CN114900999A - Each layer rivet hole location structure of multilayer circuit board - Google Patents

Each layer rivet hole location structure of multilayer circuit board Download PDF

Info

Publication number
CN114900999A
CN114900999A CN202210661455.2A CN202210661455A CN114900999A CN 114900999 A CN114900999 A CN 114900999A CN 202210661455 A CN202210661455 A CN 202210661455A CN 114900999 A CN114900999 A CN 114900999A
Authority
CN
China
Prior art keywords
circuit board
plate
multilayer circuit
positioning
liquid storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210661455.2A
Other languages
Chinese (zh)
Other versions
CN114900999B (en
Inventor
沈志刚
沈国良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yuekaite Science & Technology Tongling Co ltd
Original Assignee
Yuekaite Science & Technology Tongling Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuekaite Science & Technology Tongling Co ltd filed Critical Yuekaite Science & Technology Tongling Co ltd
Priority to CN202210661455.2A priority Critical patent/CN114900999B/en
Publication of CN114900999A publication Critical patent/CN114900999A/en
Application granted granted Critical
Publication of CN114900999B publication Critical patent/CN114900999B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention relates to the technical field of circuit board processing, and discloses a rivet hole positioning structure for each layer of a multilayer circuit board, which comprises a fixing plate, wherein positioning mechanisms are arranged on the periphery of the surface of the fixing plate; the jack of a plurality of evenly distributed is seted up on the surface of fixed plate, the surface of fixed plate is equipped with four inserted bars that are the rectangular distribution, four inserted bars insert respectively in the inside of four jacks, the inside of inserted bar is equipped with the latch mechanism who sets up with jack lateral wall joint, the equal fixed stock solution section of thick bamboo that is equipped with in tip of four inserted bars, the bottom of four stock solution sections of thick bamboo all is equipped with the location awl, one side of location awl extends to the inside of stock solution section of thick bamboo, the fixed movable plate that is equipped with in one side that the location awl is located the stock solution section of thick bamboo, the fixed two slide bars that are equipped with of bottom inner wall symmetry of stock solution section of thick bamboo. This each layer rivet hole location structure of multilayer circuit board can once only accomplish the rivet hole location of the four corners department of circuit board, can accomplish simultaneously and fix a position the not unidimensional circuit board, has improved multilayer circuit board's machining efficiency.

Description

Each layer rivet hole location structure of multilayer circuit board
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a rivet hole positioning structure for each layer of a multilayer circuit board.
Background
In the PCB process, the multilayer board is formed by sequentially aligning and riveting 6 or 8 rivet holes (according to the size of the board) at each layer of board edge through rivets; the rivet hole is a 3.175mm diameter round hole that is drilled with a 3.175mm diameter drill pin.
Wherein patent number is CN102378492B, each layer rivet hole location structure of multilayer circuit board is disclosed, form on the flange limit of each layer circuit board one side, including the area that covers in the base plate of each layer circuit board one side flange limit be greater than the copper foil region of rivet hole, this copper foil region internal opening is formed with the circular space of the same centre of a circle and is located circular space outlying annular space, the copper foil region between this circular space and the annular space forms annular copper foil layer, the external diameter of this annular copper foil layer is the same with the aperture of rivet hole, the shaping of rivet hole location structure is in the actual preparation with circuit layer an organic whole etch the shaping on the copper foil layer on base plate surface.
In the scheme, only a single rivet hole on the multilayer circuit board is positioned, but the rivet holes are arranged at four corners of the circuit board, which is well known at present, and the processing procedures can be increased if the four rivet holes are processed one by one after being positioned, so that the rivet hole positioning structure of each layer capable of being quickly positioned needs to be provided.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a positioning structure for rivet holes of each layer of a multilayer circuit board, which can complete positioning of the rivet holes at four corners of the circuit board at one time and can complete positioning of circuit boards with different sizes, thereby improving the processing efficiency of the multilayer circuit board and solving the problem of low efficiency of positioning a plurality of rivet holes on the multilayer circuit board at present.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a rivet hole positioning structure for each layer of a multilayer circuit board comprises a fixing plate, wherein positioning mechanisms are arranged on the periphery of the surface of the fixing plate;
the surface of the fixed plate is provided with a plurality of jacks which are uniformly distributed, the surface of the fixed plate is provided with four insertion rods which are distributed in a rectangular shape, the four insertion rods are respectively inserted into the four jacks, the inside of each insertion rod is provided with a clamping mechanism which is clamped with the side wall of each jack, the end parts of the four insertion rods are respectively fixedly provided with a liquid storage cylinder, the bottoms of the four liquid storage cylinders are respectively provided with a positioning cone, one side of each positioning cone extends into the liquid storage cylinder, the positioning cone is positioned at one side of the liquid storage cylinder and is fixedly provided with a movable plate, the inner wall of the bottom of the liquid storage cylinder is symmetrically and fixedly provided with two sliding rods, the two sides of the movable plate are respectively in sliding connection with the rod walls of the two sliding rods, the upper ends of the two sliding rods are respectively and fixedly provided with a stop dog, the rod walls of the two sliding rods are respectively sleeved with a first movable plate, and the two ends of the first spring are respectively and fixedly connected with the stop dog and the stop dog, and ink is arranged in the liquid storage cylinder.
Preferably, positioning mechanism includes solid fixed ring, screw rod, locating plate and rocking handle, gu fixed ring is fixed to be set up in the surface of fixed plate, gu fixed ring's inside is equipped with the internal thread, the pole wall screw thread of screw rod set up in gu fixed ring's inside, the one end of screw rod is rotated with the side of locating plate and is connected, and the other end and the rocking handle fixed connection of screw rod.
Preferably, a bearing is fixedly embedded in the side face of the positioning plate, and one end of the screw is rotatably connected with the side face of the positioning plate through the bearing.
Preferably, the locating plate adopts the wedge-shaped plate, and the inclined plane of locating plate is kept away from the one side setting of fixed plate.
Preferably, the latch mechanism includes two connecting plates, second spring, two kellies and two press the depression bar, two the connecting plate is the symmetric position in the inside of inserted bar, the second spring is and transversely is located two between the connecting plate, and the both ends of second spring respectively with two the side fixed connection of connecting plate, two the kellies respectively fixed set up in two on the one side that the connecting plate deviates from mutually, two the kellies are kept away from the one end of connecting plate all runs through to the outside of inserted bar, the inside wall of jack seted up with kelly matched with draw-in groove, two press the depression bar respectively fixed set up in two on the one side that deviates from mutually of connecting plate, two the one end of keeping away from the connecting plate according to the depression bar all extends to the outside of inserted bar.
Preferably, the two pressing rods are positioned between the liquid storage cylinder and the fixing plate, and the tail ends of the pressing rods adopt circular end faces.
Preferably, the bottom of the liquid storage cylinder is provided with a circular truncated cone hole, and the circular truncated cone hole is matched with the outer wall of the positioning cone.
Preferably, the lateral wall of liquid storage cylinder is equipped with the mouth of inking, and the fixed rubber buffer that is equipped with in inside with the mouth of inking.
(III) advantageous effects
Compared with the prior art, the invention provides a rivet hole positioning structure for each layer of a multilayer circuit board, which has the following beneficial effects:
1. this each layer rivet hole location structure of multilayer circuit board, through setting up four liquid storage barrels and four location cones on the fixed plate surface, set up location awl on the fixed plate down earlier, make the surface contact of four location awl and circuit board, at the in-process that pushes down, the location awl is pushed and is removed, make the location awl remove towards the inside of liquid storage barrel, thereby can be with the inside ink discharge of liquid storage barrel and flow down the ink mark on the surface of multilayer circuit board, the quick location to the multilayer circuit board has been accomplished this moment, when pending awl and multilayer circuit board separate, first spring applys elasticity for the location awl this moment, make the location awl with the bottom shutoff of liquid storage barrel, make the ink stop discharging.
2. This each layer rivet hole location structure of multilayer circuit board, through the solid fixed ring, screw rod, locating plate and the rocking handle that are equipped with, rotate the rocking handle and make the screw rod rotatory, promote the locating plate when the screw rod is rotatory and remove to can adjust the distance of four locating plates, make the locating plate and the size of multilayer circuit board match, and then can with the accurate and location awl contact of multilayer circuit board, improve the efficiency of location.
3. This each layer rivet hole location structure of multilayer circuit board, through the connecting plate that is equipped with, the second spring, the kelly with press the depression bar, when the position of the location awl on the stock solution section of thick bamboo is adjusted to needs, the depression bar of both sides is pressed to the hand, make two connecting plates remove and compress the second spring, drive two kellies simultaneously and withdraw to the inside of inserted bar, can take the inserted bar out from the inside of jack this moment, thereby can adjust the position of the location awl on the stock solution section of thick bamboo, and then can fix a position the multilayer circuit board of unidimensional not.
Drawings
FIG. 1 is a schematic structural diagram of a rivet hole positioning structure of each layer of a multilayer circuit board according to the present invention;
FIG. 2 is a schematic view of the connection structure of the fixing plate and the liquid storage cylinder in FIG. 1;
FIG. 3 is an enlarged view of a portion A of FIG. 2;
fig. 4 is a schematic structural view of the positioning plate in fig. 1.
In the figure: the device comprises a fixing plate 1, a jack 2, an inserting rod 3, a liquid storage cylinder 4, a positioning cone 5, a moving plate 6, a sliding rod 7, a stop block 8, a first spring 9, a fixing ring 10, a screw rod 11, a positioning plate 12, a rocking handle 13, a connecting plate 14, a second spring 15, a clamping rod 16, a pressing rod 17 and a rubber plug 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, a rivet hole positioning structure for each layer of a multilayer circuit board includes a fixing plate 1, and positioning mechanisms are disposed around the surface of the fixing plate 1; the surface of a fixed plate 1 is provided with a plurality of jacks 2 which are uniformly distributed, the surface of the fixed plate 1 is provided with four inserting rods 3 which are rectangularly distributed, the four inserting rods 3 are respectively inserted into the four jacks 2, the inside of each inserting rod 3 is provided with a clamping mechanism which is clamped with the side wall of each jack 2, the end parts of the four inserting rods 3 are respectively fixedly provided with a liquid storage cylinder 4, the bottom parts of the four liquid storage cylinders 4 are respectively provided with a positioning cone 5, one side of each positioning cone 5 extends into the corresponding liquid storage cylinder 4, the positioning cone 5 is fixedly provided with a movable plate 6 at one side of each liquid storage cylinder 4, the inner wall of the bottom part of each liquid storage cylinder 4 is symmetrically and fixedly provided with two sliding rods 7, the two sides of each movable plate 6 are respectively connected with the rod walls of the two sliding rods 7 in a sliding manner, the upper ends of the two sliding rods 7 are respectively and fixedly provided with a stop block 8, the rod walls of the two sliding rods 7 are respectively sleeved with a first spring 9, and the two ends of the first spring 9 are respectively and fixedly connected with the stop block 8 and the movable plate 6, the inside of liquid storage cylinder 4 is equipped with the ink, and location awl 5 is when being extruded and remove for location awl 5 removes towards the inside of liquid storage cylinder 4, thereby can discharge the inside ink of liquid storage cylinder 4 and flow down the ink mark on the surface of multilayer circuit board, has accomplished the quick location to the multilayer circuit board this moment.
The positioning mechanism comprises a fixing ring 10, a screw rod 11, a positioning plate 12 and a rocking handle 13, wherein the fixing ring 10 is fixedly arranged on the surface of the fixing plate 1, internal threads are arranged inside the fixing ring 10, the rod wall threads of the screw rod 11 are arranged inside the fixing ring 10, one end of the screw rod 11 is rotatably connected with the side surface of the positioning plate 12, and the other end of the screw rod 11 is fixedly connected with the rocking handle 13; a bearing is fixedly embedded in the side surface of the positioning plate 12, and one end of the screw rod 11 is rotatably connected with the side surface of the positioning plate 12 through the bearing; locating plate 12 adopts the wedge-shaped plate, and the inclined plane of locating plate 12 is kept away from one side setting of fixed plate 1, rotates rocking handle 13 and makes screw rod 11 rotatory, promotes locating plate 12 and removes when screw rod 11 is rotatory to can adjust the distance of four locating plates 12, make locating plate 12 and the size of multilayer circuit board match.
The clamping mechanism comprises two connecting plates 14, a second spring 15, two clamping rods 16 and two pressing rods 17, wherein the two connecting plates 14 are symmetrically positioned inside the inserting rod 3, the second spring 15 is transversely positioned between the two connecting plates 14, two ends of the second spring 15 are respectively and fixedly connected with the side surfaces of the two connecting plates 14, the two clamping rods 16 are respectively and fixedly arranged on the opposite sides of the two connecting plates 14, one ends of the two clamping rods 16, far away from the connecting plates 14, penetrate through the outside of the inserting rod 3, the inner side wall of the inserting hole 2 is provided with clamping grooves matched with the clamping rods 16, the two pressing rods 17 are respectively and fixedly arranged on the opposite sides of the two connecting plates 14, one ends of the two pressing rods 17, far away from the connecting plates 14, extend to the outside of the inserting rod 3, the two pressing rods 17 are positioned between the liquid storage cylinder 4 and the fixing plate 1, the tail ends of the pressing rods 17 adopt circular end surfaces to press the pressing rods 17 on two sides, so that the two connecting plates 14 move and compress the second spring 15, and at the same time, the two clamping rods 16 are driven to retract into the inner part of the inserted link 3, and at the same time, the inserted link 3 can be drawn out from the inner part of the jack.
Round platform hole has been seted up to the bottom of liquid storage cylinder 4, and the outer wall phase-match of round platform hole and location awl 5, and the lateral wall of liquid storage cylinder 4 is equipped with the china ink mouth, and the fixed rubber buffer 18 that is equipped with in inside that adds the china ink mouth, treats that the inside ink of liquid storage cylinder 4 is used up after, can open rubber buffer 18 and add the ink to the inside of liquid storage cylinder 4.
In conclusion, in the structure for positioning rivet holes in each layer of the multilayer circuit board, when in use, the rocking handle 13 is firstly rotated to rotate the screw rod 11, the screw rod 11 pushes the positioning plate 12 to move when rotating, so that the distance between the four positioning plates 12 can be adjusted, the positioning plate 12 is matched with the size of the multilayer circuit board, the multilayer circuit board can be accurately contacted with the positioning cones 5, then the pressing rods 17 on the two sides are pressed by hands, so that the two connecting plates 14 move and compress the second springs 15, and simultaneously the two clamping rods 16 are driven to retract into the insertion rods 3, at the moment, the insertion rods 3 can be pulled out from the insertion holes, so that the positions of the positioning cones 5 on the liquid storage barrel 4 can be adjusted, the insertion rods 3 are inserted into the insertion holes 2 at different positions, so that the multilayer circuit boards with different sizes can be positioned, and finally the fixing plate 1 is arranged downwards, so that the four positioning cones 5 are contacted with the surface of the circuit board, in the in-process of pushing down, location awl 5 is pushed and is removed for location awl 5 moves towards the inside of liquid storage barrel 4, thereby can be with the inside ink discharge of liquid storage barrel 4 and flow down the ink mark on the surface of multilayer circuit board, accomplished the quick location to the multilayer circuit board this moment, when pending awl 5 and multilayer circuit board separation, first spring 9 applyed elasticity for location awl 5 this moment, make location awl 5 with the bottom shutoff of liquid storage barrel 4, make the ink stop to discharge.
It is to be noted that the term "comprises," "comprising," or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. The utility model provides a each layer rivet hole location structure of multilayer circuit board, includes fixed plate (1), its characterized in that: positioning mechanisms are arranged on the periphery of the surface of the fixing plate (1);
the surface of the fixing plate (1) is provided with a plurality of evenly distributed insertion holes (2), the surface of the fixing plate (1) is provided with four insertion rods (3) which are distributed in a rectangular shape, the four insertion rods (3) are respectively inserted into the four insertion holes (2), the inside of each insertion rod (3) is provided with a clamping mechanism which is clamped with the side wall of each insertion hole (2), the end parts of the four insertion rods (3) are respectively and fixedly provided with a liquid storage cylinder (4), the bottom parts of the four liquid storage cylinders (4) are respectively provided with a positioning cone (5), one side of each positioning cone (5) extends into the liquid storage cylinder (4), one side of each positioning cone (5) which is positioned on each liquid storage cylinder (4) is fixedly provided with a movable plate (6), the inner wall of the bottom of each liquid storage cylinder (4) is symmetrically and fixedly provided with two slide bars (7), and the two sides of each movable plate (6) are respectively connected with the bar walls of the two slide bars (7), two the upper end of slide bar (7) all is fixed and is equipped with dog (8), two the pole wall of slide bar (7) all overlaps and is equipped with first spring (9), and the both ends of first spring (9) respectively with dog (8) and movable plate (6) fixed connection, the inside of liquid storage cylinder (4) is equipped with the ink.
2. The rivet hole positioning structure for each layer of a multilayer circuit board according to claim 1, characterized in that: positioning mechanism includes solid fixed ring (10), screw rod (11), locating plate (12) and rocking handle (13), gu fixed ring (10) is fixed to be set up in the surface of fixed plate (1), the inside of solid fixed ring (10) is equipped with the internal thread, the pole wall screw thread of screw rod (11) set up in the inside of solid fixed ring (10), the one end of screw rod (11) is rotated with the side of locating plate (12) and is connected, and the other end and rocking handle (13) fixed connection of screw rod (11).
3. The rivet hole positioning structure for each layer of a multilayer circuit board according to claim 2, characterized in that: the side of the positioning plate (12) is fixedly embedded with a bearing, and one end of the screw rod (11) is rotatably connected with the side of the positioning plate (12) through the bearing.
4. The rivet hole positioning structure for each layer of a multilayer circuit board according to claim 2, characterized in that: the positioning plate (12) is a wedge-shaped plate, and the inclined surface of the positioning plate (12) is far away from one side of the fixing plate (1).
5. The rivet hole positioning structure for each layer of a multilayer circuit board according to claim 1, characterized in that: the clamping mechanism comprises two connecting plates (14), a second spring (15), two clamping rods (16) and two pressing rods (17), the two connecting plates (14) are symmetrically positioned inside the inserting rod (3), the second spring (15) is transversely positioned between the two connecting plates (14), two ends of the second spring (15) are respectively and fixedly connected with the side surfaces of the two connecting plates (14), the two clamping rods (16) are respectively and fixedly arranged on one side, away from the two connecting plates (14), of the two clamping rods (16) respectively, one ends, away from the connecting plates (14), of the two clamping rods (16) penetrate through the outside of the inserting rod (3), clamping grooves matched with the clamping rods (16) are formed in the inner side wall of the inserting hole (2), and the two pressing rods (17) are respectively and fixedly arranged on one side, away from the two connecting plates (14), one ends, far away from the connecting plate (14), of the two pressing rods (17) extend to the outside of the insert rod (3).
6. The rivet hole positioning structure for each layer of a multilayer circuit board according to claim 5, characterized in that: the two pressing rods (17) are positioned between the liquid storage cylinder (4) and the fixing plate (1), and the tail ends of the pressing rods (17) are circular end faces.
7. The rivet hole positioning structure for each layer of a multilayer circuit board according to claim 1, characterized in that: the bottom of the liquid storage cylinder (4) is provided with a circular truncated cone hole, and the circular truncated cone hole is matched with the outer wall of the positioning cone (5).
8. The rivet hole positioning structure for each layer of a multilayer circuit board according to claim 1, characterized in that: the lateral wall of liquid storage cylinder (4) is equipped with black mouth, and adds the inside fixed rubber buffer (18) that is equipped with of black mouth.
CN202210661455.2A 2022-06-13 2022-06-13 Positioning structure for rivet holes of each layer of multilayer circuit board Active CN114900999B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210661455.2A CN114900999B (en) 2022-06-13 2022-06-13 Positioning structure for rivet holes of each layer of multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210661455.2A CN114900999B (en) 2022-06-13 2022-06-13 Positioning structure for rivet holes of each layer of multilayer circuit board

Publications (2)

Publication Number Publication Date
CN114900999A true CN114900999A (en) 2022-08-12
CN114900999B CN114900999B (en) 2023-08-01

Family

ID=82728154

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210661455.2A Active CN114900999B (en) 2022-06-13 2022-06-13 Positioning structure for rivet holes of each layer of multilayer circuit board

Country Status (1)

Country Link
CN (1) CN114900999B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB155647A (en) * 1919-09-23 1920-12-23 Skerrett Garratt Improved combination gauging tool
US4688328A (en) * 1985-12-20 1987-08-25 Rca Corporation Method for fabricating a printed circuit board assembly and method for the manufacture thereof
JP2010247315A (en) * 2009-04-10 2010-11-04 Makoto Okamura Positioning tool for perforation
CN102239021A (en) * 2008-12-02 2011-11-09 奥西-技术有限公司 Device for ejecting droplets of a fluid having a high temperature
CN105228356A (en) * 2015-11-05 2016-01-06 中国电子科技集团公司第四十五研究所 A kind of sizes gauge wire plate that is used for prints detent mechanism and using method thereof
CN108274415A (en) * 2018-04-16 2018-07-13 长兴华通耐火材料厂 A kind of refractory material processing fixing device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB155647A (en) * 1919-09-23 1920-12-23 Skerrett Garratt Improved combination gauging tool
US4688328A (en) * 1985-12-20 1987-08-25 Rca Corporation Method for fabricating a printed circuit board assembly and method for the manufacture thereof
CN102239021A (en) * 2008-12-02 2011-11-09 奥西-技术有限公司 Device for ejecting droplets of a fluid having a high temperature
JP2010247315A (en) * 2009-04-10 2010-11-04 Makoto Okamura Positioning tool for perforation
CN105228356A (en) * 2015-11-05 2016-01-06 中国电子科技集团公司第四十五研究所 A kind of sizes gauge wire plate that is used for prints detent mechanism and using method thereof
CN108274415A (en) * 2018-04-16 2018-07-13 长兴华通耐火材料厂 A kind of refractory material processing fixing device

Also Published As

Publication number Publication date
CN114900999B (en) 2023-08-01

Similar Documents

Publication Publication Date Title
CN114900999A (en) Each layer rivet hole location structure of multilayer circuit board
CN116045892A (en) Device for detecting flatness of smooth surface of inner wall of die
CN207187776U (en) Single track pipettor
CN111085704A (en) Circulating punching equipment for customized disc-shaped metal parts
CN218411199U (en) Earth measuring point-fixing device
CN216834747U (en) Plug board fixing frame for circuit board
CN214410496U (en) Marketing teaching is with simulation sand table
CN202388472U (en) Plane nail dismantling device
CN213126991U (en) PCB production inspection device
CN211335069U (en) High accuracy electronic components silk screen printing device
CN210336572U (en) Automatic pushing device of mould
CN218286857U (en) Heat-insulating mica forming equipment
CN220820211U (en) Current transformer current detection device
CN216662240U (en) Automatic loading device for eucalyptus felling
CN211077605U (en) Board turnover device of board arranging machine
CN110508752A (en) A kind of casting sand core assembly line positioning device
CN110883176A (en) Stamping device is used in automobile parts processing
CN110774735A (en) High accuracy electronic components silk screen printing device
CN111002389A (en) Universal hole plugging and air guide plate punching device for PCB
CN217574411U (en) Can print platemaking equipment of high definition miniature characters label
CN210282190U (en) Multi-angle positioning and angle assembling workbench of angle assembling machine
CN220737651U (en) Test tube rack for experiments
CN220478881U (en) Reagent bottle storage rack
CN210730913U (en) Automatic core ejecting device for core making machine
CN220278817U (en) Automatic dismounting device for threaded connection plug

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant