the upper side of the first section 411, the diameter of the second section 412 is the same as that of the position where the first section 411 is connected, and the inner diameter of the second section 412 is gradually reduced from the top to the bottom. It should be understood that the second section 412 has an inner diameter that is set at a position near the first section 411, which is a position where the sample 52 is generated, and that is, at a position near the first section 411, the inner diameter is smaller and the inner diameter is larger at a position far from the first section 411. Thus, during the process of pushing the sample 52 from the first section 411 to the second section 412, the inner diameter gradually increases from small to large, and the elastic deformation of the sample 52 can be gradually released according to the change of the inner diameter.

Of course, the die cylinder body 41 may be composed of a plurality of segments, but in the plurality of segments, it is necessary to include the combination of the first segment 411 and the second segment 412 described above, and the inner diameters of all the segments connected to the second segment 412 except the first segment 411 and through which the sample piece passes when it is separated from the die cylinder body 41 are not less than the maximum inner diameter of the second segment 412.

According to one embodiment of the present application, the maximum inner diameter of second section 412 is no less than the diameter of the expanded coupon 52.

Fig. 6 shows an intermediate state of the mold release sheet. The diameter of the fully expanded sample piece 52 will be 2C larger than the diameter before it exits the die cylinder body 41. As a preferred embodiment, in order to completely release the elastic deformation of the sample piece 52, it is necessary to set the maximum inner diameter in the cylinder body 41 to be larger than or equal to the diameter of the sample piece 52 after expansion. For example, if the sample 52 has a diameter of 20mm when it is just formed and a diameter of 22mm after it is fully expanded, the largest inner diameter of the second section 412 is at least 22mm or greater.

Preferably, the angle α of the generatrix l of the second section 412 with the axis o is: d is more than 0 and less than or equal to 22.5 degrees.

As shown in fig. 7, which is a cross-sectional view of the die cylinder body 41, two generatrices l of the second section 412 are gradually away from each other from bottom to top, an included angle between the two generatrices l is greater than 0 and less than or equal to 45 °, and an included angle between one of the generatrices l and the axis o is greater than 0 and less than or equal to d and less than or equal to 22.5 °.

In a plurality of tests, a sample piece 52 pressed from 200# quartz raw material powder 51 was demolded, the diameter D of the first stage 411 was 20mm, the blank pressure was 25000N, and the structure and the operation were completely the same except for the angle β of the second stage 412.

Multiple tests show that the integrity ratio of demoulding and stripping is 0 under the condition that the angle beta is greater than 45 degrees; under the condition that the angle of beta is 30 degrees, the integrity ratio of demoulding and stripping is 16 percent; under the condition that the angle of beta is 3 degrees, the integrity ratio at the time of demoulding and stripping is increased to 86.5 percent.

The above experimental data indicate that the angle of β will have an effect on the release of the coupon 52. When the angle beta is 0 and beta is greater than 45 degrees, the edge part of the sample 52 is damaged by 100 percent, but when the angle beta is more than 0 and less than or equal to 45 degrees, namely, the angle beta is more than 0 and less than or equal to 22.5 degrees, the stripping phenomenon of the sample 52 is reduced. It can be shown that the problem of mold release and peeling can be basically solved by taking the above-mentioned angle interval values.

From the above experiments, it can be concluded that the smaller the angle of β, the higher the fraction of integrity of the mold release.

In one embodiment, where β is in the range of 1 ° to 4 °, the fraction of integrity at demold spalling can be as high as 80% or more. This is because when β is in the range of 1 ° to 4 °, elastic deformation is released very slowly during the process of releasing the tablet from the mold and gradually released with a gradient, so that the internal friction of the physical bonds between the powder particles is much greater than the shear stress, and the edge of the sample 52 is not easily broken, thereby ensuring that a sample 52 having a high degree of integrity is obtained.

According to an embodiment of the present application, the tablet press 1000 further comprises: and the elastic part 9, wherein the elastic part 9 is matched with the lower end of the die cylinder to support the die cylinder 4.

The elastic member 9 is provided between the first driving mechanism 61 and the die cylinder 4, or in the case where the support 8 is provided, the elastic member 9 is provided between the support 8 and the die cylinder 4. The cylinder 4 has a certain wall thickness, and one end of the elastic member 9 may be supported on the bottom wall of the cylinder 4 and the other end supported on the support member 8 or the surface of the first driving mechanism 61. Since the die cylinder 4 is in clearance fit with the first plunger 62. For safety, during the compression tableting, an upward supporting force needs to be added to overcome the gravity of the mold cylinder 4 itself to prevent the mold cylinder 4 from dropping suddenly.

Preferably, the elastic member 9 cooperates with the boss 42 to support the die cylinder 4.

The function of the protruding part 42 is to apply a supporting force more conveniently when the elastic component 9 acts on the mold cylinder 4, and also to apply an external force on the protruding part 42 to prevent the mold cylinder 4 from moving during the process of demolding and embryo making.

In one embodiment, the boss 42 is provided on the outer peripheral wall of the lower end of the cylinder body 41.

In the tablet press machine 1000 in which the first pressing unit and the second pressing unit are arranged up and down, the sample piece 52 is usually finally formed on the first pressing unit, and in order that the ejection aid 11 is not easily slipped out when a force is applied, the protrusion 42 is provided at the lower end of the cylinder body 41, so that the outer peripheral wall of the cylinder body 41 has a guiding function during pressing of the ejection aid 11, and a point of application of the force may be increased by contacting the outer peripheral wall.

According to one embodiment of the present application, the length of the die cylinder 4 is no greater than the length of the first plunger 62.

In a tablet press 1000 in which the first and second press assemblies are arranged one above the other, it is common practice to push the sample wafer 52 up out of the die cylinder 4. In order to fully expose the sample wafer 52 at the free end of the first pressing assembly when the external force is applied to the mold cylinder 4, the length of the mold cylinder 4 should be no greater than the length of the first plunger 62, that is, when the bottom end of the mold cylinder 4 abuts against the support 8 or the first supporting seat 1, the height of the top end of the mold cylinder 4 is less than the height of the first plunger 62, so as to satisfy the condition that the sample wafer 52 lifted by the first plunger 62 is fully exposed.

In connection with the above embodiments, the method for manufacturing the sample 52 using the tablet press 1000 of the present application may be summarized as follows.

The components within tablet press 1000 are first assembled and the locations are calibrated before performing the following protocol. The first pressing assembly is placed on the first support base 1, the free end (the first plunger 62) of the first pressing assembly is adjusted to be opposite to the free end (the second plunger 72) of the second pressing assembly, and then the die cylinder 4 in fig. 6 or fig. 7 is sleeved on the free end of the first pressing assembly.

After the preparation work is completed, the following two embodiments may be performed.

According to an exemplary embodiment of the present application, a method for manufacturing a sample wafer using the tablet press 1000 described above includes the following steps:

step S201: and adding raw material powder for preparing the sample into the die cylinder.

As shown in fig. 1, the raw material powder was charged into the die cylinder.

Step S202: and the first pressing assembly or/and the second pressing assembly moves to bidirectionally press the raw material powder to press the raw material powder into the sample wafer.

In the pressing process of the present step into a preform, there may be three execution modes.

One is that only the first pressing component moves, so that the free end of the second pressing component extends into the die cylinder, and then the first pressing component and the second pressing component apply bidirectional pressing on the raw material powder to prepare a sample wafer. Reference may be made to fig. 2.

And the other method is that only the second pressing component moves, so that the free end of the second pressing component extends into the die cylinder, and then the first pressing component and the second pressing component perform bidirectional pressing on the raw material powder to prepare the sample wafer.

And the other method is that the first pressure applying assembly and the second pressure applying assembly move relatively to each other, so that the free end of the second pressure applying assembly extends into the die cylinder, and then the first pressure applying assembly and the second pressure applying assembly apply bidirectional pressure to the raw material powder to prepare the sample wafer.

Step S203: maintaining the bidirectional pressure and applying external force to the die cylinder so as to gradually push the pressed sample wafer out of the die cylinder.

During the pressing and flaking process, the first pressing assembly and the second pressing assembly exert equal and opposite forces on the sample wafer, and during the demolding and sheet taking process, the first pressing assembly and the second pressing assembly still maintain the forces or simultaneously reduce the forces on two sides. An external force is then applied to the barrel. The die cylinder is driven by external force to gradually expose the sample wafer on the free end of the first pressure applying assembly, and the upper surface and the lower surface of the sample wafer are always in a compressed state due to the fact that bidirectional pressure is maintained, so that the internal friction force between raw material powder in the sample wafer is increased, and the completeness of the sample wafer in the pushing-out process is guaranteed.

It should be noted that the simultaneous decrease of the pair of forces of the first pressing assembly and the second pressing assembly in the above process is an equivalent decrease, but not decreased to 0, i.e., step S203 is a bidirectional pressing and demolding process.

According to one embodiment of the present application, the pressure applied during pressing of the raw material powder into the coupon is a first pressure; and in the process of gradually pushing the sample wafer out of the mold cylinder after the pressing is finished, applying a second pressure to the sample wafer, wherein the second pressure is smaller than the first pressure.

According to experience and experimental data, the quartz and alumina powders with an average particle size of 200 mesh can be prepared by using a mold cylinder with a diameter of 20mm, and the ideal pressure application degree is 10000N-80000N.

And according to the ideal pressure application degree, the first pressure application assembly and the second pressure application assembly apply bidirectional pressure to the sample wafer, then external force is applied to the mold cylinder, and the sample wafer after being pressed is gradually pushed out of the mold cylinder. The second pressure for bidirectionally pressing the sample sheet in the demolding process needs to be lower than the first pressure for bidirectionally pressing the sample sheet, namely the first pressure for bidirectionally pressing the sample sheet in the demolding process is ideally 10000N-80000N, and the second pressure for bidirectionally pressing the sample sheet in the demolding process needs to be lower than 10000N-80000N.

Preferably, the second pressure is 1/10-1/1000 of the first pressure.

Most preferably, the degree of pressure applied when the sample sheet is pressed is from 1/10 to 1/1000 according to experience. Using a mold cylinder having a diameter of 20mm, for example, quartz and alumina powders having an average particle size of 200 mesh, the desired mold release pressure is between 10N and 8000N.

It will be appreciated that the second pressure being less than the first pressure is advantageous to improve the integrity of the coupon when demolded. Specifically, when the force of the bidirectional pressure applied to the sample in the demolding process is higher than 1/10 of the force of the bidirectional pressure applied in the sample preparation process, the resistance of the sample when being pushed out of the mold cylinder is too large due to the large pressure application, so that the separation difficulty is increased, and the sample is possibly crushed by the pressing force of the bidirectional pressure applied after being pushed out of the mold cylinder; when the force of the bidirectional pressure applied to the sample sheet in the demolding process is higher than 1/1000 of the force of the bidirectional pressure applied in the sample sheet preparation process, the bonding acting force between the raw material powder particles is insufficient due to the smaller pressure, and the shearing force generated in the demolding process cannot be overcome, so that one part of the ejected mold cylinder and the other part of the unexploded mold cylinder are cracked.

It should be noted that, under the pressing force of the bidirectional pressing, the volume of the raw material powder is compressed, and then the inter-particle distance is reduced, so that the raw material powder particles have larger bonding force, and the bonding force can ensure that the raw material powder particles are a whole green body, and the structural integrity can be maintained under the gravity action of a G, and no damage in any form can occur.

According to another embodiment of the present application, a method for manufacturing a sample wafer using the above tablet press comprises the steps of:

step S301: and adding raw material powder for preparing the sample into the die cylinder.

This step is the same as step S201, and is not described herein again.

Step S302: and the first pressing assembly or/and the second pressing assembly moves to bidirectionally press the raw material powder to press the raw material powder into the sample wafer.

This step is the same as step S202, and is not described herein again.

Step S303: the first pressure applying assembly and the second pressure applying assembly respectively apply unequal pressure to the sample wafer after the pressing is finished, and apply external force to the die cylinder so as to gradually push the sample wafer after the pressing is finished out of the die cylinder.

During the pressing and tablet making process, the first pressing assembly and the second pressing assembly apply equal and opposite forces to the sample tablet, and during the demoulding and tablet taking process, the first pressing assembly and the second pressing assembly apply unequal forces, namely, the first pressing assembly and the second pressing assembly apply opposite forces and different pressures to the sample tablet, which can include the following modes.

Mode 1, the pressure of the second pressure applying assembly is reduced, and the pressure of the first pressure applying assembly is kept unchanged. Mode 2, the pressure of the second pressing assembly is reduced, and the pressure of the first pressing assembly is reduced at the same time, and the condition that the pressure of the first pressing assembly is larger than that of the second pressing assembly is met. Mode 3, the pressure of the second pressure applying assembly is kept unchanged, and the pressure of the first pressure applying assembly is increased.

It will be appreciated that the sample sheet will be pushed out by the first pressing assembly using the above 3 modes, and since the first and second pressing assemblies are not distinguished in other arrangements (e.g., left and right arrangements), the pressures of the first and second pressing assemblies can also be exchanged to develop another 3 modes, and the sample sheet will be pushed out by the second pressing assembly.

In the process of removing the sample piece from the mold, an external force is applied to the mold cylinder to push the sample piece out of the mold cylinder, so that the mold cylinder is still at the position of step S302 during the process of pushing the sample piece by the first pressing assembly or the second pressing assembly, or the applied external force makes the direction of movement of the mold cylinder opposite to that of the sample piece, so as to make the mold cylinder and the sample piece relatively displaced. The action of the external force is the same as step S203, and is not described herein again.

The die cylinder is driven by external force to gradually expose the sample wafer on the free end of the first pressure applying assembly, and due to bidirectional pressure application, the upper surface and the lower surface of the sample wafer are always in a compressed state, so that the internal friction force between raw material powder in the sample wafer is increased, and the completeness of the sample wafer in the pushing-out process is ensured.

It should be noted that, in the above process, whether the force applied by the first pressing assembly is reduced or the force applied by the second pressing assembly is reduced, it will not be 0, that is, step S203 is a bidirectional pressing and demolding process.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although a few embodiments of the present general inventive concept have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.

Claims (21)

1. A tablet press machine, characterized by comprising:

a first support base;

the second supporting seat is opposite to the first supporting seat and is fixedly connected with the first supporting seat through a bracket;

the fixed end of the first pressure applying assembly is located on the first supporting seat, the fixed end of the second pressure applying assembly is fixedly connected with the second supporting seat, and the free end of the first pressure applying assembly and the free end of the second pressure applying assembly are movably arranged in opposite directions and are suitable for bidirectional pressure application; and

the lower end of the die cylinder is sleeved on the free end of the first pressing component, an accommodating space is defined in the die cylinder, and raw material powder or sample wafers which are pressed are contained in the accommodating space;

the second supporting seat is provided with a through hole parallel to the pressing direction, the second pressing assembly is provided with a demolding auxiliary piece, one end of the demolding auxiliary piece is arranged on the second pressing assembly, and the other end of the demolding auxiliary piece penetrates through the through hole and selectively presses the die cylinder.

2. The tablet press according to claim 1, wherein the first pressure applicator assembly comprises:

one end of the first driving mechanism is fixedly connected with the first supporting seat; and

the first plunger is arranged at the other end of the first driving mechanism, and the die cylinder is sleeved on the first plunger so as to enable the first plunger to be close to or far away from the free end of the second pressure applying assembly under the driving of the first driving mechanism.

3. The tablet press according to claim 2, wherein the first pressure applying assembly further comprises a first support disposed between the first drive mechanism and the first plunger.

4. The tablet press according to claim 3, wherein the first plunger is provided with a plurality of bosses in the circumferential direction, the plurality of bosses being spaced apart in the axial direction of the first plunger.

5. The tablet pressing machine according to claim 4, characterized in that a tip is provided on the boss, which tip abuts against the inner circumferential wall of the die cylinder.

6. The tablet press according to claim 2, wherein the second pressure applicator assembly comprises:

one end of the second driving mechanism is fixedly connected with the second supporting seat; and

the second plunger is arranged at the other end of the second driving mechanism so as to be close to or far away from the free end of the first pressing component under the driving of the second driving mechanism.

7. The tablet press according to claim 6, wherein the ejection aid is configured as a push rod, one end of which is fixed to the second drive mechanism and the other end of which penetrates the through-hole and optionally presses the die cylinder.

8. The tablet pressing machine according to claim 7, wherein a stop is provided on the other end of the push rod, the stop having a dimension larger than the diameter of the through hole.

9. The tablet pressing machine according to claim 8, characterized in that the stop is configured as a stop plate.

10. The tablet press according to claim 6, wherein the first and second drive mechanisms are one of oil cylinders, hydraulic cylinders, air cylinders and electric push rods.

11. The tablet press according to claim 9, wherein the die cylinder comprises:

the die cylinder comprises a die cylinder body, wherein raw material powder or sample wafers which are pressed are contained in the die cylinder body;

the limiting plate can selectively stop the bulge, and the sample wafer can be pushed out of the die cylinder body.

12. The tablet pressing machine according to claim 11, characterized in that the inner circumferential wall of the die cylinder body is provided with a wear resistant layer.

13. The tablet press according to claim 11, wherein at least a portion of the die cylinder body has an inner diameter that decreases gradually from top to bottom.

14. The tablet press according to any one of claims 1 to 13, further comprising: an elastic member engaged with a lower end of the cylinder to support the cylinder.

15. The tablet press according to any one of claims 1 to 13, wherein the first and second pressure applying assemblies each apply pressure to a sample wafer in the die cylinder during demolding, the die cylinders being relatively displaceable with respect to the free ends of the first and second pressure applying assemblies.

16. The tablet press according to claim 15, wherein the first pressure applicator assembly is capable of applying a first pressure to the feedstock powder in the die cylinder during tableting and a second pressure to the sample tablet in the die cylinder during demolding, wherein the second pressure is less than the first pressure; and/or

The second pressing assembly is capable of applying a first pressure to the raw material powder in the die cylinder during a tablet pressing process and applying a second pressure to the sample tablet in the die cylinder during a demoulding process, wherein the second pressure is less than the first pressure.

17. The tablet press according to claim 16, wherein the second pressure is 1/10-1/1000 of the first pressure.

18. A method of making a coupon made using the tablet press of any one of claims 1-17, comprising the steps of:

adding raw material powder for preparing a sample into the die cylinder;

the first pressing assembly or/and the second pressing assembly move to bidirectionally press the raw material powder to press the raw material powder into a sample wafer; and

maintaining the bidirectional pressure and applying external force to the die cylinder so as to gradually push the pressed sample wafer out of the die cylinder.

19. The manufacturing method according to claim 18, wherein the pressure applied in the process of pressing the raw material powder into the sample piece is a first pressure;

in the process of gradually pushing the sample wafer out of the die cylinder after the pressing is finished, the pressure applied to the sample wafer is a second pressure,

wherein the second pressure is less than the first pressure.

20. The manufacturing method according to claim 19, wherein the second pressure is 1/10 to 1/1000 of the first pressure.

21. A method of making a coupon made using the tablet press of any one of claims 1-17, comprising the steps of:

adding raw material powder for preparing a sample into the die cylinder;

the first pressing assembly or/and the second pressing assembly move to bidirectionally press the raw material powder to press the raw material powder into a sample wafer; and

the first pressure applying assembly and the second pressure applying assembly respectively apply unequal pressure to the sample wafer after the pressing is finished, and apply external force to the mold cylinder so as to gradually push the sample wafer after the pressing is finished out of the mold cylinder.

Images